U.S. patent application number 14/172280 was filed with the patent office on 2014-08-07 for cooling assembly.
This patent application is currently assigned to ABB Oy. The applicant listed for this patent is ABB Oy. Invention is credited to Timo Koivuluoma, Jaakko Lehto, Jorma MANNINEN.
Application Number | 20140216681 14/172280 |
Document ID | / |
Family ID | 47632910 |
Filed Date | 2014-08-07 |
United States Patent
Application |
20140216681 |
Kind Code |
A1 |
MANNINEN; Jorma ; et
al. |
August 7, 2014 |
COOLING ASSEMBLY
Abstract
A cooling assembly includes a device chamber, a cooling chamber
separated from the device chamber, a heat exchanger, a device
chamber fan arrangement and a control unit. The heat exchanger
includes a first portion located in the device chamber and a second
portion located in the cooling chamber for transferring heat from
the device chamber to the cooling chamber. The device chamber fan
arrangement is configured to generate a device chamber cooling
medium flow including a first partial flow interacting with the
first portion of the heat exchanger. The cooling assembly also
includes a first throttle arrangement for regulating the first
partial flow. The control unit is configured to reduce a cooling
power of the heat exchanger as a response to predetermined
operating conditions by decreasing the first partial flow with the
first throttle arrangement.
Inventors: |
MANNINEN; Jorma; (Vantaa,
FI) ; Koivuluoma; Timo; (Vantaa, FI) ; Lehto;
Jaakko; (Helsinki, FI) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ABB Oy |
Helsinki |
|
FI |
|
|
Assignee: |
ABB Oy
Helsinki
FI
|
Family ID: |
47632910 |
Appl. No.: |
14/172280 |
Filed: |
February 4, 2014 |
Current U.S.
Class: |
165/11.1 ;
165/96 |
Current CPC
Class: |
H01H 2009/523 20130101;
H05K 7/20618 20130101; H05K 7/206 20130101; F25B 2700/02 20130101;
F25D 21/04 20130101; F28D 2021/0028 20130101; F28F 27/00 20130101;
F25B 2700/2103 20130101 |
Class at
Publication: |
165/11.1 ;
165/96 |
International
Class: |
F28F 27/00 20060101
F28F027/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 4, 2013 |
EP |
13153787.0 |
Claims
1. A cooling assembly comprising: a device chamber; a cooling
chamber separated from the device chamber; a heat exchanger; device
chamber fan means; and control means, wherein: the heat exchanger
comprises a first portion located in the device chamber and a
second portion located in the cooling chamber for transferring heat
from the device chamber to the cooling chamber; the device chamber
fan means are configured to generate a device chamber cooling
medium flow including a first partial flow interacting with the
first portion of the heat exchanger; the cooling assembly comprises
first throttle means for regulating the first partial flow; the
control means are configured to reduce a cooling power of the heat
exchanger as a response to predetermined operating conditions by
decreasing the first partial flow with the first throttle
means.
2. A cooling assembly according to claim 1, wherein the cooling
assembly comprises a humidity sensor configured to detect a
humidity level in the device chamber, and wherein the predetermined
operating conditions comprise a situation where the humidity sensor
detects a humidity level exceeding a predetermined threshold value
in the device chamber.
3. A cooling assembly according to claim 2, wherein the cooling
assembly comprises a temperature sensor configured to detect a
temperature in the device chamber, and wherein the predetermined
operating conditions comprise a situation where the temperature
sensor detects a temperature below a predetermined threshold value
in the device chamber.
4. A cooling assembly according to claim 1, wherein the cooling
assembly comprises a temperature sensor configured to detect a
temperature in the device chamber, and wherein the predetermined
operating conditions comprise a situation where the temperature
sensor detects a temperature below a predetermined threshold value
in the device chamber.
5. A cooling assembly according to claim 1, wherein the first
throttle means are configured to regulate the first partial flow by
adjusting a bypass flow of the cooling medium, the bypass flow
being a portion of the device chamber cooling medium flow that
bypasses the first portion of the heat exchanger without
interaction.
6. A cooling assembly according to claim 1, wherein the first
throttle means comprise a generally planar first valve plate
configured to pivot about a pivoting axis extending substantially
parallel to a plane defined by the first valve plate.
