U.S. patent application number 13/711492 was filed with the patent office on 2014-06-05 for container data center with cooling system.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to CHAO-KE WEI.
Application Number | 20140150999 13/711492 |
Document ID | / |
Family ID | 50824287 |
Filed Date | 2014-06-05 |
United States Patent
Application |
20140150999 |
Kind Code |
A1 |
WEI; CHAO-KE |
June 5, 2014 |
CONTAINER DATA CENTER WITH COOLING SYSTEM
Abstract
A container data center includes a container and a cooling
system. The container defines an air inlet and an air outlet. The
cooling system includes a housing, a heat dissipation plate
received in the housing, and a fan. The housing defines an airflow
output aligning with the air inlet of the container and a number of
access holes. The fan is received in the housing and aligns with
the airflow output. The heat dissipation plate defines a number of
through holes. The fan draws airflow to enter the housing from the
access holes and extend through the through holes. The airflow
enters the container from the airflow output of the housing and the
air inlet of the container to be heated. The heated air is
exhausted out of the container through the air outlet.
Inventors: |
WEI; CHAO-KE; (New Taipei,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HON HAI PRECISION INDUSTRY CO., LTD. |
New Taipei |
|
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
New Taipei
TW
|
Family ID: |
50824287 |
Appl. No.: |
13/711492 |
Filed: |
December 11, 2012 |
Current U.S.
Class: |
165/121 |
Current CPC
Class: |
H05K 7/1497 20130101;
H05K 7/20745 20130101 |
Class at
Publication: |
165/121 |
International
Class: |
F28F 13/12 20060101
F28F013/12 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 4, 2012 |
TW |
101145366 |
Claims
1. A cooling system, comprising: a housing defining an access hole
and an airflow output; a heat dissipation apparatus comprising a
heat dissipation plate received in the housing and positioned
between the access hole and the airflow input; and a first fan
installed to the housing; wherein the heat dissipation plate
defines a plurality of through holes, the first fan draws airflow
to enter the housing through the access hole and pass through the
plurality of through holes, and flow out of the housing through the
airflow output.
2. The cooling system of claim 1, wherein the heat dissipation
apparatus further comprises a support bracket received in the
housing between the access hole and the airflow output, an inner
surface of the housing is divided into a first space and a second
space by the support bracket, the access hole is communicated with
the first space, and the airflow output is communicated with the
second space, the support bracket defines a position opening for
positioning the heat dissipation plate, the first space is
communicates with the second space through the plurality of through
holes.
3. The cooling system of claim 2, wherein the airflow output is
defined in a bottom plate of the housing, the bottom plate of the
housing defines an airflow input away from the airflow output, the
access hole is defined in an upper portion of a side plate of the
housing adjacent to the airflow input, a lower portion of the side
plate defines a vent, a partition plate is received in the housing
and is connected between the bottom plate and the side plate, the
partition plate, the bottom plate, and the side plate cooperatively
bound a third space, the airflow input and the vent are
communicated with the third space, the first fan is mounted to the
bottom plate and aligns with the airflow output.
4. The cooling system of claim 3, wherein an extending pipe extends
out from an edge bounding each of the airflow output and the
airflow input.
5. The system of claim 3, further comprising a second fan received
in the third space and aligning with the vent, to guide air flowing
out of the third space through the vent.
6. The cooling system of claim 2, wherein the airflow output is
defined in a side plate of the housing, the access hole is defined
in an opposite side plate of the housing, the first fan is mounted
to the side plate and aligns with the airflow output.
7. The cooling system of claim 1, wherein the heat dissipation
plate is made of heat conduction material.
8. The cooling system of claim 1, wherein the heat dissipation
plate forms a refrigerant duct for receiving refrigerant.
9. The cooling system of claim 8, wherein the refrigerant duct
comprises a refrigerant input end and a refrigerant output end
respectively extending through two edges of the heat dissipation
plate, a refrigerant input pipe is connected to the refrigerant
input end, and a refrigerant output pipe is connected to the
refrigerant output end.
10. A container data center, comprising: a container defining an
air inlet and an air outlet; and a cooling system comprising a
housing attached to the container, a heat dissipation plate
received in the housing, and a first fan; wherein the housing
defines an airflow output aligning with the air inlet of the
container and a plurality of access holes, the first fan is mounted
in the housing and aligns with the airflow output, the heat
dissipation plate defines a plurality of through holes, the first
fan draws airflow to enter the housing through the plurality of
access holes and pass through the plurality of through holes of the
heat dissipation plate, the airflow enters the container from the
airflow output of the housing and the air inlet of the container to
be heated, and the heated airflow is exhausted out of the container
through the air outlet of the container.
11. The container data center of claim 10, wherein the cooling
system further comprises a heat dissipation apparatus, the heat
dissipation apparatus comprises a support bracket received in the
housing between the plurality of access holes and the airflow
output, an inner surface of the housing is divided into a first
space and a second space by the support bracket, the plurality of
access hole is communicated with the first space, and the airflow
output is communicated with the second space, the support bracket
defines a position opening for positioning the heat dissipation
plate.
