U.S. patent application number 13/917630 was filed with the patent office on 2014-06-19 for working machine.
This patent application is currently assigned to GENESIS PHOTONICS INC.. The applicant listed for this patent is Gwo-Jiun Sheu, Tai-Cheng Tsai, Zhe-Long Wang. Invention is credited to Gwo-Jiun Sheu, Tai-Cheng Tsai, Zhe-Long Wang.
Application Number | 20140170936 13/917630 |
Document ID | / |
Family ID | 50931443 |
Filed Date | 2014-06-19 |
United States Patent
Application |
20140170936 |
Kind Code |
A1 |
Tsai; Tai-Cheng ; et
al. |
June 19, 2014 |
WORKING MACHINE
Abstract
A working machine includes a work piece, at least one signal
generator and a detector. The signal generator is disposed beside
the work piece for transmitting a signal. The detector is disposed
beside the work piece so as to detect the signal transmitted by the
signal generator and get a location information of the work
piece.
Inventors: |
Tsai; Tai-Cheng; (Tainan
City, TW) ; Sheu; Gwo-Jiun; (Tainan City, TW)
; Wang; Zhe-Long; (Tainan City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Tsai; Tai-Cheng
Sheu; Gwo-Jiun
Wang; Zhe-Long |
Tainan City
Tainan City
Tainan City |
|
TW
TW
TW |
|
|
Assignee: |
GENESIS PHOTONICS INC.
Tainan City
TW
|
Family ID: |
50931443 |
Appl. No.: |
13/917630 |
Filed: |
June 13, 2013 |
Current U.S.
Class: |
451/9 |
Current CPC
Class: |
B24B 37/005
20130101 |
Class at
Publication: |
451/9 |
International
Class: |
B24B 49/12 20060101
B24B049/12 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 19, 2012 |
TW |
101148417 |
Mar 22, 2013 |
TW |
102110262 |
Claims
1. A working machine, comprising: a work piece; at least one signal
generator disposed beside the work piece for transmitting a signal;
and a detector disposed beside the work piece so as to detect the
signal transmitted by the signal generator and get a location
information of the work piece.
2. The working machine as recited in claim 1, wherein the work
piece comprises a laser head or a polishing platform.
3. The working machine as recited in claim 2, wherein the signal
generator and the detector are disposed at the same side of the
work piece.
4. The working machine as recited in claim 3, wherein the detector
is directly disposed on the work piece.
5. The working machine as recited in claim 1, further comprising:
at least one guide, wherein the signal generator, the detector and
the guide are disposed at the same side of the work piece, the
guide is directly disposed on the work piece, and the guide guides
the signal transmitted by the signal generator to the detector.
6. The working machine as recited in claim 5, wherein the signal
generator and the detector are respectively located on two opposite
sides of a normal direction of the guide.
7. The working machine as recited in claim 5, wherein guide
comprises a reflective mirror.
8. The working machine as recited in claim 1, wherein the signal
generator comprises an acoustic wave generator or a light wave
generator.
9. The working machine as recited in claim 1, wherein the detector
comprises a matrix detector.
10. The working machine as recited in claim 1, further comprising:
a controller connected to the detector to receive the location
information and generate an adjusting information; and an adjuster
connected to the controller and the work piece, wherein the
adjuster receives the adjusting information and adjusts a location
of the work piece based on the adjusting information.
11. The working machine as recited in claim 10, wherein the
controller comprises a computer.
12. The working machine as recited in claim 10, wherein the
adjuster comprises an actuator.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefits of Taiwan
application serial no. 101148417, filed on Dec. 19, 2012, and
Taiwan application serial no. 102110262, filed on Mar. 22, 2013.
The entirety of each of the above-mentioned patent applications is
hereby incorporated by reference herein and made a part of
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a working machine, and more
particularly to a working machine having a signal generator and a
detector.
[0004] 2. Description of Related Art
[0005] During a polishing process of a wafer, the wafer is
generally polished in a spinning manner by using a polishing
machine. Since it cannot be previously determined whether the
polishing machine is in a horizontal status, quality of the
polished wafers constantly changes due to uneven polishing or
fragmentation. Further, during a cutting process on the wafer,
conventionally a plurality of intersected cutting lines is formed
on the wafer by a laser beam emitted by a laser head of a laser
cutting apparatus on a predetermined cutting path. Accumulated
errors caused by tilt angles may occur after using many times
(i.e., after the laser head shifts by an excessive distance with
respect to an initial location). However, users cannot be informed
on whether the laser head is tilted before the laser cutting
process is performed. Therefore, a case where the cutting lines
formed on the wafer in the subsequent process diverge from a
predetermined cutting location may arise accordingly. Moreover,
said case may also affect a splitting operation along the cutting
lines in subsequent process, such that chips may have a size prone
to inconsistency or an irregular edge profile. In some severe
cases, devices or circuits on the chips may be damaged, leading to
malfunctions of the chips. Accordingly, it is an important subject
of how to get a status of the working machine (including polishing
machine or laser cutting apparatus) instantly before working with
it.
