U.S. patent application number 14/253670 was filed with the patent office on 2014-11-13 for detection apparatus and method of chemical mechanical polishing conditioner.
This patent application is currently assigned to Kinik Company. The applicant listed for this patent is Kinik Company. Invention is credited to Jen Feng CHEN, Chia-Feng CHIU, Jui-Lin CHOU, Wen-Jen LIAO, Yi-Ting LIN, Chia Chun WANG.
Application Number | 20140335761 14/253670 |
Document ID | / |
Family ID | 51865110 |
Filed Date | 2014-11-13 |
United States Patent
Application |
20140335761 |
Kind Code |
A1 |
CHOU; Jui-Lin ; et
al. |
November 13, 2014 |
DETECTION APPARATUS AND METHOD OF CHEMICAL MECHANICAL POLISHING
CONDITIONER
Abstract
The present invention relates to a detection apparatus of
chemical mechanical polishing conditioner, comprising: a working
platform with a working plane; a placement base disposed on the
working plane of the working platform, for carrying a chemical
mechanical polishing conditioner; an image capture device forming
one or a plurality of captured images on different regions of the
chemical mechanical polishing conditioner; a display device; an
image recognition module, wherein the captured images are performed
a color matching by the image recognition module to determine one
or a plurality of risk diamonds on the chemical mechanical
polishing conditioner, and the coordinate location of the risk
diamonds are outputted into the display device; and a mobile
platform for moving the risk diamonds to specified locations. A
detection method of the above mentioned detection apparatus is also
disclosed.
Inventors: |
CHOU; Jui-Lin; (Hualien
County, TW) ; WANG; Chia Chun; (New Taipei, TW)
; CHIU; Chia-Feng; (New Taipei, TW) ; LIAO;
Wen-Jen; (New Taipei, TW) ; CHEN; Jen Feng;
(New Taipei, TW) ; LIN; Yi-Ting; (New Taipei,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kinik Company |
Taipei |
|
TW |
|
|
Assignee: |
Kinik Company
Taipei
TW
|
Family ID: |
51865110 |
Appl. No.: |
14/253670 |
Filed: |
April 15, 2014 |
Current U.S.
Class: |
451/5 |
Current CPC
Class: |
B24B 49/186 20130101;
B24B 49/12 20130101; B24B 53/017 20130101 |
Class at
Publication: |
451/5 |
International
Class: |
B24B 49/12 20060101
B24B049/12; B24B 49/18 20060101 B24B049/18 |
Foreign Application Data
Date |
Code |
Application Number |
May 9, 2013 |
TW |
102116516 |
Claims
1. A detection apparatus of a chemical mechanical polishing
conditioner, comprising: a working platform with a working plane; a
placement base disposed on the working plane of the working
platform, for carrying a chemical mechanical polishing conditioner;
an image capture device disposed on the placement base of working
platform, and the image capture device and the placement base
parallel to the working platform, wherein one or a plurality of
captured images on different regions of the chemical mechanical
polishing conditioner is formed by the image capture device; a
display device; an image recognition module electrically connected
to the image capture device and the display device, wherein the
captured images is performed a color matching by the image
recognition module to determine one or a plurality of risk diamonds
on the chemical mechanical polishing conditioner, and the
coordinate locations of the risk diamonds are outputted to the
display device; and a mobile platform made the risk diamond move to
a specified location.
2. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the image capture device is a
charge coupled device (CCD) or an industrial camera.
3. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the placement base and the image
capture device are located on the working plane and removed
freely.
4. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the detection apparatus further
comprise a light source device disposed over the placement base and
irradiated light toward the chemical mechanical polishing
conditioner.
5. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the image capture device is a color
formatting data.
6. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the risk diamonds are diamond
particles capable of reflecting incident light.
7. The detection apparatus of a chemical mechanical polishing
conditioner of claim 6, wherein the diamond particles have twin
crystal structures or internal crack structures.
8. The detection apparatus of a chemical mechanical polishing
conditioner of claim 6, wherein the diamond particles are yellow
diamonds including nitrogen-containing dopants.
9. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the risk diamonds are shown yellow
color in the image capture device.
10. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the image recognition module
determines the risk diamonds shown yellow color through the color
matching.
11. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the detection apparatus further
comprise a removing device for removing the risk diamonds from the
chemical mechanical polishing conditioner.
12. The detection apparatus of a chemical mechanical polishing
conditioner of claim 1, wherein the removing device is a high-power
laser, a water jet device, an endpoint oscillator or an artificial
shave tool.
13. A detection method of a chemical mechanical polishing
conditioner, wherein the chemical mechanical polishing conditioner
is performed a detection to determine one or a plurality of risk
diamonds on the chemical mechanical polishing conditioner through
the detection apparatus of a chemical mechanical polishing
conditioner according to claim 1.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefits of the Taiwan Patent
Application Serial Number 102116516, filed on May 9, 2013, the
subject matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a detection apparatus and a
method of a chemical mechanical polishing conditioner, and more
particularly to a chemical mechanical polishing conditioner which
may provide a detection of risk diamond on the chemical mechanical
polishing conditioner.
[0004] 2. Description of Related Art
[0005] Chemical mechanical polishing (CMP) is a common polishing
process in various industries, which can be used to grind the
surfaces of various articles, including ceramics, silicon, glass,
quartz, or a metal chip. In addition, with the rapid development of
integrated circuits, chemical mechanical polishing becomes one of
the common techniques for wafer planarization due to its ability to
achieve global planarization.
[0006] During the chemical mechanical polishing process of
semiconductor, impurities or uneven structure on the surface of a
wafer are removed by contacting the wafer (or the other
semiconductor elements) with a polishing pad and using a polishing
liquid if necessary, through the chemical reaction and mechanical
force. When the polishing pad has been used for a certain period of
time, the polishing performance and efficiency are reduced because
the debris produced in the polishing process may accumulate on the
surface of the polishing pad. Therefore, a conditioner can be used
to condition the surface of the polishing pad, such that the
surface of the polishing pad is re-roughened and maintained at an
optimum condition for polishing. Though, in the process for
manufacturing a conditioner, it is necessary to dispose an abrasive
layer by mixing abrasive particles and a binding layer on the
substrate surface, and to fix the abrasive layer to the surface of
the substrate by brazing or sintering methods. However, during the
manufacturing process of the above conditioner, or when the
conditioner conditions a polishing pad, the diamond particles on
the conditioner may be broken to form risk diamonds, such that the
conditioner may become a defective one. Therefore, it is necessary
to implement a detection process to ensure an expected polishing
effect in the subsequent steps. It is a known method to use an
optical microscope (OM) to perform a visual observation to
determine a pad conditioner has any risk diamonds. When risk
diamonds are observed, the positions would be marked by a marked
method (such as oil pen) and taken a photograph. Finally, the
photos before and after the grinding process would be compared by a
person.
[0007] In the known technology, it discloses an equipment for
detecting a defect of a polishing pad conditioner, comprising a
working platform, a placement base and an image capture device
disposed on the working platform, a display module, and an image
processing unit. The image processing unit includes an image
recognition module, a data storage device and a comparison module,
wherein the data storage device is electrically connected with the
image recognition module and the comparison module, and stores a
plurality of reference image data. The image recognition module
transfers the sample image to a sample image data having the same
format as the reference image data. The comparison module executes
a comparison of the sample image data and the corresponded
reference image data to determine whether any one of the sample
image data has any defect. The sample images having defects and
without defects would be separately marked and shown in the display
module.
[0008] Besides, in the other known technology, it discloses a
conditioner of a chemical mechanical polishing machine, which
comprises: a conditioner substrate; a first conductive layer and a
second conductive layer installed on the conditioner substrate, in
which the first conductive layer and the second conductive layer
are isolated through insulation; a plural of diamonds infixed into
the first conductive layer and the second conductive layer; and an
adhesion layer installed on the conditioner substrate to fix the
diamonds, in which the first conductive layer and the second
conductive layer can be used to detect diamond fall-off, when the
diamonds fall off, conductive material enters the location
previously occupied by the diamonds, and short circuit will occur
between the first conductive layer and the second conductive
layer.
[0009] However, in the above-mentioned chemical mechanical
polishing conditioner, the lacking or fall-off abrasive particles
on the conditioner are only detected by an image analysis or a
short circuit current. Therefore, there is an urgent need to
develop a detection apparatus and a method of a chemical mechanical
polishing conditioner, which cannot only detect and determine
whether the chemical mechanical polishing conditioner has risk
diamonds or not, but also remove risk diamonds on the chemical
mechanical polishing conditioner, thereby avoiding scratches and
breakages produced on the polishing pad due to the risk diamonds
during a chemical mechanical polishing process.
SUMMARY OF THE INVENTION
[0010] An object of the present invention is to provide a detection
apparatus and a method of a chemical mechanical polishing
conditioner to detect whether the chemical mechanical polishing
conditioner has risk diamonds or not, and to remove risk diamond on
the chemical mechanical polishing conditioner, thereby avoiding
scratches and breakages produced on the polishing pad due to the
risk diamonds during a chemical mechanical polishing process.
[0011] The present invention is different from the well-known
methods for detecting risk diamonds in which a polishing pad is
directly performed a polishing test by the conditioner, or the
total areas of the conditioner are performed a check by a person. A
person wastes his energy and time on the well-known methods, and
the detection results of the well-known method are still doubtful.
During a manufacturing process of the general chemical mechanical
polishing conditioner, the brazing powder comprising a metal alloy
and the diamond particles are disposed on a surface of a substrate
made of stainless steel and performed a heat brazing process, so
that the diamond particles are fixed on the surface of the
substrate by the brazing ally to complete a manufacture of the
chemical mechanical polishing conditioner. In the general chemical
mechanical polishing conditioner, the yellow diamonds including
nitrogen-containing dopants are often used as the abrasive
particles. After the heat brazing process, the diamonds shown
yellow color in origin become black color and the surfaces of the
completed chemical mechanical polishing conditioner are shown
totally block color by a person's eyes, because the side of the
brazing surface can absorbs incident light after hard brazing
process. However, during an actual process for manufacturing the
chemical mechanical polishing conditioner, a part of diamond
particles include risk diamonds with twin crystal structures or
internal crack structures; wherein the risk diamonds may come from
the source of materials of the diamonds themselves, or the risk
diamonds may come from the diamond particles in the brazing process
or the conditioner in the post-processing procedure. The risk
diamonds are different from general diamond particles with perfect
crystal forms which can absorb the incident light to show block
color through brazing alloy. Because these risk particles have twin
crystal structures or internal crack structures present on the
inside or the reflecting surface, the incident light will be
reflected and the risk diamonds are shown yellow color, namely,
themselves color of the general yellow diamonds including
nitrogen-containing dopants. Therefore, the present invention will
determine whether the conditioner has risk diamonds or not and
position thereof by means of detecting every diamond particle on
the conditioner, and then the risk diamonds are further removed
from the chemical mechanical polishing conditioner, thereby
avoiding scratches and breakages produced on the polishing pad due
to the risk diamonds during a chemical mechanical polishing
process. In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the present invent
cannot only detect and determine the risk diamonds shown yellow
color, but also can detect different dopants or diamonds with
different colors based on polishing requirements, but the present
invention is not limited thereto.
[0012] To achieve the above object, the present invention provides
a detection apparatus of a chemical mechanical polishing
conditioner, comprising: a working platform with a working plane; a
placement base disposed on the working plane of the working
platform, which is used to carry a chemical mechanical polishing
conditioner; an image capture device set over the placement base of
the working platform, and the image capture device and the
placement base parallel to the working plane, wherein the image
capture device is used to form one or a plurality of captured
images on different regions of the chemical mechanical polishing
conditioner; a display device; an image recognition module
electrically connected to the image capture device and the display
device, wherein the captured images are performed a color matching
by the image recognition module to determine one or a plurality of
risk diamonds on the chemical mechanical polishing conditioner, and
the coordinate locations of the risk diamonds are outputted into
the display device; and a mobile platform made the risk diamonds
remove to a specified location which is a coordinate location
outputted by the image recognition module. Therefore, when the
detection apparatus of the chemical mechanical polishing
conditioner is operated, the chemical mechanical polishing
conditioner to be detected is disposed on the placement base, and
one or a plurality of captured images are formed on the different
regions of the chemical mechanical polishing conditioner by the
image capture device. Then the captured images are transmitted into
the image recognition module to transform optical signal into
electronic signals through the image recognition module, and then
the electronic signals are transformed into optical spectrums and a
color matching is performed to determine one or a plurality of risk
diamonds on the chemical mechanical polishing conditioner, further,
the coordinate locations of risk diamonds are determined by a
general position location system. Then the coordinate locations are
transformed into the display device by the image recognition module
to show the coordinate locations of risk diamonds, and the mobile
platform can make risk diamonds remove to the specified location
according to the coordinate locations provided from the image
recognition module.
[0013] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, one or a plurality
of captured images are formed on different regions of the chemical
mechanical polishing conditioner by the image capture device, and
the numbers of the captured images may be randomly varied based on
resolutions of the image capture device or the user's detection
standard, such as one, 12, 24, 24, 108 captured images, but the
present invention is not limited thereto. In one aspect of the
present invention, 24 captured images are formed on different
regions of the chemical mechanical polishing conditioner by the
image capture device, namely, the chemical mechanical polishing
conditioner is divided into 24 regions to form 24 captured images.
In another aspect of the present invention, 54 captured images are
formed on different regions of the chemical mechanical polishing
conditioner by the image capture device, namely, the chemical
mechanical polishing conditioner is divided into 54 regions to form
54 captured images. In another aspect of the present invention, 108
captured images are formed on different regions of the chemical
mechanical polishing conditioner by the image capture device,
namely, the chemical mechanical polishing conditioner is divided
into 108 regions to form 108 captured images. In another aspect of
the present invention, if the image capture device has resolutions
with high magnification, one captured image is only formed on
different regions of the chemical mechanical polishing conditioner,
namely, the chemical mechanical polishing conditioner is regarded
as one region to form one captured image.
[0014] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the image capture
device may be a charge coupled device (CCD) or an industrial
camera, in which one or a plurality of captured images on different
regions of the chemical mechanical polishing conditioner are
formed. In one aspect of the present invention, the image capture
device is a charge coupled device. Besides, the above-mentioned
captured image may be a color formatting data in which the captured
images are perform the color matching by the image recognition
module to determine one or a plurality of risk diamonds on the
chemical mechanical polishing conditioner, and risk diamonds are
marked by the display device.
[0015] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the placement base
and the image capture device may be located on the working plane
and removed freely, so that one or a plurality of captured images
may be formed on different regions of the chemical mechanical
polishing conditioner by the image capture device. In one aspect of
the present invention, the placement base is located on the working
plane and moved in plane, such as moved to left and right or moved
to front and back, or moved to up and down. In another aspect of
the present invention, the image capture device is located on the
working plane and moved in plane or moved to up and down. In one
aspect of the present invention, the placement base and the image
capture device may be located on the working plane and moved in
plane or moved to up and down at the same time, but the present
invention is not limited thereto.
[0016] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the detection
apparatus further comprises a light source device set over the
placement base and irradiated light toward the chemical mechanical
polishing conditioner, so that one or a plurality of captured
images are formed on different regions of the chemical mechanical
polishing conditioner by the image capture device under more enough
light.
[0017] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the risk diamonds
are diamond particles capable of reflecting incident lights, in
which the diamond particles may have twin crystal structures or
internal crack structures, and the diamond particles are yellow
diamonds including nitrogen-containing dopants. The risk diamonds
are different from the general diamond particles with perfect
crystal forms which can absorb the incident lights to show block
color through a brazing alloy. These risk particles have twin
crystal structures or internal crack structures present on the
inside or the reflecting surface; therefore, the incident lights
will be reflected, so that the risk diamonds are shown yellow color
in origin. Therefore, the present invention will determine whether
the conditioner has risk diamonds or not and position thereof by
means of detecting every diamond particle on the conditioner.
[0018] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the coordinate
locations of the risk diamonds may be outputted into the mobile
platform (such as XY-stage) by the above-mentioned image
recognition module, so that risk diamonds are removed to specified
locations by the mobile platform, wherein the risk diamonds are
removed automatically to specified locations of detection rang of
an optical microscope by the mobile platform according to
coordinate locations provided from the image recognition module, so
as to remove the risk diamonds from the chemical mechanical
polishing conditioner in subsequent steps. Besides, in the
detection apparatus of the chemical mechanical polishing
conditioner of the present invention, the present invention cannot
only remove the risk diamonds to specified locations through the
mobile platform, but also can directly remove the risk diamond to
the specified locations by the placement base on the detection
device itself.
[0019] In the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the detection
apparatus further include a removing device for removing the risk
diamonds from the chemical mechanical polishing conditioner to
avoid scratches and breakages produced on the polishing pad due to
the risk diamonds during a chemical mechanical polishing process.
The above-mentioned removing device of the present invention may be
a high-power laser, a water jet device, an endpoint oscillator or
an artificial shave tool, but the present invention is not limited
thereto. In one aspect of the present invention, the removing
device is the high-power laser. In another aspect of the present
invention, the removing device is the artificial shave tool.
Besides, in the detection apparatus of the chemical mechanical
polishing conditioner of the present invention, the risk diamonds
may reflect the incident light, so that the risk diamonds are shown
yellow color in the captured images, and the image recognition
module may determine the risk diamonds shown yellow color through
the color matching.
[0020] Another object of the present invention is to provide a
method for detecting the chemical mechanical polishing conditioner.
The method is used to detect whether the chemical mechanical
polishing conditioner has the risk diamonds or not, and the risk
diamonds are removed from the chemical mechanical polishing
conditioner, thereby avoiding scratches and breakages produced on
the polishing pad due to the risk diamonds during a chemical
mechanical polishing process.
[0021] To achieve the above object, the present invention provides
a detection method of a chemical mechanical polishing conditioner,
comprising: detecting the chemical mechanical polishing conditioner
through the above-mentioned detection apparatus of the chemical
mechanical polishing conditioner, and determining one or a
plurality of risk diamonds on the chemical mechanical polishing
conditioner. Therefore, when the detection apparatus of the
chemical mechanical polishing conditioner is operated, the chemical
mechanical polishing conditioner to be detected is set on the
placement base, and one or a plurality of captured images are
formed on different regions of the chemical mechanical polishing
conditioner by the image capture device. Then the captured images
are transmitted into the image recognition module to transform
optical signal into electronic signals through the image
recognition module, and then the electronic signals are transformed
into optical spectrums and one or a plurality of risk diamonds on
the chemical mechanical polishing conditioner are determined by
performing a color matching, further, the coordinate locations of
risk diamonds are determined by a general position location system.
Then the coordinate locations are transformed into the display
device by the image recognition module to show the coordinate
locations of risk diamonds, and the mobile platform can make risk
diamonds remove to the specified locations.
[0022] In summary, according to the detection apparatus and a
method of a chemical mechanical polishing conditioner of the
present invention, the present invention may be used to detect and
determined whether the risk diamonds are present on the chemical
mechanical polishing conditioner or not, and the risk diamonds are
removed from the chemical mechanical polishing conditioner, thereby
avoiding scratches and breakages produced on the polishing pad due
to the risk diamonds during a chemical mechanical polishing
process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The above and other objects, features and other advantages
of the present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0024] FIG. 1 shows a spatial diagram of the detection apparatus of
the chemical mechanical polishing conditioner of the present
invention.
[0025] FIG. 2 shows a schematic diagram of the chemical mechanical
polishing conditioner to be detected of the present invention.
[0026] FIG. 3 shows a flow diagram of the detection apparatus of
the chemical mechanical polishing conditioner of the present
invention.
[0027] FIG. 4 shows a flow diagram of the detection apparatus of
the chemical mechanical polishing conditioners of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0028] Hereinafter, the actions and the effects of the present
invention will be explained in more detail via specific examples of
the invention. However, these examples are merely illustrative of
the present invention and the scope of the invention should not be
construed to be defined thereby.
[0029] A detection apparatus and a method of a chemical mechanical
polishing conditioner may be used to detect whether the chemical
mechanical polishing conditioner has the risk diamonds or not, and
the risk diamonds are removed from the chemical mechanical
polishing conditioner, thereby avoiding scratches and breakages
produced on the polishing pad due to the risk diamonds during a
chemical mechanical polishing process. Please refer to FIG. 1, a
spatial diagram of the detection apparatus of the chemical
mechanical polishing conditioner is shown. As shown in FIG. 1, the
detection apparatus of the chemical mechanical polishing
conditioner comprises a working platform 10 with a working plane
101; a placement base 11 disposed on the working plane 101 of the
working platform 10, for carrying a chemical mechanical polishing
conditioner 12; an image capture device 13 set over the placement
base 11 of the working platform 10 and installed actively on the
working plane 101 through a mobile mechanism 131, further, the
image capture device 13 and the placement base 11 are parallel to
the working plane 101, wherein one or a plurality of captured
images on different regions of the chemical mechanical polishing
conditioner 12 are formed by the image capture device 13; a display
device 14; an image recognition module 15 electrically connected to
the image capture device 13 and the display device 14, wherein the
captured images are performed the color matching by the image
recognition module 15 to determine one or a plurality of risk
diamonds shown yellow color on the chemical mechanical polishing
conditioner, and the coordinate locations of the risk diamonds are
outputted into the display device 14; and a mobile platform (not
shown in figure) made the risk diamonds remove to specified
locations, wherein the risk diamonds may be removed to the
specified location by the mobile platform according to the
coordinate locations provided from the image recognition module 15,
so as to remove the risk diamonds from the chemical mechanical
polishing conditioner in following steps. Besides, in example 1,
the detection apparatus further comprises a removing device (not
shown in figure) for removing the risk diamonds on the chemical
mechanical polishing conditioner, thereby avoiding scratches and
breakages produced on the polishing pad due to the risk diamonds
during a chemical mechanical polishing process.
[0030] Besides, in the above mentioned detection apparatus of the
chemical mechanical polishing conditioner, the detection apparatus
further comprises a light source device 16 set on the placement
base 11, and the light source device 16 irradiates light toward the
chemical mechanical polishing conditioner 12, so that the image
capture device 13 may form one or a plurality of captured images on
different regions of the chemical mechanical polishing conditioner
under more enough light. The numbers of the captured images may be
randomly varied based on resolutions of the image capture device or
the user's detection standard, such as one, 12, 24, 24, 108
captured images, in example 1, 54 captured images may be formed in
different regions of the chemical mechanical polishing conditioner
by the image capture device, namely, the chemical mechanical
polishing conditioner is divided in 54 regions to form 54 captured
images.
[0031] Please refer to FIG. 2, a schematic diagram of the detection
apparatus of the chemical mechanical polishing conditioner to be
detected of the present invention is shown. As shown in FIG. 2, a
brazing layer 21 made from a metal brazing alloy and diamond
particles 22 are disposed on the surface of a substrate 20 made
from stainless steel, and then a heat brazing process is performed,
so that the diamond particles 22 are fixed on the surface of a
substrate 20 by the brazing layer 21 to complete the chemical
mechanical polishing conditioner. Besides, during the heat brazing
process, a side of the brazing surface may absorb the incident
light after brazing the diamond particles 22, so that the diamond
particles 22 have the yellow diamonds including nitrogen-containing
dopants in origin to show block color by means of absorbing the
incident light to the brazing layer 21, and appearance of the
surface of the completed chemical mechanical polishing conditioner
is shown black color by a person's eyes. However, a part of the
risk diamonds 23 with twin crystal structures or internal crack
structures in the diamond particles 22, which is different from the
general diamond particles 22 with perfect crystal form, and the
general diamond particles 22 can absorb the incident light to show
block color through a solder alloy. These risk diamonds 23 may
reflect the incident light, so that these risk diamonds 23 are
shown yellow color themselves, namely, the yellow diamonds
including nitrogen-containing dopants. Therefore, the present
invention will detect every diamond particles shown yellow color on
the conditioner to determine whether the conditioner has the risk
diamonds 23 or not and the position thereof. Further, the risk
diamonds 23 are removed from the chemical mechanical polishing
conditioner by the artificial shave tool, thereby avoiding
scratches and breakages produced on the polishing pad due to the
risk diamonds 23 during a chemical mechanical polishing process. In
the detection apparatus of the chemical mechanical polishing
conditioner of the present invention, to the present cannot only
detect and determine the risk diamonds 23 shown yellow color, but
also detect different dopants or diamond particles 22 and the risk
particles 23 with different colors based on polishing requirements,
but the present invention is not limited thereto. Please refer to
FIG. 3, a flow diagram of the detection apparatus of the chemical
mechanical polishing conditioner of the present invention is shown.
As shown in FIG. 3, first, when the detection apparatus of the
chemical mechanical polishing conditioner is operated (referring to
FIG. 1 simultaneously), the chemical mechanical polishing
conditioner to be detected is disposed on the placement base, and
one or a plurality of captured images on different regions are
formed by the image capture device 33. Further, the captured images
are transmitted into the image recognition module 35, so that the
optical signal 351 transformed into electronic signals 352 through
the image recognition module 35, and the electronic signals 352 are
transformed into optical spectrums 353, and then a color matching
354 is performed to determine one or a plurality of risk diamonds
shown yellow color on the chemical mechanical polishing
conditioner, and the coordinate locations of risk diamonds are
determined by the general position location system. Then, the
coordinate locations of risk diamonds are transmitted into the
display device 34 by the image recognition module 35, and the risk
diamonds are removed to the specified location by the mobile
platform 37 according to the coordinate locations provided from the
image recognition module 35. Finally, the risk diamonds are removed
from the chemical mechanical polishing conditioner by the removing
device (not shown in figure), thereby avoiding scratches and
breakages produced on the polishing pad due to the risk diamonds
during a chemical mechanical polishing process.
Example 2
[0032] Please refer to FIG. 4, a flow diagram of the detection
apparatus of the chemical mechanical polishing conditioners of the
present invention is shown. The detection apparatus of the chemical
mechanical polishing conditioners are substantially the same as the
above Example 1, except that removing the risk diamonds to the
specified location by the mobile platform in example 1 is
different. In example 2, the risk diamonds are removed directly to
the specified location by the placement base on the detection
apparatus itself.
[0033] As shown in FIG. 4, when the detection apparatus of the
chemical mechanical polishing conditioner is operated (referring to
FIG. 1 simultaneously), the chemical mechanical polishing
conditioner to be detected is disposed on the placement base, and
one or a plurality of captured images on different regions are
formed by the image capture device 43. Further, the captured images
are transmitted into the image recognition module 45, so that the
optical signal 451 transformed into electronic signals 452 through
the image recognition module 45, and the electronic signals 452 are
transformed into optical spectrums 453, and then a color matching
454 is performed to determine one or a plurality of risk diamonds
shown yellow color on the chemical mechanical polishing
conditioner, and the coordinate locations of risk diamonds are
determined by the general position location system. Then, the
coordinate locations are transmitted into the display device 44 by
the image recognition module 45 to show the coordinate locations of
the risk diamonds, and the risk diamonds are removed directly to
the specified location by the placement base on the detection
apparatus itself, so that the risk diamonds may be removed
automatically to the specified location of the detection ranges of
optical microscope. Finally, the risk diamonds are removed from the
chemical mechanical polishing conditioner by the removing device
(not shown in figure), thereby avoiding scratches and breakages
produced on the polishing pad due to the risk diamonds during a
chemical mechanical polishing process.
[0034] It should be understood that these examples are merely
illustrative of the present invention and the scope of the
invention should not be construed to be defined thereby, and the
scope of the present invention will be limited only by the appended
claims.
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