U.S. patent application number 14/029809 was filed with the patent office on 2014-06-19 for circuit board and manufacturing method thereof.
This patent application is currently assigned to Wistron Corporation. The applicant listed for this patent is Wistron Corporation. Invention is credited to Jui-Yun Fan, Howard Huang, Hui-Lin Lu, Zheng-Wei Wu.
Application Number | 20140166354 14/029809 |
Document ID | / |
Family ID | 50912336 |
Filed Date | 2014-06-19 |
United States Patent
Application |
20140166354 |
Kind Code |
A1 |
Fan; Jui-Yun ; et
al. |
June 19, 2014 |
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Abstract
A circuit board includes a circuit board plate, a conductive
ring, a solder mask and at least one insulating pad. The circuit
board plate includes a surface and a conductive through hole
passing through the surface and the circuit board plate, wherein
the conductive through hole have a conductive layer disposed on a
wall thereof. The conductive ring on the surface surrounds an
opening of the conductive through hole on the surface and
electrically connects to the conductive layer. The solder mask is
disposed on the surface. The conductive ring is exposed outside of
the solder mask. The insulating pad has a thickness. The first
surface of the insulating pad is adapted to contact the solder mask
or the surface and sited at periphery of the conductive ring. The
second surface of the insulating pad is adapted for spacing a
distance between a solder coating tool and the solder mask.
Inventors: |
Fan; Jui-Yun; (New Taipei
City, TW) ; Lu; Hui-Lin; (New Taipei City, TW)
; Huang; Howard; (New Taipei City, TW) ; Wu;
Zheng-Wei; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Wistron Corporation |
New Taipei City |
|
TW |
|
|
Assignee: |
Wistron Corporation
New Taipei City
TW
|
Family ID: |
50912336 |
Appl. No.: |
14/029809 |
Filed: |
September 18, 2013 |
Current U.S.
Class: |
174/263 ;
29/852 |
Current CPC
Class: |
H05K 3/341 20130101;
H05K 1/0298 20130101; H05K 3/0073 20130101; H05K 3/3452 20130101;
H05K 1/115 20130101; H05K 2203/04 20130101; H05K 3/3485 20200801;
Y10T 29/49165 20150115; H05K 3/3447 20130101; H05K 2201/09909
20130101; H05K 3/4664 20130101; H05K 2203/0588 20130101 |
Class at
Publication: |
174/263 ;
29/852 |
International
Class: |
H05K 3/40 20060101
H05K003/40; H05K 1/02 20060101 H05K001/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 17, 2012 |
CN |
201210549969.5 |
Claims
1. A circuit board, comprising: a circuit board plate comprising a
surface and a conductive through hole passing through the surface
and the circuit board plate, wherein the conductive through hole
have a conductive layer disposed on a wall thereof; a conductive
ring disposed on the surface, wherein the conductive ring surrounds
an opening of the conductive through hole located on the surface
and electrically connects to the conductive layer; a solder mask
disposed on the surface, wherein the conductive ring is exposed
outside of the solder mask; and at least one insulating pad
comprising a first surface and a second surface opposite to each
other and having a thickness, wherein the first surface is adapted
to contact the solder mask or the surface of the circuit board
plate and sited at periphery of the conductive ring, the second
surface is adapted to contact a solder coating tool when the solder
coating tool is covered on the circuit board thereby spacing a
distance between the solder coating tool and the solder mask.
2. The circuit board of claim 1, wherein the at least one
insulating pad is a closed ring, and the conductive ring is located
within the closed ring.
3. The circuit board of claim 2, wherein the at least one of the
insulating pad independently surrounds a corresponding one of the
conductive ring.
4. The circuit board of claim 2, wherein the at least of the
insulating pad surrounds a corresponding plurality of the
conductive rings.
5. The circuit board of claim 1, wherein the at least one
insulating pad is a non-closed ring, the conductive ring is located
within the non-closed ring.
6. The circuit board of claim 5, wherein the at least one of the
insulating pad independently surrounds a corresponding one of the
conductive ring.
7. The circuit board of claim 5, wherein the at least of the
insulating pad surrounds a corresponding plurality of the
conductive rings.
8. The circuit board of claim 1, wherein the at least one
insulating pad comprises a plurality of insulating pads, the
plurality of insulating pads are distributed at periphery of the
conductive ring.
