U.S. patent application number 13/739914 was filed with the patent office on 2014-07-17 for integration of 3d stacked ic device with peripheral circuits.
The applicant listed for this patent is Shih-Hung Chen, Yi-Hsuan Hsiao, Hang-Ting Lue, Yen-Hao Shih. Invention is credited to Shih-Hung Chen, Yi-Hsuan Hsiao, Hang-Ting Lue, Yen-Hao Shih.
Application Number | 20140197516 13/739914 |
Document ID | / |
Family ID | 50944049 |
Filed Date | 2014-07-17 |
United States Patent
Application |
20140197516 |
Kind Code |
A1 |
Lue; Hang-Ting ; et
al. |
July 17, 2014 |
INTEGRATION OF 3D STACKED IC DEVICE WITH PERIPHERAL CIRCUITS
Abstract
An integrated circuit device includes a substrate including a
first region and a second region. A pit is formed in the first
region. A stack of active layers alternating with insulating layers
is deposited in the pit. The stack includes a particular insulating
layer. The particular insulating layer has a first thickness, where
a sum of the first thickness, thickness of active layers, and
thicknesses of other insulating layers is essentially equal to a
depth of the pit. The first thickness is different than the
thicknesses of the other insulating layers by an amount within a
range of process variations for the depth of the pit, for the
thicknesses of the active layers, and for the thicknesses of other
insulating layers. The device includes a planarized surface over
the first and second regions, where an uppermost one of the active
layers has a top surface below the planarized surface.
Inventors: |
Lue; Hang-Ting; (Hsinchu,
TW) ; Hsiao; Yi-Hsuan; (Budai Township, TW) ;
Chen; Shih-Hung; (Jhudong Township, TW) ; Shih;
Yen-Hao; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Lue; Hang-Ting
Hsiao; Yi-Hsuan
Chen; Shih-Hung
Shih; Yen-Hao |
Hsinchu
Budai Township
Jhudong Township
New Taipei City |
|
TW
TW
TW
TW |
|
|
Family ID: |
50944049 |
Appl. No.: |
13/739914 |
Filed: |
January 11, 2013 |
Current U.S.
Class: |
257/506 ;
438/14 |
Current CPC
Class: |
H01L 27/11573 20130101;
H01L 22/20 20130101; H01L 27/11556 20130101; H01L 27/11582
20130101; H01L 27/11531 20130101; H01L 29/0649 20130101; H01L 22/12
20130101 |
Class at
Publication: |
257/506 ;
438/14 |
International
Class: |
H01L 21/66 20060101
H01L021/66; H01L 29/06 20060101 H01L029/06 |
Claims
1. A method for manufacturing an integrated circuit device,
comprising: etching a substrate to form a pit, the pit having a
target depth below a top surface of the substrate; measuring a
depth of the etched pit; depositing a stack of active layers
alternating with insulating layers on the substrate at least in the
etched pit, wherein the stack has at least one insulating layer
having a thickness based on a difference between the target depth
and the measured depth of the etched pit; and applying a
planarizing process to provide a planarized surface, wherein an
uppermost one of the active layers has a top surface below the
planarized surface.
2. The method of claim 1, further comprising etching the stack in a
pattern to define an isolation region in the pit separating the
stack from a peripheral region.
3. The method of claim 2, wherein the applying a planarizing
process comprises: forming a stopping layer over the stack, the
isolation region, and the peripheral region; depositing an
insulation fill over the stopping layer in the isolation region;
polishing the insulation fill down to a level on or within the
stopping layer; and removing portions of the stopping layer above a
level at the top surface of the substrate.
4. The method of claim 2, further comprising forming components of
peripheral circuits over the peripheral region.
5. The method of claim 1, wherein the at least one insulating layer
includes a bottom insulating layer in the stack, the bottom
insulating layer having a target thickness based on the
difference.
6. The method of claim 1, wherein the at least one insulating layer
includes a bottom insulating layer having a target thickness based
on the difference, further comprising: measuring a thickness of the
deposited bottom insulating layer; and depositing a second
insulating layer over and in contact with the bottom insulating
layer, wherein the second insulating layer has a second thickness
based on the measured thickness of the deposited bottom insulating
layer.
7. The method of claim 1, wherein the target depth of the pit is
greater than the thickness of the stack, further comprising:
measuring a thickness of the deposited stack; and depositing a top
insulating layer over the stack, wherein the top insulating layer
has a thickness based on the measured thickness of the deposited
stack and the measured depth of the pit.
8. The method of claim 1, wherein the stack includes a lower
sub-stack including some of the active layers alternating with
insulating layers in the stack, and an upper sub-stack including
others of the active layers alternating with insulating layers in
the stack, and wherein the at least one insulating layer includes
an intermediate insulating layer disposed in-between the lower
sub-stack and the upper sub-stack, further comprising: measuring a
lower sub-stack thickness of the active layers and alternating
insulating layers in the lower sub-stack, after deposition of the
lower sub-stack and before deposition of the upper sub-stack; and
depositing the intermediate insulating layer over the lower
sub-stack, wherein the intermediate insulating layer has a
thickness based on the measured depth of the pit and the measured
lower sub-stack thickness.
9. The method of claim 1, further comprising: forming interlayer
connectors connected to respective active layers in the stack, the
interlayer connectors extending from the respective active layers
in the stack in the pit to a connector surface higher than the
planarized surface; and forming patterned conductor lines on top of
the connector surface and connected to the respective interlayer
connectors.
10. The method of claim 1, further comprising: etching the stack to
define a plurality of active strips including at least a plurality
of planes of active strips; forming a memory layer over and in
contact with side surfaces of active strips in the plurality of
planes; forming a layer of a second conductive material over and
having a surface conformal with the memory layer; etching the layer
of the second conductive material to define a plurality of
structures arranged orthogonally over, and having surfaces
conformal with, the plurality of active strips in the plurality of
planes; and etching the memory layer to define memory elements in
interface regions at cross-points between side surfaces of active
strips in the plurality of planes and the plurality of
structures.
11. An integrated circuit device, comprising: a substrate including
a first region and a second region; a pit formed in the first
region, the pit having a depth; a stack of active layers
alternating with insulating layers deposited in the pit, wherein
the stack includes: a particular insulating layer having a first
thickness, wherein a sum of the first thickness of the particular
insulating layer, thicknesses of active layers, and thicknesses of
other insulating layers in the stack is essentially equal to the
depth, the first thickness being different than the thicknesses of
the other insulating layers in the stack by an amount within a
range of process variations for the depth of the pit, for the
thicknesses of active layers, and for the thicknesses of other
insulating layers; and a planarized surface over the first region
and the second region, wherein an uppermost one of the active
layers has a top surface below the planarized surface.
12. The integrated circuit device of claim 11, further comprising:
an isolation region in the pit separating the stack from the second
region including a peripheral region; and a stopping layer between
the stack and the isolation region and between the isolation region
and the peripheral region.
13. The integrated circuit device of claim 12, further comprising
components of peripheral circuits over the peripheral region.
14. The integrated circuit device of claim 11, wherein the
particular insulating layer includes a bottom insulating layer
formed on a bottom of the pit.
15. The integrated circuit device of claim 11, wherein the
particular insulating layer is formed on a bottom insulating layer
formed on a bottom of the pit, wherein a sum of the first thickness
of the particular insulating layer, a second thickness of the
bottom insulating layer, thicknesses of active layers, and
thicknesses of other insulating layers in the stack is essentially
equal to the target depth.
16. The integrated circuit device of claim 11, wherein an uppermost
one of the insulating layers is formed on the uppermost one of the
active layers, and the particular insulating layer having the first
thickness is formed on the uppermost one of the insulating
layers.
17. The integrated circuit device of claim 11, wherein the
particular insulating layer includes an intermediate insulating
layer formed between two adjacent active layers.
18. The integrated circuit device of claim 11, further comprising:
interlayer connectors connected to respective active layers in the
stack, the interlayer connectors extending from the respective
active layers in the stack in the pit to a connector surface higher
than the planarized surface; and patterned conductor lines on top
of the connector surface and connected to the respective interlayer
connectors.
19. The integrated circuit device of claim 11, further comprising:
a plurality of active strips including at least a plurality of
planes of active strips; a plurality of structures arranged
orthogonally over, and having surfaces conformal with, the
plurality of active strips in the plurality of planes; and memory
elements in interface regions at cross-points between side surfaces
of active strips in the plurality of planes and the plurality of
structures.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to stacked transistor
structures, such as can be used in high density three-dimensional
(3D) memory devices, and memory devices utilizing such
structures.
[0003] 2. Description of Related Art
[0004] High density three-dimensional (3D) memory devices include
stacked multiple planes of memory cells, and peripheral circuits.
The peripheral circuits can include circuitry for example that
controls the memory cells for program, erase and read operations.
Metal layers or other conductive or semiconductive layers can
electrically connect the peripheral circuits to the memory cells.
Typically, the peripheral circuits are manufactured in CMOS
(complementary metal-oxide-semiconductor) technology, while the
stacked multiple planes of memory cells are manufactured in
different technologies such as charge trapping memory technologies
that requires process steps that are different from those used to
form the peripheral circuits.
[0005] It is desirable to provide a technology for a
three-dimensional (3D) memory device to facilitate integration of
stacked multiple planes of memory cells with peripheral circuits of
the three-dimensional (3D) memory device.
SUMMARY
[0006] A technology for integrating stacked multiple planes of
memory cells with peripheral circuits in three-dimensional memory
devices is provided. An integrated circuit device in accordance
with the technology includes a substrate including a first region
and a second region. A pit is formed in the first region. A stack
of active layers alternating with insulating layers is deposited in
the pit.
[0007] The stack includes a particular insulating layer. The
particular insulating layer has a first thickness, where a sum of
the first thickness, thickness of active layers, and thicknesses of
other insulating layers in the stack is essentially equal to a
depth of the pit. The first thickness is different than the
thicknesses of the other insulating layers in the stack by an
amount within a range of process variations for the depth of the
pit, for the thicknesses of the active layers, and for the
thicknesses of other insulating layers. The device includes a
planarized surface over the first and second regions, where an
uppermost one of the active layers has a top surface below the
planarized surface.
[0008] A method in accordance with the technology includes etching
a substrate to form a pit, where the pit has a target depth below a
top surface of the substrate, and measuring a depth of the etched
pit. The method includes depositing a stack of active layers
alternating with insulating layers on the substrate at least in the
etched pit, where the stack has at least one insulating layer
having a thickness based on a difference between the target depth
and the measured depth of the etched pit. The method includes
applying a planarizing process to provide a planarized surface.
[0009] Other aspects and advantages of the present invention can be
seen on review of the drawings, the detailed description and the
claims, which follow.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a perspective illustration of a three-dimensional
(3D) NAND-flash memory device.
[0011] FIG. 2 is a perspective illustration of an alternative
three-dimensional (3D) NAND-flash memory device.
[0012] FIG. 3 is a simplified cross-sectional view of one example
of three-dimensional (3D) NAND-flash memory device.
[0013] FIGS. 4-7 illustrate stages in a manufacturing method for a
device on an integrated circuit, in accordance with a first
embodiment.
[0014] FIGS. 8-9 illustrate stages in a manufacturing method for a
device on an integrated circuit, in accordance with a second
embodiment.
[0015] FIGS. 10-11 illustrate stages in a manufacturing method for
a device on an integrated circuit, in accordance with a third
embodiment.
[0016] FIGS. 12A and 12B illustrate a method for manufacturing a
device on an integrated circuit, in accordance with a fourth
embodiment.
[0017] FIGS. 13-18 illustrate stages in an example of a
manufacturing method for integrating a stack disposed in a pit in
an integrated circuit device with peripheral circuits for the
device.
DETAILED DESCRIPTION
[0018] A detailed description of embodiments of the present
invention is provided with reference to the FIGS. 1-18.
[0019] FIG. 1 is a perspective illustration of a three-dimensional
(3D) NAND-flash memory device. The device illustrated in FIG. 1
includes stacks of active lines alternating with insulating lines.
Insulating material is removed from the drawing to expose
additional structure. For example, insulating lines are removed
between the semiconductor lines, in the stacks, and are removed
between the stacks of semiconductor lines. This structure is
described herein in some detail, as an example of a
three-dimensional (3D) memory array which can be manufactured in a
recessed area, or pit, on a semiconductor substrate, in combination
with peripheral circuits on the substrate outside of the pit. Other
multilayer circuit structures can also be formed using the
technology described herein.
[0020] In the example shown in FIG. 1, a multilayer array is formed
on an insulating layer, and includes a plurality of word lines
125-1, . . . , 125-N conformal with the plurality of stacks. The
plurality of stacks includes semiconductor lines 112, 113, 114, and
115 in multiple planes. Semiconductor lines in the same plane are
electrically coupled together by bit line structures (e.g.
102B).
[0021] Bit line structures 112A, 113A, 114A, and 115A terminate
semiconductor lines, such as semiconductor lines 112, 113, 114, and
115. As illustrated, these bit line structures 112A, 113A, 114A,
and 115A are electrically connected to different bit lines for
connection to decoding circuitry to select planes within the array.
These bit line structures 112A, 113A, 114A, and 115A can be
patterned at the same time that the plurality of stacks is
defined.
[0022] Bit line structures 102B, 103B, 104B, and 105B terminate
semiconductor lines, such as semiconductor lines 102, 103, 104, and
105. As illustrated, these bit line structures 102B, 103B, 104B,
and 105B are electrically connected to different bit lines for
connection to decoding circuitry to select planes within the array.
These bit line structures 102B, 103B, 104B, and 105B can be
patterned at the same time that the plurality of stacks is
defined.
[0023] Any given stack of semiconductor lines is coupled to either
the bit line structures 112A, 113A, 114A, and 115A, or the bit line
structures 102B, 103B, 104B, and 105B, but not both. A stack of
semiconductor bit lines has one of the two opposite orientations of
bit line end-to-source line end orientation, or source line
end-to-bit line end orientation. For example, the stack of
semiconductor lines 112, 113, 114, and 115 has bit line
end-to-source line end orientation; and the stack of semiconductor
lines 102, 103, 104, and 105 has source line end-to-bit line end
orientation.
[0024] The stack of semiconductor lines 112, 113, 114, and 115 is
terminated at one end by the bit line structures 112A, 113A, 114A,
and 115A, passes through SSL gate structure 119, ground select line
GSL 126, word lines 125-1 WL through 125-N WL, ground select line
GSL 127, and is terminated at the other end by source line 128. The
stack of semiconductor lines 112, 113, 114, and 115 does not reach
the bit line structures 102B, 103B, 104B, and 105B.
[0025] The stack of semiconductor lines 102, 103, 104, and 105 is
terminated at one end by the bit line structures 102B, 103B, 104B,
and 105B, passes through SSL gate structure 109, ground select line
GSL 127, word lines 125-N WL through 125-1 WL, ground select line
GSL 126, and is terminated at the other end by a source line
(obscured by other parts of the figure). The stack of semiconductor
lines 102, 103, 104, and 105 does not reach the bit line structures
112A, 113A, 114A, and 115A.
[0026] A layer of memory material is disposed in interface regions
at cross-points between surfaces of the semiconductor lines 112-115
and 102-105 and the plurality of word lines 125-1 through 125-n.
Ground select lines GSL 126 and GSL 127 are conformal with the
plurality of stacks, similar to the word lines.
[0027] Every stack of semiconductor lines is terminated at one end
by bit line structures and at the other end by a source line. For
example, the stack of semiconductor lines 112, 113, 114, and 115 is
terminated at one end by bit line structures 112A, 113A, 114A, and
115A, and terminated on the other end by a source line 128. At the
near end of the figure, every other stack of semiconductor lines is
terminated by the bit line structures 102B, 103B, 104B, and 105B,
and every other stack of semiconductor lines is terminated by a
separate source line. At the far end of the figure, every other
stack of semiconductor lines is terminated by the bit line
structures 112A, 113A, 114A, and 115A, and every other stack of
semiconductor lines is terminated by a separate source line.
[0028] Bit lines and string select lines are formed at the metals
layers ML1, ML2, and ML3. Bit lines are coupled to a plane decoder
(not shown). String select lines are coupled to a string select
line decoder (not shown).
[0029] The ground select lines GSL 126 and 127 can be patterned
during the same step that the word lines 125-1 through 125-n are
defined. Ground select devices are formed at cross-points between
surfaces of the plurality of stacks and ground select lines GSL 126
and 127. The SSL gate structures 119 and 109 can be patterned
during the same step that the word lines 125-1 through 125-n are
defined. String select devices are formed at cross-points between
surfaces of the plurality of stacks and string select (SSL) gate
structures 119 and 109. These devices are coupled to decoding
circuitry for selecting the strings within particular stacks in the
array.
[0030] FIG. 2 is a perspective illustration of an alternative
three-dimensional (3D) NAND-flash memory device. The memory device
includes an array of NAND strings of memory cells, and can be a
double-gate vertical channel memory array (DGVC). The memory device
includes an integrated circuit substrate 201, and a plurality of
stacks of conductive strips alternating with insulating material.
The stacks include at least a bottom plane of conductive strips
(GSL), a plurality of intermediate planes of conductive strips
(WLs), and a top plane of conductive strips (SSLs). For example, a
stack 210 includes a bottom plane of conductive strips (GSL), a
plurality of intermediate planes of conductive strips (WLs) ranging
from WL.sub.0 to WL.sub.N-1, and a top plane of conductive strips
(SSLs), where N can be 8, 16, 32, 64 and so on. The insulating
material is removed from the drawing to expose additional
structure. For example, the insulating material is removed between
the conductive strips in the stacks, and is removed between the
stacks of conductive strips.
[0031] In the example shown in FIG. 2, a plurality of bit line
structures are arranged orthogonally over, and have surfaces
conformal with, the plurality of stacks, including inter-stack
semiconductor body elements 220 between the stacks and linking
elements 230 over the stacks connecting the semiconductor body
elements 220.
[0032] The memory device includes memory elements in interface
regions at cross-points 280 between side surfaces of the conductive
strips in the plurality of intermediate planes (WLs) in the stacks
and the inter-stack semiconductor body elements 220 of the
plurality of bit line structures.
[0033] A reference conductor 260 is disposed between the bottom
plane (GSL) of conductive strips and the integrated circuit
substrate 201. At least one reference line structure is arranged
orthogonally over the plurality of stacks, including inter-stack
semiconductor elements 240 between the stacks in electrical
communication with the reference conductor 260, and linking
elements 250 over the stacks 210 connecting the inter-stack
semiconductor elements 240. The semiconductor elements 240 have a
higher conductivity than the semiconductor body elements 220.
[0034] The memory device includes string select switches 290 at
interface regions with the top plane of conductive strips, and
reference select switches 270 at interface regions with the bottom
plane (GSL) of conductive strips.
[0035] In the example shown in FIG. 2, the memory device can
further include decoding circuitry coupled to the conductive strips
in the plurality of stacks. The decoding circuitry can include word
line decoding circuits, and string selection line decoding circuits
coupled to the top plane of conductive strips (SSLs) in the
plurality of stacks. String selection lines in the top plane of
conductive strips are independently coupled to and controlled by
the string selection line decoding circuits.
[0036] Conductive strips in the intermediate planes (WLs), and
conductive strips in the bottom plane (GSL) are connected together
to reduce decoder areas and consequently an overall size of the
memory device. Conductive strips in the top plane (SSL) are
individually decoded to allow correct bit line decoding.
[0037] The memory device can include linking elements, such as
linking elements 261 and 262, connecting sets of word lines in the
intermediate planes (WL), and interlayer connectors, such as
interlayer connectors 271 and 272, coupled to landing areas in the
linking elements 261 and 262, and to the word line decoding
circuits (not shown). The landing areas are at interface regions
between bottom surfaces of the interlayer connectors and top
surfaces of the linking elements.
[0038] In the example shown in FIG. 2, interlayer connectors (e.g.
271 and 272) for sets of word lines at multiple layers in the
plurality of intermediate planes are arranged in a staircase
structure, and are connected to landing areas at two different
layers in the plurality of intermediate planes. The staircase
structure can be formed in a vertical contact region (e.g. 314 in
FIG. 3) near the boundary of a memory cell region (e.g. 312 in FIG.
3) for the array of memory cells and a peripheral region (e.g. 318
in FIG. 3) for components of peripheral circuits. The vertical
contact region can include linking elements 261 and 262, and
interlayer connectors 271 and 272.
[0039] The memory device can include ground selection line decoding
circuits coupled to the at least one bottom plane (GSL) of
conductive strips in the plurality of stacks. The memory device can
include linking elements, such as a linking element 263, connecting
sets of ground selection lines in the bottom plane (GSL) of
conductive strips, and interlayer connectors, such as an interlayer
connector 273, coupled to landing areas in the linking elements,
and to the ground selection line decoding circuits (not shown). The
landing areas are at interface regions between bottom surfaces of
the interlayer connectors, such as an interlayer connector 273, and
top surfaces of the linking elements, such as a linking element
263. The vertical contact region (e.g. 314 in FIG. 3) can also
include a linking element 263, and an interlayer connectors
273.
[0040] In the example shown in FIG. 2, the memory device includes a
first overlying conductive layer (not shown) connected to the
plurality of bit line structures, including a plurality of global
bit lines coupled to sensing circuits. The memory device also
includes a second overlying conductive layer (not shown) connected
to the at least one reference conductor structure, coupled to a
reference voltage source.
[0041] Three-dimensional memory (3D) devices, such as the ones
illustrated by FIG. 1 and FIG. 2, as well as other structures of
three-dimensional (3D) memory devices involving stacks of active
layers alternating with insulating layers, include components of
peripheral circuits in addition to stacks of active lines
alternating with insulating lines described herein. Components of
peripheral circuits can be manufactured on a planar surface of a
substrate of an integrated circuit device to control function of
the device. The stacks can be manufactured in a pit in the
substrate below the planar surface. A depth of the pit is
determined before deposition of any of the active lines and the
insulating lines in the stacks in the pit. But due to process
variation in etching the pit, the actual depth of the pit is not
known until after the pit is etched. Also, due to process variation
in depositing the active lines and the insulating lines, the actual
thickness of the stacks is not known until after the deposition. In
integration of the stacks with the components of the peripheral
circuits, a planarization process can take place over the stacks
and on a peripheral region in the substrate for the components of
the peripheral circuits after the deposition. It is a challenge to
ensure that, in presence of process variation, the active lines in
the stacks are protected during the planarization process.
[0042] The structures of FIGS. 1 and 2 include sets of active
layers in the stack that are have dimensions critical to uniformity
of memory cells in the stacks. In the structure of FIG. 1, the
active layers including the semiconductor lines 112, 113, 114, and
115 provide the semiconductor body regions for memory cells in
horizontal NAND strings along the lines, and the thicknesses of
those lines are critical to the channel width of the memory cells.
In the structure of FIG. 2, the active layers including the word
lines WL.sub.N-1 and WL.sub.0, provide the word lines for memory
cells in vertical NAND strings along the inter-stack semiconductor
body elements 220, and the thicknesses of those word lines are
critical to the channel length of the memory cells. Thus, the
active layers that include critical thickness features can be
configured in the manufacturing to have identical or close to
identical thicknesses, to improve uniformity of the critical
characteristics of memory cells across the array. On the other
hand, the thickness of the GSL line in FIG. 2 can be critical to
the channel length of a ground select transistor in the NAND
string. Also, insulating layers in the stacks between the active
layers isolate the active layers, and thus may have minimum
acceptable thicknesses in order to act as reliable insulators, and
those minimum acceptable thicknesses can be specified during
manufacturing for each layer. However, some of the insulating
layers can have thicknesses larger than the specified thicknesses,
without having a substantial impact on memory cell performance. As
the number of active and insulating layer in the stack increases,
the height of the stack can become a manufacturing problem, and it
is desirable to maintain the overall height as small as
practical.
[0043] FIG. 3 is a simplified cross-sectional view of one example
of three-dimensional (3D) memory device 300 including a memory cell
region 312, a vertical contact region 314, an isolation region 316
and a peripheral region 318. The memory cell region 312 includes a
stack of active layers alternating with insulating layers, where
the active layers can include patterned semiconductor or conductive
materials used as bit line or word lines in a memory, and the
insulating layers can include dielectric materials. The active
layers and the insulating layers are disposed in a recessed area,
or a pit, on the substrate. The vertical contact region 314
includes linking elements that connect bit lines or word lines
etched from the active layers in the memory cell region 312 to
overlying metal layers. The isolation region 316 electrically
insulates the memory cell region 312 and the vertical contact
region 314 from the peripheral region 318. The peripheral region
318 includes components of peripheral circuits including decoding
circuitry, connected to circuit elements in the memory cell region
312 and the vertical contact region 314 via the overlying metal
layers.
[0044] Process variation in stacking active layers alternating with
insulating layers in the memory cell region 312 and the vertical
contact region 314 can be addressed as described herein, to
facilitate integration of the memory cell region with the
components of the peripheral circuits of the integrated circuit
device in the peripheral region 318. Device 300 is illustrated as
an example of one type of integrated circuit device with which the
present invention can be used; others are also possible. In the
example shown in FIG. 3, a planarized surface can be formed at
various levels over the memory cell region 312, the vertical
contact region 314, the isolation region 316, and the peripheral
region 318. In one embodiment, the planarized surface can be formed
at a level 340 of a top surface of a substrate 330. In another
embodiment, the planarized surface can be formed at a level 350 of
a top surface of peripheral gates in the peripheral region 318. In
yet another embodiment, the planarized surface can be formed at a
level 360 of a bottom surface of a lowermost one of the overlying
metal layers (not shown). The planarized surface can also be formed
at a level between the level 340 and the level 350, or between the
level 350 and the level 360. As described herein, as the number of
active and insulating layer in the stack increases, the height of
the stack can become a manufacturing problem. For example, because
of process variations, the pit can be etched in the substrate with
a depth less than a specified depth, and the stack can be
manufactured with a height greater than a sum of combined specified
thicknesses of active layers and insulating layers in the stack,
such that if a planarization process takes place at the level 340
of the top surface of a substrate 330, an uppermost one of the
active layers (e.g. 370) can be damaged by the planarization
process. The present technology provides a method and a device to
prevent damage to critical elements of the stack, such as the
uppermost one of the active layers, when the number of active and
insulating layer in the stack increases.
[0045] In the example shown in FIG. 3, the memory cell region 312,
the vertical contact region 314, and the isolation region 316 are
in a pit 320 in a substrate 330. The memory cell region 312 can
include semiconductor lines 112-115 and 102-105, SSL gate
structures 119 and 109, ground select lines GSL 126 and 127, word
lines 125-1 WL through 125-N WL, ground select lines GSL 127 and
126, and source line 128, as illustrated in FIG. 1.
[0046] The vertical contact region 314 can include bit line
structures 102B, 103B, 104B, and 105B, and bit line structures
112A, 113A, 114A, and 115A, connected to bit lines at metals layers
ML1, ML2, and ML3, as illustrated in FIG. 1. In reference to the
memory device illustrated in FIG. 2, the vertical contact region
314 can include linking elements 261 and 262 that connect sets of
word lines in the intermediate planes (WL), and interlayer
connectors 271 and 272 that are coupled to landing areas in the
linking elements 261 and 262, and to the word line decoding
circuits (not shown). In reference to the memory device illustrated
in FIG. 2, the vertical contact region 314 can also include the
linking element 263 that connect sets of ground selection lines in
the bottom plane (GSL) of conductive strips, and interlayer
connectors 273 that are coupled to landing areas in the linking
element 263, and to the ground selection line decoding circuits
(not shown). The isolation region 316 separates the memory cell
region 312 and the vertical contact region 314 from the peripheral
region 318.
[0047] Components of peripheral circuits in the peripheral region
318 can include the decoding circuitry such as described for the
memory devices illustrated in FIG. 1 and FIG. 2. For instance, the
decoding circuitry as described for the memory device illustrated
in FIG. 2 can include word line decoding circuits, string selection
line decoding circuits, and the ground selection line decoding
circuits. Components of the peripheral circuits can also include
controllers, voltage generators, address generators, command
decoders, gates, patterned metal layers, and vias connecting
patterned metal layers with other components. The components of the
peripheral circuits can be manufactured with CMOS (complementary
metal-oxide-semiconductor) technology.
[0048] A planarized surface is formed over the memory cell region
312, the vertical contact region 314, the isolation region 316, and
the peripheral region 318. Patterned metal layers are formed over
the planarized surface. In reference to the memory device
illustrated in FIG. 1, the patterned metal layers can include
metals layers ML 1, ML2, and ML3. In reference to the memory device
illustrated in FIG. 2, the patterned metal layers can include the
first overlying conductive layer (not shown) connected to the
plurality of bit line structures, and the second overlying
conductive layer (not shown) connected to the reference conductor
structure. The patterned metal layers can couple the components of
the peripheral circuits in the peripheral region 318 to the memory
cells in the memory cell region 312. The patterned metal layers can
couple the components of the peripheral circuits in the peripheral
region 318 to bit line structures 102B, 103B, 104B, and 105B, 112A,
113A, 114A, and 115A (FIG. 1) in the vertical contact region 314.
The patterned metal layers can couple the components of the
peripheral circuits in the peripheral region 318 to interlayer
connectors 271, 272 and 273 (FIG. 2) in the vertical contact region
314.
[0049] FIGS. 4-7 illustrate stages in a method for manufacturing a
device on an integrated circuit, in accordance with a first
embodiment. FIG. 4 illustrates a substrate 430 having a top surface
420 in the integrated circuit device. A sacrificial layer 415 is
formed on the substrate 430, and an etch mask 410 is formed over
the substrate 430 to select an area for etching a pit with a target
depth in the substrate 430. The target depth is specified in
advance of manufacturing and stored in a manufacturing control
system. The target depth can be calculated as greater than, lower
than, or equal to a sum of target thicknesses of a stack of active
layers and insulating layers to be deposited in the pit. Target
thicknesses of active layers and insulating layers in the stack can
also be specified in advance of manufacturing and stored in a
manufacturing control system.
[0050] As illustrated in FIG. 5, a pit 520 is etched in the
substrate 430 using the etch mask 410. After the etching, an actual
depth of the pit 520 is measured to produce a measured depth 540.
The actual depth of the pit can be measured by an alpha stepper, a
precision measurement instrument used for determining and analyzing
thin step heights in the manufacture of integrated circuits. An
alpha stepper can have sub-angstrom resolution, where an angstrom
is equal to 0.1 nanometer. Due to process variation, there may be a
difference between the target depth and the measured depth 540 of
the pit 520. The process variation may be among chips on a wafer,
or among chips on different wafers. The measured depth 540 can be
within a range of the target depth. In some example processes, the
measured depth 540 can be within +/-5% of the target depth. Said
another way, in some example processes, if the target depth is 600
nanometers, the measured depth 540 can be between 570 nanometers
and 630 nanometers.
[0051] As illustrated in FIG. 6, the at least one insulating layer
includes a bottom insulating layer 610 deposited on a bottom 510 in
the pit 520 and on the substrate 430, where the sacrificial layer
415 (FIG. 5) is removed prior to deposition of the bottom
insulating layer. The bottom insulating layer 610 has a target
thickness 615 based on a difference between the target depth and
the measured depth 540 of the pit 520.
[0052] As described herein, the target depth can be calculated as
greater than or equal to a sum of target thicknesses of a stack of
active layers and insulating layers to be deposited in the pit,
such that an uppermost one of the active layers in the stack has a
top surface below the top surface 420 of the substrate 430 after
deposition of the stack. However, the measured depth 540 of the pit
520 may be less than the target depth of the pit 520. To compensate
for the difference between the target depth and the measured depth
540, the target thickness of the bottom insulating layer 610 can be
adjusted by the difference, such that the uppermost one of the
active layer has a top surface below the top surface 420 of the
substrate 430 after deposition of the stack.
[0053] FIG. 7 illustrates active layers 710 and 730 alternating
with the bottom insulating layer 610, an intermediate insulating
layer 720, and a top insulating layer 740 in the stack deposited in
the pit 520 and on the substrate 430. Although only two active
layers are shown in the stack, the stack can include more active
layers, such as 8, 16, or 32 layers with alternating insulating
layers. The uppermost active layer 730 has a top surface 735 below
the top surface 420 of the substrate 430, such that when a
planarization process takes place at the level of the top surface
420 of the substrate 430, the uppermost active layer 730 is
protected, and the stack can be flush with the top surface 420 of
the substrate 430.
[0054] Insulating layers in the stack can be the same or different
as the other layers. Representative insulating materials that can
be used include an oxide, nitride, oxynitride, silicate, or others.
Low insulating constant materials having an insulating constant
smaller than that of silicon dioxide, such as SiCHO.sub.x, can be
used. High insulating constant (high-k) materials having an
insulating constant greater than that of silicon dioxide, such as
HfO.sub.x, HfON, AlO.sub.x, RuO.sub.x, TiO.sub.x, can be used
also.
[0055] Conductor or semiconductor layers in the stack can be the
same or different as the other layers. Representative materials
that can be used include electrically conductive semiconductors
including heavily doped polysilicon (using dopants such as As, P,
B), silicides including TiSi, CoSi, oxide semiconductors, including
InZnO, InGaZnO, and combinations of semiconductors and silicides.
Conductive layers in the stack can also be a metal, a conductive
compound, or combinations of materials including Al, Cu, W, Ti, Co,
Ni, TiN, TaN, TaAlN, and others.
[0056] FIGS. 8-9 illustrate a method for manufacturing a device on
an integrated circuit, in accordance with a second embodiment. FIG.
8 continues with the process illustrated in FIG. 6 for the first
embodiment, where the pit 520 is etched in the substrate 430, and a
bottom insulating layer 610 is deposited on a bottom 510 in the pit
520 and on the substrate 430. In reference to FIG. 8, an actual
thickness of the bottom insulating layer 610 is measured to produce
a measured thickness 815. The actual thickness of the bottom
insulating layer 610 can be measured by a metrology system that can
determine film thickness of layers of materials deposited in the
manufacture of integrated circuits. One example of such a metrology
system can be an "n and k" analyzer, where n is a refractive index
and k is an extinction coefficient used in determining the film
thickness. Representative "n and k" analyzers include models sold
by n&k Technology, Inc., of San Jose, Calif., such as the
n&k Olympian Metrology System.
[0057] Due to process variation, there may be a difference between
the target thickness 615 and the measured thickness 815 of the
bottom insulating layer 610. The process variation may be among
chips on a wafer, or among chips on different wafers. The measured
thickness 815 can be within a range of the target thickness 615. In
some example processes, the measured thickness 815 can be within
+/-5% of the target thickness 615. Said another way, in some
example processes, if the target thickness 615 is 200 nanometers,
the measured thickness 815 can be between 190 nanometers and 210
nanometers.
[0058] As illustrated in FIG. 8, a second insulating layer 810 is
deposited over and in contact with the bottom insulating layer 610.
The second insulating layer 810 has a second thickness based on the
measured thickness 815 of the deposited bottom insulating layer 610
and the measured depth 540 of the pit 520. The second thickness of
the second insulating layer 810 can be calculated such that an
uppermost one of the active layers has a top surface below the top
surface 420 of the substrate 430 after deposition of the stack.
[0059] As illustrated in FIG. 9, an uppermost active layer 930 and
another active layer 910 alternating with the second insulating
layer 810, an intermediate insulating layer 920, and a top
insulating layer 940 are deposited in the pit 520 and on the
substrate 430. Although only two active layers are shown in the
stack, the stack can include more active layers, such as 8, 16, or
32 layers with alternating insulating layers. The uppermost active
layer 930 has a top surface 935 below the top surface 420 of the
substrate 430, such that when a planarization process takes place
at the level of the top surface 420 of the substrate 430, the
uppermost active layer 930 is protected, and the stack can be flush
with the top surface 420 of the substrate 430.
[0060] FIGS. 10-11 illustrate a method for manufacturing a device
on an integrated circuit, in accordance with a third embodiment.
FIG. 10 continues with the process illustrated in FIG. 5 for the
first embodiment, where the pit 520 is etched in the substrate 430.
In the third embodiment, the target depth of the stack is greater
than the thickness of the stack of active layers alternating with
insulating layers, such that an uppermost active layer 1040 has a
top surface 1045 below the top surface 420 of the substrate 430. As
illustrated in FIG. 10, a stack of active layers 1020 and 1040
alternating with insulating layers 1010, 1030 and 1050 in the stack
is deposited in the pit 520 and on the substrate 430, where the
sacrificial layer 415 (FIG. 5) is removed prior to deposition of
the stack. Although only two active layers are shown in the stack,
the stack can include more active layers, such as 8, 16, or 32
layers with alternating insulating layers. A thickness of the
deposited stack is measured to produce a measured thickness 1090.
The thickness of the deposited stack can be measured by a precision
measurement instrument used for determining and analyzing thin step
heights in the manufacture of integrated circuits. One example of
such an instrument can be an alpha stepper that can have
sub-angstrom resolution, where an angstrom is equal to 0.1
nanometer. Representative alpha stepper instruments include models
sold by KLA-Tencor Corporation of Milpitas, Calif., such as the
Alpha-Step IQ Surface Profiler.
[0061] As described herein, due to process variation, there may be
a difference between the target thickness 615 and the measured
thickness 815 of the bottom insulating layer 610 (FIGS. 6-8).
Similarly, there may be a difference between a target thickness and
a measured thickness of an active layer (e.g. 1020). In some
example processes, the measured thickness of an active layer can be
within +/-5% of the target thickness of the active layer. Said
another way, in some example processes, if the target thickness of
the active layer is 30 nanometers, the measured thickness of the
active layer can be between 28.5 nanometers and 31.5 nanometers.
Similarly, there can also be a difference between a target
thickness and a measured thickness of an insulating layer (e.g.
1030) between two active layers (e.g. 1020 and 1040).
[0062] As illustrated in FIG. 11, since the target depth of the
stack is greater than the thickness of the stack of active layers
alternating with insulating layers, a top insulating layer 1110 is
deposited over the stack to bring the stack to a level flush with
the top surface 420 of the substrate 430. The top insulating layer
1110 has a thickness based on the measured thickness 1090 of the
deposited stack and the measured depth 540 of the pit 520. For
instance, the thickness of the top insulating layer 1110 can be
calculated as the difference between the measured depth 540 of the
pit 520 and the measured thickness 1090 of the stack, including
actual thicknesses of active layers and insulating layers already
deposited in the pit 520. When a planarization process takes place
at the level of the top surface 420 of the substrate 430, the
uppermost active layer 1040 is protected, and the stack can be
flush with the top surface 420 of the substrate 430.
[0063] FIGS. 12A and 12B illustrate a method for manufacturing a
device on an integrated circuit, in accordance with a fourth
embodiment. FIG. 12A continues with the process illustrated in FIG.
5 for the first embodiment, where the pit 520 is etched in the
substrate 430.
[0064] As illustrated in FIG. 12A, the stack includes a lower
sub-stack including some of the active layers alternating with
insulating layers in the stack. FIG. 12A illustrates a lower
sub-stack including active layers 1220 and 1240 alternating with
insulating layers 1210 and 1230 deposited in the pit 520 and on the
substrate 430, where the sacrificial layer 415 (FIG. 5) is removed
prior to deposition of the lower sub-stack. Although only two
active layers are shown in the lower sub-stack, the lower sub-stack
can include more active layers, such as 8, 16, or 32 layers with
alternating insulating layers. A lower sub-stack thickness 1290 of
the deposited active layers 1220 and 1240 and insulating layers
1210 and 1230 in the lower sub-stack stack is measured after
deposition of the lower sub-stack.
[0065] As illustrated in FIG. 12B, an intermediate insulating layer
1250 is deposited over the lower sub-stack, and the stack includes
an upper sub-stack including others of the active layers
alternating with insulating layers in the stack. The intermediate
insulating layer 1250 has a thickness based on the measured depth
540 of the pit 520 and the measured lower sub-stack thickness 1290,
such that an uppermost active layer 1260 in the upper sub-stack has
a top surface 1265 below the top surface 420 of the substrate 430.
The upper sub-stack, including the uppermost active layer 1260 and
an insulating layer 1270, is deposited over the intermediate
insulating layer 1250. Thus the intermediate insulating layer is
disposed in-between the lower sub-stack and the upper sub-stack.
When a planarization process takes place at the level of the top
surface 420 of the substrate 430, the uppermost active layer 1260
is protected, and the stack can be flush with the top surface 420
of the substrate 430.
[0066] Although FIGS. 12A and 12B illustrate only one intermediate
insulating layer 1250, the fourth embodiment can include more than
one intermediate insulating layers between a bottom insulating
layer (e.g. 1210) and an uppermost active layer (e.g. 1260) to
deposit thicker or thinner insulating layers than a target
thickness that can be specified in advance of manufacturing and
stored in a manufacturing control system.
[0067] FIGS. 13-18 illustrate a method for integrating a stack
deposited in a pit in an integrated circuit device with the
components of the peripheral circuits for the device. As
illustrated in FIG. 13, a stack is deposited in the pit 520 and on
the substrate 430. The stack can be manufactured using one of the
four embodiments described above. The stack includes active layers
1320 and 1340 alternating with a bottom insulating layer 1310, an
intermediate insulating layer 1330, and a top insulating layer
1350. Although only two active layers are shown in the stack, the
stack can include more active layers, such as 8, 16, or 32 layers
with alternating insulating layers. An uppermost active layer 1340
has a top surface 1345 below the top surface 420 of the substrate
430, such that when a planarization process takes place at the
level of the top surface 420 of the substrate 330, the active layer
1340 is protected, and the stack can be flush with the top surface
420 of the substrate 430.
[0068] The thickness of the top insulating layer 1350 can be
calculated as the difference between the measured depth 540 of the
pit 520 and a sum of the measured thicknesses of active layers
(e.g. 1320, 1340) and insulating layers (e.g. 1310, 1330) already
deposited in the pit 520. The material of the top insulating layer
1350 can include the same material as for other insulating layers
(e.g. 1310, 1330) such as oxide, nitride, oxynitride, silicate, or
others.
[0069] As illustrated in FIG. 14, an etch mask 1410 is formed over
a portion of the stack to define a memory cell region.
[0070] As illustrated in FIG. 15, the stack is then etched to form
an isolation region 1516 that separates the memory cell region from
a peripheral region 1518. Portions of the stack under the etch mask
1410 remain to be used in formation of a memory array that can
include the memory cell region 312, and the vertical contact region
314 as illustrated in FIG. 3. The etching process leaves a residual
of materials in the stack such that a wall of the isolation region
(e.g. 1510) opposite the memory array is tilted towards the
peripheral region and away from the memory array.
[0071] FIGS. 16-18 illustrate a planarization process to provide a
planarized surface, where an uppermost one of the active layers has
a top surface below the planarized surface. FIG. 16 illustrates one
stage in the planarization process after the etch mask 1410 (FIG.
14) is removed. In this stage a stopping layer 1610 is formed over
the stack, the isolation region 1516, and the peripheral region
1518. The stopping layer 1610 has a different etching rate from the
materials below so the stopping layer 1610 slows down the etching
to protect the materials below. An insulation fill 1620 is then
deposited over the stopping layer 1610 to fill in the isolation
region 1516.
[0072] FIG. 17 illustrates a subsequent stage in the planarization
process after the insulation fill is deposited. In this stage the
insulation fill 1620 is polished down to a level 1615 on or within
the stopping layer 1610.
[0073] FIG. 18 illustrates another stage in the planarizing process
after the insulation fill 1620 is polished down. In this stage
portions of the stopping layer 1610 above a level at the top
surface of the substrate is removed by a process, such as a
chemical mechanical planarization process (CMP), to provide a
planarized surface 1810. Components of the peripheral circuits can
then be formed over the peripheral region 1518. The peripheral
region 1518 is a portion of the substrate 430 that remains after
the etching of the pit 520, and is separated from a stack of active
layers (e.g. 1320, 1340) alternating with insulating layers (e.g.
1310, 1330, 1350) by the isolation region 1516.
[0074] Components of the peripheral circuits that can be formed
over the peripheral region 1518 1810 include decoding circuitry
such as described for the memory devices illustrated in FIG. 1 and
FIG. 2. For instance, the decoding circuitry as described for the
memory device illustrated in FIG. 2 can include word line decoding
circuits, string selection line decoding circuits, and the ground
selection line decoding circuits. Components of the peripheral
circuits can also include controllers, voltage generators, address
generators, command decoders, gates, gate insulatings, patterned
metal layers, and vias connecting patterned metal layers with other
components. Components of the peripheral circuits that can be
formed over the isolation region 1516 1810 and over the stack 1810
also include patterned metal layers, and vias. The patterned metal
layers can couple components of the peripheral circuits in the
peripheral region 1518 to a stack of active layers (e.g. 1320,
1340) alternating with insulating layers (e.g. 1310, 1330, 1350) in
the memory cell region 312.
[0075] The present invention provides an integrated circuit device
including a substrate including a first region and a second region.
A recessed area, or a pit, is formed in the first region, where the
pit has a depth. The integrated circuit device includes a stack of
active layers alternating with insulating layers deposited in the
pit. The active layers can include semiconductor or conductive
materials. The insulating layers can include dielectric
materials.
[0076] The stack includes a particular insulating layer in the
insulating layers. The particular insulating layer has a first
thickness, where a sum of the first thickness of the particular
insulating layer, thickness of active layers, and thicknesses of
other insulating layers in the stack is essentially equal to the
depth of the pit. The first thickness is different than the
thicknesses of the other insulating layers in the stack by an
amount within a range of process variations for the depth of the
pit, for the thicknesses of the active layers, and for the
thicknesses of insulating layers in completed stack other than the
particular insulating layer. The integrated circuit device includes
a planarized surface over the first region and the second region,
where an uppermost one of the active layers has a top surface below
the planarized surface.
[0077] As illustrated in FIG. 7, the particular insulating layer
includes a bottom insulating layer 610 formed on a bottom 510 of
the pit 520, in a first embodiment. A sum of the first thickness of
the particular insulating layer, thickness of active layers, and
thicknesses of other insulating layers is essentially equal to the
target depth of the pit.
[0078] As illustrated in FIG. 9, the particular insulating layer
810 is formed on a bottom insulating layer 610 in the pit 520, in a
second embodiment. A sum of the first thickness of the particular
insulating layer, a second thickness of the bottom insulating
layer, thickness of active layers, and thicknesses of other
insulating layers is essentially equal to the target depth of the
pit.
[0079] As illustrated in FIG. 11, an uppermost one of the
insulating layers (e.g. 1050) is formed on the uppermost one of the
active layers (e.g. 1040), and the particular insulating layer
(e.g. 1110) is formed on the uppermost one of the insulating layers
(e.g. 1050), in a third embodiment.
[0080] As illustrated in FIG. 12B, the particular insulating layer
includes an intermediate insulating layer (e.g. 1250) formed
between two adjacent active layers (e.g. 1240, 1260), in a fourth
embodiment.
[0081] As illustrated in FIG. 18, the integrated circuit device
further includes an isolation region (e.g. 1516) in the pit
separating the stack from the second region including a peripheral
region (e.g. 1518), and a stopping layer (e.g. 1610) between the
stack and the isolation region and between the isolation region and
the peripheral region. The stack includes active layers (e.g. 1320,
1340) and insulating layers (e.g. 1310, 1330, 1350).
[0082] While the present invention is disclosed by reference to the
preferred embodiments and examples detailed above, it is to be
understood that these examples are intended in an illustrative
rather than in a limiting sense. It is contemplated that
modifications and combinations will readily occur to those skilled
in the art, which modifications and combinations will be within the
spirit of the invention and the scope of the following claims. What
is claimed is:
* * * * *