U.S. patent application number 14/464185 was filed with the patent office on 2014-12-04 for optical semiconductor lighting apparatus.
The applicant listed for this patent is POSCO LED COMPANY LTD.. Invention is credited to Ji Wan KIM, Jung Hwa KIM, Yun Ha KIM.
Application Number | 20140353711 14/464185 |
Document ID | / |
Family ID | 51541571 |
Filed Date | 2014-12-04 |
United States Patent
Application |
20140353711 |
Kind Code |
A1 |
KIM; Ji Wan ; et
al. |
December 4, 2014 |
OPTICAL SEMICONDUCTOR LIGHTING APPARATUS
Abstract
An optical semiconductor lighting apparatus includes a housing
including a groove, a light-emitting module disposed in the
housing, the light-emitting module including a semiconductor
optical device, a sealing body disposed in the groove, the sealing
body including a main portion and a first rib extending from the
main portion, and an optical cover disposed on the housing and
covering the groove and the light-emitting module, wherein a first
open space is disposed between the optical cover, the first rib,
the main portion of the sealing body, and a side surface of the
groove.
Inventors: |
KIM; Ji Wan; (Seongnam-si,
KR) ; KIM; Yun Ha; (Seongnam-si, KR) ; KIM;
Jung Hwa; (Seongnam-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
POSCO LED COMPANY LTD. |
Seongnam-si |
|
KR |
|
|
Family ID: |
51541571 |
Appl. No.: |
14/464185 |
Filed: |
August 20, 2014 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
13920350 |
Jun 18, 2013 |
8841690 |
|
|
14464185 |
|
|
|
|
Current U.S.
Class: |
257/99 |
Current CPC
Class: |
F21S 8/02 20130101; H01L
33/54 20130101; F21Y 2115/10 20160801; H01L 33/58 20130101; F21V
3/00 20130101; F21K 9/00 20130101; F21V 31/005 20130101; H01L
33/483 20130101; H01L 33/52 20130101; F21V 15/01 20130101 |
Class at
Publication: |
257/99 |
International
Class: |
H01L 33/48 20060101
H01L033/48; H01L 33/54 20060101 H01L033/54 |
Foreign Application Data
Date |
Code |
Application Number |
May 2, 2013 |
KR |
10-2013-0049419 |
Claims
1. An optical semiconductor lighting apparatus, comprising: a
housing comprising a groove; a light-emitting module disposed in
the housing, the light-emitting module comprising a semiconductor
optical device; a sealing body disposed in the groove, the sealing
body comprising a main portion and a first rib extending from the
main portion; and an optical cover disposed on the housing and
covering the groove and the light-emitting module, wherein a first
open space is disposed between the optical cover, the first rib,
the main portion of the sealing body, and a side surface of the
groove.
2. The optical semiconductor lighting apparatus of claim 1, wherein
the first rib extends from a top surface of the main portion of the
sealing body along a forming direction of the sealing body.
3. The optical semiconductor lighting apparatus of claim 2, wherein
the first rib contacts the optical cover.
4. The optical semiconductor lighting apparatus of claim 1, wherein
a pair of second ribs extend in parallel from both edges of a
bottom surface of the main portion of the sealing body.
5. The optical semiconductor lighting apparatus of claim 4, wherein
a second open space is disposed between the second ribs, the bottom
surface of the main portion of the first sealing body, and a bottom
surface of the groove.
6. The optical semiconductor lighting apparatus of claim 1, wherein
the sealing body is configured to elastically deform according to a
load and pressure on the optical cover.
7. The optical semiconductor lighting apparatus of claim 5, wherein
the first and second open spaces accommodate elastic deformation of
the sealing body in the groove.
8. The optical semiconductor lighting apparatus of claim 5, wherein
the first open space and the second open space are disposed on
opposing sides of the sealing body.
9. An optical semiconductor lighting apparatus, comprising: a
light-emitting module comprising a semiconductor optical device; a
housing supporting the light-emitting module, the housing
comprising a groove disposed around the light-emitting module; an
optical cover disposed on the housing and covering the
light-emitting module and the groove; and a sealing element
disposed in the groove and comprising a body and a first rib that
extends from the body and contacts the first optical cover, such
that the body is spaced apart from the optical cover by a first air
gap disposed on opposing sides of the first rib.
10. The optical semiconductor lighting apparatus of claim 9,
wherein the sealing element further comprises second ribs extending
from opposing sides of the body and contacting the bottom of the
groove, such that a second air gap is formed between the body and
the bottom of the groove.
