U.S. patent application number 14/248109 was filed with the patent office on 2014-10-09 for chemical mechanical polishing conditioner.
The applicant listed for this patent is Chien-Min Sung, Wen-Ting Yeh. Invention is credited to Chien-Min Sung, Wen-Ting Yeh.
Application Number | 20140302756 14/248109 |
Document ID | / |
Family ID | 49902272 |
Filed Date | 2014-10-09 |
United States Patent
Application |
20140302756 |
Kind Code |
A1 |
Sung; Chien-Min ; et
al. |
October 9, 2014 |
CHEMICAL MECHANICAL POLISHING CONDITIONER
Abstract
The present invention (utility model application in Taiwan)
relates to a chemical mechanical polishing pad dresser, comprising:
a substrate; a bonding layer disposed on the substrate; an
electroplating layer disposed on the bonding layer; a fixed
template disposed on the electroplating layer having a plurality of
apertures; and a plurality of abrasive particles corresponding to
and set in the apertures, wherein the plurality of abrasive
particle fixed in the bonding layer and the substrate by means of
the electroplating layer. Therefore, the present invention is not
only to avoid damaging the abrasive particles due to the high
temperature heating in the production process, but also to solve
the corrosion problem of the surface of the chemical mechanical
polishing pad dresser by the fixed template and the electroplating
layer and to solve simultaneously the pollution problem generating
on the polished workpieces by using conventional brazing bonding
layer; and, the present invention can also provide to adjust the
abrasive particles arrangement and protrude rate through the fixed
template, so as to enhance the grinding performance and quality of
the chemical mechanical polishing pad dresser.
Inventors: |
Sung; Chien-Min; (Tansui,
TW) ; Yeh; Wen-Ting; (Taipei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Sung; Chien-Min
Yeh; Wen-Ting |
Tansui
Taipei |
|
TW
TW |
|
|
Family ID: |
49902272 |
Appl. No.: |
14/248109 |
Filed: |
April 8, 2014 |
Current U.S.
Class: |
451/443 |
Current CPC
Class: |
B24B 53/017
20130101 |
Class at
Publication: |
451/443 |
International
Class: |
B24B 53/017 20060101
B24B053/017 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 8, 2013 |
TW |
102206275 |
Claims
1. A chemical mechanical polishing pad dresser, comprising: a
substrate; a bonding layer disposed on the substrate; an
electroplating layer disposed on the bonding layer; a fixed
template disposed on the electroplating layer having a plurality of
apertures; and a plurality of abrasive particles corresponding to
and set in the apertures, wherein the plurality of abrasive
particles are fixed with the bonding layer and the substrate by the
electroplating layer.
2. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the plurality of abrasive particles are synthetic
diamond, natural diamond, polycrystalline diamond, cubic boron
nitride, or polycrystalline cubic boron nitride.
3. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the particle size of the plurality of abrasive
particles are greater than the inner diameter of the apertures.
4. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the size of the plurality of abrasive particles is
from 100 microns to 600 microns.
5. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the protrude rate that the abrasive particles
protrude from the fixed template is 1/5 to 1/2 of the size of the
abrasive plurality of particles.
6. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the plurality of abrasive particles have a pattern
arrangement.
7. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the fixed template is made from nickel metal,
silver metal, copper, or alloys thereof.
8. The chemical mechanical polishing pad dresser as claimed in
claim 7, wherein the thickness of the fixed template is from 50
microns to 300 microns.
9. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the bonding layer is made from brazing materials,
electroplating materials, a ceramic material or a resin
material.
10. The chemical mechanical polishing pad dresser as claimed in
claim 9, wherein the thickness of the bonding layer is from 20
microns to 200 microns.
11. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the substrate is made from stainless steel.
12. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the highest tips of the plurality of abrasive
particles are connected to form a polishing surface, wherein the
polishing surface is a plane, a convex plane, or a concave
plane.
13. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the plurality of abrasive particles respectively
have an attitude with a tip oriented toward a polishing pad to be
dressed.
14. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the plurality of abrasive particles located in the
central area respectively have an attitude with a tip oriented
toward a polishing pad to be dressed, and the plurality of abrasive
particles located in the surrounding area have an attitude with a
plane oriented toward the polishing pad to be dressed.
15. The chemical mechanical polishing pad dresser as claimed in
claim 1, wherein the diameter of the substrate is from 5 mm to 250
mm.
16. The chemical mechanical polishing pad dresser as claimed in
claim 1, further comprising a base substrate disposed on the bottom
of the substrate, wherein an adhesive layer for adjusting thickness
is sandwiched between the substrate and the base substrate.
17. The chemical mechanical polishing pad dresser as claimed in
claim 16, wherein the surface of the base substrate has a plurality
of substrates.
18. The chemical mechanical polishing pad dresser as claimed in
claim 16, wherein the diameter of the base substrate is 4 to 20
times of the diameter of the substrates.
19. The chemical mechanical polishing pad dresser as claimed in
claim 16, further comprising a sealing layer filled in the gap
between the substrates, wherein the substrate is fixed to the base
substrate.
20. The chemical mechanical polishing pad dresser as claimed in
claim 16, wherein the diameter of the substrate is 10 mm to 20 mm.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefits of the Taiwan Patent
Application Serial no. 102206275, filed on Apr. 8, 2012, the
subject matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention is about a chemical mechanical
polishing pad dresser, more particular, to a chemical mechanical
polishing pad dresser through having corrosion resistant
electroplating.
[0004] 2. Description of Related Art
[0005] Chemical mechanical polishing (CMP) is a common polishing
process for a various industries. Using chemical polishing process
can polish the surface of a variety kinds of materials, which
includes ceramic, silicon, glass, quartz, or a chip of metal, or
etc. In addition, with the rapid development of integrated
circuits, the chemical mechanical polishing can achieve purpose of
a large leveling area, so that it is one of the commonly techniques
for the wafer leveling in semiconductor process.
[0006] The chemical-mechanical planarization is processed by
transferring the slurry in between the wafer and the polishing pad
stably and evenly to soak the polishing pad surface with slurry
which containing chemicals (for instance, acid and oxidant) to
erode the film on the wafer surface. The myriad nano ceramics
abrasive (ex. SiO.sub.2, Al.sub.2O.sub.3 and CeO.sub.2) in the
slurry further pierce and scrape trace film, and simultaneously
conduct chemical etching and mechanical grinding to remove the
protruding deposit layer on the wafer. The purpose of planarization
can be achieved by this polishing the wafer surface.
[0007] A pad dresser, whose function is to polish pad, is a
necessary supply for chemical-mechanical planarization. The
so-called condition includes shaving the polishing pad surface,
removing the accumulation of litter of the polishing pad surface,
so as to keep the roughness of the polishing pad surface. In
addition, the conditioner can also produce tiny uplift and sunken
on the surface, and it is known as the height different of the
asperities. Accordingly, the contact area on the polishing pad
would be reduced significantly. Once the contact area becomes
smaller, the contact pressure becomes greater to make the slurry at
the contact point extrusion the protruding part of the wafer and
the chemicals (ex: H.sub.2O.sub.2) in the slurry would be oxidation
to soften or erode the wafer.
[0008] However, the conventional manufacturing method of the
diamond pad dresser such as: brazing, which is typically used to
fix the diamond particles on the surface of metal plate by binder
Although it is suitable for conditioning polishing pad, with regard
to more sophisticated of chemical mechanical planarization (such as
the chemical mechanical planarization process which line width less
than 45 nm), scratch, partial dishing, erosion and thickness
non-uniformity of the wafer would cause easily in using diamond pad
dresser for the polishing pad because the metal plate of diamond
pad dresser is too heavy. With the requirement of line width of
integrated circuits increasingly reduced, the requirement of the
wafer surface planarization will be increased, and thus the demand
pad dresser is also increased, and which can lead to previous
diamond conditioner not being able to satisfy the a pre-requirement
of the chemical-mechanical planarization process smaller than 45
nm.
[0009] In the prior art, applicant proposed Taiwan patent
application number No. 201014680, a grinding tool and a
manufacturing method thereof, which comprises a plurality of
abrasive particles, a fixed tooling, a substrate and a binding
layer. A multitude of holes on the fixing mold contains several
grinding particles; the first end and second end of the grinding
particle are respectively settled on the bottom and top of the
fixing mold; the first distal surface of substrate pushes against
the second ends of several grinding particles; the binding layer is
combined with several grinding particles, fixing mold, and
substrate; the second end of the grinding particle is an end for
grinding; the binding layer is embedded in the inner side of fixing
mold. Therefore, it is probably not in contact with liquid and
corroded during the grinding process. Therefore, it is probably not
in contact with liquid and corroded during the grinding process. By
utilizing the fixing mold to be combined with grinding particles,
it is convenient for controlling the pattern, pitch, and protrusion
height of the grinding particles, and fixing the grinding particles
more stable so that they are not easy to be released in the process
of grinding.
[0010] In addition, applicant proposed another Taiwan patent
application number No. 101215212, a chemical mechanical polishing
pad dresser, which includes: a substrate, a bonding layer, a fixed
template and a plurality of abrasive particles; the bonding layer
disposed on the substrate, the fixed template disposed on the
bonding layer and having a plurality of through holes, wherein the
abrasive particles corresponding to and set in the plurality of
through holes and are supported in the bonding layer, and the
abrasive particles respectively have a grinding side protruding
relative to the surface of the fixed template; wherein, the thermal
expansion coefficient of the substrate and the fixed template are
higher or lower than the thermal expansion coefficient of the
bonding layer. By means of controlling the differences in the
thermal expansion coefficient between the substrate, fixed template
and bonding layer, the light and thin CMP pad dresser can be
utilized, which is not only to eliminate the deformation problem
generated through the brazing method after making the substrate to
be light and thin, but also to eliminate the problem about shedding
and ectopia of the diamond particles, so as to decrease
manufacturing cost.
[0011] Additionally, as Japan patent application number No.
JP2005219152A provides a method for manufacture dresser, the
dresser can prevent the diamond particles separate from the
dresser. In such a way, a polishing object is polished so as to
decreasing scratch on the polishing object, and the dresser has a
longer working life.
[0012] According to the method, the diamond particles each coated
with a film formed of a conductive material are arranged in a
plurality of through holes formed in a holder from above an upper
surface of the holder. Then a surface plate having a recess making
contact with the tip of each diamond particle protruding from the
through hole of the holder, is arranged on a lower surface of the
holder. Further a base member is arranged on the upper surface of
the holder, and therefore the diamond particles are firmly
sandwiched by the holder and the base member
[0013] The aforementioned design of CMP pad dresser of the patent,
which though mentioned to fix the diamond particles through
disposed on a template, to avoid shifting of the diamond particles,
however, due to the conventional design CMP pad dresser mainly uses
resin or brazing material as the bonding layer for fixing the
abrasive particles, so that the resin or brazing bonding layer are
easily to be corroded and damaged by the slurry during the
polishing process, and result shedding of the diamond particles,
and thus the polished object is damaged. On the other hand, in
brazing method or resin method for manufacturing CMP pad dresser,
because the brazing method or the resin method must harden the
abrasive particles by the high temperature heating, and also cause
to damage of abrasive particles due to high temperature in
hardening process.
[0014] Accordingly, it is necessary to develop a CMP pad dresser,
which can avoid damaging abrasive particles due to high temperature
in the production process, and improve the surface of CMP pad
dresser to be corroded and damaged by the slurry during the
polishing process, and avoid the pollution problem that the
conventional brazing bonding layer to polished workpieces.
SUMMARY OF THE INVENTION
[0015] A main object of the present invention is to provide a
chemical mechanical polishing pad dresser, which is disposed on an
electroplating layer through a fixed template. It is not only to
utilize the fixed template to protect the electroplating layer, so
as to solve the conventional problem that the surface of
electroplating polishing pad dresser is corroded by the slurry, but
also to solve simultaneously the pollution problem that
conventional brazing polishing pad dresser to the polished
workpieces during the polishing process.
[0016] In order to achieve the above object, the present invention
provides a chemical mechanical polishing pad dresser, comprising: a
substrate; a bonding layer disposed on the substrate; an
electroplating layer disposed on the bonding layer; a fixed
template disposed on the electroplating layer having a plurality of
apertures; and a plurality of abrasive particles correspond to and
set in the apertures, wherein the plurality of abrasive particles
are fixed with the bonding layer and the substrate by the
electroplating layer. Therefore, the present invention is not only
to utilize the fixed template and the electroplating layer so as to
solve the problem that the surface of the chemical mechanical
polishing pad dresser is corroded by the slurry, but also to
improve simultaneously the pollution problem that conventional
brazing bonding layer to polished workpieces. Furthermore, the
present invention can adjust the abrasive particles arrangement and
protrude rate through the fixed template, so as to enhance the
grinding performance and quality of the dresser. On the other hand,
because the abrasive particles are fixed between the fixed template
and bonding layer by the electroplating method, so that it can
avoid damaging the abrasive particles due to the high temperature
heating in the production process.
[0017] In the chemical mechanical polishing pad dresser of the
present invention, the abrasive particles can be made of various
types of abrasive particles; in one aspect, the abrasive particles
may be synthetic diamond, natural diamond, polycrystalline diamond,
cubic boron nitride, or polycrystalline cubic boron nitride; in
another aspect of the present invention, the abrasive particles may
be synthetic diamond; in a further another aspect, the abrasive
particles may be polycrystalline diamond, but not limited to
herein. In addition, in the chemical mechanical polishing pad
dresser of the present invention, the particle size of the abrasive
particles may be greater than the inner diameter of the apertures
of the fixed template, so that each aperture may receive a
particle, so as to avoid dropping the abrasive particles from the
apertures and resulting the apertures lacking of abrasive particles
to affect the grinding performance and quality of the chemical
mechanical polishing pad dresser.
[0018] In the chemical mechanical polishing pad dresser of the
present invention, the particle size may be dependent on the
particle type or crystal form of particles, or surface roughness
required in a polishing process; in one aspect of the present
invention, the particle size of the plurality of abrasive particles
may be from 100 microns to 600 microns; in another aspect of the
present invention, the particle size of the plurality of abrasive
particles may be 500 microns, but the present invention is not
limited to herein.
[0019] In the chemical mechanical polishing pad dresser of the
present invention, the protrude rate that the abrasive particles
protrude from the fixed template may be determined by the required
of grinding speed or surface roughness of polishing process; in one
aspect, the protrude rate that the abrasive particles protrude from
the fixed template may be 1/5 to 1/2 of the size of the abrasive
particles; in another aspect, the protrude rate that the abrasive
particles protrude from the fixed template may be 1/4 to 1/3 of the
size of the abrasive particles. Furthermore, in the chemical
mechanical polishing pad dresser of the present invention, the
abrasive particles may be adjusted the grinding performance and
quality of the polishing pad dresser by a pattern arrangement; in
one aspect, the abrasive particles may have a matrix pattern
arrangement, a concentric circles arrangement, or a radially
arrangement, or etc., in another aspect, the abrasive particles may
have a matrix pattern arrangement, but the present invention is not
limited to herein.
[0020] In the chemical mechanical polishing pad dresser of the
present invention, the fixed template may be determined by the
electroplating layer, and having an electronegative so as to
deposit and binding to the electroplating layer fixed template and
the abrasive particles; in one aspect, the fixed template may be
made from nickel metal, silver metal, copper, or alloys thereof, in
addition, the electroplating layer may be made from nickel metal,
copper metal, chrome metal, or alloys thereof; in another aspect,
the fixed template may be made from nickel metal having an
electronegative. In addition, in the chemical mechanical polishing
pad dresser of the present invention, the thickness of the fixed
template may be determined by referring the relative ratio between
size of the abrasive particles and the thickness of the
electroplating layer; in one aspect, the thickness of the fixed
template may be from 50 microns to 300 microns; in another aspect,
the thickness of the fixed template may be from 50 microns to 100
microns, the present invention is not limited to herein.
[0021] In the chemical mechanical polishing pad dresser of the
present invention, the bonding layer may be made from brazing
materials, electroplating materials, a ceramic material or a resin
material; in one aspect, the bonding layer may be made from resin
material. In addition, in the chemical mechanical polishing pad
dresser of the present invention, the thickness of bonding layer
may be from 20 microns to 200 microns; preferably, the thickness of
bonding layer may be from 50 microns to 100 microns. Furthermore,
in the chemical mechanical polishing pad dresser of the present
invention, the substrate may be made from stainless steel, but the
present invention is not limited to herein.
[0022] In the chemical mechanical polishing pad dresser of the
present invention, the highest tip of each abrasive particle may be
connected to form a polishing surface, wherein, the polishing
surface may be a plane, a convex plane, or a concave plane
according to the surface shape of the substrate; in one aspect, the
polishing surface may be a plane shape on a plane of the substrate
surface; in another aspect, the polishing surface may be a convex
shape in the substrate surface which is convex. In addition, in the
chemical mechanical polishing pad dresser of the present invention,
the aforementioned polishing surface may be changed according to
the direction of the tip of the abrasive particles or the crystal
form of abrasive particles; in one aspect, the abrasive particles
may be a respectively have an attitude with a tip toward the
polishing pad to be dressed, so that the polishing surface may be a
plane shape; in another aspect, the abrasive particles located in
the central area may be respectively have an attitude with a tip
toward for the polishing pad to be dressed, and the abrasive
particles located in the surrounding area may be have an attitude
with a plane toward for the polishing pad to be dressed, so that
the polishing surface may be a convex shape.
[0023] In the chemical mechanical polishing pad dresser of the
present invention, the diameter of the substrate may be determined
by the area of the polishing process; in one aspect, the diameter
of the substrate may be from 5 mm to 250 mm; in another aspect, the
diameter of the substrate may be from 80 mm to 120 mm.
[0024] In the chemical mechanical polishing pad dresser of the
present invention, it further comprises a base substrate to be
disposed on the bottom of the substrate, and wherein an adhesive
layer for adjusting thickness is sandwiched between the substrate
and the base substrate. In addition, in the aforementioned chemical
mechanical polishing pad dresser of the present invention, the
surface of base substrate may has a plurality of the substrates,
and the diameter of the base substrate may be 4 to 20 times of the
diameter of the substrates. In one aspect, the surface of the base
substrate may have 4 to 20 substrates, preferably, the surface of
the base substrate may have 10 to 12 substrates, and the substrates
may be formed of a circular arrangement along outside of the base
substrate. In addition, in one aspect, the aforementioned diameter
of the substrate may be 10 mm to 20 mm. In another aspect, the
diameter of the substrate may be 15 mm, and the diameter of the
base substrate may be 100 mm, and the present invention is not
limited to herein.
[0025] In the chemical mechanical polishing pad dresser of the
present invention, it further comprises a sealing layer, which may
be filled in the gap between the substrates, so that the substrate
may be fixed to the base substrate to form a modular chemical
mechanical polishing pad dresser.
[0026] An another object of the present invention is to provide a
method for manufacturing a chemical mechanical polishing pad
dresser, which is disposed on the electroplating layer through a
fixed template. Therefore, it is not only utilize the fixed
template to protect the electroplating layer so as to solve the
conventional problem that the surface of electroplating polishing
pad dresser is corroded by the slurry, but also to solve
simultaneously pollution problems generated on the polished
workpieces by using the conventional brazing polishing pad dresser
in a polishing process.
[0027] In order to achieve the above object, the present invention
provides a method for manufacturing a chemical mechanical polishing
pad dresser, which includes: providing a temporary substrate,
wherein a temporary adhesive layer may be disposed on the temporary
substrate; providing a fixed template, disposed on the temporary
adhesive layer, and having a plurality of the apertures and inner
edges of the plurality of apertures; providing a plurality of the
abrasive particles, correspond to and set in the apertures,
wherein, the particle size of the abrasive particles may be greater
than the apertures, so that each aperture may receive and secure a
particle, and a force be applied downward by a lower pressing
plate, so that the abrasive particles penetrate to the temporary
adhesive layer, and wherein the protrude rate that the abrasive
particles protrude from the fixed template can be controlled by the
thickness of temporary adhesive; providing an electroplating layer,
which can control the fixed template to being an electronegative,
so that the electroplating layer is deposited on and fixed to the
fixed template and the abrasive particles; removing the temporary
substrate and the temporary adhesive, so that the abrasive
particles may be revealed from the apertures of the fixed template;
providing a substrate and a bonding layer, wherein the bonding
layer binds to the surface of the electroplating layer, and the
bonding layer relative to fixed template is located another side of
the electroplating layer, so as to form a polishing pad
dresser.
[0028] In the aforementioned method for manufacturing the chemical
mechanical polishing pad dresser of the present invention, it
further comprises: providing a base substrate, which may be
disposed on the bottom of substrate of the polishing pad dresser,
wherein an adhesive layer for adjusting thickness is sandwiched
between the substrate and the base substrate. In addition, in the
aforementioned method for manufacturing the chemical mechanical
polishing pad dresser of the present invention, the surface of the
base substrate may have a plurality of polishing pad dresser, and
the diameter of the base substrate is 4 to 20 times of the diameter
of the substrates.
[0029] In the method for manufacturing the chemical mechanical
polishing pad dresser of the present invention, it further
comprises a sealing layer filled in the gap between the substrates
of aforementioned polishing pad dressers, wherein the substrates of
polishing pad dressers are fixed on the base substrate, so as to
form a modular chemical mechanical polishing pad dresser.
[0030] Therefore, the chemical mechanical polishing pad dresser may
utilize the fixed template to protect the electroplating layer, so
as to solve the conventional problem that the surface of
electroplating polishing pad dresser is corroded by the slurry, and
also to solve simultaneously the pollution problem generated on
polished workpieces by the conventional brazing polishing pad
dresser in the polishing process. In addition, the abrasive
arrangement and protrude rate of abrasive particles may be adjust
by the fixed template, so as to enhance the grinding performance
and quality of the chemical mechanical polishing pad dresser.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1A to 1H show manufacturing flow charts of a CMP pad
dresser of the present invention;
[0032] FIG. 2A to 2B show the schematic views of a CMP pad dresser
of the present invention;
[0033] FIG. 3A to 3B show the schematic views of a CMP pad dresser
of the present invention;
[0034] FIG. 4A to 4B show the schematic views of a CMP pad dresser
of the present invention;
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0035] Hereafter, examples will be provided to illustrate the
embodiments of the present invention. Other advantages and effects
of the invention will become more apparent from the disclosure of
the present invention. Other various aspects also may be practiced
or applied in the invention, and various modifications and
variations can be made without departing from the spirit of the
invention based on various concepts and applications.
EXAMPLE 1
[0036] A main object of the present invention is to provide a
chemical mechanical polishing pad dresser, which is disposed on an
electroplating layer through a fixed template. Therefore, it is not
only utilize the fixed template to protect the electroplating
layer, so as to solve the conventional problem that the surface of
electroplating polishing pad dresser is corroded by the slurry, but
also to solve simultaneously the pollution problem generated on
polished workpieces by the conventional brazing polishing pad
dresser in the polishing process. The FIG. 1A to 1H shows
manufacturing flow charts of a CMP pad dresser of the example 1 of
the present invention. Please refer to FIG. 1A and 1B, firstly, a
temporary substrate 110 is provided, and a temporary adhesive layer
120 is disposed on the temporary substrate 110, wherein, in the
example 1, the temporary substrate 110 may be made of stainless
steel or general rigid material, and the temporary adhesive layer
120 may be a tape having adhesive of both side thereof, so as to
the template 130 and the abrasive particles 140 are temporarily
fixed on the temporary substrate 110.
[0037] Next, please refer to FIG. 1C, a fixed template 130 is
provided, wherein the fixed template 130 is disposed on the
temporary adhesive layer 120, and the fixed template 130 has a
plurality of the apertures 131 and inner edges of a plurality of
apertures 132, wherein, in the example 1, the fixed template 130 is
made of nickel-metal material, of which thickness is 100 microns,
and the abrasive particles 140 is controlled to have a regulation
arrangement of a matrix pattern through the apertures 131 of the
fixed template 130; please refer to FIGS. 1D and 1E, a plurality of
the abrasive particles 140 is providing, which may correspond to
and set in the apertures 131, wherein, the particle size of the
abrasive particles 140 may be greater than the apertures 131, so
that each aperture 131 may receive and secure a particle 140, and a
force is applied downward by a lower pressing plate 150 (show as
the FIG. 1D direction of arrow), so that the abrasive particles 140
penetrate to the temporary adhesive layer 120, and the protrude
rate that the abrasive particles 140 protrude from the fixed
template 130 is controlled by the thickness of the temporary
adhesive 120, wherein, in the example 1, the abrasive particles is
synthetic diamond of which the particle size is 500 .mu.m, and the
protrude rate that the abrasive particles protrude from the fixed
template may be 1/4 of the size of the abrasive particles, i.e.,
about 125 microns.
[0038] Next, please refer to FIG. 1F, an electroplating layer 160
is provided, which may control the fixed template 130 to be an
electronegative, so that the electroplating layer 160 is deposite
and bonded on the fixed template 130 and the abrasive particles
140; wherein, in the example 1, the electroplating layer 160 is
made of nickel plating material; please refer to FIG. 1G, the
temporary substrate 110 and the temporary adhesive 120 are removed,
so that the abrasive particles 140 are revealed from the apertures
131 of the fixed template 130; finally, as shown in FIG. 1H, a
substrate 180 and a bonding layer 170 are provided, so that the
bonding layer 170 bonds to the surface of electroplating layer 160,
and the bonding layer 170 relative to the fixed template 130 is
located in another side of the electroplating layer 160 so as to
form the polishing pad dresser 10, and the highest tip of each
abrasive particle 140 is connected to form a polishing surface H1,
wherein, in the example 1, the bonding layer 170 is made of resin
adhesive which thickness is 100 .mu.m, the substrate 180 is
stainless steel which diameter is 16 mm, and the substrate 180 has
a plane surface, so that the polishing surface H1 is a plane
shape.
[0039] Accordingly, the example 1 provides a chemical mechanical
polishing pad dresser 10, comprising: a substrate 180; a bonding
layer 170 disposed on the substrate 180; an electroplating layer
160 disposed on the bonding layer 170; a fixed template 130
disposed on the electroplating layer 160 having a plurality of
apertures 131; and a plurality of abrasive particles 140
corresponding to and set in the apertures 131, wherein the
plurality of abrasive particles 140 are fixed in the bonding layer
170 and the substrate 180 by means of the electroplating layer 160.
Therefore, the present invention may not only utilize the fixed
template and the electroplating layer to solve the problem that the
surface of polishing pad dresser is corroded by the slurry, but
also improve simultaneously the pollution problem generating on the
polished workpieces by using the conventional brazing bonding
layer; and the present invention also provide to adjust the
abrasive particles arrangement and protrude rate through the fixed
template, so as to enhance the grinding performance and quality of
the chemical mechanical polishing pad dresser.
EXAMPLE 2 EXAMPLE 3
[0040] FIGS. 2A and 2B show the schematic view of a CMP pad dresser
of the example 2 and the example 3 of the present invention. The
CMP pad dresser of example 2 and the example 3 are almost the same
as the aforementioned example 1, except that the example 1 provides
a polishing pad dresser having a polishing surface which is a
planar shape, on the contrary, the example 2 and the example 3
provide a polishing pad dresser having a polishing surface which
are non-planar shape.
[0041] Please refer to FIG. 2A, a polishing pad dresser 20 is
provided, comprising: a substrate 280; a bonding layer 270 disposed
on the substrate 280; an electroplating layer 260 disposed on the
bonding layer 270; a fixed template 230 disposed on the
electroplating layer 260; and a plurality of abrasive particles 240
corresponding to and set in the apertures of the fixed template
230, wherein the plurality of abrasive particles 240 are fixed in
the bonding layer 270 and the substrate 280 by means of the
electroplating layer 260, and the highest tip of each abrasive
particle 240 is connected to form a polishing surface H2. In
particular, the aforementioned substrate 280 has a convex surface,
so that the polishing surface H2 is a convex shape.
[0042] Please refer to FIG. 2B, a polishing pad dresser 21 is
provided, comprising: a substrate 281; a bonding layer 271 disposed
on the substrate 281; an electroplating layer 261 disposed on the
bonding layer 271; a fixed template 231 disposed on the
electroplating layer 261; and a plurality of abrasive particles 241
corresponding to and set in the apertures of the fixed template
231, wherein the plurality of abrasive particles 241 are fixed in
the bonding layer 271 and the substrate 281 by means of the
electroplating layer 261, the highest tip of each abrasive particle
241 is connected to form a polishing surface H3. Furthermore, the
aforementioned substrate 281 has a concave surface, so that the
polishing surface H3 is a concave shape. Therefore, the present
invention can further adjust the surface shape of the substrate at
will according to the requirement of the polishing process, so that
the polishing surface shape is a plane, a convex plane, or a
concave plane, so as to control the grinding performance and
quality of the chemical mechanical polishing pad dresser.
EXAMPLE 4 AND EXAMPLE 5
[0043] FIG. 3A and FIG. 3B show the schematic view of a CMP pad
dresser of the example 4 and the example 5 of the present
invention. The CMP pad dresser of the example 4 and the example 5
are almost the same as the aforementioned example 1, except that
the example 1 provides the abrasive particles which have
respectively an attitude with an tip oriented toward the polishing
pad to be dressed, on the contrary, the example 4 and example 5
provide the abrasive particles which have respectively an attitude
with an plane oriented toward the polishing pad to be dressed, or
the planes of the part of abrasive particles and the tips of the
another of abrasive particles are oriented toward the polishing pad
to be dressed.
[0044] Please refer to FIG. 3A, a polishing pad dresser 30 is
provided, comprising: a substrate 380; a bonding layer 370 disposed
on the substrate 380; an electroplating layer 360 disposed on the
bonding layer 370; a fixed template 330 disposed on the
electroplating layer 360; and a plurality of the abrasive particles
340 corresponding to and set in the apertures of the fixed template
330, wherein the plurality of the abrasive particles 340 are fixed
in the bonding layer 370 and the substrate 380 by means of the
electroplating layer 360. In addition, the aforementioned abrasive
particles 340 have respectively an attitude with a plane oriented
toward for the polishing pad to be dressed, so that the polishing
surface is a plane shape.
[0045] Please refer to FIG. 3B, a polishing pad dresser 31 is
provided, comprising: a substrate 381; a bonding layer 371 disposed
on the substrate 381; an electroplating layer 361 disposed on the
bonding layer 371; a fixed template 331 disposed on the
electroplating layer 361; and a plurality of the abrasive particles
341 corresponding to and set in the apertures of the fixed template
331, wherein the plurality of the abrasive particles 341 are fixed
in the bonding layer 371 and the substrate 381 by means of the
electroplating layer 361. Furthermore, in the aforementioned
polishing pad dresser 31, the central abrasive particles 341
located in the central area may have respectively an tip oriented
toward the polishing pad to be dressed, and the periphery abrasive
particles 342 located in the surrounding area may have respectively
a plane oriented toward the polishing pad to be dressed, so that
the polishing surface may be a convex shape. Therefore, the present
invention can further adjust the direction of the tip or of the
plane of the abrasive particle at will according to the requirement
of the polishing process, so that the polishing surface shape is a
plane, a convex plane, or a concave plane so as to control the
grinding performance and quality of the chemical mechanical
polishing pad dresser.
EXAMPLE 6
[0046] FIG. 4A and FIG. 4B show the schematic view and the
schematic perspective view of a CMP pad dresser of the present
invention. The example 6 provides the CMP pad dresser manufactured
by example 1 to be arranged and assembled on a base substrate, so
as to form a modular chemical mechanical polishing pad dresser.
[0047] Please refer to the FIG. 4A and FIG. 4B, a modular CMP pad
dresser is provided, comprising: providing a base substrate 480,
the base substrate 480 disposed on the bottom of the polishing pad
dresser 10 (referring to FIG. 1H), and disposed an adhesive layer
490 for adjusting thickness, wherein the adhesive layer 490 is
sandwiched between the substrate and the base substrate. In
addition, in aforementioned modular CMP pad dresser, the surface of
base substrate 480 may have a plurality of the CMP pad dresser 10,
and the diameter of the base substrate 480 may be 4 to 20 times of
the diameter of substrates of the CMP pad dressers 10. Wherein, in
example 6, the diameter of the substrate 480 is 100 mm, the surface
of base substrate 480 may have 12 CMP pad dressers 10, and the
diameter of the CMP pad dressers 10 (or the substrate thereof) is
15 mm.
[0048] In aforementioned modular CMP pad dresser, a sealing layer
470 is further comprised, which may filled in the gap of the
substrates of the aforementioned CMP pad dressers, so that the
substrates of the CMP pad dressers 10 is fixed on the base
substrate 480, so as to form a modular chemical mechanical
polishing pad dresser.
[0049] The embodiments described above are only to exemplify the
present invention but not to limit the scope of the present
invention. Any equivalent modification or variation according to
the spirit of the present invention is to be also included within
the scope of the present invention.
* * * * *