U.S. patent application number 14/165171 was filed with the patent office on 2014-07-24 for antenna pattern frame, case of electronic device and mould for manufacturing the same.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Chan Gwang AN, Sang Woo BAE, Ki Won CHANG, Sung Eun CHO, Chang Mok HAN, Ha Ryong HONG, Dae Kyu LEE, Duk Woo LEE, Jae Suk SUNG.
Application Number | 20140205708 14/165171 |
Document ID | / |
Family ID | 44140990 |
Filed Date | 2014-07-24 |
United States Patent
Application |
20140205708 |
Kind Code |
A1 |
HONG; Ha Ryong ; et
al. |
July 24, 2014 |
ANTENNA PATTERN FRAME, CASE OF ELECTRONIC DEVICE AND MOULD FOR
MANUFACTURING THE SAME
Abstract
There is provided an antenna pattern frame, including: a
radiator that includes an antenna pattern part transmitting and
receiving signals and a connection terminal part transmitting and
receiving the signals to and from a circuit substrate of an
electronic device; and a radiator frame that embeds the antenna
pattern part in a case of the electronic device and supports the
radiator, the radiator being manufactured by injection molding,
wherein the radiator frame forms a guide boss inserted into a
manufacturing mould for injection-molding the case of the
electronic device in which the radiator is embedded.
Inventors: |
HONG; Ha Ryong; (Hwaseong,
KR) ; CHO; Sung Eun; (Suwon, KR) ; LEE; Duk
Woo; (Suwon, KR) ; LEE; Dae Kyu; (Suwon,
KR) ; AN; Chan Gwang; (Suwon, KR) ; SUNG; Jae
Suk; (Yongin, KR) ; CHANG; Ki Won; (Suwon,
KR) ; HAN; Chang Mok; (Cheonan, KR) ; BAE;
Sang Woo; (Suwon, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Suwon |
|
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Suwon
KR
|
Family ID: |
44140990 |
Appl. No.: |
14/165171 |
Filed: |
January 27, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13022117 |
Feb 7, 2011 |
|
|
|
14165171 |
|
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|
Current U.S.
Class: |
425/577 ;
425/542 |
Current CPC
Class: |
B29C 45/14065 20130101;
B29C 45/2606 20130101; B29L 2031/3437 20130101; B29L 2031/3481
20130101; H01Q 1/243 20130101; B29L 2031/3431 20130101; B29C
45/14639 20130101; H01Q 9/42 20130101; B29L 2031/3456 20130101;
H01Q 1/2266 20130101; B29C 45/1671 20130101 |
Class at
Publication: |
425/577 ;
425/542 |
International
Class: |
B29C 45/26 20060101
B29C045/26 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 25, 2010 |
KR |
10-2010-0017246 |
Claims
1-11. (canceled)
12. A mould for manufacturing an antenna pattern frame, comprising:
upper and lower moulds receiving a radiator that includes an
antenna pattern part transmitting and receiving signals, a
connection terminal part connected to a circuit substrate of an
electronic device, and a connection part connecting the antenna
pattern part to the connection terminal part; and when the upper
and lower moulds are combined with each other, a resin material
introducing part formed in any one of the upper, lower, or upper
and lower moulds to introduce a resin material into an inner space
so that the inner space of the upper and lower moulds becomes the
radiator frame to embed the antenna pattern part in the case of the
electronic device, wherein the lower mould includes a guide groove
so that the radiator frame includes a guide boss that is inserted
into the manufacturing mould for injection-molding the case of the
electronic device and the radiator is the radiator frame by the
inner space.
13. The mould for manufacturing an antenna pattern frame of claim
12, wherein the lower mould includes a protruding part
corresponding to the slot part in the guide groove to form a slot
part in the guide boss.
14. The mould for manufacturing an antenna pattern frame of claim
12, wherein any one of the upper, lower, or upper and lower moulds
includes an interrupting boss that prevents the resin material from
being introduced in order to form an introducing hole for
introducing the resin material on the antenna pattern frame when
the case of the electronic device is injection-molded.
15. The mould for manufacturing an antenna pattern frame of claim
12, wherein the inner space of the upper and lower moulds receives
the connection terminal part and includes a radiator supporting
part forming groove in order to form the radiator supporting part
supporting the connection terminal part.