SUMMARY OF THE INVENTION
[0006] The invention directs to a working machine with increased
working yield rate.
[0007] The working machine of the invention includes a work piece,
at least one signal generator and a detector. The signal generator
is disposed beside the work piece for transmitting a signal. The
detector is disposed beside the work piece so as to detect the
signal transmitted by the signal generator and get a location
information of the work piece.
[0008] In an embodiment of the invention, the work piece includes a
laser head and a polishing platform.
[0009] In an embodiment of the invention, the signal generator and
the detector are disposed at the same side of the work piece.
[0010] In an embodiment of the invention, the detector is directly
disposed on the work piece.
[0011] In an embodiment of the invention, the working machine
further includes at least one guide, in which the signal generator,
the detector and the guide are disposed at the same side of the
work piece, the guide is directly disposed on the work piece and
the guide guides the signal transmitted by the signal generator to
the detector.
[0012] In an embodiment of the invention, the signal generator and
the detector are respectively located on two opposite sides of a
normal direction of the guide.
[0013] In an embodiment of the invention, the guide includes a
reflective mirror.
[0014] In an embodiment of the invention, the signal generator
includes an acoustic wave generator or a light wave generator.
[0015] In an embodiment of the invention, the detector includes a
matrix detector.
[0016] In an embodiment of the invention, the working machine
further includes a controller and an adjuster. The controller is
connected to the detector to receive the location information and
generate an adjusting information. The adjuster is connected to the
controller and the work piece, in which the adjuster receives the
adjusting information and adjusts the location of the work piece
based on the adjusting information.
[0017] In an embodiment of the invention, the controller includes a
computer.
[0018] In an embodiment of the invention, the adjuster includes an
actuator.
[0019] Based on above, since the working machine of the invention
has the signal generator and the detector, the signal transmitted
by the signal generator may be detected by the detector, so as to
get a location information of the work piece. As a result, it can
be instantly informed whether the location of the work piece is
tilted before working with the work piece, so as to increase
working yield rate of the working machine.
[0020] To make the above features and advantages of the invention
more comprehensible, several embodiments accompanied with drawings
are described in detail as follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0022] FIG. 1 is a schematic diagram illustrating a working machine
according to an embodiment of the invention.
[0023] FIG. 2 is a schematic diagram illustrating a working machine
according to another embodiment of the invention.
[0024] FIG. 3 is a schematic diagram illustrating a working machine
according to another embodiment of the invention.
[0025] FIG. 4 is a schematic diagram illustrating a working machine
according to another embodiment of the invention.
[0026] FIG. 5 is a schematic diagram illustrating a working machine
according to another embodiment of the invention.
[0027] FIG. 6 is a schematic diagram illustrating a working machine
according to another embodiment of the invention.
[0028] FIG. 7 is a schematic diagram illustrating a working machine
according to another embodiment of the invention.
DESCRIPTION OF THE EMBODIMENTS
[0029] FIG. 1 is a schematic diagram illustrating a working machine
according to an embodiment of the invention. Referring to FIG. 1,
in the present embodiment, a working machine 100a is suitable for
cutting a wafer W. The working machine 100a includes a work piece
110, at least one signal generator 130 (only one is schematically
depicted in FIG. 1) and a detector 140a. More specifically, the
work piece 100 is a laser head for emitting a laser beam L to the
wafer W. The signal generator 130 is disposed beside the work piece
110 for transmitting a signal. The detector 140a is disposed beside
the work piece 110 so as to detect the signal transmitted by the
signal generator 130 and get a location information of the work
piece 110. Herein, the working machine 100a is, for example, a
laser cutting machine.
[0030] More specifically, in the present embodiment, the signal
generator 130 is, for example, an acoustic wave generator or a
light wave generator. In other words, in case when the signal
generator 130 is the acoustic wave generator, the signal
transmitted by the signal generator 130 is an acoustic wave signal.
On the other hand, in case when the signal generator 130 is the
light wave generator, the signal transmitted by the signal
generator 130 is a light wave signal. In addition, the detector
140a herein is, for example, a matrix detector, once the detector
140a receives the signal transmitted by the signal generator 130,
the location information gotten may be expressed in formation of a
matrix. As shown in FIG. 1, the signal generator 130 and the
detector 140a are disposed at a same side of the work piece 110,
and the detector 140a are directly disposed on the work piece
110.
[0031] Since the working machine 100a of the present embodiment
includes the signal generator 130 and the detector 140a, the
detector 140a may detect the signal transmitted by the signal
generator 130 and get the location information of the work piece
110. Accordingly, it can be instantly informed whether the location
of the work piece is tilted before cutting the wafer W, so as to
increase working yield rate of the working machine 100a.
[0032] It should be noted that the reference numerals and a part of
the contents in the previous embodiment are used in the following
embodiments, in which identical reference numerals indicate
identical or similar components, and repeated description of the
same technical contents is omitted. For a detailed description of
the omitted parts, reference can be found in the previous
embodiment, and no repeated description is contained in the
following embodiments.
[0033] FIG. 2 is a schematic diagram illustrating a working machine
according to another embodiment of the invention. Referring to FIG.
2, a working machine 100b of the present embodiment is similar to
the working machine 100a of FIG. 1, while the main difference
therebetween lies in that the working machine 100b of the present
embodiment further includes at least one guide 120 (only one is
schematically depicted in FIG. 2). As shown in FIG. 2, the signal
generator 130, a detector 140b and the guide 120 are disposed at
the same side of the work piece 110, and the guide 120 is directly
disposed on the work piece 110, and the guide 120 guides the signal
transmitted by the signal generator 130 to the detector 140b.
Herein, the signal generator 130 and the detector 140b are
respectively located on two opposite sides of a normal direction N
of the guide 120.
[0034] For instance, in case when the location information is
identical to a predetermined location information, the location of
work piece 110 is located on a normal direction n of the wafer W as
shown in FIG. 2, such that the cutting lines D can be cut directly
by laser beam L vertically to a surface of the wafer W. In case
when the location information is different to the predetermined
location information, the location of work piece 110 of the working
machine 100b is diverged from the normal direction n of the work
piece W (i.e., the work piece 110 is tilted) as shown in FIG. 3,
such that the cutting lines D cannot be cut because the laser beam
L is not vertically to a surface of the work piece W. Accordingly,
the location of the work piece 110 must be adjusted before cutting
the cutting lines D. In summary, the signal transmitted by the
signal generator 130 is guided to the detector 140b through the
guide 120 before cutting the cutting lines D, so as to detect the
location of the work piece 110. That is to say, it is instantly
informed by the detector 140b whether the work piece 110 is tilted
before proceeding to subsequent cutting processes. As a result,
working yield rate of the working machine 100b may be effectively
increased.
[0035] FIG. 4 is a schematic diagram illustrating a working machine
according to another embodiment of the invention. Referring to FIG.
4, a working machine 100c of the present embodiment is similar to
the working machine 100b of FIG. 2, while the main difference
therebetween lies in that the working machine 100c of the present
embodiment further includes a controller 150 and an adjuster 160.
The controller 150 is electrically connected to the detector 140b
to receive the location information and generate an adjusting
information. The adjuster 160 is electrically connected to the
controller 150 and the work piece 110. More specifically, the
adjuster 160 receives the adjusting information and adjusts the
location of the work piece 110 based on the adjusting information
(e.g., adjusting the work piece 110 and the laser beam L at full
line to the work piece 110 and the laser beam L at dotted line, as
shown in FIG. 4), such that the cutting lines D on the wafer W may
be cut by the laser beam L. Herein, the controller 150 is, for
example, a computer which may calculate the location information
gotten by the detector 140b to generate the adjusting information.
The adjuster 160 is, for example, an actuator which may
automatically adjust the location of the work piece 110 based on
the adjusting information (i.e., the location of the work piece 110
is adjusted to locate on the normal direction n of the wafer W). As
a result, working yield rate of the working machine 100c may be
increased, and working efficiency of the working machine 100c may
also be increased by said automated adjustment.
[0036] Since the working machines 100a, 100b and 100c of the
present embodiment include the signal generator 130 and the
detectors 140a and 140b, the detectors 140a and 140b may detect the
signal transmitted by the signal generator 130 and get the location
information of the work piece 110. Of course, the signal
transmitted by the signal generator 130 may also be guided by the
guide 120 to the detectors 140a and 140b, so as to detect the
location of the work piece 110. Accordingly, it can be instantly
informed whether the location of the work piece 110 is tilted
before cutting the wafer W, so as to increase working yield rates
of the working machines 100a, 100b and 100c. In addition to the
present embodiment, the controller 150 and the adjuster 160 may
also be disposed so the controller 150 may receive the location
information and generate the adjusting information, and the
adjuster 160 may automatically adjust the location of the work
piece 110 based on the adjusting information, so as to increase
yield rates of the working machines 100a, 100b and 100c.
[0037] FIG. 5 is a schematic diagram illustrating a working machine
according to another embodiment of the invention. Referring to FIG.
5, in the present embodiment, the working machine 200a includes a
work piece 210, at least one signal generator 230 (only one is
schematically depicted in FIG. 5) and a detector 240a. More
specifically, the work piece 210 is a polishing platform, the
working machine 200a further includes a upper rotating disc 270, at
least one wafer (not illustrated) placed between the upper rotating
disc 270 and the work piece 210, and the work piece 210 faces the
wafer to perform a polishing process. The signal generator 230 is
disposed beside the work piece 210 for transmitting a signal. The
detector 240a is disposed beside the work piece 210 so as to detect
the signal transmitted by the signal generator 230 and get a
location information of the work piece 210. Herein, the working
machine 200a is, for example, a polishing machine.
[0038] More specifically, in the present embodiment, the signal
generator 230 is, for example, an acoustic wave generator or a
light wave generator. In other words, in case when the signal
generator 230 is the acoustic wave generator, the signal
transmitted by the signal generator 230 is an acoustic wave signal.
On the other hand, in case when the signal generator 230 is the
light wave generator, the signal transmitted by the signal
generator 230 is a light wave signal. In addition, the detector
240a herein is, for example, a matrix detector, once the detector
240a receives the signal transmitted by the signal generator 230,
the location information gotten may be expressed in formation of a
matrix. As shown in FIG. 5, the signal generator 230 and the
detector 240a are disposed at the same side (e.g., at a lower side)
of the work piece 210, and the detector 240a is directly disposed
on the work piece 210.
[0039] Since the working machine 200a of the present embodiment
includes the signal generator 230 and the detector 240a, the
detector 240a may detect the signal transmitted by the signal
generator 230 and get the location information of the work piece
210. Accordingly, it can be instantly informed whether the location
of the work piece 210 is tilted before performing the polishing
process, so as to increase working yield rate (i.e., polishing
yield rate) of the working machine 200a.
[0040] FIG. 6 is a schematic diagram illustrating a working machine
according to another embodiment of the invention. Referring to FIG.
6, a working machine 200b of the present embodiment is similar to
the working machine 200a of FIG. 5, while the main difference
therebetween lies in that the working machine 200b of the present
embodiment further includes two guides 220a and 220b, and the
working machine has two signal generators 230a and 230b. As shown
in FIG. 6, the signal generators 230a and 230b, a detector 240b and
the guides 220a and 220b are disposed on the same side (e.g., at a
lower side) of the work piece 210, and the guides 220a and 220b are
directly disposed on the work piece 210. The guides 220a and 220b
respectively guide the signals transmitted by the signal generators
230a and 230b to the detector 240b. Herein, the guides 220a and
220b are respectively located on two opposite sides of a normal
direction N1 of the detector 240b, the signal generator 230a and
detector 240b are respectively located on two opposite sides of a
normal direction N2 of the guide 220a, and the signal generator
230b and the detector 240b are respectively located on two opposite
sides of a normal direction N3 of the guide 220b.
[0041] The signals transmitted by the signal generators 230a and
230b may be guided to the detector 240b through the guide 220a and
220b before performing the polishing process, so as to detect the
location of the work piece 210. That is to say, it is instantly
informed by the detector 240b whether the work piece 210 is tilted
before proceeding to subsequent cutting processes. As a result,
working yield rate (i.e., polishing yield rate) of the working
machine 200b may be effectively increased.
[0042] FIG. 7 is a schematic diagram illustrating a working machine
according to another embodiment of the invention. Referring to FIG.
7, a working machine 200c of the present embodiment is similar to
the working machine 200a of FIG. 5, while the main difference
therebetween lies in that the working machine 200c of the present
embodiment further includes a controller 250 and an adjuster 260.
The controller 250 is electrically connected to the detector 240a
to receive the location information and generate an adjusting
information. The adjuster 260 is electrically connected to the
controller 250 and the work piece 210. More specifically, the
adjuster 260 receives the adjusting information and adjusts the
location of the work piece 210 based on the adjusting information,
such that the work piece 210 presents in a horizontal status.
Herein, the controller 250 is, for example, a computer which may
calculate the location information gotten by the detector 240a to
generate the adjusting information. The adjuster 260 is, for
example, an actuator which may automatically adjust the location of
the work piece 210 based on the adjusting information. As a result,
working yield rate of the working machine 200c may be effectively
increased, and working efficiency of the working machine 200c may
also be increased by said automated adjustment.
[0043] In view of above, since the working machine of the invention
has the signal generator and the detector, the signal transmitted
by the signal generator may be detected by the detector, so as to
get a location information of the work piece. As a result, it can
be instantly informed whether the location of the work piece is
tilted before working with the work piece, so as to increase
working yield rate of the working machine.
[0044] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *