U.S. patent application number 13/952622 was filed with the patent office on 2014-12-18 for heat-dissipation sheet assembly manufactured by using electrochemical method.
This patent application is currently assigned to A-TECH SOLUTION CO., LTD. The applicant listed for this patent is A-TECH SOLUTION CO., LTD. Invention is credited to Jong Seop Kim, Ki Sung Lee.
Application Number | 20140370222 13/952622 |
Document ID | / |
Family ID | 49035302 |
Filed Date | 2014-12-18 |
United States Patent
Application |
20140370222 |
Kind Code |
A1 |
Kim; Jong Seop ; et
al. |
December 18, 2014 |
HEAT-DISSIPATION SHEET ASSEMBLY MANUFACTURED BY USING
ELECTROCHEMICAL METHOD
Abstract
There is provided a heat-dissipation sheet assembly comprising a
heat-dissipation sheet layer having good heat conductivity and a
protection layer(s) electrodeposited on one or both sides of the
heat-dissipation sheet layer. When the heat-dissipation sheet layer
is immersed in an aqueous solution for electrodeposition added with
a material for electrodeposition and electric current is permitted
to flow in the aqueous solution, the protection layer(s) is
electrodeposited on the one or both sides of the heat-dissipation
sheet layer. The heat-dissipation sheet assembly can be attached to
a heat-generating unit by applying an adhesion layer to an
underside of the heat-dissipation sheet assembly.
Inventors: |
Kim; Jong Seop; (Yongin-si,
KR) ; Lee; Ki Sung; (Seoul, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
A-TECH SOLUTION CO., LTD |
Hwaseong-si |
|
KR |
|
|
Assignee: |
A-TECH SOLUTION CO., LTD
Hwaseong-si
KR
|
Family ID: |
49035302 |
Appl. No.: |
13/952622 |
Filed: |
July 28, 2013 |
Current U.S.
Class: |
428/40.9 ;
205/50; 428/41.1; 428/652; 428/671 |
Current CPC
Class: |
Y10T 428/1443 20150115;
F28F 21/089 20130101; H01L 2924/0002 20130101; F28F 21/081
20130101; Y10T 428/1438 20150115; F28F 3/00 20130101; H01L
2924/0002 20130101; Y10T 428/12882 20150115; H01L 23/3736 20130101;
Y10T 428/1275 20150115; F28F 21/02 20130101; H01L 23/3735 20130101;
H01L 23/373 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
428/40.9 ;
428/652; 428/671; 205/50; 428/41.1 |
International
Class: |
F28F 21/08 20060101
F28F021/08; F28F 21/02 20060101 F28F021/02; F28F 3/00 20060101
F28F003/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 18, 2013 |
KR |
10-2013-0069480 |
Claims
1. A heat-dissipation sheet assembly comprising: a heat-dissipation
sheet layer having good heat conductivity; and a protection
layer(s) electrodeposited on one or both sides of the
heat-dissipation sheet layer by immersing the heat-dissipation
sheet layer into an aqueous solution for electrodeposition with an
added material for electrodeposition and permitting electric
current to flow in the aqueous solution, and the heat-dissipation
sheet assembly may be attached to a heat-generating unit by
applying an adhesion layer to an underside of the heat-dissipation
sheet assembly.
2. The heat-dissipation sheet assembly according to claim 1,
wherein the heat-dissipation sheet layer is preprocessed by
immersing into an aqueous solution containing a copper component
before immersing into the aqueous solution for electrodeposition,
for better electrodeposition.
3. The heat-dissipation sheet assembly according to claim 1,
wherein the heat-dissipation sheet layer is a thin film made of a
natural graphite, artificial graphite, copper, silver, aluminum or
gold sheet.
4. The heat-dissipation sheet assembly according to claim 1,
wherein the material for electrodeposition is gold, silver, copper,
aluminium or nickel.
5. The heat-dissipation sheet assembly according to claim 1,
wherein the aqueous solution for electrodeposition is a solution
with added sodium cyanide or organic acid silver, or a solution
with added nickel sulfamate, nickel chloride and boric acid.
6. The heat-dissipation sheet assembly according to claim 1,
wherein the thickness of the heat-dissipation sheet layer is
10.about.40 .mu.m and the thickness of the protection layer is
0.1.about.3 .mu.m.