16. The mould for manufacturing an antenna pattern frame of claim
12, wherein any one of the upper, lower or upper and lower moulds
is provided with a compression pin that compresses the connection
terminal part disposed in the radiator supporting part forming
groove.
17. A mould for manufacturing a case of an electronic device,
comprising: upper and lower moulds that receive a radiator
including an antenna pattern part transmitting or receiving
signals, a radiator including a connection terminal part contacting
a circuit substrate of an electronic device, a radiator frame
supporting the radiator, and an antenna pattern frame including a
guide boss formed to be protruded from one surface of the radiator
frame; and when the upper and lower moulds are combined with each
other, a resin material introducing part formed in any one of the
upper, lower, or upper and lower moulds to form a case of an
electronic device by combining the antenna pattern frame with the
resin material due to the introduction of the resin material in the
inner space of the upper and lower moulds; wherein the lower mould
includes a guide groove formed to insert the guide boss and the
antenna pattern frame is the case of the electronic device by the
inner space.
18. The mould for manufacturing the case of the electronic device
of claim 17, wherein the guide groove includes the guide boss
receiving part to fix and support the guide boss.
19. The mould for manufacturing the case of the electronic device
of claim 18, wherein the guide boss receiving part is configured of
a variable part having a diameter larger than that of the guide
boss and a fixing part having a diameter smaller than that of the
variable part.
20. The mould for manufacturing the case of the electronic device
of claim 19, wherein the variable part receives the guide boss by
being protruded to the upper portion of the lower mould before the
guide boss is inserted, and is inserted into the guide groove of
the lower mould after the guide boss is received.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the priority of Korean Patent
Application No. 10-2010-0017246 filed on Feb. 25, 2010, in the
Korean Intellectual Property Office, the disclosure of which is
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an antenna pattern frame, a
case of an electronic device, and a mould for manufacturing the
same, and more particularly, to an antenna pattern frame having an
antenna radiator formed on the surface thereof so that the antenna
radiator is embedded in a case of an electronic device, a case of
an electronic device, and a mould for manufacturing the same.
[0004] 2. Description of the Related Art
[0005] Mobile communication terminals, for example, cellular
phones, PDAs, navigation devices, notebook computers, or the like,
that are used to support wireless communication are necessities in
modern society. Mobile communication terminals are being developed
to have functions, such as CDMA, wireless LAN, GSM, DMB, or the
like. One of the most important parts that enable these functions
is an antenna.
[0006] The antenna used in the mobile communication terminal has
devolved from an exterior type antenna such as a rod antenna or a
helical antenna to an interior type antenna where an antenna is
mounted in the terminal.
[0007] There have, however, been problems, in that the exterior
type antenna is vulnerable to external impacts and the interior
type antenna increases the volume of the terminal.
[0008] In order to solve the problems, a research to integrate the
mobile communication terminal and the antenna has been actively
conducted.
SUMMARY OF THE INVENTION
[0009] An aspect of the present invention provides an antenna
pattern frame having an antenna radiator formed on the surface
thereof and a case of an electronic device in which the antenna
radiator is embedded.
[0010] Another aspect of the present invention provides a mould for
manufacturing an antenna pattern frame and a case of an electronic
device in which an antenna radiator is embedded.
[0011] Another aspect of the present invention reduces an
appearance defect by stably fixing an antenna pattern frame to a
mould for manufacturing a case of an electronic device when molding
the case of the electronic device in which an antenna radiator is
embedded.
[0012] According to an aspect of the present invention, there is
provided an antenna pattern frame, including: a radiator that
includes an antenna pattern part transmitting and receiving signals
and a connection terminal part transmitting and receiving the
signals to and from a circuit substrate of an electronic device;
and a radiator frame that embeds the antenna pattern part in a case
of the electronic device and supports the radiator, the radiator
being manufactured by injection molding, wherein the radiator frame
forms a guide boss inserted into a manufacturing mould for
injection-molding the case of the electronic device in which the
radiator is embedded.
[0013] The guide boss may include a slot part therein so that it is
elastically supported and fixed to the manufacturing mould.
[0014] The radiator frame includes an introducing hole formed to
introduce a resin material when injection-molding the case of the
electronic device.
[0015] The radiator may include a connection part that is a part of
the radiator and connects the antenna pattern part to the
connection terminal part, and the connection part may be formed so
that the antenna pattern part is formed on one surface of the
radiator frame and the connection terminal part is formed on an
opposite surface to the one surface.