9. The circuit board of claim 8, wherein the conductive ring is
jointly surrounded by the plurality of insulating pads.
10. The circuit board of claim 8, wherein the plurality of
insulating pads jointly surrounds a corresponding plurality of the
conductive rings.
11. The circuit board of claim 1, wherein a material of the
insulating pad comprises a silkscreen.
12. The circuit board of claim 11, wherein a color of the
silkscreen is different from a color of the solder mask.
13. The circuit board of claim 1, wherein a distance between each
of the at least one insulating pad and a center of the conductive
through hole is greater than a radius of the conductive ring.
14. A manufacturing method of a circuit board, comprising:
providing a circuit board plate, wherein the circuit board plate
comprises a surface and a conductive through hole passing through
the surface and the circuit board plate, wherein the conductive
through hole have a conductive layer disposed on a wall thereof;
disposing a conductive ring on the surface, wherein the conductive
ring surrounds an opening of the conductive through hole located on
the surface and electrically connects to the conductive layer;
disposing a solder mask on the surface, wherein the conductive ring
is exposed outside of the solder mask; and disposing at least one
insulating pad having a thickness onto the solder mask or the
surface of the circuit board plate, wherein the at least one
insulating pad sited at periphery of the conductive ring.
15. The manufacturing method of claim 14, further comprising:
placing a solder coating tool onto the circuit board plate, wherein
the solder coating tool is configured to contact the at least one
insulating pad to space a distance from the conductive ring, and
the solder coating tool comprises an opening corresponding to the
conductive ring; injecting a solder into the opening, a space
surrounded by the at least one insulating pad and the conductive
through hole; placing an electronic component onto the solder,
wherein the electronic component is a dual in-line package; and
performing a reflow to fix the electronic component to the circuit
board plate.
16. The manufacturing method of claim 14, wherein the at least one
insulating pad is a closed ring, and the conductive ring is located
within the closed ring.
17. The manufacturing method of claim 16, wherein the at least one
insulating pad independently surrounds a corresponding one of the
conductive ring.
18. The manufacturing method of claim 16, wherein the at least one
insulating pad surrounds a corresponding plurality of the
conductive rings.
19. The manufacturing method of claim 14, wherein the at least one
insulating pad is a non-closed ring, and the conductive ring is
located within the non-closed ring.
20. The manufacturing method of claim 19, wherein the at least one
insulating pad independently surrounds a corresponding one of the
conductive ring.
21. The manufacturing method of claim 19, wherein the at least one
insulating pad surrounds a corresponding plurality of the
conductive rings.
22. The manufacturing method of claim 14, wherein the at least one
insulating pad comprises a plurality of insulating pads distributed
at periphery of the conductive ring.
23. The manufacturing method of claim 22, wherein one conductive
ring is jointly surrounded by the plurality of insulating pads.
24. The manufacturing method of claim 22, wherein the plurality of
insulating pads jointly surrounds a corresponding plurality of the
conductive rings.
25. The manufacturing method of claim 14, wherein a material of the
insulating pad comprises a silkscreen.
26. The manufacturing method of claim 25, wherein a color of the
silkscreen is different from a color of the solder mask.
27. The manufacturing method of claim 14, wherein a distance
between each of the at least one insulating pad and a center of the
conductive through hole is greater than a radius of the conductive
ring.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of China
application serial no. 201210549969.5, filed on Dec. 17, 2012. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a circuit board and a method of
manufacturing the same. In particular, the present invention
relates to a circuit board capable of reducing missing solder of an
electronic component during through hole standard package and a
method of manufacturing the same.
[0004] 2. Description of Related Art
[0005] With multitasking and miniaturization of electronic products
today, sizes of circuit boards in electronic products may be
relatively reduced. An electronic component with fine pitch is
usually used for disposing on the circuit board having limited
space, but such method may increase difficulties in its
manufacturing process. For instance, during a process of surface
mount technology (SMT) for a circuit board, various electronic
components with different types and pitches are usually disposed on
the same circuit board, thus it is difficult to control an amount
of a solder (e.g., solder paste) to be printed.
[0006] Generally, a steel plate is used while printing the solder
in manufacturing process of the circuit board, and a thickness of
the steel plate may affect the amount of the solder to be printed.
Therefore, the thickness is selectively changed during the process
of surface mount according to the pitches of the electronic
components. To solve a shortage problem caused by fine pitch, the
steel plate cannot be too thick. However, for electronic components
adopting through hole standard package technology such as dual
inline package (DIP), a missing solder due to insufficient amount
of the solder may occur after reflow.
SUMMARY OF THE INVENTION
[0007] The invention is directed to a circuit board, which may
effectively reduce the chances in missing solder of the dual inline
package (DIP) electronic component from occurring.
[0008] The invention provides a manufacturing method of a circuit
board for manufacturing above-said circuit board.
[0009] The invention provides a circuit board including a circuit
board plate, a conductive ring, a solder mask and at least one
insulating pad. The circuit board plate includes a surface and a
conductive through hole passing through the surface and the circuit
board plate, wherein the conductive through hole have a conductive
layer disposed on a wall thereof. The conductive ring is disposed
on the surface, the conductive ring surrounds an opening of the
conductive through hole located on the surface and electrically
connects to the conductive layer. The solder mask is disposed on
the surface and the conductive ring is exposed outside of the
solder mask. The insulating pad includes a first surface and a
second surface opposite to each other and having a thickness, the
first surface is adapted to contact the solder mask or the surface
of the circuit board plate and sited at periphery of the conductive
ring, the second surface is adapted to contact a solder coating
tool when the solder coating tool is covered on the circuit board
thereby spacing a distance between the solder coating tool and the
solder mask.
[0010] The invention further provides a manufacturing method of a
circuit board, including the following steps. A circuit board plate
is provided, in which the circuit board plate includes a surface
and a conductive through hole passing through the surface and the
circuit board plate, wherein the conductive through hole have a
conductive layer disposed on a wall thereof. A conductive ring is
disposed on the surface, in which the conductive ring surrounds an
opening of the conductive through hole located on the surface and
electrically connects to the conductive layer. A solder mask is
disposed on the surface, in which the conductive ring is exposed
outside of the solder mask. At least one insulating pad having a
thickness is disposed onto the solder mask or the surface of the
circuit board plate, wherein the at least one insulating pad sited
at periphery of the conductive ring.
[0011] According to an embodiment of the invention, a solder
coating tool is further placed onto the circuit board plate, in
which the solder coating tool is configured to contact the at least
one insulating pad to space a distance from the conductive ring,
and the solder coating tool includes an opening corresponding to
the conductive ring. A solder is injected into the opening, a space
surrounded by the at least one insulating pad and the conductive
through hole. An electronic component is placed onto the solder, in
which the electronic component is a dual in-line package. A reflow
is performed to fix the electronic component to the circuit board
plate.
[0012] Based on above, by disposing insulating pad on the solder
mask or on the circuit board plate, the circuit board of the
invention may have the insulating pad to boost height of the solder
coating tool placed on the circuit board plate, so as to increase
the space for containing the solder while printing the solder. As a
result, thickness of solder may be increased to effectively reduce
the chances in missing solder of the dual inline package (DIP)
electronic component from occurring.
[0013] To make the above features and advantages of the invention
more comprehensible, several embodiments accompanied with drawings
are described in detail as follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1A is a schematic cross-sectional view illustrating a
circuit board according to a first embodiment of the invention.
[0015] FIG. 1B is a schematic top view illustrating the circuit
board depicted in FIG. 1A.
[0016] FIG. 2 is a schematic top view illustrating a circuit board
according to a second embodiment of the invention.
[0017] FIG. 3 is a schematic top view illustrating a circuit board
according to a third embodiment of the invention.
[0018] FIG. 4 is a schematic flow chart illustrating a
manufacturing method of a circuit board according to an embodiment
of the invention.
[0019] FIG. 5 is a schematic cross-sectional view of illustrating a
manufacturing method of fixing a dual inline package electronic
component to the circuit board depicted in FIG. 4.
DESCRIPTION OF THE EMBODIMENTS
[0020] FIG. 1A is a schematic cross-sectional view illustrating a
circuit board according to a first embodiment of the invention.
FIG. 1B is a schematic top view illustrating the circuit board
depicted in FIG. 1A. Referring to FIG. 1A and FIG. 1B together, a
circuit board 100 of the present embodiment includes a circuit
board plate 110, a conductive ring 120, a solder mask 130 and at
least one insulating pad 140.
[0021] The circuit board plate 110 includes a surface 112 and a
conductive through hole 114 passing through the surface 112 and the
circuit board plate 110. The conductive through hole 114 has a
conductive layer 115 disposed on a wall thereof, and the conductive
through hole 114 is adapted for pins of a dual inline package (DIP)
electronic component to be inserted and electrically connected to
the conductive layer 115 on the wall of the conductive through hole
114. The conductive ring 120 is disposed on the surface 112, the
conductive ring 120 surrounds an opening 117 of the conductive
through hole 114 located on the surface 112 and electrically
connects to the conductive layer 115 of the conductive through hole
114. In the present embodiment, the conductive ring 120 may be a
copper foil ring, but types of the conductive ring 120 are not
limited thereto. The solder mask 130 is disposed on the surface 112
and the conductive ring 120 is exposed outside of the solder mask
130. In the present embodiment, the solder mask 130 is a silkscreen
(commonly known as green paint) which may be applied on the circuit
board for solder masking and insulation, but types of the solder
mask 130 are not limited thereto.
[0022] The insulating pad 140 includes a first surface 142 and a
second surface 144 opposite to each other, the first surface 142 is
adapted to contact the solder mask 130 and sited at periphery of
the conductive ring 120, the second surface 144 is adapted to
contact a solder coating tool 10 when the solder coating tool 10 is
covered on the circuit board 100 thereby spacing a distance between
the solder coating tool 10 and the solder mask 130. The solder
coating tool 10 may be a steel plate for printing solder, but types
of the solder coating tool 10 are not limited thereto. In the
present embodiment, preferably, a thickness of the insulating pad
140 may be between 0.4 mm to 0.7 mm and a width of the insulating
pad 140 may be approximately 0.3 mm, but the thickness and the
width of the insulating pad 140 are not limited thereto.
[0023] According to the present embodiment, the circuit board plate
110 includes a plurality of the conductive through holes 114, the
circuit board 100 includes a plurality of the insulating pads 140,
an amount of the insulating pads are correspondingly related to an
amount of the conductive through holes 114, but said relation in
amounts of the insulating pads 140 and the conductive through holes
114 are not limited thereto. The conductive ring 120 located on the
surface 112 of the circuit board plate 110 surrounds the conductive
through hole 114, and the insulating pad 140 is disposed on the
solder mask 130 outside of the conductive ring 120 as shown in FIG.
1B, or on the surface 112 of the circuit board plate 110 where the
solder mask 130 is not present (not illustrated). The insulating
pad 140 is not directed contacted to the conductive ring 120, and
it is preferable that a gap between the insulating pad 140 and the
conductive ring 120 being 0.2 mm, but the distance between the
insulating pad 140 and the conductive ring 120 is not limited
thereto, for example, they can be adjacent to each other without
the gap or even being partially overlapped.
[0024] In the present embodiment, each of the insulating pads 140
is a closed ring (circular ring) separated from each other, and the
conductive ring 120 is located within the closed ring. As shown in
FIG. 1A, a distance D between each of the insulating pads 140 and a
center A of the conductive through hole 114 is greater than a
radius r1 of the conductive ring 120, and the radius r1 of the
conductive ring 120 is greater than a radius r2 of the conductive
through hole 114.
[0025] In addition, according to the present embodiment, a material
of the insulating pad 140 includes a silkscreen. The solder mask
130 is generally printed with marks such as characters or
geometrical forms, said marks are used to denote types of the
electronic component to be placed thereon or mark locations of pins
of the electronic component to be disposed thereon during
manufacturing process. Said marks such as characters or geometrical
forms are generally printed on the solder mask 130 or the surface
112 of the circuit board plate 110 by using the silkscreen. In the
present embodiment, the insulating pad 140 may be printed together
with said characters or geometrical forms, so as to omit additional
steps of disposing the insulating pad 140 on the solder mask 130 or
the circuit board plate 110. More preferably, a color of the
silkscreen used on the insulating pad 140 may be different from a
color of the silkscreen used on the solder mask 130, so as to
facilitate in compartmentalization and recognizability. For
instance, the color of the silkscreen on the solder mask 130 may be
green, whereas the color of the silkscreen on the insulating pad
140 may be white. Of course, materials and colors of the insulating
pad 140 are not particularly limited thereto. In other embodiments,
the insulating pad 140 may also be a non-conductive material such
as plastic or rubber, which can be fixed on the solder mask 130 or
the surface 112 of the circuit board plate 110 using methods such
as an adhering process.
[0026] FIG. 2 is a schematic top view illustrating a circuit board
according to a second embodiment of the invention. Referring to
FIG. 2, a major difference between a circuit board 200 depicted in
FIG. 2 and the circuit board 100 depicted in FIG. 1A is described
as follow. In FIG. 2, due to insufficient space, conductive through
holes 214 are too close to each other, an insulating pad 240 may
not be disposed the same way as illustrated in FIG. 1B where each
of the insulating pads 140 independently surrounds one conductive
ring 120. Therefore, in FIG. 2, only one insulating pad 240 is used
to surround a plurality of conductive rings 220. In other words,
the conductive rings 220 are all located within a region surrounded
by the insulating pad 240. According to the present embodiment, the
insulating pad 240 is still a closed ring, but a shape of the
insulating pad 240 may be varied based on location and amount of
the conductive rings 220, the shape is not necessary being the
circular ring as shown in FIG. 1B. Of course, forms of the
insulating pad 240 are not limited to the forgoing, as long as
height of a solder coating tool placed on a solder mask 230 or the
surface of the circuit board plate may be boosted and the
insulating pad 240 are adjacent to the conductive ring 220.
[0027] In addition, since no insulating pad 240 is used to space
apart different conductive rings 220, a solder on different
conductive rings 220 may seem to connect each other accidentally
when printing the solder (e.g., solder paste). Practically, during
a reflow, communication cohesion of the solder paste that flowed
into the conductive through hole 214 may separate solder paste on
different conductive rings 220 so as to avoid shortage between two
adjacent conductive rings 220 to occur.
[0028] The above two embodiments are illustrated by using the
insulating pads of the closed ring, practically, said one
insulating pad may also be a structure of non-closed ring such as a
C-shape, which may be used when one side of the conductive ring is
too close to other electronic components or edges of the plate.
[0029] FIG. 3 is a schematic top view illustrating a circuit board
according to a third embodiment of the invention. Referring to FIG.
3, a major difference between a circuit board 300 depicted in FIG.
3 and the circuit board 100 depicted in FIG. 1A is described as
follow. In FIG. 3, the circuit board 300 may include a plurality of
insulating pads 340 for each conductive ring 320, the insulating
pads 340 are distributed to jointly surround the conductive ring
320. In other words, the conductive ring 320 is not surrounded
entirely by the insulating pads 340 as in a closed fashion.
[0030] In the present embodiment, an amount of the insulating pads
340 at periphery of each conductive ring 320 is 8. Due to a smaller
thickness of the steel plate, the steel plate may be slightly
bended by a force applied on the steel plate when a scraper is used
to scrape off the solder on the steel plate. In this case, a
distance between the steel plate and a solder mask 330 or the
surface of the circuit board plate may be reduced accordingly. To
avoid above-said situation, the insulating pads 340 that is denser
or with a grater amount may be disposed at periphery of the
conductive ring 320 to support the steel plate, so as to reduce
chances of the force being applied on the steel plate when pressing
the scraper down to the steel plate thereby reducing the distance
between the steel plate and the colder mask 330 or the surface of
the circuit board plate. However, the amount, the shape and the
distribution of the insulating pads 340 are not particularly
limited thereto.
[0031] In addition, in the present embodiment, since the insulating
pads 340 may not be used as walls in the first embodiment to
surround the solder paste therein, the solder paste may slightly
leak outside of a surrounding range of the insulating pads 340.
However, during the reflow, similarly, communication cohesion of
the solder paste may allow the solder paste leaked outside of the
surrounding range of the insulating pads 340 to retract, so as to
avoid shortage between two adjacent conductive rings 320 to occur.
Therefore, the insulating pads 340 in non-close fashion may achieve
the effectiveness of boosting height of the solder coating tool
placed on the solder mask 330 or the surface of the circuit board
plate and shortage occurred between two adjacent conductive rings
320 may also avoided.
[0032] FIG. 4 is a schematic flow chart illustrating a
manufacturing method of a circuit board according to an embodiment
of the invention. Referring to FIG. 4, a manufacturing method of a
circuit board according to the present embodiment includes the
following steps.
[0033] First, a circuit board plate is provided, in which the
circuit board plate includes a surface and a conductive through
hole passing through the surface and the circuit board plate,
wherein the conductive through hole have a conductive layer
disposed on a wall thereof (step 410). An amount of the conductive
through holes may be varied based on to the dual inline package
(DIP) electronic component to be disposed, the amount of the
conductive through holes is not limited to one.
[0034] Next, a conductive ring is disposed on the surface, in which
the conductive ring surrounds an opening of the conductive through
hole located on the surface and electrically connects to the
conductive layer of the conductive through hole (step 420). Each
opening located on the surface of the conductive through holes is
surrounded by one conductive ring. In the present embodiment, the
conductive ring may be a copper foil ring, but types of the
conductive ring are not limited thereto. Further, a solder mask is
disposed on the surface, in which the conductive ring is exposed
outside of the solder mask (step 430). In the present embodiment,
the solder mask may be a silkscreen, which may be applied on the
circuit board for solder masking and insulation, but types of the
solder mask are not limited thereto
[0035] Subsequently, at least one insulating pad is disposed on the
solder mask or the surface of the circuit board plate without the
solder mask, in which the insulating pad is sited at periphery of
the conductive ring (step 440) and has a fixed thickness. In the
present embodiment, the insulating pad may be one separate closed
ring, and the conductive ring is located within said closed ring.
The insulating pads may also be in a form of blocks, the insulating
pads may be distributed at periphery of the conductive ring and
jointly surround one or more conductive ring, but the form of the
insulating pads are not limited thereto. In addition, a material of
the insulating may be a silkscreen printed together with marks on
the solder mask such as characters and geometrical forms, but
materials and dispositions of the insulating pads are limited
thereto.
[0036] The circuit boards respectively depicted in FIG. 1A, FIG. 2
and FIG. 3 may be completed by performing steps 410 to step 440.
Furthermore, a manufacturing method of fixing a dual inline package
(DIP) electronic component to the circuit board is described as
below.
[0037] Referring to FIG. 5, first, a solder coating tool 10 is
placed onto the circuit board plate 110, in which the solder
coating tool 10 contacts at least one insulating pad 140 to space a
distance from the conductive ring 120, and the solder coating tool
10 includes an opening 117 corresponding to the conductive ring 120
(step 450).
[0038] Next, referring again to FIG. 5, a solder 20 is injected
into an opening 15 of the solder coating tool 10, a space
surrounded by the at least one insulating pad 140 and the
conductive through hole 114 (step 460). In step 460, a scraper 30
may be moved onto the solder coating tool 10 to scratch the solder
20 (e.g., solder paste) into the opening 15, the insulating pad 140
and the conductive through hole 114. With the insulating pad 140
being disposed, the solder coating tool 10 may not be directly
contacted to the solder mask 130 or the surface 112 of the circuit
board plate 110 while having a distance from the solder mask 130.
Accordingly, the conductive ring 120 may contain more solder 20
after step 460.
[0039] Next, an electronic component (not illustrated) is placed
onto the solder 20, in which the electronic component is a dual
in-line package (DIP) (step 470). In between steps 460 and 470, the
circuit board 100 may be preheated to melt the solder 20 for pacing
the electronic component thereto.
[0040] Lastly, a reflow is performed to fix the electronic
component to the circuit board plate 110 (step 480). After step
480, the electronic component is fixed on the circuit board 100 and
electronically connected to the conductive through hole 114 through
solder 20. The manufacturing method of the circuit board according
to the present embodiment may increase the amount of the solder by
disposing the insulating pads 140, so as to reduce the chances in
missing solder of the dual inline package (DIP) electronic
component from occurring due to insufficient solder.
[0041] In view of above, by disposing insulating pad on the solder
mask, the circuit board of the present invention may have the
insulating pad to boost height of the solder coating tool placed on
the circuit board plate, so as to increase the space for containing
the solder. As a result, thickness and amount of solder may both be
increased to effectively reduce the chances in missing solder of
the dual inline package (DIP) electronic component from occurring
due to insufficient solder.
[0042] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
disclosed embodiments without departing from the scope or spirit of
the invention. In view of the foregoing, it is intended that the
disclosure cover modifications and variations of this specification
provided they fall within the scope of the following claims and
their equivalents.
* * * * *