U.S. patent application number 14/147455 was filed with the patent office on 2014-11-27 for dc motor device and dc fan using the same.
This patent application is currently assigned to Wistron Corp.. The applicant listed for this patent is Wistron Corp.. Invention is credited to MING-CHIH CHEN, YUNG-LI JANG, KAI-HUA WANG.
Application Number | 20140345830 14/147455 |
Document ID | / |
Family ID | 51934595 |
Filed Date | 2014-11-27 |
United States Patent
Application |
20140345830 |
Kind Code |
A1 |
JANG; YUNG-LI ; et
al. |
November 27, 2014 |
DC MOTOR DEVICE AND DC FAN USING THE SAME
Abstract
A heat dissipating device includes a substrate, a plurality of
fins, and a heat pipe. The substrate has a plurality of retaining
holes. Each of the fins includes a heat dissipating sheet and a
retaining sheet extended from the heat dissipating sheet and
passing through one of the retaining holes. The heat pipe is
disposed on the fins.
Inventors: |
JANG; YUNG-LI; (New Taipei
City, TW) ; WANG; KAI-HUA; (New Taipei City, TW)
; CHEN; MING-CHIH; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Wistron Corp. |
New Taipei City |
|
TW |
|
|
Assignee: |
Wistron Corp.
New Taipei City
TW
|
Family ID: |
51934595 |
Appl. No.: |
14/147455 |
Filed: |
January 3, 2014 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
H01L 21/4882 20130101;
H01L 23/3672 20130101; F28D 15/0233 20130101; F28F 2275/12
20130101; H01L 23/427 20130101; F28D 15/0275 20130101; F28F 1/30
20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
May 27, 2013 |
CN |
201310201784.X |
Claims
1. A heat dissipating device, comprising: a substrate having a
plurality retaining holes; a plurality of first fins, wherein each
of the first fins comprises: a heat dissipating sheet having a
receiving hole; a contacting sheet extending from the heat
dissipating sheet; and a retaining sheet, extending from the heat
dissipating sheet, passing through one of the retaining holes; and
a heat pipe, disposed on the receiving hole, contacting with the
contacting sheet.
2. The heat dissipating device as claimed in claim 1, wherein the
contacting sheet and the retaining sheet are substantially
perpendicular to the heat dissipating sheet.
3. The heat dissipating device as claimed in claim 1, wherein the
retaining sheet and the contacting sheet are substantially parallel
to the substrate.
4. The heat dissipating device as claimed in claim 1, wherein the
retaining sheet and the heat dissipating sheet are respectively
located at two opposite sides of the substrate.
5. The heat dissipating device as claimed in claim 1, wherein the
first fins are sheet structures, and the heat dissipating sheet,
the contacting sheet, and the retaining sheet are formed as a
single piece.
6. The heat dissipating device as claimed in claim 1, further
comprising a plurality of second fins disposed on the substrate,
wherein the first fins and the second fins are alternately overlaid
to each other, and the second fins do not pass through the
retaining holes.
7. A heat dissipating device, comprising: a substrate having
retaining hole; a plurality of first fins, wherein each of the
first fins comprises: a heat dissipating sheet having a receiving
hole; a contacting sheet, extending from the heat dissipating
sheet, having a first end; and a first retaining sheet, extending
from the first end, passing through the retaining hole; and a heat
pipe, disposed on the receiving hole, contacting with the
contacting sheet.
8. The heat dissipating device as claimed in claim 7, wherein the
contacting sheet and the first retaining sheet are substantially
perpendicular to the heat dissipating sheet.
9. The heat dissipating device as claimed in claim 7, wherein the
first retaining sheet and the contacting sheet are substantially
parallel to the substrate.
10. The heat dissipating device as claimed in claim 7, wherein the
first retaining sheet and the heat dissipating sheet are
respectively located at two opposite sides of the substrate.
