U.S. patent application number 14/322386 was filed with the patent office on 2015-01-08 for cover of a mobile device and mobile device including the same.
The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Yo-Han JANG, Byeong-Hoon LEE, Young-Ki LEE, Hyoung-Hwan ROH, Il-Jong SONG.
Application Number | 20150009077 14/322386 |
Document ID | / |
Family ID | 52132429 |
Filed Date | 2015-01-08 |
United States Patent
Application |
20150009077 |
Kind Code |
A1 |
LEE; Young-Ki ; et
al. |
January 8, 2015 |
COVER OF A MOBILE DEVICE AND MOBILE DEVICE INCLUDING THE SAME
Abstract
A cover of a mobile device includes a metal structure disposed
to cover one surface of the mobile device. The metal structure
includes a metal material, and operates as an antenna for a
wireless communication of the mobile device.
Inventors: |
LEE; Young-Ki; (Incheon,
KR) ; ROH; Hyoung-Hwan; (Seoul, KR) ; SONG;
Il-Jong; (Suwon-si, KR) ; JANG; Yo-Han;
(Hwaseong-si, KR) ; LEE; Byeong-Hoon; (Seoul,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Suwon-Si |
|
KR |
|
|
Family ID: |
52132429 |
Appl. No.: |
14/322386 |
Filed: |
July 2, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61842546 |
Jul 3, 2013 |
|
|
|
Current U.S.
Class: |
343/702 |
Current CPC
Class: |
H04M 2250/04 20130101;
H04B 5/0031 20130101; H04M 1/72575 20130101; H01Q 13/10 20130101;
H04B 1/3888 20130101; H01Q 1/243 20130101 |
Class at
Publication: |
343/702 |
International
Class: |
H01Q 1/24 20060101
H01Q001/24; H01Q 1/50 20060101 H01Q001/50 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 29, 2014 |
KR |
10-2014-0011470 |
Claims
1. A cover of a mobile device, comprising: a metal structure
configured to cover one surface of the mobile device, the metal
structure including a metal material, and configured to operate as
an antenna for a wireless communication of the mobile device.
2. The cover of claim 1, wherein the metal structure includes a
metal plate region having a shape of a split ring resonator
(SPR).
3. The cover of claim 1, wherein the metal structure includes: a
metal plate including the metal material, the metal plate
configured to cover the one surface of the mobile device; an
opening formed at the metal plate; a slit extending from the
opening, the slit having a width narrower than a width of the
opening; and two terminals on the metal plate such that the slit is
located between the two terminals.
4. The cover of claim 3, wherein a signal path from one of the two
terminals to the other of the two terminals is formed at a region
of the metal plate surrounding the opening.
5. The cover of claim 4, wherein the metal structure further
includes: an insulator around at least a portion of the region of
the metal plate, the region at which the signal path is formed.
6. The cover of claim 3, wherein the opening has a triangular
shape, a rectangular shape, a polygonal shape having five or more
sides, a circular shape or an elliptical shape.
7. The cover of claim 3, wherein the metal structure further
includes: a capacitor at the slit.
8. The cover of claim 7, wherein the metal structure operates as a
resonator having a resonance frequency for the wireless
communication.
9. The cover of claim 7, wherein the capacitor is formed by
portions of the metal plate at both sides of the slit and an
insulator in the slit.
10. The cover of claim 3, wherein the two terminals are coupled to
a capacitor included in a matching circuit of the mobile device,
and the metal structure and the capacitor included in the matching
circuit operate as a resonator having a resonance frequency for the
wireless communication.
11. The cover of claim 3, wherein the metal structure further
includes: a magnetic sheet on at least a portion of the metal
plate.
12. The cover of claim 1, wherein the metal structure includes: a
metal plate including the metal material, the metal plate
configured to cover the one surface of the mobile device; an
opening formed at the metal plate; and two terminals on the metal
plate such that the opening is located between the two
terminals.
13. The cover of claim 1, wherein the metal structure includes: a
metal plate including the metal material, the metal plate
configured to cover the one surface of the mobile device; a first
opening formed at the metal plate; a second opening formed at the
metal plate, the second opening being spaced apart from the first
opening; and two terminals on the metal plate such that the first
and second openings are located between the two terminals.
14. The cover of claim 1, wherein the metal structure is configured
to operate as the antenna for a near field communication (NFC).
15. A mobile device comprising: a wireless communication chip
configured to perform a wireless communication; a matching circuit
coupled to the wireless communication chip, the matching circuit
configured to perform impedance matching between the wireless
communication chip and an antenna for the wireless communication;
and a cover of the mobile device configured to cover at least one
surface of the mobile device, and coupled to the matching circuit,
the cover including a metal material, and configured to operate as
the antenna for the wireless communication.
16. A cover of a mobile device, comprising: a cover configured to
cover at least one surface of the mobile device and operate as an
antenna for a wireless communication of the mobile device, the
cover formed of a metal material and including a metal plate
region, the metal plate region including an opening, at least one
slit and at least two terminals, the slit extending from a side of
the opening, and the two terminals configured to be connected to a
matching circuit of the mobile device.
17. The cover of claim 16, further comprising: a magnetic sheet
covering at least a portion of the metal plate region.
18. The cover of claim 16, further comprising: an insulator at the
slit, wherein, the insulator and the two terminals forms a
capacitor, and the capacitor and the metal plate region serving as
an inductor are configured to operate as a resonator having an LC
resonance frequency.
19. The cover of claim 16, wherein an insulator around at least a
portion of the metal plate region and configured to shield a signal
path formed at the metal plate from a noise from an outside of the
signal path.
20. The cover of claim 16, further comprising: an insulator at the
slit and around at least a portion of the metal plate region, a
first portion of the insulator at the slit and the two terminals
forming a capacitor, a second portion of the insulator configured
to shield a signal path formed at the metal plate from a noise from
an outside of the signal path.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This U.S. non-provisional application claims the benefit of
priority under 35 U.S.C. .sctn.119 to U.S. Provisional Application
No. 61/842,546 filed on Jul. 3, 2013 in the USPTO, and Korean
Patent Application No. 10-2014-0011470 filed on Jan. 29, 2014 in
the Korean Intellectual Property Office (KIPO), the entire contents
of which are incorporated by reference herein in their
entireties.
BACKGROUND
[0002] 1. Technical Field
[0003] Example embodiments relate generally to electronic devices
and, more particularly, to mobile devices and/or covers of the
mobile devices.
[0004] 2. Description of the Related Art
[0005] To perform a desired (or alternatively, predetermined)
wireless communication (e.g., a near field communication (NFC), a
radio frequency identification (RFID) communication, etc.) in a
mobile device, such as a smart phone, or a tablet computer), a
wireless communication chip (e.g., an NFC chip) is embedded in the
mobile device, and an antenna for transmitting/receiving a signal
from/to the wireless communication chip is attached to an inside of
a housing of the mobile device (e.g., an inside of a cover of the
mobile device). The housing can be formed of resin or plastic.
[0006] Recently, as the mobile device has become thinner, the
strength of the resin housing has been reduced. Thus, a mobile
device housing made of a metal material has been developed to
compensate the reduction in strength. However, in the case where
the mobile device housing (e.g., the cover of the mobile device) is
made of the metal material, the antenna attached to the cover is
shielded by the metal material, which hinders the wireless
communication of the mobile device.
SUMMARY
[0007] Some example embodiments provide a cover of a mobile device,
the cover enabling a wireless communication of the mobile
device.
[0008] Some example embodiments provide a mobile device including a
cover that improves wireless communication capabilities of the
mobile device.
[0009] According to example embodiments, a cover of a mobile device
may include a metal structure configured to cover one surface of
the mobile device. The metal structure may include a metal
material, and operate as an antenna for a wireless communication of
the mobile device.
[0010] In some example embodiments, the metal structure may include
a metal plate region having a shape of a split ring resonator
(SPR).
[0011] In some example embodiments, the metal structure may include
a metal plate including the metal material, the metal plate
configured to cover the one surface of the mobile device, an
opening formed at the metal plate, a slit extending from the
opening, the slit having a width narrower than a width of the
opening, and two terminals disposed on the metal plate such that
the slit is located between the two terminals.
[0012] In some example embodiments, a signal path from one of the
two terminals to the other of the two terminals may be formed at a
region of the metal plate surrounding the opening.
[0013] In some example embodiments, the metal structure may further
include an insulator around at least a portion of (e.g.,
surrounding) the region of the metal plate at which the signal path
is formed.
[0014] In some example embodiments, the opening may have a
triangular shape, a rectangular shape, a polygonal shape having
five or more sides, a circular shape or an elliptical shape.
[0015] In some example embodiments, the metal structure may further
include a capacitor formed at the slit.
[0016] In some example embodiments, the metal structure may operate
as a resonator having a resonance frequency suitable for the
wireless communication.
[0017] In some example embodiments, the capacitor may be formed by
portions of the metal plate at both sides of the slit and an
insulator formed to fill the slit.
[0018] In some example embodiments, the two terminals may be
coupled to a capacitor included in a matching circuit of the mobile
device, and the metal structure and the capacitor included in the
matching circuit may operate as a resonator having a resonance
frequency suitable for the wireless communication.
[0019] In some example embodiments, the metal structure may further
include a magnetic sheet disposed on at least a portion of the
metal plate.
[0020] In some example embodiments, the metal structure may include
a metal plate including the metal material, the metal plate
configured to cover the one surface of the mobile device, an
opening formed at the metal plate, and two terminals disposed on
the metal plate such that the opening is located between the two
terminals.
[0021] In some example embodiments, the metal structure may include
a metal plate including the metal material, the metal plate
configured to cover the one surface of the mobile device, a first
opening formed at the metal plate, a second opening formed at the
metal plate, the second opening being spaced apart from the first
opening, and two terminals disposed on the metal plate such that
the first and second openings are located between the two
terminals.
[0022] In some example embodiments, the metal structure may operate
as the antenna for a near field communication (NFC).
[0023] According to example embodiments, a mobile device may
include a wireless communication chip, a matching circuit, and a
cover of the mobile device. The wireless communication chip may be
configured to perform a wireless communication. The matching
circuit may be coupled to the wireless communication chip, and
configured to perform impedance matching between the wireless
communication chip and an antenna for the wireless communication.
The cover of the mobile device may be configured to cover at least
one surface of the mobile device, and be coupled to the matching
circuit. The cover may include a metal material, and be configured
to operate as the antenna for the wireless communication.
[0024] According to example embodiments, a cover of a mobile
device, may include a cover configured to cover at least one
surface of the mobile device and operate as an antenna for a
wireless communication of the mobile device, the cover formed of a
metal material and including a metal plate region, the metal plate
region including an opening, at least one slit and at least two
terminals, the slit extending from a side of the opening, and the
two terminals configured to be connected to a matching circuit of
the mobile device.
[0025] In some example embodiments, the cover may further include a
magnetic sheet covering at least a portion of the metal plate
region.
[0026] In some example embodiments, the cover may further include
an insulator at the slit. The insulator and the two terminals may
form a capacitor, and the capacitor and the metal plate region
serving as an inductor may be configured to operate as a resonator
having an LC resonance frequency.
[0027] In some example embodiments, an insulator may be disposed
around at least a portion of the metal plate region and be
configured to shield a signal path formed at the metal plate from a
noise from an outside of the signal path.
[0028] In some example embodiments, the cover may further include
an insulator at the slit and around at least a portion of the metal
plate region, a first portion of the insulator at the slit and the
two terminals forming a capacitor, a second portion of the
insulator configured to shield a signal path formed at the metal
plate from a noise from an outside of the signal path.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Illustrative, non-limiting example embodiments will be more
clearly understood from the following detailed description taken in
conjunction with the accompanying drawings.
[0030] FIG. 1 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0031] FIGS. 2A through 2C are diagrams illustrating some examples
of openings formed at the cover of FIG. 1.
[0032] FIG. 3 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0033] FIG. 4 is a circuit diagram illustrating an equivalent
circuit of the cover of FIG. 3.
[0034] FIG. 5 is a diagram illustrating a modified example of the
cover of FIG. 3.
[0035] FIG. 6 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0036] FIG. 7 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0037] FIG. 8 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0038] FIG. 9 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0039] FIG. 10 is a diagram illustrating an example of a mobile
device according to example embodiments.
[0040] FIG. 11 is a circuit diagram illustrating a wireless
communication device included in a mobile device according to
example embodiments.
[0041] FIG. 12 is a block diagram illustrating a mobile device
according to example embodiments.
DETAILED DESCRIPTION
[0042] Various example embodiments will be described more fully
hereinafter with reference to the accompanying drawings, in which
some example embodiments are shown. Example embodiments may,
however, be embodied in many different forms and should not be
construed as limited to the example embodiments set forth herein.
In the drawings, the sizes and relative sizes of layers and regions
may be exaggerated for clarity.
[0043] It will be understood that when an element or layer is
referred to as being "on," "connected to" or "coupled to" another
element or layer, it can be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like numerals refer to like elements throughout. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items.
