U.S. patent application number 14/476100 was filed with the patent office on 2014-12-18 for method for cutting tempered glass.
The applicant listed for this patent is Dongguan Masstop Liquid Crystal Display Co., Ltd., Wintek Corporation. Invention is credited to JENG-JYE HUNG, HEN-TA KANG, YI-TE LEE, CHIH-YUAN WANG.
Application Number | 20140366580 14/476100 |
Document ID | / |
Family ID | 44309169 |
Filed Date | 2014-12-18 |
United States Patent
Application |
20140366580 |
Kind Code |
A1 |
HUNG; JENG-JYE ; et
al. |
December 18, 2014 |
METHOD FOR CUTTING TEMPERED GLASS
Abstract
A method for cutting a tempered glass including the steps of
strengthening a glass substrate to form, from a surface to the
inside of the glass substrate, at least one compression stress
layer and a tensile stress layer corresponding to the compression
stress layer; removing a part of the glass substrate, wherein the
compression stress layer is formed in the part of the glass
substrate and a predetermined cutting path passes through the part
of the glass substrate; and cutting the glass substrate along the
predetermined cutting path.
Inventors: |
HUNG; JENG-JYE; (TAI PING
CITY, TW) ; LEE; YI-TE; (KAO HSIUNG CITY, TW)
; KANG; HEN-TA; (Taichung, TW) ; WANG;
CHIH-YUAN; (TAI CHUNG COUNTY, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dongguan Masstop Liquid Crystal Display Co., Ltd.
Wintek Corporation |
Dongguan City
Taichung City |
|
CN
TW |
|
|
Family ID: |
44309169 |
Appl. No.: |
14/476100 |
Filed: |
September 3, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13013415 |
Jan 25, 2011 |
8852721 |
|
|
14476100 |
|
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Current U.S.
Class: |
65/30.14 ;
65/112; 65/114; 65/31 |
Current CPC
Class: |
Y10T 428/2457 20150115;
C03C 21/002 20130101; C03B 33/023 20130101; B24B 7/241 20130101;
Y10T 428/24479 20150115; Y02P 40/57 20151101; C03C 21/00 20130101;
B32B 3/30 20130101; C03C 15/00 20130101; C03B 33/02 20130101 |
Class at
Publication: |
65/30.14 ;
65/112; 65/31; 65/114 |
International
Class: |
C03B 33/02 20060101
C03B033/02; C03C 15/00 20060101 C03C015/00; C03C 21/00 20060101
C03C021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 27, 2010 |
TW |
099102208 |
Sep 28, 2010 |
TW |
099132711 |
Claims
1. A method for cutting a tempered glass, comprising the steps of:
strengthening a glass substrate to form, from a surface to the
inside of the glass substrate, at least one compression stress
layer and a tensile stress layer corresponding to the compression
stress layer; removing a part of the glass substrate, wherein the
compression stress layer is formed in the part of the glass
substrate, and a predetermined cutting path passes through the part
of the glass substrate; and cutting the glass substrate along the
predetermined cutting path.
2. The method as claimed in claim 1, wherein the glass substrate is
given an ion exchange glass strengthening treatment.
3. The method as claimed in claim 1, wherein the part of the glass
substrate is removed by etching or polishing.
4. A method for cutting a tempered glass, comprising the steps of:
strengthening a glass substrate by an ion exchange glass
strengthening treatment to form, from a surface to the inside of
the glass substrate, at least one compression stress layer and a
tensile stress layer corresponding to the compression stress layer;
forming at least one trench on the glass substrate without
splitting the glass substrate at a position overlapping the
compression stress layer and a predetermined cutting path; and
cutting the glass substrate along the trench.
5. A method for cutting a tempered glass, comprising the steps of:
strengthening a glass substrate to form, from a surface to the
inside of the glass substrate, at least one compression stress
layer and a tensile stress layer corresponding to the compression
stress layer; forming at least one trench on the glass substrate
and in the compression stress layer without splitting the glass
substrate to remove a part of the compression stress layer and
correspondingly reduce a tensile stress along the trench; and
forming a scribe line in the trench to initiate a cutting treatment
and define a cutting path for the cutting treatment.
6. The method as claimed in claim 5, wherein the glass substrate is
given an ion exchange glass strengthening treatment.
7. The method as claimed in claim 5, wherein the trench is formed
by etching or polishing.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a Divisional application of co-pending
application Ser. No. 13/013,415, filed on Jan. 25, 2011, for which
priority is claimed under 35 U.S.C. .sctn.120; this application
claims priority of Application No. 099102208 filed in Taiwan on
Jan. 27, 2010 and Application No. 099132711 filed in Taiwan on Sep.
28, 2010 under 35 U.S.C. .sctn.119; and the entire contents of all
of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] a. Field of the Invention
[0003] The invention relates to a method for cutting a tempered
glass and a preparatory tempered glass structure for a cutting
treatment.
[0004] b. Description of the Related Art
[0005] Generally, conventional methods for strengthening glass
mainly include a heat strengthening treatment or a chemically
strengthening treatment. For example, in a typical chemically
strengthening treatment such as an ion exchange glass strengthening
treatment, a glass substrate is submersed in a bath containing a
potassium salt. This causes sodium ions on the glass surface to be
replaced by potassium ions from the bath solution. Under the
circumstance, a thin compression stress layer is formed on a skin
layer of the glass substrate. As shown in FIG. 1A and FIG. 1B, a
tensile stress TS is formed correspondingly inside a tempered glass
100 to compensate the compression stress of a compression stress
layer DOL. Compared FIG. 1A with FIG. 1B, when the compression
stress layer DOL becomes thicker (layer thickness in FIG. 1B is
larger then that in FIG. 1A), the strength of the tempered glass
100 becomes greater and the tensile stress TS inside the tempered
glass 100 also becomes greater. Hence, as the tensile stress TS is
increased to a considerable extent, the tempered glass 100 being
cut is liable to irregularly split due to the tensile stress TS.
This may result in extremely low production yield.
BRIEF SUMMARY OF THE INVENTION
[0006] The invention provides a tempered glass cutting method and a
preparatory tempered glass structure to improve the production
yield.
[0007] According to an embodiment of the invention, a method for
cutting a tempered glass including the steps of: strengthening a
glass substrate to form, from a surface to the inside of the glass
substrate, at least one compression stress layer and a tensile
stress layer corresponding to the compression stress layer;
removing a part of the glass substrate, wherein the compression
stress layer is formed in the part of the glass substrate, and a
predetermined cutting path passes through the part of the glass
substrate; and cutting the glass substrate along the predetermined
cutting path.
[0008] According to another embodiment of the invention, a method
for cutting a tempered glass including the steps of: strengthening
a glass substrate by an ion exchange glass strengthening treatment
to form, from a surface to the inside of the glass substrate, at
least one compression stress layer and a tensile stress layer
corresponding to the compression stress layer; forming at least one
trench on the glass substrate at a position overlapping the
compression stress layer and a predetermined cutting path; and
cutting the glass substrate along the trench.
[0009] According to another embodiment of the invention, a
preparatory tempered glass structure for a cutting treatment
includes a glass substrate and at least one trench. The glass
substrate is given a strengthening treatment to form, from a
surface to the inside of the glass substrate, at least one
compression stress layer and a tensile stress layer corresponding
to the compression stress layer. The trench is formed in the
compression stress layer of the glass substrate and overlaps a
predetermined cutting path for the cutting treatment.
[0010] According to the above embodiments, a part of the
compression stress layer through which a predetermined cutting path
passes is removed to reduce corresponding internal tensile stress.
Therefore, when one cuts the tempered glass, a tempered glass block
with a demanded size and a smooth facet is obtained to improve the
production yield. Further, since the remainder part of the
compression stress layer outside the predetermined cutting path is
not removed, the effect of strengthening the glass substrate is
still maintained.
[0011] Other objectives, features and advantages of the invention
will be further understood from the further technological features
disclosed by the embodiments of the invention wherein there are
shown and described preferred embodiments of this invention, simply
by way of illustration of modes best suited to carry out the
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1A and FIG. 1B show schematic diagrams of a
conventional chemically strengthened glass.
[0013] FIG. 2 to FIG. 4 show schematic diagrams illustrating a
tempered glass cutting method according to an embodiment of the
invention.
