U.S. patent application number 14/109683 was filed with the patent office on 2014-06-19 for heat transferring device and method for manufacturing the same.
This patent application is currently assigned to METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE. The applicant listed for this patent is METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE. Invention is credited to YI-SAN CHANG, JING-SHIANG SHIH, WEI-HUNG SHIH, WEI-TING WU.
Application Number | 20140166251 14/109683 |
Document ID | / |
Family ID | 50929585 |
Filed Date | 2014-06-19 |
United States Patent
Application |
20140166251 |
Kind Code |
A1 |
SHIH; WEI-HUNG ; et
al. |
June 19, 2014 |
HEAT TRANSFERRING DEVICE AND METHOD FOR MANUFACTURING THE SAME
Abstract
The disclosure provides a heat transferring device and a method
for manufacturing the heat transferring device. The heat
transferring device includes: a flexible heat transfer substrate
including a first surface, a second surface, at least one solid
portion and at least one characteristic hole portion. The at least
one solid portion is formed between the first surface and the
second surface. The at least one characteristic hole portion
includes several characteristic holes penetrating through the first
surface and the second surface. The flexible heat transfer
substrate further includes: a first end and a second end, and the
second end is corresponding to the first end. The flexible heat
transfer substrate is rolled from the first end towards the second
end to form the heat transferring device with a predetermined
shape.
Inventors: |
SHIH; WEI-HUNG; (Kaohsiung,
TW) ; SHIH; JING-SHIANG; (Kaohsiung, TW) ;
CHANG; YI-SAN; (Kaohsiung, TW) ; WU; WEI-TING;
(Kaohsiung, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE |
Kaohsiung |
|
TW |
|
|
Assignee: |
METAL INDUSTRIES RESEARCH &
DEVELOPMENT CENTRE
Kaohsiung
TW
|
Family ID: |
50929585 |
Appl. No.: |
14/109683 |
Filed: |
December 17, 2013 |
Current U.S.
Class: |
165/154 ;
29/890.036 |
Current CPC
Class: |
F28D 2021/0054 20130101;
F28F 13/003 20130101; F28D 7/04 20130101; F28F 2255/02 20130101;
F28D 7/103 20130101; Y10T 29/49361 20150115 |
Class at
Publication: |
165/154 ;
29/890.036 |
International
Class: |
F28D 7/10 20060101
F28D007/10; B21D 53/02 20060101 B21D053/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 19, 2012 |
TW |
101148193 |
Claims
1. A heat transferring device, comprising: a flexible heat transfer
substrate comprising a first surface, a second surface, at least
one solid portion and at least one characteristic hole portion,
wherein the second surface is corresponding to the first surface,
the at least one solid portion is formed between the first surface
and the second surface, the at least one characteristic hole
portion comprises a plurality of characteristic holes penetrating
through the first surface and the second surface; the flexible heat
transfer substrate further comprising: a first end and a second
end, wherein the second end is corresponding to the first end, the
flexible heat transfer substrate is rolled from the first end
towards the second end to form the heat transferring device with a
predetermined shape.
2. The heat transferring device according to claim 1, wherein the
flexible heat transfer substrate further comprises a plurality of
spacers disposed on the first surface, a predetermined distance is
formed between the spacers, and the spacers are disposed in the at
least one solid portion.
3. The heat transferring device according to claim 1, wherein the
flexible heat transfer substrate comprises two solid portions and a
characteristic hole portion, the characteristic hole portion is
disposed between the two solid portions.
4. The heat transferring device according to claim 1, wherein the
flexible heat transfer substrate comprises three solid portions and
a characteristic hole portion, the characteristic hole portion
extends from a center to the first end to separate the three solid
portions.
5. The heat transferring device according to claim 1, wherein the
flexible heat transfer substrate further comprises a plurality of
spacers disposed on the first surface, a predetermined distance is
formed between the spacers, and the spacers are disposed in the
characteristic hole portion.
6. The heat transferring device according to claim 1, wherein the
flexible heat transfer substrate further comprises a notch portion
disposed at the second end and a lower edge.
7. The heat transferring device according to claim 1, wherein the
flexible heat transfer substrate is a metal, ceramic, composite or
polymer material.