[0044] It will be understood that, although the terms first,
second, third etc. may be used herein to describe various elements,
components, regions, layers and/or sections, these elements,
components, regions, layers and/or sections should not be limited
by these terms. These terms are only used to distinguish one
element, component, region, layer or section from another region,
layer or section. Thus, a first element, component, region, layer
or section discussed below could be termed a second element,
component, region, layer or section without departing from the
teachings of example embodiments.
[0045] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper" and the like, may be used herein for ease
of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. It
will be understood that the spatially relative terms are intended
to encompass different orientations of the device in use or
operation in addition to the orientation depicted in the figures.
For example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
example term "below" can encompass both an orientation of above and
below. The device may be otherwise oriented (rotated 90 degrees or
at other orientations) and the spatially relative descriptors used
herein interpreted accordingly.
[0046] The terminology used herein is for the purpose of describing
particular example embodiments only and is not intended to be
limiting of example embodiments. As used herein, the singular forms
"a," "an" and "the" are intended to include the plural forms as
well, unless the context clearly indicates otherwise. It will be
further understood that the terms "comprises" and/or "comprising,"
when used in this specification, specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof.
[0047] Example embodiments are described herein with reference to
cross-sectional illustrations that are schematic illustrations of
idealized example embodiments (and intermediate structures). As
such, variations from the shapes of the illustrations as a result,
for example, of manufacturing techniques and/or tolerances, are to
be expected. Thus, example embodiments should not be construed as
limited to the particular shapes of regions illustrated herein but
are to include deviations in shapes that result, for example, from
manufacturing. For example, an implanted region illustrated as a
rectangle will, typically, have rounded or curved features and/or a
gradient of implant concentration at its edges rather than a binary
change from implanted to non-implanted region. Likewise, a buried
region formed by implantation may result in some implantation in
the region between the buried region and the surface through which
the implantation takes place. Thus, the regions illustrated in the
figures are schematic in nature and their shapes are not intended
to illustrate the actual shape of a region of a device and are not
intended to limit the scope of example embodiments.
[0048] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which example
embodiments belong. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0049] Although corresponding plan views and/or perspective views
of some cross-sectional view(s) may not be shown, the
cross-sectional view(s) of device structures illustrated herein
provide support for a plurality of device structures that extend
along two different directions as would be illustrated in a plan
view, and/or in three different directions as would be illustrated
in a perspective view. The two different directions may or may not
be orthogonal to each other. The three different directions may
include a third direction that may be orthogonal to the two
different directions. The plurality of device structures may be
integrated in a same electronic device. For example, when a device
structure (e.g., a memory cell structure or a transistor structure)
is illustrated in a cross-sectional view, an electronic device may
include a plurality of the device structures (e.g., memory cell
structures or transistor structures), as would be illustrated by a
plan view of the electronic device. The plurality of device
structures may be arranged in an array and/or in a two-dimensional
pattern.
[0050] Hereinafter, some example embodiments will be explained in
further detail with reference to the accompanying drawings.
[0051] FIG. 1 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0052] Referring to FIG. 1, a cover 100 of a mobile device may
include a metal structure 110 formed of a metal material. According
to example embodiments, the cover 100 of the mobile device may be a
cover of any mobile device, for example, a cellular phone, a smart
phone, a tablet computer, a laptop computer, a personal digital
assistant (PDA), a portable multimedia player (PMP), a digital
camera, a music player, a portable game console, or a navigation
device.
[0053] The metal structure 110 (or the cover 100 including the
metal structure 110 may be disposed at one surface of the mobile
device. For example, the metal structure 110 may be disposed at a
back surface of the mobile device, which is opposite to a front
surface of the mobile device where a display device is disposed. In
some example embodiments, the cover 100 including the metal
structure 110 may be detachably attached to a body housing of the
mobile device. In other example embodiments, the cover 100
including the metal structure 110 may be integrally formed with the
body housing of the mobile device.
[0054] The metal structure 110 of the cover 100 may include any
metal material having a desired (or alternatively, predetermined)
strength and a desired (or alternatively, predetermined) electrical
conductivity. For example, the metal structure 110 may be formed of
at least one of copper (Cu), aluminum (Al), iron (Fe), titanium
(Ti), silver (Ag), palladium (Pd), platinum (Pt), aurum (Au),
nickel (Ni) and the like. When the cover 100 of the mobile device
is implemented as a metal cover formed mostly of the metal
material, the cover 100 may become thinner while maintaining a
desired (or alternatively, predetermined) strength. Accordingly,
the mobile device may become thinner.
[0055] The metal structure 110 of the cover 100 may operate as an
antenna for a wireless communication of the mobile device. In some
example embodiments, the wireless communication of the mobile
device may be a near field communication (NFC). In other example
embodiments, the wireless communication of the mobile device may be
any wireless communication, for example, a radio frequency
identification (RFID) communication. In a conventional mobile
device, a separate NFC antenna is attached to an inside of a cover
of the conventional mobile device. However, the metal structure 110
or the cover 100 including the metal structure 110 according to
example embodiments may serve as the NFC antenna by itself.
Accordingly, by adopting the metal cover 100 including the metal
structure 110 and serving as the NFC antenna, a relatively thin
mobile device may be implemented. Further, if the metal cover is
applied in a conventional mobile device, an NFC antenna attached to
the metal cover may be shielded by the metal cover, and thus a
signal (e.g., an electromagnetic wave) transmitted/received by the
NFC antenna may be distorted. However, in the mobile device
according to example embodiments, because the metal cover 100
operates as the NFC antenna by itself, the NFC communication may be
accurately performed without a signal distortion.
[0056] In some example embodiments, to allow the metal structure
110 or the cover 100 including the metal structure 110 to operate
as the antenna for the wireless communication, the metal structure
110 of the cover 100 may include a metal plate region 170 having a
shape of a split ring resonator (SPR). The metal plate region 170
having the shape of the SPR may serve as an inductor by forming a
signal path SP (e.g., a current path), and operate as a resonator
along with a capacitor formed at the metal structure 110 or a
capacitor formed at a matching circuit of the mobile device. To
form the signal path SP at the metal plate region 170, the metal
structure 110 may include a metal plate 120, an opening 130, a slit
140 and terminals 150 and 160.
[0057] The metal plate 120 may include the metal material, for
example, copper (Cu), aluminum (Al), iron (Fe), titanium (Ti),
silver (Ag), palladium (Pd), platinum (Pt), aurum (Au), or nickel
(Ni). Thus, the metal plate 120 may have the electrical
conductivity. The metal plate 120 may be disposed to cover one
surface of the mobile device. For example, the metal plate 120 may
be disposed at the back surface of the mobile device, which is
opposite to the front surface of the mobile device where the
display device is disposed.