11. The heat dissipating device as claimed in claim 7, wherein the
first fins is a sheet structure, and the heat dissipating sheet,
the contacting sheet, and the first retaining sheet are formed as a
single piece.
12. The heat dissipating device as claimed in claim 7, wherein the
contacting sheet has a second end, and the first fins further
comprises a second retaining sheet extending from the second end
and fastening on the heat pipe.
13. The heat dissipating device as claimed in claim 7, further
comprising a plurality of second fins, disposed on the substrate,
but not passing through the retaining hole, wherein the first fins
and the second fins are overlapped along an arrangement direction,
and the first fins are located between the second fins.
14. The heat dissipating device as claimed in claim 13, wherein
each of the second fins comprises a fastening portion fastened on
the heat pipe.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority of China Patent Application
No. 201310201784.X filed on May. 27, 2013, the entirety of which is
incorporated by reference herein.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present disclosure relates to a heat dissipating device,
and in particular, to a heat dissipating device with fins.
[0004] 2. Description of the Related Art
[0005] Regarding the conventional manufacturing method of the heat
dissipating device, the fins and the heat pipe are fixed on the
substrate thereof by solder paste. However, for environmentally
friendly considerations, the solder paste should be reduced through
the redesigning of the structure of the heat dissipating device.
Moreover, manufacturing cost may be decreased because the solder
process is performed by manual labor.
BRIEF SUMMARY OF THE INVENTION
[0006] To solve the described problems, the present disclosure
provides a heat dissipating device assembled without solder
paste.
[0007] The present disclosure provides a heat dissipating device
including a substrate, a plurality of the first fins and a heat
pipe. The substrate has a plurality of retaining holes. Each of the
first fins includes a heat dissipating sheet, a contacting sheet,
and a retaining sheet. The heat dissipating sheet has a receiving
hole. The contacting sheet is extended from the heat dissipating
sheet. The retaining sheet is extended from the heat dissipating
sheet, and passes through one of the retaining holes. The heat pipe
is disposed on the receiving hole, and contacts with the contacting
sheet.
[0008] The present disclosure provides a heat dissipating device
including a substrate, a plurality of the first fins, and a heat
pipe. The substrate has a retaining hole. Each of the first fins
includes a heat dissipating sheet, a contacting sheet and a first
retaining sheet. The heat dissipating sheet has a receiving hole.
The contacting sheet is extended from the heat dissipating sheet,
and has a first end. The first retaining sheet is extended from the
first end, and passes through the retaining hole. The heat pipe is
disposed on the receiving hole, contacting with the contacting
sheet.
[0009] In the conclusion, the heat dissipating device of the
present disclosure is fastened on the substrate by the retaining
sheets of the fins to fix the heat pipe between the fins and the
substrate. Moreover, solder paste is not needed during the
manufacturing process of the heat dissipating device of the present
disclosure, meeting environmentally friendly considerations, and
decreasing manufacturing costs.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The invention can be more fully understood by reading the
subsequent detailed description and examples with references made
to the accompanying drawings, wherein:
[0011] FIG. 1 is a perspective view of a heat dissipating device
according to a first embodiment of the present disclosure;
[0012] FIG. 2 is an exploded view of the heat dissipating device
according to the first embodiment of the present disclosure,
wherein the retaining sheets are unbent;
[0013] FIG. 3 is a cross-sectional view of the heat dissipating
device according to the first embodiment of the present
disclosure;
[0014] FIG. 4 is a perspective view of a first fin according to the
first embodiment view of the present disclosure;
[0015] FIG. 5 is a perspective view of a second fin according to
the first embodiment of the present disclosure;
[0016] FIG. 6 is a perspective view of a heat dissipating device
according to a second embodiment of the present disclosure;
[0017] FIG. 7 is an exploded view of the heat dissipating device
according to the second embodiment of the present disclosure;
[0018] FIG. 8 is a perspective view of a first fin according to the
second embodiment of the present disclosure;
[0019] FIG. 9 is a perspective view of a heat dissipating device
according to a third embodiment of the present disclosure;
[0020] FIG. 10 is a perspective view of a substrate according to
the third embodiment of the present disclosure;
[0021] FIG. 11 is a perspective view of the first fin and second
fin according to the third embodiment of the present
disclosure;
[0022] FIG. 12 is a perspective view of the first fins according to
the third embodiment of the present disclosure; and
[0023] FIG. 13 is a perspective view of the second fins according
to the third embodiment of the present disclosure.
DETAILED DESCRIPTION OF THE INVENTION
[0024] FIG. 1 is a perspective view of a heat dissipating device 1
according to a first embodiment of the present disclosure. FIG. 2
is an exploded view of the heat dissipating device 1 according to
the first embodiment of the present disclosure, wherein the
retaining sheet 22 is unbent. FIG. 3 is a cross-sectional view of
the heat dissipating device 1 according to the first embodiment of
the present disclosure. FIG. 4 is a perspective view of a first fin
20 according to the first embodiment view of the present
disclosure. FIG. 5 is a perspective view of a second fin 30
according to the first embodiment of the present disclosure. The
heat dissipating device 1 may be disposed in a portable electronic
device (not shown) to provide a dissipating function. The heat
dissipating device 1 includes a substrate 10, a plurality of first
fins 20, a plurality of second fins 30 and a heat pipe 40.
[0025] The substrate 10 may be a printed circuit board or a
supporting board in an electronic device. The supporting board is
made of heat-conducting or electrically conducting material, such
as metal, and is utilized for disposing a variety of electronic
elements thereon, such as a printed circuit board, a power supply,
or a fan. The substrate 10 may be a sheet structure, and has a
plurality of retaining holes 11 arranged along an arrangement
direction D1. The retaining holes 11 may be rectangular and
extended along an extension direction D2, which is perpendicular to
the arrangement direction D1. In the embodiment, a part of the
retaining holes 11 are located at the edge of the substrate 10, and
is respectively communicated with the openings 12 located at the
edge of the substrate 10.
[0026] As shown in FIG. 4, the first fins 20 is made from a metal
sheet by a stamping process. The first fins 20 may be a sheet
structure including a first body 21 and two retaining sheets 22.
The retaining sheets 22 are extended from the first body 21, and
contact with the substrate 10. The first body 21 includes a first
heat dissipating sheet 211, a first contacting sheet 212, and a
first spacing sheet 213. The first heat dissipating sheet 211, the
first contacting sheet 212, the first spacing sheet 213, and the
retaining sheet 22 are formed as a single piece.
[0027] The first heat dissipating sheet 211 is a plate structure
perpendicular to the arrangement direction D1. The first heat
dissipating sheet 211 has a receiving hole S1. The first contacting
sheet 212, the first spacing sheet 213, and the retaining sheets 22
are disposed on a surface 2111 (as shown in FIG. 4) of the first
heat dissipating sheet 211 and extended from the first heat
dissipating sheet 211 along the arrangement direction D1. In other
words, the first contacting sheet 212, the first spacing sheet 213,
and the retaining sheets 22 are substantially perpendicular to the
first heat dissipating sheet 211 and substantially parallel to the
substrate 10.
[0028] The first contacting sheet 212 is located at the edge of the
receiving hole S1, and around the receiving hole S1. The first
spacing sheet 213 and the retaining sheets 22 are respectively
located at two opposite sides of the first heat dissipating sheet
211. The retaining sheets 22 are respectively located at the two
opposite sides of the receiving hole S1 and the first contacting
sheet 212. The length of the retaining sheet 22 is greater than the
length of the first spacing sheet 213. In the embodiment, the
length of the retaining sheet 22 is about at least two, three or
four times that of the length of the first spacing sheet 213. The
retaining sheets 22 and the first heat dissipating sheet 211 are
respectively located at two opposite sides of the substrate 10.
[0029] As shown in FIG. 3, the second fins 30 are disposed on the
first surface 13 of the substrate 10, but not passing through the
retaining holes 11 of the substrate 10. As shown in FIG. 5, the
second fins 30 include a second body 31 including a second heat
dissipating sheet 311, a second contacting sheet 312, and a second
spacing sheet 313. The second heat dissipating sheet 311 is
substantially parallel to the first heat dissipating sheet 211. The
structure of the second fins 30 is substantially the same as the
structure of the first fins 20. However, the second fins 30
excludes the retaining sheets 22. Accordingly, for the description
of the second fins 30, reference can be made to the description of
the first fins 20.
[0030] The heat pipe 40 is extended along the arrangement direction
D1 and disposed in the receiving holes S1 of the first fins 20 and
the second fins 30, and disposed on the substrate 10. In the
embodiment, the heat pipe 40 is a thin structure having a plane 41,
and thus, a heat source (not shown) may be disposed on an end of
the plane 41, wherein the heat source may be an electronic element,
such as a chip. The heat pipe 40 transmits the heat generated by
the heat source to the first fins 20 and the second fins 30 for
heat dissipation. In another embodiment, the heat pipe 40 may be a
curved structure extended over the substrate 10, and the heat
source may be disposed on the substrate 10.
[0031] As shown in FIGS. 2 and 3, when assembling the heat
dissipating device 1 of the embodiment, the first fins 20 and the
second fins 30 are alternately overlaid to each other along the
arrangement direction D1, wherein one or more of the first fins 20
are adjacent to each other. The second spacing sheet 313 abuts
against an adjacent first spacing sheet 213 or another adjacent
second spacing sheet 313, and the second contacting sheet 312 abuts
against an adjacent first contacting sheet 212 or another adjacent
second contacting sheet 312. Thus, by the first spacing sheets 213,
the second spacing sheets 313, the first contacting sheets 212, and
the second contacting sheets 312, the first heat dissipating sheets
211 and the second heat dissipating sheets 311 are separated from
each other stably. In addition, by the arrangement of the first
fins 20 and the second fins 30, the numbers of the retaining holes
11 on the substrate 10 is decreased, and the strength of the
substrate 10 is improved.
[0032] Further, the heat pipe 40 is disposed on the receiving holes
S1 of the first fins 20 and the second fins 30, and contacts with
the first contacting sheets 212 and the second contacting sheets
312. Next, the substrate 10 is disposed on the heat pipe 40, and
the first fins 20 and the second fins 30. The retaining sheets 22
respectively pass through retaining holes 11. Next, the retaining
sheets 22 are bent and contacted with the second surface 14, which
is opposite to the first surface 13, of the substrate 10, to fasten
the first fins 20 on substrate 10. Then, the assembly of the heat
dissipating device 1 is finished.
[0033] It should be noted that there are many assembly and
manufacturing methods for the heat dissipating device 1, and the
assembly and manufacturing methods are not limited herein.
[0034] In the embodiment, since the heat pipe 40 is tightly mounted
on the first contacting sheets 212 and the second contacting sheets
312, the first fins 20 and the second fins 30 are stably disposed
on the heat pipe 40. Moreover, by the retaining sheets 22
contacting with the second surface 14 of the substrate 10, the
first heat dissipating sheets 211 press the heat pipe 40 to clamp
the heat pipe 40 between the first surface 13 of the substrate 10
and the first heat dissipating sheets 211.
[0035] In the embodiment, since the first fins 20, the second fins
30, and the heat pipe 40 are fixed on the substrate 10 by bending
the retaining sheets 22, solder paste is not needed for the
assembly of the heat dissipating device 1. Moreover, the assembly
of the heat dissipating device 1 is able to be performed by
automated equipment, and thus, labor and manufacturing costs are
decreased.
[0036] In another embodiment, the first fins 20 or the second fins
30 includes a fastening element (not shown) to make the second fins
30 fix onto the first fins 20 or another adjacent second fin.
[0037] FIG. 6 is a perspective view of a heat dissipating device 1a
according to a second embodiment of the present disclosure. FIG. 7
is an exploded view of the heat dissipating device 1a according to
the second embodiment of the present disclosure. FIG. 8 is a
perspective view of a first fin 20a according to the second
embodiment of the present disclosure. In the second embodiment, the
substrate 10a has two retaining holes 11a parallel to each other,
and the retaining holes 11a are extended along the arrangement
direction D1. The retaining sheet 22a is extended from the first
end 2121 of the sheet 212 along the extension direction D2. The
first fins 20a and the second fins 30 are stacked along the
arrangement direction D1, wherein the first fins 20a are stacked to
each other, and all of the first fins 20a are located between the
second fins 30.
[0038] In FIG. 7, the retaining sheets 22a are unbent. When the
substrate 10a is assembled with the first fins 20a, the retaining
sheets 22a pass through the retaining holes 11a and bend to the
substrate 10. In the embodiment, the second fins 30 may be
excluded.
[0039] FIG. 9 is a perspective view of a heat dissipating device 1b
according to a third embodiment of the present disclosure. FIG. 10
is a perspective view of a substrate 10b according to the third
embodiment of the present disclosure. FIG. 11 is a perspective view
of the first fins 20b and the second fins 30b according to the
third embodiment of the present disclosure. FIG. 12 is a
perspective view of the first fins 20b according to the third
embodiment of the present disclosure. FIG. 13 is a perspective view
of the second fins 30b according to the third embodiment of the
present disclosure.
[0040] The substrate 10b has a retaining hole 11b extended along
the arrangement direction D1. Two L-shaped fastening elements 15
are disposed on the edge of the substrate 10b, wherein the L-shaped
fastening element 15 includes a first plate 151 and a second plate
152. The first plate 151 is connected to the edge of the substrate
10, and is perpendicular to the substrate 10. The second plate 152
is connected to the first plate 151, and is perpendicular to the
first plate 151 and parallel to substrate 10. Moreover, the
retaining holes 11, and the connection of the first plate 151 and
the substrate 10 are extended along the arrangement direction D1.
The heat pipe 40 is located between the L-shaped fastening elements
15 and the substrate 10.
[0041] The retaining sheets 22b and 22c of the first fins 20b are
respectively extended from the first end 2121 and the second end
2122 of the first contacting sheet 212. The retaining sheet 22b and
the retaining sheet 22c are extended to each other. In the first
fins 20b, the first spacing sheet 213 of the first embodiment may
be excluded.
[0042] The second fins 30b has a second body 31b and a fastening
portion 32b. The second body 31b includes a second heat dissipating
sheet 311b and a second contacting sheet 312b. In the embodiment,
the second heat dissipating sheet 311b and the second contacting
sheet 312b of the second fins 30b are an L-shape. The fastening
portion 32b is extended from one end of the second contacting sheet
312b.
[0043] In FIG. 11, the retaining sheets 22b and 22c are unbent.
When the substrate 10 is assembled to the first fins 20 and the
second fins 30, the retaining sheets 22b pass through the retaining
holes 11b and are bent to the substrate 10. The retaining sheets
22c and the fastening portions 32b are bent to the heat pipe 40,
and fastened on heat pipe 40.
[0044] In conclusion, the heat dissipating device of the present
disclosure is fastened on the substrate by the retaining sheets of
the fins to fix the heat pipe between the fins and the substrate.
Moreover, solder paste is not needed during the manufacturing
process of the heat dissipating device of the present disclosure
for environmentally friendly considerations, and thus, the
manufacturing costs are decreased.
[0045] While the invention has been described by way of example and
in terms of preferred embodiment, it is to be understood that the
invention is not limited thereto.
[0046] On the contrary, it is intended to cover various
modifications and similar arrangements (as would be apparent to
those skilled in the art). Therefore, the scope of the appended
claims should be accorded the broadest interpretation so as to
encompass all such modifications and similar arrangements.
* * * * *