U.S. patent application number 14/285322 was filed with the patent office on 2014-11-27 for polymer article and method for selective metallization of the same.
This patent application is currently assigned to SHENZHEN BYD AUTO R&D COMPANY LIMITED. The applicant listed for this patent is BYD COMPANY LIMITED, SHENZHEN BYD AUTO R&D COMPANY LIMITED. Invention is credited to Qing GONG, Weifeng MIAO, Wei ZHOU.
Application Number | 20140349030 14/285322 |
Document ID | / |
Family ID | 51932898 |
Filed Date | 2014-11-27 |
United States Patent
Application |
20140349030 |
Kind Code |
A1 |
GONG; Qing ; et al. |
November 27, 2014 |
POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE
SAME
Abstract
A method for selective metallization of a surface of a polymer
article is provided. The polymer article contains a base polymer
and at least one metal compound dispersed in the base polymer. The
method includes gasifying at least a part of a surface of the
polymer article by irradiating the surface with an energy source,
and forming at least one metal layer on the surface of the polymer
article by chemical plating. The metal compound contains a tin
oxide doped with at least one doping element selected from a group
including: V, Sb, In, and Mo.
Inventors: |
GONG; Qing; (Shenzhen,
CN) ; ZHOU; Wei; (Shenzhen, CN) ; MIAO;
Weifeng; (Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHENZHEN BYD AUTO R&D COMPANY LIMITED
BYD COMPANY LIMITED |
Shenzhen
Shenzhen |
|
CN
CN |
|
|
Assignee: |
SHENZHEN BYD AUTO R&D COMPANY
LIMITED
Shenzhen
CN
BYD COMPANY LIMITED
Shenzhen
CN
|
Family ID: |
51932898 |
Appl. No.: |
14/285322 |
Filed: |
May 22, 2014 |
Current U.S.
Class: |
427/555 ;
427/532; 524/406; 524/408; 524/430 |
Current CPC
Class: |
H05K 1/0373 20130101;
B29C 37/0025 20130101; C09D 11/03 20130101; H05K 2201/0236
20130101; C23C 18/1641 20130101; C08K 2003/2231 20130101; C08K
2003/2255 20130101; C01G 19/006 20130101; H05K 3/185 20130101; C01P
2002/50 20130101; H05K 2203/107 20130101; C01P 2004/61 20130101;
C23C 18/38 20130101; C01G 39/00 20130101; C23C 18/285 20130101;
C01G 30/002 20130101; H05K 3/107 20130101; B29C 2035/0877 20130101;
B29C 2035/0838 20130101; C23C 18/204 20130101; C08K 3/22 20130101;
B29C 2035/0872 20130101; C01G 19/02 20130101; H05K 2201/0218
20130101; C01P 2004/62 20130101; C01P 2004/64 20130101; H05K
2201/0215 20130101; C01P 2002/52 20130101; C01G 31/00 20130101;
C23C 18/1612 20130101; C23C 18/1608 20130101 |
Class at
Publication: |
427/555 ;
427/532; 524/408; 524/406; 524/430 |
International
Class: |
H05K 1/03 20060101
H05K001/03; H05K 3/10 20060101 H05K003/10 |
Foreign Application Data
Date |
Code |
Application Number |
May 23, 2013 |
CN |
201310195129.8 |
May 23, 2013 |
CN |
201310196611.3 |
Claims
1. A method for selective metallization of a surface of a polymer
article, wherein the polymer article comprises a base polymer and
at least one metal compound dispersed in the base polymer, the
method comprising: gasifying at least a part of a surface of the
polymer article by irradiating the surface with an energy source;
and forming at least one metal layer on the surface of the polymer
article by chemical plating, wherein based on the total weight of
the composition of the polymer article, the metal compound ranges
from about 1 wt % to about 3 wt %, the base polymer ranges from
about 97 wt % to about 99 wt %, and the metal compound comprises a
tin oxide doped with at least one doping element selected from a
group including: V, Sb, In, and Mo.
2. The method according to claim 1, wherein based on the total
amount of the metal compound, the tin oxide ranges from about 90
mol % to about 99 mol %, and the doping element is in a form of
oxide and the oxide of the doping element ranges from about 1 mol %
to about 10 mol %.
3. The method according to claim 1, wherein the tin oxide ranges
from about 92 mol % to about 98 mol %, and the oxide of the doping
element ranges from about 2 mol % to about 8 mol %.
4. The method according to claim 1, wherein the metal compound has
a volume average diameter ranging from about 50 nm to about 10
.mu.m.
5. The method according to any of claims 1, further comprising
forming the metal compound by sintering powders of the tin oxide
and a compound including the at least one doping element.
6. The method according claim 5, wherein the compound is selected
from a group including: V.sub.2O.sub.5, Sb.sub.2O.sub.3,
In.sub.2O.sub.3, and MoO.sub.3.
7. The method according claim 5, wherein the sintering is conducted
at a temperature ranging from about 800.degree. C. to about
1000.degree. C.
8. The method according to claim 1, wherein the energy source
includes a laser.
9. A polymer article comprising: a base polymer, and at least one
metal compound dispersed in the base polymer, wherein based on the
total weight of the polymer article the metal compound ranges from
about 1 wt % to about 3 wt %; and the metal compound comprises a
tin oxide doped with at least one doping element selected from a
group including: V, Sb, In, and Mo.
10. The method according to claim 9, wherein based on the total
amount of the metal compound, the tin oxide ranges from about 90
mol % to about 99 mol %, and the doping element is in a form of
oxide and the oxide of the doping element ranges from about 1 mol %
to about 10 mol %.
11. The polymer article according to claim 8, wherein the tin oxide
ranges from about 92 mol % to about 98 mol %, and the oxide of the
doping element ranges from about 2 mol % to about 8 mol %.
12. The polymer article according to claim 9, wherein the metal
compound is formed by sintering powders of the tin oxide and a
compound including the at least one doping element.
13. The polymer article according claim 10, wherein the compound is
selected from a group including: V.sub.2O.sub.5,
Sb.sub.2O.sub.3,1n.sub.2O.sub.3, and MoO.sub.3.
14. The polymer article according claim 12, wherein the sintering
is conducted at a temperature ranging from about 800.degree. C. to
about 1000.degree. C.
15. The polymer article according to claim 9, wherein the metal
compound has a volume average diameter ranging from about 50 nm to
about 10 .mu.m.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to and benefits of Chinese
Patent Application Nos. 201310196611.3 and 201310195129.8, both
filed with the State Intellectual Property Office of P. R. China on
May 23, 2013. The entire contents of the above-referenced
applications are incorporated herein by reference.
FIELD
[0002] The present disclosure relates to a surface metallization of
polymer, particularly to a polymer article and a method for surface
metallization of a surface of a polymer article.
BACKGROUND
[0003] Providing a metal layer on a selected area of a surface of a
polymer substrate in order to form a passage for transmitting
electro-magnetic signals is widely applied in the field of
automobile, computer, communications, and so on. The metal layer
can be formed on the surface of the polymer substrate in various
ways.
