U.S. patent application number 14/320428 was filed with the patent office on 2014-12-25 for integrated connector apparatus and methods.
The applicant listed for this patent is Pulse Electronics, Inc.. Invention is credited to Aurelio J. Gutierrez, Gary L. Hurd, Russell L. Machado, William Mahlerbe, Victor H. Renteria.
Application Number | 20140377996 14/320428 |
Document ID | / |
Family ID | 39738606 |
Filed Date | 2014-12-25 |
United States Patent
Application |
20140377996 |
Kind Code |
A1 |
Renteria; Victor H. ; et
al. |
December 25, 2014 |
INTEGRATED CONNECTOR APPARATUS AND METHODS
Abstract
An electrical connector mountable on a printed circuit board. In
one embodiment, the electrical connector comprises an insulative
housing comprising one or more electronic components, a plurality
of electrical conductors in signal communication with the
electronic components and adapted to interface with a plug and a
plurality of terminals in signal communication with the one or more
electronic components. In one aspect, the plurality of terminals
are adapted to interface with one or more externally mounted
electronic components on the printed circuit board thereby
filtering signals passing between the electrical conductors and the
printed circuit board, with the externally mounted electronic
components mounted within the footprint of the electrical
connector. Methods of manufacture for the aforementioned electrical
connector and business methods are also disclosed.
Inventors: |
Renteria; Victor H.; (Poway,
CA) ; Gutierrez; Aurelio J.; (Bonita, CA) ;
Mahlerbe; William; (Temecula, CA) ; Hurd; Gary
L.; (San Diego, CA) ; Machado; Russell L.;
(San Diego, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Pulse Electronics, Inc. |
San Diego |
CA |
US |
|
|
Family ID: |
39738606 |
Appl. No.: |
14/320428 |
Filed: |
June 30, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13437856 |
Apr 2, 2012 |
8764493 |
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14320428 |
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12074112 |
Feb 28, 2008 |
8147278 |
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13437856 |
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60904488 |
Mar 1, 2007 |
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Current U.S.
Class: |
439/620.21 |
Current CPC
Class: |
H05K 1/0233 20130101;
H01R 24/64 20130101; H01R 13/719 20130101; H05K 2201/2036 20130101;
H05K 2201/10515 20130101; H05K 1/18 20130101; H01R 13/7193
20130101; H05K 2201/10537 20130101; H01R 13/6658 20130101; H01R
13/66 20130101; H05K 2201/10189 20130101; H05K 2201/1003 20130101;
H05K 2201/1006 20130101; H05K 2201/10568 20130101; H01R 12/70
20130101 |
Class at
Publication: |
439/620.21 |
International
Class: |
H01R 13/66 20060101
H01R013/66; H01R 13/7193 20060101 H01R013/7193; H01R 12/70 20060101
H01R012/70 |
Claims
1.-30. (canceled)
31. (canceled)
Description
PRIORITY
[0001] This application claims priority to U.S. Provisional Patent
Application Ser. No. 60/904,488 filed Mar. 1, 2007 of the same
title, which is incorporated herein by reference in its
entirety.
COPYRIGHT
[0002] A portion of the disclosure of this patent document contains
material that is subject to copyright protection. The copyright
owner has no objection to the facsimile reproduction by anyone of
the patent document or the patent disclosure, as it appears in the
Patent and Trademark Office patent files or records, but otherwise
reserves all copyright rights whatsoever.
1. FIELD OF THE INVENTION
[0003] The present invention relates generally to electrical or
electronic connector systems and in one exemplary aspect, to
filtered connector apparatus and systems for telecommunications
applications, and methods for manufacturing the same.
2. DESCRIPTION OF RELATED TECHNOLOGY
[0004] Modular connectors, such as for example those of the "RJ"
configuration, are well known in the electronics industry. Such
connectors are adapted to receive one or more modular plugs of
varying type (e.g., RJ-45 or RJ-11), and communicate signals
between the terminals of the modular plug and the parent device
with which the connector is associated. Commonly, some form of
signal conditioning (e.g., filtering, voltage transformation, or
the like) is performed by the connector on the signals passing
through it.
[0005] Many different considerations are involved with producing an
effective and economically viable connector design. Such
considerations include, for example: (i) volume and "footprint"
available for the connector; (ii) the need for electrical status
indicators (e.g., LEDs); (iii) the cost and complexity associated
with assembling and manufacturing the device; (iv) the ability to
accommodate various electrical components and signal conditioning
configurations; (v) the electrical and noise performance of the
device; (vi) the reliability of the device; (vii) the ability to
modify the design to accommodate complementary technologies; (viii)
compatibility with existing terminal and "pin out" standards and
applications; (ix) ability to configure the connector as one of a
plurality of ports, potentially having individually variant
internal component configurations, and (ix) potentially the
maintenance or replacement of defective components.
[0006] Electrical connectors (including modular jacks) are
increasingly used in data networking applications, such as wired or
wireless LANs, whether for computers or other electronic devices
(such as routers, gateways, hubs, switching centers, digital
set-top boxes, etc.). Increasing requirements for data connectivity
and capability are driving greater adoption of these connectors
across a broader spectrum of applications. Increased data rate
requirements, such as those mandated under so-called "gigabit
Ethernet" (GBE) standards, are also increasing the performance
demands on these connectors. As more capability and components
(such as both discrete and integrated circuitry) are disposed
within the connector, more efficient use of the available volume
within the connector, and more efficient heat dissipation, are also
required.
[0007] The foregoing factors have resulted in myriad different (and
often highly specialized) configurations for modular connectors in
the prior art. Many of these designs utilize an internal PCB or
substrate for carrying electronic or signal conditioning components
internal to the connector housing. For example, U.S. Pat. No.
5,069,641 to Sakamoto, et al. issued Dec. 3, 1991 and entitled
"Modular jack" discloses a modular jack to be mounted on a circuit
board, and the modular jack has a printed board containing a noise
suppressing electronic element in a housing. The printed board is
fitted with contactors for contacting with plugs and terminals to
be used for mounting the modular jack on the circuit board. The
contactors and the terminals are electrically connected with the
noise suppressing electronic element by wires on the printed
board.
[0008] U.S. Pat. No. 5,531,612 to Goodall, et al. issued Jul. 2,
1996 entitled "Multi-port modular jack assembly" discloses a
modular jack assembly for mounting to a printed circuit board, is
shown comprising a plurality of modular jacks assembled to a common
integral housing and disposed in back-to-back mirror image
symmetry. Shielding, is provided around the connector assembly and
shielding between the two rows is also provided for suppressing
cross-talk there between. The design is compact, providing for a
large number of ports without increasing the length of the
connector assembly, whilst also providing good access to the
resilient locking latches of complementary modular plugs received
by the jacks.
