U.S. patent application number 14/497849 was filed with the patent office on 2015-01-08 for single layer leadframe with integrated three-row connector.
The applicant listed for this patent is Continental Automotive Systems, Inc.. Invention is credited to Valentin M. Stefaniu, Gabriel Tirlea, Donald J. Zito.
Application Number | 20150011101 14/497849 |
Document ID | / |
Family ID | 52133094 |
Filed Date | 2015-01-08 |
United States Patent
Application |
20150011101 |
Kind Code |
A1 |
Zito; Donald J. ; et
al. |
January 8, 2015 |
SINGLE LAYER LEADFRAME WITH INTEGRATED THREE-ROW CONNECTOR
Abstract
A lead frame assembly having a lead frame made of a single
layer, a housing substantially surrounding the lead frame, and a
plurality of leads formed as part of the lead frame. The lead frame
assembly also includes a plurality of interfaces, allowing various
devices to interact with the lead frame, such as sensors,
thermistors, solenoids, engine controllers, or electronic control
units, or the like. The interfaces may be formed as part of the
lead frame, oriented in different directions, and may be located in
different planes, making the lead frame assembly suitable for
applications with different packaging requirements. The interfaces
may be a plurality of connectors, where one of the connectors has
multiple rows of pins which are in communication with the rest of
the connectors, facilitating the communication between the
connector and various devices.
Inventors: |
Zito; Donald J.; (Fox River
Grove, IL) ; Stefaniu; Valentin M.; (Lake Zurich,
IL) ; Tirlea; Gabriel; (Niles, IL) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Continental Automotive Systems, Inc. |
Auburn Hills |
MI |
US |
|
|
Family ID: |
52133094 |
Appl. No.: |
14/497849 |
Filed: |
September 26, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13768415 |
Feb 15, 2013 |
|
|
|
14497849 |
|
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Current U.S.
Class: |
439/55 ;
174/537 |
Current CPC
Class: |
H02B 1/01 20130101; B60T
8/3675 20130101; H01R 9/226 20130101; H05K 7/026 20130101; H05K
5/0069 20130101; F16H 61/0006 20130101; B60T 8/36 20130101; G06F
1/183 20130101; G06F 1/18 20130101 |
Class at
Publication: |
439/55 ;
174/537 |
International
Class: |
H02B 1/01 20060101
H02B001/01; H01R 13/04 20060101 H01R013/04; H01R 12/70 20060101
H01R012/70 |
Claims
1. An apparatus, comprising: a lead frame assembly, including: a
plurality of sub-lead frames; a housing surrounding at least part
of each of the plurality of sub-lead frames; an upper connector
connected to the housing and in electrical communication with the
plurality of sub-lead frames; a plurality of sub-connectors, each
of the plurality of sub-connectors being part of one of the
plurality of sub-lead frames; and a plurality of pins, a portion of
the plurality of pins being part of the upper connector and in
electrical communication with another portion of the plurality of
pins being part of each of the plurality of sub-connectors; wherein
a portion of at least one of the sub-lead frames is located in a
first plane such that at least one of the plurality of
sub-connectors is located in the first plane, and a portion of
another of the plurality of sub-lead frames is located in a second
plane such that another of the plurality of sub-connectors is
located in the second plane.
2. The apparatus of claim 1, the plurality of pins further
comprising: a first row of pins being part of the upper connector;
a second row of pins being part of the upper connector; and a third
row of pins being part of the upper connector; wherein at least a
portion of the first row of pins and the second row of pins are
part of one of the plurality of sub-lead frames, and at least a
portion of the third row of pins are part of another of the
plurality of sub-lead frames.
3. The apparatus of claim 2, wherein the third row of pins is
located between the first row of pins and the second row of
pins.
4. The apparatus of claim 2, the plurality of sub-lead frames
further comprising: a first sub-lead frame, a portion of the first
sub-lead frame disposed in the first plane; a second sub-lead
frame, a portion of the second sub-lead frame disposed in the first
plane; and a third sub-lead frame, a portion of the third sub-lead
frame disposed in the second plane; wherein the first sub-lead
frame and the second sub-lead frame include at least a portion of
the first row of pins and a portion of the second row of pins, and
the third sub-lead frame includes at least a portion of the third
row of pins.
