U.S. patent application number 13/682559 was filed with the patent office on 2014-05-22 for heat pipe having a channeled heat transfer array.
This patent application is currently assigned to ELWHA LLC. The applicant listed for this patent is ELWHA LLC. Invention is credited to Roderick A. Hyde.
Application Number | 20140138058 13/682559 |
Document ID | / |
Family ID | 50726806 |
Filed Date | 2014-05-22 |
United States Patent
Application |
20140138058 |
Kind Code |
A1 |
Hyde; Roderick A. |
May 22, 2014 |
HEAT PIPE HAVING A CHANNELED HEAT TRANSFER ARRAY
Abstract
Described embodiments include a heat pipe system. The system
includes an evaporator portion having a wall internally defining an
evaporator chamber and configured to evaporate a liquid phase of a
working fluid by absorbing heat. A condenser portion has a wall
internally defining a condenser chamber and configured to condense
a vapor phase of the working fluid by releasing heat. The system
includes the working fluid. The system includes a channeled heat
transfer array including at least two tubes. Each tube of the at
least two tubes has a wall defining (i) a channel flowing an
intermediate fluid and (ii) an exterior surface directly exposed to
the working fluid. The evaporator chamber, the condenser chamber,
and the exterior surfaces of the at least two tubes of the
channeled heat transfer array form a hermetically sealed hollow
vessel containing the working fluid.
Inventors: |
Hyde; Roderick A.; (Redmond,
WA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ELWHA LLC |
Bellevue |
WA |
US |
|
|
Assignee: |
ELWHA LLC
Bellevue
WA
|
Family ID: |
50726806 |
Appl. No.: |
13/682559 |
Filed: |
November 20, 2012 |
Current U.S.
Class: |
165/104.26 ;
165/104.21 |
Current CPC
Class: |
F28D 15/00 20130101;
F28D 15/0275 20130101; F28F 2260/02 20130101; F28D 15/04
20130101 |
Class at
Publication: |
165/104.26 ;
165/104.21 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A heat pipe comprising: an evaporator portion having a wall
internally defining an evaporator chamber and configured to
evaporate a liquid phase of a working fluid by absorbing heat; a
condenser portion having a wall internally defining a condenser
chamber and configured to condense a vapor phase of the working
fluid by releasing heat; a channeled heat transfer array including
at least two tubes, each tube of the at least two tubes having a
wall defining (i) a channel open to an external environment and
(ii) an exterior surface directly exposed to the working fluid; and
the evaporator chamber, the condenser chamber, and the exterior
surfaces of the at least two tubes of the channeled heat transfer
array forming a hermetically sealed hollow vessel containing the
working fluid.
2. The heat pipe of claim 1, wherein the evaporator portion is
configured to evaporate a liquid phase of the working fluid by
absorbing heat from a heat source.
3. The heat pipe of claim 1, wherein the condenser portion is
configured to condense a vapor phase of the working fluid by
releasing heat to a heat sink.
4. The heat pipe of claim 1, further comprising: a transport
portion having an internal passageway configured to flow the
working fluid between the evaporator chamber and the condenser
chamber.
5. The heat pipe of claim 4, wherein the evaporator chamber, the
condenser chamber, the internal flow passageway, and the exterior
surfaces of the at least two tubes of the channeled heat transfer
array form a hermetically sealed hollow vessel containing the
working fluid.
6. The heat pipe of claim 4, wherein the transport portion includes
a capillary structure configured to facilitate transportation of
the working fluid in a liquid phase from the condenser portion to
the evaporator portion.
7. The heat pipe of claim 4, wherein the transport portion includes
(i) a first transport portion configured to flow a vapor phase of
the working fluid from the evaporator chamber to the condenser
chamber; and (ii) a second transport portion configured to flow a
liquid phase of the working fluid from the condenser chamber to the
evaporator chamber.
8. The heat pipe of claim 7, wherein the first transport portion
defines a first internal passageway.
9. The heat pipe of claim 7, wherein the second transport portion
defines a second internal passageway.
10. The heat pipe of claim 7, wherein the second transport portion
includes a capillary material.
11. The heat pipe of claim 7, wherein the second transport portion
includes a wicking material.
12. The heat pipe of claim 7, wherein the second transport portion
includes a grooved surface.
13. The heat pipe of claim 1, wherein a surface of the hermetically
sealed hollow vessel comprises a capillary structure configured to
facilitate transportation of the working fluid.
14. The heat pipe of claim 13, wherein the capillary structure
comprises a capillary material.
15. The heat pipe of claim 13, wherein the capillary structure
comprises a wicking material.
16. The heat pipe of claim 13, wherein the capillary structure
comprises a grooved surface.
17. The heat pipe of claim 1, wherein the working fluid includes a
working fluid tuned to a particular cooling situation.
18. The heat pipe of claim 1, wherein the working fluid includes a
working fluid tuned to a cooling situation in which the heat pipe
is designed to operate.
19. The heat pipe of claim 1, wherein the channeled heat transfer
array is located at least partially within the evaporator
chamber.
20. The heat pipe of claim 1, wherein the channeled heat transfer
array is located at least partially within the condenser
chamber.
21. The heat pipe of claim 1, wherein the channeled heat transfer
array includes (i) a first channeled heat transfer array located at
least partially within the evaporator chamber, (ii) and a second
channeled heat transfer array located at least partially within the
condenser chamber.
22. The heat pipe of claim 1, wherein the channel of a tube of the
at least two tubes is directly exposed to an intermediate
fluid.