[0016] The connection terminal part may contact and support the
radiator supporting part that is protruded from the opposite
surface of the one surface on which the antenna pattern part of the
radiator frame is formed.
[0017] According to another aspect of the present invention, there
is provided a case of an electronic device, including:
[0018] a radiator that includes an antenna pattern part
transmitting and receiving signals and a connection terminal part
transmitting and receiving the signals to and from a circuit
substrate of an electronic device; a radiator frame including a
guide boss that supports and fixes the radiator and is inserted in
the manufacturing mould for injection-molding the case of the
electronic device in which the radiator is embedded, the radiator
being manufactured by injection molding; and a case frame that
covers one surface of the radiator frame to embed the antenna
pattern part between the radiator frames.
[0019] The guide boss may include a slot part so that it is
elastically supported and fixed to the manufacturing mould.
[0020] The radiator frame may include an introducing hole formed to
introduce a resin material when injection-molding the case of the
electronic device.
[0021] The introducing hole may be formed to integrate a resin
material introduced through the introducing hole with the guide
boss.
[0022] The connection part may be formed so that the antenna
pattern part is formed on one surface of the radiator frame and the
connection terminal part may be formed on an opposite surface to
the one surface.
[0023] The connection terminal part may contact and support the
radiator supporting part that is protruded from the opposite
surface of the one surface on which the antenna pattern part of the
radiator frame is formed.
[0024] According to another aspect of the present invention, there
is provided a mould for manufacturing an antenna pattern frame,
including: upper and lower moulds receiving a radiator that
includes an antenna pattern part transmitting and receiving
signals, a connection terminal part connected to a circuit
substrate of an electronic device, and a connection part connecting
the antenna pattern part to the connection terminal parts; and when
the upper and lower moulds are combined with each other, a resin
material introducing part formed in any one of the upper, lower, or
upper and lower moulds to introduce a resin material into an inner
space so that the inner space of the upper and lower moulds becomes
the radiator frame to embed the antenna pattern part in the case of
the electronic device, wherein the lower mould includes a guide
groove so that the radiator frame includes a guide boss that is
inserted into the manufacturing mould for injection-molding the
case of the electronic device and the radiator is the radiator
frame by the inner space.
[0025] The lower mould may include a protruding part corresponding
to the slot part in the guide groove to form a slot part in the
guide boss.
[0026] Any one of the upper, lower, or upper and lower moulds may
include an interrupting boss that prevents the resin material from
being introduced in order to form an introducing hole for
introducing the resin material on the antenna pattern frame when
the case of the electronic device is injection-molded.
[0027] The inner space of the upper and lower moulds may receive
the connection terminal part and may include a radiator supporting
part forming groove in order to form the radiator supporting part
supporting the connection terminal part.
[0028] Any one of the upper, lower or upper and lower moulds may be
provided with a compression pin that compresses the connection
terminal part disposed in the radiator supporting part forming
groove.
[0029] According to another aspect of the present invention, there
is provided a mould for manufacturing a case of an electronic
device, including: upper and lower moulds that receive a radiator
including an antenna pattern part transmitting or receiving
signals, a radiator including a connection terminal part contacting
a circuit substrate of an electronic device, a radiator frame
supporting the radiator, and an antenna pattern frame including a
guide boss formed to be protruded from one surface of the radiator
frame; when the upper and lower moulds are combined with each
other, a resin material introducing part formed in any one of the
upper, lower, or upper and lower moulds to forma case of an
electronic device by combining the antenna pattern frame with the
resin material due to the introduction of the resin material in the
inner space of the upper and lower moulds; and wherein the lower
mould includes a guide groove formed to insert the guide boss and
the antenna pattern frame is the case of the electronic device by
the inner space.
[0030] The guide groove may include the guide boss receiving part
to fix and support the guide boss.
[0031] The guide boss receiving part is configured of a variable
part having a diameter larger than that of the guide boss and a
fixing part having a diameter smaller than that of the variable
part.
[0032] The variable part may receive the guide boss by being
protruded to the upper portion of the lower mould before the guide
boss is inserted, and may be inserted into the guide groove of the
lower mould after the guide boss is received.
BRIEF DESCRIPTION OF THE DRAWINGS
[0033] The above and other aspects, features and other advantages
of the present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0034] FIG. 1 is a perspective view schematically showing a
partially cutaway case of an electronic device, a mobile
communication terminal according to an exemplary embodiment of the
present invention;
[0035] FIG. 2 is a perspective view schematically showing a
radiator used in manufacturing an antenna pattern frame according
to an exemplary embodiment of the present invention;
[0036] FIG. 3 is a perspective view schematically showing an
antenna pattern frame according to an exemplary embodiment of the
present invention;
[0037] FIG. 4 is a rear perspective view of the antenna pattern
frame of FIG. 3;
[0038] FIG. 5A is a schematic cross-sectional view taken along line
A-A of FIGS. 3 and 4;
[0039] FIG. 5B is a schematic cross-sectional view showing a shape
where a resin material is filled in a mould for manufacturing the
antenna pattern frame in order to manufacture the antenna pattern
frame of FIG. 5A;
[0040] FIG. 6A is a schematic cross-sectional view showing an
antenna pattern frame according to another exemplary embodiment of
the present invention;
[0041] FIG. 6B is a schematic cross-sectional view showing a shape
where the resin material is filled in a mould for manufacturing the
antenna pattern frame in order to manufacture the antenna pattern
frame of FIG. 6A;
[0042] FIG. 7A is a schematic cross-sectional view showing an
antenna pattern frame according to another exemplary embodiment of
the present invention;
[0043] FIG. 7B is a schematic cross-sectional view showing a shape
where a resin material is filled in a mould for manufacturing the
antenna pattern frame in order to manufacture the antenna pattern
frame of FIG. 7A;
[0044] FIG. 8 is an exploded perspective view of a case of an
electronic device, a mobile communication terminal according to an
exemplary embodiment of the present invention in which the antenna
pattern radiator is embedded;
[0045] FIG. 9 is a schematic diagram showing a method for
manufacturing the case of the electronic device according to an
exemplary embodiment of the present invention in which the antenna
pattern radiator is embedded; and
[0046] FIGS. 10A to 13B are schematic cross-sectional views showing
a process of inserting the antenna pattern radiator into the mould
for manufacturing the electronic device and a shape where the resin
material is filled in order to manufacture the case of the
electronic device according to the first through fourth embodiments
of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0047] Exemplary embodiments of the present invention will now be
described in detail with reference to the accompanying drawings.
However, it should be noted that the spirit of the present
invention is not limited to the embodiments set forth herein and
those skilled in the art and understanding the present invention
can easily accomplish retrogressive inventions or other embodiments
included in the spirit of the present invention by the addition,
modification, and removal of components within the same spirit, but
those are construed as being included in the spirit of the present
invention.
[0048] Further, throughout the drawings, the same or similar
reference numerals will be used to designate the same components or
like components having the same functions in the scope of the
similar idea.
[0049] FIG. 1 is a perspective view schematically showing a
partially cutaway case of an electronic device, a mobile
communication terminal according to an exemplary embodiment of the
present invention, FIG. 2 is a perspective view schematically
showing a radiator used in manufacturing. an antenna pattern frame
according to an exemplary embodiment of the present invention, FIG.
3 is a perspective view schematically showing an antenna pattern
frame according to an exemplary embodiment of the present
invention, and FIG. 4 is a rear perspective view of the antenna
pattern frame of FIG. 3.
[0050] Referring to FIGS. 1 through 4, it can be appreciated that a
radiator 250 provided with an antenna pattern according to an
exemplary embodiment of the present invention is embedded in a case
110 of a mobile communication terminal 100. In order to form the
radiator 250 provided with the antenna pattern in the inside of the
case 110, an antenna pattern frame 200 that forms the radiator 250
provided with the antenna pattern on a radiator frame 230 is
needed.
[0051] The antenna pattern frame 200 according to an exemplary
embodiment of the present invention may include the radiator 250
provided with an antenna pattern part 210, a connection terminal
part 220, the radiator frame 230, and a guide boss 240.
[0052] The radiator 250 is made of a conductive material such as
aluminum, copper, or the like, to receive external signals and to
transmit them to a signal processing unit in the electronic device
such as the mobile communication terminal 100. Further, the
radiator 250 may include the antenna pattern part 210 forming a
meander line in order to receive the external signals of various
bands.
[0053] The radiator 250 in which the antenna pattern part 210
receiving the external signals and the connection terminal part 220
contacting a circuit substrate of the electronic device to transmit
the external signals to the electronic device are disposed on a
different plane may be provided.
[0054] Further, the radiator 250 may be formed to have a
three-dimensional structure by bending the antenna pattern part 210
and the connection terminal part 220, respectively, and the antenna
pattern part 210 and the connection terminal part 220 may be bent
and connected to each other by a bending connection part 256.
[0055] The bending connection part 256 may configure the antenna
pattern part 210 and the connection terminal part 220 on a
different plane and the connection terminal part 220 that is not
embedded in the case of the electronic device may be exposed at an
opposite surface 210b of the antenna pattern frame 200.
[0056] In other words, the antenna pattern part 210 and the
connection terminal part 220 are bent by the bending connection
part 256, such that the radiator 250 may be implemented to have a
three-dimensional curved shape.
[0057] In order to support the radiator 250 having the
three-dimensional curved shape, a radiator supporting part 258 may
be protruded from the opposite surface 210b of the radiator frame
230.
[0058] The radiator supporting part 258 may firmly support the
connection terminal part 220 exposed to the opposite surface 210b
and the bending connection part 256.
[0059] The radiator 250 may be simultaneously formed with guide pin
holes 252 or contact pin holes 254.
[0060] The guide pin hole 252 and the contact pin hole 254 will be
described below.
[0061] The connection terminal part 220 transmits the received
external signals to the electronic device and may be formed by
performing the bending, forming, and drawing processing on a part
of the radiator 250.
[0062] In addition, after the connection terminal part 220 is
separately manufactured from the radiator 250, it may be
manufactured to connect to the radiator 250 and may be connected to
the terminal 210 of the circuit substrate 300.
[0063] Meanwhile, the radiator frame 230 may be a three-dimensional
structure formed of a flat plane part 231 and a curve part 233
having a curvature. The radiator 250 may be flexible so that it is
disposed at the curved part 233 of the radiator frame 230.
[0064] The radiator frame 230 is an injection structure, the
antenna pattern part 210 may be formed on one surface 210a of the
radiator frame 230, and the connection terminal part 220 may be
formed on the opposite surface 210b of the one surface 210a.
[0065] The radiator frame 230 may embed the antenna pattern in the
case 110 of the electronic device by bonding the one surface 210a
formed with the antenna pattern part 210 to the inside of the case
110 of the electronic device.
[0066] In the structure of the radiator 250 embedded in the case
110 of the electronic device, the antenna pattern part 210
receiving the external signals and the connection terminal part 220
transmitting the external signals to the electronic device may be
formed on a different plane.
[0067] The guide boss 240 is formed to be protruded from the
opposite surface of the one surface 210a formed with the antenna
pattern part 210 of the radiator frame 230 and may be inserted in
the manufacturing mould 500 (see FIG. 10) for injection-molding the
case 120 of the electronic device.
[0068] The guide boss 240 is inserted into the manufacturing mould
500 (see FIG. 10) such that it can be stably fixed on the mould,
thereby making it possible to reduce the appearance defect and
withstand the high injection pressure.
[0069] FIG. 5A is a schematic cross-sectional view taken along line
A-A of FIGS. 3 and 4, FIG. 5B is a schematic cross-sectional view
showing a shape where a resin material is filled in a mould for
manufacturing the antenna pattern frame in order to manufacture the
antenna pattern frame of FIG. 5A, and FIGS. 6A to 7B are
cross-sectional views schematically showing another embodiment.
[0070] Referring to FIG. 5A, the antenna pattern frame 200
according to an exemplary embodiment of the present invention may
include the radiator 250 provided with the antenna pattern part
210, the connection terminal part 220, the radiator frame 230, and
the guide boss 240.
[0071] The radiator 250 may be simultaneously provided with the
guide pin holes 252 or the contact pin holes 254 and is the same as
the exemplary embodiment other than the guide pin hole 252 or the
contact pin hole 254 and therefore, a description thereof will be
described.
[0072] The radiator 250 may be disposed with the guide pin 480 of
the manufacturing mold 400 when performing the molding and may be
formed with the guide pin holes 252 that prevent the motion of the
radiator 250 on the radiator frame 230.
