U.S. patent application number 14/037099 was filed with the patent office on 2014-11-20 for organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same.
This patent application is currently assigned to Samsung Display Co., Ltd.. The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Mu-Hyun KIM, Dong-Kyu LEE, Su-Hwan LEE, Un-Cheol SUNG.
Application Number | 20140342481 14/037099 |
Document ID | / |
Family ID | 51896086 |
Filed Date | 2014-11-20 |
United States Patent
Application |
20140342481 |
Kind Code |
A1 |
LEE; Su-Hwan ; et
al. |
November 20, 2014 |
ORGANIC LAYER DEPOSITION APPARATUS AND METHOD OF MANUFACTURING
ORGANIC LIGHT-EMITTING DISPLAY APPARATUS USING THE SAME
Abstract
An organic layer deposition apparatus and a method of
manufacturing an organic light-emitting display device by using the
apparatus. In particular, an organic layer deposition apparatus
that is more easily manufactured and is suitable for use in mass
production of large substrates while performing high-definition
patterning thereon, as well as a method of manufacturing an organic
light-emitting display device by using such an apparatus.
Inventors: |
LEE; Su-Hwan; (Yongin-City,
KR) ; SUNG; Un-Cheol; (Yongin-City, KR) ; KIM;
Mu-Hyun; (Yongin-City, KR) ; LEE; Dong-Kyu;
(Yongin-City, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-City |
|
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
Yongin-City
KR
|
Family ID: |
51896086 |
Appl. No.: |
14/037099 |
Filed: |
September 25, 2013 |
Current U.S.
Class: |
438/34 ;
118/720 |
Current CPC
Class: |
H01L 51/56 20130101;
H01L 21/6776 20130101; C23C 14/24 20130101; C23C 14/042 20130101;
C23C 14/568 20130101 |
Class at
Publication: |
438/34 ;
118/720 |
International
Class: |
H01L 51/56 20060101
H01L051/56; H01L 21/677 20060101 H01L021/677 |
Foreign Application Data
Date |
Code |
Application Number |
May 16, 2013 |
KR |
10-2013-0056039 |
Claims
1. An organic layer deposition apparatus comprising: a conveyer
system comprising a moving unit configured both for having a
substrate coupled thereto and to move along with the substrate, a
first conveyer unit for moving the moving unit in a first direction
while the substrate is coupled thereto, and a second conveyer unit
for moving the moving unit in a second direction opposite to the
first direction when the substrate is separated therefrom after a
deposition has been completed; and a deposition unit comprising at
least one organic layer deposition assembly for depositing an
organic layer on the substrate while it is coupled to the moving
unit, wherein each of the organic layer deposition assemblies
comprises: at least one deposition source for discharging a
deposition material; a deposition source nozzle unit that is
disposed at a side of the at least one deposition source, wherein
at least one deposition source nozzle is formed in the deposition
source nozzle unit; a patterning slit sheet that is disposed to
face the deposition source nozzle unit and that comprises a
plurality of patterning slits extending along a predetermined
direction; a shielding member that is disposed between the
substrate and the at least one deposition source and that is
configured to block the deposition material vaporized from the at
least one deposition source; and a mesh member that is disposed on
a side of the shielding member and that is configured to prevent
dripping of the deposition material from the shielding member,
wherein the moving unit is configured to be cyclically moved
between the first conveyer unit and the second conveyer unit, and
wherein, when coupled to the moving unit, the substrate is spaced
apart from the organic layer deposition assembly by a predetermined
distance while being transferred by the first conveyer unit.
2. The organic layer deposition apparatus of claim 1, wherein the
shielding member is operably movable so as to prevent deposition of
the deposition material upon the substrate.
3. The organic layer deposition apparatus of claim 2, wherein the
shielding member is configured to be moved between the at least one
deposition source and the patterning slit sheet.
4. The organic layer deposition apparatus of claim 2, wherein the
mesh member is coupled to the shielding member so as to move with
the shielding member.
5. The organic layer deposition apparatus of claim 1, wherein the
shielding member is disposed at a side of the deposition source and
is positioned and shaped so as to channel the deposition material
vaporized from the at least one deposition source toward the
substrate.
6. The organic layer deposition apparatus of claim 5, wherein the
shielding member is shaped so as to at least partially surround the
deposition source.
7. The organic layer deposition apparatus of claim 5, wherein the
mesh member is coupled to the shielding member and both the mesh
member and the shielding member are positioned proximate to a side
of the deposition source.
8. The organic layer deposition apparatus of claim 1, wherein each
of the organic layer deposition assemblies comprises: a plurality
of deposition sources; and a plurality of shielding members that
are movably positioned between respective ones of the plurality of
deposition sources and the patterning slit sheet.
9. The organic layer deposition apparatus of claim 8, wherein the
plurality of shielding members are positionable to prevent
deposition of the deposition material upon the substrate.
10. The organic layer deposition apparatus of claim 1, wherein the
shielding member is shaped and positioned to cover a boundary area
of the substrate.
11. The organic layer deposition apparatus of claim 10, wherein the
shielding member is configured to move along with the substrate
while covering the boundary area of the substrate.
12. The organic layer deposition apparatus of claim 1, wherein the
slits of the patterning slit sheet are shaped and positioned so
that the deposition material discharged from the at least one
deposition source is deposited on the substrate in a predetermined
pattern.
13. The organic layer deposition apparatus of claim 1, wherein the
patterning slit sheet has a smaller size than the substrate in at
least one of the first direction and a third direction different
from the first direction.
14. The organic layer deposition apparatus of claim 1, wherein the
first conveyer unit and the second conveyer unit are configured to
pass through the deposition unit.
15. The organic layer deposition apparatus of claim 1, wherein the
first conveyer unit is disposed parallel to the second conveyer
unit.
16. A method of manufacturing an organic light-emitting display
device, the method comprising: conveying a moving unit into a
chamber, the moving unit having a substrate coupled thereto, the
conveying performed by a first conveyer unit installed to pass into
the chamber; forming an organic layer on the substrate by
depositing a deposition material from an organic layer deposition
assembly on the substrate while the substrate is moved relative to
the organic layer deposition assembly, the organic layer deposition
assembly being positioned in the chamber and spaced apart from the
substrate by a predetermined distance; and after the substrate is
separated from the moving unit, conveying the moving unit with a
second conveyer unit installed to pass through the chamber, wherein
the forming an organic layer further comprises blocking the
deposition material discharged from the organic layer deposition
assembly from being deposited upon the substrate, the blocking
being performed with a shielding member having a mesh member
coupled thereto.
17. The method of claim 16, wherein the organic layer deposition
assembly comprises: a deposition source for discharging a
deposition material; a deposition source nozzle unit disposed at a
side of the deposition source and comprising a plurality of
deposition source nozzles; and a patterning slit sheet facing the
deposition source nozzle unit and comprising a plurality of
arranged patterning slits, wherein the patterning slits are shaped
and arranged so that deposition material discharged from the
deposition source passes through the patterning slit sheet to be
deposited on the substrate in a predetermined pattern.
18. The method of claim 17, wherein the shielding member is
configured to be disposed between the substrate and the deposition
source to prevent the deposition material vaporized from the
deposition source from being deposited on the substrate, wherein
the mesh member is disposed on a side of the shielding member so as
to prevent dripping of the deposition material from the shielding
member.
19. The method of claim 17, wherein the shielding member is
operably movable so as to prevent deposition of the deposition
material upon the substrate.
