U.S. patent application number 13/756657 was filed with the patent office on 2014-08-07 for subtle vortex polishing apparatus.
This patent application is currently assigned to Southern Taiwan University of Science and Technology. The applicant listed for this patent is Southern Taiwan University of Science and Technology. Invention is credited to Fong-Yi Chen, Jian-Liang Chen, Ci-Hao Huang, Ming-Jheng Huang, Ming Wei Li, Hsinn-Jyh Tzeng.
Application Number | 20140220869 13/756657 |
Document ID | / |
Family ID | 51259597 |
Filed Date | 2014-08-07 |
United States Patent
Application |
20140220869 |
Kind Code |
A1 |
Tzeng; Hsinn-Jyh ; et
al. |
August 7, 2014 |
SUBTLE VORTEX POLISHING APPARATUS
Abstract
A subtle vortex polishing apparatus includes a receiving unit; a
stirring unit, movably provided in the receiving unit; and a
transmission unit, connected to the stirring unit. The workpiece to
be polished and the fluid abrasive are placed in the in the
receiving unit. The stirring unit is driven by the transmission
unit so that the fluid abrasive in the receiving unit forms the
eddy friction for polishing the workpiece and the deburring,
polishing, chamfering for the workpiece can be finished in one
time. Thereby, the grinding effect of the inner and outer surfaces
of the workpiece enhances, and this invention can be thus used in
processing small, bored, cracked, cambered complex surfaces,
achieving the effects of easy operation, single-sided or
multi-surface processing at the same time, increase in the
processing rate, significant reduce in labor intensity, reduced
processing costs and improved productivity.
Inventors: |
Tzeng; Hsinn-Jyh; (Taipei
City, TW) ; Chen; Jian-Liang; (Pingtung County,
TW) ; Chen; Fong-Yi; (Tainan City, TW) ;
Huang; Ci-Hao; (Yilan County, TW) ; Li; Ming Wei;
(Tainan City, TW) ; Huang; Ming-Jheng; (Taichung
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Science and Technology; Southern Taiwan University of |
|
|
US |
|
|
Assignee: |
Southern Taiwan University of
Science and Technology
Tainan City
TW
|
Family ID: |
51259597 |
Appl. No.: |
13/756657 |
Filed: |
February 1, 2013 |
Current U.S.
Class: |
451/113 |
Current CPC
Class: |
B24B 31/003
20130101 |
Class at
Publication: |
451/113 |
International
Class: |
B24B 31/00 20060101
B24B031/00 |
Claims
1. A subtle vortex polishing apparatus, comprising: a receiving
unit; a stirring unit, movably provided in the receiving unit; and
a transmission unit, connected to the stirring unit.
2. The apparatus of claim 1, wherein the receiving unit comprises a
container body having at least one receiving area, a supporting
part provided on a bottom of the container body, an upper lid
movably coupled at one end of the container body, a placement area
provided on a top of the upper lid, and a cover provided on a top
of the upper lid and closing the placement area.
3. The apparatus of claim 2, wherein the container body is of
cylindrical shape.
4. The apparatus of claim 2, wherein fluid abrasive is placed in
the receiving area of the container body.
5. The apparatus of claim 2, wherein a workpiece is placed on the
supporting part of the container body.
6. The apparatus of claim 2, wherein the stirring unit has a shaft
body, and a plurality of blades located along the periphery at one
end of the shaft body.
7. The apparatus of claim 2, wherein the transmission unit
comprises an actuating element connected to the stirring unit, a
power supply connected to the actuating element, and a switch
connected to the actuating element and the power supply.
8. The apparatus of claim 7, wherein the actuating element is a
motor.
9. The apparatus of claim 7, wherein the power supply unit is a
battery, a rechargeable battery or connection a plug for home
electricity.
10. The apparatus of claim 7, wherein the transmission unit further
comprises a timer connected to the actuating element and the
switch, and an inverter connected to the timer and the power
supply.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a subtle vortex polishing
apparatus, particularly to a subtle vortex polishing apparatus in
which the fluid abrasive in the receiving unit forms the eddy
friction for polishing the workpiece and the deburring, polishing,
chamfering for the workpiece can be finished in one time. Thereby,
the grinding effect of the inner and outer surfaces of the
workpiece enhances, and this invention can be thus used in
processing small, bored, cracked, cambered complex surfaces,
achieving the effects of easy operation, single-sided or
multi-surface processing at the same time, increase in the
processing rate, significant reduce in labor intensity, reduced
processing costs and improved productivity.