7. A cooling assembly according to claim 1, wherein the first
throttle means comprise a cylindrical valve whose valve surface has
a general form of a cylindrical segment, the valve surface being
configured to pivot about a pivoting axis extending substantially
parallel to an axis of the cylindrical segment.
8. A cooling assembly according to claim 1, wherein the first
throttle means comprise a first adjustable grill with a plurality
of louvers.
9. A cooling assembly according to claim 1, wherein the first
portion of the heat exchanger is in an operating situation located
lower than the second portion of the heat exchanger.
10. A cooling assembly according to claim 9, wherein the heat
exchanger comprises a passive heat exchanger.
11. A cooling assembly according to claim 10, wherein the heat
exchanger comprises a thermosyphon heat exchanger.
12. A cooling assembly according to claim 1, comprising: second
throttle means for regulating a cooling chamber cooling medium flow
interacting with the second portion of the heat exchanger, wherein
the control means are configured to reduce a cooling power of the
heat exchanger as a response to predetermined operating conditions
by decreasing the cooling chamber cooling medium flow with the
second throttle means.
13. A cooling assembly according to claim 1, comprising: an
electrical apparatus in the device chamber, the electrical
apparatus having apparatus cooling fan means configured for cooling
the electrical apparatus, the apparatus cooling fan means
constituting at least part of the device chamber fan means.
14. A cooling assembly according to claim 13, wherein the device
chamber fan means consists of the apparatus cooling fan means.
15. A cooling assembly according to claim 13, wherein the
electrical apparatus comprises one of a frequency converter and an
inverter.
Description
RELATED APPLICATION
[0001] This application claims priority under 35 U.S.C. .sctn.119
to European Patent Application No. 13153787.0 filed in Europe on
February 4, 2013, the entire content of which is hereby
incorporated by reference in its entirety.
FIELD
[0002] The present disclosure relates to a cooling assembly
including a heat exchanger for transferring heat from a device
chamber.
BACKGROUND INFORMATION
[0003] Humidity is harmful to many electronic components. Humidity
is an issue, for example, in solar power plants and wind power
plants. Challenging environments such as tropical or arctic
climates increase problems caused by humidity.
[0004] In a known cooling assembly, heating of a device chamber is
used to prevent excessive humidity. It is also known to use water
absorbing materials such as silica gel to remove humidity from a
device chamber.
[0005] Preventing humidity by means of heating induces extra cost.
Water absorbing materials are also expensive and their useful life
is limited thereby further increasing cost.
SUMMARY
[0006] An exemplary embodiment of the present disclosure provides a
cooling assembly which includes a device chamber, a cooling chamber
separated from the device chamber, a heat exchanger, device chamber
fan means, and control means. The heat exchanger includes a first
portion located in the device chamber and a second portion located
in the cooling chamber for transferring heat from the device
chamber to the cooling chamber. The device chamber fan means are
configured to generate a device chamber cooling medium flow
including a first partial flow interacting with the first portion
of the heat exchanger. The exemplary cooling assembly also includes
first throttle means for regulating the first partial flow. The
control means are configured to reduce a cooling power of the heat
exchanger as a response to predetermined operating conditions by
decreasing the first partial flow with the first throttle
means.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Additional refinements, advantages and features of the
present disclosure are described in more detail below with
reference to exemplary embodiments illustrated in the drawings, in
which:
[0008] FIG. 1 shows a cooling assembly according to an exemplary
embodiment of the present disclosure;
[0009] FIG. 2 shows a cooling assembly according to an exemplary
embodiment of the present disclosure; and
[0010] FIG. 3 shows a cooling assembly according to an exemplary
embodiment of the present disclosure.
DETAILED DESCRIPTION
[0011] Exemplary embodiments of the present disclosure provide a
cooling assembly which is capable of alleviating disadvantages
caused by humidity.
[0012] Exemplary embodiments of the present disclosure are based on
the idea of decreasing in predetermined operating conditions a
relative humidity level in a device chamber by reducing a cooling
power of a heat exchanger configured to transfer heat from the
device chamber. The cooling power is reduced by a first throttle
means capable of regulating a first partial flow of a cooling
medium interacting with a first portion of the heat exchanger
located in the device chamber. Exemplary embodiments of the present
disclosure improve controllability of a heat exchanger by lowering
a minimum cooling power of the heat exchanger. Decreasing cooling
power of the heat exchanger raises the temperature in a device
chamber thereby reducing relative humidity.
[0013] An advantage of the cooling assembly of the present
disclosure is that a relative humidity level inside a device
chamber can be decreased with a very small operating cost.
[0014] FIG. 1 shows a cooling assembly including a device chamber
2, a cooling chamber 4, a heat exchanger 3, device chamber fan
means, control means 6 (e.g., a computer processor configured to
execute a computer program and/or computer-readable instructions
tangibly recorded on a non-transitory computer-readable recording
medium, such as a non-volatile memory), a humidity sensor 61, a
temperature sensor 62, first throttle means 81, and an electrical
apparatus 102. The cooling chamber 4 is separated from the device
chamber 2. The heat exchanger 3 includes a first portion 31 located
in the device chamber 2 and a second portion 32 located in the
cooling chamber 4 for transferring heat from the device chamber 2
to the cooling chamber 4. The first portion 31 of the heat
exchanger is in an operating situation located lower than the
second portion 32 of the heat exchanger.
[0015] The device chamber fan means are configured to generate a
device chamber cooling medium flow including a first partial flow
interacting with the first portion 31 of the heat exchanger 3. As
used herein, interaction between a cooling medium flow and a heat
exchanger means heat transfer between the cooling medium flow and
the heat exchanger. The first throttle means 81 are configured for
regulating the first partial flow. The humidity sensor 61 is
configured to detect a humidity level in the device chamber 2. The
temperature sensor 62 is configured to detect a temperature in the
device chamber 2.
[0016] The control means 6 are configured to reduce a cooling power
of the heat exchanger 3 as a response to predetermined operating
conditions by decreasing the first partial flow with the first
throttle means 81. The first throttle means 81 are configured to
regulate the first partial flow by adjusting a bypass flow of the
cooling medium. The bypass flow is a portion of the device chamber
cooling medium flow that bypasses the first portion 31 of the heat
exchanger 3 without interaction. The predetermined operating
conditions including a situation where the humidity sensor 61
detects a humidity level exceeding a predetermined threshold value
in the device chamber 2, and a situation where the temperature
sensor 62 detects a temperature below a predetermined threshold
value in the device chamber 2. In accordance with an exemplary
embodiment, a predetermined condition is defined as a function of
humidity and temperature.
[0017] A wall 22 separates a first flow channel 71 from a second
flow channel 72. The first portion 31 of the heat exchanger 3 is
located in the first flow channel 71. The second flow channel 72
extends between the electrical apparatus 102 and the wall 22
bypassing the first portion 31 of the heat exchanger 3. There is an
opening 24 in the wall 22 providing a passage between the first
flow channel 71 and the second flow channel 72. According to an
exemplary embodiment, the first throttle means 81 include a
generally planar first valve plate 812 configured to pivot about a
pivoting axis extending substantially parallel to a plane defined
by the first valve plate 812. The pivoting axis passes through a
lower edge of the first valve plate 812. The first valve plate 812
has a closed position and an open position. In the closed position,
the first valve plate 812 closes the opening 24 in the wall 22. In
FIG. 1, the closed position of the first valve plate 812 is
depicted with a dashed line. In the open position, the first valve
plate 812 allows a bypass flow of the cooling medium from the first
flow channel 71 to the second flow channel 72 through the opening
24. In FIG. 1, the first valve plate 812 is in the open
position.
[0018] In accordance with an exemplary embodiment, the first valve
plate 812 only has two positions, the open position and the closed
position. In other exemplary embodiments, the first throttle means
may have more than two positions including at least one
intermediate position between an open position and a closed
position. Alternatively, the control means may be configured to
alternate the position of the first throttle means between an open
position and a closed position in order to provide an average
bypass flow of the cooling medium smaller than the bypass flow
corresponding to the open position of the first throttle means.