[0058] The opening 130 may be formed at a portion of the metal
plate 120. In some example embodiments, the opening 130 may be
formed to expose a portion of components of the mobile device. For
example, the opening 130 may be a camera hole that exposes a camera
module of the mobile device. Although FIG. 1 illustrates an example
where the opening 130 has a rectangular shape, in some example
embodiments, the opening 130 may have any shape, for example, a
triangular shape, a polygonal shape having five or more sides, a
circular shape, or an elliptical shape.
[0059] The slit 140 may be formed at the metal plate 120, and may
extend from the opening 130. For example, the slit 140 may extend
from one side of the opening 130, and may be substantially
perpendicular to the one side of the opening 130. The slit 140 may
have a narrow width, for example a width narrower than that of the
opening 130. In some example embodiments, a portion or the entirety
of the slit 140 may be filled with an insulator or a dielectric. In
this case, the insulator at the slit 140 may form a capacitor along
with portions of the metal plate 120 at both sides of the slit
140.
[0060] A plurality of terminals 150 and 160 may be formed on the
metal plate 120. For example, two terminals 150 and 160 may be
disposed such that the slit 140 is located between the two
terminals 150 and 160. The two terminals 150 and 160 may be coupled
to a desired (or alternatively, predetermined) wireless
communication chip (e.g., an NFC chip) through a matching circuit
of the mobile device.
[0061] In the metal structure 110, a signal path SP (e.g., a
current path) from one of the two terminals 150 and 160 to the
other of the two terminals 150 and 160 may be formed at a region
170 of the metal plate 120 surrounding the opening 130.
Accordingly, the region 170 of the metal plate 120, which may be a
conductor having a split ring shape, may serve as an inductor
having a desired (or alternatively, predetermined) inductance, and
may operate as a resonator having a predetermined resonance
frequency along with capacitors having desired (or alternatively,
predetermined) capacitances included in the metal structure 110
and/or the matching circuit. In some example embodiments, a size of
the opening 130 of the mobile device may be previously determined
or may be set to have a desired value, and thus the inductance of
the region 170 of the metal plate 120 may be fixed. In this case,
the capacitances of the capacitors included in the metal structure
110 and/or the matching circuit may be adjusted to allow the
resonance frequency of the resonator to become the same as a
resonance frequency suitable for the wireless communication of the
mobile device. For example, the mobile device may perform the NFC
communication as the wireless communication, and the resonator
formed by the region 170 of the metal plate 120 and the capacitor
may have the resonance frequency of about 13.56 MHz. Accordingly,
the metal structure 110 or the cover 100 including the metal
structure 110 may operate as an antenna for the NFC
communication.
[0062] As described above, the cover 100 of the mobile device
according to example embodiments may serve as the inductor having
the desired (or alternatively, predetermined) inductance or the
resonator having the desired (or alternatively, predetermined)
resonance frequency by including the region 170 of the metal plate
120 having the split ring shape, and thus may operate as the
antenna for the wireless communication (e.g., the NFC
communication) of the mobile device. That is, the cover 100 of the
mobile device according to example embodiments may operate as the
antenna for the NFC communication by itself, and thus the mobile
device may not require a separate antenna for the NFC
communication. Accordingly, although the cover 100 of the mobile
device is the metal cover, the mobile device may accurately perform
the NFC communication without the signal distortion. Further,
because the separate antenna for the NFC communication is not
required, the size of the mobile device may be reduced and a
manufacturing cost may be reduced.
[0063] FIGS. 2A through 2C are diagrams illustrating some examples
of openings formed at a cover of FIG. 1.
[0064] Referring to FIG. 2A, a metal structure 110a of a cover may
include a metal plate 120a, an opening 130a, a slit 140a and
terminals 150a and 160a. In some example embodiments, the opening
130a may expose a portion of components of the mobile device. For
example, the opening 130a may be a camera hole that exposes a
camera module of the mobile device. As illustrated in FIG. 2A, the
opening 130a may have a triangular shape. A signal path from one
terminal (e.g., 150a) to the other terminal (e.g., 160a) may be
formed at a region of the metal plate 120a surrounding the opening
130a, and thus the metal structure 110a may operate as an antenna
for a wireless communication.
[0065] Referring to FIG. 2B, a metal structure 110b of a cover may
include a metal plate 120b, an opening 130b, a slit 140b and
terminals 150b and 160b. The opening 130b may have any polygonal
shape, for example, a pentagonal shape as illustrated in FIG. 2B. A
signal path from one terminal (e.g., 150b) to the other terminal
(e.g., 160b) may be formed at a region of the metal plate 120b
surrounding the opening 130b, and thus the metal structure 110b may
operate as an antenna for a wireless communication.
[0066] Referring to FIG. 2C, a metal structure 110c of a cover may
include a metal plate 120c, an opening 130c, a slit 140c and
terminals 150c and 160c. The opening 130c may have an elliptical
shape, or a circular shape as illustrated in FIG. 2C. A signal path
from one terminal (e.g., 150c) to the other terminal (e.g., 160c)
may be formed at a region of the metal plate 120c surrounding the
opening 130c, and thus the metal structure 110c may operate as an
antenna for a wireless communication.
[0067] FIG. 3 is a diagram illustrating a cover of a mobile device
according to example embodiments, and FIG. 4 is a circuit diagram
illustrating an equivalent circuit of the cover of FIG. 3.
[0068] Referring to FIG. 3, a cover 200 of a mobile device may
include a metal structure 210 formed of a metal material. The metal
structure 210 may include a metal plate 220, an opening 230, a slit
240, terminals 250 and 260 and a capacitor 280. The metal structure
210 of FIG. 3 may have a similar configuration to the metal
structure 110 of FIG. 1, except that the metal structure 210 may
further include the capacitor 280.
[0069] The capacitor 280 may be formed at the slit 240 between the
terminals 250 and 260. In some example embodiments, at least a
portion of the slit 240 may be filled with an insulator, and the
capacitor 280 may be formed by portion of the metal plate 220 at
both side of the slit 240 and the insulator formed to fill the slit
240. In other example embodiments, a separately manufactured
capacitor 280 may be attached to the silt 240.