[0003] 2. Description of Related Art
[0004] Omori et al., Japan Patent in 2002, disclosed non-metal
bonded grinders, an electrolytic dressing grinding method and
apparatus therefore, which use the abrasive and carbon-containing
non-metal composite having the abrasive for electrolysis, reaching
good yield and good processing effect.
[0005] Even though the grinders and electrolytic dressing grinding
are used to grind the workpiece to be polished in the above
processing method to improve the surface roughness, difficult
shapes such as small, bored, cracked, arc, complex surfaces etc. on
the workpiece to polished still needs more powerful technology to
remove with enhanced feed efficiency.
[0006] VKGorana et al in 2004, International Journal of Machine
Tool & Technology, Vol. 44, pp. 201-211, discussed the
influence of the extrusion pressure, abrasive concentration,
particle size for abrasive flow machining on the material removal
amount, surface roughness, cutting force and actuating abrasive
grain density. These processing parameters includes: the abrasive
particle size, abrasive type and concentration of the mixing ratio,
processing time, and workpiece material. Such an approach utilizes
the pressure by the abrasive generates the reciprocation directly
on the workpiece, removing the material from the workpiece and
improving the surface roughness. However, for precision
transmission mechanism, such as small, bored, split, cambered,
complex surfaces, the material removal capacity is limited and the
feed efficiency and surface roughness still need to be
improved.
[0007] Another VKJain et al, International Journal of Machine Tool
& Manufacture, Vol. 44, pp. 1019-1029, 2004, disclosed a
combination of abrasive in electromagnetic rheological fine
polishing for surface processing, and discussed the influence of
different abrasive configuration on surface roughness and material
removal. In subsequent development, rotating magnetic poles are
used to drive magnetic abrasive to rotate to explore the influence
of shape and rotating speed of the magnetic poles on surface
roughness and material removal. In processing the surfaces with
complex shapes such as helical surface, the improvement in material
removal and surface accuracy is limited,
[0008] For this reason, the inventors has studied and proceeded
in-depth discussion, and actively seek approaches for many years
engaged in the research and experiences of related industries and
manufacturing. After long-term research and efforts in development,
the inventors has finally the successfully developed this invention
`a subtle vortex polishing apparatus` which overcomes the shortages
in the prior art.
SUMMARY OF THE INVENTION
[0009] A main purpose of this invention is to provide a subtle
vortex polishing apparatus in which the fluid abrasive in the
receiving unit forms the eddy friction for polishing the workpiece
and the deburring, polishing, chamfering for the workpiece can be
finished in one time. Thereby, the grinding effect of the inner and
outer surfaces of the workpiece enhances, and this invention can be
thus used in processing small, bored, cracked, cambered complex
surfaces, achieving the effects of easy operation, single-sided or
multi-surface processing at the same time, increase in the
processing rate, significant reduce in labor intensity, reduced
processing costs and improved productivity.
[0010] In order to achieve the above and other objectives, the
subtle vortex polishing apparatus of the invention includes a
receiving unit; a stirring unit, movably provided in the receiving
unit; and a transmission unit, connected to the stirring unit.
[0011] In one embodiment of the invention, the receiving unit
includes a container body having at least one receiving area, a
supporting part provided on a bottom of the container body, an
upper lid movably coupled at one end of the container body, a
placement area provided on a top of the upper lid, and a cover
provided on a top of the upper lid and closing the placement
area.
[0012] In one embodiment of the invention, the container body is of
cylindrical shape.
[0013] In one embodiment of the invention, fluid abrasive is placed
in the receiving area of the container body.
[0014] In one embodiment of the invention, a workpiece is placed on
the supporting part of the container body.
[0015] In one embodiment of the invention, the stirring unit has a
shaft body, and a plurality of blades located along the periphery
at one end of the shaft body.
[0016] In one embodiment of the invention, the transmission unit
includes an actuating element connected to the stirring unit, a
power supply connected to the actuating element, and a switch
connected to the actuating element and the power supply.
[0017] In one embodiment of the invention, the actuating element is
a motor.
[0018] In one embodiment of the invention, the power supply unit is
a battery, a rechargeable battery or connection a plug for home
electricity.
[0019] In one embodiment of the invention, the transmission unit
further comprises a timer connected to the actuating element and
the switch, and an inverter connected to the timer and the power
supply.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a schematic, perspective view of a subtle vortex
polishing apparatus according to a first embodiment of the
invention.
[0021] FIG. 2 is a schematic, exploded view of subtle vortex
polishing apparatus according to a first embodiment of the
invention.
[0022] FIG. 3 is schematic view of use status of a subtle vortex
polishing apparatus according to a first embodiment of the
invention.
