Subtle Vortex Polishing Apparatus

Tzeng; Hsinn-Jyh ;   et al.

Patent Application Summary

U.S. patent application number 13/756657 was filed with the patent office on 2014-08-07 for subtle vortex polishing apparatus. This patent application is currently assigned to Southern Taiwan University of Science and Technology. The applicant listed for this patent is Southern Taiwan University of Science and Technology. Invention is credited to Fong-Yi Chen, Jian-Liang Chen, Ci-Hao Huang, Ming-Jheng Huang, Ming Wei Li, Hsinn-Jyh Tzeng.

Application Number20140220869 13/756657
Document ID /
Family ID51259597
Filed Date2014-08-07

United States Patent Application 20140220869
Kind Code A1
Tzeng; Hsinn-Jyh ;   et al. August 7, 2014

SUBTLE VORTEX POLISHING APPARATUS

Abstract

A subtle vortex polishing apparatus includes a receiving unit; a stirring unit, movably provided in the receiving unit; and a transmission unit, connected to the stirring unit. The workpiece to be polished and the fluid abrasive are placed in the in the receiving unit. The stirring unit is driven by the transmission unit so that the fluid abrasive in the receiving unit forms the eddy friction for polishing the workpiece and the deburring, polishing, chamfering for the workpiece can be finished in one time. Thereby, the grinding effect of the inner and outer surfaces of the workpiece enhances, and this invention can be thus used in processing small, bored, cracked, cambered complex surfaces, achieving the effects of easy operation, single-sided or multi-surface processing at the same time, increase in the processing rate, significant reduce in labor intensity, reduced processing costs and improved productivity.


Inventors: Tzeng; Hsinn-Jyh; (Taipei City, TW) ; Chen; Jian-Liang; (Pingtung County, TW) ; Chen; Fong-Yi; (Tainan City, TW) ; Huang; Ci-Hao; (Yilan County, TW) ; Li; Ming Wei; (Tainan City, TW) ; Huang; Ming-Jheng; (Taichung City, TW)
Applicant:
Name City State Country Type

Science and Technology; Southern Taiwan University of

US
Assignee: Southern Taiwan University of Science and Technology
Tainan City
TW

Family ID: 51259597
Appl. No.: 13/756657
Filed: February 1, 2013

Current U.S. Class: 451/113
Current CPC Class: B24B 31/003 20130101
Class at Publication: 451/113
International Class: B24B 31/00 20060101 B24B031/00

Claims



1. A subtle vortex polishing apparatus, comprising: a receiving unit; a stirring unit, movably provided in the receiving unit; and a transmission unit, connected to the stirring unit.

2. The apparatus of claim 1, wherein the receiving unit comprises a container body having at least one receiving area, a supporting part provided on a bottom of the container body, an upper lid movably coupled at one end of the container body, a placement area provided on a top of the upper lid, and a cover provided on a top of the upper lid and closing the placement area.

3. The apparatus of claim 2, wherein the container body is of cylindrical shape.

4. The apparatus of claim 2, wherein fluid abrasive is placed in the receiving area of the container body.

5. The apparatus of claim 2, wherein a workpiece is placed on the supporting part of the container body.

6. The apparatus of claim 2, wherein the stirring unit has a shaft body, and a plurality of blades located along the periphery at one end of the shaft body.

7. The apparatus of claim 2, wherein the transmission unit comprises an actuating element connected to the stirring unit, a power supply connected to the actuating element, and a switch connected to the actuating element and the power supply.

8. The apparatus of claim 7, wherein the actuating element is a motor.

9. The apparatus of claim 7, wherein the power supply unit is a battery, a rechargeable battery or connection a plug for home electricity.

10. The apparatus of claim 7, wherein the transmission unit further comprises a timer connected to the actuating element and the switch, and an inverter connected to the timer and the power supply.
Description



BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a subtle vortex polishing apparatus, particularly to a subtle vortex polishing apparatus in which the fluid abrasive in the receiving unit forms the eddy friction for polishing the workpiece and the deburring, polishing, chamfering for the workpiece can be finished in one time. Thereby, the grinding effect of the inner and outer surfaces of the workpiece enhances, and this invention can be thus used in processing small, bored, cracked, cambered complex surfaces, achieving the effects of easy operation, single-sided or multi-surface processing at the same time, increase in the processing rate, significant reduce in labor intensity, reduced processing costs and improved productivity.