8. A method for manufacturing a heat transferring device,
comprising: (a) providing a flexible heat transfer substrate
comprising a first surface, a second surface, at least one solid
portion and at least one characteristic hole portion, wherein the
second surface is corresponding to the first surface, the at least
one solid portion is formed between the first surface and the
second surface, the at least one characteristic hole portion
comprises a plurality of characteristic holes penetrating through
the first surface and the second surface; the flexible heat
transfer substrate further comprising: a first end and a second
end, wherein the second end is corresponding to the first end; (b)
fixing the first end of the flexible heat transfer substrate onto a
rotary shaft of a rolling unit, and fixing the second end of the
flexible heat transfer substrate to a moving platform; and (c)
rolling the flexible heat transfer substrate to form the heat
transferring device with a predetermined shape.
9. The method according to claim 8, wherein in the step (c) further
comprises a shape setting step using a shape setting device, during
the rolling process, to get close to the flexible heat transfer
substrate so as to form a heat transferring device with the
predetermined shape.
10. The method according to claim 8, wherein in the step (c)
further comprises a tension controlling step using a tensometer to
control tension in the rolling process.
11. The method according to claim 8, wherein in the step (c)
further comprises a connecting step in the rolling process or after
the rolling process, using a high-temperature furnace melting,
spark plasma, resistance welding or laser welding method to connect
the flexible heat transfer substrate to form the heat transferring
device with the predetermined shape.
12. The method according to claim 8, wherein the flexible heat
transfer substrate further comprises a plurality of spacers
disposed on the first surface, a predetermined distance is formed
between the spacers, and the first surface of the rolled flexible
heat transfer substrate is spaced from the second surface.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present disclosure relates to a heat transferring device
and a method for manufacturing the same.
[0003] 2. Description of the Related Art
[0004] Currently, the thermal management market growth momentum is
adequate, and the heat transferring device is the main product on
the market. The heat transferring device includes apparatuses
needing to perform or partition heat transfer such as a heat
exchanger, a radiator, a condenser, a heater, and a heat
insulator.
[0005] To provide excellent heat transfer performance, a larger
heat transfer surface area is required, so as to increase surface
roughness or add fins to achieve improvement of the heat transfer
performance. The heat transfer surface area increased by increasing
surface roughness is limited, and thus the manner of adding fins is
mostly used as a solution. However, adding fins means increase of
the equipment volume. Moreover, to achieve the increasingly high
demand for thermal management, and to increase the fin area, due to
the minimum fin spacing restriction, increase of the volume of the
heat transferring device is ultimately required, and the weight
thereof also needs to be increased. Another efficient heat
transferring device is a heat pipe, and a lot of heat can be taken
away by using phase-change latent heat. However, the heat can be
transferred to the atmosphere only by adding another heat
transferring device. Thus, an innovative heat transferring device
is still demanded.
SUMMARY OF THE INVENTION
[0006] The present disclosure provides a heat transferring device.
The heat transferring device includes: a flexible heat transfer
substrate including a first surface, a second surface, at least one
solid portion and at least one characteristic hole portion. The
second surface is corresponding to the first surface, the at least
one solid portion is formed between the first surface and the
second surface. The at least one characteristic hole portion
includes several characteristic holes penetrating through the first
surface and the second surface. The flexible heat transfer
substrate further includes: a first end and a second end, and the
second end is corresponding to the first end. The flexible heat
transfer substrate is rolled from the first end towards the second
end to form the heat transferring device with a predetermined
shape.
[0007] The present disclosure further provides a method for
manufacturing a heat transferring device. The method includes: (a)
providing a flexible heat transfer substrate including a first
surface, a second surface, at least one solid portion and at least
one characteristic hole portion, wherein the second surface is
corresponding to the first surface, the at least one solid portion
is formed between the first surface and the second surface, the at
least one characteristic hole portion includes several
characteristic holes penetrating through the first surface and the
second surface; the flexible heat transfer substrate further
including: a first end and a second end, wherein the second end is
corresponding to the first end; (b) fixing the first end of the
flexible heat transfer substrate onto a rotary shaft of a rolling
unit, and fixing the second end of the flexible heat transfer
substrate to a moving platform; and (c) rolling the flexible heat
transfer substrate to form the heat transferring device with a
predetermined shape.
