U.S. patent application number 14/191568 was filed with the patent office on 2014-09-18 for vertical memory devices with vertical isolation structures and methods of fabricating the same.
The applicant listed for this patent is Chang-Hyun Lee. Invention is credited to Chang-Hyun Lee.
Application Number | 20140264549 14/191568 |
Document ID | / |
Family ID | 51523706 |
Filed Date | 2014-09-18 |
United States Patent
Application |
20140264549 |
Kind Code |
A1 |
Lee; Chang-Hyun |
September 18, 2014 |
VERTICAL MEMORY DEVICES WITH VERTICAL ISOLATION STRUCTURES AND
METHODS OF FABRICATING THE SAME
Abstract
A vertical memory device includes a substrate, a column of
vertical channels on the substrate and spaced apart along a
direction parallel to the substrate, respective charge storage
structures on sidewalls of respective ones of the vertical channels
and gate electrodes vertically spaced along the charge storage
structures. The vertical memory device further includes an
isolation pattern disposed adjacent the column of vertical channels
and including vertical extension portions extending parallel to the
vertical channels and connection portions extending between
adjacent ones of the vertical extension portions.
Inventors: |
Lee; Chang-Hyun; (Suwon-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Lee; Chang-Hyun |
Suwon-si |
|
KR |
|
|
Family ID: |
51523706 |
Appl. No.: |
14/191568 |
Filed: |
February 27, 2014 |
Current U.S.
Class: |
257/324 ;
438/269 |
Current CPC
Class: |
H01L 29/04 20130101;
H01L 29/16 20130101; H01L 29/7926 20130101; H01L 29/66833 20130101;
H01L 27/11578 20130101; H01L 27/11556 20130101; H01L 27/11582
20130101 |
Class at
Publication: |
257/324 ;
438/269 |
International
Class: |
H01L 27/115 20060101
H01L027/115 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 14, 2013 |
KR |
10-2013-0027397 |
Claims
1. A vertical memory device, comprising: a substrate; a column of
vertical channels on the substrate and spaced apart along a first
direction parallel to the substrate; respective charge storage
structures on sidewalls of respective ones of the vertical
channels; gate electrodes vertically spaced along the charge
storage structures; and an isolation pattern disposed adjacent the
column of vertical channels and including vertical extension
portions extending parallel to the vertical channels and connection
portions extending between adjacent ones of the vertical extension
portions.
2. The vertical memory device of claim 1, wherein the gate
electrodes include a ground selection line, a word line and a
string selection line vertically spaced apart along the vertical
channels, and wherein the connection portions have bottom surfaces
disposed between the string selection line and the word line.
3. The vertical memory device of claim 2, wherein the bottom
surfaces of the connection portions are disposed lower than a
bottom surface of the string selection line and wherein top
surfaces of the connection portions are disposed higher than a top
surface of the string selection line.
4. The vertical memory device of claim 2, wherein the string
selection line comprises string selection lines separated from each
other along a second direction parallel to the substrate by the
isolation pattern.
5. The vertical memory device of claim 1, wherein the vertical
extension portions comprise pillars having a diameter substantially
same as an outer diameter of the charge storage structures, and
wherein the vertical extension portions have a height substantially
same as a height of the charge storage structures.
6. The vertical memory device of claim 1, further comprising
respective conductive pads disposed on the vertical channels and
the isolation pattern.
7. The vertical memory device of claim 6, wherein the gate
electrodes include a ground selection line, a word line and a
string selection line vertically spaced apart along the vertical
channels, and wherein bottom surfaces of the conductive pads are
substantially higher than a top surface of the string selection
line.
8. The vertical memory device of claim 1, further comprising
respective semiconductor patterns disposed between the vertical
extension portions and the substrate and between the charge storage
structures and the substrate.
9. The vertical memory device of claim 1, wherein the vertical
extension portions and the connection portions consist essentially
of an insulating material.
10. The vertical memory device of claim 1, wherein the vertical
extension portions comprise charge storage structures.
11. A vertical memory device, comprising: a substrate; adjacent
first and second columns of vertical channels, the vertical
channels in each of the first and second columns spaced apart along
a first direction parallel to the substrate; respective charge
storage structures on sidewalls of the vertical channels of the
first and second columns of vertical channels; gate electrodes
vertically spaced along sidewalls of the charge storage structures;
a wiring extending along the first direction on and electrically
connected to a vertical channel of the first column of vertical
channels; and a bit line extending in a second direction
substantially perpendicular to the first direction on and
electrically connected to a vertical channel of the second column
of vertical channels.
12. The vertical memory device of claim 11, wherein the bit line
crosses the wiring over a vertical channel of the first column of
vertical channels.
13. The vertical memory device of claim 11, further comprising
isolation patterns extending between adjacent ones of the charge
storage structures on the first column of vertical channels;
14. The vertical memory device of claim 13, wherein the gate
electrodes include a ground selection line, a word line and a
string selection line vertically spaced apart along the vertical
channels, and wherein the isolation patterns have bottom surfaces
disposed between the string selection line and the word line.
15. The vertical memory device of claim 11, wherein the wiring is
configured to apply a predetermined voltage to the first row of
vertical channels, when the memory device including the channel
performs a read operation, a program operation or a verification
operation.
16. A method of fabricating a vertical memory device, the method
comprising: alternately forming first insulation layers and first
sacrificial layers on a substrate; forming holes through the first
insulation layers and first sacrificial layers to exposed portions
of the substrate, the holes including first and second columns of
holes extending along a first direction parallel to the substrate;
forming a trench extending along the first direction through the
first column of holes; forming an isolation pattern in the trench
and the first column of holes; forming a charge storage structure
and a vertical channel in each hole of the second column of holes;
removing the first sacrificial layers to form gaps exposing a
sidewall of the charge storage structure; and forming gate
electrodes in the gaps.
17. The method of claim 16, wherein the first and second columns of
holes are offset from one another in the first direction in a
zigzag pattern.
18. The method of claim 16, wherein forming a charge storage
structure and a vertical channel in each hole of the second column
of holes comprises: sequentially forming a tunnel insulation layer
pattern, a charge storage layer pattern and a blocking layer
pattern on each of inner walls of the holes of the second column of
holes; and forming a channel filling remaining portions of the
holes of the second column of holes.
19. The method of claim 16, wherein the gate electrodes include a
ground selection line, a word line and a string selection line
vertically spaced apart along the vertical channels, and wherein
the trench has a bottom disposed between the string selection line
and the word line.
20. The vertical memory device of claim 16, wherein the bottom of
the trench is disposed lower than a bottom surface of the string
selection line.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority under 35 USC .sctn.119 to
Korean Patent Application No. 10-2013-0027397, filed on Mar. 14,
2013 in the Korean Intellectual Property Office (KIPO), the
contents of which are herein incorporated by reference in their
entirety.
BACKGROUND
[0002] Example embodiments relate to memory devices and methods of
manufacturing the same and, more particularly, to vertical memory
devices having vertical channels and methods of manufacturing the
same.
[0003] In some methods of manufacturing vertical memory devices, an
insulation layer and a sacrificial layer may be alternately and
repeatedly formed on a substrate. Holes are formed though the
insulation layers and the sacrificial layers. Channels are formed
to fill the holes. Openings are formed through the insulation
layers and the sacrificial layers. The sacrificial layers exposed
by the openings are removed to form gaps exposing the channels. ONO
layers and gate structures including gate electrodes are formed to
fill the gaps.