[0014] FIG. 5A shows a schematic diagram of a preparatory tempered
glass structure for a cutting treatment, and FIG. 5B shows a
schematic diagram of multiple glass blocks cut from the preparatory
tempered glass structure.
DETAILED DESCRIPTION OF THE INVENTION
[0015] In the following detailed description of the preferred
embodiments, reference is made to the accompanying drawings which
form a part hereof, and in which are shown by way of illustration
specific embodiments in which the invention may be practiced. In
this regard, directional terminology, such as "top," "bottom,"
"front," "back," etc., is used with reference to the orientation of
the Figure(s) being described. The components of the present
invention can be positioned in a number of different orientations.
As such, the directional terminology is used for purposes of
illustration and is in no way limiting. On the other hand, the
drawings are only schematic and the sizes of components may be
exaggerated for clarity. It is to be understood that other
embodiments may be utilized and structural changes may be made
without departing from the scope of the present invention. Also, it
is to be understood that the phraseology and terminology used
herein are for the purpose of description and should not be
regarded as limiting. The use of "including," "comprising," or
"having" and variations thereof herein is meant to encompass the
items listed thereafter and equivalents thereof as well as
additional items. Unless limited otherwise, the terms "connected,"
"coupled," and "mounted" and variations thereof herein are used
broadly and encompass direct and indirect connections, couplings,
and mountings. Similarly, the terms "facing," "faces" and
variations thereof herein are used broadly and encompass direct and
indirect facing, and "adjacent to" and variations thereof herein
are used broadly and encompass directly and indirectly "adjacent
to". Therefore, the description of "A" component facing "B"
component herein may contain the situations that "A" component
directly faces "B" component or one or more additional components
are between "A" component and "B" component. Also, the description
of "A" component "adjacent to" "B" component herein may contain the
situations that "A" component is directly "adjacent to" "B"
component or one or more additional components are between "A"
component and "B" component. Accordingly, the drawings and
descriptions will be regarded as illustrative in nature and not as
restrictive.
[0016] Referring to FIG. 2, a tempered glass 10 according to an
embodiment of the invention is formed by a glass substrate 12 given
a strengthening treatment. The glass strengthening treatment, for
example, may be an ion exchange glass strengthening treatment. In a
typical ion exchange glass strengthening treatment, the glass
substrate 12 is submersed in a bath containing a potassium salt.
This causes sodium ions on the skin layer of the glass substrate 12
to be replaced by potassium ions from the bath solution. Under the
circumstance, a compression stress layer DOL is formed on the skin
layer of the glass substrate 12, and a tensile stress TS is formed
inside the glass substrate 12 to compensate the compression stress
of the compression stress layer DOL. In other words, a compression
stress layer DOL and a tensile stress layer TOL are correspondingly
formed in succession from a surface to the inside of the glass
substrate 12. When the compression stress layer DOL becomes
thicker, the strength and the internal tensile stress TS of the
tempered glass 10 become greater. The stress and thickness stratify
the following equation: TS=CS*[Dc/(D-2*Dc)], where TS is the
tensile stress, CS is the compression stress, Dc is the thickness
of the compression stress layer, and D is the overall thickness of
the tempered glass 10.
[0017] When the tempered glass 10 is cut, a proper cutting depth
must exceed the thickness of the compression stress layer DOL; in
other words, a crack as a result of cutting may pierce the tensile
stress layer TOL inside the glass substrate 12. As the tensile
stress TS is increased to a considerable extent, the tip of a
fracture irregularly splits due to the tensile stress TS, as shown
in FIG. 2, and thus a demanded size of a glass block cut from the
tempered glass 10 fails to be obtained. However, such problem is
solved as long as the tensile stress TS inside the glass substrate
12 is reduced. According to an embodiment shown in FIG. 3 and FIG.
4, since the tensile stress TS is induced to compensate the
compression stress of the compression stress layer DOL, a part of
the compression stress layer DOL through which a predetermined
cutting path passes is removed by etching or polishing the glass
substrate 12 to reduce corresponding internal tensile stress TS.
Therefore, when one cuts the tempered glass 10, a tempered glass
block with a demanded size and a smooth facet is obtained to
improve the production yield. Further, since the remainder part of
the compression stress layer DOL outside the predetermined cutting
path is not removed, the effect of strengthening the glass
substrate 12 is still maintained. Certainly, the method for
removing a part of the glass substrate 12 to relief the tensile
stress TS includes, but is not limited to, etching and polishing
processes.
[0018] Besides, the glass strengthening treatment may be given on
any region of the glass substrate 12. For example, as shown in FIG.
3, since a bottom surface 12a and a top surface 12b are both given
a strengthening treatment, a part of the compression stress layer
DOL on the bottom surface 12a and the top surface 12b overlapping a
predetermined cutting path is removed. Certainly, the area and
depth of a part of the compression stress layer DOL to be removed
are not limited, as long as the effect of relieving the tensile
strength and preventing irregularly cracks is achieved. Besides,
the material of the glass substrate 12 includes, but is not limited
to, sodium calcium silicate glass and aluminosilicate glass.
Further, the strengthening treatment is not limited to the ion
exchange glass strengthening treatment exemplified above, and any
strengthening treatment capable of forming compression stress and
tensile stress in the glass substrate 12 is suitable for the above
embodiments.
[0019] FIG. 5A shows a schematic diagram of a preparatory tempered
glass structure for a cutting treatment, and FIG. 5B shows a
schematic diagram of multiple glass blocks cut from the preparatory
tempered glass structure. Referring to FIG. 5A, after a glass
substrate 12 is given a glass strengthening treatment such as an
ion exchange glass strengthening treatment, a compression stress
layer and a tensile stress layer are correspondingly formed in
succession from a surface to the inside of the glass substrate 12.
Further, at least one trench V (such as multiple trenches shown in
FIG. 5A) is formed on a bottom surface 12a and a top surface 12b of
the glass substrate 12 by etching or polishing processes. The
trench V overlaps a predetermined cutting path, and the depth of
the trench V is preferably set as slightly larger than the
thickness of the compression stress layer. As shown in FIG. 5B,
when the preparatory tempered glass structure is cut along the
trench V, multiple tempered glass blocks 14 with a demanded size
and a smooth facet are obtained.
[0020] Further, the use of a tempered glass according to the above
embodiments is not limited. For example, the tempered glass may
serve as a glass substrate or a cover glass of a touch panel.
Alternatively, the tempered glass may serve as a glass substrate of
a liquid crystal display, an organic electroluminescence display,
an electrowetting display or a bi-stable display.
[0021] The foregoing description of the preferred embodiments of
the invention has been presented for purposes of illustration and
description. It is not intended to be exhaustive or to limit the
invention to the precise form or to exemplary embodiments
disclosed. Accordingly, the foregoing description should be
regarded as illustrative rather than restrictive. Obviously, many
modifications and variations will be apparent to practitioners
skilled in this art. The embodiments are chosen and described in
order to best explain the principles of the invention and its best
mode practical application, thereby to enable persons skilled in
the art to understand the invention for various embodiments and
with various modifications as are suited to the particular use or
implementation contemplated. It is intended that the scope of the
invention be defined by the claims appended hereto and their
equivalents in which all terms are meant in their broadest
reasonable sense unless otherwise indicated. Therefore, the term
"the invention", "the present invention" or the like does not
necessarily limit the claim scope to a specific embodiment, and the
reference to particularly preferred exemplary embodiments of the
invention does not imply a limitation on the invention, and no such
limitation is to be inferred. The invention is limited only by the
spirit and scope of the appended claims. The abstract of the
disclosure is provided to comply with the rules requiring an
abstract, which will allow a searcher to quickly ascertain the
subject matter of the technical disclosure of any patent issued
from this disclosure. It is submitted with the understanding that
it will not be used to interpret or limit the scope or meaning of
the claims. Any advantages and benefits described may not apply to
all embodiments of the invention. It should be appreciated that
variations may be made in the embodiments described by persons
skilled in the art without departing from the scope of the present
invention as defined by the following claims. Moreover, no element
and component in the present disclosure is intended to be dedicated
to the public regardless of whether the element or component is
explicitly recited in the following claims.
* * * * *