[0019] According to an exemplary embodiment, the heat exchanger 3
is a cothex type heat exchanger. A cothex is a thermosyphon heat
exchanger where a cooling medium circulates by means of natural
convection without a mechanical pump. In another exemplary
embodiment, a heat exchanger configured to transfer heat from the
device chamber to the cooling chamber may include another type of
passive heat exchanger, or an active heat exchanger.
[0020] The electrical apparatus 102 is provided with apparatus
cooling fan means 51 (e.g., at least one fan) located inside a
housing of the electrical apparatus 102 and configured for cooling
the electrical apparatus 102. In the embodiment of FIG. 1, the
device chamber fan means includes the apparatus cooling fan means
51.
[0021] One skilled in the art understands that relative humidity in
the device chamber 2 could be slightly decreased by reducing power
of apparatus cooling fan means 51. However, reducing a power of the
apparatus cooling fan means 51 could lead to unfavourable heat
distribution inside the electrical apparatus 102. Further, reducing
a power of apparatus cooling fan means 51 could in fact increase
relative humidity in some parts of the device chamber 2.
[0022] In another exemplary embodiment, the device chamber fan
means can include at least one fan not belonging to the apparatus
cooling fan means but specifically configured to generate a device
chamber cooling medium flow. Such at least one fan may be located
separately from the electrical apparatus.
[0023] In accordance with an exemplary embodiment, the electrical
apparatus 102 includes a frequency converter. In another exemplary
embodiment, an electrical apparatus located in the device chamber
may include an inverter or some other heat generating apparatus
that requires cooling.
[0024] In the exemplary embodiment of FIG. 1, the device chamber
cooling medium flow always includes some bypass flow of the cooling
medium irrespective of operation of the first throttle means 81. In
the closed position of the first valve plate 812, a bypass flow
passes through the second flow channel 72 and a third flow channel
73 extending between the electrical apparatus 102 and an inner wall
of the device chamber 2.
[0025] In accordance with another exemplary embodiment, a closed
position of first throttle means substantially prevents a bypass
flow of the cooling medium. The bypass flow is a portion of the
device chamber cooling medium flow that bypasses the first portion
of the heat exchanger without interaction. For example, blocking
the second flow channel 72 and the third flow channel 73 in the
cooling assembly of FIG. 1 would provide such an embodiment.
[0026] The cooling assembly further includes second throttle means
82 and cooling chamber fan means 52 (e.g., at least one fan and/or
a ventilation arrangement) for regulating a cooling chamber cooling
medium flow interacting with the second portion 32 of the heat
exchanger 3. The control means 6 are configured to reduce a cooling
power of the heat exchanger 3 as a response to predetermined
operating conditions by decreasing the cooling chamber cooling
medium flow by controlling the second throttle means 82 and the
cooling chamber fan means 52.
[0027] The device chamber 2 is separated from the cooling chamber 4
such that there is substantially no cooling medium flow between the
device chamber 2 and the cooling chamber 4. Therefore,
substantially no contaminant particles can pass from the cooling
chamber 4 into the device chamber 2. According to an exemplary
embodiment, the cooling medium in the cooling chamber 4 as well as
in the device chamber 2 is air.
[0028] A wall 42 separates a first portion 401 of the cooling
chamber 4 from a second portion 402 of the cooling chamber 4. The
first portion 401 of the cooling chamber 4 includes the second
portion 32 of the heat exchanger 3. The second portion 402 of the
cooling chamber 4 includes the cooling chamber fan means 52. The
second portion 402 is in an operating situation located above the
first portion 401. There is an opening 44 in the wall 42 providing
a passage between the first portion 401 of the cooling chamber 4
and the second portion 402 of the cooling chamber 4.
[0029] According to an exemplary embodiment, the second throttle
means 82 include a generally planar second valve plate 822
configured to pivot about a pivoting axis extending substantially
parallel to a plane defined by the second valve plate 822. The
pivoting axis passes through an upper edge of the second valve
plate 822. The second valve plate 822 has a closed position and an
open position. In the closed position, the second valve plate 822
closes the opening 44 in the wall 42. In FIG. 1, the closed
position of the second valve plate 822 is depicted with a dashed
line. In the open position depicted in FIG. 1, the second valve
plate 822 allows a flow of cooling medium from the first portion
401 of the cooling chamber 4 to the second portion 402 of the
cooling chamber 4 through the opening 44. The open position of the
second valve plate 822 increases a cooling power of the heat
exchanger 3 compared to the closed position of the second valve
plate 822, because a lower part of the first portion 401 of the
cooling chamber 4 and the second portion 402 of the cooling chamber
4 include openings allowing the cooling medium to flow between
exterior of the cooling assembly and the cooling chamber 4.
