U.S. patent application number 13/727559 was filed with the patent office on 2014-06-26 for heat dissipation assembly.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to HSUAN-I LIN.
Application Number | 20140174699 13/727559 |
Document ID | / |
Family ID | 50973301 |
Filed Date | 2014-06-26 |
United States Patent
Application |
20140174699 |
Kind Code |
A1 |
LIN; HSUAN-I |
June 26, 2014 |
HEAT DISSIPATION ASSEMBLY
Abstract
A heat sink assembly includes a base, a heat pipe, a first heat
sink, and a second heat sink. The second heat sink is installed
between the base and the first heat sink. The heat pipe includes a
positioning portion sandwiched between the second heat sink and the
base, and two heat-conductive portions extending up from two
opposite ends of the positioning portion and inserted into the
first heat sink.
Inventors: |
LIN; HSUAN-I; (New Taipei,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HON HAI PRECISION INDUSTRY CO., LTD. |
New Taipei |
|
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
New Taipei
TW
|
Family ID: |
50973301 |
Appl. No.: |
13/727559 |
Filed: |
December 26, 2012 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
H01L 23/4006 20130101;
F28F 1/32 20130101; H01L 23/427 20130101; H01L 23/3672 20130101;
H01L 2924/0002 20130101; F28D 2021/0029 20130101; F28F 2215/04
20130101; F28D 15/0275 20130101; H01L 2924/0002 20130101; H01L
2924/00 20130101; F28F 3/02 20130101; H01L 23/467 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 25, 2012 |
TW |
101149728 |
Claims
1. A heat dissipation assembly, comprising: a base; a first heat
sink installed on the base; a second heat sink installed between
the base and the first heat sink; and a heat pipe comprising a
positioning portion sandwiched between the second heat sink and the
base, and two heat-conductive portions extending up from two
opposite ends of the positioning portion and inserted into the
first heat sink; wherein the base comprises a rectangular bracket,
two spaced baffling pieces extend up from each side of the bracket,
the baffling pieces at the each side of the bracket cooperatively
bound a cutout, the heat pipe further comprises two connecting
portions respectively connected between the heat-conductive
portions and the two opposite ends of the positioning portion, each
baffling piece faces the corresponding connecting portion, and the
second heat sink is located between the cutouts of the bracket.
2. The heat dissipation assembly of claim 1, wherein the first heat
sink is supported on the bracket, and a bottom of the first heat
sink is engaged with the baffling pieces.
3. The heat dissipation assembly of claim 1, wherein the base
further comprises a connecting member, the bracket defines an
opening, the connecting member comprises a supporting plate
received in the opening and two flanges extending out from two
opposite ends of the supporting plate to be mounted to the bracket,
the baffling pieces are respectively located at two opposite sides
of the opening, and the second heat sink is mounted on the support
plate.
4. The heat dissipation assembly of claim 3, wherein a top of the
supporting plate defines a first receiving slot for receiving a
bottom of the positioning portion of the heat pipe.
5. The heat dissipation assembly of claim 4, wherein the second
heat sink comprises a bottom plate and a plurality of fins
extending up from the bottom plate, the bottom plate defines a
second receiving slot for receiving a top of the positioning
portion of the heat pipe.
6. The heat dissipation assembly of claim 1, wherein the first heat
sink comprises a plurality of fins parallel to and spaced from one
another, each fin defines two inserting holes, the heat-conductive
portions are inserted into the inserting holes of each fin.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a heat dissipation
assembly.
[0003] 2. Description of Related Art
[0004] Central processing units (CPUs) of computers or servers
generate a large amount of heat during operation. The heat needs to
be dissipated immediately to ensure the continued proper
functioning of the computers or servers. Presently, a conventional
heat dissipation assembly is usually mounted on a CPU for
dissipating the heat. The heat dissipation assembly includes a
base, a heat sink, and a substantially U-shaped heat pipe connected
between the base and the heat sink. However, although the base and
the heat sink cooperatively bound a space for system airflow, the
system airflow cannot fully contact with the heat sink, thus
reducing heat dissipating efficiency of the heat sink.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the embodiments can be better understood
with reference to the drawings. The components in the drawings are
not necessarily drawn to scale, the emphasis instead being placed
upon clearly illustrating the principles of the embodiments.
Moreover, in the drawings, like reference numerals designate
corresponding parts throughout the several views.
[0006] FIG. 1 is an exploded, isometric view of an exemplary
embodiment of a heat dissipation assembly, together with a
motherboard.
[0007] FIG. 2 is an assembled, isometric view of the heat
dissipation assembly and the motherboard of FIG. 1.
[0008] FIG. 3 is a side plan view of FIG. 2, showing the heat
dissipation assembly in use.
DETAILED DESCRIPTION
[0009] The present disclosure, including the accompanying drawings,
is illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0010] FIG. 1 shows an embodiment of a heat dissipation assembly
for dissipating heat of an electronic component 302 mounted on a
motherboard 300. The heat dissipation assembly includes a base 20,
a first heat sink 40, a second heat sink 60, and three U-shaped
heat pipes 80. In the embodiment, the electronic component 302 is a
central processing unit.
[0011] The base 20 includes a bracket 22 and a connecting member
24.
[0012] The bracket 22 includes a substantially rectangular bottom
wall 222. The bottom wall 222 defines a rectangular opening 223 in
a middle of the bottom wall 222, and a plurality of screw holes 224
located at two opposite sides of the opening 223. Two opposite and
spaced baffling pieces 226 extend up from each side of the bottom
plate 222, and cooperatively bound a cutout 227. Four fasteners 228
are respectively installed on four corners of the bottom wall 222,
to be mounted to the motherboard 300. The electronic component 302
is received in the opening 223 of the bracket 22.
[0013] The connecting member 24 includes a rectangular supporting
plate 242 and two flanges 244 extending out from upper portions of
two opposite ends of the supporting plate 242. Each flange 244
defines a plurality of through holes 246. A top of the supporting
plate 242 defines three receiving slots 247 parallel to the flanges
244.
[0014] The first heat sink 40 includes a plurality of fins 42 each
defining a plurality of inserting holes 44.
[0015] The second heat sink 60 includes a rectangular bottom plate
62 and a plurality of fins 64 perpendicularly extending up from the
bottom plate 62. A bottom of the bottom plate 62 defines three
parallel receiving slots 66, opposite to the fins 64.
[0016] Each heat pipe 80 includes a positioning portion 82, two
heat-conductive portions 84, and two connecting portions 83
respectively connected between two opposite ends of the positioning
portion 82 and the heat-conductive portions 84.
[0017] FIG. 2 shows that in assembly of the heat dissipation
assembly, the supporting plate 242 is received in the opening 223
of the bracket 22, and a bottom surface of the supporting plate 242
is abutted against the electronic component 302. A plurality of
screws extends through the through holes 246 of the connecting
member 24, to be screwed into the corresponding screw holes 224. A
bottom of the positioning portion 82 of each heat pipe 80 opposite
to the heat-conductive portions 84 is received in the corresponding
receiving slot 247 of the connecting member 24, and jointed to the
supporting plate 424. Thereby, the baffling pieces 226 respectively
face the connecting portions 82 of the heat pipes 80. The second
heat sink 60 is mounted on the supporting plate 242. Tops of the
positioning portions 82 are received in the corresponding receiving
slots 66, and jointed to the second heat sink 60. The
heat-conductive portions 84 are inserted into the corresponding
inserting holes 44 of each fin 42. The fins 42 are jointed to the
heat-conductive portions 84. The fins 42 are parallel to and spaced
from one another. A bottom of the first heat sink 40 is abutted
against the baffling pieces 226, and jointed to the baffling pieces
226. The second heat sink 60 is located between the cutouts 227 of
the bracket 22.
[0018] Referring to FIG. 3, in use, a first part of heat generated
by the electronic component 302 is transferred to the second heat
sink 60 through the connecting member 24 and the positioning
portions 82 of the heat pipes 80. A second part of the heat is
transferred to the first heat sink 40 through the heat-conductive
portions 84 of the heat pipes 80. Airflow generated by system fans
(not shown) flows through the fins 42, and the fins 64 from the
cutouts 227. The airflow can fully contact with the first and
second fins 42 and 64, to increase heat-dissipation
effectiveness.
[0019] While the disclosure describes examples and embodiments, it
is to be understood that the disclosure is not limited thereto. On
the contrary, the disclosure is intended to cover various
modifications and similar arrangements as would be apparent to
those skilled in the art. Therefore, the scope of the appended
claims should be accorded the broadest interpretation so as to
encompass all such modifications and similar arrangements.
* * * * *