5. The apparatus of claim 4, the first sub-lead frame further
comprising at least one of the plurality of sub-connectors located
in the first plane and in electrical communication with the first
row of pins.
6. The apparatus of claim 4, the second sub-lead frame further
comprising at least one of the plurality of sub-connectors located
in the first plane, and in electrical communication with the first
row of pins.
7. The apparatus of claim 4, the third sub-lead frame further
comprising at least one of the plurality of sub-connectors located
in the second plane, and in electrical communication with the third
row of pins.
8. The apparatus of claim 4, wherein the upper connector extends
from the first plane outwardly away from the lead frame on the
opposite side of the first sub-lead frame and the second sub-lead
frame in relation to the third sub-lead frame.
9. The apparatus of claim 2, further comprising a plurality of
leads, wherein at least a portion of the second row of pins is in
electrical communication with one or more of the plurality of
leads.
10. The apparatus of claim 9, wherein each of the plurality of
leads is in electrical communication with a solenoid.
11. A lead frame assembly, comprising: a plurality of sub-lead
frames, at least one of the plurality of sub-lead frames disposed
in a first plane, and at least one of the plurality of sub-lead
frames disposed in a second plane; a housing surrounding at least
part of each of the plurality of sub-lead frames; an upper
connector connected to the housing and in electrical communication
with the plurality of sub-lead frames; a plurality of
sub-connectors, each of the plurality of sub-connectors being part
of one of the plurality of sub-lead frames; a plurality of pins, a
portion of the plurality of pins being part of the upper connector
and in electrical communication is another portion of the plurality
of pins being part of each of the plurality of sub-connectors; a
first row of pins being part of the upper connector, the first row
of pins being part of the plurality of pins; a second row of pins
being part of the upper connector, the second row of pins being
part of the plurality of pins; a third row of pins being part of
the upper connector, the third row of pins being part of the
plurality of pins, the third row of pins being located between the
first row of pins and the second row of pins; and a plurality of
leads, at least a portion of the second row of pins being in
electrical communication with one or more of the plurality of
leads; wherein at least a portion of the first row of pins and the
second row of pins are part of one of the plurality of sub-lead
frames, and at least a portion of the third row of pins is part of
another of the plurality of sub-lead frames.
12. The lead frame assembly of claim 11, the plurality of sub-lead
frames further comprising a first sub-lead frame having a portion
disposed in the first plane, a portion of the first row of pins and
a portion of the second row of pins being part of the first
sub-lead frame.
13. The lead frame assembly of claim 12, the first sub-lead frame
further comprising three sub-connectors located in the first plane
and in electrical communication with at least a portion of the
first row of pins.
14. The lead frame assembly of claim 11, the plurality of sub-lead
frames further comprising a second sub-lead frame having a portion
disposed in the first plane, a portion of the first row of pins and
a portion of the second row of pins being part of the second
sub-lead frame.
15. The lead frame assembly of claim 14, the second sub-lead frame
further comprising a sub-connector located in the first plane, and
in electrical communication with at least a portion of the first
row of pins.
16. The lead frame assembly of claim 11, the plurality of sub-lead
frames further comprising a third sub-lead frame having a portion
disposed in the second plane, at least a portion of the third row
of pins being part of the third sub-lead frame.
17. The lead frame assembly of claim 16, the third sub-lead frame
further comprising two sub-connectors located in the second plane,
and in electrical communication with at least a portion of the
third row of pins.
18. The lead frame assembly of claim 11, wherein the upper
connector extends outwardly away from the lead frame, and the upper
connector extends from the first plane.
