U.S. patent application number 14/343923 was filed with the patent office on 2014-08-14 for polymer and composition including same, and adhesive composition.
This patent application is currently assigned to NISSAN CHEMICAL INDUSTRIES, LTD.. The applicant listed for this patent is Tomoyuki Enomoto, Takahiro Kishioka, Takuya Ohashi, Mamoru Tamura. Invention is credited to Tomoyuki Enomoto, Takahiro Kishioka, Takuya Ohashi, Mamoru Tamura.
Application Number | 20140228488 14/343923 |
Document ID | / |
Family ID | 47832227 |
Filed Date | 2014-08-14 |
United States Patent
Application |
20140228488 |
Kind Code |
A1 |
Tamura; Mamoru ; et
al. |
August 14, 2014 |
POLYMER AND COMPOSITION INCLUDING SAME, AND ADHESIVE
COMPOSITION
Abstract
There is provided a novel polymer, a composition containing the
polymer, and a novel adhesive composition containing the polymer
from which a cured film having desired properties is obtained. A
polymer comprising a structural unit of Formula (1): ##STR00001##
wherein Q is a bivalent group, R.sub.1 is a C.sub.1-10 alkylene
group, a C.sub.2-10 alkenylene group or C.sub.2-10 alkynylene
group, a C.sub.6-14 arylene group, a C.sub.4-10 cyclic alkylene
group, etc., or a polymer comprising a structural unit of Formula
(6): ##STR00002## wherein Q.sub.4 is an allyl group, a vinyl group,
an epoxy group, or a glycidyl group, and R.sub.5 is a bivalent
organic group having a main chain containing only carbon atom or at
least one of oxygen atom, nitrogen atom and sulfur atom in addition
to carbon atom, a composition comprising the polymer, and an
adhesive composition comprising the polymer and a solvent.
Inventors: |
Tamura; Mamoru; (Toyama-shi,
JP) ; Ohashi; Takuya; (Toyama-shi, JP) ;
Kishioka; Takahiro; (Toyama-shi, JP) ; Enomoto;
Tomoyuki; (Toyama-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Tamura; Mamoru
Ohashi; Takuya
Kishioka; Takahiro
Enomoto; Tomoyuki |
Toyama-shi
Toyama-shi
Toyama-shi
Toyama-shi |
|
JP
JP
JP
JP |
|
|
Assignee: |
NISSAN CHEMICAL INDUSTRIES,
LTD.
Tokyo
JP
|
Family ID: |
47832227 |
Appl. No.: |
14/343923 |
Filed: |
September 6, 2012 |
PCT Filed: |
September 6, 2012 |
PCT NO: |
PCT/JP2012/072747 |
371 Date: |
March 10, 2014 |
Current U.S.
Class: |
524/111 ;
524/361; 524/606; 525/540; 526/263; 528/228; 528/363; 528/423 |
Current CPC
Class: |
C09J 179/04 20130101;
C08G 59/26 20130101; H01L 2924/0002 20130101; C09D 11/102 20130101;
C09J 163/00 20130101; H01L 21/02282 20130101; C08K 5/07 20130101;
G03F 7/094 20130101; H01L 2924/0002 20130101; G03F 7/09 20130101;
C08G 73/06 20130101; H01L 23/293 20130101; C08G 73/0638 20130101;
G03F 7/11 20130101; C08G 59/3236 20130101; H01L 2924/00 20130101;
C08G 73/0677 20130101; C09D 11/10 20130101; C08G 73/0633 20130101;
C09J 11/06 20130101; H01L 21/02118 20130101; C08K 5/04
20130101 |
Class at
Publication: |
524/111 ;
528/423; 525/540; 526/263; 528/228; 524/361; 528/363; 524/606 |
International
Class: |
C08G 73/06 20060101
C08G073/06; C08K 5/07 20060101 C08K005/07; C09J 11/06 20060101
C09J011/06; C08K 5/04 20060101 C08K005/04 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 8, 2011 |
JP |
2011-196318 |
Sep 8, 2011 |
JP |
2011-196319 |
Claims
1. A polymer having a weight-average molecular weight of 1,000 to
100,000, comprising a structural unit of Formula (1): ##STR00030##
{where Q is a bivalent group of Formula (2) or Formula (3):
##STR00031## (where Q.sub.1 is a C.sub.1-6 alkyl group, an allyl
group, a vinyl group, an epoxy group, or a glycidyl group, each of
Q.sub.2 and Q.sub.3 is independently a hydrogen atom, a C.sub.1-6
alkyl group, an allyl group, a vinyl group, an epoxy group, or a
glycidyl group, and n is 0 or 1); when Q is a bivalent group of
Formula (2) or Formula (3), and n is 1, a carbonyl group composing
a portion of each of Formula (2) and Formula (3) is bonded to a
nitrogen atom of Formula (1); R.sub.1 is a C.sub.4-8 alkylene
group, or a group of Formula (4) or Formula (5):
-A.sub.1-R.sub.2-A.sub.2- (4) --R.sub.3-A.sub.3-R.sub.4-- (5)
(where each of A.sub.1, A.sub.2, and A.sub.3 is independently a
C.sub.6-14 arylene group or a C.sub.4-10 cyclic alkylene group,
R.sub.2 is a sulfonyl group, a carbonyl group, or a C.sub.1-5
alkylene group, at least one hydrogen atom of the alkylene group is
optionally substituted with a halogen atom, and each of R.sub.3 and
R.sub.4 is independently a C.sub.1-5 alkylene group)}.
2. A polymer having a weight-average molecular weight of 1,000 to
100,000, comprising a structural unit of Formula (6): ##STR00032##
where Q.sub.4 is an allyl group, a vinyl group, an epoxy group, or
a glycidyl group, and R.sub.5 is a C.sub.4-8 bivalent hydrocarbon
group or a group of Formula (7): ##STR00033## (where each of two m
is independently 0 or 1, and Q.sub.5 is a bivalent organic
group)}.
3. (canceled)
4. The polymer according to claim 2, wherein Q.sub.5 in Formula (7)
is a C.sub.6-14 arylene group, a C.sub.4-10 alicyclic hydrocarbon
group, a C.sub.2-6 alkenylene group or a C.sub.2-6 alkynylene
group, or a group of Formula (8): -A.sub.4-Q.sub.6-A.sub.5- (8)
{where each of A.sub.4 and A.sub.5 is independently a C.sub.6-14
arylene group or a C.sub.4-10 alicyclic hydrocarbon group, and
Q.sub.6 is a sulfonyl group, a carbonyl group, or an alkylene group
of Formula (9): ##STR00034## (where each of R.sub.6 and R.sub.7 is
independently a C.sub.1 or C.sub.2 alkyl group, and at least one
hydrogen atom of the alkyl group is optionally substituted with a
halogen atom)}.
5. The polymer according to claim 4, wherein the arylene group is a
phenylene group, and the alicyclic hydrocarbon group is a
cyclohexylene group.
6. The polymer according to claim 4, wherein the alkyl group is a
methyl group in which at least one hydrogen atom is optionally
substituted with a fluorine atom.
7. A composition comprising the polymer according to claim 1.
8. The composition according to claim 7, further comprising a
surfactant.
9. The composition according to claim 7, further comprising a
thermal acid generator.
10. The composition according to claim 7, further comprising a
solvent.
11. The composition according to claim 7, wherein the composition
is used for an adhesive, formation of an insulating film, or
formation of a resist underlayer film.
12. The composition according to claim 10, wherein the composition
is an insulating ink.
13. An adhesive composition comprising: a polymer having a
structural unit of Formula (6): ##STR00035## {where Q.sub.4 is an
allyl group, a vinyl group, an epoxy group, or a glycidyl group,
and R.sub.5 is a C.sub.4-8 bivalent hydrocarbon group or a group of
Formula (7): ##STR00036## (where each of two m is independently 0
or 1, and Q.sub.5 is a bivalent organic group)}; and an organic
solvent.
14. (canceled)
15. The adhesive composition according to claim 13, wherein Q.sub.5
in Formula (7) is a C.sub.6-14 arylene group, a C.sub.4-10
alicyclic hydrocarbon group, a C.sub.2-6 alkenylene group or a
C.sub.2-6 alkynylene group, or a group of Formula (8):
-A.sub.4-Q.sub.6-A.sub.5- (8) {where each of A.sub.4 and A.sub.5 is
independently a C.sub.6-14 arylene group or a C.sub.4-10 alicyclic
hydrocarbon group, and Q.sub.6 is a sulfonyl group, a carbonyl
group, or an alkylene group of Formula (9): ##STR00037## (where
each of R.sub.6 and R.sub.7 is independently a C.sub.1 or C.sub.2
alkyl group, and at least one hydrogen atom of the alkyl group is
optionally substituted with a halogen atom)}.
16. The adhesive composition according to claim 15, wherein the
arylene group is a phenylene group, and the alicyclic hydrocarbon
group is a cyclohexylene group.
17. The adhesive composition according to claim 15, wherein the
alkyl group is a methyl group in which at least one hydrogen atom
is optionally substituted with a fluorine atom.
18. A composition comprising the polymer according to claim 2.
Description
TECHNICAL FIELD
[0001] The present invention relates to a novel polymer. The
present invention also relates to a composition containing the
polymer used for adhesives, formation of insulating films,
formation of resist underlayer films, and other applications.
[0002] The present invention further relates to an adhesive
composition bonding between stacked materials in the step for
manufacturing optical devices such as LEDs and CMOS image sensors,
and semiconductor devices such as IC chips.
BACKGROUND ART
[0003] In recent years, highly integrated semiconductor devices
have been sought after for use in high-performance and compact
electron equipment such as cell-phones and IC cards. To obtain
highly integrated semiconductor devices, fine semiconductor
elements, and stack structures in which semiconductor elements are
vertically stacked have been developed. For making such stack
structures, adhesives are used for bonding between semiconductor
elements. However, well-known adhesives such as an acrylic resin,
epoxy resin, and silicone resin cannot be applied in the step for
electrode assembly of metal bumps, an ion diffusion step, or other
steps that require a high temperature of 250.degree. C. or above
because those adhesives are heat-resistant at temperatures only
around 250.degree. C.
[0004] Patent Document 1 discloses an isocyanurate ring-containing
polymer that is used in an adhesive for optical semiconductors, and
a composition containing the isocyanurate ring-containing polymer.
This document discloses that the isocyanurate ring-containing
polymer can be obtained by allowing an N-monosubstituted
isocyanuric acid to react with a dihalogenated compound under the
presence of an alkali metal compound, or by subjecting an
N,N',N''-trisubstituted isocyanuric acid and a silane compound to a
hydrosilylation reaction. This document also discloses that the
composition can be used as an adhesive for optical semiconductors,
and can be heated in an oven at 50.degree. C. to 250.degree. C. for
30 minutes to 4 hours for bonding.
[0005] The market of flat panel displays (FPDs) such as liquid
crystal displays (LCDs) and organic EL (OLED) displays are rapidly
expanding. Although glass substrates are used as base materials of
display panels in liquid crystal displays, flexible displays in
which plastic substrates are used have been developed for obtaining
thinner, light weight, and flexible displays, and reducing
processing costs by employing Roll-to-Roll processes. However, PET
resins, PEN resins, and PC resins known as resin materials used in
well-known plastic substrates are heat-resistant at only around
250.degree. C. The resin materials cannot be thus used in a process
requiring a high temperature of 250.degree. C. or above that is
conventionally required in the step for forming thin film
transistors (TFTs).
[0006] The process for forming thin film transistors includes a
step for forming insulating films such as gate insulating films.
Patent Document 2 discloses a gate insulating film forming agent
for thin film transistors, with which gate insulating films can be
formed at a temperature of 180.degree. C. or below.
PRIOR ART DOCUMENTS
Patent Documents
[0007] Patent Document 1: Japanese Patent Application Publication
No. 2008-143954
[0008] Patent Document 2: WO2008/146847
SUMMARY OF THE INVENTION
Problem to be Solved by the Invention
[0009] The light transmittance of a cured material produced from
the composition disclosed in Patent Document 1 was measured at 470
nm, and was evaluated as 90% or greater. The heat resistance of the
cured material was also evaluated. Although this document discloses
that the transmittance at 470 nm was measured after the cured
material was left in an oven at 150.degree. C. for 120 hour, the
heat resistance at a temperature of 250.degree. C. or above is
unclear.
[0010] Hydroxy groups are not excluded from the isocyanurate
ring-containing polymer of Patent Document 1, and an oligomer
compound or a polymer compound contained in the gate insulating
film forming agent disclosed in Patent Document 2 has a hydroxy
group introduced in a repeating unit of the compound. However, in a
case where the polymer has a hydroxy group, the polymer is
hygroscopic, and in applications in which insulation performance is
essential, desired insulation performance may not be obtained.
Furthermore, the isocyanurate ring-containing polymer of Patent
Document 1 contains silicon, and thus when the polymer is used to
form a film on a substrate such as silicon wafer, a fluorine gas
needs to be mixed into an etching gas in the processing through
reworking and a photolithography process. This may damage the
substrate.
Means for Solving the Problem
[0011] A first aspect of the present invention provides a polymer
having a weight-average molecular weight of 1,000 to 100,000,
comprising a structural unit of Formula (1):
##STR00003##
{where Q is a bivalent group of Formula (2) or Formula (3):
##STR00004##
(where Q.sub.1 is a C.sub.1-6 alkyl group, an allyl group, a vinyl
group, an epoxy group, or a glycidyl group, each of Q.sub.2 and
Q.sub.3 is independently a hydrogen atom, a C.sub.1-6 alkyl group,
an allyl group, a vinyl group, an epoxy group, or a glycidyl group,
and n is 0 or 1); when Q is a bivalent group of Formula (2) or
Formula (3), and n is 1, a carbonyl group composing a portion of
each of Formula (2) and Formula (3) is bonded to a nitrogen atom of
Formula (1); R.sub.1 is a C.sub.1-10 alkylene group, a C.sub.2-10
alkenylene group or C.sub.2-10 alkynylene group, a C.sub.6-14
arylene group, a C.sub.4-10 cyclic alkylene group, or a group of
Formula (4) or Formula (5):
-A.sub.1-R.sub.2-A.sub.2- (4)
--R.sub.3-A.sub.3-R.sub.4-- (5)
(where each of A.sub.1, A.sub.2, and A.sub.3 is independently a
C.sub.6-14 arylene group or a C.sub.4-10 cyclic alkylene group,
R.sub.2 is a sulfonyl group, a carbonyl group, or a C.sub.1-5
alkylene group, at least one hydrogen atom of the alkylene group is
optionally substituted with a halogen atom, and each of R.sub.3 and
R.sub.4 is independently a C.sub.1-5 alkylene group)}.
[0012] A second aspect of the present invention provides a polymer
having a weight-average molecular weight of 1,000 to 100,000,
comprising a structural unit of Formula (6):
##STR00005##
(where Q.sub.4 is an allyl group, a vinyl group, an epoxy group, or
a glycidyl group, and R.sub.5 is a bivalent organic group having a
main chain consisting of a carbon atom or a main chain having a
carbon atom and at least one of an oxygen atom, a nitrogen atom,
and a sulfur atom).
[0013] A third aspect of the present invention provides a
composition comprising the polymer according to the present
invention.
[0014] A fourth aspect of the present invention provides an
adhesive composition comprising: a polymer having a structural unit
of Formula (6) according to the present invention; and an organic
solvent.
Effects of the Invention
[0015] It is possible to obtain a cured film that has high heat
resistance, high transmittance to visible light, good
reworkability, adhesiveness, and desired insulation performance, by
e use of a composition comprising a polymer having a structural
unit of Formula (1) according to the present invention.
[0016] A cured film formed from an adhesive composition of the
present invention has a transmittance of 95% or above (at a
wavelength of 500 nm), heat resistance at a temperature of
250.degree. C. or above, adhesiveness, and solvent resistance.
MODES FOR CARRYING OUT THE INVENTION
[0017] [Polymer]
[0018] A weight-average molecular weight of the polymer having a
structural unit of Formula (1) according to the present invention
determined by a gel permeation chromatography (hereinafter,
abbreviated as GPC) analysis which will be described later is 1,000
to 100,000, and preferably 1,000 to 50,000 in terms of standard
polystyrene. The polymer whose weight-average molecular weight is
greater than 100,000 may be less soluble to a solvent. In contrast,
with the polymer whose weight-average molecular weight is smaller
than 1,000, obtained films may be cracked, and the composition may
have poor coating properties. When monomers as raw materials of the
polymer are, for example, a monosubstituted isocyanuric acid and a
dihalogenated compound, ends of the polymer are a hydrogen atom and
a halogen atom.
[0019] In the structural unit of Formula (1), each of an alkyl
group and an alkylene group may be a straight chain or a branched
chain. Example of the alkenylene group and the alkynylene group
include an ethen-1,2-diyl group (a --CH.dbd.CH-- group), a
2-butene-1,4-diyl group (--CH.sub.2--CH.dbd.CH--CH.sub.2-- group),
and an ethyne-1,2-diyl group (a --C.ident.C-- group); examples of
the arylene group include a phenylene group, a naphthylene group,
and an anthrylene group; and examples of the cyclic alkylene group
include a cyclohexylene group. Examples of the halogen atom with
which at least one hydrogen atom of the alkylene group is
substituted include a fluorine atom, a chlorine atom, and a bromine
atom.
[0020] The polymer according to the present invention may be
composed of only one type of a structural unit of Formula (1), or
may be composed of two or more types of structural units of Formula
(1) (copolymer).
[0021] The following shows examples of groups of R.sub.1 in Formula
(1). In each of the formulae below, the formula in the parentheses
corresponds to R.sub.1.
##STR00006##
[0022] The polymer having a structural unit of Formula (6)
according to the present invention may be composed of only one type
of a structural unit of Formula (6), or may be composed of two or
more types of structural units of Formula (6) (copolymer). The
weight-average molecular weight of the polymer determined by GPC
analysis is, for example, 1,000 to 100,000 in terms of standard
polystyrene. In Formula (6), R.sub.5 is a bivalent organic group
having a main chain consisting of a carbon atom or a main chain
having a carbon atom and at least one of an oxygen atom, a nitrogen
atom, and a sulfur atom. In other words, the bivalent organic group
has no silicon atom in its main chain. For example, the group is a
C.sub.1-10 bivalent hydrocarbon group or a group of Formula
(7):
##STR00007##
(where each of two m is independently 0 or 1, and Q.sub.5 is a
bivalent organic group).
[0023] In Formula (6), examples of the bivalent hydrocarbon group
include an alkylene group. The bivalent hydrocarbon group can
include a phenylene group and a carbonyl group within the limits of
the carbon atom number of 1 to 10.
[0024] In Formula (7), Q.sub.5 is, for example, a C.sub.6-14
arylene group, a C.sub.4-10 alicyclic hydrocarbon group, a
C.sub.2-6 alkenylene group or a C.sub.2-6 alkynylene group, or a
group of Formula (8):
-A.sub.4-Q.sub.6-A.sub.5- (8)
{where each of A.sub.4 and A.sub.5 is independently a C.sub.6-14
arylene group or a C.sub.4-10 alicyclic hydrocarbon group, and
Q.sub.6 is a sulfonyl group, a carbonyl group, or an alkylene group
of Formula (9):
##STR00008##
(where each of R.sub.6 and R.sub.7 is independently a C.sub.1 or
C.sub.2 alkyl group, and at least one hydrogen atom of the alkyl
group is optionally substituted with a halogen atom)}.
[0025] In Formulae (7) and (8), an arylene group is, for example, a
phenylene group, and an alicyclic hydrocarbon group is, for
example, a cyclohexylene group, but these groups are not
necessarily limiting examples. The alicyclic hydrocarbon group may
also be, for example, a norbornene-2,3-diyl group or an
adamantan-1,3-diyl group because norbornene and adamantan are also
alicyclic hydrocarbons.
[0026] In Formula (7), examples of the alkenylene group or the
alkynylene group include an ethen-1,2-diyl group (a --CH.dbd.CH--
group), a 2-butene-1,4-diyl group (a
--CH.sub.2--CH.dbd.CH--CH.sub.2-- group), and an ethyne-1,2-diyl
group (a --C.ident.C-- group).
[0027] In Formula (9), the alkyl group is, for example, a methyl
group in which at least one hydrogen atom may be substituted with a
fluorine atom. Examples of the methyl group in which at least one
hydrogen atom is substituted with a fluorine atom include a
--CF.sub.3 group.
[0028] The polymer having a structural unit of Formula (6) has, for
example, a structural unit of any of Formula (6-1) to Formula (6-9)
below, and the polymer having a structural unit of Formula (6) in
which R.sub.5 is Formula (7) is a polymer having a structural unit
of any of Formula (6-2) to Formula (6-8) below.
##STR00009##
[0029] [Composition Including Polymer]
[0030] If desired, a composition including the polymer having a
structural unit of Formula (1) according to the present invention
may contain at least one of a surfactant, a thermal acid generator,
and a solvent in addition to the polymer.
[0031] When the composition of the present invention contains a
surfactant, examples of the surfactant include: nonionic
surfactants including polyoxyethylene alkylethers such as
polyoxyethylene lauryl ether, polyoxyethylene stearyl ether,
polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether,
polyoxyethylene alkylarylethers such as polyoxyethylene octyl
phenol ether and polyoxyethylene nonyl phenol ether,
polyoxyethylene-polyoxypropylene block copolymers, sorbitan fatty
acid esters such as sorbitan monolaurate, sorbitan monopalmitate,
sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, and
sorbitan tristearate, and polyoxyethylene sorbitan fatty acid
esters such as polyoxyethylene sorbitan monolaurate,
polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan
monostearate, polyoxyethylene sorbitan trioleate, and
polyoxyethylene sorbitan tristearate; fluorine surfactants
including Eftop (registered trademark) EF301, Eftop EF303, and
Eftop EF352 (manufactured by Mitsubishi Materials Electronic
Chemicals Co., Ltd. (former JEMCO Co., Ltd.)), MEGAFAC (registered
trademark) F171, MEGAFAC F173, and MEGAFAC R30 (manufactured by DIC
Corporation), Fluorad FC430 and Fluorad FC431 (manufactured by
Sumitomo 3M Limited), and AsahiGuard (registered trademark) AG710,
SURFLON (registered trademark) S-382, SURFLON SC101, SURFLON SC102,
SURFLON SC103, SURFLON SC104, SURFLON SC105, and SURFLON SC106
(manufactured by Asahi Glass Co., Ltd.); and organosiloxane polymer
KP341(manufactured by Shin-Etsu Chemical Co., Ltd.). These
surfactants may be added alone, or two or more of the surfactants
may be added in combination. The mixing amount of the surfactant
is, for example, 0.01% by mass to 10% by mass of a total solid
content excluding a solvent.
[0032] When the composition of the present invention contains a
thermal acid generator, examples of the thermal acid generator to
be mixed include acid compounds such as p-toluenesulfonic acid,
trifluoromethanesulfonic acid, pyridinium-p-toluenesulfonate,
salicylic acid, 5-sulfosalicylic acid, citric acid, benzoic acid,
and hydroxybenzoic acid; and/or 2,4,4,6-tetrabromocyclohexadienone,
benzoin tosylate, and 2-nitrobenzyl tosylate. The mixing amount of
the thermal acid generator is, for example, 0.02% by mass to 10% by
mass, or 0.04% by mass to 5% by mass of a total solid content
excluding a solvent.
[0033] When the composition of the present invention contains a
solvent, the solvent is not particularly limited as long as it is
an organic solvent that can be used in a step for manufacturing
semiconductor devices. Preferable examples of the organic solvent
available include ketones such as cyclohexanone, methyl isoamyl
ketone, 2-butanone, and 2-heptanone; polyhydric alcohols and
derivatives thereof such as ethylene glycol, ethylene glycol
monoacetate, diethylene glycol, diethylene glycol monoacetate,
propylene glycol, propylene glycol monoacetate, dipropylene glycol
or dipropylene glycol monoacetate, and monomethyl ether, monoethyl
ether, monopropyl ether, monobutyl ether, and monophenyl ether;
cyclic ethers such as dioxane; lactones such as y-butyrolactone;
and esters such as methyl lactate, ethyl lactate, methyl acetate,
ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate,
methyl methoxypropionate, and ethyl ethoxypropionate. These may be
used alone, or two or more of them may be used as a mixture. When
the organic solvent is contained, the percentage of a solid content
in the composition of the present invention is, for example, 1% by
mass to 70% by mass, in which the solid content refers to
ingredients of the composition excluding the organic solvent.
[0034] If desired, the composition including a polymer according to
the present invention may further contain additives, such as an
inorganic filler, a silane coupling agent, a rheology modifier, and
a cross-linker, but they are not necessarily contained.
[0035] Examples of the inorganic filler include aluminum nitride,
boron nitride, alumina, and silica.
[0036] Examples of the silane coupling agent include
vinyltrimethoxysilane, vinyltriethoxysilane,
3-methacryloxypropyltrimethoxysilane,
3-methacryloxypropyltriethoxysilane,
3-glycidoxypropyltrimethoxysilane,
3-glycidoxypropyltriethoxysilane, 3-aminopropyltrimethoxysilane,
and 3-aminopropyltriethoxysilane.
[0037] Examples of the rheology modifier include: phthalic acid
derivatives such as dimethyl phthalate, diethyl phthalate,
diisobutyl phthalate, dihexyl phthalate, and butyl isodecyl
phthalate; adipic acid derivatives such as di normal butyl adipate,
diisobutyl adipate, diisooctyl adipate, and octyl decyl adipate;
maleic acid derivatives such as di normal butyl maleate, diethyl
maleate, and dinonyl maleate; oleic acid derivatives such as methyl
oleate, butyl oleate, and tetrahydrofurfuryl oleate; and stearic
acid derivatives such as normal butyl stearate and glyceryl
stearate.
[0038] Examples of the cross-linker include nitrogen-containing
compounds in which nitrogen atoms are substituted with alkoxymethyl
groups such as a methoxymethyl group, an ethoxymethyl group, a
butoxymethyl group, and a hexyloxymethyl group, or with
hydroxymethyl groups. Further examples of the cross-linker
available include epoxy group-containing compounds, epoxy
group-containing polymers, allyl group-containing compounds, allyl
group-containing polymers, isocyanate group-containing compounds,
isocyanate group-containing polymers, and azido group (azi
group)-containing compounds.
[0039] Examples of the nitrogen-containing compounds include
hexamethoxymethyl melamine, tetramethoxymethyl benzoguanamine,
1,3,4,6-tetrakis(butoxymethyl)glycoluril,
1,3,4,6-tetrakis(hydroxymethyl)glycoluril,
1,3-bis(hydroxymethyl)urea, 1,1,3,3-tetrakis(butoxymethyl)urea,
1,1,3,3-tetrakis(methoxymethyl)urea,
1,3-bis(hydroxymethyl)-4,5-dihydroxy-2-imidazolinone, and
1,3-bis(methoxymethyl)-4,5-dimethoxy-2-imidazolinone. Examples of
the azido group (azi group)-containing compounds include
2,6-bis(4-azidobenzylidene)-4-methylcyclohexanone and
2,6-bis(4-azidobenzylidene)cyclohexanone.
[0040] Further examples of the cross-linker include commercially
available compounds such as methoxymethyl-type melamine compounds
(trade name: CYMEL (registered trademark) 300, CYMEL 301, CYMEL
303, and CYMEL 350), butoxymethyl-type melamine compounds (trade
name: MY COAT (registered trademark) 506 and MY COAT 508),
glycoluril compounds (trade name: CYMEL (registered trademark) 1170
and POWDERLINK (registered trademark) 1174), methylated urea resins
(trade name: UFR65), butylated urea resins (trade name: UFR300,
U-VAN10S60, U-VAN10R, and U-VAN11HV), manufactured by Nihon Cytec
Industries Inc.; and urea/formaldehyde resins (highly condensed
type, trade name: BECKAMINE (registered trademark) J-300S,
BECKAMINE P-955, and BECKAMINE N), manufactured by DIC
Corporation.
[0041] A compound having, for example, 1 to 6, or 2 to 4 epoxy
rings can be used as an epoxy group-containing cross-linker.
Examples thereof include 1,4-butanediol diglycidyl ether,
1,2-epoxy-4-(epoxyethyl)cyclohexane, glycerol triglycidyl ether,
diethylene glycol diglycidyl ether, 2,6-diglycidylphenylglycidyl
ether, 1,1,3-tris[p-(2,3-epoxypropoxy)phenyl]propane,
1,2-cyclohexane dicarboxylic acid diglycidyl ester,
4,4'-methylenebis(N,N-diglycidylaniline),
3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate,
trimethylolethane triglycidyl ether, triglycidyl-p-aminophenol,
tetraglycidyl metaxylene diamine, tetraglycidyl
diaminodiphenylmethane, tetraglycidyl-1,3-bisaminomethyl
cyclohexane, bisphenol-A-diglycidyl ether, bisphenol-S-diglycidyl
ether, pentaerythritol tetraglycidyl ether, resorcinol diglycidyl
ether, phthalic acid diglycidyl ester, neopentyl glycol diglycidyl
ether, polypropylene glycol diglycidyl ether,
tetrabromobisphenol-A-diglycidyl ether, bisphenol hexafluoroacetone
diglycidyl ether, pentaerythritol diglycidyl ether,
tris-(2,3-epoxypropyl)isocyanurate, monoallyldiglycidyl
isocyanurate, diglycerol polydiglycidyl ether, pentaerythritol
polyglycidyl ether,
1,4-bis(2,3-epoxypropoxyperfluoroisopropyl)cyclohexane, sorbitol
polyglycidyl ether, trimethylolpropane polyglycidyl ether, resorcin
diglycidyl ether, 1,6-hexanediol diglycidyl ether, polyethylene
glycol diglycidyl ether, phenylglycidyl ether, p-tertiary
butylphenylglycidyl ether, adipic acid diglycidyl ether, o-phthalic
acid diglycidyl ether, dibromophenyl glycidyl ether,
1,2,7,8-diepoxyoctane, 1,6-dimethylol perfluorohexane diglycidyl
ether, 4,4'-bis(2,3-epoxypropoxyperfluoroisopropyl)diphenyl ether,
2,2-bis(4-glycidyloxyphenyl)propane,
3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexane carboxylate,
3,4-epoxycyclohexyl oxirane,
2-(3,4-epoxycyclohexyl)-3',4'-epoxy-1,3-dioxane-5-spirocyclohexane,
1,2-ethylenedioxy-bis(3,4-epoxycyclohexylmethane),
4',5'-epoxy-2'-methylcyclohexylmethyl-4,5-epoxy-2-methylcyclohexane
carboxylate, ethylene glycol-bis(3,4-epoxycyclohexane carboxylate),
and bis-(3,4-epoxycyclohexylmethyl)adipate, and
bis(2,3-epoxycyclopentyl)ether.
[0042] These compounds of the cross-linkers can be used alone, or
two or more of the compounds can be used in combination. The
cross-linker can be used at 1% by mass to 50% by mass, or 8% by
mass to 40% by mass, or 15% by mass to 30% by mass of a polymer
contained in the composition of the present invention.
[0043] The composition comprising a polymer according to the
present invention can contain a catalyst for cross-linking. The use
of the catalyst for cross-linking facilitates reaction of the
cross-linker. Examples of the catalyst for cross-linking include
p-toluenesulfonic acid, trifluoromethanesulfonic acid,
methanesulfonic acid, pyridinium-p-toluenesulfonate, salicylic
acid, camphorsulfonic acid, 5-sulfosalicylic acid, citric acid,
benzoic acid, hydroxybenzoic acid, 4-chlorobenzenesulfonic acid,
4-hydroxybenzenesulfonic acid, benzenedisulfonic acid, and
1-naphthalenesulfonic acid.
[0044] These catalysts for cross-linking can be used alone, or two
or more of the catalysts can be used in combination. The catalyst
for cross-linking can be used at 0.01% by mass to 10% by mass, or
0.05% by mass to 8% by mass, or 0.1% by mass to 5% by mass, or 0.3%
by mass to 3% by mass, or 0.5% by mass to 1% by mass of the polymer
contained in the composition of the present invention.
[0045] Conventionally used miscible additives, such as an
additional resin for improving performance of the composition, a
tackifier, a plasticizer, an adhesion auxiliary agent, a
stabilizer, a colorant, and an antifoaming agent can further be
added to the composition comprising a polymer according to the
present invention, as long as these additives do not affect
essential properties of the present invention.
[0046] Addition polymerization polymers or condensation
polymerization polymers, such as polyester, polystyrene, polyimide,
an acrylic polymer, a methacrylic polymer, polyvinyl ether, phenol
novolac, naphthol novolac, polyether, polyamide, and polycarbonate
can be used as the additional resin (polymer) for improving
performance of the composition. Preferably used are polymers having
aromatic ring structures such as a benzene ring, a naphthalene
ring, an anthracene ring, a triazine ring, a quinoline ring, and a
quinoxaline ring.
[0047] Examples of the additional resin (polymer) include: an
addition polymerization polymer having an addition polymerization
monomer such as benzyl acrylate, benzyl methacrylate, phenyl
acrylate, naphthyl acrylate, anthryl methacrylate, anthrylmethyl
methacrylate, styrene, hydroxy styrene, benzylvinyl ether, and
N-phenyl maleimide, as a structural unit thereof; and a
condensation polymerization polymer such as phenol novolac and
naphthol novolac. A polymer having no aromatic ring structure can
also be used as the additional resin (polymer). Example of such a
polymer includes an addition polymerization polymer containing only
an addition polymerization monomer having no aromatic ring
structure as a structural unit thereof, such as alkyl acrylate,
alkyl methacrylate, vinyl ether, alkylvinyl ether, acrylonitrile,
maleimide, N-alkyl maleimide, and maleic acid anhydride. When an
addition polymerization polymer is used as an additional resin
(polymer), the polymer may be a homopolymer or a copolymer.
[0048] A weight-average molecular weight of an additional resin
(polymer) used for the composition including a polymer according to
the present invention is, for example, 1,000 to 1,000,000, or 3,000
to 300,000, or 5,000 to 200,000, or 10,000 to 100,000. When an
additional resin (polymer) is contained in the composition of the
present invention, the content thereof is, for example, 40% by mass
or less, or 20% by mass or less, or 1% by mass to 19% by mass of
the solid content.
[0049] The tackifier is added to control modulus of elasticity,
viscosity, and surface condition. The type of the tackifier is
preferably decided by taking into account viscosity. Specific
examples thereof include one of, or a combination of two or more of
an aliphatic petroleum resin, an aromatic petroleum resin, an
aliphatic and aromatic copolymerization petroleum resin, a
hydrogenerated alicyclic petroleum resin, an alkyl phenol resin, a
xylene resin, a coumarone indene resin, a terpene resin, a terpene
phenol resin, an aromatic denatured terpene resin, a hydrogenated
terpene resin, a rosin resin, a hydrogenerated rosin resin, a
disproportionated rosin resin, a dimerized rosin resin, and an
esterified rosin resin. The tackifier can be contained at a
percentage of, for example, 100% by mass or less, or 50% by mass or
less of the polymer contained in the composition of the present
invention.