[0008] The heat transferring device of the present disclosure can
use a porous structure formed by the characteristic holes of the
characteristic hole portion to increase the heat transfer surface
area, so as to facilitate heat exchange and improve heat transfer
efficiency.
[0009] The method for manufacturing a heat transferring device
according to the present disclosure does not use an adhesive agent
and polymer materials to fix the shape of the heat transferring
device. The front stage of the process can perform cleaning for the
flexible heat transfer substrate, thus reducing energy consumption
and having no pollution concerns.
[0010] The method for manufacturing a heat transferring device can
be proceeded continuously, and does not require the use of special
powders and other advanced manufacturing technologies. Therefore,
the method of the disclosure can reduce the cost and price of the
heat transferring device. The characteristic hole portion can use a
sheet for manufacturing, and the process for manufacturing the
characteristic hole portion is simple.
[0011] The method for manufacturing a heat transferring device can
adjust the shape and dimension of the heat transferring device
depending upon customization specifications. The heat transferring
devices with various specifications can be proceeded by one method,
and high performance heat transferring devices can be provided with
more competitive prices to enter the thermal management market.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1A is a schematic top view of a flexible heat transfer
substrate according to a first embodiment of the present
disclosure.
[0013] FIG. 1B is a schematic side view of the flexible heat
transfer substrate according to the first embodiment of the present
disclosure.
[0014] FIG. 2 is a schematic view of the heat transferring device
according to the first embodiment of the present disclosure.
[0015] FIG. 3A is a schematic top view of a flexible heat transfer
substrate according to a second embodiment of the present
disclosure.
[0016] FIG. 3B is a schematic side view of the flexible heat
transfer substrate according to the second embodiment of the
present disclosure.
[0017] FIG. 4 is a schematic sectional view of the heat
transferring device according to the second embodiment of the
present disclosure.
[0018] FIG. 5A is a schematic top view of a flexible heat transfer
substrate according to a third embodiment of the present
disclosure.
[0019] FIG. 5B is a schematic side view of the flexible heat
transfer substrate according to the third embodiment of the present
disclosure.
[0020] FIG. 6 is a schematic sectional view of a heat transferring
device according to the third embodiment of the present
disclosure.
[0021] FIG. 7A is a schematic top view of a flexible heat transfer
substrate according to a fourth embodiment of the present
disclosure.
[0022] FIG. 7B is a schematic side view of the flexible heat
transfer substrate according to the fourth embodiment of the
present disclosure.
[0023] FIG. 8 is a schematic sectional view of a heat transferring
device according to the fourth embodiment of the present
disclosure.
[0024] FIG. 9A is a schematic top view of a flexible heat transfer
substrate according to a fifth embodiment of the present
disclosure.
[0025] FIG. 9B is a schematic side view of the flexible heat
transfer substrate according to the fifth embodiment of the present
disclosure.
[0026] FIGS. 10A and 10B are schematic views of implementation
aspects of characteristic hole portions of a flexible heat transfer
substrate according to the present disclosure.
[0027] FIG. 11 is a schematic view of a flow chart of a method for
manufacturing a heat transferring device according to the present
disclosure.
DETAILED DESCRIPTION OF THE INVENTION
[0028] FIG. 1A is a schematic top view of a flexible heat transfer
substrate according to a first embodiment of the present
disclosure. FIG. 1B is a schematic side view of the flexible heat
transfer substrate according to the first embodiment of the present
disclosure. According to the first embodiment of the present
disclosure, the flexible heat transfer substrate 10 of the present
disclosure includes: a first surface 11, a second surface 12, at
least one solid portion 13 and at least one characteristic hole
portion 14. The second surface 12 is corresponding to the first
surface 11. The flexible heat transfer substrate 10 may be a metal,
ceramic, composite or polymer material.
[0029] The at least one solid portion 13 is formed between the
first surface 11 and the second surface 12, the at least one
characteristic hole portion 14 includes several characteristic
holes 141 and 142 penetrating through the first surface 11 and the
second surface 12, and the characteristic holes 141 and 142 are
circular. The flexible heat transfer substrate 10 further includes:
a first end 15 and a second end 16, the second end 16 is
corresponding to the first end 15, where the flexible heat transfer
substrate 10 is rolled from the first end 15 towards the second end
16, to form a heat transferring device 20 (referring to FIG. 2) of
a predetermined shape.
[0030] In this embodiment, the flexible heat transfer substrate 10
includes two solid portions 13 and a characteristic hole portion
14, the characteristic hole portion 14 is disposed between the two
solid portions 13. The flexible heat transfer substrate 10 further
includes several spacers 17 disposed on the first surface 11. The
spacers 17 have a set distance therebetween, and the spacers 17 are
disposed in one of the two solid portions 13.
[0031] FIG. 2 is a schematic view of the heat transferring device
according to the first embodiment of the present disclosure. As
stated above, the flexible heat transfer substrate 10 is rolled
from the first end 15 towards the second end 16 to form a
cylindrical heat transferring device 20. In addition to the solid
portion 13 and the characteristic hole portion 14, the heat
transferring device 20 has a hollow portion 21 formed by spacing
the first surface of the rolled flexible heat transfer substrate 10
from the second surface 12 due to separation of the spacers 17. In
this embodiment, the axis of the heat transferring device 20 is
made by rolling the solid portion 13, and is a solid structure. The
hollow portion 21 surrounds the axis externally and axially
penetrates through the heat transferring device 20, so that the
heat transferring device 20 forms a tubular structure.
[0032] The heat transferring device 20 of the present disclosure
can use a porous structure formed by the characteristic holes of
the characteristic hole portion 14 to increase the heat transfer
surface area, so as to facilitate heat exchange and improve heat
transfer efficiency. In addition, a fluid can be added to the
hollow portion 21, if the fluid is in a stationary state, heat
transfer is mainly performed by means of thermal conduction, and
the heat transfer performance is low, and has a heat-insulating
function. If the fluid is in a flowing state, the heat transfer can
be performed by means of thermal convection, so that the heat
transfer performance is good, and has a heat dissipating or heating
function. Therefore, the heat transfer performance can be
controlled by controlling the flow velocity of the fluid, so that
the heat transferring device 20 can achieve various heat transfer
demands, such as heat exchange, heating, dissipating, cooling, and
heat-insulating.
[0033] FIG. 3A is a schematic top view of a flexible heat transfer
substrate according to a second embodiment of the present
disclosure. FIG. 3B is a schematic side view of the flexible heat
transfer substrate according to the second embodiment of the
present disclosure. The difference between the flexible heat
transfer substrate 30 according to the second embodiment of the
present disclosure and the flexible heat transfer substrate 10
according to the first embodiment lies in that, spacers 31 of the
flexible heat transfer substrate 30 according to the second
embodiment of the present disclosure are disposed on two solid
portions 13.
[0034] FIG. 4 is a schematic sectional view of the heat
transferring device according to the second embodiment of the
present disclosure. Referring to FIGS. 3A, 3B and 4, in this
embodiment, a heat transferring device 35 according to the second
embodiment is formed by rolling the flexible heat transfer
substrate 30. A rotary shaft of a rolling unit used for rolling the
flexible heat transfer substrate 30 is large, so that the periphery
of the axis of the heat transferring device 35 according to the
second embodiment is formed by rolling the solid portions 13 and
the spacers 31, and thus the axis of the rolled heat transferring
device 35 is a hollow portion 32. From the center to the periphery,
the structure of the heat transferring device 35 is the hollow
portion 32, the solid portion 13, the characteristic hole portion
14, the solid portion 13, the hollow portion 33 and the solid
portion 13. In other words, the heat transferring device 35 is a
tubular structure having two hollow portions 32 and 33, and the two
hollow portions 32 and 33 are spaced apart by the solid portion 13,
the characteristic hole portion 14 and the solid portion 13.
Similarly, the heat transferring device 35 according to the second
embodiment of the present disclosure has the efficacy of the heat
transferring device 20 in the first embodiment.
[0035] FIG. 5A is a schematic top view of a flexible heat transfer
substrate according to a third embodiment of the present
disclosure. FIG. 5B is a schematic side view of the flexible heat
transfer substrate according to the third embodiment of the present
disclosure. The flexible heat transfer substrate 50 according to
the third embodiment of the present disclosure includes: a first
surface 51, a second surface 52, three solid portions 531, 532 and
533, a characteristic hole portion 54 and several spacers 57. The
characteristic hole portion 54 includes several characteristic
holes 541 and 542. The characteristic hole portion 54 extends from
the center to a first end 55 to separate the three solid portions
531, 532 and 533. The spacers 57 are disposed in the solid portion
531, and in this embodiment, the spacers 57 are disposed between
the characteristic hole portion 54 and an upper edge. The flexible
heat transfer substrate 50 according to the third embodiment of the
present disclosure further includes a notch portion 58 disposed at
a second end 56 and a lower edge.
[0036] FIG. 6 is a schematic sectional view of a heat transferring
device according to the third embodiment of the present disclosure.
Referring to FIGS. 5A, 5B and 6, in this embodiment, the heat
transferring device 40 according to the third embodiment is formed
by rolling the flexible heat transfer substrate 50. The spacers 57
of the flexible heat transfer substrate 50 are rolled to make the
axis of the heat transferring device 40 become a hollow portion 41.
The first end 55 of the flexible heat transfer substrate 50 rolled
into the hollow portion 41 of the axis further includes the
characteristic hole portion 54 and the solid portions 531 and 532,
and thus the axis of the heat transferring device 40 is a hollow
structure, and a side face at the axis has several characteristic
holes 541 and 542. The notch portion 58 of the flexible heat
transfer substrate 50 is rolled to make the periphery of the heat
transferring device 40 also become the notch portion 58. Similarly,
the heat transferring device 40 according to the third embodiment
of the present disclosure has the efficacy of the heat transferring
device 20 in the first embodiment.
[0037] FIG. 7A is a schematic top view of a flexible heat transfer
substrate according to a fourth embodiment of the present
disclosure. FIG. 7B is a schematic side view of the flexible heat
transfer substrate according to the fourth embodiment of the
present disclosure. The flexible heat transfer substrate 70
according to the fourth embodiment of the present disclosure
includes: a first surface 71, a second surface 72, two solid
portions 731 and 732, a characteristic hole portion 74 and a notch
portion 77. The characteristic hole portion 74 includes several
characteristic holes 741 and 742, and the characteristic hole
portion 74 is disposed in the center. The solid portion 731 extends
from a first end 75 to below the characteristic hole portion 74.
The notch portion 77 is disposed at a second end 76 and a lower
edge.
[0038] FIG. 8 is a schematic sectional view of a heat transferring
device according to the fourth embodiment of the present
disclosure. Referring to FIGS. 7A, 7B and 8, in this embodiment,
the heat transferring device 60 according to the fourth embodiment
is formed by rolling the flexible heat transfer substrate 70, and
the solid portion 731 of the flexible heat transfer substrate 70 is
rolled to make the axis of the heat transferring device 60 become a
hollow structure. Moreover, the notch portion 77 of the flexible
heat transfer substrate 70 is rolled to make the periphery of the
heat transferring device 60 also become the notch portion 77.
Similarly, the heat transferring device 60 according to the fourth
embodiment of the present disclosure has the efficacy of the heat
transferring device 20 in the first embodiment.
[0039] FIG. 9A is a schematic top view of a flexible heat transfer
substrate according to a fifth embodiment of the present
disclosure. FIG. 9B is a schematic side view of the flexible heat
transfer substrate according to the fifth embodiment of the present
disclosure. The flexible heat transfer substrate 80 is
substantially identical with the third embodiment, and includes: a
first surface 81, a second surface 82, three solid portions 831,
832 and 833, a characteristic hole portion 84 and several spacers
87. The difference lies in that the spacers 87 are disposed in the
characteristic hole portion 84, and close to a first end 85. The
spacers 87 are materials extruding the characteristic hole portion
84 when the characteristic hole 841 is formed, and the spacers 87
are formed by protruding the material of the characteristic hole
portion 84 beyond the first surface 81. The schematic section view
of the heat transferring device according to the fifth embodiment
of the present disclosure is the same as that of the heat
transferring device according to the third embodiment, which is as
shown in FIG. 6, and is not repeated herein.
[0040] FIGS. 10A and 10B are schematic views of implementation
aspects of characteristic hole portions of a flexible heat transfer
substrate according to the present disclosure. In FIG. 10A, the
characteristic hole portion 100 includes several characteristic
holes 101 and 102, and the characteristic holes 101 and 102 are
hexagonal. In FIG. 10B, the characteristic hole portion 110
includes several characteristic holes 111 and 112, and the
characteristic holes 111 and 112 are rhombic. However, in other
embodiments, the characteristic holes of the characteristic hole
portion may be polygonal.
[0041] FIG. 11 is a schematic view of a flow chart of a method for
manufacturing a heat transferring device according to the present
disclosure. Referring to step S91, a flexible heat transfer
substrate is provided. The flexible heat transfer substrate can
refer to the above embodiments, and is not repeated herein.
Referring to step S92, the flexible heat transfer substrate is
processed; preferably, the step of treating the flexible heat
transfer substrate includes: shock-washing 5 minutes with
ultra-pure water, shock-washing 5 minutes with acetone,
shock-washing 5 minutes with ultra-pure water and shock-washing
with 5 minutes with alcohol, for removing residual oil in the
processing of the flexible heat transfer substrate as well as solid
impurities on the surface.
[0042] Referring to step S93, the first end of the flexible heat
transfer substrate is fixed onto a rotary shaft of a rolling unit,
and the second end of the flexible heat transfer substrate is fixed
to a moving platform. A clamp can be used to clamp and fix the
second end of the flexible heat transfer substrate to the moving
platform. Referring to step S94, the flexible heat transfer
substrate is rolled at a predetermined rotation speed to perform
continuous rolling. The rolling process may include a shape setting
step, as shown in step S95, a shape setting device is used, during
the rolling process, to get close to the flexible heat transfer
substrate so as to form a heat transferring device with the
predetermined shape. Alternatively, the rotary shaft of the rolling
unit having various shapes can be used to form the heat
transferring device with various predetermined shapes.
[0043] In addition, the rolling process may include a tension
controlling step, as shown in step S96, a tensometer is used to
control tension in the rolling process, to control the tension
acted upon the flexible heat transfer substrate.
[0044] In order to fix the shape of the heat transferring device, a
connecting step may be included in the rolling process or after the
rolling, as shown in step S97, the flexible heat transfer substrate
is connected in the rolling process or after the rolling with a
high-temperature furnace melting, spark plasma, resistance welding
or laser welding method, to form the heat transferring device with
the predetermined shape, as shown in step S98.
[0045] The method for manufacturing a heat transferring device
according to the present disclosure does not use an adhesive agent
and polymer materials to fix the shape of the heat transferring
device. The front stage of the process can perform cleaning for the
flexible heat transfer substrate, thus reducing energy consumption
and having no pollution concerns.
[0046] The method for manufacturing a heat transferring device can
be proceeded continuously, and does not require the use of special
powders and other advanced manufacturing technologies. Therefore,
the method of the disclosure can reduce the cost and price of the
heat transferring device. The characteristic hole portion can use a
sheet for manufacturing, and the process for manufacturing the
characteristic hole portion is simple.
[0047] The method for manufacturing a heat transferring device can
adjust the shape and dimension of the heat transferring device
depending upon customization specifications. The heat transferring
devices with various specifications can be proceeded by one method,
and high performance heat transferring devices can be provided with
more competitive prices to enter the thermal management market.
[0048] While several embodiments of the present disclosure have
been illustrated and described, various modifications and
improvements can be made by those skilled in the art. The
embodiments of the present disclosure are therefore described in an
illustrative but not in a restrictive sense. It is intended that
the present disclosure should not be limited to the particular
forms as illustrated and that all modifications which maintain the
spirit and scope of the present disclosure are within the scope
defined in the appended claims.
* * * * *