[0023] FIG. 4 is a schematic, exploded perspective view of subtle
vortex polishing apparatus according to a second embodiment of the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] The aforementioned illustrations and following detailed
descriptions are exemplary for the purpose of further explaining
the scope of the present invention. Other objectives and advantages
related to the present invention will be illustrated in the
subsequent descriptions and appended tables.
[0025] FIG. 1 is a schematic, perspective view of a subtle vortex
polishing apparatus according to a first embodiment of the
invention. FIG. 2 is a schematic, exploded view of subtle vortex
polishing apparatus according to a first embodiment of the
invention. FIG. 3 is schematic view of use status of a subtle
vortex polishing apparatus according to a first embodiment of the
invention. As shown, the subtle vortex polishing apparatus of the
present invention includes at least a receiving unit 1, a stiffing
unit 2 and a transmission unit 3.
[0026] The above-mentioned receiving unit 1 includes a container
body 11 having at least one receiving area 111, a supporting part
12 provided on a bottom of the container body 11, an upper lid 13
movably coupled at one end of the container body 11, a placement
area 14 provided on a top of the upper lid 13, and a cover 15
provided on a top of the upper lid 13 and closing the placement
area 14 The container body 11 is of cylindrical shape.
[0027] The stirring unit 2 is movably provided in the receiving
unit 1, and has a shaft body 21, and a plurality of blades 22
located along the periphery at one end of the shaft body 21. The
stirring unit 2 penetrates through the upper lid 13 via the shaft
body 21 to movably locate in the container body 11 of the receiving
area 111.
[0028] The transmission unit 3 is disposed in the placement area 14
of the upper lid 13 and is connected to the stirring unit 2 The
transmission unit 3 includes an actuating element 31 connected to
the shaft body 21 of the stirring unit 2, a power supply 32
connected to the actuating element 31, and a switch 33 connected to
the actuating element 31 and the power supply 32. The actuating
element 31 can be a motor. The power supply unit 21 can be a
battery, a rechargeable battery or connection a plug for home
electricity.
[0029] When the present invention is in use, one workpiece 4 to be
polished is placed on the supporting part 12 of the container body
11 and fluid abrasive 5 is injected into the receiving area 111 of
the container body 11. The switch 33 of the drive unit 3 is turned
on so that the actuating member 31 drives the shaft body 21 of the
stirring unit 2 to operate the individual blade 22 by the required
electrical power from the power supply 32. Thereby each blade 22
agitates the fluid abrasive 5 to generate an eddy so that the fluid
abrasive 5 polishes the workpiece 4 by friction. At this moment,
with the use of the fluid abrasive 5, the workpiece 4 to be
polished is subject to completely deburring, polishing and
chamfering for the application to difficult processing on small,
bored, cracked, cambered complex surfaces. As such, the grinding
effect of polishing inner and outer surfaces of the workpiece
4.
[0030] FIG. 4 is a schematic, exploded perspective view of subtle
vortex polishing apparatus according to a second embodiment of the
present invention. As shown, the second embodiment is the same as
the first embodiment, except in that the transmission unit 3
further includes a timer 34 connected to the actuating element 31
and the switch 33, and an inverter 35 connected to the timer 34 and
the power supply 32.
[0031] The timer 34 allows users to fully understand the actuation
time, set the polishing time as required, and automatically turns
off after the set time. The inverter 35 can use a fixed voltage to
change the power so as to control the rotational speed of the
actuating element 31. Thereby, the present invention can be more in
line with the requirement for the actual use.
[0032] In summary, the subtle vortex polishing apparatus of the
invention can effectively improve various drawbacks in the prior
art. The workpiece to be polished and the fluid abrasive are placed
in the in the receiving unit. The stirring unit is driven by the
transmission unit so that the fluid abrasive in the receiving unit
forms the eddy friction for polishing the workpiece and the
deburring, polishing, chamfering for the workpiece can be finished
in one time. Thereby, the grinding effect of the inner and outer
surfaces of the workpiece enhances, and this invention can be thus
used in processing small, bored, cracked, cambered complex
surfaces, achieving the effects of easy operation, single-sided or
multi-surface processing at the same time, increase in the
processing rate, significant reduce in labor intensity, reduced
processing costs and improved productivity. This makes the
invention more progressive and more practical in use which complies
with the patent law.
[0033] The descriptions illustrated supra set forth simply the
preferred embodiments of the present invention; however, the
characteristics of the present invention are by no means restricted
thereto. All changes, alternations, or modifications conveniently
considered by those skilled in the art are deemed to be encompassed
within the scope of the present invention delineated by the
following claims.
* * * * *