[0050] The composition including a polymer according to the present
invention is used for adhesives, formation of insulating films, or
formation of resist underlayer films. Such adhesives are used, for
example, in a process of forming three-dimensional stacked bodies,
such as IC chips, in order to bond between stacked materials. In
the formation of insulating films, for example, gate insulating
films or interlayer insulating films of thin film transistors are
formed. In the formation of resist underlayer films, for example, a
resist underlayer film is formed between a substrate and a resist
film in order that a resist pattern having a desired shape is
formed on the substrate.
[0051] When the composition contains a solvent, the composition is
used for insulating inks. Insulating inks are used, for example, in
a process for manufacturing flexible displays in which plastic
substrates are used, to form insulating films by methods such as
screen printing and ink jet.
[0052] [Adhesive Composition]
[0053] The adhesive composition of the present invention contains
the polymer having a structural unit of Formula (6) and a solvent
as essential ingredients. The polymer may be composed of only one
type of a structural unit of Formula (6), or may be composed of two
or more types of structural units of Formula (6) (copolymer). The
weight-average molecular weight of the polymer determined by GPC
analysis is, for example, 1,000 to 100,000 in terms of standard
polystyrene. The definition of each group in a structural unit of
Formula (6) is described above.
[0054] The adhesive composition of the present invention can be
prepared as a coating solution in which a polymer of Formula (6) is
dissolved in an organic solvent so that the solution can be used
for spin coating within the range from 0.001 to 5,000 Pas in
viscosity.
[0055] The organic solvent is not particularly limited as long as
it can be used in a step for manufacturing semiconductor devices.
Preferable examples of the organic solvent available include:
ketones such as cyclohexanone, methyl isoamyl ketone, 2-butanone,
and 2-heptanone; polyhydric alcohols and derivatives thereof, such
as ethylene glycol, ethylene glycol monoacetate, diethylene glycol,
diethylene glycol monoacetate, propylene glycol, propylene glycol
monoacetate, dipropylene glycol, and dipropylene glycol
monoacetate, as well as monomethyl ether, monoethyl ether,
monopropyl ether, monobutyl ether, and monophenyl ether of these;
cyclic ethers such as dioxane; lactones such as y-butyrolactone;
and esters such as methyl lactate, ethyl lactate, methyl acetate,
ethyl acetate, butyl acetate, methyl pyruvate, ethyl pyruvate,
methyl methoxypropionate, and ethyl ethoxypropionate. These may be
used alone, or two or more of them may be used as a mixture.
[0056] The percentage of a solid content in the adhesive
composition of the present invention is, for example, 1% by mass to
70% by mass, in which the solid content refers to ingredients of
the adhesive composition excluding the organic solvent.
[0057] If necessary, the adhesive composition of the present
invention may further contain additives such as a surfactant, a
thermal acid generator, an inorganic filler, a silane coupling
agent, a rheology modifier, a cross-linker, and a catalyst for
cross-linking.
[0058] As these additives, various specific compounds described in
the section [Composition Including Polymer] above as examples of a
surfactant, a thermal acid generator, an inorganic filler, a silane
coupling agent, a rheology modifier, a cross-linker, and a catalyst
for cross-linking can be used in the amounts described above.
[0059] Conventionally used miscible additives, such as an
additional resin for improving performance of an adhesive, a
tackifier, a plasticizer, an adhesion auxiliary agent, a
stabilizer, a colorant, and an antifoaming agent, can further be
added to the adhesive composition of the present invention as long
as these additives do not affect essential properties of the
present invention.
[0060] Specific compounds described in the section [Composition
Including Polymer] above as examples can also be used as these
additives in the amounts described above.
EXAMPLES
[0061] The present invention will be explained in further detail
according to examples; however, the present invention is not
limited to these examples.
[0062] Gel permeation chromatography (GPC) analyses of polymers
obtained in synthesis examples described below were conducted with
the following device and measuring condition.
[0063] Device: All-in-one high-speed GPC system, HLC-8220GPC,
manufactured by Tosoh Corporation
[0064] Column: KF-G, KF804L
[0065] Column temperature: 40.degree. C.
[0066] Solvent: tetrahydrofuran (THF)
[0067] Flow rate: 1.0 mL/minute
[0068] Standard sample: polystyrene
[0069] Detector: RI
Synthesis Example 1
[0070] 10.0 g of sodium hydride (60% by mass contained in oil
paraffin) was suspended in 200 g of N-methyl-2-pyrrolidone, and
then 21.9 g of monobutyl isocyanurate was added thereto by split
addition. The mixture was heated to 40.degree. C., and agitated for
1 hour. After that, 25.5 g of 1,4-dibromobutane was added slowly,
and the resultant mixture was reacted at 100.degree. C. for 2
hours. The reaction was then stopped with water to precipitate a
polymer. Next, reprecipitation was conducted to obtain a polymer
having a structural unit of Formula [A] below. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 7,100
in terms of standard polystyrene.
##STR00010##
Synthesis Example 2
[0071] 10.0 g of sodium hydride (60% by mass contained in oil
paraffin) was suspended in 200 g of N-methyl-2-pyrrolidone, and
then 19.5 g of monoallyl isocyanurate was added thereto by split
addition. The mixture was heated to 40.degree. C., and agitated for
1 hour. After that, 15.0 g of 1,4-dichloro butane was added slowly,
and the resultant mixture was reacted at 90.degree. C. for 24
hours. The reaction was then stopped with water to precipitate a
polymer. Next, reprecipitation was conducted to obtain a polymer
having a structural unit of Formula [B] below. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 4,000
in terms of standard polystyrene.
##STR00011##
Synthesis Example 3
[0072] 8 g of the polymer obtained in Synthesis Example 2 was
dissolved in 32 g of methylene chloride, and then 9.3 g (0.054 mol)
of m-chloroperoxybenzoic acid was added thereto by split addition.
The mixture was reacted under a nitrogen atmosphere, at room
temperature for 2 days. After that, the obtained reaction solution
was added dropwise into a mixed solvent of diethyl ether/methanol,
and then the precipitate was filtered to obtain white powder. GPC
analysis of the reaction product showed a weight-average molecular
weight of 5,200 in terms of standard polystyrene. The inversion
rate from allyl to epoxy was 52%. The obtained reaction product was
a polymer having structural units of two formulae in Formula
[C]:
##STR00012##
Synthesis Example 4
[0073] 67.66 g of monoallyl isocyanurate, 74.39 g of
1,2-dibromoethane, 121.62 g of potassium carbonate, and 213.07 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [D] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 9,500 in terms of standard
polystyrene.
##STR00013##
Synthesis Example 5
[0074] 67.66 g of monoallyl isocyanurate, 77.73 g of
1,4-dibromobutane, 121.62 g of potassium carbonate, and 581.53 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [E] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 9,500 in terms of standard
polystyrene.
##STR00014##
Synthesis Example 6
[0075] 67.66 g of monoallyl isocyanurate, 87.83 g of
1,6-dibromohexane, 121.62 g of potassium carbonate, and 621.94 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next, the mixture
was poured into a two-layer separation solution of ethyl acetate
and water, and a liquid separation operation was performed. Only a
target polymer was extracted in an ethyl acetate layer, and then
ethyl acetate was distilled with an evaporator to obtain a polymer
having a structural unit of Formula [F] below. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 5,600
in terms of standard polystyrene.
##STR00015##
Synthesis Example 7
[0076] 11.84 g of monoallyl isocyanurate, 17.14 g of
1,8-dibromooctane, 21.28 g of potassium carbonate, and 115.91 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next, the mixture
was poured into a two-layer separation solution of ethyl acetate
and water, and a liquid separation operation was performed. Only a
target polymer was extracted in an ethyl acetate layer, and then
ethyl acetate was distilled with an evaporator to obtain a polymer
having a structural unit of Formula [G] below. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 11,300
in terms of standard polystyrene.
##STR00016##
Synthesis Example 8
[0077] 11.84 g of monoallyl isocyanurate, 17.14 g of
1,10-dibromodecane, 21.28 g of potassium carbonate, and 115.91 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next, the mixture
was poured into a two-layer separation solution of ethyl acetate
and water, and a liquid separation operation was performed. Only a
target polymer was extracted in an ethyl acetate layer, and then
ethyl acetate was distilled with an evaporator to obtain a polymer
having a structural unit of Formula [H] below. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 10,600
in terms of standard polystyrene.
##STR00017##
Synthesis Example 9
[0078] 11.84 g of monoallyl isocyanurate, 12.13 g of p-dichloro
xylene, 21.28 g of potassium carbonate, and 95.89 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [I] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 17,000 in terms of standard
polystyrene.
##STR00018##
Synthesis Example 10
[0079] 12.89 g of diethylbarbituric acid, 13.02 g of
1,4-dibromoethane, 21.28 g of potassium carbonate, and 103.65 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [J] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 2,400 in terms of standard
polystyrene.
