U.S. patent application number 14/277217 was filed with the patent office on 2014-11-20 for semiconductor device, method of positioning semiconductor device, and positioning apparatus for semiconductor device.
This patent application is currently assigned to OLYMPUS CORPORATION. The applicant listed for this patent is OLYMPUS CORPORATION. Invention is credited to Masato MIKAMI.
Application Number | 20140339711 14/277217 |
Document ID | / |
Family ID | 51895155 |
Filed Date | 2014-11-20 |
United States Patent
Application |
20140339711 |
Kind Code |
A1 |
MIKAMI; Masato |
November 20, 2014 |
SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE,
AND POSITIONING APPARATUS FOR SEMICONDUCTOR DEVICE
Abstract
A semiconductor device includes: a semiconductor chip that has a
first connection terminal for wiring connection; a substrate that
has a second connection terminal for wiring connection, the second
connection terminal being electrically connected to the first
connection terminal; and a reflective surface that reflects light
from the first connection terminal and the second connection
terminal in a thickness direction of the substrate or the
semiconductor chip.
Inventors: |
MIKAMI; Masato; (Tokyo,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
OLYMPUS CORPORATION |
Tokyo |
|
JP |
|
|
Assignee: |
OLYMPUS CORPORATION
Tokyo
JP
|
Family ID: |
51895155 |
Appl. No.: |
14/277217 |
Filed: |
May 14, 2014 |
Current U.S.
Class: |
257/784 ;
356/399 |
Current CPC
Class: |
H01L 2224/133 20130101;
H01L 2223/5442 20130101; H01L 2924/12042 20130101; H01L 23/544
20130101; H01L 2924/014 20130101; H01L 2924/00014 20130101; H01L
2924/00014 20130101; H01L 2924/00 20130101; H01L 2224/1329
20130101; H01L 2224/133 20130101; H01L 2924/014 20130101; H01L
2924/12042 20130101; H01L 2223/54473 20130101; H01L 2223/54486
20130101; H01L 2223/54426 20130101; H01L 2224/81121 20130101; H01L
2224/131 20130101; H01L 2224/1329 20130101; H01L 2224/131 20130101;
H01L 24/81 20130101 |
Class at
Publication: |
257/784 ;
356/399 |
International
Class: |
H01L 23/544 20060101
H01L023/544; H01L 21/66 20060101 H01L021/66 |
Foreign Application Data
Date |
Code |
Application Number |
May 20, 2013 |
JP |
2013-106330 |
Claims
1. A semiconductor device, comprising: a semiconductor chip that
has a first connection terminal for wiring connection; a substrate
that has a second connection terminal for wiring connection, the
second connection terminal being electrically connected to the
first connection terminal; and a reflective surface that reflects
light from the first connection terminal and the second connection
terminal in a thickness direction of the substrate or the
semiconductor chip.
2. The semiconductor device according to claim 1, wherein the
reflective surface is a part of an outer surface of a prism mounted
on the semiconductor chip.
3. The semiconductor device according to claim 2, further
comprising a transmission cable that is connected on a reverse side
of a connection surface of the substrate to the semiconductor chip,
and is positioned according to an image reflected by the reflective
surface when being connected.
4. The semiconductor device according to claim 2, wherein the
semiconductor chip has a first alignment mark on a connection
surface to the substrate, and the substrate has a second alignment
mark on a reverse side of a connection surface to the semiconductor
chip.
5. The semiconductor device according to claim 1, wherein the
reflective surface is formed on a base substrate to which the
semiconductor chip is connected.
6. The semiconductor device according to claim 1, wherein the
reflective surface is a part of a trench portion that is formed in
the substrate and that accommodates the semiconductor chip.
7. A method of positioning a semiconductor device in which a
semiconductor chip and a substrate are connected to each other, the
method comprising the steps of: first positioning of positioning in
a field of view of an imaging device a reflective surface that
reflects light from a first connection terminal of the
semiconductor chip for wiring connection; and second positioning of
positioning the substrate according to an image of a second
connection terminal of the substrate for wiring connection and an
image of the first connection terminal, both of the images being
projected on the reflective surface.
8. The method according to claim 7, further comprising a step of
roughly adjusting a position of the second connection terminal of
the substrate according to a first alignment mark formed on a
connection surface of the semiconductor chip to the substrate and a
second alignment mark formed on a reverse side of a connection
surface of the substrate to the semiconductor chip, after the step
of first positioning.