[0009] U.S. Pat. No. 5,587,884 to Raman issued Dec. 24, 1996 and
entitled "Electrical connector jack with encapsulated signal
conditioning components" discloses a modular jack electrical
connector assembly suitable for conditioning the signals in
unshielded twisted pair wires for use with network components is
disclosed. The modular jack comprises a conventional insulative
housing and an insert subassembly including insert molded front
insert member and rear insert member. Contact terminals for mating
with a modular plug extend from the front insert member and into
the rear insert member. The rear insert member also includes signal
conditioning components such as common mode choke coils, filter
circuits and transformers suitable for conditioning the twisted
pair signals for used in applications such as for input to and
output from IEEE 10 Base-T network components.
[0010] U.S. Pat. No. 5,647,767 to Scheer, et al. issued Jul. 15,
1997 and entitled "Electrical connector jack assembly for signal
transmission" discloses a modular jack electrical connector
assembly for conditioning the signals in unshielded twisted pair
wires for use with network components. The modular jack comprises a
conventional insulative housing and an insert subassembly including
an insert molded front insert member and a rear insert member.
Contact terminals for mating with a modular plug extend from the
front insert member and into the rear insert member. The rear
insert member also includes signal conditioning components such as
common mode choke coils, filter circuits and transformers suitable
for conditioning the twisted pair signals for used in applications
such as for input to and output from IEEE 10 Base-T network
components. The rear insert member includes an insert molded body
which stabilizes the position of the contact terminals and leads
extending from the rear insert member for attachment to external
circuits, such as the external printed circuit board containing the
interface processor for the specific application.
[0011] U.S. Pat. No. 5,759,067 entitled "Shielded Connector" to
Scheer exemplifies a common prior art approach. In this
configuration, one or more PCBs are disposed within the connector
housing in a vertical planar orientation such that an inner face of
the PCB is directed toward an interior of the assembly and an outer
face directed toward an exterior of the assembly.
[0012] U.S. Pat. No. 6,062,908 to Jones issued May 16, 2000
entitled "High density connector modules having integral filtering
components within repairable, replaceable submodules" discloses a
connector module for mounting on a circuit board includes a housing
and at least one plug-receiving opening for receiving an RJ-45 or
other similar jack. Each plug-receiving opening includes contact
portions that make electrical contact with individual conductors,
e.g., twisted pair conductors, connected to the RJ-45 jack. A
plurality of connection pins protrude from a bottom surface of the
housing and facilitate mounting of the modular connector onto the
circuit board. Protection/filtering circuitry, located within
vertical space inside of the housing so as to reside adjacent the
connection pins, electrically couples and minimizes the electrical
distance between the contact portions associated with each
plug-receiving opening and the plurality of connection pins. The
protection/filtering circuitry includes at least one ring-shaped
ferrite core. Light emitting diodes may also be included as an
integral part of the module, but are mounted for viewing so as to
be outside of the shielded portions of the module.
[0013] U.S. Pat. No. 6,159,050 to Belopolsky, et al. issued Dec.
12, 2000 entitled "Modular jack with filter insert" discloses a
modular jack assembly which includes an outer insulative housing
having top and bottom walls and opposed lateral walls while
defining an interior section. This housing also has front and rear
open ends. This assembly also includes an insulative insert having
a top section, an upper side and rear section having a base side
and a recess. This jack is positioned so that the upper side of its
top section is adjacent to top side of the insulative housing such
that its terminal end extends into the interior section of the
insulative housing and the rear section at least partially covers
the rear open end of the insulative housing. This assembly also
includes an electronic component mounted in the rear section of the
insulative insert. A conductor is mounted in the electrical
insert.
[0014] U.S. Pat. No. 6,171,152 to Kunz issued Jan. 9, 2001 entitled
"Standard footprint and form factor RJ-45 connector with integrated
signal conditioning for high speed networks" discloses an RJ-45
style modular connector having a plastic rectangular housing with
an open front end to receive a matching RJ-45 style modular jack,
and an opposite open back end. A contact spring assembly of a
plurality of wires in separate circuits passes forward through said
open back end into the back of said open front end of the housing.
The contact assembly also includes a plastic block that supports
the plurality of wires by a right angle turn and is vertically
oriented with respect to the plurality of wires, and the plastic
block inserts and locks into the open back end of the housing. A
set of mounting pins is disposed at a bottom edge of the plastic
block for connection to a printed motherboard. A signal
conditioning part is disposed in the plastic block for providing
signal conditioning of signals passing from said set of mounting
pins to the contact spring assembly.
[0015] U.S. Pat. No. 6,585,540 to Gutierrez, et al. issued Jul. 1,
2003 and entitled "Shielded microelectronic connector assembly and
method of manufacturing" discloses a multi-connector electronic
assembly incorporating different noise shield elements which reduce
noise interference and increase performance. In one embodiment, the
connector assembly comprises a plurality of connectors with
associated electronic components arranged in two parallel rows, one
disposed atop the other. The assembly utilizes a substrate shield
which mitigates noise transmission through the bottom surface of
the assembly, as well as an external "wrap-around shield to
mitigate noise transmission through the remaining external
surfaces. In a second embodiment, the connector assembly further
includes a top-to-bottom shield interposed between the top and
bottom rows of connectors to reduce noise transmission between the
rows of connectors, and a plurality of front-to-back shield
elements disposed between the electronic components of respective
top and bottom row connectors to limit transmission between the
electronic components.
[0016] U.S. Pat. No. 6,761,595 to Zheng, et al. issued Jul. 13,
2004 entitled "Electrical connector" discloses an electrical
connector has an insulative housing and a plurality of
subassemblies. Each subassembly has a base member, a first and
second printed circuit boards, a pair of insert portions mounted on
corresponding PCBs, and a plurality of terminals insert molded in
the insert portions. One of the insert portions has a plurality of
first positioning posts and first mounting holes, the other insert
portion has a plurality of second positioning posts and mounting
holes second stably engaging with the first mounting holes and the
first positioning posts of the former. The base member has a
plurality of magnetic coils connecting with the terminals.
[0017] U.S. Pat. No. 6,769,936 to Gutierrez, et al. issued. Aug. 3,
2004 entitled "Connector with insert assembly and method of
manufacturing" discloses a modular plug connector assembly
incorporating a substantially planar, low profile removable insert
assembly with associated substrate disposed in the rear portion of
the connector housing, the substrate adapted to optionally receive
one or more electronic components. In one embodiment, the connector
assembly comprises a single port with a single insert assembly. The
conductors and terminals of the connector are retained within
respective molded carriers which are received within the insert
assembly. A plurality of light sources (e.g., LEDs) is also
received within the housing, the conductors of the LEDs mated with
conductive traces on the substrate of the insert assembly. In
another embodiment, the connector assembly comprises a multi-port
"1.times.N" device.
[0018] U.S. Pat. No. 6,773,302 to Gutierrez, et al. issued Aug. 10,
2004 entitled "Advanced microelectronic connector assembly and
method of manufacturing" discloses a modular plug connector
assembly incorporating a substrate disposed in the rear portion of
the connector housing, the substrate adapted to receive one or more
electronic components such as choke coils, transformers, or other
signal conditioning elements or magnetics. In one embodiment, the
connector assembly comprises a single port pair with a single
substrate disposed in the rear portion of the housing. In another
embodiment, the assembly comprises a multi-port "row-and-column"
housing with multiple substrates (one per port) received within the
rear of the housing, each substrate having signal conditioning
electronics which condition the input signal received from the
corresponding modular plug before egress from the connector
assembly. In yet another embodiment, the connector assembly
comprises a plurality of light sources (e.g., LEDs) received within
the housing.