19. The lead frame assembly of claim 18, wherein each of the
plurality of leads is connected to a solenoid
20. A lead frame assembly, comprising: a first sub-lead frame, a
portion of the first sub-lead frame disposed in a first plane; a
second sub-lead frame, a portion of the second sub-lead frame
disposed in the first plane; a third sub-lead frame, a portion of
the third sub-lead frame disposed in a second plane; a housing
substantially surrounding a portion of the first sub-lead frame,
the second sub-lead frame, and the third sub-lead frame; an upper
connector, at portion of the upper connector integrally formed as
part of the housing; a plurality of leads formed as part of the
first sub-lead frame and the second sub-lead frame; a plurality of
sub-connectors, a portion of the plurality of connectors being part
of the first sub-lead frame, a portion of the plurality of
sub-connectors being part of the second sub-lead frame, and a
portion of the plurality of sub-connectors being part of the third
sub-lead frame; a first row of pins being part of the upper
connector; a second row of pins being part of the upper connector,
at least a portion of the second row of pins being in electrical
communication with one or more of the plurality of leads; and a
third row of pins being part of the upper connector, the third row
of pins being disposed between the first row of pins and the second
row of pins; wherein at least a portion of the first row of pins
and the second row of pins are part of the first sub-lead frame,
and at least a portion of the third row of pins is part of the
second sub-lead frame.
21. The lead frame assembly of claim 20, the plurality of
sub-connectors further comprising a plurality of pins exposed
outside of the housing for connection with electronic devices, each
of the plurality of sub-connectors having one or more of the
plurality of pins in electrical communication with one or more of
the first row of pins, the second row of pins, or the third row of
pins.
22. The lead frame assembly of claim 21, the first sub-lead frame
further comprising three sub-connectors located in the first plane
and in electrical communication with at least a portion of the
first row of pins.
23. The lead frame assembly of claim 21, the third sub-lead frame
further comprising two sub-connectors located in the second plane,
and in electrical communication with at least a portion of the
third row of pins.
24. The lead frame assembly of claim 21, the second sub-lead frame
further comprising a sub-connector located in the first plane, and
in electrical communication with at least a portion of the first
row of pins.
25. The lead frame assembly of claim 20, wherein the upper
connector extends outwardly away from the lead frame, and the upper
connector extends from the first plane.
26. The lead frame assembly of claim 20, wherein each of the
plurality of leads is connected to a solenoid.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part application,
which claims the benefit of U.S. application Ser. No. 13/768,415
filed Feb. 15, 2013. The disclosure of the above application is
incorporated herein by reference.
FIELD OF THE INVENTION
[0002] The invention relates generally to multiple sub-lead frames
being associated with a connector having multiple rows of pins, and
each sub-lead frame has at least one pin that is in electrical
communication with one or more of the rows of pins that are part of
the connector.
BACKGROUND OF THE INVENTION
[0003] Lead frames are commonly used to provide electrical
communication between various electrical components. The lead frame
typically includes metal leads which extend outside of a housing
for providing a connection between various components.
[0004] Lead frames also may include a connector, which is mounted
to the housing, for providing electronic communication between the
lead frame and other devices. There are also applications where is
it necessary to have multiple connectors either formed as part of
the lead frame, or attached to the lead frame. One type of a design
incorporates the use of a lead frame having multiple layers, to
provide for the use of multiple connectors. Still other
applications require the use of a single connector which is in
electrical communication with multiple connectors that are part of
the lead frame having multiple layers. These multiple layer lead
frames are typically constructed using a housing surrounding the
multiple layers, with the multiple layers being separated by a
portion of the housing. One of the issues that may occur during
manufacturing of these types of lead frames is electrical shorts
occurring as a result from mechanical slivers from plating or from
the mold inserts closing on the stamping and dislodging the slivers
from the edge of the stamping. Additionally, lead frames having
multiple layers are more expensive to manufacture because of the
multiple pre-molds required for the additional layers.
[0005] Accordingly, there exists a need for a lead frame which
allows for the use of multiple connectors, as well as multiple lead
frames having a layered structure, while remaining cost feasible to
manufacture.
SUMMARY OF THE INVENTION
[0006] The present invention is a lead frame assembly having
several sub-lead frames, each of which is in electrical
communication with a single connector, providing electrical
communication with several components using the single connector.
The lead frame assembly includes a first sub-lead frame and a
second sub-lead frame, where at least part of each of the first and
second sub-lead frames is in a first plane, and a third sub-lead
frame, which is partially disposed in a second plane. A housing
substantially surrounds a portion of each of the sub-lead frames,
and an upper connector is integrally formed as part of the
housing.
[0007] A plurality of leads are formed as part of the first
sub-lead frame and the second sub-lead frame, and in one
embodiment, each of the plurality of leads is connected to a
solenoid.
[0008] The lead frame assembly also includes a plurality of
sub-connectors, where a portion of the plurality of sub-connectors
are part of the first sub-lead frame, a portion of the plurality of
sub-connectors are part of the second sub-lead frame, and a portion
of the plurality of sub-connectors are part of the third sub-lead
frame.
[0009] Each of the sub-connectors in is electrical communication
with an upper connector having multiple rows of pins. The upper
connector extends from the first plane outwardly away from the
first sub-lead frame and the second sub-lead frame. The upper
connector includes a first row of pins, a second row of pins, and a
third row of pins located between the first row of pins and the
second row of pins. At least a portion of the first and second rows
of pins is part of each of the first sub-lead frame and the second
sub-lead frame, and at least a portion of the third row of pins is
part of the third sub-lead frame. Additionally, a portion of the
second row of pins is in electrical communication with one or more
of the plurality of leads.
[0010] The plurality of sub-connectors also includes varying
amounts of pins in electrical communication with one or more of the
rows of pins of the upper connector, and the pins are exposed
outside of the housing for connection with electronic devices.
[0011] The first sub-lead frame includes three sub-connectors
located in the first plane and in electrical communication with at
least a portion of the first row of pins, the second sub-lead frame
includes a sub-connector located in the first plane and in
electrical communication with at least a portion of the first row
of pins, and the third sub-lead frame includes two sub-connectors
located in the second plane, and in electrical communication with
at least a portion of the third row of pins.
[0012] It is an object of this invention to provide a lead frame
assembly which may be used with several different devices, such as,
but not limited to sensors, thermistors, solenoids, engine
controllers, or electronic control units, or any other device
suitable for connection with a lead frame using one or more
interfaces or connectors. In one embodiment, the interfaces are
located in different planes, allowing for the connection to the
lead frame to be in different planes.
[0013] It is another object of this invention to provide a lead
frame having a single layer to incorporate a three-row connector
system. In one embodiment, the additional third row is added to the
center of a dual row connector. This third center row is part of a
separate sub-lead frame incorporated into the lead frame assembly,
and assembled on the bottom side of the lead frame assembly.
[0014] It is another object of this invention to provide a
three-row connector incorporated into a single layer lead frame.
This provides a cost effective solution for two-row connectors and
potential expansion to three-row connectors at minimal costs. The
lead frame assembly of the present invention also expands the
connector ports and interconnectors on the lead frame. Connectors
having a low pin count are used with the basic lead frame, while
connectors having a high pin count may add expansion to the lead
frame and add the third row. The three-row connector may be used
for providing a single interface to communicate with many
sub-connectors that are connected to various components.
[0015] Further areas of applicability of the present invention will
become apparent from the detailed description provided hereinafter.
It should be understood that the detailed description and specific
examples, while indicating the preferred embodiment of the
invention, are intended for purposes of illustration only and are
not intended to limit the scope of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present invention will become more fully understood from
the detailed description and the accompanying drawings,
wherein:
[0017] FIG. 1 is a perspective view of a lead frame having multiple
connectors, according to embodiments of the present invention;
[0018] FIG. 2 is a top view of a portion of a lead frame having
multiple connectors, according to embodiments of the present
invention;
[0019] FIG. 3 is a perspective view of a lead frame assembly with
the housing and the shroud for each connector removed, according to
embodiments of the present invention;
[0020] FIG. 4 is a perspective view of a sub-assembly, which is
part of a lead frame assembly, according to embodiments of the
present invention; and
[0021] FIG. 5 is a second perspective view of a lead frame having
multiple connectors, according to embodiments of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0022] The following description of the preferred embodiment(s) is
merely exemplary in nature and is in no way intended to limit the
invention, its application, or uses.
[0023] An embodiment of a lead frame assembly according to the
present invention is shown in FIGS. 1-5 generally at 10. The lead
frame assembly 10 includes a frame portion, or lead frame, 12
having a plurality of leads 14. The lead frame 12 in this
embodiment includes several sub-lead frames. There is a first
sub-lead frame, shown generally at 12A, a second sub-lead frame,
shown generally at 12B, and a third sub-lead frame, shown generally
at 12C, with a portion of the leads 14 being part of the first
sub-lead frame 12A and the second sub-lead frame 12B. The lead
frame 12 and leads 14 are at least partially surrounded by a
housing 16. The housing 16 is molded around the lead frame 12 and
leads 14, and is made of a plastic moldable material, such as
epoxy, nylon, polyethylene, or polystyrene.
[0024] The sub-lead frames 12A,B are made of a single layer, shown
generally at 18A, where the single layer 18A defines a first plane.
Integrally formed as part of the housing 16 is more than one
interface. Each interface is used for allowing communication as
well as a connection with the lead frame 12. In this embodiment,
the plurality of interfaces is a plurality of connectors. However,
other types of interfaces may be used to allow the lead frame 12 to
be used with different devices, such as, but not limited to,
thermistors, solenoids, sensors, or the like. Furthermore, the
other devices, such as the sensors, thermistors, solenoids, engine
controllers, or electronic control units, may be directly connected
to the lead frame 12, and in other embodiments, the other devices
may be integral with the lead frame 12.
[0025] In the embodiment shown in FIGS. 1-5, there is a first
connector 20, a second connector 22, and a third connector 24,
which are integral with the housing 16, and the connectors 20,22,24
and layer 18A are located in the first plane 18A. The connectors
20,22,24 are associated with the first sub-lead frame 18A. There is
also a fourth connector 26 and a fifth connector 28 associated with
the third sub-lead frame 12C, and the housing 16 partially
surrounds the fourth connector 26 and the fifth connector 28. The
fourth connector 26 and fifth connector 28 are located in a second
plane, shown generally at 18B, which is substantially parallel to
and separate from the first plane 18A. In this embodiment, the
fourth connector 26 and fifth connector 28 are located below the
connectors 20,22,24. A sixth connector, which in this embodiment is
an upper connector 30, is associated with all three sub-lead frames
12A,B,C, and is at least partially surrounded by the housing 16.
The sixth connector 30 faces and extends outwardly away from the
lead frame 12, on the opposite side as the fourth sub-connector 26
and fifth sub-connector 28, as shown in FIGS. 1, 2, and 5. There is
also a seventh connector 32, which is shown in FIG. 2 and
associated with the second-lead frame 12B. The seventh connector 32
is located in the first plane 18A.
[0026] The connectors 20,22,24,26,28,32 in this embodiment are all
sub-connectors, and are all in electrical communication with the
upper connector 30. Each of the connectors 20,22,24,26,28,30,32
also includes one or more pins 34 which are in electrical
communication with the lead frame 12, which therefore provide
electrical communication between the components connected to the
connectors 20,22,24,26,28,30,32 and the lead frame 12. Some of the
connectors 20,22,24,26,28,30,32 have a greater number of pins (a
high pin count), and other connectors 20,22,24,26,28,30,32 have a
lesser number of pins (a low pin count), depending upon the use for
the connectors 20,22,24,26,28,30,32.
[0027] More specifically, the upper connector 30 is a three-row
connector 30, and includes a first row of pins, shown generally at
30A, a second row of pins, shown generally at 30B, and a third row
of pins, shown generally at 30C. Referring now to FIGS. 2-3, the
first row 30A of pins 34 has fourteen pins, and it is shown that
the pins 34 for the first three connectors 20,22,24 of the first
sub-lead frame 12A are associated with twelve of the pins 34 in the
first row 34A of pins 34 of the upper connector 30. Two of the pins
34 in the first row 30A are associated with the pins 34 of the
seventh connector 32 of the second sub-lead frame 12B.