##STR00019##
Synthesis Example 11
[0080] 11.84 g of monoallyl isocyanurate, 14.83 g of
1,4-dibromo-2-butene, 21.28 g of potassium carbonate, and 106.65 g
of N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [K] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 8,900 in terms of standard
polystyrene.
##STR00020##
Synthesis Example 12
[0081] 16.91 g of monoallyl isocyanurate, 12.57 g of
1,3-dichloro-2-propanone, 30.41 g of potassium carbonate, and 88.45
g of N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [L] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 1,300 in terms of standard
polystyrene.
##STR00021##
Synthesis Example 13
[0082] 25.37 g of monoallyl isocyanurate, 22.32 g of o-dichloro
xylene, 45.61 g of potassium carbonate, and 111.28 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having a structural unit of
Formula [M] below. GPC analysis of the obtained polymer showed a
weight-average molecular weight of 7,800 in terms of standard
polystyrene.
##STR00022##
Synthesis Example 14
[0083] 84.57 g of monoallyl isocyanurate, 39.38 g of m-dichloro
xylene, 45.99 g of 1,5-dibromo pentane, 6.05 g of allyl bromide,
106.62 g of potassium carbonate, and 410.66 g of
N-methyl-2-pyrrolidone were placed in a flask equipped with an
agitator, a reflux apparatus, and a thermometer. The air in the
flask was replaced with nitrogen, and then the mixture was heated
to 70.degree. C. and reacted for 20 hours. After that, the solution
was cooled to room temperature, and then was filtered to collect a
filtrate. A mixed solution in which N-methyl-2-pyrrolidone and 1
mol/L hydrochloric acid were mixed at a volume ratio of 90:10 was
added to the filtrate until the pH became acidic. Next,
reprecipitation purification was conducted by pouring the mixture
into methanol to obtain a polymer having structural units of two
formulae in Formula [N] below, at a molar ratio of 50:50. GPC
analysis of the obtained polymer showed a weight-average molecular
weight of 3,900 in terms of standard polystyrene.
##STR00023##
Comparative Synthesis Example 1
[0084] 21.22 g of diallyl monoglycidyl isocyanurate, 10.64 g of
1,1,3,3-tetramethyldisiloxane, and 20 .mu.L of Karstedt's catalyst
(0.1 M xylene solution of
platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex) were
placed in a flask equipped with an agitator, a reflux apparatus,
and a thermometer. The air in the flask was replaced with nitrogen,
and then the mixture was reacted at 70.degree. C. for 1 hour and at
90.degree. C. for 20 hours to obtain a polymer having a structural
unit of Formula [X] below. GPC analysis of the obtained polymer
showed a weight-average molecular weight of 7,800 in terms of
standard polystyrene.
##STR00024##
Comparative Synthesis Example 2
[0085] 18.57 g of diallyl monoglycidyl isocyanurate, 19.59 g of
1,1,3,3,5,5,7,7-octamethyltetrasiloxane, and 20 .mu.L of Karstedt's
catalyst (0.1 M xylene solution of
platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex) were
placed in a flask equipped with an agitator, a reflux apparatus,
and a thermometer. The air in the flask was replaced with nitrogen,
and then the mixture was reacted at 70.degree. C. for 1 hour and at
150.degree. C. for 20 hours to obtain a polymer having a structural
unit of Formula [Y] below. GPC analysis of the obtained polymer
showed a weight-average molecular weight of 5,500 in terms of
standard polystyrene.
##STR00025##
Example 1
[0086] A solution was prepared by dissolving 1 g of the polymer
obtained in Synthesis Example 1 and 0.01 g of MEGAFAC (registered
trademark) R-30 (manufactured by DIC Corporation) as a surfactant
into 2.0 g of propylene glycol monomethyl ether, 2.0 g of propylene
glycol monomethyl ether acetate, and 1 g of .gamma.-butyrolactone.
Then, the solution was filtered through a polyethylene micro filter
having a pore size of 0.10 .mu.m to prepare a composition.
Example 2
[0087] With the exception that the polymer obtained in Synthesis
Example 2 was used instead of the polymer obtained in Synthesis
Example 1, a composition was prepared in the same manner as Example
1.
Example 3
[0088] A solution was prepared by dissolving 1 g of the polymer
obtained in Synthesis Example 3, 0.01 g of MEGAFAC (registered
trademark) R-30 (manufactured by DIC Corporation) as a surfactant,
and 0.03 g of TAG-N (manufactured by SANSHIN CHEMICAL INDUSTRY CO.,
LTD.) as a thermal acid generator into 2.0 g of propylene glycol
monomethyl ether, 2.0 g of propylene glycol monomethyl ether
acetate, and 1 g of .gamma.-butyrolactone. Then, the solution was
filtered through a polyethylene micro filter having a pore size of
0.10 .mu.m to prepare a composition.
Example 4
[0089] The polymer obtained in Synthesis Example 4 was dissolved in
cyclohexanone, and the solution was then filtered through a
polytetrafluoroethylene (hereinafter, abbreviated as PTFE) micro
filter having a pore size of 1.0 .mu.m to prepare a composition in
which the percentage of the solid content was 35% by mass.
Example 5
[0090] With the exception that the polymer obtained in Synthesis
Example 5 was used instead of the polymer obtained in Synthesis
Example 4, a composition was prepared in the same manner as Example
4.
Example 6
[0091] With the exception that the polymer obtained in Synthesis
Example 6 was used instead of the polymer obtained in Synthesis
Example 4, a composition was prepared in the same manner as Example
4.
Example 7
[0092] With the exception that the polymer obtained in Synthesis
Example 7 was used instead of the polymer obtained in Synthesis
Example 4, a composition was prepared in the same manner as Example
4.
Example 8
[0093] With the exception that the polymer obtained in Synthesis
Example 8 was used instead of the polymer obtained in Synthesis
Example 4, a composition was prepared in the same manner as Example
4.
Comparative Example 1
[0094] A solution was prepared by adding 0.01 g of MEGAFAC
(registered trademark) R-30 (manufactured by DIC Corporation) as a
surfactant to 5 g of a poly(pyromellitic
dianhydride-co-4,4'-oxydianiline)amic acid solution (Pyre-ML
RC-5019, 16% by mass N-methyl-2-pyrrolidone solution, manufactured
by Sigma-Aldrich Japan K.K.) that is a polyimide precursor. Then
the solution was filtered through a polyethylene micro filter
having a pore size of 0.10 .mu.m to prepare a composition.
Comparative Example 2
[0095] The polymer obtained in Comparative Synthesis Example 1 was
dissolved in cyclohexanone. To the resultant solution, a thermal
acid generator, K-PURE TAG 2689 (manufactured by King Industries
Inc.) was then added at 1% by mass of the mass of the polymer. The
solution was filtered through a PTFE micro filter having a pore
size of 1.0 .mu.m to prepare a composition in which the percentage
of the solid content was 35.35% by mass.
Comparative Example 3
[0096] The polymer obtained in Comparative Synthesis Example 2 was
dissolved in cyclohexanone. To the resultant solution, a thermal
acid generator, K-PURE TAG 2689 (manufactured by King Industries
Inc.) was then added at 1% by mass of the mass of the polymer. The
solution was filtered through a PTFE micro filter having a pore
size of 1.0 to prepare a composition in which the percentage of the
solid content was 40.40% by mass.
Comparative Example 4
[0097] Polymethylmethacrylate (manufactured by Wako Pure Chemical
Industries, Ltd.) that is an acrylic resin was dissolved in
cyclohexanone, and then the solution was filtered through a PTFE
micro filter having a pore size of 1.0 .mu.m to prepare a
composition in which the percentage of the solid content was 20% by
mass.
[0098] [Measurement of Transmittance]
[0099] The compositions prepared in Examples 1 to 3, and
Comparative Example 1 were applied to respective quartz substrates
by use of a spin coater. Each of the substrates was baked at
200.degree. C. for 5 minutes on a hot plate to form a film having a
thickness of 0.75 .mu.m. A transmittance of the film at a
wavelength of 400 nm was measured by use of an ultraviolet-visible
spectrophotometer UV-2550 (manufactured by SHIMADZU
[0100] Corporation). The film was further heated at 260.degree. C.
for 3 minutes, and then its transmittance at a wavelength of 400 nm
was measured. Table 1 below shows the results of the measurement.
As shown in Table 1, the results suggest that the films obtained
from compositions of the present invention have higher
transmittances compared to the film obtained from the composition
of Comparative Example, keep high transmittances even at a high
temperature such as 260.degree. C. almost without coloring, and are
heat resistant.
TABLE-US-00001 TABLE 1 Transmittance (Wavelength 400 nm)
200.degree. C. 260.degree. C. Example 1 100% 98% Example 2 100% 99%
Example 3 100% 99% Comparative Example 1 88% 87%
[0101] [Light Resistance Test]
[0102] The compositions prepared in Examples 1 to 3 were applied to
respective quartz substrates by use of a spin coater. Each of the
substrates was baked at 220.degree. C. for 5 minutes on a hot plate
to form a film having a thickness of 0.75 .mu.m. A light resistance
test (JIS B7754) with a xenon arc lamp was conducted to each of
these films for 24 hours, and then a transmittance of the film at a
wavelength of 400 nm was measured by use of an ultraviolet-visible
spectrophotometer UV-2550 (manufactured by SHIMADZU Corporation).