[0003] 2. Description of Related Art

[0004] Omori et al., Japan Patent in 2002, disclosed non-metal bonded grinders, an electrolytic dressing grinding method and apparatus therefore, which use the abrasive and carbon-containing non-metal composite having the abrasive for electrolysis, reaching good yield and good processing effect.

[0005] Even though the grinders and electrolytic dressing grinding are used to grind the workpiece to be polished in the above processing method to improve the surface roughness, difficult shapes such as small, bored, cracked, arc, complex surfaces etc. on the workpiece to polished still needs more powerful technology to remove with enhanced feed efficiency.

[0006] VKGorana et al in 2004, International Journal of Machine Tool & Technology, Vol. 44, pp. 201-211, discussed the influence of the extrusion pressure, abrasive concentration, particle size for abrasive flow machining on the material removal amount, surface roughness, cutting force and actuating abrasive grain density. These processing parameters includes: the abrasive particle size, abrasive type and concentration of the mixing ratio, processing time, and workpiece material. Such an approach utilizes the pressure by the abrasive generates the reciprocation directly on the workpiece, removing the material from the workpiece and improving the surface roughness. However, for precision transmission mechanism, such as small, bored, split, cambered, complex surfaces, the material removal capacity is limited and the feed efficiency and surface roughness still need to be improved.

[0007] Another VKJain et al, International Journal of Machine Tool & Manufacture, Vol. 44, pp. 1019-1029, 2004, disclosed a combination of abrasive in electromagnetic rheological fine polishing for surface processing, and discussed the influence of different abrasive configuration on surface roughness and material removal. In subsequent development, rotating magnetic poles are used to drive magnetic abrasive to rotate to explore the influence of shape and rotating speed of the magnetic poles on surface roughness and material removal. In processing the surfaces with complex shapes such as helical surface, the improvement in material removal and surface accuracy is limited,

[0008] For this reason, the inventors has studied and proceeded in-depth discussion, and actively seek approaches for many years engaged in the research and experiences of related industries and manufacturing. After long-term research and efforts in development, the inventors has finally the successfully developed this invention `a subtle vortex polishing apparatus` which overcomes the shortages in the prior art.

SUMMARY OF THE INVENTION

[0009] A main purpose of this invention is to provide a subtle vortex polishing apparatus in which the fluid abrasive in the receiving unit forms the eddy friction for polishing the workpiece and the deburring, polishing, chamfering for the workpiece can be finished in one time. Thereby, the grinding effect of the inner and outer surfaces of the workpiece enhances, and this invention can be thus used in processing small, bored, cracked, cambered complex surfaces, achieving the effects of easy operation, single-sided or multi-surface processing at the same time, increase in the processing rate, significant reduce in labor intensity, reduced processing costs and improved productivity.

[0010] In order to achieve the above and other objectives, the subtle vortex polishing apparatus of the invention includes a receiving unit; a stirring unit, movably provided in the receiving unit; and a transmission unit, connected to the stirring unit.

[0011] In one embodiment of the invention, the receiving unit includes a container body having at least one receiving area, a supporting part provided on a bottom of the container body, an upper lid movably coupled at one end of the container body, a placement area provided on a top of the upper lid, and a cover provided on a top of the upper lid and closing the placement area.

[0012] In one embodiment of the invention, the container body is of cylindrical shape.

[0013] In one embodiment of the invention, fluid abrasive is placed in the receiving area of the container body.

[0014] In one embodiment of the invention, a workpiece is placed on the supporting part of the container body.

[0015] In one embodiment of the invention, the stirring unit has a shaft body, and a plurality of blades located along the periphery at one end of the shaft body.

[0016] In one embodiment of the invention, the transmission unit includes an actuating element connected to the stirring unit, a power supply connected to the actuating element, and a switch connected to the actuating element and the power supply.

[0017] In one embodiment of the invention, the actuating element is a motor.

[0018] In one embodiment of the invention, the power supply unit is a battery, a rechargeable battery or connection a plug for home electricity.

[0019] In one embodiment of the invention, the transmission unit further comprises a timer connected to the actuating element and the switch, and an inverter connected to the timer and the power supply.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG. 1 is a schematic, perspective view of a subtle vortex polishing apparatus according to a first embodiment of the invention.

[0021] FIG. 2 is a schematic, exploded view of subtle vortex polishing apparatus according to a first embodiment of the invention.

