U.S. patent application number 14/205091 was filed with the patent office on 2014-09-18 for devices, systems and methods of cooling the skin.
This patent application is currently assigned to Gentherm Incorporated. The applicant listed for this patent is Gentherm Incorporated. Invention is credited to John Lofy, David Marquette.
Application Number | 20140260331 14/205091 |
Document ID | / |
Family ID | 51521081 |
Filed Date | 2014-09-18 |
United States Patent
Application |
20140260331 |
Kind Code |
A1 |
Lofy; John ; et al. |
September 18, 2014 |
DEVICES, SYSTEMS AND METHODS OF COOLING THE SKIN
Abstract
According to some embodiments, a thermal conditioning system for
selectively cooling skin of a subject comprises at least one
thermal conditioning device comprising a first side and second
side, the second side being generally opposite of the first side.
In some embodiments, the system further comprises a heat sink
positioned along the second side of the at least one thermal
conditioning device, wherein the first side of the at least one
thermal conditioning device is configured to be placed in contact
with or in close proximity to a skin surface of the subject to
selectively cool or heat the skin surface.
Inventors: |
Lofy; John; (Claremont,
CA) ; Marquette; David; (Farmington Hills,
MI) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Gentherm Incorporated |
Northville |
MI |
US |
|
|
Assignee: |
Gentherm Incorporated
Northville
MI
|
Family ID: |
51521081 |
Appl. No.: |
14/205091 |
Filed: |
March 11, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61777629 |
Mar 12, 2013 |
|
|
|
Current U.S.
Class: |
62/3.3 ; 165/185;
165/287 |
Current CPC
Class: |
F25B 21/02 20130101;
A61F 2007/0036 20130101; A61M 13/003 20130101; A61M 2205/3606
20130101; F28F 3/048 20130101; A61F 2007/0055 20130101; A61F 7/007
20130101; A61F 2007/0091 20130101; A61M 2205/8206 20130101; A61M
2210/04 20130101; F25B 2321/0251 20130101; A61M 2205/3673 20130101;
A61F 2007/0095 20130101; A61M 2205/3368 20130101; F28F 3/022
20130101; A61F 2007/0075 20130101; A61B 2090/065 20160201; A61M
2205/3344 20130101 |
Class at
Publication: |
62/3.3 ; 165/185;
165/287 |
International
Class: |
F25B 21/02 20060101
F25B021/02; F28F 3/02 20060101 F28F003/02 |
Claims
1-35. (canceled)
36. A thermal conditioning system for selectively cooling or
heating a skin surface of a subject, the system comprising: at
least one thermal conditioning device comprising a first side and
second side, the second side being generally opposite of the first
side; a heat sink positioned along the second side of the at least
one thermal conditioning device; wherein the first side of the at
least one thermal conditioning device is configured to be placed in
contact with or in close proximity to a skin surface of the subject
to selectively cool or heat the skin surface.
37. The system of claim 36, wherein the heat sink comprises one or
more heat transfer members, the heat transfer members comprising
fins or pins; wherein the at least one thermal conditioning device
comprises a thermoelectric device; wherein the first side of the at
least one thermal conditioning device is configured to not contact
the skin surface; and further comprising at least one spacer
configured to maintain a clearance between the first side of the at
least one thermal conditioning device and the skin surface of the
subject during use.
38. The system of claim 36, wherein the heat sink comprises one or
more heat transfer members.
39. The system of claim 36, wherein the heat transfer members
comprise fins or pins.
40. The system of claim 36, wherein the at least one thermal
conditioning device comprises a thermoelectric device.
41. The system of claim 36, wherein the first side of the at least
one thermal conditioning device is configured to contact the skin
surface.
42. The system of claim 36, wherein the first side of the at least
one thermal conditioning device is configured to not contact the
skin surface.
43. The system of claim 42, further comprising at least one spacer
configured to maintain a clearance between the first side of the at
least one thermal conditioning device and the skin surface of the
subject during use.
44. The system of claim 43, wherein the spacer comprises a smooth
surface and/or a slidable or other movable feature or portion.
45. The system of claim 36, further comprising at least one
intermediate member or base, the at least one intermediate member
or base being configured to support the at least one thermal
conditioning device, wherein the at least one intermediate member
or base is configured to at least partially contact the skin
surface of the subject during use.
46. The system of claim 45, wherein the at least one intermediate
member or base comprises a layer of fabric or plastic.
47. The system of claim 45, wherein the at least one intermediate
member or base is at least partially flexible so as to generally
conform to a shape of the subject's skin surface.
48. The system of claim 36, wherein the system comprises a
plurality of thermal conditioning devices.
49. The system of claim 48, wherein at least two of the plurality
of thermal conditioning devices are electrically and/or
mechanically coupled to each other by at least one interconnecting
member.
50. The system of claim 49, further comprising at least one joint
or movable feature along or near the at least one interconnecting
member to provide additional flexibility to the system.
51. The system of claim 48, wherein the thermal conditioning
devices are arranged in a hexagonal pattern.
52. The system of claim 36, further comprising at least one
sensor.
53. The system of claim 52, wherein the sensor comprises at least
one of a temperature sensor, a humidity sensor, a condensation
sensor and a pressure sensor.
54. The system of claim 36, further comprising at least one thermal
switch or fuse configured to automatically cease power delivery to
the at least one thermal conditioning device when a temperature
associated with the at least one thermal switch or fuse rises above
a maximum threshold or drops below a minimum threshold.
55. The system of claim 36, further comprising thermal insulation
along at least a portion the surfaces of the heat sink.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the priority benefit under 35 U.S.C.
.sctn.119(e) of U.S. Provisional Application No. 61777,629, filed
Mar. 12, 2013, the entirety of which is hereby incorporated by
reference herein.
BACKGROUND
[0002] 1. Field
[0003] This application relates to climate control devices, systems
and methods, and more specifically, to devices, systems and method
of cooling and/or heating a skin surface of a subject (e.g., human,
other mammalian, etc.) and/or for other medical thermal
conditioning purposes.