[0019] U.S. Pat. No. 6,786,772 to Liu issued Sep. 7, 2004 entitled
"Modulated connector" discloses a modulated connector includes an
input module, a transfer module and an applied terminal module. The
input module has at least one resilient leg set adapted to connect
to other electrical elements. The transfer module is connected to
the input module via a circuit board and has a substantially
U-shaped pin seat with two sets of pins to correspond to the side
holes of the circuit board. The applied terminal module is
connected to the transfer circuit board and has two side circuit
boards respectively and electrically connected to the transfer
module and a base electrically connected to the side circuit boards
and provided with multiple contacting pins extending through the
base for connection with another electrical device.
[0020] U.S. Pat. No. 6,848,943 to Machado, et al. issued Feb. 1,
2005 entitled "Shielded connector assembly and method of
manufacturing" discloses a shielded modular plug connector assembly
incorporating a removable insert assembly disposed in the connector
housing, the insert assembly adapted to optionally receive one or
more electronic components. In one exemplary embodiment, the
connector assembly comprises a single port connector with integral
shielded housing and dual-substrate insert assembly. The housing is
advantageously fanned using a metal casting process which
inherently shields the connector (and exterior environment) from
EMI and other noise while allowing for a reduced housing
profile.
[0021] U.S. Pat. No. 6,962,511 to Gutierrez, et al. Nov. 8, 2005
entitled "Advanced microelectronic connector assembly and method of
manufacturing" discloses an advanced modular plug connector
assembly incorporating a substrate disposed in the rear portion of
the connector housing, the substrate adapted to receive one or more
electronic components such as choke coils, transformers, or other
signal conditioning elements or magnetics. In one embodiment, the
connector assembly comprises a single port pair with a single
substrate disposed in the rear portion of the housing. In another
embodiment, the assembly comprises a multi-port "row-and-column"
housing with multiple substrates (one per port) received within the
rear of the housing, each substrate having signal conditioning
electronics which condition the input signal received from the
corresponding modular plug before egress from the connector
assembly. In yet another embodiment, the connector assembly
comprises an indicator assembly having a plurality of optically
transmissive conduits, the assembly being disposed largely outside
the external noise shield of the connector and removable therefrom.
Methods for manufacturing the aforementioned embodiments are also
disclosed.
[0022] U.S. Pat. No. 7,241,181 to Machado, et al. issued Jul. 10,
2007 entitled "Universal connector assembly and method of
manufacturing" discloses an advanced modular plug connector
assembly incorporating an insert assembly disposed in the rear
portion of the connector housing. In one embodiment, the connector
has a plurality of ports in multi-row configuration, and the insert
assembly includes a substrate adapted to receive one or more
electronic components such as choke coils, transformers, or other
signal conditioning elements or magnetics. The substrate also
interfaces with the conductors of two modular ports of the
connector, and is removable from the housing such that an insert
assembly of a different electronics or terminal configuration can
be substituted therefor. In this fashion, the connector can be
configured to a plurality of different standards (e.g., Gigabit
Ethernet and 10/100). In yet another embodiment, the connector
assembly comprises a plurality of light sources (e.g., LEDs)
received within the housing. Methods for manufacturing the
aforementioned embodiments are also disclosed.
[0023] Accordingly, it would be most desirable to provide an
improved electrical connector (e.g., modular jack) design that
would provide reliable and superior electrical and noise
performance, while also providing application flexibility,
including aspects desirable in low profile connector applications.
Such a connector design would also minimize costs by specifying
that some of the electrical components necessary for the electrical
connector filter circuit be carried external to the electrical
connector, yet within the electrical connector footprint to
minimize electrical connector size. The improved connector design
would also facilitate easy assembly, as well as be amenable to
integration into a multi-port connector assembly.
SUMMARY OF THE INVENTION
[0024] The present invention provides, inter alia, a low cost
connector (as compared to prior art designs) while offering novel
features that improve the manufacturability of the connector
assembly. The connector provides a means to interconnect a plug(s)
to a circuit board and, by the use of a common mode choke coil
and/or a transformer on each of the plugs signal lines, filter the
signal carried through the plug to the circuit board.
[0025] In a first aspect of the invention, an electrical connector
apparatus is disclosed. In one embodiment, the electrical connector
comprises an assembly comprising a magnetically filtered connector
for use with various RJ plugs such as the RJ-45 and RJ-11. In one
variant, the assembly moves the connector's internal PCA, its
circuitry and its components to a customer's PCA. Moreover, the
exemplary embodiment locates those components within the confines
of the connector's PCB footprint or adjacent to it. It also locates
the connector's circuitry to the customers PCA; and provides a path
for the connector's filtered signals to its circuitry on the
customers PCA.
[0026] In another embodiment, an electrical connector mountable on
a printed circuit board in a telecommunications apparatus is
disclosed. The electrical connector comprises an insulative housing
comprising one or more electronic components; a plurality of
electrical conductors in signal communication with the one or more
electronic components and adapted to interface with a plug; and a
plurality of terminals in signal communication with the one or more
electronic components. The plurality of terminals are adapted to
interface with one or more externally mounted electronic components
on the printed circuit board thereby filtering signals passing
between the plurality of electrical conductors and the printed
circuit board. The externally mounted electronic components are
mounted within the footprint of the electrical connector.
[0027] In one variant, the electrical connector further comprises
an organizer assembly comprising an insulative insert with the
plurality of electrical conductors in signal communication with the
one or more electronic components.
[0028] In yet another variant, the insulative housing comprises at
least one port cavity and at least one electronic component cavity;
wherein individual ones of the at least one port cavity are adapted
to receive the organizer assembly such that individual ones of the
at least one port cavity are inaccessible from the at least one
electronic component cavity when the organizer assembly is received
within its respective port cavity.
[0029] In yet another variant, the electrical connector comprises a
vertically mounted electrical connector comprising a connector port
and an interface surface to the printed circuit board wherein the
one or more electronic components are positioned within the
insulative housing so as to not reside between said connector port
and the interface surface.
[0030] In yet another variant, the plurality of terminals in signal
communication with the one or more electronic components are
distributed evenly throughout the insulative housing so that
individual ones of the one or more electronic components are
substantially equidistant from its respective terminal.
[0031] In yet another variant, the insulative housing is adapted to
accommodate the one or more externally mounted electronic
components substantially between the insulative housing and the
printed circuit board.
[0032] In yet another variant, the one or more externally mounted
electronic components comprise chip-like electronic components and
the one or more electronic components comprise toroidal inductive
devices.