9. A positioning apparatus for a semiconductor device that
includes: a semiconductor chip having a first connection terminal
for wiring connection; a substrate having a second connection
terminal for wiring connection, the second connection terminal
being electrically connected to the first connection terminal; and
a reflective surface that reflects light, the positioning apparatus
comprising: a stage that fixes the semiconductor chip having the
first connection terminal for wiring connection and is movable
within one plane; a tool that suctions and fixes the substrate
having the second connection terminal for wiring connection and
mounts the substrate on the semiconductor chip; an imaging device
that images a reflective surface for projecting images of the first
connection terminal and the second connection terminal; and a
control unit that controls movement of the stage based on the
images of the first connection terminal and the second connection
terminal that are projected on the reflective surface, the images
having been imaged by the imaging device.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims the benefit of
priority from Japanese Patent Application No. 2013-106330, filed on
May 20, 2013, the entire contents of which are incorporated herein
by reference.
BACKGROUND
[0002] 1. Technical Field
[0003] The disclosure relates to a semiconductor device, a method
of positioning the semiconductor device, and a positioning
apparatus for the semiconductor device.
[0004] 2. Related Art
[0005] When a semiconductor chip is connected to a mount substrate
to manufacture a semiconductor device, positioning between the
semiconductor chip and the mount substrate is performed, based on
an alignment mark formed on the semiconductor chip and/or the mount
substrate, conventionally.
[0006] As techniques of performing positioning highly accurately by
using an alignment mark: a technique of forming, in a region around
an alignment mark of a semiconductor substrate, a sloped region
that is sloped with respect to a normal direction of the substrate,
to thereby reduce a normal direction reflectivity of laser light
irradiated from the normal direction to the sloped region and
precisely detect the alignment mark (for example, see Japanese
Laid-open Patent Application No. 11-330347); and a technique of
making a contrast difference between an alignment mark and a
background region uniform to thereby improve visibility of the
alignment mark (for example, see Japanese Laid-open Patent
Application No. 2009-194119), are disclosed.
SUMMARY
[0007] In some embodiments, a semiconductor device includes: a
semiconductor chip that has a first connection terminal for wiring
connection; a substrate that has a second connection terminal for
wiring connection, the second connection terminal being
electrically connected to the first connection terminal; and a
reflective surface that reflects light from the first connection
terminal and the second connection terminal in a thickness
direction of the substrate or the semiconductor chip.
[0008] In some embodiments, a method of positioning a semiconductor
device in which a semiconductor chip and a substrate are connected
to each other includes the steps of: first positioning of
positioning in a field of view of an imaging device a reflective
surface that reflects light from a first connection terminal of the
semiconductor chip for wiring connection; and second positioning of
positioning the substrate according to an image of a second
connection terminal of the substrate for wiring connection and an
image of the first connection terminal, both of the images being
projected on the reflective surface.
[0009] In some embodiments, a positioning apparatus for a
semiconductor device is provided. The semiconductor device
includes: a semiconductor chip having a first connection terminal
for wiring connection; a substrate having a second connection
terminal for wiring connection, the second connection terminal
being electrically connected to the first connection terminal; and
a reflective surface that reflects light. The positioning apparatus
includes: a stage that fixes the semiconductor chip having the
first connection terminal for wiring connection and is movable
within one plane; a tool that suctions and fixes the substrate
having the second connection terminal for wiring connection and
mounts the substrate on the semiconductor chip; an imaging device
that images a reflective surface for projecting images of the first
connection terminal and the second connection terminal; and a
control unit that controls movement of the stage based on the
images of the first connection terminal and the second connection
terminal that are projected on the reflective surface, the images
having been imaged by the imaging device.
[0010] The above and other features, advantages and technical and
industrial significance of this invention will be better understood
by reading the following detailed description of presently
preferred embodiments of the invention, when considered in
connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a cross section diagram of a semiconductor device
according to a first embodiment of the present invention;
[0012] FIG. 2 is a top view before connection of the semiconductor
device of FIG. 1;
[0013] FIG. 3 is a block diagram illustrating a positioning
apparatus for the semiconductor device according to the first
embodiment of the present invention;
[0014] FIG. 4 is a flow chart illustrating a method of
manufacturing the semiconductor device according to the first
embodiment of the present invention;
[0015] FIG. 5 is a cross section diagram illustrating positioning
of a semiconductor device according to a second embodiment of the
present invention;
[0016] FIG. 6 is a top view illustrating positioning of the
semiconductor device according to the second embodiment of the
present invention;
[0017] FIG. 7 is a diagram illustrating projection of an image of a
connection part;
[0018] FIG. 8 is a cross section diagram illustrating positioning
of a semiconductor device according to a third embodiment of the
present invention;
[0019] FIG. 9 is a top view illustrating positioning of the
semiconductor device according to the third embodiment of the
present invention;
[0020] FIG. 10 is a perspective diagram illustrating a
semiconductor device according to a modified example of the third
embodiment of the present invention; and
[0021] FIG. 11 is a cross section diagram along line A-A of the
semiconductor device of FIG. 10.