[0004] 2. Description of the Related Art
[0005] Cooling of human or other mammalian skin can provide one or
more benefits, particularly in situations or circumstances where a
subject's skin and/or body temperature is elevated relative to
normal, acceptable, comfortable and/or safe levels. For example, in
some instances, a person's skin and/or body temperature may be
dangerously high because of fever and/or another medical condition
(e.g., infection, allergy or other adverse reaction, disease,
etc.). In other cases, a subject's temperature may be elevated due
to exposure to heat or sun and/or other source of heat (e.g.,
workspace). In other circumstances, it may be desirable to heat a
person's skin or other anatomical location, either in lieu of or in
addition to cooling, as desired or required. For example, heating
can be used to treat hypothermia, chills and/or any other condition
or ailment. Therefore, a need exists to provide devices, systems
and methods of cooling and/or heating skin and/or other portions of
a subject's anatomy.
SUMMARY
[0006] According to some embodiments, a thermal conditioning system
for selectively cooling and/or heating skin of a subject comprises
at least one thermal conditioning device comprising a first side
and second side, the second side being generally opposite of the
first side. In some embodiments, the system further comprises a
heat sink positioned along the second side of the at least one
thermal conditioning device, wherein the first side of the at least
one thermal conditioning device is configured to be placed in
contact with or in close proximity to a skin surface of the subject
to selectively cool or heat the skin surface. In some embodiments,
the heat sink comprises one or more heat transfer members (e.g.,
fins, pins, etc.).
[0007] According to some embodiments, a method of selectively
cooling and/or heating skin of a subject includes placing a thermal
conditioning system adjacent a skin surface of a subject, wherein
the thermal conditioning system comprises at least one thermal
conditioning device (e.g., a thermoelectric device, a convective
heater, a heat pump, another heating or cooling device, etc.)
having a first side and second side, wherein the second side being
generally opposite of the first side, wherein the thermal
conditioning system further comprises a heat sink positioned along
the second side of the at least one thermal conditioning device,
wherein the first side of the at least one thermal conditioning
device is configured to be placed in contact with or in close
proximity to a skin surface of the subject to selectively cool or
heat the skin surface.
[0008] According to some embodiments, the method further comprises
activating the at least one thermal conditioning device so at to
selectively heat or cool the subject's skin, and deactivating the
at least one thermal conditioning device after a time period (e.g.,
0-10 seconds, 10-20 seconds, 20-30 seconds, 30-45 seconds, 445-60
seconds, 1-2 minutes, 2-3 minutes, 3-5 minutes, 5-10 minutes, 10-15
minutes, 15-20 minutes, 20-30 minutes, 30 minutes-60 minutes, 1-1.5
hours, 1.5-2 hours, 2-3 hours, 3-4 hours, 4-5 hours, 5-10 hours,
more than 10 hours, etc.). In some embodiments, the system is
removably fastened to the subject using at least one fastener
(e.g., strap, connector, buckles, clamp, clasp, etc.). In one
embodiment, the system is positioned against or near the subject
without fastening or otherwise securing the system to the
subject.
[0009] According to some embodiments, the method further comprises
detecting a temperature of the at least one thermal conditioning
device and/or the subject's skin using at least one sensor (e.g.,
temperature sensor, thermocouple, etc.). In some embodiments, the
system is configured to deactivate, at least in part (e.g., one or
more of the thermal conditioning devices are deactivated), when a
threshold temperature is detected by the at least one sensor. In
some embodiments, the thermal conditioning system comprises a
plurality of thermal conditioning devices, the thermal conditioning
devices being arranged in at least two zones, wherein each of the
at least two zones can be separately controlled and operated during
use.
[0010] According to some embodiments, the at least one thermal
conditioning device comprises a thermoelectric device (e.g.,
Peltier circuit or device). In some embodiments, the at least one
thermal conditioning device comprises a convective heater, a heat
pump and/or any other type of heating or cooling device. In some
embodiments, the first side of the at least one thermal
conditioning device is configured to contact, at least partially, a
skin surface of the subject. In some embodiments, the first side of
the at least one thermal conditioning device is configured to not
contact the skin surface. Therefore, the system can be positioned,
during use, so as to provide a desired clearance or spacing from
the subject's skin.
[0011] According to some embodiments, the system further comprises
at least one spacer or other feature, device or member configured
to maintain a clearance between the first side of the at least one
thermal conditioning device and the skin surface of the subject
during use. In one embodiment, the spacer comprises a smooth
surface and/or a slidable or other movable feature or portion. In
some embodiments, such a clearance distance can be 1 mm to 20 mm
(e.g., 1, 2, 3, 4, 5, 10, 15, 20 mm, values between the foregoing,
etc.). In other embodiments, the clearance is less than about 1 mm
(e.g., 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.9, 0.9 mm,
values between the foregoing, etc.) or more than about 20 mm (e.g.,
21, 22, 25, 30, 35, 40, 50, 60 mm, more than 60 mm, values between
the foregoing, etc.).
[0012] According to some embodiments, the system further comprises
at least one intermediate member or base configured to support the
at least one thermal conditioning device, wherein the at least one
intermediate member or base is configured to at least partially
contact the skin surface of the subject during use. In some
embodiments, the at least one intermediate member or base comprises
a layer of fabric, plastic or the like. In some embodiments, the
base can be shaped, sized and otherwise configured to fit on or
around a portion of the subject's body (e.g., particular surface,
limb, etc.). In some embodiments, the at least one intermediate
member or base is at least partially flexible so as to generally
conform to a shape of the subject's skin surface.
[0013] According to some embodiments, the system comprises a
plurality of (e.g., 2, 3, 4, 5, 6, 7, 8, 9, 10, 10-15, 15-20, more
than 20, etc.) thermal conditioning devices. In one embodiment, at
least two of the plurality of thermal conditioning devices are
electrically and/or mechanically coupled to each other by at least
one interconnecting member (e.g., post, wire, other rigid,
semi-rigid or flexible member or feature, etc.). In some
embodiments, the system further comprises at least one joint or
movable feature (e.g., hinge, bendable portion or feature, etc.)
along or near the at least one interconnecting member to provide
additional flexibility to the system. In some embodiments, the
thermal conditioning devices are arranged in a hexagonal pattern.
In some embodiments, the thermal conditioning devices are arranged
in a rectangular, triangular, other polygonal, circular (e.g.,
along one or more concentric circles), oval (e.g., along one or
more concentric ovals), irregular, etc. pattern.
[0014] According to some embodiments, the system further comprises
at least one sensor (e.g., temperature sensor, a humidity sensor, a
condensation sensor, a pressure, contact or occupant sensor, etc.).