[0070] The capacitor 280 may operate as a resonator along with a
region 270 of the metal plate 220 at which a signal path SP is
formed. For example, as illustrated in FIG. 4, the region 270 of
the metal plate 220, which may be a conductor having a split ring
shape, may serve as an inductor L having a desired (or
alternatively, predetermined) inductance, and the capacitor 280
formed at the slit 240 may serve as a capacitor C coupled between
terminals T1 and T2 (e.g., the terminals 250 and 260 illustrated in
FIG. 3) and may be in parallel with the inductor L. Accordingly,
the region 270 of the metal plate 220 and the capacitor 280 may
operate as a resonator having a desired (or alternatively,
predetermined) LC resonance frequency.
[0071] In some example embodiments, the capacitance of the
capacitor 280 may be determined to allow the resonator to have a
resonance frequency suitable for the wireless communication (e.g.,
an NFC communication) of the mobile device. For example, a size of
the opening 230 may be determined according to a size of a
component (e.g., a camera module) of the mobile device that is
exposed by the opening 230, and thus the inductance of the region
270 of the metal plate 220 may be fixed. Thus, to allow the
resonator to have the desired (or alternatively, predetermined)
resonance frequency, the capacitance of the capacitor 280 may be
determined based on the desired resonance frequency and the fixed
inductance. For example, the mobile device may perform the NFC
communication, and the capacitance of the capacitor 280 may be
determined to allow the resonator to have a resonance frequency of,
for example, about 13.56 MHz.
[0072] In other example embodiments, a matching circuit coupled to
the terminals T1 and T2 (e.g., the terminals 250 and 260
illustrated in FIG. 3) may include a capacitor C between terminals
T1 and T2, the capacitor C being in parallel with the inductor L,
and the resonance frequency of the resonator may be determined
based on the inductance of the inductor L (or the region 270 of the
metal plate 220) and a sum of the capacitance of the capacitor C
(or the capacitor 280) of the metal structure 210 and a capacitance
of the capacitor of the matching circuit.
[0073] As described above, the cover 200 of the mobile device
according to example embodiments may serve as the resonator having
the desired (or alternatively, predetermined) resonance frequency
by including the region 270 of the metal plate 220 serving as the
inductor L and the capacitor 280 and C formed at the slit 240,
thereby operating as the antenna for the wireless communication
(e.g., the NFC communication) of the mobile device. For example,
the cover 200 of the mobile device according to example embodiments
may operate as the antenna for the NFC communication by itself, and
thus the mobile device may not require a separate antenna for the
NFC communication. Accordingly, although the cover 200 of the
mobile device is the metal cover and the mobile device does not
include a separate antenna for the NFC communication, the mobile
device may accurately perform the NFC communication without the
signal distortion. Further, because the separate antenna for the
NFC communication is not required, the size of the mobile device
may be reduced, and a manufacturing cost for the mobile device may
be reduced.
[0074] FIG. 5 is a diagram illustrating a modified example of the
cover of FIG. 3.
[0075] Referring to FIG. 5, a metal structure 210a of a cover may
include a metal plate 220a, an opening 230a, a slit 240a, terminals
250a and 260a and a capacitor 280a formed at the slit 240a.
[0076] A portion or the entirety of the slit 240a may be filled
with an insulator 285a. Thus, portions of the metal plate 220a at
both side of the slit 240a and the insulator 285a may form the
capacitor 280a.
[0077] Accordingly, the metal structure 210a may have a desired (or
alternatively, predetermined) inductance by a region of the metal
plate 220a at which a signal path is formed and a desired (or
alternatively, predetermined) capacitance by the capacitor 280a.
Thus, the metal structure 210a may operate as a resonator having a
desired (or alternatively, predetermined) resonance frequency.
Accordingly, the cover including the metal structure 210a may
operate as an antenna by itself without a separate antenna.
[0078] FIG. 6 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0079] Referring to FIG. 6, a cover 300 of a mobile device may
include a metal structure 310 formed of a metal material. The metal
structure 310 may include a metal plate 320, an opening 330, a slit
340, terminals 350 and 360, and an insulator 390. The metal
structure 310 of FIG. 6 may have a similar configuration to the
metal structure 110 of FIG. 1, except that the metal structure 310
may further include the insulator 390.
[0080] The insulator 390 may be formed to surround a region of the
metal plate 320 at which a signal path SP is formed. The signal
path SP may be isolated by the insulator 390, and thus signal
leakage (e.g., current leakage) of the signal path SP may be
mitigated or prevented. Further, a noise from the outside of the
signal path SP may be blocked by the insulator 390. Accordingly, a
signal (e.g., an electromagnetic wave) transmitted/received by the
cover 300 may be further mitigated or prevented from being
distorted.
[0081] In some example embodiments, an insulator 390 (or a
dielectric) may be further formed at the slit 340. In this case,
the metal structure 310 may have a desired (or alternatively,
predetermined) capacitance by portions of the metal plate 320 at
both sides of the slit 340 and the insulator 390 (or the
dielectric) formed to fill the slit 340. The metal structure 310
may further have a desired (or alternatively, predetermined)
inductance by the region of the metal plate 320 at which the signal
path SP is formed, and thus the metal structure 310 may operate as
a resonator having a desired (or alternatively, predetermined)
resonance frequency. Accordingly, the cover 300 of the mobile
device according to example embodiments may operate as an antenna
by itself without a separate antenna.
[0082] FIG. 7 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0083] Referring to FIG. 7, a cover 400 of a mobile device may
include a metal structure 410 formed of a metal material. The metal
structure 410 may include a metal plate 420, an opening 430, a slit
440, terminals 450 and 460 and a magnetic sheet 495. The metal
structure 410 of FIG. 7 may have a similar configuration to the
metal structure 110 of FIG. 1, except that the metal structure 410
may further include the magnetic sheet 495.
[0084] The magnetic sheet 495 may be attached to at least a portion
of the metal plate 420. In some example embodiments, the magnetic
sheet 495 may be formed to cover the entire surface of the metal
plate 420. In other example embodiments, the magnetic sheet 495 may
be formed on a region of the metal plate 420 at which a signal path
is formed. According to example embodiments, the magnetic sheet 495
may be a ferrite sheet or a magneto-dielectric material (MDM)
sheet. The magnetic sheet 495 may improve electromagnetic wave
radiation efficiency, and may adjust a resonance frequency of the
metal structure 410. Accordingly, even if the region of the metal
plate 420 at which the signal path is formed has a small size, the
metal structure 410 may have a desired resonance frequency using
the magnetic sheet 495. Thus, by the magnetic sheet 495, the size
of the region of the metal plate 420 at which the signal path is
formed may be reduced. Further, due to the reduction in size of the
region of the metal plate 420 at which the signal path is formed,
electromagnetic wave absorption by a human body may be reduced. For
example, by the magnetic sheet 495, a change in the resonance
frequency of the metal structure 410 when the cover 400 is touched
by a hand of a human, which hereinafter will be referred to as a
"hand effect," may be mitigated or prevented.