7. The heat-dissipation sheet assembly according to claim 1 further
comprising: an adhesion layer to attach the heat-dissipation sheet
assembly to the heat-generating unit; and a release paper on an
underside of the adhesion layer, the release paper being easily
detached from the adhesion layer.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of Korean Patent
Application No. 10-2013-0069480, filed on Jun. 18, 2013, the
disclosure of which is hereby incorporated herein by reference in
its entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a heat-dissipation sheet
assembly and more particularly, to a heat-dissipation sheet
assembly manufactured by using an electrochemical method.
[0004] 2. Description of the Related Art
[0005] Recently, the structural complexity and preciseness have
more and more increased in various electrical and electronic
equipment including televisions, computers, medical devices, office
equipment, communication equipment, etc. As the electrical and
electronic components which are used in these devices and equipment
have become smaller in size and the quantity thereof has increased,
the heat generated in these components has increased. To
efficiently release and disperse the heat generated,
heat-dissipation sheets are widely used. Especially, as slim
notebooks, tablet PCs, smart phones, plasma display panels (PDP),
liquid crystal displays (LCD) and light-emitting diodes (LED) are
now made smaller in size and lighter in weight, heat-dissipation
sheets are widely used in the devices in which a lot of heat is
generated.
[0006] However, as shown in FIG. 1, a conventional heat-dissipation
sheet assembly 90 includes a heat-dissipation sheet layer 91, such
as graphite sheets having good heat conductivity, and
heat-dissipation sheet protection layers 92, 92' made of plastic
resin to protect the heat-dissipation sheet layer 91, which are
bonded on and under the heat-dissipation sheet layer 91 by using an
adhesive 94. Further, an outer protection layer 93 may be bonded on
the upper heat-dissipation sheet protection layer 92 using the
adhesive 94, to protect the upper heat-dissipation sheet protection
layer 92 from an external impact or abrasion. An adhesion layer 95
is applied under the lower heat-dissipation sheet protection layer
92' to attach the heat-dissipation sheet assembly 90 to a
heat-generating unit 1. In this conventional art, since the
adhesive strength of the adhesive 94 decreases due to the
repetitive heat generation from the heat-generating unit 1, the
heat-dissipation sheet layer 91, the heat-dissipation sheet layer
protection layers 92, 92' and the outer protection layer 93 may
separate from one another. Furthermore, if the heat-dissipation
sheet assembly 90 is inadvertently pulled or intentionally removed
from the heat-generating unit 1 for repairing/checking a device or
equipment, the heat-dissipation sheet layer 91 may be peeled off or
damaged. In addition, since the adhesives 94 and the
heat-dissipation sheet protection layers 92, 92' have a heat
insulation effect preventing heat transfer, the effect of
dissipating and dispersing the heat generated from the
heat-generating unit 1 is hindered.
SUMMARY OF THE INVENTION
[0007] Therefore, it is an object of the present invention to
provide a heat-dissipation sheet assembly wherein a
heat-dissipation sheet layer is prevented from being damaged even
if an external force is applied to the heat-dissipation sheet
assembly and no separation occurs between each layer even by the
repetitive heat generation.
[0008] It is another object of the present invention to provide a
heat-dissipation sheet assembly which is easily manufactured by a
simple structure and has excellent effects of heat dissipation and
dispersion.
[0009] In accordance with an aspect of the present invention, there
is provided a heat-dissipation sheet assembly comprising: a
heat-dissipation sheet layer having good heat conductivity, a
protection layer which is electrodeposited on one or both sides of
the heat-dissipation sheet layer. The protection layer is
electrodeposited on one or both sides of the heat-dissipation sheet
layer by immersing the heat-dissipation sheet layer into an aqueous
solution for electrodeposition with an added material for
electrodeposition and permitting electric current to flow in the
aqueous solution for electrodeposition.
[0010] The heat-dissipation sheet assembly may be attached to a
heat-generating unit by applying an adhesion layer to an underside
of the heat-dissipation sheet assembly.
[0011] Preferably, the heat-dissipation sheet layer may be
preprocessed by immersing the heat-dissipation sheet layer into an
aqueous solution containing a copper component before immersing the
heat-dissipation sheet layer into the aqueous solution for
electrodeposition, for better electrodeposition.