Table 2 below shows the results of the measurement. As shown in
Table 2, the results show that the films obtained from the
compositions of the present invention have high transmittances even
after the ultraviolet irradiation, and are highly light resistant
(hard to be colored).
TABLE-US-00002 TABLE 2 Transmittance (Wavelength 400 nm) Before
Irradiation After Irradiation Example 1 100% 100% Example 2 100%
100% Example 3 100% 100%
[0103] [Test of Elution to Solvent]
[0104] The compositions prepared in Example 3 and Comparative
Example 1 were applied to respective silicon wafers by use of a
spin coater. Each of the silicon wafers was baked at 200.degree. C.
for 5 minutes on a hot plate to form a film having a thickness of 1
.mu.m. The film was soaked in acetone, N-methyl-2-pyrrolidone,
2-propanol, and 2-heptanone, each at 23.degree. C. for 10 minutes.
It was confirmed that in the film obtained from the composition of
Example 3, the film thickness was changed by 5% or less before and
after soaking. In contrast, the film obtained from the composition
of Comparative Example 1 was completely dissolved after being
soaked in N-methyl-2-pyrrolidone.
[0105] [Evaluation of Reworkability]
[0106] The compositions prepared in Examples 4 to 6, and
Comparative Examples 2 and 3 were applied to respective silicon
wafers by use of a spin coater. Each of the silicon wafers was
baked at 100.degree. C. for 2 minutes, and 150.degree. C. for 2
minutes on a hot plate, and was further baked in an oven in which
the air was replaced with nitrogen, at 250.degree. C. for 1 hour to
form a film. Etching was conducted for 2 minutes by use of a
reactive ion etching device (RIE-10NR, manufactured by SAMCO INC.)
under an oxygen flow rate of 50 sccm, a pressure of 12 Pa, and an
RF output of 250 W. Reworkability of each of the films was
evaluated from a decreased amount of a film thickness per minute.
Table 3 below shows the results. As shown in Table 3, the films
obtained from the compositions of the present invention have
excellent reworkability because the films can be easily removed by
etching. In contrast, the films obtained from the compositions of
the Comparative Examples are not reworkable because the films were
almost impossible to be removed.
TABLE-US-00003 TABLE 3 Decreased Amount of Film Thickness Example 4
725 nm/minute Example 5 732 nm/minute Example 6 690 nm/minute
Comparative Example 2 18 nm/minute Comparative Example 3 14
nm/minute
[0107] [Evaluation of Insulation Performance]
[0108] Cyclohexanone was added to the compositions prepared in
Examples 4 to 8, and Comparative Example 4 to form respective
dilute solutions so that films formed on silicon wafers by use of a
spin coater have a film thickness of 500 nm. The prepared dilute
solutions were applied to respective silicon wafers by use of a
spin coater. Each of the silicon wafers was baked at 100.degree. C.
for 2 minutes, and 150.degree. C. for 2 minutes on a hot plate, and
was further baked in an oven in which the air was replaced with
nitrogen at 250.degree. C. for 1 hour to form a film. A voltage of
2 MV/cm was applied to each of the films by use of a mercury probe
(CVmap 92-B, manufactured by Four Dimensions Inc.), and the leakage
current value was measured to evaluate the insulation performance
of the film. Table 4 below shows the results. As shown in Table 4,
the films obtained from the compositions of the present invention
show low leakage current values, and thus their insulation
performances are high. In contrast, the film obtained from the
composition of the Comparative Example shows a high leakage current
value, and thus its insulation performance is low.
TABLE-US-00004 TABLE 4 Leakage Current Value (A/cm.sup.2) Example 4
2.45 .times. 10.sup.-9 Example 5 1.09 .times. 10.sup.-9 Example 6
1.65 .times. 10.sup.-9 Example 7 0.90 .times. 10.sup.-9 Example 8
0.85 .times. 10.sup.-9 Comparative Example 4 14.43 .times.
10.sup.-9
[0109] [Evaluation of Heat Resistance]
[0110] The compositions prepared in Examples 4 to 8, and
Comparative Example 4 were applied to respective silicon wafers by
use of a spin coater. Each of the silicon wafers was baked at
100.degree. C. for 2 minutes, and 150.degree. C. for 2 minutes on a
hot plate to form a film. The film was subjected to temperature
rising by 10.degree. C./minute by TG-DTA (TG/DTA2010SR,
manufactured by Bruker AXS K.K.), and a heat resistance was
evaluated from a temperature that induced mass decrease of 5% by
mass. Table 5 below shows the results. As shown in Table 5,
temperatures that induced mass decrease of the films obtained from
the compositions of the present invention were high. Thus the heat
resistance of the films obtained from the compositions of the
present invention is higher than that of the film obtained from the
composition of the Comparative Example.
TABLE-US-00005 TABLE 5 Temperature That Induced Mass Decrease of 5%
by mass Example 4 437.degree. C. Example 5 420.degree. C. Example 6
419.degree. C. Example 7 430.degree. C. Example 8 405.degree. C.
Comparative Example 4 323.degree. C.
[0111] [Evaluation of Adhesiveness]
(Preparation of Sample for Evaluation of Adhesive Force)
[0112] The compositions prepared in Examples 4 and 5 were applied
to respective silicon wafers having a diameter of 4 inches by use
of a spin coater so that films having a thickness of 5 .mu.m were
formed. Each of the silicon wafers was baked at 100.degree. C. for
2 minutes, and 150.degree. C. for 2 minutes on a hot plate to form
a film. Then the film formed on the silicon wafer was bonded to a
glass wafer having a diameter of 4 inches by use of a bonding
system (VJ-300, manufactured by Ayumi Industries Company Limited),
under a vacuum of 10 Pa or less, a temperature of 160.degree. C.,
and a bonding pressure of 400 kg. Next, the bonded wafers were
baked in an oven at 250.degree. C. for 1 hour, and were cut into 1
square centimeter with a dicing saw (DAD321, manufactured by DISCO
Corporation) to prepare a sample for evaluating adhesive force.
[0113] The composition prepared in Comparative Example 4 was
applied to a silicon wager having a diameter of 4 inches by use of
a spin coater so that a film having a thickness of 5 .mu.m was
formed. The silicon wafer was baked at 100.degree. C. for 2
minutes, and 200.degree. C. for 2 minutes on a hot plate to form a
film. Then the film formed on the silicon wafer was bonded to a
glass wafer having a diameter of 4 inches by use of a bonding
system (VJ-300, manufactured by Ayumi Industries Company Limited),
under a vacuum of 10 Pa or less, a temperature of 270.degree. C.,
and a bonding pressure of 400 kg. Next, the bonded wafers were cut
into 1 square centimeter with a dicing saw (DAD321, manufactured by
DISCO Corporation) to prepare a sample for evaluating adhesive
force.
[0114] (Evaluation of Adhesive Force)
[0115] Araldite (registered trademark) 2014 (manufactured by
Huntsman Advanced Materials LLC) was applied to both surfaces of
each of the samples that were prepared with compositions of
Examples 4 and 5, and Comparative Example 4 for evaluating adhesive
force. Then both of the surfaces were bonded to a dedicated jig for
adhesive force (shear) measurement, and adhesive force (shear) was
tested and evaluated by use of Autograph (Autograph AGS-100NX,
manufactured by SHIMADZU Corporation). Adhesive force was measured
at a tension speed of 1 mm/minute. Table 6 below shows the results.
In Table 6, a value of adhesive force "1000 N or greater" means
that the value of adhesive force is equal to or greater than the
measurement limit of the adhesive force measuring instrument (test
device). The samples obtained with the compositions of Examples 4
and 5 showed higher adhesive force than that of the sample obtained
with the composition of Comparative Example 4.
TABLE-US-00006 TABLE 6 Adhesive Force (Shear) Example 4 1000N or
greater Example 5 1000N or greater Comparative Example 4 708N
Synthesis Example 15
[0116] 25.00 g of 1,2-cyclohexane dicarboxylic acid glycidyl ester,
15.43 g of monoallyl isocyanurate, and 0.93 g of benzyl triethyl
ammonium chloride were dissolved in 62.05 g of cyclohexanone, and
then the solution was reacted at 140.degree. C. for 4 hours to
obtain a solution containing a polymer. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 5,500
in terms of standard polystyrene. The obtained polymer seems to
have a structural unit of Formula [O] below, and have a hydrogen
atom on its end.
##STR00026##
Synthesis Example 16
[0117] 15.86 g of 1,2-cyclohexane dicarboxylic acid, 25.00 g of
monoallyl diglycidyl isocyanurate, and 3.35 g of ethyl triphenyl
phosphonium bromide were dissolved in 54.03 g of cyclohexanone, and
then the solution was reacted at 140.degree. C. for 4 hours to
obtain a solution containing a polymer. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 3,300
in terms of standard polystyrene. The obtained polymer seems to
have a structural unit of Formula [P] below, and have a carboxy
group on its end. Note that the end of the polymer obtained in this
Synthesis Example is different from the end of the polymer obtained
in Synthesis Example 15.
##STR00027##
Synthesis Example 17
[0118] 25.00 g of 2,2-bis(4-glycidyloxycyclohexane)propane, 9.67 g
of monoallyl isocyanurate, and 1.04 g of ethyl triphenyl
phosphonium bromide were dissolved in 53.57 g of cyclohexanone, and
then the solution was reacted at 140.degree. C. for 4 hours to
obtain a solution containing a polymer. GPC analysis of the
obtained polymer showed a weight-average molecular weight of 8,200
in terms of standard polystyrene. The obtained polymer seems to
have a structural unit of Formula [Q] below, and have a hydrogen
atom on its end.
##STR00028##
Synthesis Example 18
[0119] 2.0 g of monoallyl diglycidyl isocyanurate and 1.2 g of
monoallyl isocyanurate were dissolved in 13.2 g of cyclohexanone,
and the solution was heated to 120.degree. C. 0.08 g of benzyl
triethyl ammonium chloride was added to the solution, and the
mixture was reacted under a nitrogen atmosphere, at 120.degree. C.
for 21 hours. After that, the obtained reaction solution was added
dropwise into methanol, and then the precipitate was filtered to
obtain white powder. GPC analysis of the reaction product showed a
weight-average molecular weight of 5,800 in terms of standard
polystyrene. The obtained reaction product was a polymer having a
structural unit of Formula [R].
##STR00029##
Example 9
[0120] A solution containing the polymer obtained in Synthesis
Example 15 was poured into a bottle packed with a cation exchange
resin (15JWET, ORGANO CORPORATION) and an anion exchange resin
(Monosphere (registered trademark) 550A, Muromachi Technos Co.,
Ltd.), and agitated for 4 hours. Then the solution was filtered
through a polyethylene micro filter having a pore size of 3 .mu.m
to prepare an adhesive composition.
Example 10
[0121] A solution containing the polymer obtained in Synthesis
Example 16 was poured into a bottle packed with a cation exchange
resin (15JWET, ORGANO CORPORATION) and an anion exchange resin
(Monosphere (registered trademark) 550A, Muromachi Technos Co.,
Ltd.), and agitated for 4 hours. Then the solution was filtered
through a polyethylene micro filter having a pore size of 3 .mu.m
to prepare an adhesive composition.
Example 11
[0122] A solution containing the polymer obtained in Synthesis
Example 17 was poured into a bottle packed with a cation exchange
resin (15JWET, ORGANO CORPORATION) and an anion exchange resin
(Monosphere (registered trademark) 550A, Muromachi Technos Co.,
Ltd.), and agitated for 4 hours. Then the solution was filtered
through a polyethylene micro filter having a pore size of 3 .mu.m
to prepare an adhesive composition.
Example 12
[0123] 5 g of the polymer powder obtained in Synthesis Example 18
was charged into 45 g of cyclohexanone, and the mixture was
agitated for 4 hours. Then the mixture was filtered through a
polyethylene micro filter having a pore size of 3 .mu.m to prepare
an adhesive composition.
Example 13
[0124] A solution containing the polymer obtained in Synthesis
Example 15 was poured into a bottle packed with a cation exchange
resin (15JWET, ORGANO CORPORATION) and an anion exchange resin
(Monosphere (registered trademark) 550A, Muromachi Technos Co.,
Ltd.), and agitated for 4 hours. Then the solution was filtered
through a polyethylene micro filter having a pore size of 3 .mu.m.
ORGANOSILICASOL (MEK-AC-2101, manufactured by Nissan Chemical
Industries, Ltd.) whose mass was one ninth of the mass of the
polymer (solid content) contained in the solution was added to the
filtrate, and the mixture was agitated to prepare an adhesive
composition.
Example 14
[0125] A solution containing the polymer obtained in Synthesis
Example 16 was poured into a bottle packed with a cation exchange
resin (15JWET, ORGANO CORPORATION) and an anion exchange resin
(Monosphere (registered trademark) 550A, Muromachi Technos Co.,
Ltd.), and agitated for 4 hours. Then the solution was filtered
through a polyethylene micro filter having a pore size of 3 .mu.m.
ORGANOSILICASOL (MEK-AC-2101, manufactured by Nissan Chemical
Industries, Ltd.) whose mass was one ninth of the mass of the
polymer (solid content) contained in the solution was added to the
filtrate, and the mixture was agitated to prepare an adhesive
composition.
Comparative Example 5
[0126] 10 g of N-methyl-2-pyrrolidone was added to 10 g of a
poly(pyromellitic dianhydride-co-4,4'-oxydianiline)amic acid
solution (Pyre-ML RC-5019, 16% by mass N-methyl-2-pyrrolidone
solution, manufactured by Sigma-Aldrich Japan K.K.) that is a
polyimide precursor, to prepare an adhesive composition.
[0127] [Measurement of Transmittance]
[0128] The adhesive compositions prepared in Examples 9, 10, 11,
13, and 14, and Comparative Example 5 were applied to respective
quartz substrate by use of a spin coater. Each of the quartz
substrates was baked at 200.degree. C. for 5 minutes on a hot plate
to form a film having a thickness of 1 .mu.m. A transmittance of
the film at a wavelength of 500 nm was measured by use of an
ultraviolet-visible spectrophotometer UV-2550 (manufactured by
SHIMADZU Corporation).
[0129] Each of the films formed from the adhesive compositions
prepared in Examples 9 and 10, and Comparative Example 5 was
further baked at 270.degree. C. for 5 minutes, and then its
transmittance at a wavelength of 500 nm was measured.
[0130] Table 7 below shows the results of the measurement. As shown
in Table 7, the results suggest that the films formed from the
adhesive compositions prepared in Examples 9 and 10 have higher
transmittances compared to the film formed from the adhesive
composition prepared in Comparative Example 5, keep high
transmittances even after baked at 270.degree. C., and are heat
resistant.
TABLE-US-00007 TABLE 7 Transmittance (Wavelength 500 nm)
200.degree. C. 270.degree. C. Example 9 99% 97% Example 10 99% 97%
Example 11 97% -- Example 13 99% -- Example 14 99% -- Comparative
Example 5 90% 88%
[0131] [Test of Elution to Solvent]
[0132] The adhesive compositions prepared in Examples 9, 10, 11,
13, and 14, and Comparative Example 5 were applied to respective
silicon wafers by use of a spin coater. Each of the silicon wafers
was baked at 200.degree. C. for 5 minutes on a hot plate to form a
film having a thickness of 1 .mu.m. The film was soaked in
N-methyl-2-pyrrolidone at 23.degree. C. for 2 minutes. It was
confirmed that in the films formed from the adhesive compositions
prepared in Examples 9, 10, 11, 13, and 14, the film thickness was
changed by 1% or less before and after soaking. In contrast, the
film formed from the adhesive composition prepared in Comparative
Example 5 was dissolved after being soaked in
N-methyl-2-pyrrolidone and 20% or more of the film thickness before
soaking was lost.
[0133] [Evaluation of Adhesive Force]
[0134] The adhesive compositions prepared in Examples 9, 10, and 11
were applied to respective silicon wafers by use of a spin coater.
Each of the silicon wafers was baked at 100.degree. C. for 4
minutes, and 160.degree. C. for 4 minutes to form a film having a
thickness of 5 vim. Then the film formed on the silicon wafer was
bonded to a glass wafer having a diameter of 4 inches by use of a
bonding system (VJ-300, manufactured by Ayumi Industries Company
Limited), under a vacuum of 10 Pa or less, a temperature of
160.degree. C., and a bonding pressure of 800 kg. Next, the bonded
wafers were cut into 1 square centimeter with a dicing device
(DAD321, manufactured by DISCO Corporation) to prepare a sample for
evaluating adhesive force.
[0135] Araldite (registered trademark) 2014 (manufactured by
Huntsman Advanced Materials LLC) was applied to both surfaces of
each of the obtained samples for evaluating adhesive force. Then
both of the surfaces were bonded to a dedicated jig for adhesive
force (shear) measurement, and adhesive force (shear) was tested
and evaluated by use of Autograph (Autograph AGS-100NX,
manufactured by SHIMADZU Corporation). Adhesive force was measured
at a tension speed of 1 mm/minute. Table 8 below shows the results.
In Table 8, a value of adhesive force "1000 N or greater" means
that the value is equal to or greater than the measurement limit of
the adhesive force measuring instrument. Samples obtained with the
adhesive compositions prepared in Examples 9, 10, and 11 were
confirmed to have sufficient adhesiveness.
TABLE-US-00008 TABLE 8 Adhesive Force (Shear) Example 9 1000N or
greater Example 10 1000N or greater Example 11 1000N or greater
* * * * *