[0073] In addition, the radiator 250 may be disposed with the
contact pin 470 of the manufacturing mold 400 when performing the
molding and may be formed with the contact pin holes 254 that
prevent the motion of the radiator 250 on the radiator frame
230.
[0074] The contact pin 470 and the guide pin 480 may be formed on
the radiator 250 and the radiator frame 230 under the contact pin
470 is filled after performing the molding but the radiator frame
230 under the guide pin 480 is formed with holes.
[0075] The contact pin 470, inserted into the contact pin hole 254
formed on the radiator 250, serves to prevent a horizontal movement
of the radiator 250 in the mould 400 for manufacturing the antenna
pattern frame 200.
[0076] Further, the guide pin 480 inserted into the guide pin hole
252 formed on the radiator 250 serves to prevent a vertical
movement of the radiator 250 in the mould 400 for manufacturing the
antenna pattern frame 200.
[0077] Referring to FIG. 5B, the radiator 250 is disposed in the
inner space 450 of the manufacturing mould 400 after providing the
radiator 250.
[0078] The inner space 450 is formed when an upper mould 420 and a
lower mould 410 are combined with each other and the groove formed
in the upper mould 420 or the lower mould 410 becomes the inner
space 450 by the combination of the upper mould 420 and the lower
mould 410.
[0079] When the upper mould 420 and the lower mould 410 are
combined with each other, the radiator 250 may be fixed to the
inner space 450 by passing or contacting the guide pin 480, the
contact pin 470 or the guide pin 480 and the contact pin 470 that
are formed in the upper or lower moulds 410 and 420, through and to
the guide pin hole 252, the contact pin hole 254 or the guide pin
hole 252 and the contact pin hole 254 that are formed in the
antenna pattern part 210.
[0080] The inner space 450 is filled with the resin material to
form the radiator frame 230 that embeds the antenna pattern part
210 in the case 120 of the electronic device.
[0081] When the upper and lower moulds are combined with each
other, the inner space 450 of the upper and lower moulds becomes
the radiator frame 230 so that the antenna pattern part 210 is
embedded in the case 120 of the electronic device to introduce the
resin material into the inner space, thereby making it possible to
form the resin material introducing part 440 in any one of the
upper, lower or upper and lower moulds.
[0082] The resin material is identically filled at the boundary
surface between the radiator 250 and the radiator frame 230, such
that the flowing of the resin material can be good when putting the
radiator frame 230 in the mould for manufacturing the case 110 of
the electronic device in which the antenna pattern is embedded and
injection-molding the radiator frame 230.
[0083] At this time, the inner space 450 of the upper or lower
moulds 410 and 420 is formed with a curve part, such that the
radiator frame 230 may have the curve part.
[0084] Further, the inner space 450 of the upper and lower moulds
410 and 420 may accommodate the connection terminal part 220 and
include the radiator supporting part forming groove 460 to form the
radiator supporting part 258 supporting the connection terminal
part 220.
[0085] In addition, the upper, lower or upper and lower moulds 410
and 420 may be provided with a compression pin 430 that compresses
the connection terminal part 220 disposed in the radiator
supporting part forming groove 460 to closely attach the connection
terminal part 220 to the radiator supporting part forming groove
460.
[0086] The compression pin 430 may prevent the resin material from
being introduced under the connection terminal part 220 when the
resin material is introduced. When the injection material is
covered on a part of the connection terminal part 220, the
electrical connection may be unstable, which can be prevented by
the compression pin 430.
[0087] Further, the lower mould 410 may include a guide groove 490
so that the radiator frame 230 includes the guide boss 240 inserted
into the manufacturing mould 400 for injection-molding the case 110
of the electronic device.
[0088] The resin material is also introduced into the guide groove
490, such that the antenna pattern frame 200 may include the guide
boss 240.
[0089] Referring to FIGS. 6A and 6B, the antenna pattern frame 200
according to another embodiment of the present invention may
include a slot part 245 in the guide boss 240.
[0090] The slot part 245 may be formed to include the protruding
part corresponding to the slot part 245 in the guide groove 490 of
the lower mould 410.
[0091] The resin material introduced from the resin material
introducing part 440 is filled in the guide groove 490 by the slot
part 245 but is filled in the region other than the protruding part
due to the protruding part.
[0092] Therefore, the guide boss 240 of the antenna pattern frame
200 includes the slot part 245 and the slot part 245 serves to
elastically support and fix the manufacturing mould 400 when
forming the case 110 of the electronic device.
[0093] Referring to FIGS. 7A and 7B, the antenna pattern frame 200
according to another embodiment of the present invention may
include a small guide boss 240 as compared with the exemplary
embodiment.
[0094] In order to form the guide boss 240, the lower mould 410 may
include the small guide groove 490 and the upper mould 420 may be
formed with the protruding part 422 to form the introducing hole
260 that introduces the resin material into the inner space in the
mould 500 (see FIG. 12) for manufacturing the case 110 of the
electronic device in which the radiator 250 is embedded.
[0095] The introduction of the resin material is prevented by the
protruding part 422 and the antenna pattern frame 200 may be formed
with holes.
[0096] However, it is to be noted that the protruding part 422 is
to form the introducing hole 260 and is not limited to being formed
in the upper mould 420. Therefore, the protruding part 422 may be
formed in the lower mould 410.
[0097] FIG. 8 is an exploded perspective view of the case of the
electronic device, the mobile communication terminal according to
an exemplary embodiment of the present invention in which the
antenna pattern radiator is embedded.
[0098] The case 120 of the electronic device according to the
exemplary embodiment of the present invention in which the antenna
pattern radiator 200 is embedded may include the radiator 250, the
radiator frame 230, and the case frame 120.
[0099] The radiator 250 and the radiator frame 230 are described in
the exemplary embodiment and therefore, a description thereof will
be omitted.
[0100] The case frame 120 covers one surface of the radiator frame
230 in which the antenna pattern part 210 is formed to embed the
antenna pattern part 210 between the radiator frames 230.
[0101] Further, the radiator frame 230 and the case frame 120 may
be integrated without a clearly defined boundary therebetween. When
viewing the case 110 of the electronic device from the rear, the
antenna pattern part 210 may not be shown and only the connection
terminal part 220 may be shown.
[0102] The radiator frame 230, the case frame 120, or the radiator
frame 230 and the case frame 120 may be formed by the injection
molding. In particular, when the radiator frame 230 and the case
frame 120 are formed of a separate injection fixture, the case 120
of the electronic device is manufactured by bonding the radiator
frame 230 in which the radiator 250 is formed to the case frame
120.
[0103] Meanwhile, the case frame 120 is injection-molded in the
radiator frame 230, such that it may be subjected to a double
injection molding. In other words, the radiator frame 230 is
disposed in the mould and is then subjected to insert injection,
thereby making it possible to integrate the radiator frame 230 and
the case frame 120.
[0104] When the guide pin hole 252 or the contact pin hole 254
formed in the radiator frame 230 is disposed in the mould 500 (see
FIG. 10) for manufacturing the case of the electronic device, they
are combined with the guide pin or the contact pin (not shown)
formed in the manufacturing mould 500, thereby making it possible
to prevent the antenna pattern frame 200 from moving in the
manufacturing mould 500.
[0105] FIG. 9 is a schematic diagram showing a method for
manufacturing the case of the electronic device according to an
exemplary embodiment of the present invention in which the antenna
pattern radiator is embedded.
[0106] Referring to FIG. 9, the case frame 120 is a separate
injection product having a radiator receiving groove 115 in a shape
corresponding to the radiator frame 230 and the case 110 of the
electronic device in which the antenna pattern radiator is embedded
by bonding the radiator frame 230 to the radiator receiving groove
115 may be manufactured.
[0107] An adhesive layer 495 is formed on the surface of the
radiator 250 of the antenna pattern frame 200.
[0108] FIGS. 10 through 13 are schematic cross-sectional views
showing a process of inserting the antenna pattern radiator into
the mould for manufacturing the electronic device and a shape where
the resin material is filled in order to manufacture the case of
the electronic device according to the first through fourth
embodiments of the present invention.
[0109] Referring to FIG. 10, the guide boss 240 of the antenna
pattern frame 200 is fixed and supported by being inserted into the
guide groove 530 of the lower mould 510.
[0110] The radiator frame 230 is disposed in the mould 500 for
manufacturing the case of the electronic device having an inner
space 540 accommodating the radiator frame 230 and the resin
material is introduced into the mould, such that the radiator frame
230 is integrated with the case 110 of the electronic device.
[0111] Meanwhile, the radiator frame 230 and the case frame 120 may
be formed without a clearly defined boundary therebetween.
[0112] When the injection of the antenna pattern frame 200 is
called the primary injection and the injection of the case 110 of
the electronic device is called the secondary injection, the
antenna pattern frame 200 may be fixed and supported not to move by
the guide boss 240 and the guide groove 530 in the secondary
injection manufacturing mould 500, even in the secondary injection
as in the primary injection.
[0113] In other words, the guide boss 240 is inserted into the
secondary injection mould 500 to serve to fix and support the
injection product, that is, the radiator frame 230 so that the
injection product can withstand the high temperature and the high
injection pressure.
[0114] Further, the inner space 540 of the manufacturing mould 500
may include the curve forming part 525 so that the case 110 of the
electronic device has the curve part.
[0115] Meanwhile, the mould 500 for manufacturing the case of the
electronic device that manufactures the case 120 of the electronic
device in which the antenna pattern is embedded by the secondary
injection may form the antenna pattern part 210 receiving the
external signals and the connection terminal part 220 contacting
the circuit substrate of the electronic device on a different
plane.
[0116] The radiator frame 230 having the radiator 250 is formed in
the upper or lower moulds 510 and 520 and the upper and lower
moulds 510 and 520 of the mould for manufacturing the case of the
electronic device and when the upper or lower moulds 510 and 520
are combined with each other, the case of the electronic device may
include the resin material introducing part 530 introducing the
resin material into the inner space so that the inner space 540
formed in the mould becomes the case 120 of the electronic
device.
[0117] Similar to the radiator 250, the radiator frame 230 is
provided with the guide pin hole or the contact pin hole, wherein
the guide pin hole or the contacting hole may be fixed to the guide
pin or the contact pin formed in the manufacturing mould 500. This
is to prevent the radiator frame 230 from moving in the
manufacturing mould.
[0118] Referring to FIG. 11, the guide boss 240 can be easily
inserted into the guide groove 530 of the lower mould 510 by the
slot part 245 in the guide boss 240 of the antenna pattern frame
200 and then, be fixed and supported to the outside of the slot
part 245 by its elasticity. As a result, the guide boss 240 has a
structure capable of withstanding high injection pressure.
[0119] Referring to FIG. 12, the guide boss 240 of the antenna
pattern frame 200 is inserted into the guide groove 530 of the
lower mould 510 and then, a space may be formed in a predetermined
area of the guide groove 530.
[0120] The resin material is introduced into the resin inlet 530,
such that it is introduced into the introducing hole 260 of the
antenna pattern frame 200. Thereafter, the resin material may also
be filled in the space of the guide groove 530.
[0121] In this case, since the antenna pattern frame 200 is fixed
and supported by the flowing of the resin material, the guide boss
has a structure capable of withstanding the injection pressure.
[0122] Referring to FIG. 13, the guide groove 530 includes a guide
boss receiving part to fix and support the guide boss 240 and the
guide boss receiving part may include a variable part 532 having a
diameter larger than that of the guide boss 240 and a fixing part
534 having a diameter smaller than that of the variable part
532.
[0123] The variable part 532 receives the guide boss 240 by being
protruded to the upper portion of the lower mould before the guide
boss 240 is inserted and then, is inserted into the guide groove
530 of the lower mould, such that the antenna pattern frame 200 is
fixed and supported to the lower mould 510.
[0124] Therefore, the antenna pattern frame 200 may be easily fixed
to the lower mould 510 by the guide boss receiving part 530
configured of the variable part 532 and the fixing part 534 and can
withstand high-temperature and high-pressure injection liquid.
[0125] As set forth above, the antenna pattern frame, the case of
the electronic device, and the mould for manufacturing the same
according to the present invention stably fixes the antenna pattern
frame to the inner space of the mould for manufacturing the case of
the electronic device when molding the case of the electronic
device in which the antenna radiator is embedded, thereby making it
possible to reduce the appearance defect and to provide a structure
withstanding the high-temperature and high-pressure injection
liquid when performing the injection molding.
[0126] While the present invention has been shown and described in
connection with the exemplary embodiments, it will be apparent to
those skilled in the art that modifications and variations can be
made without departing from the spirit and scope of the invention
as defined by the appended claims.
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