11. The optical semiconductor lighting apparatus of claim 9,
wherein the first air gap and the second air gap are disposed on
opposing sides of the body.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 13/920,350, filed on Jun. 18, 2013, and claims
priority from and the benefit of Korean Patent Application No.
10-2013-0049419, filed on May 2, 2013, which are incorporated
herein by reference for all purposes as if fully set forth
herein.
BACKGROUND
[0002] 1. Field
[0003] The present invention relates to an optical semiconductor
lighting apparatus, and more particularly, to an optical
semiconductor lighting apparatus that can prevent penetration of
moisture, particles, dust or the like and can improve the
durability and connectivity thereof in its entirety.
[0004] 2. Discussion of the Background
[0005] As compared with incandescent bulbs and fluorescent lamps,
optical semiconductors using a light source, such as a light
emitting diode (LED), an organic LED, a laser diode, and an organic
electroluminescent diode, have low power consumption, long
lifespan, superior durability, and high luminance. Due to these
advantages, the optical semiconductors have recently attracted
attention as an illumination component.
[0006] Generally, a lighting apparatus using the optical
semiconductor as a light source includes a housing accommodating a
light emitting module in which a plurality of optical
semiconductors are arrayed, and an optical cover facing the optical
semiconductors and finishing one opened surface of the housing.
[0007] In order to prevent foreign substances such as moisture or
dust from flowing into a light emitting module side, the optical
cover is fixed to the housing by press-fitting a sealing member,
such as an O-ring, of which the cross-section is a "" or "C" shape
along edges thereof.
[0008] However, such a sealing member contracts or expands
according to external environment change such as temperature or
pressure, causing a problem in sealing maintenance.
[0009] Therefore, there is an urgent need for apparatuses that can
solve the above problems, prevent penetration of moisture and
foreign substances, and improve the durability thereof in their
entirety.
SUMMARY
[0010] The present invention has been made in an effort to solve
the above problems, and provides an optical semiconductor lighting
apparatus that can prevent penetration of moisture and foreign
substances and improve the durability thereof in its entirety.
[0011] According to an embodiment of the present invention, an
optical semiconductor lighting apparatus includes: a light emitting
module including a semiconductor optical device; a housing
including the light emitting module; a first sealing body connected
to a groove recessed in a polygonal or closed-curve shape of the
housing; a first optical cover covering an outer edge of the groove
and a top surface of the housing; a first rib formed on a top
surface of the first sealing body along a forming direction of the
first sealing body; and a pair of second ribs formed in parallel
along both edges of a bottom surface of the first sealing body.
[0012] The first rib may come into contact with the first optical
cover and allow elastic deformation.
[0013] The pair of second ribs may come into contact with a bottom
surface of the groove and allows elastic deformation.
[0014] The first sealing body may allow elastic deformation between
the first and second ribs according to a load and pressure of the
first optical cover.
[0015] The housing may further include a first stepped portion
formed with a height difference along the outer edge of the groove,
and an edge of the first optical cover may come into contact with
the first stepped portion.
[0016] The housing may further include a first stepped portion
formed with a height difference along the outer edge of the groove,
and a thickness of the first optical cover may be equal to a height
of the first stepped portion protruding from the outer edge of the
groove.
[0017] The housing may further include: a first stepped portion
formed with a height difference along the outer edge of the groove;
a second stepped portion formed with a height difference on a top
surface of the first stepped portion; and a cover press ring
pressing an edge of the first optical cover, which comes into
contact with the first stepped portion, and the top surface of the
first stepped portion.
[0018] An edge of the cover press ring may come into contact with
the second stepped portion. A thickness of the first optical cover
may be equal to a height of the first stepped portion protruding
from the outer edge of the groove. A thickness of the cover press
ring may be equal to a height of the second stepped portion
protruding from the first stepped portion.
[0019] The housing may further include: a first stepped portion
formed with a height difference along the outer edge of the groove;
a second stepped portion formed with a height difference on a top
surface of the first stepped portion; an outer cover covering a top
surface of the second stepped portion and one side of the housing;
and a second sealing body disposed on a top surface of the second
stepped portion and covered by the outer cover, an edge of the
first optical cover comes into contact with the first stepped
portion, and a thickness of the first optical cover is equal to a
height of the first stepped portion protruding from the outer edge
of the groove.
[0020] The housing may further include a cover press ring pressing
an edge of the first optical cover, which comes into contact with
the first stepped portion, and a top surface of the first stepped
portion. A thickness of the cover press ring may be equal to a
height of the second stepped portion protruding from the first
stepped portion. An edge of the cover press ring may come into
contact with the second stepped portion. The second sealing body
may press a top surface of the second stepped portion and an upper
portion of the cover press ring.
[0021] The housing may further include: a first stepped portion
formed with a height difference along the outer edge of the groove;
a second stepped portion formed with a height difference on a top
surface of the first stepped portion; an outer cover covering a top
surface of the second stepped portion and a side of the housing;
and a positioning rib formed on the outer cover along a forming
direction of the outer cover.
[0022] The housing may further include a second optical cover fixed
inside the positioning rib.
[0023] In addition, the term "semiconductor optical device" as used
in claims and detailed description refers to an LED chip or the
like that includes or uses optical semiconductor.
[0024] The "semiconductor optical device" may include a
package-level device with various types of optical semiconductor as
well as the above-mentioned LED chip.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The accompanying drawings, which are included to provide a
further understanding of the invention and are incorporated in and
constitute a part of this specification, illustrate embodiments of
the invention, and together with the description serve to explain
the principles of the invention.
[0026] FIG. 1 is a cross-sectional conceptual diagram illustrating
an overall configuration of an optical semiconductor lighting
apparatus according to an embodiment of the present invention.
[0027] FIG. 2 is a cross-sectional conceptual diagram illustrating
pre-modification states of a first sealing body and first and
second ribs, which are essential components of the optical
semiconductor lighting apparatus according to the embodiment of the
present invention.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0028] Exemplary embodiments of the present invention will be
described below in detail with reference to the accompanying
drawings. Throughout the disclosure, like reference numerals refer
to like parts throughout the drawings and embodiments of the
present invention.
[0029] Hereinafter, exemplary embodiments of the present invention
will be described with reference to the accompanying drawings.
[0030] FIG. 1 is a cross-sectional conceptual diagram illustrating
an overall configuration of an optical semiconductor lighting
apparatus according to an embodiment of the present invention, and
FIG. 2 is a cross-sectional conceptual diagram illustrating
pre-modification states of a first sealing body and first and
second ribs, which are essential components of the optical
semiconductor lighting apparatus according to the embodiment of the
present invention.
[0031] As illustrated in FIGS. 1 and 2, the optical semiconductor
lighting apparatus includes a light emitting module 100, a housing
200, a first sealing body 300, a first optical cover 400, a first
rib 310, and a second rib 320.
[0032] The light emitting module 100 includes one or more
semiconductor optical devices 101 operating as a light source, a
circuit board, and a driving circuit (not illustrated) for driving
the semiconductor optical devices 101.
[0033] The housing 200 accommodates the light emitting module 100,
and provides a space for mounting the first sealing body 300 and
the first optical cover 400 to be described below.
[0034] The first sealing body 300 is coupled to a groove 201
recessed in the housing 200 along edges of the light emitting
module 100 in a polygonal or closed-curve shape. The first sealing
body 300 is provided for maintaining sealing while preventing
moisture and foreign substances from flowing into the light
emitting module 100 through the inside of the housing 200.
[0035] The first optical cover 400 covers the outer edge of the
groove 201 and the top surface of the housing 200. The first
optical cover 400 prevents inflow of moisture and foreign
substances and protects the light emitting module 100 such as the
semiconductor optical devices 101 from the exterior by covering the
opened top surface of the housing 200. In addition, the first
optical cover 400 performs an optical function of diffusing or
reducing light emitted from the semiconductor optical devices
101.
[0036] The first rib 310 is formed on the top surface of the first
sealing body 300 along a forming direction of the first sealing
body 300. The first rib 310 is integrally formed with the first
sealing body 300 and is formed using the same material as the first
sealing body 300. The first rib 310 primarily disperses and
supports a force and pressure applied from the edge of the first
optical cover 400 while coming into contact with the first optical
cover 400.
[0037] The second rib 320 is provided with a pair of ribs formed in
parallel along both edges of the bottom surface of the first
sealing body 300. The second rib 320 is integrally formed with the
first sealing body 300 and is formed using the same material as the
first sealing body 300. The second rib 320 secondarily disperses
and supports a force and pressure applied from the edge of the
first optical cover 400 while coming into contact with the groove
201.
[0038] In addition to the above-described embodiment, the following
various embodiments can also be applied to the present
invention.
[0039] The first and second ribs 310 and 320 are formed from the
first sealing body 300 as described above, and maintain sealing
while appropriately dispersing and supporting a force and pressure
applied along a vertical direction of the first sealing body
300.
[0040] That is, the first rib 310 comes into contact with the first
optical cover 400 and allows elastic deformation in a state of FIG.
2, as shown in the enlarged portion of FIG. 1. The pair of second
ribs 320 comes into contact with the bottom surface 201b of the
groove 201 and allows elastic deformation in a state of FIG. 2, as
shown in the enlarged portion of FIG. 1.
[0041] In this case, the first sealing body 300 allows elastic
deformation in a state of FIG. 2, as shown in the enlarged portion
of FIG. 1, according to a load and pressure of the first optical
cover 400 between the first and second ribs 310 and 320.
[0042] On the other hand, the housing 200 further includes a first
stepped portion 210 formed with a height difference along the outer
edge of the groove 201 in order for connection of the first optical
cover 400 and sealing maintenance. The edge of the first optical
cover 400 may come into contact with the first stepped portion
210.
[0043] A thickness of the first optical cover 400 may be equal to a
height of the first stepped portion 210 protruding from the outer
edge of the groove 201.
[0044] In this case, the housing 200 may further include a second
stepped portion 220 and a cover press ring 230. The second stepped
portion 220 is formed on the first stepped portion with a height
difference with respect to the first stepped portion 210. The cover
press ring 230 presses the edge of the first optical cover 400
coming into contact with the first stepped portion 210, and the top
surface of the first stepped portion 210.
[0045] The edge of the cover press ring 230 comes into contact with
the second stepped portion 220, and the cover press ring 230
presses the first optical cover 400 while coming into close contact
with the first optical cover 400, thereby avoiding the
inconvenience of coupling with bolts along the edge of the first
optical cover 400.
[0046] The cover press ring 230 presses the edge of the first
optical cover 400, which comes into contact with the first stepped
portion 210, and the top surface of the first stepped portion 210.
A thickness of the cover press ring 230 is equal to a height of the
second stepped portion 220 protruding from the first stepped
portion, and the edge of the cover press ring 230 comes into
contact with the second stepped portion 220.
[0047] On the other hand, the housing 200 may include an outer
cover 240 covering the top surface of the second stepped portion
220 and the side of the housing 200, and a second sealing body 250
disposed on the top surface of the stepped portion 220 and covered
by the outer cover 240.
[0048] When a general-purpose lighting apparatus as well as a
lighting apparatus such as canopy light is mounted in the housing
200, in particular, when a ceiling-recessed lighting apparatus is
used, the outer cover 240 prevents moisture from flowing from the
ceiling to the light emitting module 100.
[0049] In the outer cover 240, a positioning rib 242 may be further
formed on the outer cover 240 along a forming direction of the
outer cover 240. Therefore, a second optical cover 260 may be
additionally mounted inside the positioning rib 242.
[0050] That is, the positioning rib 242 allows a user to perform
operations while checking and determining an accurate installation
position of the optical component, such as the second optical cover
260, with his/her naked eye.
[0051] When a fixing material, such as silicon, is coated along the
edge of the second optical cover 260 so as to fix the second
optical cover 260, the positioning rib 242 prevents the fixing
material from flowing into the light emitting module 100 and allows
the installation of additional optical components.
[0052] The second sealing body 250 secondarily blocks moisture and
foreign substances introduced through the outer cover 240, and
protects the entire apparatus by absorbing or dispersing external
shocks applied to the first optical cover 400.
[0053] For this purpose, the second sealing body 250 is configured
to press the top surface of the second stepped portion 220 and the
upper portion of the cover press ring 230.
[0054] As described above, the basic technical spirit of the
present invention is to provide the optical semiconductor lighting
apparatus according to the present invention can prevent
penetration of moisture and foreign substances, and improve the
durability of the entire apparatus.
[0055] The above-described configurations according to the present
invention can obtain the following effects.
[0056] First, since the first sealing body primarily maintains
sealing, it is possible to fundamentally prevent inflow of moisture
or foreign substances. In addition, while allowing elastic
deformation, the first and second ribs formed on the top and bottom
surfaces of the first sealing body effectively distribute and
support the pressure and force applied to the edges and entire
surfaces of the first optical cover to be connected to the housing.
Therefore, the durability of the entire apparatus can be
improved.
[0057] In particular, since the optical semiconductor lighting
apparatus of the present invention can be used for a long time
without degradation in sealing performance, products with high
reliability can be supplied to consumers.
[0058] While the embodiments of the present invention have been
described with reference to the specific embodiments, it will be
apparent to those skilled in the art that various changes and
modifications may be made without departing from the spirit and
scope of the invention as defined in the following claims.
* * * * *