20. The method of claim 19, wherein the shielding member is
configured to be moved between the deposition source and the
patterning slit sheet.
21. The method of claim 19, wherein the mesh member is coupled to
the shielding member so as to move with the shielding member.
22. The method of claim 17, wherein the shielding member is
disposed at a side of the deposition source and is positioned and
shaped so as to channel the deposition material vaporized from the
deposition source toward the substrate.
23. The method of claim 22, wherein the shielding member is shaped
so as to at least partially surround the deposition source.
24. The method of claim 22, wherein the mesh member is coupled to
the shielding member and both the mesh member and the shielding
member are positioned proximate to a side of the deposition
source.
25. The method of claim 17, wherein the organic layer deposition
assembly comprises: a plurality of deposition sources; and a
plurality of shielding members that are movably positionable
between respective ones of the plurality of deposition sources and
the patterning slit sheet.
26. The method of claim 25, wherein the plurality of shielding
members are positionable to prevent deposition of the deposition
material on the substrate.
27. The method of claim 17, wherein the shielding member is shaped
and positioned to cover a boundary area of the substrate.
28. The method of claim 27, wherein the shielding member is
configured to move along with the substrate while covering the
boundary area of the substrate.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATION
[0001] This application claims priority to, and the benefit of,
Korean Patent Application No. 10-2013-0056039, filed on May 16,
2013, in the Korean Intellectual Property Office, the disclosure of
which is incorporated herein in its entirety by reference.
BACKGROUND
[0002] 1. Field
[0003] Aspects of the present invention relate generally to organic
light-emitting displays. More specifically, aspects of the present
invention relate to an organic layer deposition apparatus and a
method of manufacturing an organic light-emitting display device by
using said organic layer deposition apparatus.
[0004] 2. Description of the Related Art
[0005] Organic light-emitting display devices have wider viewing
angles, better contrast characteristics, and faster response speeds
than many other display devices, and thus have drawn attention as
viable next-generation display devices.
[0006] An organic light-emitting display device includes
intermediate layers (including an emission layer) disposed between
a first electrode and a second electrode. The electrodes and the
intermediate layers may be formed using various methods, one of
which is an independent deposition method. When an organic
light-emitting display device is manufactured by using this
deposition method, a fine metal mask (FMM) having the same pattern
as that of an organic layer to be formed is disposed to closely
contact a substrate on which the organic layer and the like are
formed, and an organic layer material is deposited on the FMM to
form the organic layer having the desired pattern.
[0007] However, deposition methods using such an FMM present
difficulties in manufacturing larger organic light-emitting display
devices using a large mother glass. For example, when such a large
mask is used, the mask may bend under its own weight, thereby
distorting the resulting pattern.
[0008] Moreover, the processes of aligning a substrate and an FMM
to closely contact each other, performing deposition thereon, and
separating the FMM from the substrate are time-consuming, resulting
in a long manufacturing time and low production efficiency.
[0009] Information disclosed in this Background section was already
known to the inventors of the present invention before achieving
the present invention or is technical information acquired in the
process of achieving the present invention. Therefore, it may
contain information not in the prior art.
SUMMARY
[0010] Aspects of the present invention are directed toward organic
layer deposition apparatuses that are more easily manufactured, and
are suitable for use in the mass production of a large substrate
while enabling high-definition patterning. Methods of manufacturing
organic light-emitting display devices by using the organic layer
deposition apparatuses are also contemplated.
[0011] According to an embodiment of the present invention, there
is provided an organic layer deposition apparatus comprising: a
conveyer system comprising a moving unit configured both for having
a substrate coupled thereto and to move along with the substrate, a
first conveyer unit for moving the moving unit in a first direction
while the substrate is coupled thereto, and a second conveyer unit
for moving the moving unit in a second direction opposite to the
first direction when the substrate is separated therefrom after a
deposition has been completed; and a deposition unit comprising at
least one organic layer deposition assembly for depositing an
organic layer on the substrate while it is coupled to the moving
unit, wherein each of the organic layer deposition assemblies
comprises: at least one deposition source for discharging a
deposition material; a deposition source nozzle unit that is
disposed at a side of the at least one deposition source, wherein
at least one deposition source nozzle is formed in the deposition
source nozzle unit; a patterning slit sheet that is disposed to
face the deposition source nozzle unit and that comprises a
plurality of patterning slits extending along a predetermined
direction; a shielding member that is disposed between the
substrate and the at least one deposition source and that is
configured to block the deposition material vaporized from the at
least one deposition source; and a mesh member that is disposed on
a side of the shielding member and that is configured to prevent
dripping of the deposition material from the shielding member,
wherein the moving unit is configured to be cyclically moved
between the first conveyer unit and the second conveyer unit, and
wherein, when coupled to the moving unit, the substrate is spaced
apart from the organic layer deposition assembly by a predetermined
distance while being transferred by the first conveyer unit.
[0012] The shielding member may be operably movable so as to
prevent deposition of the deposition material upon the
substrate.
[0013] The shielding member may be configured to be moved between
the at least one deposition source and the patterning slit
sheet.
[0014] The mesh member may be coupled to the shielding member so as
to move with the shielding member.
[0015] The shielding member may be disposed at a side of the
deposition source and is positioned and shaped so as to channel the
deposition material vaporized from the at least one deposition
source toward the substrate.
[0016] The shielding member may be shaped so as to at least
partially surround the deposition source.
[0017] The mesh member may be coupled to the shielding member and
both the mesh member and the shielding member are positioned
proximate to a side of the deposition source.
[0018] Each of the organic layer deposition assemblies may include:
a plurality of deposition sources; and a plurality of shielding
members that are movably positioned between respective ones of the
plurality of deposition sources and the patterning slit sheet.
[0019] The plurality of shielding members may be positionable to
prevent deposition of the deposition material on the substrate.
[0020] The shielding member may be shaped and positioned to cover a
boundary area of the substrate.
[0021] The shielding member may be configured to move along with
the substrate while covering the boundary area of the
substrate.
[0022] The slits of the patterning slit sheet may be shaped and
positioned so that the deposition material discharged from the at
least one deposition source is deposited on the substrate in a
predetermined pattern.
[0023] The patterning slit sheet may have a smaller size than the
substrate in at least one of the first direction and a third
direction different from the first direction.
[0024] The first conveyer unit and the second conveyer unit are
configured to pass through the deposition unit.
[0025] The first conveyer unit and the second conveyer unit may be
disposed parallel to each other.
[0026] According to an embodiment of the present invention, there
is provided a method of manufacturing an organic light-emitting
display device, the method comprising: conveying a moving unit into
a chamber, the moving unit having a substrate coupled thereto, the
conveying performed by a first conveyer unit installed to pass into
the chamber; forming an organic layer on the substrate by
depositing a deposition material from an organic layer deposition
assembly on the substrate while the substrate is moved relative to
the organic layer deposition assembly, the organic layer deposition
assembly being positioned in the chamber and spaced apart from the
substrate by a predetermined distance; and after the substrate is
separated from the moving unit, conveying the moving unit with a
second conveyer unit installed to pass through the chamber, wherein
the forming an organic layer further comprises blocking the
deposition material discharged from the organic layer deposition
assembly from being deposited upon the substrate, the blocking
being performed with a shielding member having a mesh member
coupled thereto.