[0004] For example, U.S. Pat. No. 5,599,592 discloses a
metallization process for metallizing a plastic composite article
containing a polymer and grains of one or more metal oxides. The
method includes steps of: 1) irradiating the plastic article
surface to be metallized with a light beam emitted by an excimer
laser; 2) immersing the irradiated article into at least one
autocatalytic bath; 3) thermally processing the metallized plastic
article to induce the diffusion of the deposited metal into the
plastic article. The metal oxides may be oxides of antimony,
aluminum, iron, zinc or tin. It is disclosed in U.S. Pat. No.
5,599,592 that the content of the grains of metal oxides in the
plastic composite article can be in the range of 1% to 30% (by
weight). However, as described in embodiments of the specification
of U.S. Pat. No. 5,599,592, the contents of the grains of the metal
oxides in the plastic composite article are all above 4% by
volume.
SUMMARY
[0005] Embodiments of the present disclosure seek to solve at least
one of the problems existing in the prior art to at least some
extent, or to provide a consumer with a useful commercial
choice.
[0006] Embodiments of the present disclosure provide a method for
selective metallization of a surface of a polymer article. The
polymer article may contain a base polymer and at least one metal
compound dispersed in the base polymer. The method may include
steps of: gasifying at least a part of a surface of the polymer
article by irradiating the surface with an energy source; and
forming at least one metal layer on the surface of the polymer
article by chemical plating. In some embodiments, based on the
total weight of the polymer article, the content of the metal
compound ranges from about 1 wt % to about 3 wt %, the content of
the base polymer ranges from about 97 wt % to about 99 wt %. In
some embodiments, the metal compound contains a tin oxide doped
with at least one doping element selected from a group including:
V, Sb, In and Mo. In some embodiments, based on the total amount of
the metal compound, the content of the tin oxide ranges from about
90 mol % to about 99 mol %, and the doping element is in a form of
oxide and the oxide of the doping element ranges from about 1 mol %
to about 10 mol %.
[0007] According to embodiments of the present disclosure, the
metal compound has a light color. When the metal compound is
dispersed in the base polymer, it may not or substantially not
influence the color of the base polymer itself. In addition, the
metal compound has very strong adsorption power to the energy
source, therefore a predetermined part of the polymer article may
be removed with the irradiation of the energy source, even when the
content of the metal compound is relatively low. In this way, high
content of metal compound dispersed in the base polymer, which will
have severe consequence on the mechanical properties of the base
polymer, may be efficiently avoided.
[0008] According to embodiments of the present disclosure, the
metal compound may act as an accelerator for chemical plating
without being reduced to pure metal. In some embodiments, it only
needs to subject the polymer article to some simple surface
treatments, e.g. surface roughening, so that selective
metallization on the surface of the polymer article may be
achieved. In some embodiments, the surface roughening may be
performed by irradiating the surface of the polymer article with a
laser. The energy of the laser only needs to be sufficient for
removing the predetermined part of the polymer article and exposing
the metal compound in the predetermined surface, and it needs not
to be extremely high in order to reduce the metal compound into
pure metal. When the metal compound is exposed, the following
chemical plating may be performed directly on the irradiated
surface of the polymer article. The method for selective
metallization of the polymer article is simple and has low
requirements on the energy, therefore suitable for large scale
applications.
[0009] Embodiments of the present disclosure provide a polymer
article. The polymer article contains: a base polymer and at least
one metal compound dispersed in the base polymer. In some
embodiments, based on the total weight of the polymer article, the
content of the metal compound ranges from about 1 wt % to about 3
wt %. In some embodiments, the metal compound contains a tin oxide
doped with at least one doping element selected from a group
including: V, Sb, In and Mo. In some embodiments, based on the
total amount of the metal compound, the content of the tin oxide
ranges from about 90 mol % to about 99 mol %, and the doping
element is in a form of oxide and the oxide of the doping element
ranges from about 1 mol % to about 10 mol %.
[0010] According to embodiments of the present disclosure, the
metal compound may have a light color and may not or substantially
not influence the color of the polymer article itself. Then the
polymer article can have relative lighter colors as well. Such an
arrangement allows creating polymer articles for special
applications where polymer articles having lighter colors are
required. In addition, the metal compound has very strong
adsorption power to the energy source. Therefore the polymer
article may be used as a polymer substrate for selective
metallization, without the requirement of extremely high energy to
reduce the metal compound into pure metals as required in the
conventional process. A predetermined part of the polymer article
may be removed with the irradiation of the energy source, even when
the content of the metal compound is relatively low. In this way,
high content of metal compound dispersed in the base polymer, which
will have severe consequence on the mechanical properties of the
base polymer, may be efficiently avoided.
[0011] Additional aspects and advantages of embodiments of present
disclosure will be given in part in the following descriptions,
become apparent in part from the following descriptions, or be
learned from the practice of the embodiments of the present
disclosure.
DETAILED DESCRIPTION
[0012] Reference will be made in detail to embodiments of the
present disclosure. The embodiments described herein with reference
to drawings are explanatory, illustrative, and used to generally
understand the present disclosure. The embodiments shall not be
construed to limit the present disclosure.
[0013] For the purpose of the present description and of the
following claims, the definitions of the numerical ranges always
include the extremes unless otherwise specified.
[0014] According to embodiments of an aspect of the present
disclosure, a polymer article is provided. The polymer article may
contain: a base polymer and at least one metal compound dispersed
in the base polymer.
[0015] In some embodiments, based on the total weight of the
polymer article, the content of the metal compound ranges from
about 1 wt % to about 3 wt %, the content of the base polymer
ranges from about 97 wt % to about 99 wt %.
[0016] In some embodiments, the metal compound may contain a tin
oxide doped with at least one doping element selected from a group
including: V, Sb, In and Mo. In some embodiments, the doping
element is selected from V and/or Mo. In some embodiments, the
doping element is selected from In and/or Sb. In some embodiments,
the doping element is selected from In and/or Sb as well as at
least one selected from V and Mo.
[0017] In some embodiments, the metal compound contains an oxide of
In, an oxide of Sb, an oxide of V, and an oxide of Mo, and the
ratio between the total amount of oxides of In and Sb and the total
amount of oxides of V and Mo may be in the range of 1:1-0.1. In
some embodiments, the ratio may be in the range of 1:0.5-0.2.
[0018] According to embodiments of the present disclosure, the
doping element may be in the form of oxide in the metal compound.
In some embodiments, based on the total amount of the metal
compound (for example, the sum of the amount of the tin oxide and
the amount of the oxide of the doping element), the content of the
tin oxide ranges from about 90 mol % to about 99 mol %, and the
oxide of the doping element ranges from about 1 mol % to about 10
mol %.
[0019] In other words, the amount of the doping element is about 1
mol % to about 10 mol %, and the amount of the doping element is
obtained by the following formula:
molar amount of the oxide of the doping element/(molar amount of
the oxide of the doping element+molar amount of the tin oxide).