[0028] The second row 30B of pins 34 of the upper connector 30
includes fourteen pins 34, seven of which are associated with the
leads 14 of the first sub-lead frame 12A, five of which are
associated with the leads 14 of the second sub-lead frame 12B, and
two of which are associated with a thermistor 36, which is located
in the first plane 18A and part of the second sub-lead frame 12B.
The third row 30C of pins 34 of the upper connector 30 are
associated with the pins 34 of the fourth connector 26 and fifth
connector 28.
[0029] The connectors 20,22,24,26,28,30,32 and leads 14 are used
for connecting the assembly 10 to various components. In addition
to having other types of interfaces than the connectors
20,22,24,26,28,30,32, the connectors 20,22,24,26,28,30,32 may be
used for providing a connection between the lead frame 12, and
various components such as sensors, solenoids, thermistors, and the
like. In one embodiment, the lead frame assembly 10 is used as part
of a transmission. Each of the leads 14 may be used for connection
to a corresponding solenoid, and each of the first three connectors
20,22,24 may be used for connection with other parts of the
transmission. Also, each of the remaining connectors 26,28,30,32
may be used to connect to components outside the transmission, such
as an engine controller, a vehicle electronic control unit, or the
like. Various components may also be mounted to the lead frame 12,
such as resistors, capacitors, one or more inductors, or as shown
in FIG. 2, the thermistor 36.
[0030] The use of the three rows 30A,B,C as part of the upper
connector 30 provides the additional functionality of being able to
add the third sub-lead frame 12C to the first and second sub-lead
frames 12A,B, without having to add an additional connector. More
specifically, the design of the lead frame assembly 10 allows for a
single corresponding connector to be connected to the upper
connector 30 and therefore be in electrical communication with all
of the connectors 20,22,24,26,28,32 and the leads 14 of all three
sub-lead frames 12A,12B,12C. The upper connector 30 being a
three-row connector having additional pins 34 therefore expands the
use of the lead frame assembly 10 beyond the use of the two
sub-lead frames 12A,12B having the connectors 20,22,24,32, to
having the additional connectors 26,28, providing the lead frame
assembly 10 with additional capability, without having to add
another connector to supplement the upper connector 30.
[0031] While is has been shown that the pins 34 in each of the rows
30A,30B,30C are associated with the various pins 34 of the
connectors 20,22,24,26,28,32 and leads 14, as previously described,
it is within the scope of the invention that the pins 34 of the
connector 30 may be configured differently, and each row
30A,30B,30C may have different pins 34 associated with different
connectors 20,22,24,26,28,32 and leads 14, without departing from
the scope of the invention.
[0032] Referring again to the Figures generally, in one embodiment,
the fourth connector 26 and the fifth connector 28 are grouped
together as a cluster, shown generally at 38. The cluster 38 is
connected to the lead frame 12 through the use of an extension 40.
The extension 40 provides a connection between the portion of the
housing 16 which supports the connectors 26,28 located in the
second plane 18B and the portion of the housing 16 located in the
first plane 18A. In other embodiments, the connectors 26,28 are not
arranged in a cluster, but are located in separate locations, and
there is a separate extension for each connector 26,28, which is
used to support each connectors 26,28.
[0033] Various molding techniques may be used to integrally form
the housing 16 with the lead frame 12. The housing 12 is molded
around the lead frame 12, while still allowing the pins 34 and the
leads 14 to remain exposed for connection with the various
components as mentioned above. The lead frame 12 may also include
die attach pads which are used for supporting the lead frame 12
during assembly.
[0034] The description of the invention is merely exemplary in
nature and, thus, variations that do not depart from the gist of
the invention are intended to be within the scope of the invention.
Such variations are not to be regarded as a departure from the
spirit and scope of the invention.
* * * * *