U.S. patent application number 13/732417 was filed with the patent office on 2014-07-03 for vapor chamber structure.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. The applicant listed for this patent is ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Chih-Peng Chen.
Application Number | 20140182820 13/732417 |
Document ID | / |
Family ID | 51015818 |
Filed Date | 2014-07-03 |
United States Patent
Application |
20140182820 |
Kind Code |
A1 |
Chen; Chih-Peng |
July 3, 2014 |
VAPOR CHAMBER STRUCTURE
Abstract
A vapor chamber structure includes a main body internally
defining a sealed chamber and having a plurality of radiating fins
externally provided thereon. The radiating fins are integrally
formed on and outward extended from one side of the main body in a
direction opposite to the chamber; and the chamber is internally
provided with a wick structure and filled with a working fluid. By
integrally forming the radiating fins and the chamber with one
another, the vapor chamber structure can be manufactured with
reduced labor cost and shortened manufacturing time.
Inventors: |
Chen; Chih-Peng; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASIA VITAL COMPONENTS CO., LTD. |
New Taipei City |
|
TW |
|
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
New Taipei City
TW
|
Family ID: |
51015818 |
Appl. No.: |
13/732417 |
Filed: |
January 1, 2013 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 2021/0028 20130101;
F28D 15/04 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Claims
1. A vapor chamber structure, comprising a main body internally
defining a sealed chamber and having a plurality of radiating fins
provided thereon; the radiating fins being outward extended from
one side of the main body in a direction opposite to the chamber;
and the chamber being internally provided with a wick structure and
filled with a working fluid.
2. The vapor chamber structure as claimed in claim 1, wherein the
main body has a first side and an opposite second side; the
radiating fins being outward extended from one of the first and the
second side, and the other side of the main body without the
radiating fins being used to contact with a heat source.
3. The vapor chamber structure as claimed in claim 1, wherein the
wick structure is selected from the group consisting of a plurality
of grooves, a sintered-powder structure, and a mesh structure.
4. The vapor chamber structure as claimed in claim 1, wherein the
radiating fins and the chamber are integrally formed with one
another.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a vapor chamber structure,
and more particularly to a vapor chamber structure that is
integrally formed by way of extrusion to have a sealed chamber and
a plurality of outward extended radiating fins.
BACKGROUND OF THE INVENTION
[0002] Due to the rapid progress in different technological fields,
most of the currently available electronic products have largely
enhanced functions, and many internal electronic elements of these
functionally enhanced electronic products, such as the central
processing unit (CPU), the chipset, or the display unit thereof,
also have constantly increased operating speed. The electronic
elements operating at high speed would produce more heat in one
unit time. The produced heat must be timely removed with proper
means, so as to avoid lowered stability and performance of the
electronic products or even burnout of the electronic elements.
[0003] The heat dissipation devices generally adopted by the
electronic industry for removing heat from the electronic elements
include fans, heat sinks and heat pipes. The heat sink is provided
to contact with a heat source for absorbing heat, and the absorbed
heat is then transferred to a remote location by a heat pipe for
dissipating into ambient air. The fan is used to force air flow
through the heat sink to carry the absorbed heat away from the heat
sink. For a heat source that is located in a considerably narrow
space or has a considerably large area, a vapor chamber is usually
selected as the heat dissipation element for heat transfer and heat
dissipation.
[0004] A conventional vapor chamber is formed by closing two mating
plates to each other, so as to define a sealed chamber between the
two closed plates. The sealed chamber is in a vacuum state and has
a supporting structure and a wick structure provided therein. The
wick structure for the conventional vapor chamber can be a mesh
structure, a sintered-powder structure or a plurality of grooves,
and is formed, in a secondary processing, on one side of the plate
that is to be closed by the other plate. After the two plates are
closed together, air enclosed in the sealed chamber is evacuated to
produce a vacuum state in the chamber, and then the chamber is
filled with a working fluid. When forming the conventional vapor
chamber through the above procedures, a lot of labor, time and
material are required.
[0005] In conclusion, the prior art vapor chamber has the following
disadvantages: (1) requiring higher manufacturing cost; and (2)
requiring longer manufacturing time.
[0006] It is therefore tried by the inventor to develop an improved
vapor chamber structure to eliminate the disadvantages in the prior
art vapor chamber.
SUMMARY OF THE INVENTION
[0007] A primary object of the present invention is to provide a
vapor chamber structure that is manufactured with reduced labor
cost and shortened manufacturing time.
[0008] To achieve the above and other objects, the vapor chamber
structure according to the present invention includes a main body
internally defining a sealed chamber and having a plurality of
radiating fins externally provided thereon. The radiating fins are
integrally formed on and outward extended from one side of the main
body in a direction opposite to the chamber; and the chamber is
internally provided with a wick structure and filled with a working
fluid.
[0009] The vapor chamber structure according to the present
invention can be integrally formed by way of extrusion to have the
sealed chamber and the plurality of outward extended radiating
fins. In this way, the vapor chamber structure can be manufactured
with reduced material and labor as well as shortened manufacturing
time to largely lower the overall manufacturing cost thereof.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein
[0011] FIG. 1A is a perspective sectional view of a vapor chamber
structure according to a first embodiment of the present
invention;
[0012] FIG. 1B is a cross sectional view of the vapor chamber
structure of FIG. 1A;
[0013] FIG. 2 is a cross sectional view of a vapor chamber
structure according to a second embodiment of the present
invention;
[0014] FIG. 3 is a cross sectional view of a vapor chamber
structure according to a third embodiment of the present
invention;
[0015] FIG. 4A is a perspective sectional view of a vapor chamber
structure according to a fourth embodiment of the present
invention; and FIG. 4B is a cross sectional view of the vapor
chamber structure of FIG. 4A.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] The present invention will now be described with some
preferred embodiments thereof and with reference to the
accompanying drawings. For the purpose of easy to understand,
elements that are the same in the preferred embodiments are denoted
by the same reference numerals.
[0017] Please refer to FIGS. 1A and 1B that are perspective
sectional and cross sectional views, respectively, of a vapor
chamber structure 1 according to a first embodiment of the present
invention. As shown, the vapor chamber structure 1 in the first
embodiment includes a main body 10, which defines a sealed chamber
102 and has a plurality of radiating fins 101 provided thereon. The
radiating fins 101 are outward extended from one side of the main
body 10 in a direction opposite to the chamber 102. The chamber 102
is internally provided with a wick structure 1021 and filled with a
working fluid 1022.
[0018] The wick structure 1021 can be formed of a plurality of
grooves, a sintered powder structure, or a mesh structure. In the
first embodiment, the wick structure 1021 is illustrated as a
plurality of grooves without limiting the present invention
thereto.
[0019] In the present invention, the radiating fins 101 and the
chamber 102 are integrally formed with one another.
[0020] Please refer to FIG. 2 that is a cross sectional view of a
vapor chamber structure 1 according to a second embodiment of the
present invention. As shown, the vapor chamber structure 1 in the
second embodiment is generally structurally similar to that in the
first embodiment, except that the wick structure 1021 in the second
embodiment is illustrated as a sintered-powder structure without
limiting the present invention thereto.
[0021] FIG. 3 is a cross sectional view of a vapor chamber
structure 1 according to a third embodiment of the present
invention. As shown, the vapor chamber structure 1 in the third
embodiment is generally structurally similar to that in the first
embodiment, except that the wick structure 1021 in the third
embodiment is illustrated as a mesh structure without limiting the
present invention thereto.
[0022] FIGS. 4A and 4B are perspective sectional and cross
sectional views, respectively, of a vapor chamber structure 1
according to a fourth embodiment of the present invention.
[0023] As shown, the vapor chamber structure 1 in the fourth
embodiment is generally structurally similar to that in the first
embodiment, except that the main body 10 in the fourth embodiment
includes a first side 11 and an opposite second side 12. The
radiating fins 101 can be selectively formed on the first side 11
or the second side 12 to outward extend therefrom, while the other
side of the main body 10 without the radiating fins 101 is for
contacting with a heat source 2.
[0024] By integrally forming the radiating fins 101 and the chamber
102 with one another in manufacturing the vapor chamber structure
1, it is not necessary to assemble the radiating fins to the vapor
chamber by welding or other additional mechanical processing.
Therefore, the manufacturing process of the vapor chamber structure
1 is effectively simplified to reduce the labor cost and the
manufacturing time thereof.
[0025] In summary, compared to the prior art, the vapor chamber
structure according to the present invention has the following
advantages: (1) reduced manufacturing cost; and (2) reduced labor
cost and shortened manufacturing time.
[0026] The present invention has been described with some preferred
embodiments thereof and it is understood that many changes and
modifications in the described embodiments can be carried out
without departing from the scope and the spirit of the invention
that is intended to be limited only by the appended claims.
* * * * *