U.S. patent application number 14/023989 was filed with the patent office on 2014-10-23 for phase transfer heat dissipating device and phase transfer heat dissipating system.
This patent application is currently assigned to MICROTHERMAL TECHNOLOGY CORP.. The applicant listed for this patent is MICROTHERMAL TECHNOLOGY CORP.. Invention is credited to Chih-Chiang Ku, Che-Wei Liao, Hsien-Chun Meng, Wen-Kai Tsai.
Application Number | 20140311176 14/023989 |
Document ID | / |
Family ID | 49301274 |
Filed Date | 2014-10-23 |
United States Patent
Application |
20140311176 |
Kind Code |
A1 |
Meng; Hsien-Chun ; et
al. |
October 23, 2014 |
PHASE TRANSFER HEAT DISSIPATING DEVICE AND PHASE TRANSFER HEAT
DISSIPATING SYSTEM
Abstract
A volumetric phase transfer heat dissipating system includes a
base, a cap and an atomizing member. The base includes a plurality
of conducting members. The cap is engaged with the base to form a
chamber. The conducting members are disposed in the chamber and
extended toward the cap. The cap includes an inlet connecting
portion for being connected to a fluid transmission tube and
includes an outlet connecting portion for being connected to a
vapor transmission tube. The atomizing member is sleeved to the
inlet connecting portion and disposed between the fluid
transmission tube and the chamber. A working fluid in the fluid
transmission tube flows into the chamber via the atomizing member
and forms liquid on inner walls of the chamber and outer walls of
the conducting members, and the liquid is vaporized after absorbing
heat and flows out via the vapor transmission tube.
Inventors: |
Meng; Hsien-Chun; (Taoyuan
County, TW) ; Ku; Chih-Chiang; (Taoyuan County,
TW) ; Liao; Che-Wei; (Taoyuan County, TW) ;
Tsai; Wen-Kai; (Taoyuan County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MICROTHERMAL TECHNOLOGY CORP. |
TAOYUAN COUNTY |
|
TW |
|
|
Assignee: |
MICROTHERMAL TECHNOLOGY
CORP.
TAOYUAN COUNTY
TW
|
Family ID: |
49301274 |
Appl. No.: |
14/023989 |
Filed: |
September 11, 2013 |
Current U.S.
Class: |
62/314 |
Current CPC
Class: |
F28F 3/12 20130101; H01L
23/467 20130101; F28F 3/022 20130101; F28F 9/028 20130101; H01L
2924/0002 20130101; F25D 7/00 20130101; F28B 9/00 20130101; F28F
9/0246 20130101; H01L 23/4735 20130101; H01L 23/427 20130101; H01L
2924/00 20130101; H01L 2924/0002 20130101; F28D 15/0266
20130101 |
Class at
Publication: |
62/314 |
International
Class: |
F25D 7/00 20060101
F25D007/00; F28B 9/00 20060101 F28B009/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 19, 2013 |
TW |
102114026 |
Claims
1. A volumetric phase transfer heat dissipating device, comprising:
a base, comprising a plurality of conducting members; a cap,
engaged with the base so as to form a chamber with the base, the
conducting members being disposed in the chamber, the cap
comprising an inlet connecting portion for being connected to a
fluid transmission tube and comprising an outlet connecting portion
for being connected to a vapor transmission tube; and an atomizing
member, being sleeved to the inlet connecting portion and disposed
between the fluid transmission tube and the chamber; wherein a
working fluid in the fluid transmission tube flows into the chamber
via the atomizing member and liquid is formed on inner walls of the
chamber and outer walls of the conducting members, the liquid is
vaporized after absorbing heat and flows out via the vapor
transmission tube.
2. The volumetric phase transfer heat dissipating device according
to claim 1, wherein the base further comprises a first combining
portion, and the cap further comprises a second combining portion,
the second combining portion is engaged with the first combining
portion so as to combine the base with the cap.
3. The volumetric phase transfer heat dissipating device according
to claim 1, wherein the chamber gradually expands from one end
thereof which is adjacent to the inlet connecting portion toward
the other end thereof which is adjacent to the outlet connecting
portion.
4. The volumetric phase transfer heat dissipating device according
to claim 1, wherein the inlet connecting portion comprises an inlet
threading portion for threading with the fluid transmission tube,
the outlet connecting portion comprises an outlet threading portion
for threading with the vapor transmission tube.
5. The volumetric phase transfer heat dissipating device according
to claim 1, wherein the inlet connecting portion comprises a
sleeving unit for sleeving the atomizing member.
6. The volumetric phase transfer heat dissipating device according
to claim 5, wherein the sleeving unit comprises an upper sleeving
member and a lower sleeving member, the atomizing member is
disposed between the upper sleeving member and the lower sleeving
member.
7. The volumetric phase transfer heat dissipating device according
to claim 1, wherein the atomizing member is attached to one end of
the fluid transmission tube.
8. The volumetric phase transfer heat dissipating device according
to claim 1, wherein the atomizing member comprises a main body and
a plurality of micro-pores disposed on the main body.
9. A volumetric phase transfer heat dissipating system, comprising:
a condenser, comprising a condenser body, a fluid transmission tube
and a vapor transmission tube, one end of the fluid transmission
tube and one end of the vapor transmission tube being connected to
the condenser body; and a volumetric phase transfer heat
dissipating device, comprising: a base, comprising a plurality of
conducting members; a cap, engaged with the base so as to form a
chamber with the base, the conducting members being disposed in the
chamber, the cap comprising an inlet connecting portion for being
connected to the fluid transmission tube and comprising an outlet
connecting portion for being connected to the vapor transmission
tube; and an atomizing member, being sleeved to the inlet
connecting portion and disposed between the fluid transmission tube
and the chamber; wherein the fluid transmission tube is connected
to the inlet connecting portion of the volumetric phase transfer
heat dissipating device, the vapor transmission tube is connected
to the outlet connecting portion of the volumetric phase transfer
heat dissipating device, a working fluid in the fluid transmission
tube flows into the chamber via the atomizing member, the liquid is
formed on the inner walls of the chamber and outer walls of the
conducting members, and the liquid is vaporized after absorbing
heat and flows to the condenser body via the vapor transmission
tube.
10. The volumetric phase transfer heat dissipating system according
to claim 9, wherein the base further comprises a first combining
portion, and the cap further comprises a second combining portion,
the second combining portion is engaged with the first combining
portion so as to combine the base with the cap.
11. The volumetric phase transfer heat dissipating system according
to claim 9, wherein the chamber gradually expands from one end
thereof which is adjacent to the inlet connecting portion toward
the other end thereof which is adjacent to the outlet connecting
portion.
12. The volumetric phase transfer heat dissipating system according
to claim 9, wherein the inlet connecting portion comprises an inlet
threading portion for threading with the fluid transmission tube,
the outlet connecting portion comprises an outlet threading portion
for threading with the vapor transmission tube.
13. The volumetric phase transfer heat dissipating system according
to claim 9, wherein the inlet connecting portion comprises a
sleeving unit for sleeving the atomizing member.
14. The volumetric phase transfer heat dissipating system according
to claim 13, wherein the sleeving unit comprises an upper sleeving
member and a lower sleeving member, the atomizing member is
disposed between the upper sleeving member and the lower sleeving
member.
15. The volumetric phase transfer heat dissipating system according
to claim 9, wherein the atomizing member is attached to one end of
the fluid transmission tube.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn.119(a) on Patent Application No. 102114026 filed in
Taiwan, R.O.C. on 2013/04/19, the entire contents of which are
hereby incorporated by reference.
BACKGROUND
[0002] 1. Technical Field
[0003] The present invention relates to a heat dissipating device,
and particularly relates to a volumetric phase transfer heat
dissipating device.
[0004] 2. Related Art
[0005] In general, the heat flux per unit area (W/cm.sup.2) of
conventional heat dissipating systems for active electronic
components, such as a fan with cooling fins or a fan with cooling
fins and heat pipes, fails to meet the heat dissipation
requirements of high efficiency electronic components.
[0006] In order to meet the heat dissipation requirements of high
efficiency electronic components, in recent years, technologies for
cooling electronic components using the phase transfer principle
have been developed. For example, U.S. Pat. No. 7,082,778 B2 patent
discloses a spray cooling module functioned similar to the inkjet.
In the spray cooling module, heating electrode plates are
cooperated with the surface tension of the working liquid to
generate bubbles, so that the working liquid is squeezed to form
moistures in the spraying chamber, and the moisture is then
thermally contacted with the electronic components so as to
vaporize them, absorbing heat from the electronic components, and
thus cooling them. However, the structure of the spray cooling
module is too complicated to manufacture easily; additionally,
since the electrode plates must be heated, when the working liquid
is flowing to the electrode plates, the temperature of the working
liquid increases, reducing heat dissipating efficiency. Therefore,
it is necessary to develop another cooling system having high heat
dissipating efficiency.
SUMMARY
[0007] In view of this, the present invention proposes a volumetric
phase transfer heat dissipating device which can atomize the
working fluid efficiently, so as to vaporize the working fluid. The
present invention has advantages such as a simplified structure,
high heat dissipating performance, etc.
[0008] One invention concept of the present invention proposes a
volumetric phase transfer heat dissipating device, including a
base, a cap and an atomizing member. The base includes a plurality
of conducting members. The cap is engaged with the base so as to
form a chamber with the base. The conducting members are disposed
in the chamber and are extended toward the cap. The cap includes an
inlet connecting portion for being connected to a fluid
transmission tube and includes an outlet connecting portion for
being connected to a vapor transmission tube. The atomizing member
is sleeved to the inlet connecting portion and is disposed between
the fluid transmission tube and the chamber. A working fluid in the
fluid transmission tube flows into the chamber via the atomizing
member and forms liquid on inner walls of the chamber and outer
walls of the conducting members, and the liquid is vaporized after
absorbing heat and flowing out via the vapor transmission tube.
[0009] One invention concept of the present invention proposes a
volumetric phase transfer heat dissipating system, including a
condenser and a volumetric phase transfer heat dissipating device
as mentioned above. The condenser includes a condenser body, a
fluid transmission tube and a vapor transmission tube. One end of
the fluid transmission tube and one end of the vapor transmission
tube are connected to the condenser body. The fluid transmission
tube is connected to the inlet connecting portion of the volumetric
phase transfer heat dissipating device. The vapor transmission tube
is connected to the outlet connecting portion of the volumetric
phase transfer heat dissipating device. The working fluid in the
fluid transmission tube is flowing into the chamber via the
atomizing member and forms liquid on the inner walls of the
chamber. The liquid is vaporized after absorbing heat and flows to
the condenser body via the vapor transmission tube.
[0010] According to the present invention, the atomizing member is
disposed in the inlet connecting portion of the cap, so that the
working fluid is flowing into the chamber to form the liquid.
Further, the liquid is disposed on the inner walls of the chamber
and the outer walls of the conducting members and provided for heat
absorption. The conducting members are disposed in the chamber so
as to increase the contact area between the conducting members and
the liquid to enhance the heat dissipating performance.
[0011] The detailed features and advantages of the present
invention are described below in great detail through the following
embodiments, the content of the detailed description is sufficient
for those skilled in the art to understand the technical content of
the present invention and to implement the present invention there
accordingly. Based on the content of the specification, the claims,
and the drawings, those skilled in the art can easily understand
the relevant objectives and advantages of the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The present invention will become more fully understood from
the detailed description given herein below for illustration only,
and thus not limitative of the present invention, wherein:
[0013] FIG. 1 is a constructional schematic view of a volumetric
phase transfer heat dissipating system of a first embodiment of the
present invention;
[0014] FIG. 2 is a perspective view of the volumetric phase
transfer heat dissipating system of the first embodiment of the
present invention;
[0015] FIG. 3 is a partial exploded view of the phase transfer heat
dissipating system of the first embodiment of the present
invention;
[0016] FIG. 4 is a partial lateral view of the volumetric phase
transfer heat dissipating system of the first embodiment of the
present invention; and
[0017] FIG. 5 is a partial enlarged view of the volumetric phase
transfer heat dissipating system of the first embodiment of the
present invention.
DETAILED DESCRIPTION
[0018] FIGS. 1-5 are a constructional schematic view, a perspective
view, a partial exploded view, a partial lateral view and a partial
enlarged view of the volumetric phase transfer heat dissipating
system of a first embodiment of the present invention
respectively.
[0019] The volumetric phase transfer heat dissipating system of the
first embodiment of the present invention includes a volumetric
phase transfer heat dissipating device 1 and a condenser 5. In this
embodiment, the volumetric phase transfer heat dissipating device 1
is connected to the condenser 5 for operation. The condenser 5
includes a condenser body 51, a fluid transmission tube 53 and a
vapor transmission tube 54. One end of the fluid transmission tube
53 and one end of the vapor transmission tube 54 are connected to
the condenser body 51.
[0020] The phase transfer heat dissipating device 1 includes a base
11, a cap 12 and an atomizing member 15.
[0021] The base 11 has a base body 111 which is approximately
formed as a polygonal plate. One side of the base body 111 is
contacted with a heat source 8 (for example: a LED chip or a CPU).
A plurality of conducting members 112 is disposed on a central
region of the other side of the base body 111. A first combining
portion 113 formed as stair shaped is disposed on a periphery of
the base body 111. Here, the shape of the base body 111 and the
shape of the first combining portion 113 described above are only
examples, but embodiments of the present invention are not limited
thereto. In addition, in this embodiment, the conducting members
112 are formed as rod-shaped structures, but embodiments of the
present invention are not limited thereto. In some embodiments, the
conducting members 112 are formed as groove-shaped structures or
other non-planar surface shaped structures which can increase the
surface area of the base 11 so as to increase the heat exchange
area and enhance the condensing performance.
[0022] The cap 12 has a cap body 121 which is approximately formed
as a polygonal plate. The cap body 121 has a supporting wall 122
extended from a periphery thereof. An end portion of the supporting
wall 122 has a second combining portion 123. The shape of the
second combining portion 123 corresponds to the shape of the first
combining portion 113, so that the second combining portion 123 is
engaged with the first combining portion 113 and the base 11 is
combined with the cap 12 so as to form a chamber 10. In this
embodiment, what is required is that the base 11 and the cap 12 are
capable of forming a hollow structure, the structures of the base
11 and the cap 12 described above are only examples, the present
invention is not limited thereto. When the conducting members 112
are rod structures, the conducting members 112 are disposed in the
chamber 10 and extended toward the cap 12.
[0023] Here, the cap 12 has an inlet connecting portion 124 and an
outlet connecting portion 125. The fluid transmission tube 53 is
connected to the inlet connecting portion 124 and the vapor
transmission tube 54 is connected to the outlet connecting portion
125, so that the working fluid 6 in the fluid transmission tube 53
is capable of flowing into the chamber 10, and the vapor of the
working fluid 6 in the chamber 10 is capable of flowing out via the
vapor transmission tube 54. Further, the inlet connecting portion
124 has an inlet threading portion 1241 for threading with the
fluid transmission tube 53, and the outlet connecting portion 125
has an outlet threading portion 1251 for threading with the vapor
transmission tube 54. In this embodiment, the chamber 10 gradually
expands from one end thereof which is adjacent to the inlet
connecting portion 124 toward the other end thereof which is
adjacent to the outlet connecting portion 125; namely, the upper
wall of the chamber 10 is inclined, resulting in that the chamber
10 gradually expands from one end thereof which is adjacent to the
inlet connecting portion 124 toward the other end thereof which is
adjacent to the outlet connecting portion 125.
[0024] Additionally, the conducting members 112 are disposed
corresponding to the cap body 121 but are not directly disposed
toward the inlet connecting portion 124 and the outlet connecting
portion 125. That is to say, the conducting members 112 correspond
to regions between the inlet connecting portion 124 and the outlet
connecting portion 125.
[0025] The atomizing member 15 is plate structure and is disposed
in the inlet connecting portion 124. The atomizing member 15 has a
main body 151 and a plurality of micro-pores 152. The micro-pores
152 are disposed on the main body 151, so that the working fluid 6
in the fluid transmission tube 53 is atomized via the atomizing
member 15 so as to enhance the heat dissipating performance. Here,
the pore diameters of the micro-pores 152 are defined between 5
micrometers to 1000 micrometers, preferably defined between 20
micrometers to 300 micrometers. Further, the distance between any
two neighboring micro-pores 152 is defined between 5 micrometers to
2000 micrometers.
[0026] In this embodiment, the inlet connecting portion 124 has a
sleeving unit 127 assembled thereon and provided for sleeving the
atomizing member 15. The sleeving unit 127 further includes an
upper sleeving member 1271 and a lower sleeving member 1272. The
upper sleeving member 1271 and the lower sleeving member 1272 are
hollow shaped, and the atomizing member 15 is disposed between the
upper sleeving member 1271 and the lower sleeving member 1272.
Here, the upper sleeving member 1271 is attached to the cap body
121, and the atomizing member 15 is sandwiched between the upper
sleeving member 1271 and the lower sleeving member 1272; in
addition, the lower sleeving member 1272 is fastened on the cap
body 121 via a plurality of fastening members 1273.
[0027] In some implementation aspects, the atomizing member 15 is
disposed in the inlet connecting portion 124 and attached to one
end of the fluid transmission tube 53, so that the working fluid 6
in the fluid transmission tube 53 is atomized via the atomizing
member 15.
[0028] In the present invention, the manufacturing method of the
atomizing member 15 includes following steps. At first, by physical
vapor deposition, chemical vapor deposition or other technologies
like LIGA (Lithographie GalVanoformung Abformung), a deposited
metal layer is formed on the surface of a substrate in which the
substrate is made of glass or silicon. Next, a photo resist layer
is formed by spin coating method or by immersion method; in this
way the photo resist layer is exposed through a mask by
photolithography, and is developed to remove the photo resist layer
under the unexposed region so as to reveal the ready-to-remove
deposited metal layer. Subsequently, the deposited metal layer
which is not protected by the photo resist layer is removed by
etching, and the remainder of the photo resist layer is removed; at
this time, the deposited metal layer with a plurality of through
holes is formed on the surface of the substrate, the through holes
are substantially the predetermined holes of the micro-pores 152 of
the atomizing member 15, and the diameter of the through holes is
larger than that of the micro-pores 152. Thereafter, an
electrocasting metal layer is formed on the surface of the
deposited metal layer by electrocasting method. Finally, a
demoulding process is applied, so that the electrocasting metal
layer is separated from the deposited metal layer and the substrate
so as to form the atomizing member 15.
[0029] Upon operating the present invention, the working fluid 6 in
the fluid transmission tube 53 is flowing to the atomizing member
15 and forms a plurality of tiny liquid drops or moistures. After
flowing to the chamber 10, the tiny liquid drops or moistures
become liquid which is disposed on the inner walls of the chamber
10 and the outer walls of the conducting members 112, and because
of absorbing the heat from the heat source 8, the liquid is
vaporized and converted to vapors which are flowing to the
condenser body 51 via the vapor transmission tube 54. Thereafter,
the vapors are condensed in the condenser body 51 so as to form the
working fluid 6, and the working fluid 6 is flows again into the
atomizing member 15 via the fluid transmission tube 53 and further
flows into the chamber 10. Under such conditions, a circulating
system is formed without pumps or other driving devices.
Additionally, since the chamber 10 gradually expands from one end
thereof which is adjacent to the inlet connecting portion 124
toward the other end thereof which is adjacent to the outlet
connecting portion 125, the atomized working fluid and the vapors
are prone to flow toward the outlet connecting portion 125.
[0030] In the present invention, the atomizing member 15 is
disposed in the inlet connecting portion 124 of the cap 12, so that
the working fluid 6 is flowing into the chamber 10 to form the
liquid. Further, the liquid is disposed on the inner walls of the
chamber 10 and the outer walls of the conducting members 112 for
heat absorption. The conducting members 112 are disposed in the
chamber 10 so as to increase the contact area between the
conducting members 112 and the liquid to enhance the heat
dissipating performance. Additionally, without applying pumps or
other driving devices, the present invention provides an
automatically circulated condensing system which has advantages
such as a simplified structure, high heat dissipating performance,
etc.
[0031] While the present invention has been described by the way of
example and in terms of the preferred embodiments, it is to be
understood that the invention need not be limited to the disclosed
embodiments. On the contrary, it is intended to cover various
modifications and similar arrangements included within the spirit
and scope of the appended claims, the scope of which should be
accorded the broadest interpretation so as to encompass all such
modifications and similar structures.
* * * * *