[0020] In some embodiments, the content of the tin oxide ranges
from about 92 mol % to about 98 mol %, and the oxide of the doping
element ranges from about 2 mol % to about 8 mol %.
[0021] The diameter of the metal compound may be any normal option
in the related art. In some embodiments, the metal compound may
have a volume average diameter ranging from about 50 nm to about 10
.mu.m. In some embodiments, the metal compound may have a volume
average diameter ranging from about 300 nm to about 5 .mu.m. In
some embodiments, the metal compound may have a volume average
diameter ranging from about 1 .mu.m to about 3.5 .mu.m. The volume
average diameter may be determined by a laser particle
analyzer.
[0022] According to some embodiments of the present disclosure, the
metal compound may have a light color. In an embodiment, the metal
compound is white.
[0023] The metal compound may be obtained by any conventional
method which is known in the art. In some embodiments, the metal
compound may be formed by sintering powders of the tin oxide and a
compound, and the compound includes the at least one doping
element. In some embodiments, the method further includes forming
the metal compound by sintering powders of the tin oxide and a
compound, wherein the compound comprises the at least one doping
element.
[0024] The compound may be oxides of the doping elements and/or a
compound precursor which is capable of forming the oxides of the
doping element via the sintering step. In some embodiments, the
oxides may be any normal compound formed by the doping element and
oxygen. For example, the oxide may be selected from:
V.sub.2O.sub.5, Sb.sub.2O.sub.3, In.sub.2O.sub.3 and MoO.sub.3. The
compound precursor may be hydroxides of the doping elements and/or
gels of the doping elements, for example, at least one selected
from a group consisting of: V hydroxide, gel containing V, Sb
hydroxide, gel containing Sb, In hydroxide, gel containing In, Mo
hydroxide and gel containing Mo.
[0025] In some embodiments, the compound may be selected from a
group consisting of: V.sub.2O.sub.5, Sb.sub.2O.sub.3,
In.sub.2O.sub.3 and MoO.sub.3.
[0026] There are no special limits for the composition of the
powders of the tin oxide and the compound, provided that the
contents of the tin oxide and the doping element in the prepared
polymer article are consistent with those described above.
[0027] There are no special limits for the diameter of the powders,
which may be normal options in the related art. In some embodiment,
the powders of the tin oxide and the compound have an average
particle diameter ranging from about 50 nm to about 10 .mu.m.
[0028] There are no special limits for the method for preparing the
powder of the tin oxide and the compound, which may be any normal
option in the related art. In some embodiments, the powders may be
obtained by grinding the tin oxide and the compound containing the
doping element. The grinding may be performed by a dry grinding
process, a wet grinding process, or a semi-dry grinding
process.
[0029] In some embodiments, the wet grinding process may be carried
out using a dispersant. The dispersant may be any normally used
dispersant in a conventional grinding process. In some embodiments,
the dispersant may be water and/or C.sub.1-C.sub.5 alcohol, for
example, ethanol. The amount of the dispersant is known in the
art.
[0030] In some embodiments, the powders may be obtained by a wet
grinding process or a semi-dry grinding process. The wet grinding
process and the semi-dry grinding process may further include a
drying step. The drying may be carried out with a normal drying
process. In some embodiments, the drying is carried out at a
temperature ranging from about 40.degree. C. to about 120.degree.
C. In some embodiments, the drying may be carried out under an
atmosphere containing oxygen, or under a non-reactive atmosphere.
In some embodiments, the atmosphere containing oxygen may be air or
a combination of oxygen and a non-reactive gas. The non-reactive
gas may refer to any gas which may not react chemically with the
components of the powders or the prepared metal compound. For
example, the non-reactive gas may be those selected from group 0 of
the periodic table or nitrogen. In some embodiment, the
non-reactive gas may be argon.
[0031] In some embodiments, the sintering may be conducted at a
temperature ranging from about 800.degree. C. to about 1000.degree.
C. In some embodiments, the sintering may be conducted at a
temperature ranging from about 850.degree. C. to about 950.degree.
C. The condition for sintering may be selected according to the
sintering temperature, and the sintering may be performed for a
time period ranging from about 1 hour to 6 hours.
[0032] In some embodiments, the sintering may be carried out under
an atmosphere containing oxygen. In some embodiments, the sintering
may be carried out under a non-reactive atmosphere. In an
embodiment, the compound may form an oxide precursor via sintering,
and the sintering is performed under the atmosphere containing
oxygen.
[0033] In some embodiments, the sintered powders may be subjected
to a second grinding step. Therefore, the particle diameter of the
further sintered powder may be further reduced and the metal
compound may satisfy the following application requirements. In
some embodiments, with the two sintering steps, the metal compound
may have a volume average diameter ranging from about 50 nm to
about 10 .mu.m. In some embodiments, the metal compound may have a
volume average diameter ranging from about 300 nm to about 5 .mu.m.
In some embodiments, the metal compound may have a volume average
diameter ranging from about 1 .mu.m to about 3.5 .mu.m. The further
grinding may be performed by at least one process selected from a
group including: a dry grinding process, a wet grinding process,
and a semi-dry grinding process.
[0034] In some embodiments, the further grinding process may be
carried out by using a dispersant. The dispersant may be of any
normal option in a conventional grinding process. In an embodiment,
the dispersant may be water and/or C.sub.1-C.sub.5 alcohol, for
example, ethanol. The amount of dispersant may be of any normal
options in the art.
[0035] In some embodiments, based on the total weight of the
polymer article, the content of the metal compound may vary from
about 1 wt % to about 3 wt %. With this amount of metal compound
dispersed in the base polymer, the polymer article may maintain an
excellent mechanical performance of the base polymer, especially
compact toughness. In addition, when the polymer article is
irradiated with an energy source in order to remove a portion of
the polymer and expose the metal compound, the metal compound may
act as a chemical plating accelerator.
[0036] In some embodiments, the base polymer may be any
conventional molded polymers known to those having ordinary skill
in the art, and may be chosen according to practical use. In some
embodiments, the base polymer may be a thermoplastic polymer or a
thermosetting polymer. In an embodiment, the base polymer may be at
least one selected from a group including: plastic, rubber, and
fiber.
[0037] By way of example and without limits, in some embodiments
the polymer may be at least one selected from a group including:
polyolefin, such as polystyrene, polypropylene, poly(methyl
methacrylate), poly(acrylonitrile-butadiene-styrene);
polycarbonate; polyester, such as poly(cyclohexyl-paradimethylene
terephthalate), poly(diallyl isophthalate), poly(diallyl
teraphthalate), poly(butylene naphthalate), poly(ethylene
terephthalate), poly(butylene terephthalate); polyamide, such as
poly(hexamethylene adipamide), poly(hexamethylene azelamide),
poly(hexamethylene succinamide), poly(hexamethylene lauramide),
poly(hexamethylene sebacamide), poly(decamethylene sebacamide),
poly(undecanoic amide), poly(lauramide), poly(octanamide),
poly(9-arninononanoic acid), polycaprolactam, poly(paraphenylene
phthalamide), poly(isophenylene phthalamide), poly(paraphenylene
adipamide), poly(paraphenylene azelamide); poly(aromatic ether);
polyether imide; polycarbonate/(acrylonitrile-butadiene-styrene)
alloy; polyphenylene oxide; polyphenylene sulfide; polyimide;
polysulfone; poly(ether-ether-ketone); polybenzimidazole; phenol
formaldehyde resin; urea formaldehyde resin; melamine-formaldehyde
resin; epoxide resin; alkyd resin and polyurethane.
[0038] In some embodiments, the polymer article may further contain
at least one additive. In some embodiments, the additive can be,
for example, filler, antioxidant, light stabilizer and so on. By
the addition of the additive, the performance and property of the
polymer article may be improved. There are no special limits for
the content and the type of the additive. The additive can have a
light colour. The additive may be selected according to, for
example, practical requirements.
[0039] The filler used as the additive to the polymer article may
be any filler which is non-reactive under the effect of laser
(either physically or chemically). In some embodiments, the filler
may be at least one selected from tal and/or calcium carbonate.
[0040] In some embodiments, the filler may be glass fiber. With the
addition of glass fiber, the thickness of the removed base polymer
(in other words, the distance from the top surface of the polymer
article to the exposed metal compound) may be significantly
increased, which may facilitate the deposition of metal onto the
metal compound during the following chemical plating process.
[0041] In some embodiments, the filler may also be selected from
micro glass bead, calcium sulfate, barium sulfate, titanium
dioxide, pearl powder, wollastonite, diatomite, caoline, coal
fines, pot clay, mica, oil shale ash, aluminum silicate, alumina,
silica and zinc oxide. In an embodiment, the filler may be titanium
dioxide and the brightness of the polymer article may be further
increased.
[0042] The antioxidant used as the additive to the polymer article
may be any conventional antioxidant in the related art. In some
embodiments, the antioxidant may contain a primary antioxidant and
a secondary antioxidant. The ratio between the primary antioxidant
and the secondary antioxidant may be appropriately selected
according to, for example, the type of the antioxidant. In some
embodiments, the weight ratio between the primary antioxidant and
the secondary antioxidant may be about 1:1-4.
[0043] In some embodiments, the primary antioxidant may be a
hindered phenol antioxidant. By way of example but without limits,
in some embodiments, the primary antioxidant may be antioxidant
1098 or antioxidant 1010, in which the antioxidant 1098 mainly
contains
N,N'-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)hexane
diamine and the antioxidant 1010 mainly contains
tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic
acid]pentaerythritol.
[0044] In some embodiments, the secondary antioxidant may be a
phosphite ester antioxidant. By way of example and without limits,
in some embodiments, the secondary antioxidant may be antioxidant
168, which mainly contains
tri(2,4-di-tert-butyl-phenyl)phosphorite.
[0045] In some embodiments, the light stabilizer used as the
additive to the polymer article may be of the hindered amine type.
In some embodiments, the light stabilizer may be
bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate. The light stabilizer
may be any known ones in the art, without special limits in the
present disclosure.
[0046] In some embodiments, the amount of the additive may be
appropriately selected according to functions and types of the
additives. In some embodiments, based on 100 weight parts of the
polymer article, the content of the filler may range from 1 weight
part to 40 weight parts, the content of the antioxidant may range
from about 0.01 weight parts to about 1 weight parts, the content
of the light stabilizer may range from about 0.01 weight parts to
about 1 weight part, and the content of the lubricant may range
from about 0.01 weight parts to about 1 weight part.
[0047] In some embodiments, the polymer article may be prepared
with the following steps: a mixture containing a base polymer and
at least one of the above-identified metal compound is mixed to
form a polymer composition, and then the composition is molded.
[0048] In some embodiments, the above-identified additive may be
used to improve the performance of the base polymer and provide the
base polymer with a new performance. In some embodiments, the base
polymer may further contain an additive for improving the
processing performance of the base polymer, such as a
lubricant.
[0049] In some embodiments, the lubricant may be at least one
selected from a group including: ethylene/vinyl acetate copolymer
(EVA wax), polyethylene (PE wax) and stearate. With the addition of
the lubricant, the flowing performance of the polymer article may
be improved.
[0050] In some embodiments, the molding step may be performed by
any conventional molding process known in the art, without special
limits in the present disclosure. In some embodiments, the molding
step is performed by injection molding. In another embodiment, the
molding step is performed by extrusion molding.
[0051] Embodiments of another aspect of the present disclosure
provide a method for selective metallization of a surface of a
polymer article. The polymer article may contain a base polymer and
at least one metal compound dispersed in the base polymer. The
method may include steps of: gasifying at least a part of a surface
of the polymer article by irradiating the surface with an energy
source; and forming at least one metal layer on the surface of the
polymer article by chemical plating. In some embodiments, based on
the total weight of the polymer article, the content of the metal
compound ranges from about 1 wt % to about 3 wt %, the content of
the base polymer ranges from about 97 wt % to about 99 wt %. In
some embodiments, the metal compound contains a tin oxide doped
with at least one doping element selected from a group including:
V, Sb, In and Mo. In some embodiments, based on the total amount of
the metal compound, the content of the tin oxide ranges from about
90 mol % to about 99 mol %, and the doping element is in a form of
oxide and the oxide of the doping element ranges from about 1 mol %
to about 10 mol %.
[0052] In other words, the amount of the doping element is about 1
mol % to about 10 mol %, and the amount of the doping element is
obtained by the following formula:
molar amount of the oxide of the doping element/(molar amount of
the oxide of the doping element +molar amount of the tin
oxide).
[0053] In some embodiments, the method for selective metallization
of a surface of a polymer article may include steps of: providing a
polymer composition containing a base polymer and at least one
metal compound dispersed in the base polymer; forming the polymer
article by molding the polymer composition; gasifying at least a
part of a surface of the polymer article by irradiating the surface
with an energy source; and forming at least one metal layer on the
surface of the polymer article by chemical plating.
[0054] According to embodiments of the present disclosure, the base
polymer in a predetermined area of the surface of the polymer
article may be removed and the metal compound in the predetermined
area may be exposed by the irradiating step. In the following
chemical plating step, metals may be deposited on the metal
compound in the predetermined area of the polymer article, by which
at least one metal layer may be formed on the predetermined area of
the polymer article. In this way, selective metallization of the
polymer article may be achieved.
[0055] The inventors have found that, selective metallization an
insulative substrate like plastic may be achieved by dispersing
metal oxides into an insulative substrate, irradiating a surface of
the insulative substrate to be metallized followed by chemical
plating. When the metal oxide has relatively dark color, the dark
color of the metal oxide may conflict with or influence the color
of the insulative substrate. However, if a metal oxide having a
lighter color is used, due to the poor light absorption capability
of the lighter metal oxide, the energy of from the energy source
cannot be absorbed efficiently by the polymer article. In this
condition, the base polymer in the predetermined area of the
surface of the polymer article may not be removed rapidly and
completely. Worse still, a porous surface may be formed. Moreover,
the active sites formed for the following chemical plating step may
not be sufficient, and then the requirements for the chemical
plating step may hardly met. Therefore, it is believed that the
requirements for the following chemical plating (i.e. removing the
base polymer in the predetermined area and forming enough active
sites on the metal oxide) may be satisfied with higher amount of
the metal oxide or higher energy.
[0056] The inventors have found that, the tin oxide doped with at
least one doping element selected from a group including V. Sb, In
and Mo may have a lighter color and stronger light absorption
capability than that of a conventional tin oxide. Further, with the
doped tin oxide, the base polymer in the predetermined area of the
polymer article may be removed even with lower amount of the doped
tin oxide. As the amount of the tin oxide is lower, negative
impacts on the mechanical property of the polymer article due to
high content of metal additive may be efficiently prevented. In
addition, the metal compound may be used as the chemical plating
accelerator (also referred as catalyst) in the following chemical
plating step, without reducing the metal compound into pure metals.
In other words, even the surface of the polymer article is
irradiated with relatively lower energy, the chemical plating step
may be performed successfully. Then the polymer article may be
obtained.
[0057] The base polymer, metal compound and the polymer article are
all described in details in the above, therefore detailed
description thereof is omitted herein.
[0058] In some embodiments, the energy source may be at least one
selected from a group including: laser, electron beam and ion beam.
In an embodiment, the energy source is a laser. The energy provided
by the laser must ensure the base polymer in the irradiated area of
the surface of the polymer article is gasified and the metal
compound in the irradiated area is exposed. The metal compound has
excellent absorption capability to energy provided by the energy
source, thus the base polymer in the predetermined area may be
removed and the metal compound in the predetermined area may be
exposed, even irradiating with the energy source which provides
relatively lower energy.
[0059] In some embodiments, the gasifying step may be performed by
using a laser, and the laser may have a wavelength of 157-10600 nm
and a power of 1-100 W. In an embodiment, the laser may have a
wavelength of 1064-10600 nm and a power of 3-50 W. In another
embodiment, the laser may have a wavelength of 1064 nm and a power
of 3-40 W. In a further embodiment, the laser may have a wavelength
of 1064 nm and a power of 5-20 W. The predetermined area of the
surface of the polymer article may form a pattern, then the metal
layer formed on the predetermined area may form a metal pattern on
the polymer article. With the laser, the precision of the metal
pattern may be improved.
[0060] In some embodiments, the gasifying step may be performed by
using an electron beam, and the electron beam may have a power
density of 10-10.sup.11 W/cm.sup.2.
[0061] In some embodiments, the gasifying step may be performed by
using an ion beam, and the ion beam may have an energy of
10-10.sup.6 eV.
[0062] The chemical plating is well known to person having ordinary
skill in the art. In some embodiments, the chemical plating may be
carried out with the following steps. The polymer article subjected
to the irradiating is immersed in a Cu solution. In some
embodiments, the Cu solution may contain a Cu salt. In some
embodiments, the Cu solution may further contain a reducing agent.
In some embodiments, the Cu solution may have a pH ranging from
about 12 to about 13. In some embodiments, the reducing agent may
reduce the Cu ions in the Cu salt into Cu metal. In some
embodiments, the reducing agent may be at least one selected from a
group including: glyoxylic acid, diamide, and sodium
phosphorate.
[0063] In some embodiments, the method may further include a step
of electroplating or chemical plating. The electroplating or
chemical plating may be performed for at least one time, so that
additional metal layers, either of the same metal as or of
different metals from the prior metal layers, may be formed on the
prior metal layers. In some embodiments, a Cu layer is formed on
the surface of the polymer article in the first chemical plating
step, then a Ni layer is formed on the Cu layer in the following
electroplating or chemical plating. With the additional Ni layer,
oxidation of the Cu layer may be prevented.
[0064] It will be understood that the features mentioned above and
those still to be explained hereinafter may be used not only in the
particular combination specified but also in other combinations or
on their own, without departing from the scope of the present
invention.
[0065] Some illustrative and non-limiting examples are provided
hereunder for a better understanding of the present invention and
its practical embodiments.
Testing Method
[0066] Samples of the metal compounds and the polymer articles
obtained from the following Examples and Comparative Examples were
subjected to the following tests.
Composition
[0067] In the following Examples and Comparative Examples, the
composition of the metal compound was measured by an Inductively
Coupled Plasma--Atomic Emission Spectrometry (ICP-AES).
Volume Average Diameter
[0068] In the following Examples and Comparative Examples, the
volume average diameter of the metal compound was measured by a
Laser Particle Sizer commercially available from Chengdu Jingxin
Powder Analyse Instrument Co., Ltd., China.
Adhesion
[0069] In the following Examples and Comparative Examples, the
adhesion between the metal layer and the base polymer was
determined by a cross-cut process. Specifically, a surface of the
sample to be measured was cut using a cross-cut knife to form 100
grids (1 mm.times.1 mm). A gap between adjacent grids was formed to
reach the bottom of the metal layer. Debris in the test region was
cleaned using a brush, and then an adhesive tape (3M600 gummed
paper) was sticked to a tested grid. One end of the sticked
adhesive paper was rapidly torn off in a vertical direction. Two
identical tests were performed on the same grid region. The grade
of the adhesion was determined according to the following
standard:
[0070] Grade 5B: the cut edge is smooth and the metal layers both
at the cut edge and cut intersection of the grid does not fall
off;
[0071] Grade 4B: the metal layers at the cut intersection are
partly removed, but no more than 5% (area percent) of the metal
layers are removed;
[0072] Grade 3B: the metal layers both at the cut edge and the cut
intersection are partly removed, and 5-15% (area percent) of the
metal layers are removed;
[0073] Grade 2B: the metal layers at both the cut edge and the cut
intersection are partly removed, and 15-35% (area percent) of the
metal layers are removed;
[0074] Grade 1B: the metal layers at both the cut edge and the cut
intersection are partly removed, and 35-65% (area percent) of the
metal layers are removed;
[0075] Grade 0B: the metal layers at both the cut edge and the cut
intersection are partly removed, and more than 65% (area percent)
of the metal layers are removed.
[0076] The results are shown in Table 1.
Notch Impact Strength
[0077] In the following Examples and Comparative Examples, the
notch impact strength of the polymer article was measured according
to ASTM D256. For each sample, 5 testing points were tested and 5
results were recorded, and the value of the notch impact strength
was recorded as the average of the 5 results.
Chemical Plating Accelerator
[0078] In the following Examples and Comparative Examples, the
method for determining whether the metal compound can act as the
chemical plating accelerator includes the following steps.
[0079] 1) 50 g of the metal compound, 20 g of binder material
CAB381-0.5 (commercially available from Eastman Chemical Company,
US), 100 g of n-ethanol, 2 g of dispersing agent DISPERBYK-165
(commercially available from BYK Company, GE), 0.2 g of antifoaming
agent BYK-051 (commercially available from BYK Company, GE), 0.4 g
of leveling agent BYK-333 (commercially available from BYK Company,
GE) and 0.5 g of hydrogenated castor oil (commercially available
from Wuhan Jinnuo Chemical Company, China) were mixed uniformly to
obtain an ink composition.
[0080] 2) The ink composition obtained from the step 1) was applied
on a surface of an Al.sub.2O.sub.3 ceramic substrate by ink jet
printing, and then the Al.sub.2O.sub.3 ceramic substrate was dried
at 120.degree. C. for 3 hours. Then, an ink layer was formed on the
surface of the Al.sub.2O.sub.3 ceramic substrate, which was formed
as a pattern on the Al.sub.2O.sub.3 ceramic substrate and could be
used as an antenna for a receiver.
[0081] 3) The ceramic substrate obtained from the step 2) was
subjected to chemical plating using a Cu solution containing: 0.12
mol/L of CuSO.sub.4.5H.sub.2O, 0.14 mol/L of
Na.sub.2EDTA.2H.sub.2O, 10 mg/L of potassium ferrocyanide, 10 mg/L
of 2,2'-bipyridine and 0.10 mol/L of glyoxylic acid. The Cu
solution had a temperature of 50.degree. C. and a pH ranging in
12.5-13, which is adjusted with NaOH and H.sub.2SO.sub.4.
[0082] Then the surface of the ceramic substrate which had been
subjected to the chemical plating was observed. If metals had been
deposited on the surface of the ceramic substrate and formed a
complete pattern (circuit), then it is indicated that the metal
compound can be used as chemical plating accelerator. If the
deposited metals cannot form a complete pattern (circuit) on the
surface of the ceramic substrate or even no metal is deposited on
the surface of the ceramic substrate, then it is indicated that the
metal compound cannot be used as chemical plating accelerator.
EXAMPLES
Example 1 (E1)
[0083] 1) Particles of SnO.sub.2 were grinded in a grinding mill
for 4 h together with V.sub.2O.sub.5 and ethanol, to form a first
mixture. Based on 100 weight parts of SnO.sub.2 and V.sub.2O.sub.5,
the content of ethanol was 150 weight parts. Based on the total
amount of SnO.sub.2 and V.sub.2O.sub.5, the content of
V.sub.2O.sub.5 was 10 mol %. The first mixture was dried under an
air atmosphere at 80.degree. C. for 2 h, thus obtaining a second
mixture having a volume average particle diameter of 1 .mu.m. The
second mixture was calcined under an air atmosphere at 900.degree.
C. for 5 h and grinded to white powders having a volume average
particle diameter of 1.5 .mu.m. After tested, the white powders
included doped tin oxide with a content of V.sub.2O.sub.5 being 10
mol %.
[0084] 2) The white powders of doped tin oxide were mixed with
polycarbonate (PC) to form a third mixture, and then the third
mixture was extruded and pelleted with an extruder to form pellets.
The pellets were injection molded in an injection mould, thus
forming a PC sheet containing the doped tin oxide. Based on the
total weight of the doped tin oxide and the PC, the content of the
doped tin oxide was 3 wt %. The PC sheet was subjected to an impact
strength test, and the results were recorded in Table 1.
[0085] 3) A surface of the PC sheet was irradiated with a laser
provided by a YAG laser, to remove PC on a predetermined area
(corresponding to the structure of a receiver) of the surface of
the PC sheet. The laser had a wavelength of 1064 nm, a power of 5
W, a frequency of 30 kHz, a scanning speed of 1000 mm/s and a
filling distance of 30 .mu.m.
[0086] 4) The PC sheet obtained from the step 3) was subjected to
chemical plating by using a Cu solution, thus forming a metal layer
on the predetermined area of the surface of the PC sheet. The metal
layer may be used as an antenna. The Cu solution contained: 0.12
mol/L of CuSO.sub.4.5H.sub.2O, 0.14 mol/L of Na.sub.2EDTA.
2H.sub.2O, 10 mg/L of potassium ferrocyanide, 10 mg/L of
2,2'-bipyridine and 0.10 mol/L of glyoxylic acid. The Cu solution
had a temperature of 50.degree. C. and a pH ranging in 12.5-13
which is adjusted with NaOH and H.sub.2SO.sub.4. Then the PC sheet
formed with the metal layer was observed, and it was found that the
metal layer formed a complete circuit on the PC sheet. The plating
speed and adhesion between the metal layer and the PC were both
listed in Table 1.
COMPARATIVE EXAMPLE 1 (CE1)
[0087] 1) Tin oxide was mixed with PC to form a third mixture, and
then the third mixture was extruded and pelleted with the same
condition as described in the step 2) of Example 1, thus forming a
PC sheet containing tin oxide. Based on the total weight of the tin
oxide and the PC, the content of the tin oxide was 3 wt %.
[0088] 2) The PC sheet obtained from the step 2) was irradiated
with a laser under the same condition as described in the step 3)
of Example 1.
[0089] 3) The PC sheet obtained from the step 3) was subjected to a
chemical plating under the same condition as described in the step
4) of Example 1. It was observed that, it was not capable of
forming a complete metal circuit on the PC sheet.
COMPARATIVE EXAMPLE 2 (CE2)
[0090] 1) Tin oxide was mixed with PC to form a third mixture, and
then the third mixture was extruded and pelleted with the same
condition as described in the step 2) of Example 1, thus forming a
PC sheet containing tin oxide. Based on the total weight of the tin
oxide and the PC, the content of the tin oxide was 10 wt %, i.e.
1.85 vol %. The PC sheet was subjected to an impact strength test,
and the results were recorded in Table 1.
[0091] 2) The PC sheet obtained from the step 2) was irradiated
with a laser under the same condition as described in the step 3)
of Example 1.
[0092] 3) The PC sheet obtained from the step 3) was subjected to a
chemical plating under the same condition as described in the step
4) of Example 1. It was observed that, a complete metal circuit was
formed on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
COMPARATIVE EXAMPLE 3 (CE3)
[0093] The present example included substantially the same steps 1)
to 4) as those of Example 1, with the exception that: in the step
2), based on the total weight of the doped tin oxide and the PC
sheet, the content of the doped tin oxide was 5 wt %. It was
observed that, a complete metal circuit was formed on the PC sheet.
The plating speed, adhesion and impact strength were all listed in
Table 1.
EXAMPLE 2 (E2)
[0094] 1) Particles of SnO.sub.2 were grinded in a grinding mill
for 2 h together with MoO.sub.3 and ethanol, to form a first
mixture. Based on 100 weight parts of SnO.sub.2 and MoO.sub.3, the
content of ethanol was 160 weight parts. Based on the total amount
of SnO.sub.2 and MoO.sub.3, the content of MoO.sub.3 was 10 mol %.
The first mixture was dried under an air atmosphere at 80.degree.
C. for 3 h, thus obtaining a second mixture having a volume average
particle diameter of 2.6 .mu.m. The second mixture was calcined
under an air atmosphere at 950.degree. C. for 5 h and grinded to
white powders having a volume average particle diameter of 1.6
.mu.m. After tested, the white powders included doped tin oxide
with a content of MoO.sub.3 being 10 mol %.
[0095] 2) The white powders of doped tin oxide were mixed with PC
to form a third mixture, and then the third mixture was extruded
and pelleted with an extruder to form pellets. The pellets were
injection molded in an injection mould, thus forming a PC sheet
containing the doped tin oxide. Based on the total weight of the
doped tin oxide and the PC, the content of the doped tin oxide was
3 wt %. The PC sheet was subjected to an impact strength test, and
the results were recorded in Table 1.
[0096] 3) A surface of the PC sheet was irradiated with a laser
under the same condition as described in the step 3) of Example
1.
[0097] 4) The PC sheet obtained from the step 3) was subjected to
chemical plating under the same condition as described in the step
4) of Example 1. Then the PC sheet formed with the metal layer was
observed, and it was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
COMPARATIVE EXAMPLE 4 (CE4)
[0098] The present example included substantially the same steps 1)
to 4) as those of Example 2, with the exception that: in the step
1), the same amount of Ga.sub.2O.sub.3 was used instead of
MoO.sub.3. It was observed that, it was not capable of forming a
complete metal circuit on the PC sheet.
EXAMPLE 3 (E3)
[0099] 1) The step of preparing the doped tin oxide was
substantially the same with the step 1) of Example 2, with the
exception that: the amount of MoO.sub.3 was 8 mol %. After tested,
the white powders was proved to be doped tin oxide with a content
of MoO.sub.3 being 8 mol %.
[0100] 2) The step of preparing the PC sheet was substantially the
same with the step 2) of Example 2, with the exception that: the
doped tin oxide was those obtained from the step 1) of Example 3.
The PC sheet was subjected to an impact strength test, and the
results were recorded in Table 1.
[0101] 3) The step of irradiating the PC sheet was substantially
the same with the step 3) of Example 2, with the exception that:
the PC sheet was obtained from the step 2) of Example 3.
[0102] 4) The step of chemical plating was substantially the same
with the step 4) of Example 2, with the exception that: the PC
sheet was obtained from the step 3) of Example 3. The PC sheet
formed with the metal layer was observed, and it was found that the
metal layer formed a complete circuit on the PC sheet. The plating
speed and adhesion between the metal layer and the PC were both
listed in Table 1.
EXAMPLE 4 (E4)
[0103] 1) Particles of SnO.sub.2 were grinded in a grinding mill
for 5 h together with V.sub.2O.sub.5 and ethanol, to form a first
mixture. Based on 100 weight parts of SnO.sub.2 and V.sub.2O.sub.5,
the content of ethanol was 120 weight parts. Based on the total
amount of SnO.sub.2 and V.sub.2O.sub.5, the content of
V.sub.2O.sub.5 was 1 mol %. The first mixture was dried under a
nitrogen atmosphere at 100.degree. C. for 6 h, thus obtaining a
second mixture having a volume average particle diameter of 1.8
.mu.m. The second mixture was calcined under an air atmosphere at
850.degree. C. for 6 h and grinded to white powders having a volume
average particle diameter of 1.2 .mu.m. After tested, the white
powders was proved to be doped tin oxide with a content of
V.sub.2O.sub.5 being 1 mol %.
[0104] 2) The white powders of doped tin oxide were mixed with PC
to form a third mixture, and then the third mixture was extruded
and pelleted with an extruder to form pellets. The pellets were
injection molded in an injection mould, thus forming a PC sheet
containing the doped tin oxide. Based on the total weight of the
doped tin oxide and the PC, the content of the doped tin oxide was
3 wt %. The PC sheet was subjected to an impact strength test, and
the results were recorded in Table 1.
[0105] 3) A surface of the PC sheet obtained from the step 2) was
irradiated with a laser provided by a YAG laser, to remove PC on a
predetermined area (corresponding to the structure of a receiver)
of the surface of the PC sheet. The laser had a wavelength of 1064
nm, a power of 20 W, a frequency of 30 kHz, a scanning speed of 800
mm/s and a filling distance of 25 .mu.m.
[0106] 4) The PC sheet obtained from the step 3) was subjected to
chemical plating under the same condition as described in the step
4) of Example 1. Then the PC sheet formed with the metal layer was
observed, and it was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
EXAMPLE 5 (E5)
[0107] 1) The step of preparing the doped tin oxide was
substantially the same with the step 1) of Example 4, with the
exception that: the amount of V.sub.2O.sub.5 was 2 mol %. After
tested, the white powders was proved to be doped tin oxide with a
content of V.sub.2O.sub.5 being 2 mol %.
[0108] 2) The step of preparing the PC sheet was substantially the
same with the step 2) of Example 4, with the exception that: the
doped tin oxide was those obtained from the step 1) of Example 5.
The PC sheet was subjected to an impact strength test, and the
results were recorded in Table 1.
[0109] 3) The step of irradiating the PC sheet was substantially
the same with the step 3) of Example 4, with the exception that:
the PC sheet was obtained from the step 2) of Example 5.
[0110] 4) The step of chemical plating was substantially the same
with the step 4) of Example 4, with the exception that: the PC
sheet was obtained from the step 3) of Example 5. The PC sheet
formed with the metal layer was observed, and it was found that the
metal layer formed a complete circuit on the PC sheet. The plating
speed and adhesion between the metal layer and the PC were both
listed in Table 1.
EXAMPLE 6 (E6)
[0111] 1) Particles of Sn0.sub.2 were grinded in a grinding mill
for 4 h together with MoO.sub.3, V.sub.2O.sub.5 and ethanol, to
form a first mixture. Based on 100 weight parts of SnO.sub.2,
MoO.sub.3 and V.sub.2O.sub.5, the content of ethanol was 200 weight
parts. Based on the total amount of SnO.sub.2, MoO.sub.3 and
V.sub.2O.sub.5, the content of MoO.sub.3 was 1.8 mol %, the content
of V.sub.2O.sub.5 was 2.5 mol %. The first mixture was dried under
an air atmosphere at 120.degree. C. for 4 h, thus obtaining a
second mixture having a volume average particle diameter of 3.8 m.
The second mixture was calcined under an air atmosphere at
920.degree. C. for 4 h and grinded to white powders having a volume
average particle diameter of 3.2 .mu.m. After tested, the white
powders was proved to be doped tin oxide with a content of
MoO.sub.3 being 1.8 mol % and a content of V.sub.2O.sub.5 being 2.5
mol %.
[0112] 2) The white powders obtained from the step 1) were mixed
with PC and TiO.sub.2 (having a volume average diameter of 2.1
.mu.m) to form a third mixture, and then the third mixture was
extruded and pelleted with an extruder to form pellets. The pellets
were injection molded in an injection mould, thus forming a PC
sheet containing the doped tin oxide. Based on the total weight of
the doped tin oxide, TiO.sub.2 and the PC, the content of the doped
tin oxide was 1.8 wt %, the content of the TiO.sub.2 was 2 wt %.
The PC sheet was subjected to an impact strength test, and the
results were recorded in Table 1.
[0113] 3) The PC sheet obtained from the step 2) was irradiated
with a laser under the same condition as described in the step 3)
of Example 1.
[0114] 4) The PC sheet obtained from the step 3) was subjected to
chemical plating under the same condition as described in the step
4) of Example 1. Then the PC sheet formed with the metal layer was
observed, and it was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
EXAMPLE 7 (E7)
[0115] The present example included substantially the same steps 1)
to 4) as those of Example 1, with the exception that: in the step
1), the same amount of In.sub.2O.sub.3 was used instead of
V.sub.2O.sub.5. It was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
EXAMPLE 8 (E8)
[0116] The present example included substantially the same steps 1)
to 4) as those of Example 1, with the exception that: in the step
1), the same amount of Sb.sub.2O.sub.3 was used instead of
V.sub.2O.sub.5. It was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
EXAMPLE 9 (E9)
[0117] 1) Particles of SnO.sub.2 were grinded in a grinding mill
for 4 h together with MoO.sub.3, Sb.sub.2O.sub.3 and ethanol, to
form a first mixture. Based on 100 weight parts of SnO.sub.2,
Sb.sub.2O.sub.3 and V.sub.2O.sub.5, the content of ethanol was 200
weight parts. Based on the total amount of SnO.sub.2,
Sb.sub.2O.sub.3 and V.sub.2O.sub.5, the content of MoO.sub.3 was
1.2 mol %, the content of Sb.sub.2O.sub.3 was 5.6 mol %. The first
mixture was dried under an air atmosphere at 80.degree. C. for 4 h,
thus obtaining a second mixture having a volume average particle
diameter of 3.1 .mu.m. The second mixture was calcined under an air
atmosphere at 920.degree. C. for 4 h and grinded to white powders
having a volume average particle diameter of 2.6 .mu.m. After
tested, the white powders was proved to be doped tin oxide with a
content of MoO.sub.3 being 1.2 mol % and a content of
Sb.sub.2O.sub.3 being 5.6 mol %.
[0118] 2) The white powders obtained from the step 1) were mixed
with PC to form a third mixture, and then the third mixture was
extruded and pelleted with an extruder to form pellets. The pellets
were injection molded in an injection mould, thus forming a PC
sheet containing the doped tin oxide. Based on the total weight of
the doped tin oxide and the PC, the content of the doped tin oxide
was 2.8 wt %. The PC sheet was subjected to an impact strength
test, and the results were recorded in Table 1.
[0119] 3) The PC sheet obtained from the step 2) was irradiated
with a laser under the same condition as described in the step 3)
of Example 1.
[0120] 4) The PC sheet obtained from the step 3) was subjected to
chemical plating under the same condition as described in the step
4) of Example 1. Then the PC sheet formed with the metal layer was
observed, and it was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
EXAMPLE 10 (E 10)
[0121] 1) Particles of SnO.sub.2 were grinded in a grinding mill
for 4 h together with MoO.sub.3, In.sub.2O.sub.3 and ethanol, to
form a first mixture. Based on 100 weight parts of SnO.sub.2,
MoO.sub.3 and In.sub.2O.sub.3, the content of ethanol was 200
weight parts. Based on the total amount of SnO.sub.2, MoO.sub.3 and
In.sub.2O.sub.3, the content of MoO.sub.3 was 1.8 mol %, the
content of In.sub.2O.sub.3 was 6.9 mol %. The first mixture was
dried under an air atmosphere at 120.degree. C. for 4 h, thus
obtaining a second mixture having a volume average particle
diameter of 4.2 .mu.m. The second mixture was calcined under an air
atmosphere at 900.degree. C. for 6 h and grinded to white powders
having a volume average particle diameter of 2.5 .mu.m. After
tested, the white powders was proved to be doped tin oxide with a
content of MoO.sub.3 being 1.8 mol % and a content of
In.sub.2O.sub.3 being 6.9 mol %.
[0122] 2) The white powders obtained from the step 1) were mixed
with PC to form a third mixture, and then the third mixture was
extruded and pelleted with an extruder to form pellets. The pellets
were injection molded in an injection mould, thus forming a PC
sheet containing the doped tin oxide. Based on the total weight of
the doped tin oxide and the PC, the content of the doped tin oxide
was 2.6 wt %. The PC sheet was subjected to an impact strength
test, and the results were recorded in Table 1.
[0123] 3) The PC sheet obtained from the step 2) was irradiated
with a laser under the same condition as described in the step 3)
of Example 1.
[0124] 4) The PC sheet obtained from the step 3) was subjected to
chemical plating under the same condition as described in the step
4) of Example 1. Then the PC sheet formed with the metal layer was
observed, and it was found that the metal layer formed a complete
circuit on the PC sheet. The plating speed and adhesion between the
metal layer and the PC were both listed in Table 1.
TABLE-US-00001 TABLE 1 Whether can Plating speed Impact Strength be
used (.mu.m/h) Adhesion (J/m) as accelerators E1 5.1 5B 673.8 Yes
CE1 -- -- -- No CE2 6.0 5B 483.0 -- CE3 5.6 5B 548.4 -- E2 5.2 5B
650.2 Yes CE4 -- -- -- No E3 5.1 5B 649.3 Yes E4 2.7 3B 676.4 Yes
E5 3.8 4B 679.3 Yes E6 4.7 5B 642.3 Yes E7 2.6 4B 659.4 Yes E8 2.4
4B 661.2 Yes E9 4.2 5B 658.1 Yes E10 4.1 5B 684.2 Yes
[0125] Reference throughout this specification to "an embodiment,"
"some embodiments," "one embodiment", "another example," "an
example," "a specific example," or "some examples," means that a
particular feature, structure, material, or characteristic
described in connection with the embodiment or example is included
in at least one embodiment or example of the present disclosure.
Thus, the appearances of the phrases such as "in some embodiments,"
"in one embodiment", "in an embodiment", "in another example," "in
an example," "in a specific example," or "in some examples," in
various places throughout this specification are not necessarily
referring to the same embodiment or example of the present
disclosure. Furthermore, the particular features, structures,
materials, or characteristics may be combined in any suitable
manner in one or more embodiments or examples.
[0126] Although explanatory embodiments have been shown and
described, it would be appreciated by those skilled in the art that
the above embodiments cannot be construed to limit the present
disclosure, and changes, alternatives, and modifications can be
made in the embodiments without departing from spirit, principles
and scope of the present disclosure.
* * * * *