12. The container data center of claim 10, wherein the heat
dissipation plate forms a refrigerant duct, refrigerant is received
in the refrigerant duct.
13. The container data center of claim 12, wherein the refrigerant
duct comprises a refrigerant input end and a refrigerant output end
respectively extending through two edges of the heat dissipation
plate, a refrigerant input pipe is connected to the refrigerant
input end, and a refrigerant output pipe is connected to the
refrigerant output end.
14. The container data center of claim 10, wherein a row of
cabinets is arrayed in the container along a lengthwise direction
of the container, and a partition piece is connected between tops
of the cabinets and the container, a cool channel and a heat
channel are defined in the container at two opposite sides of the
row of cabinets and the partition piece, the air outlet
communicates with the cool channel, and the air inlet communicates
with the heat channel.
15. The container data center of claim 14, wherein the housing is
supported on a top wall of the container, the air inlet and the air
outlet are respectively defined in two opposite sides of the top
wall of the container, the airflow output is defined in a bottom
plate of the housing, the bottom plate of the housing defines an
airflow input aligning with the air outlet of the container, the
plurality of access holes is defined in an upper portion of a side
plate of the housing adjacent to the airflow input, a lower portion
of the side plate defines a vent, a partition plate is received in
the housing and is connected between the bottom plate and the side
plate, the partition plate, the bottom plate, and the side plate
cooperatively bound a third space, the airflow input and the vent
are communicated with the third space.
16. The container data center of claim 15, wherein an extending
pipe extends out from an edge bounding each of the airflow input
and the airflow output, and is inserted into a corresponding one of
the air inlet and the air outlet of the container.
17. The container data center of claim 15, wherein the cooling
system further comprises a second fan received in the third space
and aligning with the vent.
18. The container data center of claim 14, wherein the housing and
the container are positioned side by side, the air outlet is
defined in a sidewall of the container adjacent to the housing, the
air outlet is defined in an opposite sidewall of the container away
from the housing, the airflow output is define in a side plate of
the housing and aligns with the air inlet, and the plurality of
access holes is defined an opposite plate of the housing away from
the container.
19. The container data center of claim 18, wherein an extending
pipe extends out from an edge bounding the airflow output, and is
inserted into the air inlet of the container.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to a container data center
including a cooling system.
[0003] 2. Description of Related Art
[0004] Typical container data centers include a container, a number
of servers, and a cooling system. The servers and the cooling
system are both received in the container, occupying most of the
interior space of the container. As such, less space is reserved
for heat dissipation in the container, resulting in a lower heat
dissipation efficiency. In addition, it is also difficult to
optimize the arrangement of the servers and the cooling system
which are both in the same container to obtain a high heat
dissipation efficiency of the container data center.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, all the views
are schematic, and like reference numerals designate corresponding
parts throughout the several views.
[0006] FIG. 1 is an exploded, isometric view of a first exemplary
embodiment of a container data center.
[0007] FIG. 2 is an assembled, isometric view of FIG. 1.
[0008] FIG. 3 is a cross-sectional view of FIG. 2, taken along the
line of III-III.
[0009] FIG. 4 is an assembled, isometric view of a second exemplary
embodiment of a container data center.
[0010] FIG. 5 is a cross-sectional view of FIG. 4, taken along the
line of V-V.
DETAILED DESCRIPTION
[0011] The present disclosure, including the accompanying drawings,
is illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean at least one.
[0012] FIGS. 1-3 show a first exemplary embodiment of a container
data center 100. The container data center 100 includes a container
20, a row of cabinets 24, a partitioning piece 26, and a cooling
system 40.
[0013] The container 20 includes a rectangular bottom wall 222, a
top wall 224 opposite to the bottom wall 222, and four sidewalls
226 respectively connected between four edges of the bottom wall
222 and the top wall 224. The row of cabinets 24 are arrayed on the
bottom wall 222, along the lengthwise direction of the bottom wall
222. The partitioning piece 26 is connected between the top wall
224 and tops of the cabinets 24. A cool channel 27 and a heat
channel 80 are defined in the container 20, at two opposite sides
of the row of cabinets 24 and the partitioning piece 26. One side
of the top wall 224 of the container 20 defines a row of air inlets
227 along the lengthwise direction of the container 20, the air
inlets 227 communicating with the cool channel 27. The other side
of the top wall 224 defines a row of air outlets 228 along the
lengthwise direction of the container 22, the air outlet 228
communicating with the heat channel 28. Four corners of the top
wall 224 of the container 22 respectively define a position hole
225.
[0014] The cooling system 40 includes a housing 42, a heat
dissipation apparatus 44, and a plurality of fans 46.