[0004] Dummy channels are disposed in a region where the gate
electrodes (particularly, a string selection line) are separated.
However, a coupling phenomenon may occur between the channel and
the dummy channel, so that the electrical characteristics of the
vertical memory device may degrade.
SUMMARY
[0005] Some embodiments provide a vertical memory device including
a substrate, a column of vertical channels on the substrate and
spaced apart along a first direction parallel to the substrate,
respective charge storage structures on sidewalls of respective
ones of the vertical channels and gate electrodes vertically spaced
along the charge storage structures. The vertical memory device
further includes an isolation pattern disposed adjacent the column
of vertical channels and including vertical extension portions
extending parallel to the vertical channels and connection portions
extending between adjacent ones of the vertical extension
portions.
[0006] In some embodiments, the gate electrodes may include a
ground selection line, a word line and a string selection line
vertically spaced apart along the vertical channels. The connection
portions may have bottom surfaces disposed between the string
selection line and the word line. The bottom surfaces of the
connection portions may be disposed lower than a bottom surface of
the string selection line and top surfaces of the connection
portions may be disposed higher than a top surface of the string
selection line. In some embodiments, the string selection line may
include string selection lines separated from each other along a
second direction parallel to the substrate by the isolation
pattern.
[0007] In some embodiments, the vertical extension portions may
include pillars having a diameter substantially same as an outer
diameter of the charge storage structures. The vertical extension
portions may have a height substantially same as a height of the
charge storage structures.
[0008] The vertical memory device may further include respective
conductive pads disposed on the vertical channels and the isolation
pattern. Bottom surfaces of the conductive pads may be
substantially higher than a top surface of the string selection
line.
[0009] In some embodiments, the vertical memory device may further
include respective semiconductor patterns disposed between the
vertical extension portions and the substrate and between the
charge storage structures and the substrate.
[0010] Some embodiments provide a vertical memory device including
a substrate and adjacent first and second columns of vertical
channels, the vertical channels in each of the first and second
columns spaced apart along a first direction parallel to the
substrate. The vertical memory device further includes respective
charge storage structures on sidewalls of the vertical channels of
the first and second columns of vertical channels and gate
electrodes vertically spaced along sidewalls of the charge storage
structures. A wiring extends along the first direction on and
electrically connected to a vertical channel of the first column of
vertical channels. A bit line extends in a second direction
substantially perpendicular to the first direction on and
electrically connected to a vertical channel of the second column
of vertical channels. The bit line may cross the wiring over a
vertical channel of the first column of vertical channels.
[0011] In some embodiments, the vertical memory device may further
include isolation patterns extending between adjacent ones of the
charge storage structures on the first column of vertical channels.
The gate electrodes may include a ground selection line, a word
line and a string selection line vertically spaced apart along the
vertical channels. The isolation patterns may have bottom surfaces
disposed between the string selection line and the word line. The
bottom surfaces of the isolation patterns may be disposed lower
than a bottom surface of the string selection line, and top
surfaces of the isolation patterns may be disposed higher than a
top surface of the string selection line.
[0012] Still further embodiments provide methods of fabricating a
vertical memory device. The methods include alternately forming
first insulation layers and first sacrificial layers on a substrate
and forming holes through the first insulation layers and first
sacrificial layers to exposed portions of the substrate, the holes
including first and second columns of holes extending along a first
direction parallel to the substrate. The methods further include
forming a trench extending along the first direction through the
first column of holes and forming an isolation pattern in the
trench and the first column of holes. A charge storage structure
and a vertical channel are formed in each of the holes of the
second column of holes. The first sacrificial layers are removed to
form gaps exposing a sidewall of the charge storage structure and
gate electrodes are formed in the gaps.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Example embodiments will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings. FIGS. 1 to 28B represent non-limiting,
example embodiments as described herein.
[0014] FIG. 1 is a perspective view illustrating a vertical memory
device in accordance with example embodiments;
[0015] FIG. 2a is a horizontal cross-sectional view cut along the
line in FIG. 1;
[0016] FIG. 2b includes a vertical cross-sectional view (A) cut
along the line I-I' in FIG. 2a and a vertical cross-sectional view
(B) cut along the line II-II' in FIG. 2a;
[0017] FIG. 3 is a local perspective view illustrating the vertical
memory device of FIG. 1;
[0018] FIG. 4 is a perspective view illustrating an isolation
pattern in accordance with example embodiments;
[0019] FIG. 5 is an equivalent circuit diagram illustrating a
vertical memory device in accordance with example embodiments;
[0020] FIGS. 6 to 16B are vertical cross-sectional views,
horizontal cross-sectional views and perspective views illustrating
operations for manufacturing a vertical memory device in accordance
with example embodiments;
[0021] FIG. 17 is a perspective view illustrating a vertical memory
device in accordance with other example embodiments;
[0022] FIG. 18 includes a vertical cross-sectional view (A) cut
along the line I-I' in FIG. 17 and a vertical cross-sectional view
(B) cut along the line II-II' in FIG. 17;
[0023] FIG. 19 is a perspective view illustrating a vertical memory
device in accordance with other example embodiments;
[0024] FIG. 20 includes a vertical cross-sectional view (A) cut
along the line I-I' in FIG. 19 and a vertical cross-sectional view
(B) cut along the line II-II' in FIG. 19;
[0025] FIG. 21 is a plan view illustrating a vertical memory device
in accordance with other example embodiments;
[0026] FIG. 22 includes a vertical cross-sectional view (A) cut
along the line I-I' in FIG. 21 and a vertical cross-sectional view
(B) cut along the line II-II' in FIG. 21; and
[0027] FIGS. 23A to 28B are vertical cross-sectional views and
horizontal cross-sectional views illustrating operations for
manufacturing a vertical memory device in accordance with other
example embodiments.
DETAILED DESCRIPTION
[0028] Example embodiments will now be described more fully with
reference to the accompanying drawings, in which example
embodiments are shown. Example embodiments may, however, be
embodied in many different forms and should not be construed as
limited to the example embodiments set forth herein. In the
drawings, the thicknesses of layers and regions are exaggerated for
clarity. Like reference numerals in the drawings denote like
elements, and thus their description will be omitted.
[0029] It will be understood that when an element or layer is
referred to as being "on," "connected to" or "coupled to" another
element or layer, it can be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like numerals refer to like elements throughout. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items. Other words used to
describe the relationship between elements or layers should be
interpreted in a like fashion (e.g., "between" versus "directly
between," "adjacent" versus "directly adjacent," "on" versus
"directly on").
[0030] It will be understood that, although the terms first,
second, third, etc. may be used herein to describe various
elements, components, regions, layers and/or sections, these
elements, components, regions, layers and/or sections should not be
limited by these terms. Unless indicated otherwise, these terms are
only used to distinguish one element, component, region, layer or
section from another region, layer or section. Thus, a first
element, component, region, layer or section discussed below could
be termed a second element, component, region, layer or section
without departing from the teachings of the example
embodiments.
[0031] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper" and the like, may be used herein for ease
of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. It
will be understood that the spatially relative terms are intended
to encompass different orientations of the device in use or
operation in addition to the orientation depicted in the figures.
For example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
exemplary term "below" can encompass both an orientation of above
and below. The device may be otherwise oriented (rotated 90 degrees
or at other orientations) and the spatially relative descriptors
used herein interpreted accordingly.
[0032] The terminology used herein is for the purpose of describing
particular example embodiments only and is not intended to be
limiting of the example embodiments. As used herein, the singular
forms "a," "an" and "the" are intended to include the plural forms
as well, unless the context clearly indicates otherwise. It will be
further understood that the terms "comprises" and/or "comprising,"
when used in this specification, specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof.
[0033] Example embodiments are described herein with reference to
cross-sectional illustrations that are schematic illustrations of
idealized example embodiments (and intermediate structures). As
such, variations from the shapes of the illustrations as a result,
for example, of manufacturing techniques and/or tolerances, are to
be expected. Thus, example embodiments should not be construed as
limited to the particular shapes of regions illustrated herein but
are to include deviations in shapes that result, for example, from
manufacturing. For example, an implanted region illustrated as a
rectangle will, typically, have rounded or curved features and/or a
gradient of implant concentration at its edges rather than a binary
change from implanted to non-implanted region. Likewise, a buried
region formed by implantation may result in some implantation in
the region between the buried region and the surface through which
the implantation takes place. Thus, the regions illustrated in the
figures are schematic in nature and their shapes are not intended
to limit the scope of the present disclosure.
[0034] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0035] FIG. 1 is a perspective view illustrating a vertical memory
device in accordance with example embodiments; FIG. 2a is a
horizontal cross-sectional view cut along the line in FIG. 1
illustrating the vertical memory device; FIG. 2b includes a
vertical cross-sectional view (A) cut along the line I-I' in FIG.
2a and a vertical cross-sectional view (B) cut along the line
II-II' in FIG. 2a illustrating the vertical memory device; FIG. 3
is a local perspective view illustrating the vertical memory
device; and FIG. 4 is a perspective view illustrating an isolation
pattern in accordance with example embodiments.
[0036] For the convenience of the explanation, FIG. 1 does not show
all elements of the vertical memory device, but only shows some
elements thereof, e.g., a substrate, a semiconductor pattern, a
channel, a gate electrode, a pad, an isolation pattern, a bit line
contact and a bit line. In all figures in this specification, a
direction substantially perpendicular to a top surface of the
substrate is referred to as a first direction, and two directions
substantially parallel to the top surface of the substrate and
substantially perpendicular to each other are referred to as a
second direction and a third direction. Additionally, a direction
indicated by an arrow in the figures and a reverse direction
thereto are considered as the same direction.
[0037] Referring to FIGS. 1 to 4, the vertical memory device may
include a plurality of channels 170 each of which may extend in the
first direction on a substrate 100, a charge storage structure 160
surrounding an outer sidewall of each channel 170 and a second
blocking layer pattern 215 that may be stacked on and may partially
surround the outer sidewall of each channel 170.
[0038] Additionally, the vertical memory device may include a
plurality of gate electrodes 222, 224 and 226 that may be formed on
an outer sidewall of the second blocking layer pattern 215 and
partially cover outer sidewalls of some channels 170. The gate
electrodes 222, 224 and 226 may be separated by a first insulation
layer pattern 115, a third insulation layer pattern 230 and an
isolation pattern 150. Further, the vertical memory device may
further include a bit line 265 that may be electrically connected
to the channels 170.
[0039] The substrate 100 may include a semiconductor material,
e.g., silicon, germanium, etc. The substrate 100 may include a
first region IV and a second region V. In some example embodiments,
the first region IV may be a cell region where the channel 170 may
be disposed, and the second region V may be a word line cut region
that may separate the gate electrodes 222, 224 and 226. A plurality
of first regions IV may be arranged in the second direction, and
each of the first regions IV may extend in the third direction. The
second region V may be arranged between the first regions IV, and
the second region V may extend in the third direction.
[0040] Each channel 170 may extend in the first direction in the
first region IV. In some example embodiments, each channel 170 may
have a cup shape of which a central bottom is opened. In this case,
a space defined by an inner wall of each channel 170 may be filled
with a second insulation layer pattern 180. In other example
embodiments, each channel 170 may have a pillar shape. For example,
the channels 170 may include doped or undoped polysilicon or single
crystalline silicon.
[0041] In some example embodiments, the plurality of channels 170
may be arranged in both of the second and third directions, and
thus a channel array may be defined.
[0042] In some example embodiments, the channel array may be
arranged to correspond to a hole array (see FIG. 7A). In some
example embodiments, the channels 170 may not be disposed in the
first holes 130a (see FIG. 7A) arranged at a central portion of the
first region IV in the third direction, and the channels 170 may be
disposed in the second holes 130b and the third holes 130c (see
FIG. 7A) arranged at edge portions of the first region IV in the
third direction. Therefore, the plurality of channels 170 may be
arranged in a zigzag pattern (that is, a staggered pattern) with
respect to the third direction, and thus more channels 170 may be
arranged in a given area.
[0043] Referring to FIG. 3, the charge storage structure 160 may
include a tunnel insulation layer pattern 166, a charge storage
layer pattern 164 and a first blocking layer pattern 162 that may
be sequentially stacked on and may surround the outer sidewalls of
each channel 170. Particularly, the tunnel insulation layer pattern
166, the charge storage layer pattern 164 and the first blocking
layer pattern 162 may surround the outer sidewall and a bottom
surface of each channel 170. In some example embodiments, a
plurality of charge storage structures 160 may be formed, each of
which may be corresponded to each channel 170.
[0044] In some example embodiments, the tunnel insulation layer
pattern 166 may include an oxide, e.g., silicon oxide, the charge
storage layer pattern 164 may include a nitride, e.g., silicon
nitride, and the first blocking layer pattern 162 may include an
oxide, e.g., silicon oxide.
[0045] In some example embodiments, each channel 170 may be
disposed through the charge storage structure 160 to contact a top
surface of the substrate 100.
[0046] Additionally, a pad 185 may be formed on top surfaces of the
channel 170 and the charge storage structure 160. In some example
embodiments, the pad 185 may include doped or undoped polysilicon
or single crystalline silicon.
[0047] A plurality of first insulation layer patterns 115 may be
formed in the first direction on sidewalls of the first blocking
layer patterns 162, respectively. For example, each first
insulation layer pattern 115 may include silicon oxide, and a space
between the first insulation layer patterns 115 at each level may
be defined as a gap 200.
[0048] The second blocking layer pattern 215 may surround a
sidewall of the first blocking layer pattern 162 exposed by the gap
200. Thus, portions of the outer sidewalls of the channels 170 may
be surrounded by the second blocking layer pattern 215. The second
blocking layer pattern 215 may be further formed on an inner wall
of the gap 200. Top and bottom end portions of the second blocking
layer pattern 215 may extend in both of the second and third
directions. The second blocking layer pattern 215 may include an
insulation material, e.g., aluminum oxide and/or silicon oxide.
[0049] The plurality of gate electrodes 222, 224 and 226 may be
formed on sidewalls of the second blocking layer pattern 215 and
may fill the gap 200. In some example embodiments, the plurality of
gate electrodes 222, 224 and 226 may extend in the third
direction.
[0050] The plurality of gate electrodes 222, 224 and 226 may
include a ground selection line (GSL) 226, a word line 222 and a
string selection line (SSL) 224 that are spaced apart from each
other along the first direction.
[0051] Each of the GSL 226, the word line 222 and the SSL 224 may
be at a single level (e.g., one of each, each at a different
height) or more than one level, and each of the first insulation
layer patterns 115 may be interposed therebetween. In an example
embodiments, the GSL 226 and the SSL 224 may be at one level (e.g.,
two of each at different heights), respectively, and the word line
222 may be at 4 levels between the GSL 226 and the SSL 217.
However, the GSL 226 and the SSL 224 may be at two levels, and the
word line 222 may be formed at 2, 8 or 16 levels.
[0052] In some example embodiments, the plurality of gate
electrodes 222, 224 and 226 may include, for example, a metal
and/or a metal nitride. For example, the plurality of gate
electrodes 222, 224 and 226 may include a metal and/or a metal
nitride with low electrical resistance (e.g., tungsten, tungsten
nitride, titanium, titanium nitride, tantalum, tantalum nitride
and/or platinum.).
[0053] Accordingly, the charge storage structure 160 and the
plurality of gate electrodes 222, 224 and 226 may define a gate
structure. A plurality of gate structures may be formed in the
first direction.
[0054] On the other hand, the plurality of gate electrodes 222, 224
and 226 may be arranged in the second direction. Particularly, the
plurality of gate electrodes 222, 224 and 226 may be separated by
the third insulation layer pattern 230 and the isolation pattern
150 extending in the third direction.
[0055] The third insulation layer pattern 230 may be disposed in
the second region V of the substrate 100, and may extend in the
first direction and the third direction. Therefore, the word line
222, the SSL 224 and the GSL 226 may be separated from each other
in the second direction by the third insulation layer pattern
230.
[0056] Referring to FIG. 3 and FIG. 4, the isolation pattern 150
may be disposed at the central portion of the first region IV of
the substrate 100. The isolation pattern 150 may include a
plurality of extension portions 150a extending in the first
direction and a plurality of connection portions 150b connecting
the extension portions 150a in the third direction.
[0057] In some example embodiments, the plurality of extension
portions 150a may be arranged in the third direction, and each of
the extension portions 150a may extend in the first direction.
Therefore, a bottom surface of the extension portions 150a may
directly contact the surface of the substrate 100, and a top
surface of the extension portions 150a may be substantially higher
than a top surface of the SSL 224. For example, the extension
portions 150a may have a pillar shape.
[0058] The connection portions 150b may be disposed between the
extension portions 150a in the third direction. The connection
portions 150b may be disposed through the SSL 224, so that the SSL
224 may be separated from each other in the second direction by the
connection portions 150b. The connection portions 150b may not
penetrate the word line 222. Accordingly, the connection portions
150b may separate the SSL 224 in the second direction, and may not
separate the word line 222.
[0059] A bottom surface of the connection portions 150b may be
substantially equal to or lower than a bottom surface of the SSL
224, and may be higher than a top surface of the uppermost word
line 222. The bottom surface of the connection portion 150b may be
higher than the bottom surface of the extension portion 150a.
Further, a top surface of the connection portions 150b may
substantially equal to the top surface of the extension portions
150a. A width of the connection portion 150b in the second
direction may be substantially smaller than a diameter of the
extension portion 150a.
[0060] In some example embodiments, the isolation pattern 150 may
include an insulation material, such as silicon oxide. In
particular, the isolation pattern 150 may consist essentially of an
insulation material. Therefore, the extension portions 150a of the
isolation pattern 150 may reduce or prevent a coupling between the
isolation pattern 150 and the adjacent channels 170.
[0061] The bit line 265 may be electrically connected to the pad
185 via a bit line contact 235, and thus may be electrically
connected to the channels 170. The bit line 265 may include a
metal, a metal nitride, doped polysilicon, and the like. In some
example embodiments, the bit line 265 may extend in the second
direction, and a plurality of bit lines 265 may be formed in the
third direction.
[0062] The bit line contact 260 may be disposed through a fourth
insulation layer 240, and make contact with a top surface of the
pad 185. The bit line contact 260 may include a metal, a metal
nitride, doped polysilicon, and the like.
[0063] According to example embodiments, the vertical memory device
may include the isolation pattern 150. The isolation pattern 150
may include an insulation material such as silicon oxide.
Therefore, coupling between the extension portions 150a and the
adjacent channels 170 may be reduced or prevented. Further, the
connection portions 150b may separate the SSL 224 in the second
direction.
[0064] FIG. 5 is an equivalent circuit diagram illustrating a
vertical memory device in accordance with example embodiments.
[0065] Referring to FIG. 5 with the FIGS. 1 to 4, the word line 222
and the channels 170 according to example embodiments may define a
memory cell 10. The SSL 224 and the channels 170 may define an
upper non memory cell 20, and the GSL 226 and the channels 170 may
define a lower non memory cell 30.
[0066] A single cell string 40 may be formed to include the upper
non memory cell 20, the lower non memory cell 30 and a plurality of
memory cells 10. Each cell string 40 may be electrically connected
to the bit line 265.
[0067] The equivalent circuit diagram in the FIG. 5 may be applied
not only to the vertical memory device illustrated with reference
to the FIGS. 1 to 4 but also to all vertical memory devices
illustrated in all of the example embodiments.
[0068] The plurality of word lines 222 may extend in the third
direction, and may be spaced apart from each other in the first and
second directions. Thus, the plurality of memory cells 10 defined
by the word lines 222 and the channels 170 may be distributed
three-dimensionally.
[0069] A plurality of SSLs 224 may extend in the third direction,
and may be arranged in the second direction. Thus, one of the cell
strings 40 connected to one bit line 265 may be selected by the
upper non memory cell 20 including the SSL 224. The GSL 226 may
control an electrical connection between the channel 170 and the
substrate 100.
[0070] FIGS. 6 to 16B are vertical cross-sectional views,
horizontal cross-sectional views and perspective views illustrating
operations for manufacturing a vertical memory device in accordance
with example embodiments. FIGS. 7A, 8A, 9A, 10A, 11A, 12A, 13A and
16A are horizontal cross-sectional views illustrating operations
for manufacturing a vertical memory device in accordance with
example embodiments, FIGS. 6, 7B, 8B, 9B, 10B, 11B, 12B, 13B, 14,
15 and 16B are vertical cross-sectional views illustrating
operations for manufacturing a vertical memory device in accordance
with example embodiments, and FIG. 11 C is a local perspective view
illustrating operations for manufacturing the vertical memory
device. Particularly, FIGS. 6, 7B, 8B, 9B, 10B, 11B, 12B, 13B, 14,
15 and 16B include cross-sectional views (A) cut along the line
I-I' of the horizontal cross-sectional views and cross-sectional
views (B) cut along the line II-II' of the horizontal
cross-sectional views. The figures show operations for
manufacturing the vertical memory device of FIGS. 1 to 4, but these
operations are not be limited thereto.
[0071] Referring to FIG. 6, first insulation layers 110 and first
sacrificial layers 120 may be alternately and repeatedly formed on
a substrate 100. A plurality of first insulation layers 110 and a
plurality of first sacrificial layers 120 may be alternately formed
on each other at a plurality of levels, respectively.
[0072] The substrate 100 may include a semiconductor material, for
example, silicon and/or germanium. The substrate 100 may be divided
into a first region IV and a second region V. In some example
embodiments, the first region IV may be a cell region where the
channel 170 (see FIG. 11A) may be disposed, and the second region V
may be a word line cut region that may separate the gate electrodes
222, 224 and 226 (see FIG. 15).
[0073] In some example embodiments, the first insulation layers 110
and the first sacrificial layers 120 may be formed by, for example,
a chemical vapor deposition (CVD) process, a plasma enhanced
chemical vapor deposition (PECVD) process and/or an atomic layer
deposition process (ALD) process. A lowermost first insulation
layer 110, which may be disposed directly on a top surface of the
substrate 100, may be formed by, for example, a thermal oxidation
process. In some example embodiments, the first insulation layer
110 may include a silicon oxide. The first sacrificial layer 120
may be formed to include, for example, a material with etch
selectivity to the first insulation layer 110 (e.g., silicon
nitride).
[0074] The number of the first insulation layers 110 and the number
of the first sacrificial layers 120 stacked on the substrate 100
may vary according to the desired number of a GSL 226, a word line
222 and a SSL 224 (see FIG. 15). According to some example
embodiments, each of the GSL 226 and the SSL 224 may be formed at a
single level, and the word lines 222 may be formed at 4 levels. The
first sacrificial layers 120 may be formed at 6 levels, and the
first insulation layers 110 may be formed at 7 levels. According to
some example embodiments, each of the GSLs 226 and the SSLs 224 may
be formed at two levels, and the word lines 222 may be formed at 2,
8 or 16 levels. The number of the first insulation layers 110 and
the number of the first sacrificial layers 120 may vary according
to this case. However, the number of GSLs 226, SSLs 224 and word
lines 222 may not be limited to the example embodiments described
herein.
[0075] Referring to FIGS. 7A and 7B, a plurality of holes 130 may
be formed through the first insulation layers 110 and the first
sacrificial layers 120 to expose the top surface of the substrate
100. A second sacrificial layer pattern 135 may be formed in each
hole 130.
[0076] In some example embodiments, after forming a hard mask on
the uppermost first insulation layer 110, the first insulation
layers 110 and the first sacrificial layers 120 may be dry etched
using the hard mask as an etch mask to form the holes 130. A second
sacrificial layer may be formed on the hard mask to fill the holes
130, and an upper portion of the second sacrificial layer may be
removed to form the second sacrificial layer pattern 135.
[0077] Each of the holes 130 may extend in the first direction. Due
to the characteristics of a dry etch process, the holes 130 may be
of a width that becomes gradually decreases from a top portion to a
bottom portion of the holes 130.
[0078] In some example embodiments, a plurality of holes 130a, 130b
and 130c may be arrayed in the second and third directions in the
first region IV. The holes 130a, 130b and 130c formed in the first
region IV may define a hole array. In some example embodiments, the
hole array may have a first hole column including the plurality of
first holes 130a arranged in the third direction, a second hole
column including the plurality of second holes 130b arranged in the
third direction and a third hole column including the plurality of
third holes 130c arranged between the first and second holes 130a
and 130b. The first holes 130a may be arranged at a central portion
of the first region IV in the third direction. The second holes
130b may be arranged at edge portions of the first region IV in the
third direction. The third holes 130c may be positioned in a
direction, which may be an oblique angle to the second direction or
the third direction, from the first or the second holes 130a or
130b. Accordingly, the first, second and third holes 130a, 130b and
130c may be arranged in a zigzag pattern with respect to the third
direction, and thus more holes 130 may be arranged in a given
area.
[0079] In some example embodiments, the second sacrificial layer
may be formed using a material having an etch selectivity with
respect to the first insulation layer 110 and the first sacrificial
layer 120. When the first insulation layer 110 includes silicon
oxide and the first sacrificial layer 120 includes silicon nitride,
the second sacrificial layer may include polysilicon, amorphous
silicon, a silicon based spin on hard mask (si-SOH) material or a
carbon based spin on hard mask (c-SOH) material.
[0080] Referring to FIGS. 8A and 8B, a first trench 140 may be
formed by partially removing the second sacrificial layer pattern
135 and portions of the first insulation layers 110 and the first
sacrificial layers 120. The first trench 140 may penetrate a
specific first sacrificial layer 120, in which the SSL 217 (see
FIG. 15) may be subsequently formed, and the first insulation layer
110 disposed above the specific first sacrificial layer 120.
Further, the first trench 140 may partially penetrate the first
insulation layer 110 disposed under the specific first sacrificial
layer 120, in which the SSL 217 may be subsequently formed.
[0081] In some example embodiments, the first trench 140 may extend
in the third direction, and may overlap the second sacrificial
layer pattern 135 disposed in the first hole 130a. Further, the
first trench 140 may have a width in the second direction that may
be less than a diameter of the first hole 130a.
[0082] Referring to FIGS. 9a and 9b, the second sacrificial layer
pattern 135 filling the first hole 130a may be removed. In some
example embodiments, a mask may be formed on the first insulation
layer 110 and the second sacrificial layer pattern disposed in the
second and third holes 130b and 130c. An etching process may be
performed to remove the second sacrificial layer pattern 135
filling the first hole 130a.
[0083] Therefore, the first holes 130a may be in fluid
communication with the first trench 140. The first trench 140 may
extend in the third direction, so that the plurality of first holes
130a arranged in the third direction may be in fluid communication
with each other by the first trench 140.
[0084] Referring to FIGS. 10a and 10b, an isolation pattern 150 may
be formed to fill the first holes 130a and the first trench 140.
Particularly, after forming an isolation layer on the uppermost
first insulation layer 110 to fill the first holes 130a and the
first trench 140, an upper portion of the isolation layer may be
planarized until a top surface of the first insulation layer 110 is
exposed, thereby forming the isolation pattern 150. In some example
embodiments, the isolation layer may be formed using a material
having an etch selectivity with respect to the first insulation
layer 110. The planarization process may include a chemical
mechanical polishing (CMP) process and/or an etch back process.
[0085] The isolation pattern 150 may include a plurality of
extension portions 150a filling the first holes 130a and a
plurality of connection portions 150b connecting the extension
portions 150a. In some example embodiments, the plurality of
extension portions 150a may be arranged in the third direction.
Each of the extension portions 150a may extend in the first
direction according to the first holes 130a. The extension portions
150a may directly contact the top surface of the substrate 100. The
extension portion 150a may have a pillar shape.
[0086] The connection portions 150b may be disposed between the
extension portions 150a in the third direction. The connection
portions 150b may penetrate the specific first sacrificial layer
120, in which the SSL 217 (see FIG. 15) may be subsequently formed,
and the first insulation layer 110 disposed above the specific
first sacrificial layer 120. Further, the connection portions 150b
may partially penetrate the first insulation layer 110 disposed
under the specific first sacrificial layer 120, in which the SSL
217 may be subsequently formed. However, the connection portions
150b may not penetrate the first sacrificial layers 120, in which
the word line 222 (see FIG. 15) may be subsequently formed.
Therefore, a bottom surface of the connection portion 150b may be
higher than a bottom surface of the extension portion 150a.
Further, a width of the connection portion 150b in the second
direction may be smaller than the diameter of the first extension
portion 150a.
[0087] In some example embodiments, the isolation pattern 150 may
include an insulation material, such as silicon oxide.
Particularly, the isolation pattern 150 may consist essentially of
an insulation material, that is, the isolation pattern 150 may not
include a conductive material or a semiconductor material. The
extension portions 150a of the isolation pattern 150 may reduce or
prevent a coupling between the extension portions 150a and adjacent
channels 170 (see FIG. 11A).
[0088] Referring to FIGS. 11A, 11B and 11C, after removing the
second sacrificial layer pattern 135, a charge storage structure
160, a channel 170 and a second insulation layer pattern 180 may be
formed in each of the second holes 130b and the third holes 130c.
In some example embodiments, a first blocking layer, a charge
storage layer and a tunnel insulation layer may be formed on inner
walls of the second and third holes 130b and 130c, a top surface of
the substrate 100 and the top surface of the uppermost first
insulation layer 110, and lower portions of the first blocking
layer, the charge storage layer and the tunnel insulation layer may
be removed to form a first recess 175. A channel layer may be
formed on inner walls of the first recess 175, the second hole 130b
and the third hole 130c, a second insulation may be formed in the
first recess 175, the second hole 130b and the third hole 130c, and
an upper portion of the channel layer and the second insulation
layer may be planarized until the top surface of the uppermost
first insulation layer 110 is exposed, thereby forming a first
blocking layer pattern 162, a charge storage layer pattern 164, a
tunnel insulation layer pattern 166, the channel 170 and the second
insulation layer pattern 180. The first blocking layer pattern 162,
the charge storage layer pattern 164, the tunnel insulation layer
pattern 166 may form the charge storage structure 160.
[0089] In some example embodiments, the first blocking layer may be
formed using an oxide, e.g., silicon oxide, the charge storage
layer may be formed using a nitride, e.g., silicon nitride, and the
tunnel insulation layer may be formed using an oxide, e.g., silicon
oxide.
[0090] In some example embodiments, a plurality of channels 170 may
be arranged in the second and third directions, so that a channel
array may be defined. The plurality of channels 170 in the second
holes 130b and the plurality of channels 170 in the third holes
130c may be arranged in a zigzag pattern with respect to the third
direction, and thus more channels 170 may be arranged in a given
area.
[0091] Referring to FIGS. 12A and 12B, upper portions of the
channel 170, the charge storage structure 160, the second
insulation layer pattern 180 and the isolation pattern 150 may be
removed to form a second recess 182, and a pad 185 may be formed to
fill the second recess 182. In particular, upper portions of the
channel 170, the charge storage structure 160, the second
insulation layer pattern 180 and the isolation pattern 150 may be
removed by an etch back process to form the second recess 182. A
pad layer may be formed on the channel 170, the charge storage
structure 160, the second insulation layer pattern 180, the
isolation pattern 150 and the uppermost first insulation layer 110
in the second recess 182, and the pad layer may be planarized until
a top surface of the uppermost first insulation layer 110 is
exposed to form the pad 185. In some example embodiments, the pad
layer may include amorphous silicon, and a crystallization process
may be further performed thereon.
[0092] Referring to FIGS. 13A and 13B, a first opening 190 may be
formed through the first insulation layers 110 and the first
sacrificial layers 120 to expose the top surface of the substrate
100, and the first sacrificial layers 120 may be removed to form
gaps 200 between first insulation layer patterns 115 at adjacent
levels.
[0093] In some example embodiments, after forming a hard mask (not
shown) on the uppermost first insulation layer 110, the insulation
layers 110 and the first sacrificial layers 120 may be, for
example, dry etched using the hard mask as an etch mask to form the
first opening 190. The first opening 190 may extend in the first
direction.
[0094] In some example embodiments, a plurality of first openings
190 may be arranged in the second direction, and each first opening
190 may extend in the third direction. Each first opening 190 may
be formed in the second region V between the first regions IV.
[0095] The first insulation layer 110 and the first sacrificial
layer 120 may be converted into a first insulation layer pattern
115 and a first sacrificial layer pattern 125, respectively. A
plurality of first insulation layer patterns 115 may be formed in
the second direction at each level, and each first insulation layer
pattern 115 may extend in the third direction.
[0096] In some example embodiments, the first sacrificial layer
patterns 125 exposed by the first openings 190 may be removed by,
for example, a wet etch process using an etch solution including
phosphoric acid and/or sulfuric acid. Therefore, an outer sidewall
of the first blocking layer pattern 162 may be partially exposed by
the gaps 200.
[0097] Referring to FIG. 14, a second blocking layer 210 and a gate
electrode layer 220 may be sequentially formed on the exposed
portion of the outer sidewall of the first blocking layer pattern
162, inner walls of the gaps 200, surfaces of the first insulation
patterns 115, the exposed top surface of the substrate 100 and top
surfaces of the pads 185. A gate electrode layer 220 may fill
remaining portions of the gaps 200. In some example embodiments,
the second blocking layer 210 may be formed using an insulation
material such as aluminum oxide or silicon oxide by a sequentially
flow deposition (SFD) process or an atomic layer deposition (ALD)
process. In some example embodiments, the gate electrode layer 220
may be formed using a metal. For example, the gate electrode 210
may include a metal of a low resistance, e.g., tungsten, titanium,
tantalum, platinum, and the like. When the gate electrode layer 220
includes tungsten, the gate electrode layer 220 may be formed by a
CVD process or an ALD process using tungsten hexafluoride
(WF.sub.C) as a source gas.
[0098] Referring to FIG. 15, the gate electrode layer 220 may be
partially removed to form a plurality of gate electrodes 222, 224
and 226 in the gaps 200.
[0099] In some example embodiments, the gate electrode layer 220
may be partially removed by, for example, a wet etch process. In
some example embodiments, the plurality of gate electrodes 222, 224
and 226 may fill the gap 200. The plurality of gate electrodes 222,
224 and 226 may extend in the third direction.
[0100] The plurality of gate electrodes 222, 224 and 226 may
include GSLs 226, word lines 222 and SSLs 224 sequentially located
from the top surface of the substrate 100. Each of the GSLs 226,
the word lines 222 and the SSLs 224 may be formed at a single level
or at a plurality of levels. According to some example embodiments,
each of the GSLs 226 and the SSLs 224 may be formed at single
level, and the word lines 222 may be formed at 4 levels between the
GSL 226 and the SSL 217. However, the number of GSLs 218, word
lines 216 and SSLs 217 is not limited thereto.
[0101] The GSLs 226 may be formed adjacent to the top surface of
the substrate 100. The word lines 222 and the SSLs 224 may be
formed adjacent to the channels 170, and particularly, the SSLs 224
may be formed adjacent to the connection portion 150b of the
isolation pattern 150. The connection portion 150b of the isolation
pattern 150 may extend in the third direction, and may penetrate
the SSLs 224 in the first direction. Therefore, the SSLs 224 may be
separated from each other in the second direction by the connection
portion 150b.
[0102] When the gate electrode layer 220 is partially removed,
portions of the second blocking layer 210 on a surface of the first
insulation layer pattern 115 and on top surfaces of the substrate
100, the pads 185 and the division layer pattern 165 may also be
removed to form a second blocking layer pattern 215.
[0103] In a process for partially removing the gate electrode layer
220 and the second blocking layer 210, the first opening 190
exposing the top surface of the substrate 100 and extending in the
third direction may be formed again. Impurities may be implanted
into the exposed top surface of the substrate 100 to form an
impurity region 105. In some example embodiments, the impurities
may include n-type impurities, for example, phosphorus and/or
arsenic. In some example embodiments, the impurity region 105 may
extend in the third direction and may serve as a common source line
(CSL).
[0104] Referring to FIG. 16A and 16B, a third insulation pattern
230 may be formed in the first opening 190. A bit line contact 260
may formed. The bit line contact 260 is electrically connected to a
bit line 265.
[0105] In some example embodiments, after a third insulating
interlayer filling the first opening 190 is formed on the substrate
100 and the uppermost first insulation pattern 115, an upper
portion of the third insulating interlayer may be planarized until
a top surface of the uppermost first insulation layer pattern 115
may be exposed to form the third insulation layer pattern 230.
[0106] A fourth insulation layer 240 may be formed on the first and
third insulation layer patterns 115 and 230 and the pad 185, and a
second opening may be formed to expose a top surface of the pad
185. The bit line contact 260 may be formed on the pad 185 to fill
the second opening. The bit line 265 electrically connected to the
bit line contact 260 may be formed.
[0107] According to some example embodiments, operations for
fabricating a vertical memory device may include forming an
isolation pattern 150 having extension portions 150a and connection
portions 150b. The isolation pattern 150 may include an insulation
material such as silicon oxide. Particularly, the isolation pattern
150 may consist essentially of an insulation material, i.e., the
isolation pattern 150 may not include a conductive material or a
semiconductor material. Therefore, coupling between the isolation
pattern 150 and adjacent channels 170 may be reduced or prevented.
Further, the connection portions 150b may separate the SSLs
224.
[0108] FIG. 17 is a perspective view illustrating a vertical memory
device in accordance with other example embodiments, and FIG. 18
includes a vertical cross-sectional view (A) cut along the line
I-I' in FIG. 17 and a vertical cross-sectional view (B) cut along
the line II-II' in FIG. 17 illustrating the vertical memory device.
The vertical memory device may include substantially similar
features to those shown in FIGS. 1 to 4, so like reference numerals
refer to like elements, and repetitive explanations thereof may be
omitted.
[0109] The vertical memory device may include a plurality of
channels 170, each of which may extend in a first direction on a
substrate 100, and charge storage structures 160 surrounding outer
sidewalls of the channels 170. The vertical memory device may
further include gate electrodes 222, 224 and 226 partially covering
outer sidewalls of some of the channels 170. The gate electrodes
222, 224 and 226 may be separated by first insulation layer
patterns 115, third insulation layer patterns 230 and the isolation
patterns 151.
[0110] Compared to the vertical memory device described with
reference to FIGS. 1 to 4, the vertical memory device of FIGS. 17
and 18 may not include a pad disposed on top surfaces of the
channel 170 and the isolation pattern 151. Therefore, the isolation
pattern 151 of FIGS. 17 and 18 may have a different shape from the
isolation pattern 150 of FIGS. 1 to 4.
[0111] The isolation patterns 151 may include a plurality of
extension portions 151a extending in the first direction and a
plurality of connection portions 151b connecting the extension
portions 151a in the third direction. The connection portions 151b
and the extension portions 151a of the isolation patterns 151 may
have top surfaces substantially coplanar with top surfaces of the
channels 170.
[0112] According to some example embodiments, the isolation
patterns 151 may include an insulation material such as silicon
oxide. Therefore, coupling between the extension portions 151a and
the adjacent channels 170 may be reduced or prevented. Further, the
connection portions 151b may separate the SSLs 224 in the second
direction.
[0113] FIG. 19 is a perspective view illustrating a vertical memory
device in accordance with other example embodiments, and FIG. 20
includes a vertical cross-sectional view (A) cut along the line
I-I' in FIG. 19 and a vertical cross-sectional view (B) cut along
the line II-II' in FIG. 19 illustrating the vertical memory device.
The vertical memory device may include features substantially
similar to those shown in FIGS. 1 to 4, so like reference numerals
refer to like elements, and repetitive explanations thereof may be
omitted.
[0114] The vertical memory device may include a plurality of
channels 170, each of which may extend in a first direction on a
substrate 100, charge storage structures 160 surrounding outer
sidewalls of the channels 170. The vertical memory device may
include a plurality of gate electrodes 222, 224 and 226 partially
covering outer sidewalls of the channels 170. The plurality of gate
electrodes 222, 224 and 226 may be separated by first insulation
layer patterns 115, third insulation layer patterns 230 and
isolation patterns 152.
[0115] Compared to the vertical memory device described with
reference to FIGS. 1 to 4, the vertical memory device of FIGS. 19
and 20 may further include .a semiconductor pattern 155 between the
channels 170 and a top surface of the substrate 100 and between the
isolation pattern 152 and the top surface of the substrate 100.
Therefore, the isolation pattern 152 of FIGS. 19 and 20 may have a
different shape from the isolation pattern 150 of FIGS. 1 to 4.
[0116] The semiconductor pattern 155 may directly contact a lower
portion of the channel 170 that may penetrate the charge storage
structure 160. In some example embodiments, the semiconductor
pattern 155 may include doped or undoped polysilicon, single
crystalline polysilicon, doped or undoped polygermanium or single
crystalline germanium. A GSL 226 may be disposed adjacent to a
sidewall of the semiconductor pattern 155.
[0117] The isolation pattern 152 may include a plurality of
extension portions 152a extending in the first direction and a
plurality of connection portions 152b connecting the extension
portions 152a in the third direction. A bottom surface of the
extension portion 152a of the isolation pattern 152 may directly
contact the top surface of the semiconductor pattern 155, and may
not directly contact the top surface of the substrate 100.
Therefore, the bottom surface of the extension portion 152 may be
higher than a top surface of the GSLs.
[0118] According to some example embodiments, the isolation pattern
152 may include an insulation material, such as silicon oxide.
Therefore, coupling between the extension portions 152a and the
adjacent channels 170 may be reduced or prevented. Further, the
connection portions 152b may separate the SSLs 224 in the second
direction.
[0119] FIG. 21 is a plan view illustrating a vertical memory device
in accordance with other example embodiments, and FIG. 22 includes
a vertical cross-sectional view (A) cut along the line I-I' in FIG.
21 and a vertical cross-sectional view (B) cut along the line
II-II' in FIG. 21 illustrating the vertical memory device. The
vertical memory device include features that are substantially
similar to those of FIGS. 1 to 4, so like reference numerals refer
to like elements, and repetitive explanations thereof may be
omitted.
[0120] The vertical memory device may include a plurality of
channels 170 and 170a, each of which may extend in a first
direction on a substrate 100, and charge storage structures 160
surrounding outer sidewalls of the channels 170 and 170a.
[0121] In some example embodiments, the plurality of channels 170
and 170a may be arranged in a second direction and a third
direction, and thus a channel array may be defined. Dummy channels
170a may be disposed in the first holes 130a (see FIG. 7A) arranged
at a central portion of the first region IV in the third direction,
and regular channels 170 may be disposed in the second holes 130b
and the third holes 130c (see FIG. 7A) arranged at edge portions of
the first region IV in the third direction. The channels 170 may be
arranged in a zigzag pattern (that is, a staggered pattern) with
respect to the third direction.
[0122] The vertical memory device may include gate electrodes 222,
224 and 226 partially covering outer sidewalls of the channels 170.
The gate electrodes 222, 224 and 226 may be separated by first
insulation layer patterns 115, third insulation layer patterns 230
and isolation patterns 153. Further, the vertical memory device may
further include bit lines 265 electrically connected to the
channels 170. The dummy channels 170a in the first holes 130a may
be electrically connected to the first wiring 250 by the first
wiring contacts 245, and the regular channels 170 in the second
holes 130b and the third holes 130c may be electrically connected
to the bit lines 265 by bit line contacts 260.
[0123] In some example embodiments, first wirings 250 may be
arranged in the second direction, each of the first wirings 250 may
extend in the third direction. The first wirings 250 may apply a
predetermined voltage to the dummy channel 170a. For example, when
a memory cell of the channel 170 adjacent to the dummy channel 170a
performs a program operation or a read operation, the first wiring
250 may apply 0V to the dummy channel 170a. Further, when the
memory cell of the channel 170 adjacent to the dummy channel 170a
performs a verification operation, the first wiring 250 may apply
0V or a positive voltage (Vcc) to the dummy channel 170a. When the
memory cell of the channel 170 adjacent to the dummy channel 170a
performs an erase operation, the dummy channel 170a may be floated,
i.e., the electrical potential of the dummy channel 170a may be
adjusted by the first wiring 250, so that coupling between the
adjacent channels 170 may be reduced or prevented.
[0124] FIGS. 23A to 28B are vertical cross-sectional views and
horizontal cross-sectional views illustrating operations for
fabricating a vertical memory device in accordance with other
example embodiments. Processes substantially the same as or similar
to those illustrated with reference to FIG. 6 may be performed.
First insulation layers 110 and first sacrificial layers 120 may be
alternately and repeatedly formed on a substrate 100.
[0125] Referring to FIGS. 23A and 23B, a first trench 140 may be
formed by removing portions of a first insulation layer 110 and a
first sacrificial layer 120. An isolation pattern 153 may be formed
in the first trench 140.
[0126] In some example embodiments, the first trench 140 may
penetrate a specific first sacrificial layer 120, in which the SSLs
217 (see FIG. 15) may be subsequently formed, and the first
insulation layer 110 disposed above the specific first sacrificial
layer 120. After forming an isolation layer on the third insulation
layer 110 to fill the first trench 140, an upper portion of the
isolation layer may be planarized until a top surface of the first
insulation layer 110 is exposed, thereby forming the isolation
pattern 153. For example, the isolation layer may be formed using
an insulation material, such as silicon oxide.
[0127] Referring to FIGS. 24A and 24B, a plurality of holes 130 may
be formed through the first insulation layers 110 and the first
sacrificial layers 120 to expose a top surface of the substrate
100. The process for forming the plurality of holes 130 may be
substantially the similar to that described with reference to FIGS.
7A and 7B. The plurality of holes 130a, 130b and 130c may be
arranged in the second direction and the third direction.
[0128] Referring to FIGS. 25A and 25B, a charge storage structure
160, a channel 170 and a second insulation layer pattern 180 may be
formed in each of the holes 130a, 130b and 130c. The process for
forming the charge storage structures 160, the channels 170 and the
second insulation layer patterns 180 may be substantially the
similar to that described with reference to FIGS. 11A, 11B and 11C.
However, the charge storage structures 160, the channels 170 and
the second insulation layer patterns 180 may be formed not only in
the second hole 130b and the third hole 130c but also in the first
holes 130a.
[0129] Referring to FIGS. 26A and 26B, pads 185 may be formed on
the channels 170, the charge storage structures 160 and the second
insulation layer patterns 180, and a first opening 190 may be
formed through the first insulation layer 110 and the first
sacrificial layer 120. After removing the first sacrificial layers
120, gate electrodes 222, 224 and 225 and a second blocking layer
pattern 215 may be formed using processes substantially similar to
those described with reference to FIGS. 12 to 15. Further, common
source line contacts 235 may be formed through a third insulation
layer pattern 230 in a second region V of the substrate 100, such
that the common source line contact 235 may be electrically
connected to the impurity regions 105.
[0130] Referring to FIGS. 27A and 27B, first contacts 245 and
second contacts 247 may be formed. First wirings 250 and second
wirings 252 may be formed. After forming a fourth insulation layer
240 on the first insulation layer pattern 115, pads 185 and third
insulation layer patterns 230, the first and second contacts 245
and 247 may be formed to penetrate the fourth insulation layer 240.
The first wirings 250 may be formed to be electrically connected to
the first contacts 245 and the second wirings 252 may be formed to
be electrically connected to the second contacts 247.
[0131] In some example embodiments, the first wirings 250 and the
second wirings 252 may extend in the third direction. The first
contacts 245 may directly contact top surfaces of the pads 185
filling the first holes 130a, so that the channels 170 in the first
holes 130a may be electrically connected to the first wirings 250
by the first contacts 245 and the pads 185.
[0132] Further, the second contacts 247 may directly contact top
surfaces of the common source line contacts 235, so that the
impurity region 105 may be electrically connected to the second
wiring 252 by the first second contact 245 and the common source
line contact 235.
[0133] The first contacts 245 and the second contacts 247 may be
formed simultaneously. Further, the first wirings 250 and the
second wiring 252 may be formed simultaneously. Therefore, the
first contacts 245 and the first wirings 250 may be formed without
an additional process.
[0134] Referring to FIGS. 28A and 28B, bit line contacts 260 and
bit lines 265 may be formed. After forming a fifth insulation layer
255 on the first and second wirings 250 and 252 and the fourth
insulation layer 240, the bit line contacts 260 may be formed
through the fourth insulation layer 240 and the fifth insulation
layer 255. The bit lines 265 electrically connected to the bit line
contacts 260 may be formed on the fifth insulation layer 255.
[0135] In some example embodiments, a plurality of bit lines 265
may be arranged in the third direction, and each of the bit lines
265 may extend in the second direction. Therefore, the bit lines
265 may be substantially perpendicular to the first wirings 250.
Further, the bit line contacts 260 may directly contact top
surfaces of the pads 185 in the second holes 130b and the third
holes 130c, so that the channels 170 in the second holes 130b and
the third holes 130c may be electrically connected to the bit lines
265 by the bit line contacts 260 and the pads 185.
[0136] The first wirings 250 may apply a predetermined voltage to
the channel 170 in the first hole 130a (hereinafter referred to as
a dummy channel). For example, when a memory cell of the channel
170 performs a program operation or a read operation, the first
wiring 250 may apply 0V to the dummy channel. Further, when the
memory cell of the channel 170 performs a verification operation,
the first wiring 250 may apply 0V or a positive voltage (Vcc) to
the dummy channel. When the memory cell of the channel 170 performs
an erase operation, the dummy channel may be floated. That is, the
electrical potential of the dummy channel 170a may be adjusted by
the first wiring 250, so that coupling between the channels 170 may
be reduced or prevented.
[0137] The foregoing is illustrative of example embodiments and is
not to be construed as limiting thereof. Although a few example
embodiments have been described, those skilled in the art will
readily appreciate that many modifications are possible in the
example embodiments without materially departing from the novel
teachings and advantages of the present inventive subject matter.
Accordingly, all such modifications are intended to be included
within the scope of the present inventive subject matter as defined
in the claims. In the claims, means-plus-function clauses are
intended to cover the structures described herein as performing the
recited function and not only structural equivalents but also
equivalent structures. Therefore, it is to be understood that the
foregoing is illustrative of various example embodiments and is not
to be construed as limited to the specific example embodiments
disclosed, and that modifications to the disclosed example
embodiments, as well as other example embodiments, are intended to
be included within the scope of the appended claims.
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