[0085] The cover 400 of the mobile device according to example
embodiments may operate as an antenna by itself without a separate
antenna. Further, in the cover 400 of the mobile device according
to example embodiments, the hand effect may be mitigated or
prevented by the magnetic sheet 495.
[0086] FIG. 8 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0087] Referring to FIG. 8, a cover 500 of a mobile device includes
a metal structure 510 formed of a metal material. The cover 500 may
be disposed to cover one surface of the mobile device. The metal
structure 510 of the cover 500 may include any metal material
having a desired (or alternatively, predetermined) strength and a
desired (or alternatively, predetermined) electrical conductivity.
The metal structure 510 or the cover 500 including the metal
structure 510 may operate as an antenna for a wireless
communication (e.g., an NFC communication) of the mobile
device.
[0088] To allow the cover 500 to operate as the antenna, the metal
structure 510 may include a metal plate 520, an opening 530, and
terminals 550 and 560.
[0089] The metal plate 520 may include the metal material, for
example, copper (Cu), aluminum (Al), iron (Fe), titanium (Ti),
silver (Ag), palladium (Pd), platinum (Pt), aurum (Au), or nickel
(Ni). The opening 530 may be formed at a portion of the metal plate
520. In some example embodiments, the opening 530 may be formed to
expose a portion of components (e.g., a camera module) of the
mobile device. Although FIG. 8 illustrates an example where the
opening 530 has a rectangular shape, in some example embodiments,
the opening 530 may have any shape, for example, a triangular
shape, a polygonal shape having five or more sides, a circular
shape, or an elliptical shape. The two terminals 550 and 560 may be
disposed on the metal plate 520 such that the opening 530 is
located between the two terminals 550 and 560. In some example
embodiments, the opening 530 may extend to an edge of the metal
plate 520, and may be formed such that a portion of a top region of
the metal plate 520 is opened. In this case, the two terminals 550
and 560 may be formed near the edge at the top region of the metal
plate 520 while the opening 530 is located between the two
terminals 550 and 560. In other example embodiments, as illustrated
in FIG. 8, the metal structure 510 may further include an insulator
590 formed at one side of the opening 530, and the two terminals
550 and 560 may be formed near the insulator 590 while the opening
530 is located between the two terminals 550 and 560.
[0090] In the metal structure 510, a signal path SP (e.g., a
current path) from one of the two terminals 550 and 560 to the
other of the two terminals 550 and 560 may be formed at a region of
the metal plate 520 surrounding the opening 530. Accordingly, the
region of the metal plate 520 at which the signal path SP is formed
may serve as an inductor having a desired (or alternatively,
predetermined) inductance, and may operate as a resonator having a
desired (or alternatively, predetermined) resonance frequency along
with capacitors having desired (or alternatively, predetermined)
capacitances included in the metal structure 510 and/or a matching
circuit.
[0091] As described above, the cover 500 of the mobile device
according to example embodiments may serve as the inductor having
the desired (or alternatively, predetermined) inductance and/or the
resonator having the desired (or alternatively, predetermined)
resonance frequency. Thus, the cover 500 of the mobile device
according to example embodiments may operate as the antenna for the
wireless communication (e.g., the NFC communication) of the mobile
device. For example, the cover 500 of the mobile device according
to example embodiments may operate as the antenna for the NFC
communication by itself, a separate provision of an antenna for the
NFC communication of the mobile device may not be required.
Accordingly, although the cover 500 of the mobile device is formed
of the metal material, the mobile device may accurately perform the
NFC communication without the signal distortion. Further, because
the separate antenna for the NFC communication is not required, the
size of the mobile device may be reduced, and a manufacturing cost
may be reduced.
[0092] FIG. 9 is a diagram illustrating a cover of a mobile device
according to example embodiments.
[0093] Referring to FIG. 9, a cover 600 of a mobile device includes
a metal structure 610 formed of a metal material. The cover 600 may
be disposed to cover one surface of the mobile device. The metal
structure 610 of the cover 600 may include any metal material
having a desired (or alternatively, predetermined) strength and a
desired (or alternatively, predetermined) electrical conductivity.
The metal structure 610 or the cover 600 including the metal
structure 610 may operate as an antenna for a wireless
communication (e.g., an NFC communication) of the mobile
device.
[0094] To allow the cover 600 to operate as the antenna, the metal
structure 610 may include a metal plate 620, a first opening 630, a
second opening 635, terminals 650 and 660, and an insulator
690.
[0095] The metal plate 620 may include the metal material, for
example, copper (Cu), aluminum (Al), iron (Fe), titanium (Ti),
silver (Ag), palladium (Pd), platinum (Pt), aurum (Au), or nickel
(Ni). The first opening 630 may be formed at a portion of the metal
plate 620, and the second opening 635 may be formed at another
portion of the metal plate 620. In some example embodiments, the
first and second openings 630 and 635 may be formed to expose a
portion of components of the mobile device. For example, a camera
lens of the mobile device may be exposed through the first opening
630, and a camera flash may be exposed through the second opening
635. Although FIG. 9 illustrates an example where the first and
second openings 630 and 635 have rectangular shapes, in some
example embodiments, each opening 630 and 635 may have any shape,
for example, a triangular shape, a polygonal shape having five or
more sides, a circular shape, or an elliptical shape. The two
terminals 650 and 660 may be disposed on the metal plate 620 such
that the first and second openings 630 and 635 are located between
the two terminals 650 and 660. For example, one terminal 650 may be
disposed near the top right corner of the first opening 630, and
the other terminal 660 may be disposed near the bottom left corner
of the second opening 635.
[0096] In the metal structure 610, an S-shaped signal path SP may
be formed at a region outside the first opening 630, a region
between the first and second openings 630 and 635 and a region
outside the second opening 635. For example, as illustrated in FIG.
9, the signal path SP may be formed at a region of the metal plate
620 near a top side of the first opening 630, a region of the metal
plate 620 near a left side of the first opening 630, a region of
the metal plate 620 between the first and second openings 630 and
635, a region of the metal plate 620 near a right side of the
second opening 635 and a region of the metal plate 620 near a
bottom side of the second opening 635. Further, the insulator 690
may be formed to surround the signal path SP. Accordingly, the
regions of the metal plate 620 at which the signal path SP is
formed may serve as an inductor having a desired (or alternatively,
predetermined) inductance, and may operate as a resonator having a
desired (or alternatively, predetermined) resonance frequency along
with capacitors having desired (or alternatively, predetermined)
capacitances included in the metal structure 610 and/or a matching
circuit.
[0097] As described above, the cover 600 of the mobile device
according to example embodiments may serve as the inductor having
the desired (or alternatively, predetermined) inductance or the
resonator having the desired (or alternatively, predetermined)
resonance frequency, and thus may operate as the antenna for the
wireless communication (e.g., the NFC communication) of the mobile
device. For example, the cover 600 of the mobile device according
to example embodiments may operate as the antenna for the NFC
communication by itself, and thus the mobile device may not require
a separate antenna for the NFC communication. Accordingly, although
the cover 600 of the mobile device is formed of the metal material,
the mobile device may accurately perform the NFC communication
without the signal distortion. Further, because the separate
antenna for the NFC communication is not required, the size of the
mobile device may be reduced, and a manufacturing cost may be
reduced.
[0098] FIG. 10 is a diagram illustrating an example of a mobile
device according to example embodiments.
[0099] Referring to FIG. 10, a mobile device 700 may include a main
body 710 and a cover 760. The cover 760 may be any one of the
covers 100, 200, 300, 400, 500 and 600 illustrated in FIGS. 1
through 10. Although FIG. 10 illustrates a smart phone as an
example of the mobile device 700, in some example embodiments, the
mobile device 700 may be any mobile device, for example, a cellular
phone, a tablet computer, a laptop computer, a personal digital
assistant (PDA), a portable multimedia player (PMP), a digital
camera, a music player, a portable game console, or a navigation
device. Further, although FIG. 10 illustrates an example where the
cover 760 is detachably attached to a housing of the main body 710,
in some example embodiments, the cover 760 may be integrally formed
with the housing of the main body 710.
[0100] The cover 760 may be disposed to cover one surface of the
main body 710 of the mobile device 700. For example, the cover 760
may be disposed to cover a back surface of the main body 710 where
a battery receiving groove 720 is formed.
[0101] An opening 770 may be formed at the cover 760. When the
cover 760 is attached to the housing of the main body 710, a camera
module 730 may be exposed through the opening 770. For example, a
camera lens 731 and a camera flash 733 may be exposed through the
opening 770.
[0102] A slit 780 may be formed at the cover 760, and the slit 780
may extend from the opening 770. Two terminals 790 and 795 may be
formed an inner surface of the cover 760 facing the main body 710,
and the two terminals 790 and 795 may be disposed such that the
slit 780 is located between the two terminals 790 and 795. When the
cover 760 is attached to the housing of the main body 710, the two
terminals 790 and 795 may contact two pins 740 and 745 formed on
the main body 710. Accordingly, a signal path formed at the cover
760 may be electrically coupled to a matching circuit 750 and a
wireless communication chip 755 embedded in the main body 710. The
wireless communication chip 755 may perform a wireless
communication, and the matching circuit 750 may perform impedance
matching between the wireless communication chip 755 and an antenna
for the wireless communication.
[0103] The cover 760 may be implemented as a metal cover, and may
operate as the antenna for the wireless communication performed by
the wireless communication chip 755 by itself. For example, the
wireless communication chip 755 may perform the wireless
communication via the matching circuit 750 and the cover 760
without a separate antenna. In some example embodiments, the
wireless communication chip 755 may be an NFC chip that performs an
NFC communication. In other example embodiments, the wireless
communication chip 755 may perform any wireless communication, for
example, an RFID communication. In some example embodiments, the
wireless communication chip 755 may be embedded in the main body
710 of the mobile device 700. In other example embodiments, the
wireless communication chip 755 may be detachably attached to the
main body 710 of the mobile device 700.
[0104] As described above, the mobile device 700 according to
example embodiments may use the cover 760 as the antenna for the
wireless communication without a separate antenna. Accordingly,
because the separate antenna for the wireless communication is not
required, the size of the mobile device 700 may be reduced, and a
manufacturing cost may be reduced.
[0105] FIG. 11 is a circuit diagram illustrating a wireless
communication device included in a mobile device according to
example embodiments.
[0106] Referring to FIG. 11, a wireless communication device 800
included in a mobile device may include a cover 810 of the mobile
device, a matching circuit 830 and a wireless communication chip
850. In some example embodiments, the wireless communication device
800 may be an NFC device, and the wireless communication chip 850
may be an NFC chip.
[0107] The cover 810 of the mobile device may be any one of covers
100, 200, 300, 400, 500 and 600 illustrated in FIGS. 1 through 9.
The cover 810 may be implemented as a metal cover, and may operate
as an antenna for a wireless communication by itself. In some
example embodiments, the cover 810 may include a first inductor I1
having a desired (or alternatively, predetermined) inductance and a
first capacitor C1 having a desired (or alternatively,
predetermined) capacitance, and thus may operate as a resonator
having a resonance frequency suitable for the wireless
communication performed by the wireless communication chip 850. In
some example embodiments, the matching circuit 830 may not include
a second capacitor C2. In other example embodiments, the cover 810
may include the first inductor I1 having the desired (or
alternatively, predetermined) inductance, and the matching circuit
830 may include the second capacitor C2 coupled between terminals
T1 and T2 of the cover 810. In this case, the cover 810 may operate
as the resonator having the resonance frequency suitable for the
wireless communication along with the second capacitor C2 included
in the matching circuit 830. In still other example embodiments,
the cover 810 may include the first inductor I1 and the first
capacitor C1, and the matching circuit 830 may include the second
capacitor C2. In this case, the resonance frequency of the
resonator implemented by the cover 810 may be determined based on
the inductance of the first inductor I1 and a sum of the
capacitance of the first capacitor C1 and the capacitance of the
second capacitor C2.
[0108] The matching circuit 830 may be coupled to the terminals T1
and T2 of the cover 830, and may be coupled to terminals RX, TX1,
TX2, L1 and L2 of the wireless communication chip 850. The matching
circuit 830 may perform impedance matching between the wireless
communication chip 850 and the antenna for the wireless
communication, e.g., the cover 810.
[0109] In some example embodiments, the matching circuit 830 may
include a third capacitor C3, a fourth capacitor C4, a fifth
capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an
eighth capacitor C8, a second inductor 12 and a third inductor 13.
The third capacitor C3 may be coupled between a first terminal T1
of the cover 810 and a first node, the fourth capacitor C4 may be
coupled between a second terminal T2 of the cover 810 and a second
node, and the fifth capacitor C5 may be coupled between the first
node and the second node. The second inductor 12 may be coupled
between the first node and a first transmitting terminal TX1 of the
wireless communication chip 850, and the third inductor 13 may be
coupled between the second node and a second transmitting terminal
TX2 of the wireless communication chip 850. The sixth capacitor C6
may be coupled between the first terminal T1 of the cover 810 and a
receiving terminal RX of the wireless communication chip 850. The
seventh capacitor C7 may be coupled between the first terminal T1
of the cover 810 and a first power terminal L1 of the wireless
communication chip 850, and the eighth capacitor C8 may be coupled
between the second terminal T2 of the cover 810 and a second power
terminal L2 of the wireless communication chip 850. Although FIG.
11 illustrates an example of a configuration of the matching
circuit 830, the matching circuit 830 may have any configuration
for impedance matching between the cover 810 and the wireless
communication chip 850.
[0110] The wireless communication chip 850 may perform the wireless
communication, for example the NFC communication, via the matching
circuit 830 and the cover 810. The wireless communication chip 850
may be coupled to the matching circuit 830 through the first power
terminal L1, the second power terminal L2, the first transmitting
terminal TX1, the second transmitting terminal TX2 and the
receiving terminal RX. In a case where the wireless communication
chip 850 is the NFC chip, the wireless communication chip 850 may
perform a transmitting/receiving operation through the first and
second power terminals L1 and L2 in an NFC card mode. In an NFC
reader mode, the wireless communication chip 850 may perform a
transmitting operation through the first and second transmitting
terminals TX1 and TX2, and may perform a receiving operation
through the receiving terminal RX.
[0111] As described above, the wireless communication device 800
included in the mobile device according to example embodiments may
use the cover 810 as the antenna for the wireless communication
without a separate antenna. Accordingly, the size of the mobile
device may be reduced, and a manufacturing cost may be reduced.
[0112] FIG. 12 is a block diagram illustrating a mobile device
according to example embodiments.
[0113] Referring to FIG. 12, a mobile device 900 may include a
processor 910, a memory device 920, a user interface 930, a power
supply 940, and a wireless communication device 800. According to
example embodiments, the mobile device 900 may be any mobile
device, for example, a cellular phone, a smart phone, a tablet
computer, a laptop computer, a personal digital assistant (PDA), a
portable multimedia player (PMP), a digital camera, a music player,
a portable game console, or a navigation device.
[0114] The processor 910 may control an overall operation of the
mobile device 910. In some example embodiments, the processor 910
may be an application processor (AP) that executes applications,
for example, an internet browsing application, a game application,
and/or a video player application. In some example embodiments, the
processor 910 may be a single core processor. In other example
embodiments, the processor 910 may be a multi-core processor
including a plurality of processor cores. For example, the
processor 910 may be, for example, a dual-core processor, a
quad-core processor, or a hexa-core processor.
[0115] The memory device 920 may store data for an operation of the
mobile device 900. For example, the memory device 920 may store a
boot image for booting the mobile device 900, and may store data
received from an external device. For example, the memory device
920 may be implemented as a volatile memory device, for example, a
dynamic random access memory (DRAM), a static random access memory
(SRAM), a mobile DRAM, a DDR SDRAM, an LPDDR SDRAM, a GDDER SDRAM,
or an RDRAM, or may be implemented as a nonvolatile memory device,
for example, an electrically erasable programmable read-only memory
(EEPROM), a flash memory, a phase change random access memory
(PRAM), a resistance random access memory (RRAM), a nano floating
gate memory (NFGM), a polymer random access memory (PoRAM), a
magnetic random access memory (MRAM), or a ferroelectric random
access memory (FRAM).
[0116] The wireless communication device 800 may perform a wireless
communication with an external device. In some example embodiments,
the wireless communication device 800 may be an NFC device that
performs an NFC communication. The wireless communication device
800 may include a cover 810 of the mobile device 900 that is
implemented as a metal cover. The cover 810 may operate as an
antenna for the wireless communication. The wireless communication
device 800 may further include a matching circuit 830 for impedance
matching between the cover 810 and the matching circuit 830, and a
wireless communication chip 850 that performs the wireless
communication via the cover 810 and the matching circuit 830. The
wireless communication device 800 included in the mobile device 900
according to example embodiments may use the cover 810 of the
mobile device 900 as the antenna for the wireless communication
without a separate antenna for the wireless communication.
Accordingly, the size of the mobile device 900 may be reduced, and
a manufacturing cost may be reduced.
[0117] The user interface 930 may include at least one input
device, (e.g., a keyboard, a mouse, and/or a touch screen) and at
least one output device (e.g., a printer or a display device). The
power supply 940 may supply power to the mobile device 900.
[0118] In some example embodiments, the mobile device 900 may
further include an image processor, and may further include a
storage device (e.g., a memory card, a solid state drive (SSD), a
hard disk drive (HDD), or a CD-ROM).
[0119] In some example embodiments, the mobile device 900 and/or
components of the mobile device 900 may be packaged in various
forms, for example, package on package (PoP), ball grid arrays
(BGAs), chip scale packages (CSPs), plastic leaded chip carrier
(PLCC), plastic dual in-line package (PDIP), die in waffle pack,
die in wafer form, chip on board (COB), ceramic dual in-line
package (CERDIP), plastic metric quad flat pack (MQFP), thin quad
flat pack (TQFP), small outline IC (SOIC), shrink small outline
package (SSOP), thin small outline package (TSOP), system in
package (SIP), multi-chip package (MCP), wafer-level fabricated
package (WFP), or wafer-level processed stack package (WSP).
[0120] As described above, the cover 810 of the mobile device may
be used as the antenna by itself. Accordingly, the size of the
mobile device 900 may be reduced, and the manufacturing cost of the
mobile device 900 may be reduced.
[0121] Example embodiments may be applied to any mobile device, for
example, a cellular phone, a smart phone, a tablet computer, a
laptop computer, a personal digital assistant (PDA), a portable
multimedia player (PMP), a digital camera, a music player, a
portable game console, or a navigation device.
[0122] The foregoing is illustrative of example embodiments and is
not to be construed as limiting thereof. Although a few example
embodiments have been described, those skilled in the art will
readily appreciate that many modifications are possible in the
example embodiments without materially departing from the novel
teachings and advantages of example embodiments. Accordingly, all
such modifications are intended to be included within the scope of
example embodiments as defined in the claims. Therefore, it is to
be understood that the foregoing is illustrative of various example
embodiments and is not to be construed as limited to the specific
example embodiments disclosed, and that modifications to the
disclosed example embodiments, as well as other example
embodiments, are intended to be included within the scope of the
appended claims.
* * * * *