In some embodiments, the system additionally includes at least one
thermal switch or fuse configured to automatically cease power
delivery to the at least one thermal conditioning device when a
temperature associated with the at least one thermal switch or fuse
rises above a maximum threshold or drops below a minimum threshold.
In some embodiments, the system further includes thermal insulation
(e.g., layers, components, etc.) along one or more outer surfaces
and/or other portions of the heat sink (e.g., fins, pins, base,
etc.).
[0015] According to some embodiments, the system further includes
at least one of a power supply and a control module, wherein the
power supply is configured to electrically activate the at least
one thermal conditioning device, and wherein the control module is
configured to regulate at least one aspect of the system. In one
embodiment, the power supply comprises a battery, a connection to
an AC or DC power supply and/or the like.
[0016] According to some embodiments, the at least one thermal
conditioning device is configured to only cool the subject's skin.
In some embodiments, the at least one thermal conditioning device
is configured to only heat the subject's skin. In other
embodiments, the at least one thermal conditioning device is
configured to selectively cool and/or heat the subject's skin.
[0017] According to some embodiments, the system further comprises
at least one fastener (e.g., strap, buckle, latch, etc.) configured
to removably secure the system to the subject during use. In some
embodiments, at least one component of the system comprises a
non-linear (e.g., curved, irregular, undulating, etc.) surface to
enable the system to better conform to a shape of the subject's
skin. In some embodiments, the at least one thermal conditioning
device and the heat sink are collectively assembled into a single
thermal conditioning assembly. In some embodiments, the plurality
of thermal conditioning devices are divided or assembled into at
least two zones (e.g., 2, 3, 4, 5, 6, 7, 9, 10, more than 10,
etc.), each of the at least two zones being configured to be
controlled independently of at least one other zone.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] These and other features, aspects and advantages of the
present application are described with reference to drawings of
certain embodiments, which are intended to illustrate, but not to
limit, the concepts disclosed herein. The attached drawings are
provided for the purpose of illustrating concepts of at least some
of the embodiments disclosed herein and may not be to scale.
[0019] FIG. 1 illustrates a perspective view of one embodiment of a
thermal conditioning system configured for use on a subject's
limb;
[0020] FIG. 2 illustrates a front perspective view of one
embodiment of a thermal conditioning system configured for use on a
subject's limb;
[0021] FIG. 3 illustrates a side perspective view of one embodiment
of a thermal conditioning system configured for use on a subject's
limb;
[0022] FIG. 4 illustrates a side view of one embodiment of a heat
sink of a thermal conditioning assembly;
[0023] FIG. 5 illustrates a perspective view of a heat sink
comprising one or more layers of thermal insulation according to
one embodiment;
[0024] FIG. 6 illustrates a perspective view of another embodiment
of a thermal conditioning system configured for use on a subject's
limb;
[0025] FIG. 7 illustrates one embodiment of a heat sink of a
thermal conditioning assembly comprising a plurality of pins;
[0026] FIG. 8a schematically illustrates a side view of one
embodiment of a thermal conditioning assembly comprising a
sensor;
[0027] FIG. 8b schematically illustrates a side view of one
embodiment of a thermal conditioning assembly comprising at least
one spacer to provide clearance between the assembly and the
adjacent skin surface;
[0028] FIG. 8c schematically illustrates a side view of one
embodiment of a thermal conditioning assembly comprising an
intermediate or base layer positioned between the thermal
conditioning device and the subject's skin;
[0029] FIG. 9 schematically illustrates a perspective view of one
embodiment of a glove-shaped thermal conditioning system configured
to cool and/or heat a subject's skin;
[0030] FIG. 10 illustrates a side view of thermal conditioning
assemblies positioned along a subject's arm, according to one
embodiment;
[0031] FIG. 11 schematically illustrates a thermal conditioning
system comprises a plurality of thermal zones;
[0032] FIG. 12 schematically illustrates a side view of thermal
conditioning assemblies according to one embodiment;
[0033] FIG. 13 schematically illustrates a side view of curved
(e.g., non-linear) thermal conditioning assemblies according to one
embodiment;
[0034] FIG. 14 schematically illustrates a top view of a thermal
conditioning system comprises a plurality of thermal conditioning
assemblies generally arranged in a hexagonal layout or pattern;
[0035] FIG. 15 schematically illustrates thermal conditioning
assemblies forming a generally triangular pattern and having
interconnecting members connecting each other according to one
embodiment;
[0036] FIG. 16 schematically illustrates one embodiment of two
interconnecting members attached to a thermal conditioning
assembly; and
[0037] FIG. 17 schematically illustrates one embodiment of a
thermal conditioning system positioned around a limb of a subject
and comprising at least one fastener to keep the system in place,
relative to the subject, during use.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0038] This application is generally directed to climate control
systems for the cooling (and/or heating) of skin and/or other
portions of a person's anatomy. Accordingly, the climate control
system and the various devices, systems and features associated
with it are described herein in the context of such skin and/or
medical cooling or heating applications because they have
particular utility in this context. However, the devices, systems
and the methods described herein, as well as their various systems
and features, can be used in other contexts as well, such as, for
example, but without limitation, cooling or temperature regulation
of surfaces and/or other portion of living or non-living beings or
things, such as, for example, animals, plants, electronic devices
or components, seating assemblies and/or the like.
[0039] Various embodiments disclosed herein utilize one or more
thermoelectric devices to selectively cool and/or heat a desired
skin surface or other surface. In alternative embodiments, the
thermal conditioning of skin or a target surface can be
accomplished using one or more other thermal conditioning devices
(e.g., cooling, heating and/or ventilation devices), such as, for
example, heat pumps, convective heaters, refrigerant-based systems,
other thermal conditioning device, etc, either in lieu of or in
addition to thermoelectric devices. A thermoelectric device or TED
can comprise a Peltier device. According to some embodiments, a
thermoelectric device comprises a first substrate and a second
substrate disposed apart from each other. In some embodiments, the
first and second substrates can be configured to provide electrical
insulation (e.g., between adjacent layers or members). In addition,
the thermoelectric device can comprise a plurality of semiconductor
elements (e.g., pellets) comprising a first set of semiconductor
elements and a second set of semiconductor elements, the first and
second sets of semiconductor elements can include dissimilar
electrical properties. In some embodiments, each of the
semiconductor elements include a first end positioned toward the
first substrate and a second end positioned toward the second
substrate. In some embodiments, electrical conductors are used to
electrically couple the ends of two adjacent semiconductor elements
to one another. In some embodiments, the conductors are arranged
and otherwise configured to electrically connect the semiconductor
elements of the thermoelectric device to one another in series.