DETAILED DESCRIPTION
[0022] Hereinafter, with reference to the appended drawings, modes
for carrying out the present invention (hereinafter, referred to as
"embodiments") will be described. The present invention is not
limited by the embodiments. Further, in describing the drawings,
the same portions are appended with the same reference signs.
Further, the drawings are schematic, and it is to be noted that the
relation between the thickness and width of each component and the
ratios among the respective components are different from the
actual. Further, a portion is included, which has different size
relations and ratios among the drawings.
First Embodiment
[0023] FIG. 1 is a cross section diagram illustrating a
semiconductor device 100 according to a first embodiment of the
present invention. FIG. 2 is a top view before connection of the
semiconductor device 100 of FIG. 1. The semiconductor device 100
according to the first embodiment of the present invention
includes: a semiconductor chip 10, which is a solid-state image
sensing element; a mount substrate 20; and a prism 30 that emits
light incident from an imaging optical system to the semiconductor
chip 10.
[0024] In the semiconductor chip 10, a first connection terminal 11
for wiring connection, an imaging region 12 that converts an
optical signal input from the prism 30 to an electric signal, and
an alignment mark 13 are formed on a same surface.
[0025] In the mount substrate 20, a second connection terminal 21
for wiring connection is formed, and an alignment mark 22, which is
on a reverse side of a surface on which the second connection
terminal 21 is formed, is formed. The first connection terminal 11
and second connection terminal 21 are bumps formed by screen
printing, plating, or the like.
[0026] The prism 30 has a first prism 31 and a second prism 32,
reflects, by a connection surface 33 between the first prism 31 and
second prism 32, light incident on the first prism 31 from a
non-illustrated imaging optical system, and emits the reflected
light to the imaging region 12. A sloped surface of the first prism
31 and not contacting the second prism 32 forms a reflective
surface 34 that reflects light from the first connection terminal
11 and second connection terminal 21.
[0027] As illustrated in FIG. 2, the reflective surface 34 is
formed at a position such that the reflective surface 34 is able to
reflect the light from the first connection terminal 11 and second
connection terminal 21 in a thickness direction of the mount
substrate 20, and the reflective surface 34 projects thereon an
image 11a of the first connection terminal 11 and an image 21a of
the second connection terminal 21. By visually recognizing the
image 11a and image 21a projected on the reflective surface 34 from
above, that is, from the reverse side of a connection surface of
the mount substrate 20, positioning of the semiconductor chip 10
and mount substrate 20 is possible. Further, in the first
embodiment, the semiconductor chip 10 and the mount substrate 20
are formed respectively with the alignment marks 13 and 22, and
after roughly adjusting positions of the semiconductor chip 10 and
mount substrate 20 using the alignment marks 13 and 22, the
positions of the semiconductor chip 10 and mount substrate 20 are
finely adjusted using the image 11a and image 21a projected on the
reflective surface 34, and thus highly accurate positioning is
possible in a short period of time. In FIG. 2, the reflective
surface 34 projects thereon the image 11a of the first connection
terminal 11, the image 21a of the second connection terminal 21,
and an image 20a of a part of the mount substrate 20, but the
reflective surface 34 may just have an area that allows projection
of at least the image 11a of the first connection terminal 11 and
the image 21a of the second connection terminal 21 in the thickness
direction of the mount substrate.
[0028] The semiconductor chip 10 and the mount substrate 20 are
connected in parallel by a connection material 15 such as a
soldering paste, an anisotropic conductive film (ACF), an
anisotropic conductive paste), or the like, such that the first
connection terminal 11 and the second connection terminal 21 face
each other.
[0029] Next, a manufacturing method and a manufacturing device for
the semiconductor device 100 according to the first embodiment are
described. FIG. 3 is a block diagram illustrating a positioning
apparatus for the semiconductor device 100 according to the first
embodiment of the present invention.
[0030] A positioning apparatus 200 for the semiconductor device 100
includes: an imaging device 210 such as a CCD that captures the
image 11a of the first connection terminal 11 and the image 21a of
the second connection terminal 21 that are projected on the
reflective surface 34; a control unit 220 that performs control of
each unit; a stage 230 that fixes the semiconductor chip 10 and is
able to move the fixed semiconductor chip 10 in one plane
(X-direction, Y-direction, and O-direction); a tool 240 that holds
the mount substrate 20 and mounts the held mount substrate 20 on
the semiconductor chip 10 fixed on the stage 230; and a display
unit 250 that outputs an image captured by the imaging device
210.
[0031] The imaging device 210 is fixed above the mount substrate 20
that is to be positioned, and the imaging device 210 captures the
image 11a of the first connection terminal 11 and the image 21a of
the second connection terminal 21, which are projected on the
reflective surface 34. Further, the imaging device 210 outputs the
captured images to the control unit 220. The imaging device 210
preferably has an angle change mechanism that is able to make
adjustment according to an angle of the reflective surface 34 and a
vertical axis Z adjustment mechanism for adjusting a focus
point.
[0032] When image data are input by the imaging device 210, the
control unit 220 performs the positioning of the semiconductor chip
10 and mount substrate 20 by performing a pattern matching process,
focus adjustment, and the like on the image data. Further, the
control unit 220 outputs the image data input from the imaging
device 210 to the display unit 250.
[0033] The control unit 220 may be one that controls a
non-illustrated coating mechanism for the connection material 15.
Above the semiconductor chip 10, the coating mechanism for the
connection material 15 is fixed in a retractable manner and the
coating mechanism supplies the connection material 15 to a
connection part of the semiconductor chip 10, that is, onto the
first connection terminal 11, by a discharge device, such as a
syringe. The coating mechanism preferably has a temperature control
device, a displacement meter, and the like, for the syringe or the
like. The coating mechanism may be configured to perform coating of
the connection material on a specified position by image
recognition using the imaging device 210 and control unit 220,
instead of using the displacement meter. A positioning process by
the imaging device 210 and the control unit 220 is performed after
the coating mechanism is retracted from above the semiconductor
chip 10.
[0034] The stage 230 moves on the one plane (X-direction,
Y-direction, and .theta.-direction), under control of the control
unit 220, to place the semiconductor chip 10 to a specified
position by suctioning and fixing the semiconductor chip 10.
[0035] Under the control of the control unit 220, the tool 240
picks up the mount substrate 20 by suction-fixing the mount
substrate 20 using a suction unit or the like and mounts the picked
up mount substrate 20 on the semiconductor chip 10 fixed on the
stage 230. For the movement of the semiconductor chip 10 and mount
substrate 20 by the stage 230 and tool 240, a servomotor is
used.
[0036] When the control unit 220 determines, by using the pattern
matching process, that the semiconductor chip 10 and the mount
substrate 20 are not at the specified positions, the tool 240
moves, under the control of the control unit 220, the mount
substrate 20 fixed by the suction unit or the like to the specified
position with respect to the semiconductor chip 10.
[0037] The positioning of the semiconductor chip 10 and the mount
substrate 20 by the positioning apparatus 200 may be automatically
performed by software built in the control unit 220 or operated
manually based on an image displayed on the display unit 250.
Further, the coating of the connection material 15 by the coating
mechanism and the movement of the semiconductor chip 10 and mount
substrate 20 may be performed automatically by software or operated
manually based on the image displayed on the display unit 250.
[0038] Next, the method of manufacturing the semiconductor device
100 by using the positioning apparatus 200 will be described. FIG.
4 is a flow chart illustrating the method of manufacturing the
semiconductor device 100 according to the first embodiment of the
present invention.
[0039] First, by capturing, by the imaging device 210, an image of
the alignment mark 13 of the semiconductor chip 10 fixed on the
stage 230, the alignment mark 13 of the semiconductor chip 10 is
recognized (step S1). By the recognition of the alignment mark 13
of the semiconductor chip 10, the positions of the semiconductor
chip 10 and the first connection terminal 11 are recognized, and
the connection material 15 is coated on the first connection
terminal 11 of the semiconductor chip 10 by the coating mechanism
(step S2).
[0040] After coating the connection material 15 and retracting the
coating mechanism from above the semiconductor chip 10 (step S3),
the tool 240 is set (step S4), and the mount substrate 20 is picked
up by the tool 240 (step S5).
[0041] The alignment mark 22 of the mount substrate 20 held by the
tool 240 is recognized through imaging by the imaging device 210
(step S6). By the recognized alignment mark 22 and the alignment
mark 13 of the semiconductor chip 10 recognized in step S1, under
the control of the control unit 220, the positions of the
semiconductor chip 10 and mount substrate 20 are roughly adjusted
by movement of the tool 240 (step S7).
[0042] After the rough adjustment by the alignment marks 13 and 22,
the image 11a of the first connection terminal 11 and the image 21a
of the second connection terminal 21, which are projected on the
reflective surface 34, are captured by the imaging device 210 to be
recognized (step S8). The control unit 220 performs pattern
matching or the like on the image data captured by the imaging
device 210 to thereby finely adjust the positions of the
semiconductor chip 10 and mount substrate 20 (step S9).
[0043] After the fine adjustment of the positions, the first
connection terminal 11 and second connection terminal 21 come into
contact with each other by the movement of the tool 240 (step S10).
If misalignment is detected after coming into contact (step S11:
YES), fine adjustment of the positions at step S9 is performed
again, and if no misalignment is detected (step S11: NO), the first
connection terminal 11 and the second connection terminal 21 are
connected to each other (step S12).
[0044] The semiconductor device 100 according to the first
embodiment includes the optical reflective surface 34, which is a
part of an outer surface of the prism 30, and is able to project
the image 11a of the first connection terminal 11 and the image 21a
of the second connection terminal 21 on the reflective surface 34,
and thus, positioning that conventionally required two devices (top
view and side view) is able to be performed by the single imaging
device 210 arranged at the reverse side of the connection surface
of the mount substrate 20. Further, since the semiconductor device
100 according to the first embodiment has the alignment marks 13
and 22, it becomes possible to perform positioning (rough
adjustment) by the alignment marks 13 and 22 up to positions where
the image 21a of the connection terminal 21 is projected on the
reflective surface 34, and thereafter perform positioning by the
images 11a and 21a projected on the reflective surface 34, and
thus, fast and highly accurate positioning and connection between
connection terminals become possible.
[0045] In the first embodiment, the alignment marks 13 and 22 are
respectively formed in the semiconductor chip 10 and the mount
substrate 20, and the positions of the semiconductor chip 10 and
mount substrate 20 are roughly adjusted by the alignment marks 13
and 22, but without forming the alignment marks 13 and 22,
positioning between the semiconductor chip 10 and the mount
substrate 20 may be performed based only on the images 11a and 21a
projected on the reflective surface 34. If the positioning between
the semiconductor chip 10 and the mount substrate 20 is performed
based only on the images 11a and 21a projected on the reflective
surface 34, positioning in the Y-direction of FIG. 2 may be
performed by pattern matching with respect to the positions of the
images 11a and 21a projected on the reflective surface 34, and
positioning in the X-direction may be performed by focus adjustment
of the images 11a and 21a.
Second Embodiment
[0046] A semiconductor device 100A according to a second embodiment
includes a transmission cable 40 connected on the reverse side of
the connection surface, which is of the mount substrate 20 and
which is connected to the semiconductor chip 10. FIG. 5 is a cross
section diagram illustrating positioning of the semiconductor
device 100A according to the second embodiment of the present
invention. FIG. 6 is a top view illustrating the positioning of the
semiconductor device 100A according to the second embodiment of the
present invention. FIG. 7 is a diagram illustrating projection of
an image of a connection part.
[0047] As illustrated in FIGS. 5 and 6, the semiconductor device
100A according to the second embodiment includes the transmission
cable 40 connected on the reverse side of the connection surface,
which is of the mount substrate 20 and which is connected to the
semiconductor chip 10. The transmission cable 40 includes a core
wire 41 formed of a conductor such as copper, and an insulation
layer 42 that covers an outer periphery of the core wire 41.
[0048] On the reverse side of the connection surface of the mount
substrate 20 to the semiconductor chip 10, a connection land 23
that connects the transmission cable 40 is formed. After being
positioned on the connection land 23, the core wire 41 of the
transmission cable 40 is connected by a non-illustrated
electrically conductive joining member such as a solder, ACF, ACP,
or the like.
[0049] The semiconductor device 100A according to the second
embodiment is different from the semiconductor device 100 of the
first embodiment in that only one prism 30A is used. In the second
embodiment, because only one prism 30A is used, the reflective
surface 34 is able to be secured largely. Thereby, in addition to
the image 11a and image 21a of the first connection terminal 11 and
second connection terminal 21, an image 23a of the connection land
23 of the mount substrate 20 and an image 40a of the transmission
cable 40 are able to be projected on the reflective surface 34.
[0050] Further, as illustrated in FIG. 7, an angle of a slope of
the prism 30A is freely settable, and thus reflected light is able
to be reflected in any direction. The angle of the slope of the
prism 30A is preferably 45.degree..
[0051] After performing positioning and connection of the
semiconductor chip 10 and mount substrate 20 by using the
reflective surface 34 similarly to the first embodiment, the
semiconductor device 100A according to the second embodiment is
manufactured by performing positioning and connection of an end
portion of the exposed core wire 41 of the transmission cable 40,
by using the reflective surface 34.
[0052] According to the second embodiment, even when the
transmission cable 40 is also mounted on the mount substrate 20,
highly accurate positioning is possible by using a reflected image.
When an electronic part or the like other than the transmission
cable 40 is mounted on the mount substrate 20 also, positioning
using the reflective surface 34 is possible.
Third Embodiment
[0053] In a semiconductor device 100B according to a third
embodiment, a reflective surface 51 is formed on a base substrate
50 on which the semiconductor chip 10 is mounted, and the
semiconductor chip 10 is connected to the mount substrate 20 at a
reverse side of a connection surface of the semiconductor chip 10
to the base substrate 50. FIG. 8 is a cross section diagram
illustrating positioning of the semiconductor device 100B according
to the third embodiment of the present invention. FIG. 9 is a top
view illustrating positioning of the semiconductor device 100B
according to the third embodiment of the present invention.
[0054] In the semiconductor device 100B according to the third
embodiment, the reflective surface 51 is formed on the base
substrate 50 on which the semiconductor chip 10 is mounted. The
reflective surface 51 has a reflective coat layer formed thereon,
by forming a slope on the base substrate 50 and thereafter forming
a vapor deposition film or the like of a metal on the slope.
[0055] In the semiconductor device 100B of the third embodiment,
after positioning is performed according to the image 11a of the
first connection terminal 11 of the semiconductor chip 10 and the
image 21a of the second connection terminal 21 of the mount
substrate 20, which are projected on the reflective surface 51, the
first connection terminal 11 and the second connection terminal 21
are connected by the connection material.
[0056] In the semiconductor device 100B according to the third
embodiment, by providing the reflective surface 51 on the base
substrate 50 to be mounted with the semiconductor chip 10, highly
accurate positioning becomes possible by just a single imaging
device.
[0057] The reflective surface may be formed on a substrate instead
of the base substrate 50. FIG. 10 is a perspective diagram
illustrating a semiconductor device 100C according to a modified
example of the third embodiment of the present invention. FIG. 11
is a cross section diagram along line A-A of the semiconductor
device 100C of FIG. 10.
[0058] The semiconductor device 100C according to the modified
example includes: the semiconductor chip 10; a substrate 60 having
a trench portion 62 in which the semiconductor chip 10 is mounted;
and a reflective surface 63 formed in the trench portion 62. The
reflective surface 63 is formed on one of side surfaces of the
trench portion 62 and similarly to the third embodiment, after a
slope is formed thereon, a reflective coat layer is formed thereon
by a vapor deposition film or the like of metal. The substrate 60
serves as a relay substrate to be connected to one or two circuit
boards.
[0059] In the semiconductor device 100C, after positioning
according to the image of the first connection terminal 11 of the
semiconductor chip 10 and an image of a second connection terminal
61 of the substrate 60, which are projected on the reflective
surface 63, is performed, the first connection terminal 11 and the
second connection terminal 61 are connected to each other by a
connection material 16.
[0060] In the semiconductor device 100C according to the modified
example of the third embodiment, by providing the reflective
surface 63 on the base substrate 60 to be mounted with the
semiconductor chip 10, highly accurate positioning becomes possible
by a single imaging device.
[0061] As described above, the semiconductor device, the method of
positioning the semiconductor device, and the positioning apparatus
for the semiconductor device are useful for a semiconductor device
that requires highly accurate positioning.
[0062] According to some embodiments, because positioning while
visually recognizing the connection terminals projected on the
reflective surfaces is possible, accurate positioning becomes
possible.
[0063] Additional advantages and modifications will readily occur
to those skilled in the art. Therefore, the invention in its
broader aspects is not limited to the specific details and
representative embodiments shown and described herein. Accordingly,
various modifications may be made without departing from the spirit
or scope of the general inventive concept as defined by the
appended claims and their equivalents.
* * * * *