[0027] The organic layer deposition assembly may comprise: a
deposition source for discharging a deposition material; a
deposition source nozzle unit disposed at a side of the deposition
source and comprising a plurality of deposition source nozzles; and
a patterning slit sheet facing the deposition source nozzle unit
and comprising a plurality of arranged patterning slits, wherein
the patterning slits are shaped and arranged so that deposition
material discharged from the deposition source passes through the
patterning slit sheet to be deposited on the substrate in a
predetermined pattern.
[0028] The shielding member may be configured to be disposed
between the substrate and the deposition source to prevent the
deposition material vaporized from the deposition source from being
deposited on the substrate, wherein the mesh member is disposed on
a side of the shielding member so as to prevent dripping of the
deposition material from the shielding member.
[0029] The shielding member may be operably movable so as to
prevent deposition of the deposition material upon the
substrate.
[0030] The shielding member may be configured to be moved between
the deposition source and the patterning slit sheet.
[0031] The mesh member may be coupled to the shielding member so as
to move with the shielding member.
[0032] The shielding member may be disposed at a side of the
deposition source and be positioned and shaped so as to channel the
deposition material vaporized from the deposition source toward the
substrate.
[0033] The shielding member may be shaped so as to at least
partially surround the deposition source.
[0034] The mesh member may be coupled to the shielding member and
both the mesh member and the shielding member may be positioned
proximate to a side of the deposition source.
[0035] The organic layer deposition assembly may include: a
plurality of deposition sources; and a plurality of shielding
members that are movably positionable between respective ones of
the plurality of deposition sources and the patterning slit
sheet.
[0036] The plurality of shielding members may be positionable to
prevent deposition of the deposition material on the substrate.
[0037] The shielding member may be shaped and positioned to cover a
boundary area of the substrate.
[0038] The shielding member may be configured to move along with
the substrate while covering the boundary area of the
substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0039] The above and other features and advantages of the present
invention will become more apparent by describing in detail
exemplary embodiments thereof with reference to the attached
drawings in which:
[0040] FIG. 1 is a schematic plan view illustrating a structure of
an organic layer deposition apparatus according to an embodiment of
the present invention;
[0041] FIG. 2 is a schematic side view of a deposition unit of the
organic layer deposition apparatus of FIG. 1, according to an
embodiment of the present invention;
[0042] FIG. 3 is a schematic perspective view of the deposition
unit of the organic layer deposition apparatus of FIG. 1, according
to an embodiment of the present invention;
[0043] FIG. 4 is a schematic cross-sectional view of the deposition
unit of FIG. 3, according to an embodiment of the present
invention;
[0044] FIGS. 5 and 6 illustrate the deposition source, a shielding
member, and a mesh member of FIG. 3, according to an embodiment of
the present invention;
[0045] FIG. 7 is a detailed view of the shielding member and the
mesh member of FIG. 6, according to an embodiment of the present
invention;
[0046] FIG. 8 illustrates the shielding member and the mesh member
of FIG. 3, according to another embodiment of the present
invention;
[0047] FIG. 9 illustrates the shielding member and the mesh member
of FIG. 3, according to another embodiment of the present
invention;
[0048] FIG. 10 illustrates the shielding member and the mesh member
of FIG. 3, according to another embodiment of the present
invention;
[0049] FIG. 11 illustrates an organic layer deposition assembly
according to another embodiment of the present invention; and
[0050] FIG. 12 is a cross-sectional view of an active matrix-type
organic light-emitting display device manufactured using the
organic layer deposition apparatus, according to an embodiment of
the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0051] Reference will now be made in detail to the present
embodiments of the present invention, examples of which are
illustrated in the accompanying drawings, which are not necessarily
to scale, wherein like reference numerals refer to like elements
throughout. The embodiments are described below in order to explain
aspects of the present invention by referring to the figures.
Expressions such as "at least one of," when preceding a list of
elements, modify the entire list of elements and do not modify the
individual elements of the list.
[0052] FIG. 1 is a schematic plan view illustrating a structure of
an organic layer deposition apparatus 1 according to an embodiment
of the present invention. FIG. 2 is a schematic side view of a
deposition unit 100 of the organic layer deposition apparatus 1 of
FIG. 1, according to an embodiment of the present invention.
[0053] Referring to FIGS. 1 and 2, the organic layer deposition
apparatus 1 includes the deposition unit 100, a loading unit 200,
an unloading unit 300, and a conveyer unit or system 400.
[0054] The loading unit 200 may include a first rack 212, a
transport chamber 214, a first inversion chamber 218, and a buffer
chamber 219.
[0055] A number of substrates 2, onto which a deposition material
has not yet been applied, are stacked up on the first rack 212. A
transport robot included in the transport chamber 214 picks up one
of the substrates 2 from the first rack 212, disposes it on a
moving unit 430 transferred by a second conveyer unit 420, and
moves the moving unit 430, on which the substrate 2 is disposed,
into the first inversion chamber 218.
[0056] The first inversion chamber 218 is disposed adjacent to the
transport chamber 214. The first inversion chamber 218 includes a
first inversion robot that inverts the moving unit 430 and then
loads it on a first conveyer unit 410 of the deposition unit
100.
[0057] Referring to FIG. 1, the transport robot of the transport
chamber 214 places one of the substrates 2 on a top surface of the
moving unit 430, and the moving unit 430, on which the substrate 2
is disposed, is then transferred into the first inversion chamber
218. A first inversion robot of the first inversion chamber 218
inverts the first inversion chamber 218 so that the substrate 2 is
turned upside down in the deposition unit 100.
[0058] The unloading unit 300 is configured to operate in an
opposite manner to the loading unit 200 described above.
Specifically, a second inversion robot in a second inversion
chamber 328 inverts the moving unit 430 after it has passed through
the deposition unit 100 with the substrate 2 disposed thereon, and
then moves the moving unit 430, with its substrate 2, into an
ejection chamber 324. Then, an ejection robot takes the moving unit
430 and its substrate 2 out of the ejection chamber 324, separates
the substrate 2 from the moving unit 430, and then loads the
substrate 2 on a second rack 322. The moving unit 430, separated
from the substrate 2, is returned to the loading unit 200 via the
second conveyer unit 420.
[0059] However, the present invention is not limited to the
configuration of the above example. For example, when disposing the
substrate 2 on the moving unit 430, the substrate 2 may be fixed
onto a bottom surface of the moving unit 430 and then moved into
the deposition unit 100. In such an embodiment, for example, the
first inversion robot of the first inversion chamber 218 and the
second inversion robot of the second inversion chamber 328 may be
omitted.
[0060] The deposition unit 100 may include at least one chamber for
deposition. In one embodiment, as illustrated in FIGS. 1 and 2, the
deposition unit 100 includes a chamber 101 in which a plurality of
organic layer deposition assemblies 100-1 through 100-n may be
disposed. Referring to FIG. 1, 11 organic layer deposition
assemblies, i.e., the organic layer deposition assembly 100-1, the
organic layer deposition assembly 100-2, . . . , and the organic
layer deposition assembly 100-11, are disposed in the chamber 101.
However, the number of organic layer deposition assemblies may vary
according to various factors such as the desired deposition
material and deposition conditions. The chamber 101 is maintained
in vacuum during the deposition process.