[0040] In some embodiments, when a voltage is applied to the
thermoelectric device, the thermoelectric device is activated,
causing a first side of the thermoelectric device (e.g., along or
near the first substrate) to heat and the second side of the
thermoelectric device (e.g., along or near the second, opposite
substrate) to cool. Such a heating or cooling effect can be
reversed (e.g., wherein the first side is cooled and the second
side is heated) by reversing the electrical current through the
thermoelectric device. In addition, the amount of heating and/or
cooling desired can be regulated by modifying the duty cycle of the
thermoelectric device. Accordingly, thermoelectric devices can be
used to selectively heat or cool an adjacent surface.
[0041] Additional details regarding thermoelectric devices,
convective heaters and/or other thermal conditioning devices or
systems are provided in U.S. patent application Ser. No.
11/546,928, filed on Oct. 12, 2006 and published as U.S. Publ. No.
2008/0087316 on Apr. 17, 2008; U.S. patent application Ser. No.
11/833,892, filed on Aug. 3, 2007 and issued as U.S. Pat. No.
8,222,511 on Jul. 17, 2012; U.S. patent application Ser. No.
11/972,544, filed on Jan. 10, 2008 and published as U.S. Publ. No.
2008/0173022 on Jul. 24, 2008; U.S. patent application Ser. No.
12/049,120, filed on Mar. 14, 2008 and issued as U.S. Pat. No.
8,143,554 on Mar. 27, 2012; and U.S. patent application Ser. No.
12/695,602, filed on Jan. 28, 2010 and published as U.S. Publ. No.
2010/0193498 on Aug. 5, 2010, all of which are hereby incorporated
by reference herein and made a part of the present application.
[0042] Thermal conditioning using thermoelectric devices can be
accomplished via conductive heating or cooling, wherein the heat is
transferred directly to or from the surface to be conditioned. For
example, in conductive conditioning, a thermoelectric device and/or
other thermal conditioning device can be placed in contact with
and/or in close proximity to the object that will be thermally
conditioned (e.g., skin, other anatomical location, a surface or
other portion of an electronic device or other inanimate object,
etc.). Once the thermal conditioning device is activated, the
portion of the thermal conditioning device adjacent the target
surface (e.g., a first or second side of a thermoelectric device)
can be cooled or heated. As a result of the heating or cooling of
the thermoelectric device and/or any other thermal conditioning
device can cause the transfer of heat either away or to the surface
to be thermally conditioned (e.g., a subject's skin or other
anatomical area, a surface or portion of a device, etc.).
[0043] In other embodiments, the heat transfer between a thermal
conditioning device (e.g., a thermoelectric device) and a subject's
skin or other surface targeted for cooling or heating can be
accomplished convectively. For example, air or other fluid can be
delivered past or near a heated or cooled portion of a thermal
conditioning device to selectively heat or cool such air or other
fluid. The heated or cooled fluid can then be transferred to a
subject's skin or other target surface. For any of the embodiments
disclosed herein, such convective thermal conditioning of skin can
be performed either in addition to or in lieu of conductive
techniques.
[0044] With respect to either conductive or convective cooling or
heating of skin (or any other target surface), such thermal
conditioning can be performed either directly to the skin or
indirectly. For example, in conductive arrangements, a cooled or
heated surface of a thermoelectric device or other thermal
conditioning device can be placed either in direct contact (e.g.,
partially or fully) with the subject's skin or in very close
proximity to it (e.g., without the use of any intermediate layers,
membranes or other devices or components). Similarly, for devices
and systems that utilize convective cooling or heating, cooled or
heated air or other fluid can be delivered directly to the
skin.
[0045] In some embodiments, however, one or more thermoelectric
devices and/or other thermal conditioning devices are positioned
along an intermediate layer or device. For example, a thermal
conditioning device can be positioned along an exterior surface of
a glove, sleeve, brace, adhesive strip or layer, article of
clothing (e.g., shirt, pants, shorts, helmet, hat, etc.). In other
configurations, one or more thermal conditioning devices are
embedded within an intermediate layer and one or more other
exterior layers, as desired or required.
[0046] In embodiments that incorporate one or more intermediate
layers, such intermediate layers can comprise one or more
materials, such as, for example, natural and/or synthetic fabric,
neoprene or other rubber-based materials, other thermoplastics
and/or the like. In some embodiments, intermediate layers are
sized, shaped and/or otherwise configured to facilitate heat
transfer between the thermal conditioning device(s) and the
subject's skin (or other target surface). For example, the one or
more intermediate layers can comprise a structure and/or thickness
that generally promote the transfer of heat thereacross (e.g.,
either toward or away from the thermal conditioning device).
[0047] One embodiment of a thermal conditioning system 2 for
selectively cooling or heating the skin and/or other portions of a
subject S is schematically illustrated in FIG. 1. In the depicted
embodiment, the skin surface being treated (e.g., cooled) is
located along a limb (e.g., arm, leg, etc.) of the subject S, which
in the illustrated embodiment is illustrated as a cylinder for
convenience. However, the thermal conditioning system or components
thereof can be used to cool and/or heat any other portion of the
subject's skin or anatomy.
[0048] With continued reference to FIG. 1, a plurality of the
thermal conditioning assemblies 10 can be strategically positioned
along the skin of the subject. In the depicted embodiment, a total
of nine assemblies 10 have been positioned along various portions
of the subject's limb in order to cool adjacent portions of the
subject skin. However, in other embodiments, fewer (e.g., 1, 2, 3,
4, 5, 6, 7, 8) or more (e.g., 10, 11, 12, 13, 14, 15, more than 15,
etc.) assemblies 10 can be used, as desired or required for a
particular application, protocol or use. For example, the exact
number of thermal conditioning assemblies that are required or
desired can depend on one or more factors, such as, for example,
the size of the individual assemblies, the cooling or heating
capacity of the assemblies, the size, type and other details of the
subject's target skin or other anatomical location, the amount of
cooling or heating that is required and/or the like.
[0049] In the embodiment illustrated in FIG. 1, the assemblies 10
are located in an aligned or substantially aligned orientation
along a longitudinal axis of the subject's limb. As shown, the
assemblies 10 are located along three distinct rows, with each row
having a total of three assemblies 10. In other embodiments, the
orientation, quantity, type, spacing, the inclusion of additional
components or features (e.g., sensors, intermediate layers, etc.)
and/or other details related to the thermal assemblies 10 of a skin
conditioning system 2 can be different than illustrated in FIG. 1
and/or otherwise disclosed herein. For example, to further clarify
the point that great variations in design can exist between various
embodiments, in some configurations, a skin conditioning system can
comprise only a single thermal conditioning assembly. The terms
thermal conditioning assembly, thermal assembly and cooling
assembly are used interchangeably herein.
[0050] As illustrated in FIG. 1, as well as the related views in
FIGS. 2 and 3, a thermal conditioning assembly 10 can comprise a
heat sink 20 (e.g., a plurality of fins or other heat transfer
members) that extend from a base 30. The fins or other heat
transfer members 20 can form a single, unitary structure with the
base 30. Alternatively, the heat sink (e.g., heat transfer members)
20 are separate from the base (and/or each other), as desired or
required. Accordingly, one or more portions of the thermal assembly
10 can be attached (and/or otherwise positioned adjacent) to one
another using one or more connection devices, methods and/or
features, such as, for example, adhesives, mechanical or other
types of fasteners (e.g., screws, rivets, clips, etc.), pressure or
friction fit connections and/or the like. As used herein, the term
"heat sink" should be given its ordinary meaning and may include,
without limitation, one or more fins, pins and/or other heat
transfer members or portions. For example, in some embodiments, the
heat sink 20 includes a base 30. In other embodiments, the heat
sink is separate and distinct from the base (e.g., structurally,
thermally, etc.).
[0051] One or more thermoelectric devices or other thermal
conditioning devices 100 (e.g., other cooling or heating devices,
convective heaters, etc.) can be positioned along, within or near
the heat transfer members 20 and/or the base 30 of the assembly 10.
For example, in the depicted embodiment, one or more thermoelectric
devices 100 are located along the base 30 (e.g., above and/or below
the base) of the thermal assembly 10. Accordingly, in some
embodiments, when activated, the lower surface of the thermal
conditioning device 100 conductively cools (or heats, as desired or
required) by transferring heat away (or to) the skin of the subject
S. In arrangements where the thermal conditioning device 100
comprises a thermoelectric device (or a similar device), a waste
side that is generally opposite of the main side being cooled, will
be heated (or vice versa).
[0052] Thus, in such embodiments, when the thermal conditioning
device 100 is activated and the subject's skin is being selectively
cooled by the thermal conditioning system 2, heat is being produced
along the opposite (e.g., top) side of the conditioning device 100.
Accordingly, the heat exchange members (e.g., fins) 20 of the
assembly 10 can help transfer that waste heat away from the system
2 and the subject S. As shown, the heat exchange members 20 can
include a plurality of spaced apart fins or portions (e.g., plates,
pins, sheets, etc.). In some embodiments, such heat exchange
members 20 comprise one or more high heat transfer materials (e.g.,
copper, aluminum, etc.), a relatively large surface area,
relatively thin profile and/or one or more other features for
promoting more efficient heat transfer between the surrounding
environment (e.g., ambient air) and the heat being produced by the
thermoelectric device or other thermal conditioning device 100. In
some embodiments, in order to further enhance the transfer of waste
heat away from the thermal assembly 10 and the subject's skin, one
or more fluid transfer devices (e.g., blowers, fans, etc.) can be
used to deliver air through and/or near the heat transfer members
20, as desired or required.
[0053] As illustrated in FIGS. 2 and 3, during use, heat H can pass
through the heat transfer members 20 (e.g., fins) and be carried
away from the electrically activated thermal assemblies 10.
Meanwhile, the side of the thermal conditioning device (e.g.,
thermoelectric device) 100 adjacent the subject can conductively
cool the subject's skin. With reference to the embodiment of the
system 2 illustrated in FIGS. 1-3, each thermal conditioning
assembly 10 can include one or more (e.g., 2, 3, 4, 5, 6, 7, 8, 9,
10, more than 10, etc.) thermal conditioning devices 100, as
desired or required. As noted above, the thermal conditioning
device 100 can be located along any location of a thermal assembly,
such as, for example, without limitation, at, along or near the
bottom of the assembly (e.g., along an upper and/or lower surface
of a base 30, at least partially within a base or other portion of
the assembly, etc.), along a side of an assembly (e.g., at or near
one of the fins or other heat transfer members, etc.) and/or at or
near any other location of the assembly. Accordingly, depending on
the exact locations of the thermal conditioning device or devices
100, one or more thermal conditioning devices 100 (e.g.,
thermoelectric devices) of the assembly can be in direct or
substantially direct contact with the subject's skin. Such contact
can be continuous or partial (e.g., intermittent).
[0054] Further, in some embodiments, the system 2 can be used to
transfer heat from or to the subject's skin (e.g., to selectively
cool or heat the subject's skin) without direct contact between the
cooled or heated surface(s) of a thermal conditioning device 100.
For example, the thermoelectric device or other thermal
conditioning device 100 can be a particular distance away from the
adjacent skin surface. In some embodiments, such a clearance
distance can be 1 mm to 20 mm (e.g., 1, 2, 3, 4, 5, 10, 15, 20 mm,
values between the foregoing, etc.). In other embodiments, the
clearance is less than about 1 mm (e.g., 0.01, 0.05, 0.1, 0.2, 0.3,
0.4, 0.5, 0.6, 0.7, 0.9, 0.9 mm, values between the foregoing,
etc.) or more than about 20 mm (e.g., 21, 22, 25, 30, 35, 40, 50,
60 mm, more than 60 mm, values between the foregoing, etc.).
[0055] In some embodiments, as discussed herein, the subject's skin
can be selectively cooled and/or heated using a convective cooling
and/or heating device, either in lieu of or in addition to
conductive heating techniques. For example, in some embodiments,
cooled and/or heated air can be delivered to a targeted skin area
to thermally condition it. Convective thermal conditioning can use
one or more fluid transfer devices (e.g., blowers, fans, etc.),
ducts or other fluid conduits and/or any other component to help
transfer fluids through the necessary fluid path.
[0056] The view of FIG. 3, schematically illustrates a side view of
a plurality of thermal conditioning assemblies 10 aligned in
several rows. As shown, the assemblies 10 can be placed next to
each other, in the longitudinal and/or radial direction, as desired
or required to cool or heat an area of the subject's skin. In
embodiments comprising thermoelectric devices or related technology
to cool the skin, heat H produced along the opposite side of the
thermoelectric device can rise through the heat transfer members 20
and be transferred (e.g., with or without the use of a fan or other
fluid transfer device.
[0057] FIGS. 4 and 5 illustrate different views of one embodiment
of a thermal conditioning assembly 10 for use in skin cooling or
heating systems and applications. As shown, one or more outer
surfaces of the assembly 10 can comprise a thermally insulation
layer, component or material 40. The use of insulation can help
protect a user who comes in contact with the various assemblies
against dangerously hot portions of the heat transfer members 20 or
other portion of the assembly 10. In some embodiments, the thermal
insulation layer or component 40, which can be secured to the
assembly using adhesives, mechanical fasters and/or the like, is
positioned along the sides of the assembly (e.g., adjacent the heat
transfer members 20), along the top of the heat transfer members
and/or along any other surface of the assembly 10.
[0058] In other embodiments, as schematically illustrated in FIG.
6, the plurality of thermal conditioning assemblies 10 can be
arranged so the heat transfer members 20 of longitudinally
assemblies 10 align with one another. This is different than the
alignment of longitudinally adjacent members 10 of the embodiment
illustrated in FIGS. 1-3. The specific arrangement of heat transfer
members can be selected to create a desired orientation of heat
transfer members (e.g., in relation to one another and/or to the
subject).
[0059] As illustrated in FIG. 7, in some embodiments, the heat
transfer members 20' of a thermal conditioning assembly comprise a
plurality of pins that extend from a base 30'. As with any other
assembly embodiments disclosed herein, the pins, fins and/or other
heat transfer members 20, 20' can form a unitary structure with the
base 30, 30'. Alternatively, however the heat transfer members 20,
20' can be separate from the base 30, 30'. In such arrangements,
the heat transfer members 20, 20' can be attached to the base 30,
30' using one or more connection devices, features or methods
(e.g., welds, adhesives, screws, rivet, other fasteners, press fit
or friction fit connections, etc.). The pins 20' can comprise a
generally cylindrical shape (e.g., as illustrated in FIG. 7).
Alternatively, however, the pins can comprise any other
cross-sectional shape (e.g., square, rectangular, triangular, oval,
irregular, etc.). Further, the overall shape, spacing, quantity,
orientation and/or other details regarding the fins 20, pins 20'
and/or other heat transfer members can be different than
illustrated herein, as desired or required. As with other
embodiments disclosed herein, one or more thermoelectric devices
and/or other thermal conditioning devices (not shown) can be
positioned on, within and/or near the base 30' so that, when
activated, the thermal conditioning assembly 10' can selectively
cool (or heat) a subject skin or other target anatomical
location.
[0060] FIG. 8a illustrates one embodiment of a thermal conditioning
assembly 10 configured for direct placement along a portion of a
subject's skin. As shown, the assembly 10 comprises one or more
heat transfer members 20 (e.g., fins, pins, etc.) that extend from
a base 30. One or more thermoelectric devices and/or other thermal
conditioning devices 100 can be positioned along (e.g., top,
bottom, etc.), within, adjacent or near the base (and/or any other
portion of the assembly 10). When activated, the thermal
conditioning device 100 can selectively cool or heat the adjacent
skin surface. For example, during a cooling procedure using the
assembly, a thermoelectric device 100 can be placed on or near the
target skin surface of the subject. Thus, the thermal conditioning
device 100 can contact (e.g., partially or completely) or not
contact the subject (e.g., the subject's skin).
[0061] According to some embodiments, as illustrated in FIG. 8b,
the assembly 10 can comprises one or more spacers 120 that are
configured to contact the subject's skin during use of the cooling
system. In the illustrated embodiments, the spacers 120 are secured
to the bottom of the base 30 of the assembly 10. However, in other
embodiments, the spacers can be secured to the thermal conditioning
device 100 and/or any other portion of the assembly or cooling
system, either in lieu of or in addition to the base 30, as desired
or required. The spacers 120 can include posts or other protruding
members having generally smooth bottom surfaces that engage the
subject's skin. In some embodiments, the spacers 120 can include a
long continuous lip and/or other generally continuous members that
extend along a longer portion (e.g., partially or completely) of
the assembly 10. In some embodiments, the spacers 120 comprise one
or more rollers and/or other low friction devices or components to
assist in moving or repositioning the assembly along the subject's
skin. As shown, the spacers 120 can help maintain a particular
clearance 124 between the subject's skin (or other surface being
thermally conditioned) and the thermal conditioning device 100. For
example, as noted above, in some embodiments, the clearance 124 is
1 mm to 20 mm (e.g., 1, 2, 3, 4, 5, 10, 15, 20 mm, values between
the foregoing, etc.). In other embodiments, the clearance is less
than about 1 mm (e.g., 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6,
0.7, 0.9, 0.9 mm, values between the foregoing, etc.) or more than
about 20 mm (e.g., 21, 22, 25, 30, 35, 40, 50, 60 mm, more than 60
mm, values between the foregoing, etc.).
[0062] With any of the embodiments disclosed herein, the various
cooling or other conditioning system can include one or more
sensors. For example, as illustrated in FIG. 8a, a thermocouple or
other temperature sensor 200 can be positioned adjacent the
thermoelectric device 100 of the thermal conditioning assembly 10
and/or the subject's skin. Such sensors can help ensure that the
level of cooling (and/or heating, if heating of the subject is
desired) is maintained within particular limits. This can help
prevent or reduce the likelihood of potentially harmful and/or
otherwise damaging temperature extremes during use of the system.
Such sensors 200 can be positioned along one or more thermal
conditioning assemblies 10 and/or any other component, device
and/or portion of the cooling system. Sensors can include
temperature sensors, humidity sensors, condensation sensors and/or
any other type of sensor, as desired or required.
[0063] For any of the skin conditioning systems disclosed herein,
one or more intermediate layers or components can be positioned
adjacent the thermal conditioning assemblies 10 and/or other
components of a system. For example, as illustrated in FIG. 8c, one
or more intermediate layers I, such as, for example, at least a
portion of a glove, sleeve, brace, adhesive strip or layer, article
of clothing (e.g., shirt, pants, shorts, helmet, hat, etc.) can be
positioned between a thermal conditioning device 100 (or, e.g., a
thermal conditioning assembly 10 to which the device 100 is
secured) and the subject's skin being thermally conditioned. Such
intermediate layers or components I can help prevent direct contact
between the subject's skin and the various assemblies and device of
a cooling system. In some embodiments, intermediate layers or
components can be reusable (e.g., via sterilization, other
cleaning, etc.) or disposable (e.g., replaceable with a new layer
I), as desired or required.
[0064] One embodiment of a skin conditioning system 2 in the shape
of a glove is illustrated in FIG. 9. As shown, the system can
include one or more intermediate layers or components I that are
shaped, sized and otherwise configured to be worn (e.g., like a
glove). Alternatively, the system 2 can include a glove-shaped
intermediate layer I that is configured to simply be placed over a
subject's hand. The system 2 can include any other shape to match
the corresponding portion of the subject's anatomy being cooled or
otherwise thermally conditioned. For example, a system 2 can
include one or more intermediate layers I (e.g., positioned between
one or more thermal conditioning assemblies 10 and the subject)
that are in the shape of (or configured to be worn on), at least in
part, a foot, a leg, an arm, a hand, a torso, a neck, a head,
etc.). As shown in FIG. 9, the system 2 can include one or more
(e.g., 2, 3, 4, 5, more than 5, etc.) thermal conditioning
assemblies 10 placed along at least a portion of the intermediate
layer I.
[0065] As discussed herein, a thermal conditioning assembly 10 can
be positioned directly on the subject's skin S. For example, in the
embodiment illustrated in FIG. 10, two separate assemblies 10 have
been positioned along a subject's arm A. In other arrangements, the
quantity, spacing, size and/or other details the thermal
conditioning assemblies 10 included in a particular system 2 can
vary, as desired or required. In any of the embodiments disclosed
herein, the various assemblies 10 and/or other electrical
components of a system can comprise one or more of the following: a
power supply (e.g., battery, connections to a central or main power
source, a controller, a sensor and/or the like). Where a
temperature sensor is included in a particular system, such a
sensor can be configured to automatically disable a thermal
conditioning device 100 (e.g., a thermoelectric device) when the
sensor reaches a particular temperature. Such sensors can be
incorporated into any of the embodiments disclosed herein.
[0066] FIG. 11 illustrates one embodiment of a cooling or other
thermal conditioning system 2 comprising a plurality of zones
Z.sub.1, Z.sub.2, Z.sub.3, Z.sub.4. In the illustrated embodiment,
the system 2 comprises a total of four zones. However, in other
arrangements, more or fewer zones can be included, as desired or
required. For example, each zone can be associated with particular
sub-portions of the subject's anatomical region being cooled (e.g.,
if the system is used for cooling the subject's arm, the various
zones can be aligned with, e.g., the upper arm or shoulder, elbow,
forearm, hand, etc.). In addition, each zone Z.sub.1, Z.sub.2,
Z.sub.3, Z.sub.4 can include one or more thermal conditioning
assemblies 10, in accordance with the various embodiments disclosed
herein. Regardless of the exact layout and configuration of the
zones, and the various assemblies and/or other components 10
included therein, the use of separate zones can enable for
customized cooling (or other thermal conditioning, e.g., heating)
along the portion of the subject's body along which the system 2 is
placed.
[0067] In some embodiments, due to the non-linear (e.g., curved,
convex, irregular, etc.) shape of various regions of the anatomy of
a subject, systems can be customized to a particular shape. For
example, as illustrated in FIG. 12, heat sinks of adjacent
assemblies 10 can be angled along theirs ends E to accommodate the
curvature of the body portion being cooled (e.g., arm, leg, other
limb, etc.). Likewise, as shown in FIG. 13, one or more assemblies
10 (e.g., heat sinks) and/or other portions of the conditioning
system can include a curvature to accommodate the shape of the
subject's skin being cooled or heated.
[0068] In some embodiments, one or more membranes, layers and/or
other devices are placed over and/or around the targeted skin
portion of a subject before commencing a cooling or heating
procedure, either in addition to or in lieu of including an
intermediate layer or other layer in the thermal conditioning
system itself. For example, in some arrangements, one or more thin
layers of plastic (e.g., vinylidene chloride or saran wrap,
polyethylene, other polymeric materials, etc.), can be positioned
along or around an arm, leg, foot, neck and/or any other anatomical
portion before applying the thermal conditioning system to the
subject's skin.
[0069] In any of the embodiments disclosed herein, the various heat
transfer assemblies 10 (e.g., heat sinks and thermal conditioning
devices) of a system 2 can be arranged in a hexagonal arrangement,
as illustrated schematically in FIG. 14. Such an arrangement can
provide more uniform thermal coverage. However, in other
embodiments, a different layout or arrangement can be used, such
as, for example, rectangular (e.g., grid), circular or oval (e.g.,
plurality of concentric circles or ovals), etc., as desired or
required.
[0070] As noted herein, the system can also be configured to at
least partially flex or bend to generally conform to the subject's
anatomy. Thus, a hexagonal arrangement, defining
triangularly-shaped panels T (FIG. 14) between adjacent assemblies
10, can provide for a more enhanced flexibility of the system 2. As
illustrated in FIG. 15, in any of the embodiments disclosed herein,
adjacent assemblies 10 of a system 2 can include one or more
interconnecting members 300 that connect two or more of the
assemblies 10 to each other. Such interconnecting members 300 can
mechanically and/or electrically couple adjacent assemblies 10 to
each other, and may include, without limitation, one or more rigid,
semi-rigid and/or flexible materials or components (e.g., metals,
alloys, plastic, etc.). In some embodiments, for example, the
interconnecting members comprise tubes (e.g., solid or hollow) that
include a circular, oval, rectangular, triangular, other polygonal
and/or any other cross sectional shape. One or more wires or other
electrical conductors can be routed through hollow embodiments of
interconnecting members 300. This can provide a convenient manner
in which to electrically couple the various assemblies 10 to each
other and/or to a power supply or control module. With continued
reference to FIG. 15, the ends 320 of the interconnecting members
300 can comprise rigid or movable connections to the corresponding
assemblies 10. For example, as illustrated in FIG. 16, in some
embodiments, the end 320 can include a flexible joint or other
rotatable feature J to improve the overall flexibility of the
system 2.
[0071] In any of the embodiments disclosed herein, the thermal
conditioning system 2 can include assemblies that only comprise a
thermal conditioning device 100 (e.g., thermoelectric device, other
cooling or heating element, etc.) without the need for additional
portions or features (e.g., heat sink).
[0072] As discussed herein, the system can include one or more
intermediate or other base layers onto which the various thermal
conditioning devices 100 or assemblies 10 are positioned. Such a
layer can comprise a flexible structure or features so that the
system can generally conform to the subject's anatomy. For example,
in some arrangements, the thermal conditioning components (e.g.,
devices, assemblies, etc.) are secured to a vinyl sheet or other
fabric or layer.
[0073] As illustrated in FIG. 17, a cooling or other thermal
conditioning system 2 configured for placement around a subject's
limb S, can include a plurality of heat transfer assemblies 10
(e.g., thermoelectric devices or other thermal conditioning
devices, heat sinks and/or the like). As shown, adjacent assemblies
10 can be mechanically and/or electrically coupled to each other
using one or more interconnecting members 300. In addition, a
securement device 400 can be used to hold the system 2 in place
during use. For example, the securement device or feature 400 can
comprise a strap having a latch or other fastener 420 (e.g.,
Velcro, tab, other mechanical coupling, etc.). In some embodiments,
the securement device or feature is at least partially flexible or
extendable to facilitate securement of the system 2 to the subject
S.
[0074] In any of the embodiments disclosed herein, the heat sink
(e.g., fins, pins, other heat transfer members, base, etc.) can be
extruded as one, two or more portions. In heat sink arrangements
having two or more portions, such separate portions (e.g., fins,
pins, base, etc.) can be attached to each other using welds,
adhesives, other bonding agents, mechanical connections or
fasteners, etc. In some embodiments, for example, the heat sinks
comprise an extruded aluminum shape.
[0075] In any of the embodiments disclosed herein, the spacing of
the thermal assemblies 10 (e.g., thermoelectric devices) can be
reduced by taking advantage of the body's thermo-regulatory
response (e.g., as the body can naturally spread the effect of
cooling or heating to an area larger that the physical footprint of
the individual assemblies).
[0076] In any of the embodiments disclosed herein, the various
assemblies 10 (e.g., thermoelectric devices) of a system can be
arranged on a pad or other base member, with spacing of the
assemblies 10 controlled, at least in part, by the structure of the
pad or other base member. The spacing of the assemblies can be
maintained as a result of the stiffness of the pad structure.
[0077] For any of the embodiments disclosed herein, the various
thermoelectric devices and/or other thermal conditioning devices
100 of the system 2 can be configured in a series and/or parallel
arrangement, as desired or required. Accordingly, the cooling
system 2 can be configured to continue to function even if one or
more individual thermoelectric devices or other thermal
conditioning devices 100 were to fail. In some embodiments, a
series and/or parallel arrangement of thermoelectric devices and/or
other thermal conditioning devices 100 can be configured so that
power is relatively uniform to the thermoelectric devices 100 that
are in use.
[0078] In some embodiments, a system can be configured to enable a
user to select which (and/or to what extent) the various thermal
transfer assemblies (e.g., thermoelectric devices or other thermal
conditioning devices) are activated at any particular time. For
example, in some embodiments, the specific thermoelectric devices
can be selected using a control module and/or locally at each
device (e.g., via a switch or other controller).
[0079] For embodiments where temperature regulation or monitoring
is desired (e.g., to prevent low or high operating or treatment
temperatures), one or more thermal fuses can be incorporated into
the system, either in addition to or in lieu of other temperature
detection and/or control devices (e.g., thermistors, temperature
sensors, etc.). Accordingly, each thermoelectric device and/or
other thermal conditioning device 100 can have its power
automatically (e.g., fully or partially), based on, for example, a
skin temperate, a temperature of the thermal conditioning device or
assembly, a temperature of the base layer of the system and/or the
like.
[0080] In any of the embodiments disclosed herein, a skin
conditioning system can be configured for alternating heating and
cooling of the adjacent skin of a subject. Such alternating heating
and cooling of the subject's skin can offer one or more therapeutic
or other benefits or advantages (e.g., promoting a desired
therapeutic response, maintaining the body temperature within a
particular range, etc.). In some embodiments, a heat sink (e.g.,
fins, pins, etc.) in thermal communication with a thermoelectric
device or other thermal conditioning device 100 can be sized,
shaped and/or otherwise configured to take advantage of the thermal
mass of the heat sink and the transient condition of operation. For
example, when the thermoelectric device is being operated in
cooling mode, the heat sink temperature can increase with time.
When, however, the thermoelectric device is switched to heating
mode, the thermoelectric device can cool the heat sink.
Accordingly, the temperature of the thermoelectric device can swing
p and down when the device is switched between heating and cooling
modes. Thus, in some embodiments, the size, thermal mass and/or
other features of the heat sink can be advantageously selected
based on the expected switching between heating and cooling mode of
the system.
[0081] The features and attributes of the specific embodiments
disclosed herein may be combined in different ways to form
additional embodiments, all of which fall within the scope of the
present disclosure. Although the concepts presented herein have
been disclosed in the context of certain embodiments and examples,
the present application extends beyond the specifically disclosed
embodiments to other alternative embodiments and/or uses of the
concepts disclosed herein and obvious modifications and equivalents
thereof. The disclosure herein of any particular feature, aspect,
method, property, characteristic, quality, attribute, element, or
the like in connection with an embodiment can be used in all other
embodiments set forth herein. The ranges disclosed herein also
encompass any and all overlap, sub-ranges, and combinations
thereof. Language such as "up to," "at least," "greater than,"
"less than," "between," and the like includes the number recited.
Numbers preceded by a term such as "about" or "approximately"
include the recited numbers. For example, "about 10 mm" includes
"10 mm." For all of the embodiments described herein the steps of
the methods need not be performed sequentially. Thus, it is
intended that the scope of the concepts disclosed herein should not
be limited by the particular disclosed embodiments described
above.
* * * * *