[0022] FIG. 3 is schematic view of use status of a subtle vortex polishing apparatus according to a first embodiment of the invention.

[0023] FIG. 4 is a schematic, exploded perspective view of subtle vortex polishing apparatus according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] The aforementioned illustrations and following detailed descriptions are exemplary for the purpose of further explaining the scope of the present invention. Other objectives and advantages related to the present invention will be illustrated in the subsequent descriptions and appended tables.

[0025] FIG. 1 is a schematic, perspective view of a subtle vortex polishing apparatus according to a first embodiment of the invention. FIG. 2 is a schematic, exploded view of subtle vortex polishing apparatus according to a first embodiment of the invention. FIG. 3 is schematic view of use status of a subtle vortex polishing apparatus according to a first embodiment of the invention. As shown, the subtle vortex polishing apparatus of the present invention includes at least a receiving unit 1, a stiffing unit 2 and a transmission unit 3.

[0026] The above-mentioned receiving unit 1 includes a container body 11 having at least one receiving area 111, a supporting part 12 provided on a bottom of the container body 11, an upper lid 13 movably coupled at one end of the container body 11, a placement area 14 provided on a top of the upper lid 13, and a cover 15 provided on a top of the upper lid 13 and closing the placement area 14 The container body 11 is of cylindrical shape.

[0027] The stirring unit 2 is movably provided in the receiving unit 1, and has a shaft body 21, and a plurality of blades 22 located along the periphery at one end of the shaft body 21. The stirring unit 2 penetrates through the upper lid 13 via the shaft body 21 to movably locate in the container body 11 of the receiving area 111.

[0028] The transmission unit 3 is disposed in the placement area 14 of the upper lid 13 and is connected to the stirring unit 2 The transmission unit 3 includes an actuating element 31 connected to the shaft body 21 of the stirring unit 2, a power supply 32 connected to the actuating element 31, and a switch 33 connected to the actuating element 31 and the power supply 32. The actuating element 31 can be a motor. The power supply unit 21 can be a battery, a rechargeable battery or connection a plug for home electricity.

[0029] When the present invention is in use, one workpiece 4 to be polished is placed on the supporting part 12 of the container body 11 and fluid abrasive 5 is injected into the receiving area 111 of the container body 11. The switch 33 of the drive unit 3 is turned on so that the actuating member 31 drives the shaft body 21 of the stirring unit 2 to operate the individual blade 22 by the required electrical power from the power supply 32. Thereby each blade 22 agitates the fluid abrasive 5 to generate an eddy so that the fluid abrasive 5 polishes the workpiece 4 by friction. At this moment, with the use of the fluid abrasive 5, the workpiece 4 to be polished is subject to completely deburring, polishing and chamfering for the application to difficult processing on small, bored, cracked, cambered complex surfaces. As such, the grinding effect of polishing inner and outer surfaces of the workpiece 4.

[0030] FIG. 4 is a schematic, exploded perspective view of subtle vortex polishing apparatus according to a second embodiment of the present invention. As shown, the second embodiment is the same as the first embodiment, except in that the transmission unit 3 further includes a timer 34 connected to the actuating element 31 and the switch 33, and an inverter 35 connected to the timer 34 and the power supply 32.

[0031] The timer 34 allows users to fully understand the actuation time, set the polishing time as required, and automatically turns off after the set time. The inverter 35 can use a fixed voltage to change the power so as to control the rotational speed of the actuating element 31. Thereby, the present invention can be more in line with the requirement for the actual use.

[0032] In summary, the subtle vortex polishing apparatus of the invention can effectively improve various drawbacks in the prior art. The workpiece to be polished and the fluid abrasive are placed in the in the receiving unit. The stirring unit is driven by the transmission unit so that the fluid abrasive in the receiving unit forms the eddy friction for polishing the workpiece and the deburring, polishing, chamfering for the workpiece can be finished in one time. Thereby, the grinding effect of the inner and outer surfaces of the workpiece enhances, and this invention can be thus used in processing small, bored, cracked, cambered complex surfaces, achieving the effects of easy operation, single-sided or multi-surface processing at the same time, increase in the processing rate, significant reduce in labor intensity, reduced processing costs and improved productivity. This makes the invention more progressive and more practical in use which complies with the patent law.

[0033] The descriptions illustrated supra set forth simply the preferred embodiments of the present invention; however, the characteristics of the present invention are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the present invention delineated by the following claims.

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