[0033] In yet another embodiment, the connector assembly comprises
a connector housing comprising a plug receiving recess and an
electronic component receiving recess; a terminal insert, the
terminal insert comprising a plurality of terminals residing at
least partly within the plug receiving recess and the electronic
component recess; and an electronic component residing within the
electronic component receiving recess, the electronic component
comprising a plurality of leads, at least one of the plurality of
leads connected directly to one of the plurality of terminals.
[0034] In one variant, the connector housing comprises a vertically
mounted connector housing wherein the terminal insert comprises an
insulating header portion having a bottom surface; and wherein the
electronic component is disposed substantially above the bottom
surface.
[0035] In another variant, the electronic component comprises a
wound toroid the one of the plurality of terminals comprises a
notched end adapted to receive the at least one of the plurality of
leads.
[0036] In yet another variant, the electronic component receiving
recess comprises a depth, the depth permitting the electronic
component to be mass terminated to the one of the plurality of
terminals without damaging the electronic component.
[0037] In yet another embodiment, the connector assembly, comprises
a connector housing comprising a plug receiving recess defined by a
plug receiving surface and an electronic component receiving
recess; a terminal insert, the terminal insert comprising a
plurality of terminals residing at least partly within the plug
receiving recess and the electronic component recess and further
comprising an insulative portion comprising a bottom surface, the
bottom surface; and a plurality of electronic components residing
within the electronic component receiving recess, the plurality of
electronic components residing in a substantially coplanar fashion
and further residing substantially between the level of the plug
receiving surface and the level of the bottom surface.
[0038] In one variant, the plug receiving surface and the bottom
surface are substantially parallel in orientation with respect to
one another.
[0039] In another variant, the plug receiving recess is adapted to
receive the terminal insert such that the plug receiving recess is
inaccessible from the electronic component receiving recess when
the terminal insert is received within the connector housing.
[0040] In yet another variant, the connector housing comprises a
vertical mounted connector housing that comprises a substantially
L-shape.
[0041] In yet another variant, the terminal insert comprises one or
more locking features, the one or more locking features adapted to
interface with one or more receiving elements on the connector
housing.
[0042] In yet another variant, the terminal insert is shaped so as
to separate the plug receiving recess from the electronic component
receiving recess when the one or more locking features is engaged
with the one or more receiving elements.
[0043] In a second aspect of the invention, a low-profile connector
assembly is disclosed. The low profile connector assembly comprises
a vertical mounted connector housing comprising a connector port
and an interface surface, the vertical mounted connector housing
comprising a plurality of terminals extending below the interface
surface; a plurality of electronic components in signal
communication with at least a portion of the plurality of
terminals; wherein the plurality of electronic components are
disposed within the vertical mounted connector housing such that
they do not reside between the connector port and the interface
surface.
[0044] In one variant, the connector assembly further comprises an
organizer assembly comprising an insulative insert; and a plurality
of electrical conductors in signal communication with the one or
more electronic components.
[0045] In another variant, the connector assembly further comprises
an electronic component cavity, wherein the connector port is
adapted to receive the organizer assembly such that the connector
port is inaccessible from the electronic component cavity when the
organizer assembly is received within the connector port.
[0046] In yet another variant, the plurality of terminals in signal
communication with the plurality of electronic components are
distributed evenly throughout the connector housing so that
individual ones of the plurality of electronic components are
substantially equidistant from its respective terminal.
[0047] In yet another variant, the connector housing comprises an
external electronic component cavity adapted to accommodate one or
more externally mounted electronic components substantially between
the connector housing and an external printed circuit board.
[0048] In yet another variant, the one or more externally mounted
electronic components comprise chip-like electronic components and
the plurality of electronic components comprises toroidal inductive
devices.
[0049] In yet another variant, the vertical mounted connector
housing comprises a substantially L-shape.
[0050] In yet another variant, the insulative insert comprises one
or more locking features, the one or more locking features adapted
to interface with one or more receiving elements on the vertical
mounted connector housing.
[0051] In yet another variant, the insulative insert is shaped so
as to separate the connector port from an electronic component
cavity when the one or more locking features is engaged with the
one or more receiving elements.
[0052] In yet another variant, the vertical mounted connector
housing comprises an electronic component cavity adapted to house
the plurality of electronic components and the plurality of
electrical conductors in signal communication with the one or more
electronic components each comprise a termination end; wherein the
electronic component cavity is deep enough to permit the mass
termination of the termination end of the electrical conductors
without damaging the plurality of electronic components housed
within the electronic component cavity.
[0053] In a third aspect of the invention, a connector assembly for
use with discrete electronic components located on an external
printed circuit board is disclosed.
[0054] In a fourth aspect, a substrate-less modular connector or
jack is disclosed.
[0055] In a fifth aspect of the invention, a connector useful for
Voice-over-IP (VoIP) applications is disclosed.
[0056] In a sixth aspect of the invention, a method of
manufacturing the aforementioned connector apparatus is disclosed.
In one embodiment, the method comprises forming a connector
housing; winding one or more coil assemblies; inserting the one or
more coil assemblies into the connector housing; and specifying one
or more electronic components to be mounted on the circuit board
underneath the connector housing.
[0057] In one variant, the one or more electronic components
comprise chip-like electronic components.
[0058] In another variant, the method further comprises forming an
organizer assembly; and inserting the organizer assembly into the
connector housing.
[0059] In a seventh aspect of the invention, a method of doing
business is disclosed. In one embodiment, the method comprises
designing a filtered connector, assembling a portion of the design
components in a connector and specifying the remaining design
components to be utilized on the printed circuit board external to
the filtered connector.
BRIEF DESCRIPTION OF THE DRAWINGS
[0060] The features, objectives, and advantages of the invention
will become more apparent from the detailed description set forth
below when taken in conjunction with the drawings, wherein:
[0061] FIG. 1 illustrates a perspective view of a modular jack
connector assembly manufactured in accordance with the principles
of the present invention.
[0062] FIG. 1A is a perspective view of the underside of the
modular jack connector assembly of FIG. 1.
[0063] FIG. 1B is a bottom plan view of the modular jack connector
assembly of FIGS. 1-1A.
[0064] FIG. 1C is a cross sectional view of the modular jack
connector assembly of FIGS. 1-1B taken along line A-A.
[0065] FIG. 2 is a perspective view of the organizer utilized in
the modular jack connector assembly of FIGS. 1-1C.
[0066] FIG. 2A is a top plan view of the organizer shown in FIG.
2.
[0067] FIG. 3 is a cross sectional view of a second embodiment of a
modular jack connector assembly.
[0068] FIG. 4 is a cross sectional view of a third embodiment of a
modular jack connector assembly.
[0069] FIG. 5 is a cross sectional view of a fourth embodiment of a
modular jack connector assembly.
[0070] FIG. 6 is a cross sectional view of a fifth embodiment of a
modular jack connector assembly.
[0071] FIG. 7 illustrates a logical flow diagram for a first
exemplary method of manufacturing a modular jack connector assembly
in accordance with the principles of the present invention.
[0072] FIG. 8 is a perspective view of the underside of the modular
jack connector assembly of FIG. 1 illustrating the use of a strain
relief bar for wire termination.
[0073] All Figures disclosed herein are .COPYRGT. Copyright 2007
Pulse Engineering, Inc. All rights reserved.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0074] Reference is now made to the drawings wherein like numerals
refer to like parts throughout.
[0075] As used herein, the terms "electrical component" and
"electronic component" are used interchangeably and refer to
components adapted to provide some electrical and/or signal
conditioning function, including without limitation inductive
reactors ("choke coils"), transformers, filters, transistors,
gapped core toroids, inductors (coupled or otherwise), capacitors,
resistors, operational amplifiers, and diodes, whether discrete
components or integrated circuits, whether alone or in
combination.
[0076] As used herein, the term "integrated circuit (IC)" refers to
without limitation any type of device, whether single or multiple
die, having any level of integration (including without limitation
ULSI, VLSI, and LSI) and irrespective of process or base materials
(including, without limitation Si, SiGe, CMOS and GaAs). ICs may
include, for example, memory devices (e.g., DRAM, SRAM, DDRAM,
EEPROM/Flash, and ROM), digital processors, SoC devices, FPGAs,
ASICs, ADCs, DACs, transceivers, memory controllers, and other
devices, as well as any combinations thereof.
[0077] As used herein, the term "memory" includes any type of
integrated circuit or other storage device adapted for storing
digital data including, without limitation, ROM. PROM, EEPROM,
DRAM, SDRAM, DDR/2 SDRAM, EDO/FPMS, RLDRAM, SRAM, "flash" memory
(e.g., NAND/NOR), and PSRAM.
[0078] As used herein, the terms "microprocessor" and "digital
processor" are meant generally to include all types of digital
processing devices including, without limitation, digital signal
processors (DSPs), reduced instruction set computers (RISC),
general-purpose (CISC) processors, microprocessors, gate arrays
(e.g., FPGAs), PLDs, reconfigurable compute fabrics (RCFs), array
processors, secure microprocessors, and application-specific
integrated circuits (ASICs). Such digital processors may be
contained on a single unitary IC die, or distributed across
multiple components.
[0079] As used herein, the term "signal conditioning" or
"conditioning" shall be understood to include, but not be limited
to, signal voltage transformation, filtering and noise mitigation,
signal splitting, impedance control and correction, current
limiting, capacitance control, and time delay.
[0080] While the present invention is discussed largely in the
context of telecommunications applications requiring low-profile
connector profiles, the invention is not so limited. In fact, the
present invention may be utilized or combined with other types of
technologies and capabilities such as e.g., using one or more
integrated circuits within or in conjunction with the connector
assembly.
Mechanical Embodiments
[0081] Prior art magnetically filtered connectors typically utilize
an internal printed circuit board ("PCB") or other substrate to
carry the input signals through internal circuitry connecting
numerous internal transformer coils and chokes to various internal
electrical components for filtering applications and then to pins
located in specific locations relative to the customers printed
circuit assembly ("PCA"). While prior art designs typically focused
on customer manufacturing convenience (by internalizing all the
filter circuitry within the connector itself), cost is becoming an
ever important factor in the design of these integrated component
connectors. In order to reduce the total "on-the-board" cost of a
filtered connector, while still providing manufacturing convenience
to a customer, it would be prudent for the connector manufacturer
to locate any functional parameters of the connector design at the
least expensive point in the overall process of manufacturing the
customer's completed circuit board assembly.
[0082] The inventor herein has realized that by transferring some
of those functional filtered-connector design elements, which are
currently provided at a greater expense by the filtered connector
manufacture, to the customer's PCA it will reduce the overall total
cost to the customer while minimizing customer inconvenience. This
is largely because some of the functionality associated with the
connector's filtering circuitry can be incorporated into the
customer's PCA at little or no added cost to the customer. This is
especially desirable in applications where the customer generally
has a much higher utilization of similar electrical components
(e.g. chip capacitors, resistors, etc.) utilized in the
filtered-connector design elements and therefore can purchase them
at a lower cost than a connector manufacturer due to economies of
scale. Further, the customer can further save costs because the
addition of overhead costs associated with these electronic
components being passed along to the customer can now be avoided.
By moving these connector design elements from the connector to the
customers PCB the connector manufacturer can save costs and pass
those savings on to the end consumer of the customer's PCA. This
cost saving from the price of the connector will be greater than
the very minor cost increase born by the customer to provide the
additional connector functions on their PCB, thus reducing the
total cost of providing a filtered connector solution to the
customer. The bottom line is that all parties (i.e. connector
manufacturer, PCA manufacturer and end customer) save money
utilizing such a business model.
[0083] Another cost saving move results from the minimization of
the number of components utilized in the connector assembly. Prior
art filtered connector assemblies typically include at least a
housing, a header assembly to house the electronic components, and
a so-called FCC insert. The inventor herein has obviated the need
for these three components by combining the housing and the header
assembly into a single component. This is exemplified in the
L-shaped housing 104 seen in FIG. 1.
[0084] Referring now to FIG. 1, a first exemplary embodiment of a
magnetically filtered modular jack connector assembly 100 is shown
and described in detail. The connector assembly 100 comprises a
vertically mounted assembly comprising a generally L-shaped housing
104. In the embodiment shown, the connector assembly is a two (2)
port 102 assembly suitable for low profile applications. The
L-shaped housing 104 contributes to the low profile nature of the
assembly 100 which is useful in certain telecommunications
applications where height is at a premium. For instance, in one
embodiment, the connector assembly 100 comprises VoIP magnetic
circuitry (see FIG. 1A). The connector assembly is shaped so as to
accommodate interface circuitry for the VoIP circuitry present on
an external circuit board (not shown). The external circuit board
housing (not shown) necessitates the connector assembly be low in
profile so as to fit with the external PCA housing.
[0085] As previously alluded to the connector assembly 100 in the
present embodiment comprises two (2) ports 102, although it is
appreciated that more or less ports could be added if desired.
Further, while shown as two (2) ports 102 in a single row (i.e. a
1.times.2 connector), the symmetrical nature of the design can be
readily adapted for 2.times.N or N.times.N applications. Each of
the ports 102 is preferably of the registered jack (RJ) style due
to their widespread usage in the telecommunications industry. The
embodiment shown possesses eight (8) conductors and is of the RJ-45
type; however any number of RJ style ports could be utilized (i.e.
RJ-11, RJ-14, etc.) in its place. Further, it is envisioned that
the connector assembly 100 may in certain embodiments possess mixed
port architecture such as where a first port comprises an RJ-45
port, while a second port comprises an RJ-11 port. In yet another
embodiment, it may be desirable to have a first port that comprises
an RJ-45 port, while a second port comprises a USB port. Further,
it is envisioned that in some embodiments it may be desirable to
incorporate ports 102 which implement a "keep-out" feature such as
that disclosed in co-owned and co-pending U.S. Provisional Patent
Application No. 60/904,464 filed Mar. 1, 2007 and entitled
"Connector Keep-Out Apparatus and Methods", the contents of which
are incorporated herein by reference in its entirety. This keep-out
feature may be especially desirable in mixed port applications.
[0086] The modular jack connector assembly 100 comprises two top
surfaces 108 and 110, as well as a plurality of terminal pins 112
which interface with an external circuit board and/or PCA (not
shown). In addition, the modular jack connector assembly 100
comprises a plurality of standoffs 114 which are useful for, inter
alia, providing a wash area below the assembly as is well
understood in the electronics arts. Referring now to FIG. 1A, the
underside of the modular jack connector assembly 100 is shown in
detail. As can be seen, the modular jack connector housing 104
comprises a unitary body having a plurality of terminal pins 112.
Within the unitary body resides an electronic component recess 122
adapted to retain a plurality of magnetic components 120, 130.
Preferably the magnetic components 120, 130 comprise toroidal
magnetics of the type well understood in the electronic arts. In
the embodiment shown, the magnetic components comprise four (4)
toroidal transformers 120 per port, as well as four (4) toroidal
choke coils 130 per port for a total of sixteen (16) toroids in the
embodiment shown. The embodiment shown is desirable in VoIP
applications. In an alternative embodiment, the magnetic components
may be adapted for a PoE or PoE+ ("PoE plus") application.
[0087] While the toroidal coils 120, 130 are conventional in
design; alternative embodiments may envision non-conventional
toroidal coils. For example, the improved toroidal device disclosed
in Assignee's co-owned U.S. Pat. No. 6,642,827 entitled "Advanced
Electronic Microminiature Coil and Method of Manufacturing" filed
Sep. 13, 2000, which is incorporated herein by reference in its
entirety, may be used in conjunction with the invention disclosed
herein.
[0088] Terminal pins 112a are not terminated to any of the magnetic
components 120, 130 and are simply utilized for symmetry and for
improving the mechanical connection of the assembly 100 to the
external circuit board once soldered. Middle terminal pins 112b are
utilized to spread the distribution of the terminal pins 112 more
evenly throughout the magnetic components. Symmetrically balancing
the placement of the magnetic components 120, 130 are desirable to
ensure uniformity in electrical performance (e.g. impedance
matching, etc.). In the embodiment shown, these terminal pins 112b
are utilized for termination to the center taps located on the
transformer toroids 120. Terminal pins 112c are located adjacent
the edge of the connector assembly 100 and are each located
proximate an optional lead in channel 116. These remaining terminal
pins 112c are utilized as signal pins (here twenty (20)) and for
eight (8) center tap connections to the choke coils 130. The
terminal pins 112 are preferably post inserted into the connector
assembly housing 104 although the utilization of insert molding may
be preferable in certain embodiments. It should also be noted that
terminal pins 112a, 112b, 112c and terminal ends 210 are preferably
co-planar so as to facilitate mass termination of these conductive
features in well known mass termination processes such as wave
soldering and the like.
[0089] Adjacent the electronic component recess 122 of the
connector assembly 100 comprise a plurality of organizer recesses
180. These organizer recesses 180 are adapted to accommodate the
organizer assemblies 200 discussed more fully herein below with
respect to FIGS. 2-2A. Of particular significance is the
utilization of the entire space of the recess 180 when the
organizer assembly 200 is inserted. As a result there is no gap
that allows access from the electronic component recess 122 to the
modular jack connector ports 102 once the organizer assembly 200 is
fully inserted. This is significant in that the electronic
components 120, 130 will typically be potted with a silicone based
material. This is necessary in order to mechanically secure the
components 120, 130 as well help provide electrical isolation
between electrical potentials present within the component recess
122 and external or internal electronic components or signal or
ground planes present on the external circuit board. By providing
no gap, this potting compound can not enter into the modular jack
connector ports 102, where it can become lodged between the
conductor terminals 106 and the comb-like structure of the housing
104 within the connector ports 102, etc.
[0090] Referring now to FIG. 1B, the lack of a gap between the
organizer recess 180 and the organizer assembly 200 is more readily
apparent. In addition, as can perhaps best be seen in FIG. 1B, the
terminal pins 112c are distributed along the edge of the connector
assembly 100 in two distinct rows. This offset increases the
distance between adjacent terminal pins 112c, permitting the wires
wrapped around these terminal pins 112c to more easily be
installed, as well as prevent solder bridging during mass
termination as will be discussed more fully herein below. As can
also be seen in FIG. 1B, the relative sizing of the channels 116
will accordingly vary based on the relative positioning of its
respective terminal pin 112c.
[0091] Referring now to FIG. 1C, a cross sectional view taken
across line A-A of FIG. 1B is shown and described in detail. In
particular, the interface between the organizer assembly 200 and
the connector assembly housing 104 can be seen in more detail. As
can be seen, the interface 140 comprises a plurality of snap
features which mechanically interlock the organizer assembly 200
into the connector assembly housing 104. Note again that the
connector port 102 is physically separated from the component
recess 122 with the organizer assembly 200 installed. Another
feature of the present embodiment is best illustrated in FIG. 1C.
This feature relates to the low profile nature of the connector
assembly 100. Specifically, because no electronic components are
interspersed between the connector port 102 and the external
circuit board (not shown), the height of the vertically mounted
connector assembly 100 is minimized. In fact, the only space
necessary below the connector port is a small recess 124 to
accommodate the wire wrap terminal ends 210 of the organizer
assembly 200. As can also be seen, the electronic component recess
122 need not be uniform in depth; in fact, it may be made deeper to
accommodate larger coils 120 as illustrated in FIG. 1C.
[0092] It should also be noted that the connector assembly 100 may,
in certain embodiments, benefit by the addition of an internally
mounted printed circuit board. This is particularly useful in cases
where it benefits the PCA manufacturer to include electronic
components on a circuit board internal to the connector assembly
100. It is further recognized that an external EMI shield could
also be placed over the connector housing 104 in certain instances
to improve the EMI performance of the connector assembly.
[0093] It is also appreciated that in certain embodiments that it
may be desirable to include LEDs to the connector port 102 in order
to provide signaling of the connector assembly operation of the
type well understood in the electronic connector arts. These and
other embodiments would be readily implemented by one of ordinary
skill given the present disclosure.
[0094] Referring now to FIG. 2, the organizer assembly 200 of the
connector assembly 100 is shown and described in detail. The
organizer assembly 200 comprises an organizer insert 202 and a
plurality of conductors 106. The organizer insert 202 comprises a
plurality of retention features 240 that act as cantilever snaps
when inserted into the connector assembly housing 104. It is
recognized however that these retention features 240 may be
obviated in lieu of other retention methods such as through use of
epoxies, heat staking and the like. Each of the plurality of
conductors 106 comprises a termination end 210 having a notched
cutout 250. The notched cutout 250 is utilized for the wire
wrapping of the magnetic component terminations. The organizer
insert 202 also preferably comprises a high temperature polymeric
material such as nylon. This allows the termination ends 210 to be
mass terminated by immersion soldering as will be discussed more
fully herein below.