Consequently, the open position of the second valve plate 822
induces a draught in the cooling chamber 4 during operation of the
cooling assembly.
[0030] When the control means 6 detect an operating condition that
requires or allows reducing cooling power of the heat exchanger 3,
the control means 6 turns off the cooling chamber fan means 52. If
the turning off of the cooling chamber fan means 52 does not reduce
a cooling power of the heat exchanger 3 enough the control means 6
opens the first valve plate 812 and/or closes the second valve
plate 822.
[0031] In the embodiment of FIG. 1, the first throttle means 81
include only one valve member, namely the first valve plate 812. In
another exemplary embodiment, first throttle means may include a
plurality of valve members. For example, FIG. 2 shows a cooling
assembly in which first throttle means 81' include a first
adjustable grill 816' and a second adjustable grill 836'. The first
adjustable grill 816' includes a plurality of louvers 861', and the
second adjustable grill 836' includes a plurality of louvers
862'.
[0032] The first adjustable grill 816' is located in an opening 24'
in a wall 22', and is configured to regulate a cooling medium flow
through the opening 24'. The second adjustable grill 836' is
located adjacent to an upper surface of the first portion 31' of
the heat exchanger 3'. The control means 6' are configured to
control both the first adjustable grill 816' and the second
adjustable grill 836'. A first partial flow interacting with the
first portion 31' of the heat exchanger 3' is minimized by an open
position of the first adjustable grill 816' and a closed position
of the second adjustable grill 836'. The first partial flow is
maximized by a closed position of the first adjustable grill 816'
and an open position of the second adjustable grill 836'.
[0033] The control means 6' are configured to steplessly control
the first adjustable grill 816' and the second adjustable grill
836'. In FIG. 2, both the first adjustable grill 816' and the
second adjustable grill 836' are in an intermediate position
between an open and closed position.
[0034] A type of valve member of the first throttle means and
second throttle means is not limited to a planar valve plate and an
adjustable grill. FIG. 3 shows a cooling assembly in which first
throttle means 81'' include a cylindrical valve 814'' whose valve
surface has a general form of a cylindrical segment. The valve
surface of the cylindrical valve 814'' is configured to pivot about
a pivoting axis extending substantially parallel to an axis of the
cylindrical segment. The control means 6'' are configured to
steplessly control the cylindrical valve 814''.
[0035] It should be noticed that although both second throttle
means 82' of FIG. 2 and second throttle means 82'' of FIG. 3
include a generally planar second valve plate, the second throttle
means may alternatively include an adjustable grill, a cylindrical
valve, or any other suitable valve member.
[0036] Except for the first throttle means, the cooling assemblies
of FIGS. 1 to 3 are quite similar. The only further significant
difference relates to a wall separating a first flow channel from a
second flow channel. For example, in the cooling assembly of FIG.
3, the segments of wall 22'' located adjacent the cylindrical valve
814'' are inclined towards the cylindrical valve 814'' in order to
better co-operate with it. The wall segments have been inclined
because of a relatively long radius of the cylindrical valve 814''
and a relatively short distance between a wall 22'' and an
electrical apparatus 102''.
[0037] In accordance with an exemplary embodiment, a cooling
assembly includes heating means (e.g., a heater) for heating the
device chamber. In this embodiment, the control means are
configured to decrease the first partial flow with the first
throttle means when the heating means are in use. Such operation
improves efficiency of the heating by reducing heat loss from the
device chamber.
[0038] It will be appreciated by those skilled in the art that the
present invention can be embodied in other specific forms without
departing from the spirit or essential characteristics thereof. The
presently disclosed embodiments are therefore considered in all
respects to be illustrative and not restricted. The scope of the
invention is indicated by the appended claims rather than the
foregoing description and all changes that come within the meaning
and range and equivalence thereof are intended to be embraced
therein.
* * * * *