[0012] Preferably, the heat-dissipation sheet layer may be a thin
film made of a natural graphite, artificial graphite, copper,
silver, aluminum or gold sheet. The material for electrodeposition
may be gold, silver, copper, aluminium or nickel.
[0013] Preferably, the aqueous solution for electrodeposition may
be a solution with added sodium cyanide or organic acid silver, or
a solution with added nickel sulfamate, nickel chloride and boric
acid.
[0014] Preferably, the thickness of the heat-dissipation sheet
layer may be 10.about.40 .mu.m and the thickness of the protection
layer may be 0.1.about.3 .mu.m.
[0015] Preferably, the heat-dissipation sheet assembly may further
comprise an adhesion layer to attach the heat-dissipation sheet
assembly to the heat-generating unit; and a release paper on an
underside of the adhesion layer. The release paper can be easily
detached from the adhesion layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and other features and advantages of the present
invention will become more apparent to those of ordinary skill in
the art by describing in detail the preferred embodiments thereof
with reference to the attached drawings in which:
[0017] FIG. 1 is a schematic cross-sectional view of a conventional
heat-dissipation sheet assembly;
[0018] FIG. 2 is a schematic cross-sectional view of a
heat-dissipation sheet assembly according to one embodiment of the
present invention; and
[0019] FIG. 3 is a schematic cross-sectional view of a
heat-dissipation sheet assembly according to another embodiment of
the present invention.
DESCRIPTION OF NUMBERS FOR CONSTITUENTS IN DRAWINGS
TABLE-US-00001 [0020] 1: heat-generating unit 10, 10':
heat-dissipation sheet assembly 11: heat-dissipation sheet layer
12, 12': protection layer 13: adhesion layer 90: heat-dissipation
sheet assembly 91: heat-dissipation sheet layer 92, 92': protection
layer 93: outer protection layer 94: adhesive layer 95: adhesion
layer
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0021] The present invention will now be described more fully
hereinafter with reference to the accompanying drawings, in which
the preferred embodiments of the invention are shown so that those
of ordinary skill in the art can easily carry out the present
invention.
[0022] FIGS. 2 and 3 are schematic cross-sectional views of
heat-dissipation sheet assemblies 10, 10' according to the present
invention. FIG. 2 is a cross-sectional view of the heat-dissipation
sheet assembly 10 according to one embodiment of the present
invention, wherein a protection layer 12 is electrodeposited on
only one side of a heat-dissipation sheet 11. FIG. 3 is a
cross-sectional view of the heat-dissipation sheet assembly 10'
according to another embodiment of the present invention, wherein
protection layers 12, 12' are electrodeposited on and under a
heat-dissipation sheet layer 11.
[0023] As shown in FIGS. 2 and 3, the heat-dissipation sheet
assemblies 10, 10' comprise the heat-dissipation sheet layer 11
having good heat conductivity and the protection layers 12, 12' to
protect the heat-dissipation sheet layer 11. The heat-dissipation
sheet layer 11 is a thin film made of a natural graphite sheet or
an artificial graphite sheet having high heat conductivity, or a
metal sheet having good heat conductivity, such as copper, silver,
aluminium or gold. The thickness of the heat-dissipation sheet
layer 11 may be about 10.about.60 .mu.m, preferably about
10.about.40 .mu.m. The protection layers 12, 12' are made of metal
materials such as gold, silver, copper, aluminium or nickel. The
protection layers 12, 12' protect the heat-dissipation sheet layer
11 by preventing it from being damaged or worn away. In addition,
the protection layers 12, 12' have good heat conductivity, allowing
the heat generated from the heat-generating unit 1 to be
effectively dissipated and dispersed through the heat-dissipation
sheet layer 11. The protection layer 12 may be applied only on the
heat-dissipation sheet layer 11 as shown in FIG. 2, or the
protection layers 12, 12' may be applied on and under the
heat-dissipation sheet layer 11 as shown in FIG. 3 to further
increase the capability of protecting the heat-dissipation sheet
layer 11. The protection layers are ultra thin films and the
thickness of the each protection layer 12, 12' may be about
0.1.about.5 .mu.m, preferably about 0.1.about.3 .mu.m. Therefore,
since the heat-dissipation sheet assemblies 10, 10' according to
the present invention are thin plates about 10.about.70 .mu.m in
the whole thickness, these are readily and effectively used as
heat-dissipating means for the light and thin electrical and
electronic products.
[0024] An important point is that the protection layers 12, 12' are
electrodeposited to the one or both sides of the heat-dissipation
sheet layer 11 by using an electrochemical method, without using
any adhesives. As a method to electrodeposit the protection layers
12, 12' to the heat-dissipation sheet layer 11, the material for
electrodeposition, such as gold, silver, copper or aluminum, is
added, in an adequate ratio, into an aqueous solution for
electrodeposition, for example, an aqueous solution with added
sodium cyanide or organic acid silver, and then the
heat-dissipation sheet layer 11 is immersed in the aqueous solution
for electrodeposition with the added material for
electrodeposition. Thereafter, when the heat-dissipation sheet
layer 11 is connected to a cathode and an anode plate is installed
nearby one side or both sides of the heat-dissipation sheet layer
11, electric current is allowed to flow. Then, the material for
electrodeposition dissolved in the aqueous solution for
electrodeposition is electrodeposited to one side or both sides of
the heat-dissipation sheet layer 11, to form the protection layers
12, 12'. If the material of the protection layer, that is, the
material for electrodeposition is nickel, the aqueous solution for
electrodeposition may be a solution with added nickel sulfamate,
nickel chloride and boric acid. If the heat-dissipation sheet layer
is preprocessed by being immersed into an aqueous solution
containing a copper component before being immersed into the
aqueous solution, the electrodeposition may be better enhanced.
[0025] As shown in FIGS. 2 and 3, the heat-dissipation sheet
assemblies 10, 10' completed in the above-described manner may be
attached to the heat-generating unit 1 by applying an adhesion
layer 13 to the undersides of the heat-dissipation sheet assemblies
10, 10' or to the topside of the heat-generating unit 1. The
adhesion layer 13 may be, for example, a silicon or epoxy-based
adhesive.
[0026] As described above, when the protection layers 12, 12' are
electrodeposited to the heat-dissipation sheet layer 11, the
elements of the protection layers 12, 12' permeate into an inner
structure of the heat-dissipation sheet layer 11 and the bonding
force further increases. Therefore, even if heat is repetitively
generated from the heat-generating unit 1, the bonding strength
between the heat-dissipation sheet layer 11 and the protection
layers 12, 12' does not fall. Accordingly, for example, if a force
is applied to pull the heat-dissipation sheet assemblies 10, 10'
from the heat-generating unit 1 for checking or repairing the
heat-generating unit 1, the entire heat-dissipation sheet
assemblies 10, 10' will be separated from the heat-generating unit
1 without the heat-dissipation sheet layer 11 itself being damaged
or without the heat-dissipation sheet layer 11 and the protection
layers 12, 12' being separated.
[0027] The heat-dissipation sheet assemblies 12, 12' according to
the present invention may comprise an adhesion layer 13 to attach
the heat-dissipation sheet assemblies 12, 12' to the
heat-generating unit 1, and a release paper to protect this
adhesion layer 13. The release paper may be attached to the
adhesion layer 13, and can be easily detached from the adhesion
layer 13. For the release paper, a material, such as a vinyl film,
a polyester film, a paper or a cloth covered with release coating
may be used.
[0028] In accordance with the present invention, the
heat-dissipation sheet assembly has the following effects: [0029]
Even if an external force is applied to the heat-dissipation sheet
assembly attached to the heat-generating unit, the heat-dissipation
sheet layer and the heat-dissipation sheet assembly are prevented
from being damaged. [0030] Even if heat is repetitively generated
from the heat-generating unit, separation between the layers of the
heat-dissipation sheet assembly is prevented. [0031] Since the
structure of the heat-dissipation sheet assembly is simple, it is
easily manufactured. [0032] Since there are no layers to hinder the
effects of dissipating and dispersing the heat, the effects of
dissipating and dispersing the heat is more improved.
[0033] The invention has been described using preferred exemplary
embodiments. However, it is to be understood that the scope of the
invention is not limited to the disclosed embodiments. On the
contrary, the scope of the invention is intended to include various
modifications and alternative arrangements within the capabilities
of persons skilled in the art using presently known or future
technologies and equivalents. The scope of the claims, therefore,
should be accorded the broadest interpretation so as to encompass
all such modifications and similar arrangements.
* * * * *