[0015] The housing 42 includes a rectangular bottom plate 422, a
top plate 424 opposite to the bottom plate 422, and four side
plates 426 respectively connected between four edges of the bottom
plate 422 and the top plate 424. The bottom plate 422 defines a row
of airflow outputs 4221 in one side of the bottom plate 422, and a
row of airflow inputs 4222 in the other side of the bottom plate
422. A circular extending pipe 4223 extends out from a
circumference bounding each of the airflow outputs 4221 and airflow
inputs 4222. One of the side plates 426 adjacent to the airflow
inputs 4222 defines a plurality of access holes 4262 adjacent to
the top plate 422, and a plurality of vents 4263 adjacent to the
bottom plate 422. An L-shaped partition plate 427 is received in
the housing 42, one side of the partition plate 427 is mounted on
the bottom plate 422, and the other side of the partition plate 427
is mounted on the side plate 426 defining the vents 4263. The
partition plate 427, the bottom plate 422, and the side plate 426
cooperatively bound a space 428. The airflow inputs 4222 and the
vents 4263 are respectively communicated with the space 428. Four
position pins 429 extend out from corners of the bottom plate
422.
[0016] The heat dissipation apparatus 44 includes a support bracket
442 received in the housing 42 and a heat dissipation plate 444
installed on the support bracket 442. The support bracket 442 is
connected to inner surfaces of the four side plates 426 of the
housing 42. An inner space of the housing 42 is divided into a
first space 425 and a second space 423 by the support bracket 442.
The access holes 4262 communicate with the first space 425, and the
airflow outputs 4221 communicate with the second space 423. The
support bracket 442 defines a position opening 4421 for positioning
the heat dissipation plate 444. The heat dissipation plate 444
defines a plurality of through holes 4442 communicating with the
first and second spaces 425 and 423. A refrigerant duct 4443 is
formed in the heat dissipation plate 444. The refrigerant duct 444
includes a refrigerant input end 4445 and a refrigerant output end
4446 respectively extending through two opposite edges of the heat
dissipation plate 444. The heat dissipation plate 444 is made of
heat conduction material, such as aluminum, steel, or copper, and
is integrally formed. A refrigerant input pipe 472 is connected to
the refrigerant input end 4445, and a refrigerant output pipe 474
is connected to the refrigerant output end 4446. A moisture filter
apparatus 448 is mounted on the heat dissipation plate 444, in the
first space 425.
[0017] The fans 46 are respectively installed on the bottom plate
422 and the side plate 426 defining the vents 4263, and
respectively align with the airflow outputs 4221 and the vents
4263. The fans 46 aligning with the airflow outputs 4221 guide air
to flow out of the second space 423 through the airflow outputs
4221. The fans 46 aligning with the vents 4263 guide air to flow
out of the space 428 through the vents 4263.
[0018] In assembly, the housing 42 is supported on the container
20. The extending pipes 4223 at the airflow outputs 4221 and the
airflow inputs 4222 are respectively inserted into the air inlets
227 and the air outlets 228, and the position pins 429 are
respectively inserted into the position holes 225.
[0019] In use, a considerable heat is generated by a plurality of
servers of the cabinets 24 during operation. Refrigerant flows into
the refrigerant duct 4443 of the heat dissipation plate 444 from
the refrigerant input end 4445, and flows out of the refrigerant
duct 4443 from the refrigerant output end 4446. The refrigerant can
be liquid, such as cold water, or cold air. The fans 46 draw
airflow to flow into the first space 425 from the access holes
4262. The airflow flows through the moisture filter apparatus 448
and the through holes 4442 of the heat dissipation plate 444, and
enters the second space 423. The airflow is cooled by the
refrigerant of the heat dissipation plate 444 to become cool
airflow. The cool airflow flows into the cool channel 27 of the
container 20 from the airflow outputs 4221 and the air inlets 227
by the fans 46. The cool airflow flows through the row of cabinets
24, and the heat of the cabinets 24 is transferred to the cool
airflow. The cool airflow is heated and flows into the heat channel
28 of the container 20. The heated airflow enters the space 428
through the air outlets 228 of the container 20, the airflow inputs
4222 of the housing 42, and is dissipated out of the housing 42
from the vents 4263 through the fans 46.
[0020] When the airflow flowing in the first space 425 has a lower
temperature, the refrigerant is not needed.
[0021] FIG. 4 and FIG. 5 show a second exemplary embodiment of a
container data center 100a. The container data center 100a is
substantially similar to the first embodiment of the container data
center 100. The container data center 100a includes a container 20a
and a housing 42a located with the container 22a side by side. The
housing 42a is similar to the housing 42, but omits the partition
plate 427, the airflow inputs 4222, the fans 46 received in the
space 428, and the vents 4263. A lower portion of the side plate of
the housing 42a adjacent to the container 20a defines a plurality
of airflow outputs 4221a. A lower portion of one sidewall of the
container 20a adjacent to the housing 42a defines a plurality of
air inlets 227a respectively aligning with the airflow outputs
4221a. An upper portion of another sidewall of the container 20a
opposite to the air inlets 227a defines a plurality of air outlets
228.
[0022] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and function of the
embodiments, the present disclosure is illustrative only, and
changes may be made in details, especially in the matters of shape,
size, and arrangement of parts within the principles of the
embodiments to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *