U.S. patent application number 14/101176 was filed with the patent office on 2014-09-25 for building board and method for producing building board.
This patent application is currently assigned to Nichiha Corporation. The applicant listed for this patent is Nichiha Corporation. Invention is credited to Toshio IMAI, Hiroaki YAMAMOTO.
Application Number | 20140287220 14/101176 |
Document ID | / |
Family ID | 49766860 |
Filed Date | 2014-09-25 |
United States Patent
Application |
20140287220 |
Kind Code |
A1 |
IMAI; Toshio ; et
al. |
September 25, 2014 |
BUILDING BOARD AND METHOD FOR PRODUCING BUILDING BOARD
Abstract
A building board includes an inorganic board having a surface
covered by an insulating coating film containing a coating film
forming material and organic hollow particles, wherein the organic
hollow particles have an average particle size in the range of 5 to
50 .mu.m and an average hollow ratio of 80% or more, and the
insulating coating film contains 0 01 to 5.0 parts by mass of the
organic hollow particles per 100 parts by mass of solid content
thereof, and has an average thickness of 5 to 500 .mu.m. The method
for producing a building board includes: applying, onto a surface
of an inorganic board, an insulating coating material containing a
coating film forming material and organic hollow particles; and
drying the insulating coating material to form an insulating
coating film.
Inventors: |
IMAI; Toshio; (Nagoya-shi,
JP) ; YAMAMOTO; Hiroaki; (Nagoya-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Nichiha Corporation |
Nagoya-shi |
|
JP |
|
|
Assignee: |
Nichiha Corporation
Nagoya-shi
JP
|
Family ID: |
49766860 |
Appl. No.: |
14/101176 |
Filed: |
December 9, 2013 |
Current U.S.
Class: |
428/313.5 ;
427/384 |
Current CPC
Class: |
E04B 1/806 20130101;
C04B 41/71 20130101; C04B 41/483 20130101; C04B 41/64 20130101;
Y02W 30/97 20150501; C04B 41/4988 20130101; C04B 41/4842 20130101;
C04B 41/52 20130101; Y10T 428/249972 20150401; C04B 41/63 20130101;
C04B 41/009 20130101; Y02W 30/91 20150501; C04B 41/009 20130101;
C04B 18/26 20130101; C04B 28/02 20130101; C04B 41/483 20130101;
C04B 16/082 20130101; C04B 41/4842 20130101; C04B 16/082 20130101;
C04B 41/4988 20130101; C04B 16/082 20130101; C04B 41/52 20130101;
C04B 41/483 20130101; C04B 41/52 20130101; C04B 16/082 20130101;
C04B 41/483 20130101; C04B 41/52 20130101; C04B 16/082 20130101;
C04B 41/4842 20130101; C04B 41/522 20130101; C04B 41/52 20130101;
C04B 16/082 20130101; C04B 41/4988 20130101; C04B 41/522
20130101 |
Class at
Publication: |
428/313.5 ;
427/384 |
International
Class: |
E04B 1/80 20060101
E04B001/80 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 19, 2013 |
JP |
2013-056833 |
Claims
1. A building board comprising an inorganic board having a surface
covered by an insulating coating film containing a coating film
forming material and organic hollow particles, wherein the organic
hollow particles have an average particle size in the range of 5 to
50 .mu.m and an average hollow ratio of 80% or more, and the
insulating coating film contains 0.01 to 5.0 parts by mass of the
organic hollow particles per 100 parts by mass of solid content
thereof, and has an average thickness of 5 to 500 .mu.m.
2. The building board according to claim 1, wherein the insulating
coating film is formed as an outermost layer in the building
board.
3. The building board according to claim 1, wherein the organic
hollow particles comprise at least one of acrylonitrile,
methacrylonitrile, vinylidene chloride, acrylic acid ester, and
styrene.
4. The building board according to claim 1, wherein the insulating
coating film contains a water-soluble solvent.
5. The building board according to claim 4, wherein the
water-soluble solvent comprises at least one of a glycol-based
solvent and a glycol ether-based solvent.
6. The building board according to claim 1, wherein the inorganic
board is a ceramic siding board.
7. A method for producing a building board, comprising: applying,
onto a surface of an inorganic board, an insulating coating
material containing a coating film forming material and organic
hollow particles; and drying the insulating coating material to
form an insulating coating film, wherein a coating material
containing 0.01 to 5.0 parts by mass of organic hollow particles
having an average particle size in the range of 5 to 50 .mu.m and
an average hollow ratio of 80% or more, per 100 parts by mass of
solid content of the coating material is used as the insulating
coating material, and the coating material is dried such that the
insulating coating film has an average thickness of 5 to 500
.mu.m.
8. The method for producing a building board according to claim 7,
wherein the insulating coating film is formed on an outermost side
in the building board.
9. The method for producing a building board according to claim 7,
wherein the organic hollow particles comprise at least one of
acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic acid
ester, and styrene.
10. The method for producing a building board according to claim 7,
wherein the insulating coating material contains a water-soluble
solvent.
11. The method for producing a building board according to claim
10, wherein the water-soluble solvent comprises at least one of a
glycol-based solvent and a glycol ether-based solvent.
12. The method for producing a building board according to claim 7,
wherein a ceramic siding board is used as the inorganic board.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a building board that is
suitable for wall materials, roof materials and the like, and a
method for producing such a building board.
[0003] 2. Description of Related Art
[0004] Conventionally, inorganic boards composed mainly of a
hydraulic inorganic powder such as cement and wood reinforcement
such as wood pulp fiber have been used. These inorganic boards have
excellent physical properties including, for example, flexural
strength, and thus are used as building boards such as interior
wall materials, exterior wall materials, roof materials and the
like of residential houses after they are subjected to coating.
[0005] However, in view of the recent environmental issues,
including, for example, those related to energy saving, there is a
need for an improved thermal insulation effect for residential
houses. To this end, investigations have been made to increase the
thermal insulation effect for residential houses by forming an
insulating coating film on the surface of a building board. For
example, JP 2000-71389A discloses an insulating wall material
obtained by forming, on the surface of a substrate, an insulating
coating film in which a ceramic fine powder having thermal
insulation properties is mixed with and dispersed in a coating film
forming material.
[0006] However, the experiments carried out by the present
inventors have demonstrated that a building board having formed
thereon an insulating coating film containing the dispersed and
mixed ceramic fine powder as in the case of JP 2000-71389A actually
has a small thermal insulation effect (see the comparative examples
described below). As a result of in-depth studies carried out by
the inventors, it has been found that one of the causes lies in
that the ceramic fine powder tends not to provide a thermal
insulation effect because its hollow ratio is prone to be low.
Additionally, the ceramic fine powder has a large particle size,
and thus the surface of a coating film formed therefrom has no
smoothness, resulting in a poor appearance in terms of design
quality.
SUMMARY OF THE INVENTION
[0007] Therefore, it is an object of the present invention to
provide a building board having excellent thermal insulation
properties and design quality, and a method for producing the
same.
[0008] The present invention provides a building board including an
inorganic board having a surface covered by an insulating coating
film containing a coating film forming material and organic hollow
particles. The organic hollow particles have an average particle
size in the range of 5 to 50 .mu.m and an average hollow ratio of
80% or more. The insulating coating film contains 0.01 to 5.0 parts
by mass of the organic hollow particles per 100 parts by mass of
solid content thereof, and has an average thickness of 5 to 500
.mu.m. Acrylic resin, silicone resin, fluororesin, acrylic silicone
resin, polyurethane resin, epoxy resin, polysiloxane resin and the
like can be used as the coating film forming material. Although any
organic compound may be used as the material for the organic hollow
particles, it is preferable that the organic hollow particles
include at least one of acrylonitrile, methacrylonitrile,
vinylidene chloride, acrylic acid ester, and styrene because the
state in which the hollow ratio is high can be maintained. Further,
it is preferable that the insulating coating film contains a
water-soluble solvent because the coating film formed can easily be
homogeneous in the process of forming the insulating coating film
when the coating material forming the insulating coating film
contains a water-soluble solvent. In that case, it is preferable
that the water-soluble solvent includes at least one of a
glycol-based solvent and a glycol ether-based solvent because these
solvents contribute to homogenization. Examples of the inorganic
board include ceramic siding boards such as a wood fiber-reinforced
cement board, a fiber-reinforced cement board, a fiber-reinforced
cement calcium silicate board and a slag gypsum board, metallic
siding boards, and ALC boards. Ceramic siding boards are preferable
because they increase the thermal insulation effect significantly.
Furthermore, it is preferable that the insulating coating film is
formed as an outermost layer in the building board in order to make
the design quality of the surface of the insulating coating film
pronounced.
[0009] The present invention also provides a method for producing a
building board, including: applying, onto a surface of an inorganic
board, an insulating coating material containing a coating film
forming material and organic hollow particles; and drying the
insulating coating material to form an insulating coating film. The
method is characterized in that a coating material containing 0.01
to 5.0 parts by mass of organic hollow particles having an average
particle size in the range of 5 to 50 .mu.m and an average hollow
ratio of 80% or more, per 100 parts by mass of solid content of the
coating material is used as the insulating coating material, and
the coating material is dried such that the insulating coating film
has an average thickness of 5 to 500 .mu.m. As the coating film
forming material, it is possible to use, for example, acrylic
resin, silicone resin, fluororesin, acrylic silicone resin,
polyurethane resin, epoxy resin, and polysiloxane resin. It is
preferable that the organic hollow particles include at least one
of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic
acid ester, and styrene. Further, it is preferable that the
insulating coating material contains a water-soluble solvent
because the insulating coating film formed can easily be
homogeneous. In that case, it is preferable that the water-soluble
solvent includes at least one of a glycol-based solvent and a
glycol ether-based solvent because these contribute to
homogenization. Examples of the inorganic board include ceramic
siding boards such as a wood fiber-reinforced cement board, a
fiber-reinforced cement board, a fiber-reinforced cement calcium
silicate board and a slag gypsum board, metallic siding boards, and
ALC boards. It is preferable to perform the production method of
the present invention on ceramic siding boards because the thermal
insulation effect increases remarkably. In order to make the design
quality of the surface, of the insulating coating film pronounced,
it is preferable that insulating coating film is formed as an
outermost layer in the building board.
[0010] According to the present invention, it is possible to
provide a building board having excellent thermal insulation
properties and design quality, and a method for producing the
same.
DETAILED DESCRIPTION OF THE INVENTION
[0011] Hereinafter, an embodiment of the present invention will be
specifically described.
[0012] A building board according to the present invention is
characterized in that the surface of an inorganic board is covered
by an insulating coating film containing a coating film forming
material and organic hollow particles.
[0013] Examples of the inorganic board include ceramic siding
boards such as a wood fiber-reinforced cement board, a
fiber-reinforced cement board, a fiber-reinforced cement calcium
silicate board and a slag gypsum board, metallic siding boards, and
ALC boards. In the present invention, it is preferable that the
inorganic board is a ceramic siding board because this
significantly improves the thermal insulation effect provided by
the insulating coating film. Note that although the insulating
coating film may be formed directly on the surface of the inorganic
board, a sealer coating film may be formed on the inorganic board,
and the insulating coating film may be formed thereon. The sealer
coating film may be formed, for example, using an acrylic emulsion,
an acrylic urethane resin-based coating material, an epoxy
resin-based coating material, a solvent-type moisture-curable
urethane, a water-dispersible isocyanate, or the like. The sealer
coating film may be formed in a single layer, or may be formed in
two or more layers. Note that a board having a flat surface or a
board having a surface with an irregular pattern may be used as the
inorganic board.
[0014] Examples of the coating film forming material contained in
the insulating coating film that covers the surface of the
inorganic board include acrylic resin, silicone resin, fluororesin,
acrylic silicone resin, polyurethane resin, epoxy resin, and
polysiloxane resin.
[0015] Although the organic hollow particles contained in the
insulating coating film may be made of any organic material, it is
essential for the organic hollow particles to have an average
particle size in the range of 5 to 50 .mu.m and an average hollow
ratio of 80% or more. The reason that the average particle size of
the organic hollow particles is in the range of 5 to 50 .mu.m is
that an average particle size less than 5 .mu.m cannot provide a
sufficient thermal insulation effect, and an average particle size
greater than 50 .mu.m causes a reduction in the strength of the
insulating coating film formed, giving rise to such concerns that
the insulating coating film is brittle and the coating film
adhesion failure tends to occur. The reason that the average hollow
ratio of the organic hollow particle is 80% or more is that an
average hollow ratio less than 80% cannot provide a sufficient
thermal insulation effect. A preferable upper limit of the average
hollow ratio varies depending on various factors under the
condition that the hollow state of the organic hollow particles can
be maintained. However, it is preferable that the average hollow
ratio is 90% or more because the insulating coating film can
achieve a greater thermal insulation effect. Note that the "average
hollow ratio" is a value in volume percentage. To obtain these
average particle size and hollow ratio, the hollow particles need
to be an organic material. More specifically, an organic material
is flexible and thus stretches during formation of hollow
particles, so that the average hollow ratio becomes as high as 80%
or more, and that state can be maintained. It is preferable that
the organic hollow particles include at least one of acrylonitrile,
methacrylonitrile, vinylidene chloride, acrylic acid ester, and
styrene because excellent durability and thermal insulation can be
achieved.
[0016] In the present invention, the insulating coating film
contains 0.01 to 5.0 parts by mass of the organic hollow particles
per 100 parts by mass of solid content thereof and has an average
thickness of 5 to 500 .mu.m. The reason that the insulating coating
film contains 0.01 to 5.0 parts by mass of the organic hollow
particles per 100 parts by mass of solid content thereof is as
follows. Organic hollow particles in an amount less than 0.01 part
by mass cannot provide a sufficient thermal insulation effect, and
organic hollow particles in an amount greater than 5.0 parts by
mass causes a reduction in the strength of the insulating coating
film formed, giving rise to such concerns that the insulating
coating film is brittle and the coating film adhesion failure tends
to occur. Note that the organic hollow particle content represents
the ratio of the organic solid content forming a film of the
organic hollow particles, per 100 parts by mass of the solid
content constituting the entire insulating coating film. The reason
that the average thickness of the insulating coating film is 5 to
500 .mu.m is as follows. An average thickness less than 5 .mu.m
cannot provide a sufficient thermal insulation effect, and an
average thickness greater than 500 .mu.m causes a reduction in the
strength of the insulating coating film formed and an increase in
the drying time. In the case of an inorganic board having a surface
with a design pattern, the irregularities in the pattern will be
embedded, resulting in alternation of the appearance.
[0017] Further, according to the present invention, the insulating
coating film can be made more homogeneous during the process of
forming the insulating coating film when the coating material for
forming the insulating coating film contains a water-soluble
solvent. Thus, the insulating coating film may contain a
water-soluble solvent. In that case, it is preferable that the
water-soluble solvent includes at least one of a glycol-based
solvent and a glycol ether-based solvent because these solvents
contribute more to homogenization.
[0018] Note that, in the present invention, it is preferable, in
terms of design quality, that the insulating coating film is formed
as an outermost layer in the building board because the suitable
surface state and gloss of the insulating coating film are
exposed.
[0019] In the method for producing a building board according to
the present invention, an insulating coating material containing a
coating film forming material and organic hollow particles is
applied onto the surface of an inorganic board, and dried to form
an insulating coating film. The inorganic board and the coating
film forming material are as described above. Here, in the method
for producing a building board according to the present invention,
a coating material containing 0.01 to 5.0 parts by mass of organic
hollow particles having an average particle size in the range of 5
to 50 .mu.m and an average hollow ratio of 80% or more, per 100
parts by mass of the solid content of the coating material is used
as the insulating coating material, and the coating material is
dried such that the insulating coating film has an average
thickness of 5 to 500 .mu.m. The reason that the hollow particles
having an average particle size in the range of 5 to 50 .mu.m and
an average hollow ratio of 80% or more are used for the insulating
coating material is as follows. As described above, when the hollow
particles have an average particle size less than 5 .mu.m or an
average hollow ratio less than 80%, the insulating coating film
formed does not provide a sufficient thermal insulation effect.
Hollow particles having an average particle size greater than 50
.mu.m causes a reduction in the strength of the formed insulating
coating film, giving rise to such concerns that the insulating
coating film is brittle and the coating film adhesion failure tends
to occur. To meet these average particle size and average hollow
ratio and maintain that state, the hollow particles need to be an
organic material. In view of the durability and the thermal
insulation properties, it is preferable that the hollow particles
include at least one of acrylonitrile, methacrylonitrile,
vinylidene chloride, acrylic acid ester, and styrene.
[0020] Further, in the method for producing a building board
according to the present invention, a coating material containing
0.01 to 5.0 parts by mass of the organic hollow particles per 100
parts by mass of the solid content of the coating material is used
as the insulating coating material. The reason that the coating
material having an organic hollow particle content of 0.01 parts by
mass or more per 100 parts by mass of the solid content of the
coating material is that when the organic hollow particle content
is less than 0.01 parts by mass, the thermal insulation effect of
the insulating coating film formed is not sufficient. The reason
that the organic hollow particle content is 5.0 parts by mass or
less is that an organic hollow particle content greater than 5.0
parts by mass causes a reduction in the strength of the insulating
coating film formed, giving rise to such concerns that the
insulating coating film is brittle and the coating film adhesion
failure tends to occur. Note that the organic hollow particle
content represents the ratio of the organic solid content forming a
film of the organic hollow particles, per 100 parts by mass of the
solid content constituting the insulating coating material.
[0021] In the method for producing a building board according to
the present invention, the above-described insulating coating
material is applied and dried to form an insulating coating film
having an average thickness of 5 to 500 .mu.m. Various methods
including, for example, spray coating, roll coater coating, curtain
coater coating, and dip coating may be used as the method for
applying the coating material, and any of such methods may be used
as long as the dried insulating coating film has an average
thickness of 5 to 500 .mu.m. The reason that the average thickness
of the insulating coating film is 5 to 500 .mu.m is as follows.
When an average thickness is less than 5 .mu.m, the thermal
insulation effect of the insulating coating film formed is not
sufficient. An average thickness greater than 500 .mu.m causes a
reduction in the strength of the insulating coating film formed and
an increase in the drying time. In the case of an inorganic board
having a design pattern on its surface, the irregularities of the
pattern will be embedded, resulting in alteration of the
appearance. It is more preferable that the insulating coating film
has an average thickness of 30 to 500 .mu.m because excellent
hiding power can be achieved. There is no particular limitation
with respect to the drying as long as the insulating coating film
can be formed. In view of forming the insulating coating film while
reliably maintaining the hollow structure of the organic hollow
particles, it is preferable that the temperature of the coating
film during drying is 130.degree. C. or lower. In view of the
heat-resisting properties of the organic hollow particles, it is
more preferable that the above-described temperature is 40 to
110.degree. C.
[0022] Further, it is preferable that the insulating coating
material contains a water-soluble solvent because the insulating
coating film formed can easily be homogeneous. More specifically,
when the above-described organic hollow particles having a high
thermal insulation effect are mixed, there is a problem that heat
tends not to be conducted uniformly throughout the coating film
during drying after the application of the insulating coating
material onto the inorganic board. Therefore, using an insulating
coating material containing a water-soluble solvent enables heat to
be conducted, during drying, throughout the entire coating film
that is being formed. This makes it possible to form a homogeneous
insulating coating film and achieve a uniform thermal insulation
effect throughout the building board by the insulating coating
film, thus improving the overall thermal insulation properties of
the building board. As the water-soluble solvent, it is possible to
use, for example, ethylene glycol, propylene glycol, diethylene
glycol, dipropylene glycol N-butyl ether, and tripropylene glycol
monomethyl ether, or a mixture thereof. In that case, the
temperature of the coating film during application and drying of
the insulating coating material is set to be lower than the boiling
point of the water-soluble solvent. By doing so, the water-soluble
solvent remains in a sufficient amount even after being subjected
to drying, and thus can contribute to the formation of a
homogeneous insulating coating film. It is preferable that the
water-soluble solvent includes at least one of a glycol-based
solvent and a glycol ether-based solvent because these solvents
have high boiling points and thus are likely to remain until the
end of the process of forming the insulating coating film and
contribute to homogenization of the insulating coating film.
Additionally, it is preferable that the water-soluble solvent is
contained in an amount of 0.1 to 10 parts by mass per 100 parts by
mass of the solid content of the insulating coating material
because this allows the entire insulating coating film to be
reliably formed as a homogeneous film.
[0023] Note that the color tone of the insulating coating film can
be adjusted using a pigment. That is, a coating material containing
a pigment or a coating material containing no pigment may be used
as the insulating coating material.
[0024] Furthermore, in the method for producing a building board
according to the present invention, it is preferable, in terms of
design quality, that the insulating coating film is formed by
applying the insulating coating material on the outermost side of
the building board and drying the insulating coating material
because the suitable surface state and gloss of the insulating
coating film are exposed.
[0025] Hereinafter, examples of the present invention will be
described.
[0026] An aqueous white coating material composed mainly of acrylic
resin was applied in a thickness of 16 mm onto the surface of an
inorganic board (wood fiber-reinforced cement board), and dried for
about 5 minutes using a dryer at about 80.degree. C., to form a
sealer layer. Then, each of the insulating coating materials listed
in Table 1 is applied onto the surface of the sealer layer, and
dried for about 5 minutes using a dryer at about 80.degree. C., to
produce building boards of Examples 1 to 6 and Comparative Examples
1 to 6. Note that inorganic boards provided with a brick pattern on
their surfaces were used for Example 6 and Comparative Example 6,
and inorganic boards provided with a flat pattern on their surfaces
were used for the other examples.
[0027] The details of the building boards are as described in Table
1.
[0028] More specifically, in Example 1, an insulating coating film
having a thickness of 50 .mu.m was formed using, as the insulating
coating material, a coating material containing an acrylic silicone
emulsion as the coating material forming material, 2.0 parts by
mass of particles made of acrylonitrile and having an average
particle size of 15 .mu.m and an average hollow ratio of 98% as the
hollow particles, and 2.0 parts by mass of ethylene glycol as the
water-soluble solvent, and having been toned with titanium
oxide.
[0029] In Example 2, an insulating coating film having a thickness
of 30 .mu.m was formed using, as the insulating coating material, a
coating material containing an acrylic silicone emulsion as the
coating film forming material, 5.0 parts by mass of particles made
of vinylidene chloride and acrylonitrile and having an average
particle size of 20 .mu.m and an average hollow ratio of 98% as the
hollow particles, and 0.2 parts by mass of propylene glycol as the
water-soluble solvent, and having been toned with titanium
oxide.
[0030] In Example 3, an insulating coating film having a thickness
of 500 .mu.m was formed using, as the insulating coating material,
a coating material containing an acrylic silicone emulsion as the
coating film forming material, 0.5 parts by mass of particles made
of methacrylonitrile and methyl acrylate and having an average
particle size of 40 .mu.m and an average hollow ratio of 98% as the
hollow particles, and 10 parts by mass of diethylene glycol as the
water-soluble solvent, and having been toned with titanium
oxide.
[0031] In Example 4, an insulating coating film having a thickness
of 50 .mu.m was formed using, as the insulating coating material, a
coating material containing an acrylic emulsion as the coating film
forming material, 2.0 parts by mass of particles made of
acrylonitrile and having an average particle size of 15 .mu.m and
an average hollow ratio of 98% as the hollow particles, and 2.0
parts by mass of ethylene glycol as the water-soluble solvent, and
having been toned with titanium oxide and iron oxide (red).
[0032] In Example 5, an insulating coating film having a thickness
of 50 .mu.m was formed using, as the insulating coating material, a
coating material containing a fluororesin emulsion as the coating
film forming material, 2.0 parts by mass of particles made of
acrylonitrile and having an average particle size of 15 .mu.m and
an average hollow ratio of 98% as the hollow particles, and 2.0
parts by mass of ethylene glycol as the water-soluble solvent, and
having been toned with titanium oxide and iron oxide (yellow).
[0033] In Example 6, an insulating coating film having a thickness
of 500 .mu.m was formed using, as the insulating coating material,
a coating material containing an acrylic silicone emulsion as the
coating film forming material, and 2.0 parts by mass of particles
made of acrylonitrile and having an average particle size of 15
.mu.m and an average hollow ratio of 98% as the hollow particles,
and having been toned with titanium oxide.
[0034] Meanwhile, in Comparative Example 1, an insulating coating
film having a thickness of 20 .mu.m was formed using, as the
insulating coating material, a coating material containing an
acrylic silicone emulsion as the coating film forming material, and
having been toned with titanium oxide. In other words, in
Comparative Example 1, the coating film was formed using a coating
material containing no hollow particles and no water-soluble
solvent.
[0035] In Comparative Example 2, an insulating coating film having
a thickness of 50 .mu.m was formed using, as the insulating coating
material, a coating material containing an acrylic silicone
emulsion as the coating film forming material, 5.0 parts by mass of
particles made of ceramic and having an average particle size of
150 .mu.m and an average hollow ratio of 30% as the hollow
particles, and 2.0 parts by mass of propylene glycol as the
water-soluble solvent, and having been toned with titanium
oxide.
[0036] In Comparative Example 3, an insulating coating film having
a thickness of 100 .mu.m was formed using, as the insulating
coating material, a coating material containing an acrylic silicone
emulsion as the coating film forming material, 2.0 parts by mass of
particles made of methyl acrylate and having an average particle
size of 20 .mu.m and an average hollow ratio of 0% (solid), and 2.0
parts by mass of ethylene glycol as the water-soluble solvent, and
having been toned with titanium oxide.
[0037] In Comparative Example 4, an insulating coating film having
a thickness of 20 .mu.m was formed using, as the insulating coating
material, a coating material containing an acrylic emulsion as the
coating film forming material and having been toned with titanium
oxide and iron oxide (red).
[0038] In Comparative Example 5, an insulating coating film having
a thickness of 20 .mu.m was formed using, as the insulating coating
material, a coating material containing a fluororesin emulsion as
the coating film forming material and having been toned with
titanium oxide and iron oxide (yellow).
[0039] In Comparative Example 6, an insulating coating film having
a thickness of 1000 .mu.m was formed using, as the insulating
coating material, a coating material containing an acrylic silicone
emulsion as the coating film forming material and 2.0 parts by mass
of particles made of methyl acrylate and having an average particle
size of 50 .mu.m and an average hollow ratio of 0% (solid), and
having been toned with titanium oxide.
[0040] Note that, in order to examine the thermal insulation effect
provided by toning, the color tones of the coating materials of
Examples 1 to 3 and 6, and Comparative Examples 1 to 3 and 6 were
matched with one another using titanium oxide. Likewise, the color
tones of the coating materials of Example 4 and Comparative Example
4 were matched with one another using titanium oxide and iron oxide
(red), and the color tones of the coating materials of Example 5
and Comparative Example 5 were matched with one another using
titanium oxide and iron oxide (yellow).
[0041] Further, in order to examine the design effect, the
inorganic boards of Examples 1 to 5 and Comparative Examples 1 to 5
had the same flat pattern, and the inorganic boards of Example 6
and Comparative Example 6 had the same brick pattern.
[0042] The thermal insulation effect testing was performed on the
building boards of Examples 1 to 6 and Comparative Examples 1 to 6.
Lamp irradiation was used as the testing method. More specifically,
the surface of each building board was irradiated with light using
a halogen lamp of 100 V and 150 W disposed at a position 10 cm away
from the surface of the building board. Then, at the time point at
which the irradiation was continuously performed for 10 minutes,
the surface temperature of the building board was measured using a
radiation thermometer. The results are also shown in Table 1.
[0043] Furthermore, the building boards of Examples 1 to 6 and
Comparative Examples 1 to 6 were checked for their appearance.
Specifically, the surface state of the insulating coating film of
each building board was visually observed. The building boards that
had an insulating coating film having a flat surface and
successfully represented the irregular pattern of the inorganic
board were rated as "good", and the building boards that either had
an insulating coating film having a non-flat surface or failed to
represent the irregular pattern of the inorganic board were rated
as "poor". Additionally, using a hand-held gloss meter "Gloss
Checker IG-320" manufactured by HORIBA, Ltd., the gloss values of
arbitrarily selected five locations of the surface of the
insulating coating film of each building board were measured, and
an average value was determined. Then, the building boards having
an average gloss value of 20 or less were rated as "good", and the
rest of the building boards were rated as "poor". The results are
also shown in Table 1.
TABLE-US-00001 TABLE 1 Com. Com. Com. Com. Com. Com. Ex. 1 Ex. 2
Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6
Inorganic Pattern Flat Flat Flat Flat Flat Brick Flat Flat Flat
Flat Flat Brick board Insulating Coating film Composition Acrylic
Acrylic Acrylic Acrylic Fluororesin Acrylic Acrylic Acrylic Acrylic
Acrylic Fluororesin Acrylic coating forming silicone silicone
silicone emulsion emulsion silicone silicone silicone silicone
emulsion emulsion silicone material material emulsion emulsion
emulsion emulsion emulsion emulsion emulsion emulsion Hollow
Composition Acrylonitrile Vinylidene Methacryl- Acrylon- Acrylon-
Acrylon- -- Ceramic Methyl -- -- Methyl particles chloride,
onitrile, itrile itrile itrile acrylate acrylate Acrylon- Methyl
(Solid) (Solid) itrile acrylate Average particle 15 20 40 15 15 15
-- 150 20 -- -- 50 size [.mu.m] Average hollow 98 98 98 98 98 98 --
30 0 -- -- 0 ratio [%] Content [part(s) 2.0 5.0 0.5 2.0 2.0 2.0 --
5.0 2.0 -- -- 2.0 by mass] Water-soluble Composition Ethylene
Propylene Diethylene Ethylene Ethylene -- -- Propylene Ethylene --
-- -- solvent glycol glycol glycol glycol glycol glycol glycol
Content [part(s) 2.0 0.2 10.0 2.0 2.0 2.0 -- 2.0 2.0 -- -- -- by
mass] Pigment Titanium Titanium Titanium Titanium Titanium Titanium
Titanium Titanium Titanium Titanium Titanium Titanium oxide oxide
oxide oxide, oxide, oxide oxide oxide oxide oxide, oxide, oxide
Iron Iron Iron Iron oxide oxide oxide oxide (Red) (Yellow) (Red)
(Yellow) Insulating Thickness 50 30 500 50 50 500 20 50 100 20 20
1000 coating [.mu.m] film Thermal Surface temperature 54 56 50 58
59 50 65 63 63 68 69 64 insulation [.degree. C.] properties Design
Gloss value Good Good Good Good Good Good Poor Good Poor Poor Poor
Poor quality Surface state of Good Good Good Good Good Good Good
Poor Good Good Good Poor coating film
[0044] In Table 1, the hollow particle (solid particle) content and
the water-soluble solvent content are expressed in parts by mass
per 100 parts by mass of the solid content of the coating material.
Additionally, the average hollow ratio of the hollow particles
(solid particles) is expressed in volume percentage with respect to
the solid particles (hollow particles).
[0045] As can be seen from Table 1, the surface temperatures of
Comparative Examples 1 to 6 reached 63 to 69.degree. C., whereas
the surface temperatures of Examples 1 to 6 fell within the range
of 50 to 59.degree. C.
[0046] Further, a comparison of the inorganic coating materials
having the same color tone showed that the surface temperatures of
Comparative Examples 1 to 3 reached 63 to 65.degree. C., whereas
the surface temperatures of Examples 1 to 3 fell within the range
of at 50 to 56.degree. C. Likewise, the surface temperature of
Comparative Example 4 reached 68.degree. C., whereas the surface
temperature of Example 4 was kept within 58.degree. C., and the
surface temperature of Comparative Example 5 reached 69.degree. C.,
whereas the surface temperature of Example 5 was kept within
59.degree. C.
[0047] That is, it can be said that the temperature increase of the
building boards can be reliably suppressed, thus enhancing their
thermal insulation properties.
[0048] Additionally, the gloss values of Comparative Examples 1 and
3 to 5 were rated as "poor" and the surface state of the coating
film of Comparative Example 2 was rated as "poor" (the surface was
irregular as if it was rough skin). In contrast, both the gloss
values and the surface states of the coating films of Examples 1 to
5 were rated as "good", indicating that the surfaces of the coating
films were smooth.
[0049] Furthermore, the surface state of the coating film of
Comparative Example 6 was rated as "poor", indicating that the
irregular pattern of the inorganic board failed to be represented,
whereas the surface state of the coating film of Example 6 was
rated as "good", indicating that the irregular pattern of the
inorganic board was successfully represented.
[0050] Although one embodiment of the present invention has been
described above, the present invention is not limited to the
embodiment and various modifications may be made thereto within the
scope of the invention as defined in the appended claims. For
example, a coating material containing a filler such as calcium
carbonate, clay or acrylic beads, mat beads, a photostabilizer, or
an ultraviolet absorber may also be used as the insulating coating
material.
[0051] As described above, the present invention can provide a
building board having excellent thermal insulation properties and
design quality, and a method for producing the same.
* * * * *