[0095] Referring now to FIG. 2A, another feature of the conductors
106 becomes more readily apparent. As can be seen, the pitch "B" at
the termination end 210 is larger in size than the pitch "A" at the
opposing end. This is because the pitch dimension "A" is typically
specified in a standard and has a dimension that is typically not
desirable for mass termination. Therefore, the pitch "B" at the
termination end is expanded in order to increase the distance
between conductors 106. This facilitates the mass termination of
magnet wire, etc. to the conductors 106.
[0096] It should also be noted that in certain embodiments a gap
between the portions of the FCC conductors that exit the organizer
assembly towards the plug recess and the housing wall to which that
portion of the leads are parallel is desirable. This gap provides
additional deflection length from the top surface of the connector
to the organizer for the leads to move toward when a plug is
inserted. This additional deflection increases the length of the
entire deflection beam of the FCC lead and reduces the stress on
the FCC bend (which can be as high as 150 degrees) where the
bending stress is normally concentrated.
[0097] Referring now to FIG. 3, a salient advantage of the present
connector assembly 100 is now readily apparent. In prior art
filtered connectors, a printed circuit board would often be
implemented within a connector assembly to incorporate the required
discrete electronic components necessary for the operation of the
circuit. In the present invention however, this connector printed
circuit board, which includes associated electronic component
circuitry, is removed from the connector assembly 100 in some
embodiments. The connector housing 104 optionally comprises
standoffs 150 adapted to interface with the customer's mother board
300. These standoffs 150 provide a predetermined distance between
the bottom of the connector 100 and the customer's mother board
300. The resulting cavity space will accommodate the connector
specified components 302 now being mounted on the customer's PCB
300 when the connector 100 is mounted over these components 302.
This is accomplished by giving the customer an electronic component
circuit board layout for the connector's filtering circuitry. The
connector assembly 100 includes interface circuitry (e.g. the
interfacing pins 112) adapted to be placed in electrical
communication with the circuitry now present on the customers board
300. The pertinent specifications, including PCB layout location
requirements for the electrical components and the PCB footprint of
the connector are provided to the customer. The customer adds the
filtering circuitry to his own circuitry during the mother board's
layout design phase adds the filtering electrical components to
their own board purchased parts and builds the board. The connector
assembly 100 is then mounted to the customers PCB 300 exactly where
it would have been without this cost saving device. It should also
be recognized that since the connector assembly 100 of the present
invention is mounted to the customers PCB 300 on top of the
customer mounted electrical components 302; the connector assembly
100 doesn't require any additional board space over prior art
designs.
[0098] Referring now to FIG. 4, yet another embodiment of a
connector assembly 100 in accordance with the principles of the
present invention is shown and described in detail. In the
embodiment shown, the standoffs (FIG. 3, 150) are obviated in order
to make the connector assembly 100 as low in profile as possible.
Again the internal magnetic components 120, 130 are shifted out
from underneath the connector port 102. The external electronic
components 302 on the customer printed circuit board 300 are
shifted to the far side of the customer's board 300. Accordingly
space is not needed under the connector assembly 100 to accommodate
these components 302. Another advantage is that improved electrical
isolation is provided between the magnetic components 120, 130 and
the external electronic components 302 via the interposed printed
circuit board 300. This permits, in certain embodiments, a lower
profile connector because spacing between components 120, 130 and
302 need not be considered due to the placement of the electronic
components 302.
[0099] Referring now to FIG. 5, yet another embodiment of a
connector assembly 500 in accordance with the principles of the
present invention is shown and described in detail. In the
embodiment shown, a vertically mounted connector assembly 500 which
must minimize its footprint (at the expense of height) is shown and
described in detail. Here, the magnetic components 520 are mounted
on the underside of the organizer assembly 200. The magnetic
components are mounted to the termination ends 210 of the organizer
assembly 200 and the signal pins 512 as discussed previously. The
magnetic components 520 are also received within a cavity 524 which
also has plenty of room to accommodate externally mounted
electronic components (not shown). The organizer assembly 200 seals
off the component cavity 524 from the connector port 102 via snap
features 540 between the organizer assembly 200 and the connector
assembly housing 502. This allows the cavity 524 to be potted with
any number of compounds well understood in the art (such as
silicone) without permitting the potting compound to foul up the
internal workings of the connector port 102.
[0100] Referring now to FIG. 6, yet another embodiment of a
connector assembly 600 is shown and described in detail. As
illustrated in FIG. 1, the previous embodiments discussed comprise
a "tab out" configuration. In other words, the tab of the inserted
modular plug faces away from internals of the modular jack
connector assembly 100. However, this configuration has some
potential drawbacks. As can be seen in FIG. 6, a "tab in"
configuration is shown for the connector assembly 600. That is, the
tab of the inserted modular plug (not shown) will face inward
towards the center of the connector assembly 600. What this
ultimately means is that the termination ends 210 of the organizer
assembly 200 are now positioned towards the edge of the connector
assembly 600. Because of this, electronic components 620 can be
positioned underneath the connector port 102 resulting in a reduced
width dimension "W". This of course can be at the expense of the
overall height of the connector assembly. Similar to the embodiment
discussed in FIG. 1, the connector assembly 600 illustrated in FIG.
6 possesses a plurality of terminal pins 612, electronic and/or
magnetic components 610, 620 all resident within a component cavity
624.
[0101] It will be appreciated that the features of the present
inventions can be implemented in conjunction with or in the context
of any number of different connector, modular, jack, or other
paradigms, including without limitation those described in U.S.
Pat. No. 6,773,302 entitled "Advanced microelectronic connector
assembly and method of manufacturing", U.S. Pat. No. 6,773,298
entitled "Connector assembly with light source sub-assemblies and
method of manufacturing", U.S. Pat. No. 6,769,936 entitled
"Connector with insert assembly and method of manufacturing", U.S.
Pat. No. 6,585,540 entitled "Shielded microelectronic connector
assembly and method of manufacturing", U.S. Pat. No. 6,471,551
entitled "Connector assembly with side-by-side terminal arrays",
U.S. Pat. No. 6,409,548 entitled "Microelectronic connector with
open-cavity insert", U.S. Pat. No. 6,325,664 entitled "Shielded
microelectronic connector with indicators and method of
manufacturing", U.S. Pat. No. 6,224,425 entitled "Simplified
microelectronic connector and method of manufacturing", U.S. Pat.
No. 6,193,560 entitled "Connector assembly with side-by-side
terminal arrays", U.S. Pat. No. 6,176,741 entitled "Modular
Microelectronic connector and method for manufacturing same", U.S.
Pat. No. 6,159,050 entitled "Modular jack with filter insert", U.S.
Pat. No. 6,116,963 entitled "Two-piece microelectronic connector
and method", U.S. Pat. No. 6,062,908 entitled "High density
connector modules having integral filtering components within
repairable, replaceable sub-modules", U.S. Pat. No. 5,587,884
entitled "Electrical connector jack with encapsulated signal
conditioning components", U.S. Pat. No. 5,736,910 entitled "Modular
jack connector with a flexible laminate capacitor mounted on a
circuit board", U.S. Pat. No. 5,971,805 entitled "Modular jack with
filter insert", and U.S. Pat. No. 5,069,641 entitled "Modular
jack", each of the foregoing patents incorporated herein by
reference in its entirety.
[0102] Moreover, the methods and apparatus described in co-pending
and co-owned U.S. patent application Ser. No. 11/170,583 filed Jun.
28, 2005 entitled "Universal Connector Assembly and Method of
Manufacturing", U.S. patent application Ser. No. 11/387,226 filed
Mar. 22, 2006 entitled "Power-Enabled Connector Assembly and Method
of Manufacturing", U.S. patent application Ser. No. 11/436,283
filed May 17, 2006 entitled "Bias Current Compensation Apparatus
and Method", U.S. patent application Ser. No. 11/399,002 filed Apr.
5, 2006 entitled "Modular Electronic Header Assembly and Methods of
Manufacture", U.S. provisional patent application Ser. No.
60/849,432 filed Oct. 2, 2006 entitled "Shield and Antenna
Connector Apparatus and Methods", U.S. provisional patent
application Ser. No. 60/859,120 Nov. 14, 2006 entitled "Wire-Less
Inductive Devices and Methods", and U.S. provisional patent
application Ser. No. 60/898,677 filed Jan. 30, 2007 entitled
"Low-Profile Connector Assembly and Methods", each of the foregoing
being incorporated herein by reference in its entirety, may be used
consistent with the aspects of the present invention.
Business Methods
[0103] As previously discussed, prior art magnetically filtered
connectors typically utilize an internal printed circuit board
("PCB") or other substrate to carry the input signals through
internal circuitry connecting numerous internal transformer coils
and chokes to various internal electrical components for filtering
applications and then to pins located in specific locations
relative to the customers printed circuit assembly ("PCA").
[0104] The inventor herein has realized that by transferring some
of those functional filtered-connector design elements, which are
currently provided at a greater expense by the filtered connector
manufacture to the customer's PCA, it will reduce the overall total
cost to the customer while minimizing customer inconvenience. This
is largely because some of the functionality associated with the
connector's filtering circuitry can be incorporated into the
customer's PCA at little or no added cost to the customer. This is
especially desirable in applications where the customer generally
has a much higher utilization of similar electrical components
(e.g. chip capacitors, resistors, etc.) utilized in the
filtered-connector design elements and therefore can purchase them
at a lower cost than a connector manufacturer due to economies of
scale.
[0105] Further, the customer can further save costs because the
addition of overhead costs associated with these electronic
components being passed along to the customer can now be avoided.
By moving these connector design elements from the connector to the
customer's circuit board, the connector manufacturer can save costs
and pass those savings on to the end consumer of the customer's
PCA. Accordingly, a business method is proposed in which the
manufacturer of the filtered connector specifies the routing and
placement of electronic components on the customer's PCA in order
to permit the filtered connector to function properly. The customer
will then populate the PCA with these components and then mount the
filtered connector on their PCA thereby completing the functional
design of the filtered connector assembly.
Methods of Manufacture
[0106] Referring now to FIG. 7, an exemplary method 700 for
manufacturing a modular jack connector assembly is illustrated. At
step 702, the modular jack connector assembly housing is formed,
Preferably the housing is formed using well known injection molding
methods of the type well known in the art. At step 704, the
organizer assembly is formed, preferably using similar processes as
that utilized in step 702. However, the organizer assembly also
includes conductive leads which are stamped from sheet base
material, plated and formed into a predefined shape. The conductive
leads are then insert molded (i.e. a polymeric material is molded
around the conductive leads) at step 704. At step 706, the terminal
pins are post inserted into the connector housing formed at step
702. The terminal pins are preferably made from wire stock and
inserted into respective holes located in the connector housing.
While a post insertion method is presently contemplated, it is
appreciated that other methods could be utilized (such as the
aforementioned insert molding discussed at step 704).
[0107] At step 708, the coil subassemblies utilized in the
connector housing are manufactured. In one embodiment this is
accomplished by taking formed ferromagnetic toroids and winding
magnet wire about the toroidal core. This can be accomplished using
manual processes or via automated processes such as that disclosed
in co-owned U.S. Pat. No. 3,985,310 filed Oct. 7, 1974 and entitled
"Method for winding ring-shaped articles", the contents of which
are incorporated herein by reference in its entirety. At step 710,
the coil subassemblies are inserted into the connector housing and
the termination ends of the coil subassemblies are wrapped about
the terminal pins of the connector housing and the notched ends of
the organizer assembly conductors. Referring back to FIG. 1C, it is
readily apparent that the magnetic component 120 adjacent to the
termination end 210 of the organizer assembly 200 is disposed above
the organizer insert 202. This pulls the wires from the magnetic
component 120 terminated at the termination end 210 away from the
mass terminated surface of the connector assembly 100. This allows
for the mass termination of the connector assembly 100 without fear
of damaging the magnetic component 120; or without fear of
excessive burn back on the terminated wires at, inters alia,
termination end 210. In addition, subjecting the leads to the high
temperature of the eutectic solder may result in the embrittlement
of the leads which can in turn cause high rates of failure during
the lifecycle of the product.
[0108] In one embodiment, the connector housing utilizes a strain
relief bar 800 (see FIG. 8) which is removed after the wires are
terminated to the terminal pins 112c. The strain relief bar 800
forces the assembler to route the wires of the coil assembly over
the strain relief bar to terminal pins 112c. Once, the strain
relief bar 800 is removed, a sufficient amount of slack is left in
the wires to prevent breakage due to excessive tension in the
wires.
[0109] At step 712, the organizer assembly is inserted into the
connector assembly and is locked into place via the mechanical
snaps. At step 714, the wire wrapped conductors and terminals are
terminated with a eutectic solder. Preferably this is performed
using a mass termination technique such as wave soldering of the
type well understood in the electronic manufacturing arts. The coil
subassemblies are potted to protect the coil subassembly wires and
increase the resistance to high voltage potential arcing. As
previously discussed, the potting is preferably performed after
insertion of the organizer assembly to prevent fouling of the
conductor leads in the modular jack port(s).
[0110] It will be recognized that while certain aspects of the
invention are described in teams of a specific sequence of steps of
a method, these descriptions are only illustrative of the broader
methods of the invention, and may be modified as required by the
particular application. Certain steps may be rendered unnecessary
or optional under certain circumstances. Additionally, certain
steps or functionality may be added to the disclosed embodiments,
or the order of performance of two or more steps permuted. All such
variations are considered to be encompassed within the invention
disclosed and claimed herein.
[0111] While the above detailed description has shown, described,
and pointed out novel features of the invention as applied to
various embodiments, it will be understood that various omissions,
substitutions, and changes in the form and details of the device or
process illustrated may be made by those skilled in the art without
departing from the invention. The foregoing description is of the
best mode presently contemplated of carrying out the invention.
This description is in no way meant to be limiting, but rather
should be taken as illustrative of the general principles of the
invention. The scope of the invention should be determined with
reference to the claims.
* * * * *