[0061] In this regard, some of the 11 organic layer deposition
assemblies may be used for deposition to form a common layer, and
the rest of the 11 organic layer deposition assemblies may be used
for deposition to form a pattern layer. In this embodiment, the
organic layer deposition assemblies used for deposition to form a
common layer may not include a patterning slit sheet 130 (refer to
FIG. 3). According to one embodiment, the 11 organic layer
deposition assemblies may be configured such that the organic layer
deposition assembly 100-1 performs deposition for forming a hole
injection layer (HIL) as a common layer, the organic layer
deposition assembly 100-2 performs deposition for forming an
injection layer (IL) as a common layer, the organic layer
deposition assembly 100-3 and the organic layer deposition assembly
100-4 perform deposition for forming a hole transport layer (HTL)
as a common layer, the organic layer deposition assembly 100-5
performs deposition for forming, e.g., an R' material and/or a G'
material in the HTL as a common layer, the organic layer deposition
assembly 100-6 performs deposition for forming an R'' material in
the HTL as a common layer, the organic layer deposition assembly
100-7 performs deposition for forming a red emission layer (R EML)
as a pattern layer, the organic layer deposition assembly 100-8
performs deposition for forming a green emission layer (G EML) as a
pattern layer, the organic layer deposition assembly 100-9 performs
deposition for forming a blue emission layer (B EML) as a pattern
layer, the organic layer deposition assembly 100-10 performs
deposition for forming an electron transport layer (ETL) as a
common layer, and the organic layer deposition assembly 100-11
performs deposition for forming an electron injection layer (EIL)
as a common layer. The organic layer deposition assemblies
described above may also be arranged in various forms and
configurations for various processes that may differ from this
one.
[0062] In the embodiment illustrated in FIG. 1, the moving unit 430
with the substrate 2 fixed thereon may be moved at least to the
deposition unit 100 or may be moved sequentially to the loading
unit 200, the deposition unit 100, and the unloading unit 300, by
the first conveyer unit 410, and the moving unit 430 that has been
separated from the substrate 2 in the unloading unit 300 may be
moved back to the loading unit 200 by the second conveyer unit
420.
[0063] The first conveyer unit 410 passes through the chamber 101
when passing through the deposition unit 100, and the second
conveyer unit 420 conveys the moving units 430 back after their
substrates 2 are separated.
[0064] In the present embodiment, the organic layer deposition
apparatus 1 is configured such that the first conveyer unit 410 is
disposed above the second conveyer unit 420. Thus, after the moving
unit 430, is separated from the substrate 2 in the unloading unit
300, the moving unit 430 is returned to the loading unit 200 via
the second conveyer unit 420 formed below the first conveyer unit
410, so that the organic layer deposition apparatus 1 may have an
improved space utilization efficiency.
[0065] In an embodiment, the deposition unit 100 of FIG. 1 may
further include a deposition source replacement unit 190 disposed
at a side of each organic layer deposition assembly. Although not
particularly illustrated in the drawings, the deposition source
replacement unit 190 may be formed as a cassette-type unit that may
be removably affixed to the outside of each organic layer
deposition assembly. Thus, a deposition source 110 (refer to FIG.
3) of the organic layer deposition assembly 100-1 may be easily
replaced.
[0066] In FIG. 1, the organic layer deposition apparatus 1 has two
sets of structures each including the loading unit 200, the
deposition unit 100, the unloading unit 300, and the conveyer unit
400 that are arranged in parallel. That is, it can be seen that two
organic layer deposition apparatuses 1 are arranged side by side
(above and below in FIG. 1). In such an embodiment, a patterning
slit sheet replacement unit 500 may be disposed between the two
organic layer deposition apparatuses 1. That is, due to this
configuration of structures, the two organic layer deposition
apparatuses 1 share a patterning slit sheet replacement unit 500,
resulting in improved space utilization efficiency as compared to a
case where each organic layer deposition apparatus 1 has its own
patterning slit sheet replacement unit 500.
[0067] FIG. 3 is a schematic perspective view of the deposition
unit 100 of the organic layer deposition apparatus 1 of FIG. 1,
according to an embodiment of the present invention. FIG. 4 is a
schematic cross-sectional view of the deposition unit 100 of FIG.
3, according to an embodiment of the present invention.
[0068] Hereinafter, an overall structure of the deposition unit 100
will be described.
[0069] The chamber 101 may be formed as a hollow box type chamber,
and may accommodate the at least one organic layer deposition
assembly 100-1 and the moving unit 430. In further detail, a foot
102 is formed so as to fix the deposition unit 100 on the ground, a
lower housing 103 is disposed on the foot 102, and an upper housing
104 is disposed on the lower housing 103. The chamber 101
accommodates both the lower housing 103 and the upper housing 104.
In this regard, a connection part of the lower housing 103 and the
chamber 101 is sealed so that the inside of the chamber 101 is
completely isolated from the outside. Due to the structure in which
the lower housing 103 and the upper housing 104 are disposed on the
foot 102 fixed on the ground, the lower housing 103 and the upper
housing 104 may be maintained in a fixed position even when the
chamber 101 is repeatedly contracted and expanded. Thus, the lower
housing 103 and the upper housing 104 may serve as a reference
frame within the deposition unit 100.
[0070] The upper housing 104 includes the organic layer deposition
assembly 100-1 and the first conveyer unit 410 of the conveyer unit
400, and the lower housing 103 includes the second conveyer unit
420 of the conveyer unit 400. While the moving unit 430 is
cyclically moving between the first conveyer unit 410 and the
second conveyer unit 420, a deposition process is continuously
performed.
[0071] Hereinafter, constituents of the organic layer deposition
assembly 100-1 are described in further detail.
[0072] The organic layer deposition assembly 100-1 includes the
deposition source 110, a deposition source nozzle unit 120, the
patterning slit sheet 130, a shielding member 141, a mesh member
142, a first stage 150, and a second stage 160. In this regard, all
the elements illustrated in FIGS. 3 and 4 may be arranged in the
chamber 101 to be maintained in an appropriate vacuum state. This
structure is desired to achieve the linearity of a deposition
material.
[0073] The substrate 2, on which the deposition material 115 is to
be deposited, is arranged in the chamber 101. The substrate 2 may
be a substrate for a flat panel display device. For example, a
large substrate of 40 inches or larger, such as a mother glass for
manufacturing a plurality of flat panel displays, may be used as
the substrate 2.
[0074] According to an embodiment, the deposition method may be
performed with the substrate 2 being moved relative to the organic
layer deposition assembly 100-1.
[0075] In a conventional deposition method using an FMM, the size
of the FMM needs to be the same as that of a substrate. Thus, as
the size of the substrate increases, the FMM also needs increase in
size. Due to these problems, it is difficult to fabricate the FMM
and to align the FMM in a precise pattern by elongation of the
FMM.
[0076] To address these problems, in the organic layer deposition
assembly 100-1 according to the present embodiment, deposition may
be performed while the organic layer deposition assembly 100-1 and
the substrate 2 are moved relative to each other. In other words,
deposition may be continuously performed while the substrate 2,
which faces the organic layer deposition assembly 100-1, is moved
in the Y-axis direction shown in FIG. 3. That is, deposition is
performed in a scanning manner while the substrate 2 is moved in
the direction of arrow A as illustrated in FIG. 3. Although the
substrate 2 is illustrated as being moved in the Y-axis direction
in the chamber 101 in FIG. 3 when deposition is performed, the
present invention is not limited thereto. For example, deposition
may be performed while the organic layer deposition assembly 100-1
is moved in the Y-axis direction and the substrate 2 is held in a
fixed position.
[0077] Thus, in the organic layer deposition assembly 100-1, the
patterning slit sheet 130 may be much smaller than an FMM used in a
conventional deposition method. In other words, in the organic
layer deposition assembly 100-1, deposition is continuously
performed, i.e., in a scanning manner, while the substrate 2 is
moved in the Y-axis direction. Thus, at least one of the lengths of
the patterning slit sheet 130 in X-axis and Y-axis directions may
be much less than a length of the substrate 2. Since the patterning
slit sheet 130 may be formed much smaller than the FMM used in a
conventional deposition method, it is much easier to manufacture
the patterning slit sheet 130. That is, a small patterning slit
sheet 130 is more advantageous in manufacturing processes,
including etching followed by precise elongation, welding,
transferring, and washing processes, than the FMM used in
conventional deposition methods. In addition, such a rectangular,
striplike FMM is more advantageous for manufacturing a relatively
large display device.
[0078] In order to perform deposition while the organic layer
deposition assembly 100-1 and the substrate 2 are moved relative to
each other as described above, the organic layer deposition
assembly 100-1 and the substrate 2 may be spaced apart from each
other by a certain distance. This is described below in more
detail.
[0079] The deposition source 110 that contains and heats the
deposition material 115 is disposed at a side opposite to (facing)
a side of the substrate. As the deposition material 115 contained
in the deposition source 110 is vaporized, deposition is performed
on the substrate 2.
[0080] The deposition source 110 includes a crucible 111 that is
filled with the deposition material 115, and a heater 112 that
heats the crucible 111 so as to vaporize the deposition material
115 toward the deposition source nozzle unit 120.
[0081] The deposition source 110, in one embodiment, is disposed
facing the substrate 2. In this regard, the organic layer
deposition assemblies according to the present embodiment each may
include different deposition source nozzles in performing
deposition for forming common layers and pattern layers.
[0082] In one embodiment, the patterning slit sheet 130 may be
disposed between the deposition source 110 and the substrate 2. The
patterning slit sheet 130 may further include a frame 135 having a
shape similar to a window frame. The patterning slit sheet 130
includes a plurality of patterning slits 131 arranged in the X-axis
direction. The deposition material 115 that has been vaporized in
the deposition source 110 passes through the nozzles 121 of the
deposition source nozzle unit 120 and through the slits 131 of the
patterning slit sheet 130, and is then deposited onto the substrate
2. In this regard, the patterning slit sheet 130 may be formed
using the same method as that used to form an FMM, in particular, a
stripe-type mask, e.g., etching. In this regard, a total number of
patterning slits 131 may be greater than a total number of
deposition source nozzles 121.
[0083] In one embodiment, the deposition source 110 (as well as the
deposition source nozzle unit 120) and the patterning slit sheet
130 may be spaced apart from each other by a certain distance.
[0084] As described above, deposition is performed while the
organic layer deposition assembly 100-1 is moved relative to the
substrate 2. In order for the organic layer deposition assembly
100-1 to be moved relative to the substrate 2, the patterning slit
sheet 130 is disposed to be spaced apart from the substrate 2 by a
certain distance.
[0085] In a conventional deposition method using an FMM, deposition
is performed with the FMM in close contact with a substrate in
order to prevent formation of shadows on the substrate. However,
when the FMM is placed in contact with the substrate, defects due
to the contact between the substrate and the FMM may occur. In
addition, since it is difficult to move the mask with respect to
the substrate, the mask and the substrate are preferably formed to
be at least approximately the same size. Accordingly, the mask
should increase in size as the size of a display device increases.
However, this becomes difficult as mask size increases.
[0086] To address these problems, in the organic layer deposition
assembly 100-1 according to the present embodiment, the patterning
slit sheet 130 is spaced apart by a certain distance from the
substrate 2, on which a deposition material is to be deposited.
[0087] According to the present embodiment, deposition may be
performed while a mask formed smaller than a substrate is moved
with respect to the substrate. Such a smaller mask is easier to
manufacture. In addition, defects due to contact between the
substrate and the mask may be prevented. In addition, since it is
unnecessary to closely contact the substrate with the mask during a
deposition process, manufacturing speed may be improved.
[0088] Hereinafter, a particular disposition of each element of the
upper housing 104 will be described.
[0089] The deposition source 110 and the deposition source nozzle
unit 120 are disposed on a bottom portion of the upper housing 104.
Accommodation portions 104-1 are respectively formed on both sides
of the deposition source 110 and the deposition source nozzle unit
120, to have a protruding shape (i.e., protruding upward toward the
slit sheet 130 as well as inward toward the deposition source 110).
The first stage 150, the second stage 160, and the patterning slit
sheet 130 are sequentially formed on the accommodation portions
104-1 in this order.
[0090] In this regard, the first stage 150 is formed to move in
both X-axis and Y-axis directions so that the first stage 150
aligns the patterning slit sheet 130 in the X-axis and Y-axis
directions. That is, the first stage 150 includes a plurality of
actuators so that the first stage 150 can be moved in the X-axis
and Y-axis directions with respect to the upper housing 104.
[0091] The second stage 160 is formed to move in a Z-axis direction
so as to align the patterning slit sheet 130 in the Z-axis
direction. That is, the second stage 160 includes a plurality of
actuators and is formed to move in the Z-axis direction with
respect to the first stage 150.
[0092] The patterning slit sheet 130 is disposed on the second
stage 160. The patterning slit sheet 130 is disposed on the first
stage 150 and the second stage 160 so as to move in the X-axis,
Y-axis, and Z-axis directions, so as to properly align the
substrate 2 and the patterning slit sheet 130.
[0093] In addition, the upper housing 104, the first stage 150, and
the second stage 160 may guide a flow path of the deposition
material 115 such that the deposition material 115 discharged
through the deposition source nozzles 121 is not dispersed too
widely. That is, the flow path of the deposition material 115 is
sealed by the upper housing 104, the first stage 150, and the
second stage 160, and thus, the movement of the deposition material
115 in the X-axis and Y-axis directions may be thereby concurrently
or simultaneously guided.
[0094] The shielding member 141 and the mesh member 142 may be
further disposed between the patterning slit sheet 130 and the
deposition source 110. The shielding member 141 may perform a
function of blocking some deposition material 115 emitted from the
deposition source 110. Also, the mesh member 142 may be disposed on
a side of the shielding member 141 to prevent dropping of
deposition material 115 deposited on the shielding member 141. This
will be further described in detail with reference to FIG. 5
below.
[0095] Hereinafter, the conveyer unit 400 that conveys the
substrate 2, on which the deposition material 115 is to be
deposited, is described in more detail. Referring to FIGS. 3 and 4,
the conveyer unit 400 includes the first conveyer unit 410, the
second conveyer unit 420, and the moving unit 430.
[0096] The first conveyer unit 410 conveys in an in-line manner the
moving unit 430, which includes the carrier 431 and an
electrostatic chuck 432 attached thereto, and also conveys the
substrate 2 attached to the moving unit 430, so that an organic
layer may be formed on the substrate 2 by the organic layer
deposition assembly 100-1.
[0097] The second conveyer unit 420 returns to the loading unit 200
the moving unit 430 from which the substrate 2 has been separated
in the unloading unit 300 after one deposition cycle is completed.
The second conveyer unit 420 includes a coil 421, roller guides
422, and a charging track 423.
[0098] The moving unit 430 includes the carrier 431 that is
conveyed along the first conveyer unit 410 and the second conveyer
unit 420, as well as the electrostatic chuck 432 that is coupled to
a surface of the carrier 431 and to which the substrate 2 is
attached.
[0099] Hereinafter, each element of the conveyer unit 400 will be
described in more detail.
[0100] The carrier 431 of the moving unit 430 will now be described
in detail.
[0101] The carrier 431 includes a main body part 431a, a magnet
rail 431b, contactless power supply (CPS) modules 431c, a power
supply unit 431d, and guide grooves (not shown).
[0102] The main body part 431a constitutes a base part of the
carrier 431 and may be formed of a magnetic material, such as iron
or steel. In this regard, due to a magnetic force between the main
body part 431a and the respective magnetically suspended bearings
(not shown), which are described below, the carrier 431 may be
maintained spaced apart from guide members 412 by a certain
distance.
[0103] The guide grooves (not shown) may be respectively formed at
both sides of the main body part 431a and each may accommodate a
guide protrusion (not shown) of the guide member 412.
[0104] The magnetic rail 431b may be formed along a center line of
the main body part 431a in a direction where the main body part
431a proceeds (i.e., along the center line of the main body part
431a that extends in the direction of movement of the moving unit
430). The magnetic rail 431b and a coil 411, which are described
below in more detail, may together constitute a linear motor, and
the carrier 431 may be conveyed in the direction of an arrow A by
the linear motor.
[0105] The CPS modules 431c and the power supply unit 431d may be
respectively formed on both sides of the magnetic rail 431b in the
main body part 431a, although embodiments of the invention
contemplate any suitable position for either part). The power
supply unit 431d includes a battery (e.g., a rechargeable battery)
that provides power so that the electrostatic chuck 432 can chuck
the substrate 2 and maintain operation. The CPS modules 431c are
wireless charging modules that charge the power supply unit 431d.
In particular, the charging track 423 formed in the second conveyer
unit 420, which is described below, is connected to an inverter
(not shown), and thus, when the carrier 431 is transferred to the
second conveyer unit 420, a magnetic field is formed between the
charging track 423 and the CPS modules 431c so as to supply power
to the CPS modules 431c. The power supplied to the CPS modules 431c
is used to charge the power supply unit 431d.
[0106] The electrostatic chuck 432 may include an electrode
embedded in a main body formed of ceramic, wherein the electrode is
supplied with power. The substrate 2 is attached onto a surface of
the main body of the electrostatic chuck 432 as a high voltage is
applied to the electrode.
[0107] Hereinafter, an operation of the moving unit 430 is
described in more detail.
[0108] The magnetic rail 431b of the main body part 431a and the
coil 411 may be combined with each other to constitute an operation
unit. In this regard, the operation unit may be a linear motor. The
linear motor has a low frictional coefficient, little position
error, and a very high degree of position determination, as
compared to a conventional slide guide system. As described above,
the linear motor may include the coil 411 and the magnetic rail
431b. The magnetic rail 431b is linearly disposed on the carrier
431, and a plurality of the coils 411 may be disposed at an inner
side of the chamber 101 and separated from the rail 431b by a
certain distance while facing the magnetic rail 431b. Since the
magnetic rail 431b is disposed on the carrier 431 instead of the
coil 411, the carrier 431 may be operable without power being
supplied thereto. In this regard, the coil 411 may be formed in an
atmosphere (ATM) box in an air atmosphere, and the carrier 431, to
which the magnetic rail 431b is attached, may be moved in the
chamber 101 while the chamber 101 maintains a vacuum.
[0109] The organic layer deposition assembly 100-1 of the organic
layer deposition apparatus 1 according to the present embodiment
may further include the camera 170 for an aligning process. In
detail, the camera 170 may align in real time a mark formed on the
patterning slit sheet 130 and a mark formed on the substrate 2. In
this regard, the camera 170 is disposed to operate accurately in
the chamber 101 while it maintains a vacuum during deposition. For
this, the camera 170 may be installed in a camera accommodation
unit 171 in an atmospheric state, i.e. one which maintains an
atmosphere yet remains transparent.
[0110] Hereinafter, the shielding member 141 and the mesh member
142 of the organic layer deposition apparatus 1 according to the
current embodiment of the present invention will be described in
detail.
[0111] FIGS. 5 and 6 illustrate the deposition source 110, the
shielding member 141, and the mesh member 142 of FIG. 3 according
to an embodiment of the present invention, and FIG. 7 is a detailed
view of the shielding member 141 and the mesh member 142 of FIG.
6.
[0112] Referring to FIGS. 5, 6, and 7, the shielding member 141 and
the mesh member 142 may (but not necessarily) be further included
between the patterning slit sheet 130 and the deposition source
110. The shielding member 141 may perform the function of blocking
the deposition material 115 emitted from the deposition source 110.
Also, the mesh member 142 may be formed on a side of the shielding
member 141 to prevent excess deposition material 115 deposited on
the shielding member 141 from dripping down.
[0113] That is, according to the current embodiment of the present
invention, the shielding member 141 is disposed between the
deposition source 110 and the patterning slit sheet 130 so as to
function as a main shutter that prevents deposition of a deposition
material on the patterning slit sheet 130 during a deposition
standby mode.
[0114] In more detail, in the organic layer deposition apparatus
100, frequent turning on and off of power to the deposition source
110 has to be avoided to maintain a constant temperature until all
of the deposition material 115 is used once it has started to
operate, in order to prevent deformation of the deposition material
115 (which may be an organic material). In this case, after the
organic layer deposition apparatus 100 has deposited sufficient
material on the substrate 2, the deposition material 115 must be
prevented from further discharge into the chamber 101 through the
patterning slit sheet 130, such as in a deposition standby mode
before deposition is performed on other substrates. During this
time, the deposition material 115 is accumulated on the patterning
slit sheet 130 if no shielding member 141 is present.
[0115] To this end, the shielding member 141 is included between
the deposition source 110 and the patterning slit sheet 130 in the
chamber 101, so as to block the deposition material 115 emitted
from the deposition source 110. Thus, when the shielding member 141
is interposed between the deposition source 110 and the patterning
slit sheet 130, attachment of the deposition material 115
discharged from the deposition source 110 to non-targeted portions
of the chamber 101, including the patterning slit sheet 130, may be
minimized. Deposition material 115 discharged from the deposition
source 110 is deposited on shielding member 141 rather than on some
other undesired target or location.
[0116] As illustrated in FIG. 6, when the substrate 2 does not pass
through the organic layer deposition assembly 100-1, the shielding
member 141 may cover the deposition source 110 so that the
deposition material 115 discharged from the deposition source 110
is not smeared on the patterning slit sheet 130.
[0117] As illustrated in FIG. 5, when the substrate 2 starts to
enter the organic layer deposition assembly 100-1, the shielding
member 141, which is covering the deposition source 110, moves to
open a movement path of the deposition material 115, and the
deposition material 115 discharged from the deposition source 110
passes through the patterning slit sheet 130 to be deposited on the
substrate 2.
[0118] The mesh member 142 may be further formed on a side of the
shielding member 141, and in particular on the side facing the
deposition source 110. The mesh member 142 performs the function of
preventing dripping of the deposition material 115 deposited on the
shielding member 141.
[0119] In further detail, during a deposition operation, a large
amount of deposition material can be deposited on the shielding
member 141. When a sufficiently large amount of deposition material
is deposited, the deposition material might form droplets that drip
down due to their weight. The dropping deposition material
functions as particles in the chamber 101, that is, as impurities,
and if drops of the deposition material drip down toward the
deposition source 110, it also affects a layer formation flux FLUX
and may degrade product quality. In addition, if a large amount of
deposition material is deposited on the shielding member 141 and
enough deposition material drips down, equipment can no longer be
driven, thus decreasing the equipment operating ratio and
production capacity.
[0120] In order to solve the above problems, the mesh member 142 is
further formed on a side of the shielding member 141 in the organic
layer deposition apparatus 1 according to the current embodiment of
the present invention so as to prevent dropping of the deposition
material 115 deposited on the shielding member 141. When the mesh
member 142 is coupled to the side of the shielding member 141, the
deposition material is deposited in gaps of the mesh member 142,
which has a meshlike configuration that forms a fine sieve, so that
mesh member 142 easily catches the attaching deposition material,
and accordingly, dropping of the deposition material may be
prevented.
[0121] Experiments showed that an organic deposition material
started to drip after about 60 to 70 hours of process time if no
mesh member w included. However, when a mesh member was used,
dripping of an organic material did not occur even after 250 hours
of process time.
[0122] According to the current embodiment of the present
invention, as dripping of the deposition material deposited onto
the shielding member 141 is prevented, product quality may be
improved and equipment operating ratio and productivity may be
increased.
[0123] FIG. 8 illustrates a shielding member 143 and a mesh member
144 according to another embodiment of the present invention.
[0124] According to this embodiment of the present invention, the
shielding member 143 is disposed between the deposition source 110
and the patterning slit sheet 130, and in particular between the
patterning slit sheet 130 and each of three deposition sources
110a, 110b, and 110c of the organic layer deposition assembly 100-1
(see FIG. 1) individually, so as to function as a source shutter
that is used in controlling deposition from each of the three
deposition sources 110a, 110b, and 110c individually. That is,
three shielding members 143a, 143b, and 143c are respectively
formed in front of the deposition sources 110a, 110b, and 110c so
that a deposition material from each individual one of the
deposition sources 110a, 110b, and 110c may be blocked, and even if
one of the deposition sources 110a, 110b, and 110c becomes
defective, deposition may be performed by using the other
deposition sources without interruption.
[0125] Here, the shielding member 143 in the form of a source
shutter, however, is disposed relatively close to the deposition
source 110, and thus a large amount of deposition material is
deposited, and the deposition material may easily drop. When a
deposition material drops from the shielding member 143, the
deposition material may fall onto, and block up, the deposition
source nozzle unit 120, thus degrading product characteristics.
[0126] In order to solve the above problem, the mesh member 144 is
further formed on a side of the shielding member 143 that prevents
dropping of the deposition material 115 deposited on the shielding
member 143. That is, three mesh members 144a, 144b, and 144c are
respectively coupled to sides of the three shielding members 143a,
143b, and 143c. When the mesh member 144 is coupled to the side of
the shielding member 143, the deposition material is deposited upon
the sieve of the mesh member 144, and the mesh member 144 easily
catches the attaching deposition material. Thus, dropping of the
deposition material may be prevented.
[0127] FIG. 9 illustrates a shielding member 147 and a mesh member
148 according to another embodiment of the present invention.
[0128] According to this embodiment of the present invention, the
shielding member 147 is disposed between the deposition source 110
and the substrate 2 while being positioned laterally outside the
patterning slit sheet 130 so as to function as a blinder for
preventing deposition of an organic material in a non-layer forming
area of the substrate 2, i.e., an area of substrate 2 upon which no
organic material is to be deposited. That is, the shielding member
147 is formed to move together with the substrate 2 while it covers
the non-layer forming area of the substrate 2 during movement of
the substrate 2 (e.g., a boundary portion) so that the non-layer
forming area of the substrate 2 is covered. Accordingly, deposition
of an organic material in the non-layer forming area of the
substrate 2 may be easily prevented without any additional
structure.
[0129] Also, in the organic layer deposition apparatus 1 according
to the current embodiment of the present invention, a mesh member
148 is further formed on a side of the shielding member 147 in the
form of a source shutter, in detail, on a side of the shielding
member 147 facing the deposition source 110, thereby preventing
dripping of the deposition material 115 deposited on the shielding
member 147. When the mesh member 148 is coupled to the side of the
shielding member 147, the deposition material is deposited in gaps
of the mesh member 148, which is in the form of a fine sieve, so
that the mesh member 142 easily catches the attaching deposition
material. Thus, dropping of the deposition material back down
toward the deposition source 110 may be prevented.
[0130] FIG. 10 illustrates a shielding member 145 and a mesh member
146 according to another embodiment of the present invention.
[0131] According to this embodiment of the present invention, the
shielding member 145 is formed at a side of the deposition source
110 to surround the deposition source 110 and in the form of an
angle-limiting plate that adjusts an angle of a deposition material
being discharged, thereby guiding a path of the deposition material
that is vaporized from the deposition source 110. That is, the
shielding member 145 is oriented perpendicular to the surface of
the substrate 2 and/or parallel to the direction of spray from the
deposition source 110, so that the shielding member 145 creates a
discharge path, thus guiding or channeling a deposition material
that is vaporized from the deposition source 110, thereby improving
directivity of the deposition material. A portion of the deposition
material vaporized from the deposition source 110, which proceeds
almost in a perpendicular direction, does not collide with the
shielding member 145 but proceeds to the substrate 2. On the other
hand, another portion of the deposition material vaporized from the
deposition source 110 that proceeds obliquely at a predetermined
angle or less collides with the shielding member 145 and is
deposited on the shielding member 145. The directionality of the
deposition material is improved by the shielding member 145, and
shadows may be significantly reduced accordingly.
[0132] However, the shielding member 145, which is in the form of
an angle-limiting plate, is relatively close to the deposition
source 110 (i.e. positioned proximate thereto), and thus, a large
amount of deposition material is deposited thereon, and the
deposition material may easily form drops. When the deposition
material drops from the shielding member 145, which is in the form
of an angle-limiting plate, the deposition material may stop up or
clog the deposition source nozzle unit 120, or cause interference
in an angle of the deposition material being sublimed, and may vary
a sublimation flux and affect the uniformity of a deposition layer,
thereby degrading product characteristics.
[0133] In order to prevent the above problem, the mesh member 146
is further formed on two sides of the shielding member 145, so as
to prevent dropping of the deposition material 115 deposited on the
shielding member 145. When the mesh member 146 is coupled to the
sides of the shielding member 145, the deposition material is
deposited upon the mesh member 146, and the mesh member 146 thus
catches the attaching deposition material, preventing dripping of
the deposition material.
[0134] FIG. 11 is a schematic perspective view of an organic layer
deposition assembly 900 according to another embodiment of the
present invention.
[0135] Referring to FIG. 11, the organic layer deposition assembly
900 includes a deposition source 910, a deposition source nozzle
unit 920, and a patterning slit sheet 950. Also, the organic layer
deposition assembly 900 further includes a shielding member 941 and
a mesh member 942.
[0136] The deposition source 910 includes a crucible 911 that is
filled with a deposition material 915, and a heater 912 that heats
the crucible 911 so as to vaporize the deposition material 915
toward the deposition source nozzle unit 920. The deposition source
nozzle unit 920 is disposed at a side of the deposition source 910,
and a plurality of deposition source nozzles 921 are arranged along
a Y-axis direction in the deposition source nozzle unit 920. The
patterning slit sheet 950 and a frame 955 are further included
between the deposition source 910 and the substrate 2, and the
sheet 950 has a plurality of patterning slits 951. Also, the
deposition source 910, the deposition source nozzle unit 920 and
the patterning slit sheet 950 are coupled to each other via a
connecting member 935.
[0137] The arrangement of the deposition source nozzles 921
included in the deposition source nozzle unit 920 are different
from that of the above-described embodiments of the present
invention, and thus will be described in detail below.
[0138] The deposition source nozzle unit 920 is disposed at a side
of the deposition source 910, in detail, at a side of the
deposition source 910 that faces the substrate 2. Also, the
deposition source nozzles 921 are formed in the deposition source
nozzle unit 920. A deposition material 915 vaporized in the
deposition source 910 passes through the deposition source nozzle
unit 920 to proceed to the substrate 2, which is the deposition
object or target. In this case, if a plurality of deposition source
nozzles 921 are arranged in an X-axis direction, distances between
the deposition source nozzles 921 and the respective patterning
slits 951 are variable, and a shadow is formed due to deposition
material that is discharged from the deposition source nozzles 921
that are relatively far from the patterning slit 951. Accordingly,
by disposing just one deposition source nozzle 921 in the X-axis
direction, generation of shadows may be significantly reduced.
[0139] FIG. 12 is a cross-sectional view of an active matrix-type
organic light-emitting display device manufactured using the
organic layer deposition apparatus 1, according to an embodiment of
the present invention.
[0140] Referring to FIG. 12, the active matrix organic
light-emitting display device 10 according to the current
embodiment is formed on a substrate 2. The substrate 2 may be
formed of a transparent material, for example, glass, plastic, or
metal. An insulating layer 51, such as a buffer layer, is formed on
an entire surface of the substrate 2.
[0141] A thin film transistor (TFT), a capacitor (not shown), and
an organic light-emitting diode (OLED) are disposed on the
insulating layer 51, as illustrated in FIG. 12.
[0142] A semiconductor active layer 52 is formed on an upper
surface of the insulating layer 51 in a set or predetermined
pattern. A gate insulating layer 53 is formed to cover the
semiconductor active layer 52. The semiconductor active layer 52
may include a p-type or n-type semiconductor material.
[0143] A gate electrode 54 of the TFT is formed on a region of the
gate insulating layer 53 corresponding to the semiconductor active
layer 52. An interlayer insulating layer 55 is formed to cover the
gate electrode 54. The interlayer insulating layer 55 and the gate
insulating layer 53 are etched by, for example, dry etching, to
form contact holes exposing parts of the semiconductor active layer
52.
[0144] Source/drain electrodes 56, 57 are formed on the interlayer
insulating layer 55 to contact the semiconductor active layer 52
through the contact holes. A passivation layer 58 is formed to
cover the source/drain electrodes 56, 57, and is etched to expose a
part of one of the source/drain electrodes 56, 57. An insulating
layer (not shown) may be further formed on the passivation layer 58
so as to planarize the passivation layer 58.
[0145] In addition, the OLED displays set or predetermined image
information by emitting red, green, or blue light. The OLED
includes a first electrode 61 disposed on the passivation layer 58.
The first electrode 61 is electrically connected to the drain
electrode 57 of the TFT.
[0146] A pixel-defining layer 60 is formed to cover the first
electrode 61. An opening is formed in the pixel-defining layer 60,
and an organic layer 62, including an emission layer (EML), is
formed in a region defined by the opening. A second electrode 63 is
formed on the organic layer 62.
[0147] The pixel-defining layer 60, which defines individual
pixels, is formed of an organic material. The pixel-defining layer
60 also planarizes the surface of a region of the substrate 30 in
which the first electrode 61 is formed, and in particular, the
surface of the insulating layer 59.
[0148] The first electrode 61 and the second electrode 63 are
insulated from each other, and respectively apply voltages of
opposite polarities to the organic layer 62 to induce light
emission.
[0149] The organic layer 62, including an EML, may be formed of a
low-molecular weight organic material or a high-molecular weight
organic material. When a low-molecular weight organic material is
used, the organic layer 62 may have a single or multi-layer
structure including a hole injection layer (HIL), a hole transport
layer (HTL), the EML, an electron transport layer (ETL), and/or an
electron injection layer (EIL). Non-limiting examples of available
organic materials may include copper phthalocyanine (CuPc),
N,N'-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB), and
tris-8-hydroxyquinoline aluminum (Alq.sub.3).
[0150] The organic layer 62, including an EML, may be formed using
the organic layer deposition apparatus 1 illustrated in FIG. 1.
That is, an organic layer deposition apparatus includes a
deposition source that discharges a deposition material, a
deposition source nozzle unit that is disposed at a side of the
deposition source and includes a plurality of deposition source
nozzles formed therein, and a patterning slit sheet that faces the
deposition source nozzle unit. The patterning slit sheet includes a
plurality of patterning slits formed therein, where the slits are
disposed to be spaced apart by a set or predetermined distance from
a substrate on which the deposition material is to be deposited. In
addition, the deposition material discharged from the organic layer
deposition apparatus 1 (refer to FIG. 1) is deposited on the
substrate 2 (refer to FIG. 1) while the organic layer deposition
apparatus 1 and the substrate 2 are moved relative to each
other.
[0151] After the organic layer 62 is formed, the second electrode
63 may be formed by the same deposition method used to form the
organic layer 62.
[0152] The first electrode 61 may function as an anode, and the
second electrode 63 may function as a cathode. Alternatively, the
first electrode 61 may function as a cathode, and the second
electrode 63 may function as an anode. The first electrode 61 may
be patterned to correspond to individual pixel regions, and the
second electrode 63 may be formed to cover all the pixels.
[0153] The first electrode 61 may be formed as a transparent
electrode or a reflective electrode. Such a transparent electrode
may be formed of indium tin oxide (ITO), indium zinc oxide (IZO),
zinc oxide (ZnO), or indium oxide (In.sub.2O.sub.3). Such a
reflective electrode may be formed by forming a reflective layer
from silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt),
palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium
(Ir), chromium (Cr) or a compound thereof, and then forming a layer
of ITO, IZO, ZnO, or In.sub.2O.sub.3on the reflective layer. The
first electrode 61 may be formed by forming a layer by, for
example, sputtering, and then patterning the layer by, for example,
photolithography.
[0154] The second electrode 63 may also be formed as a transparent
electrode or a reflective electrode. When the second electrode 63
is formed as a transparent electrode, the second electrode 63 is
used as a cathode. To this end, such a transparent electrode may be
formed by depositing a metal having a low work function, such as
lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca),
lithium fluoride/aluminum (LiF/AI), aluminum (Al), silver (Ag),
magnesium (Mg), or a compound thereof on a surface of the organic
layer 62, and forming an auxiliary electrode layer or a bus
electrode line thereon from ITO, IZO, ZnO, In.sub.2O.sub.3, or the
like. When the second electrode 63 is formed as a reflective
electrode, the reflective layer may be formed by depositing Li, Ca,
LiF/Ca, LiF/Al, Al, Ag, Mg, or a compound thereof on the entire
surface of the organic layer 62. The second electrode 63 may be
formed using the same deposition method used to form the organic
layer 62 described above.
[0155] The organic layer deposition apparatuses according to the
embodiments of the present invention described above may be applied
to form an organic layer or an inorganic layer of an organic TFT,
and to form layers from various materials.
[0156] As described above, the one or more embodiments of the
present invention provide organic layer deposition apparatuses that
are suitable for use in the mass production of a large substrate
and enable high-definition patterning. Embodiments of the invention
also include methods of manufacturing organic light-emitting
display devices by using the same, and organic light-emitting
display devices manufactured using the methods.
[0157] Although a few embodiments of the present invention have
been shown and described, it would be appreciated by those skilled
in the art that changes may be made in this embodiment without
departing from the principles and spirit of the invention, the
scope of which is defined in the claims and their equivalents.
* * * * *