23. The heat pipe of claim 1, wherein the channel of a tube of the
at least two microtubes includes a microchannel configured to
facilitate a laminar flow of a fluid through the microchannel.
24. (canceled)
25. (canceled)
26. (canceled)
27. The heat pipe of claim 1, wherein the intermediate fluid
includes air, a liquid, or a gas.
28. The heat pipe of claim 1, wherein the exterior surface of a
wall of a tube of the at least two tubes lying within the
hermetically sealed hollow vessel is directly exposed to the
working fluid.
29. (canceled)
30. (canceled)
31. (canceled)
32. The heat pipe of claim 1, wherein a circumference of the
exterior surface of a wall of a tube of the at least two tubes
within the hermetically sealed hollow vessel is directly exposed to
the working fluid.
33. (canceled)
34. (canceled)
35. The heat pipe of claim 1, wherein the exterior surface of a
wall of a tube of the at least two tubes within the hermetically
sealed hollow vessel is at least partially covered with a capillary
structure that is directly exposed to the working fluid.
36. (canceled)
37. (canceled)
38. The heat pipe of claim 1, wherein at least one channel of a
tube of the at least two tubes has a non-circular cross
section.
39. The heat pipe of claim 1, wherein at least one channel of a
tube of the at least two tubes has an elliptical cross section.
40. The heat pipe of claim 1, wherein at least one channel of a
tube of the at least two tubes has a rectangular cross section.
41. A heat transfer method comprising: flowing an intermediate
fluid carrying heat absorbed from a heat generating device through
an array of at least two tubes, each tube of the array of at least
two tubes having a wall defining (i) a channel flowing the
intermediate fluid and (ii) an exterior surface exposed to a liquid
phase of a working fluid present in a first chamber of a
hermetically sealed vessel; absorbing heat from the intermediate
fluid by evaporating the liquid phase of the working fluid into a
vapor phase; flowing the vapor-phase working fluid to a second
chamber of the hermetically sealed vessel; releasing heat from the
vapor-phase working fluid present in the second chamber to a heat
sink by condensing the vapor-phase working fluid into the liquid
phase working fluid; and flowing the liquid phase working fluid
back to the first chamber.
42. The method of claim 41, wherein the absorbing heat further
includes flowing the liquid-phase working fluid proximate to the
exterior surface of each wall of the at least two tubes using a
capillary action.
43. The method of claim 41, wherein the array of at least two tubes
includes an array of at least two microtubes, each microtube having
a microchannel configured to facilitate a laminar flow of the
intermediate fluid through the microchannel.
44. The method of claim 41, wherein the flowing further includes
flowing the liquid phase working fluid back to the first chamber
using a capillary action.
45. The method of claim 41, further comprising: assisting the
condensing the vapor-phase working fluid by flowing another
intermediate fluid thermally coupled with the heat sink through
another array of at least two tubes, each tube of the another array
at least two tubes having a wall defining (i) a channel flowing the
another intermediate fluid and (ii) an exterior surface exposed to
the vapor-phase working fluid present in the second chamber.
46. The method of claim 45, wherein the assisting the condensing
further includes flowing the condensed liquid-phase of the
vapor-phase working fluid proximate to the exterior surface of each
wall of the at least two tubes of the another array using a
capillary action.
47. A heat transfer method comprising: absorbing heat by
evaporating a liquid phase of a working fluid present in a first
chamber of a hermetically sealed vessel to a vapor-phase; flowing
the vapor-phase working fluid to a second chamber of the
hermetically sealed vessel; releasing heat from the vapor-phase
working fluid present in the second chamber to a heat sink by
condensing the vapor-phase working fluid into the liquid-phase
working fluid, the condensing vapor-phase working fluid including
flowing an intermediate fluid thermally coupled with the heat sink
through an array of at least two tubes, each tube of the array at
least two tubes having a wall defining (i) a channel flowing the
intermediate fluid and (ii) an exterior surface exposed to the
vapor-phase working fluid present in the second chamber; and
flowing the liquid phase working fluid back to the first
chamber.
48. The method of claim 47, wherein the condensing the vapor-phase
working fluid further includes flowing the condensed liquid-phase
of the vapor-phase working fluid proximate to the exterior surface
of each wall of the at least two tubes using a capillary
action.
49. The method of claim 47, wherein the exterior surface includes
an exterior surface having at least a portion covered with a
capillary structure further facilitating condensation of the
vapor-phase working fluid.
50. The method of claim 47, wherein the flowing further includes
flowing the liquid-phase working fluid back to the first chamber
using a capillary action.
Description
[0001] If an Application Data Sheet (ADS) has been filed on the
filing date of this application, it is incorporated by reference
herein. Any applications claimed on the ADS for priority under 35
U.S.C. .sctn..sctn.119, 120, 121, or 365(c), and any and all
parent, grandparent, great-grandparent, etc. applications of such
applications, are also incorporated by reference, including any
priority claims made in those applications and any material
incorporated by reference, to the extent such subject matter is not
inconsistent herewith.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] The present application is related to and/or claims the
benefit of the earliest available effective filing date(s) from the
following listed application(s) (the "Priority Applications"), if
any, listed below (e.g., claims earliest available priority dates
for other than provisional patent applications or claims benefits
under 35 USC .sctn.119(e) for provisional patent applications, for
any and all parent, grandparent, great-grandparent, etc.
applications of the Priority Application(s)). In addition, the
present application is related to the "Related Applications," if
any, listed below.
PRIORITY APPLICATIONS
[0003] None
RELATED APPLICATIONS
[0004] None
[0005] The United States Patent Office (USPTO) has published a
notice to the effect that the USPTO's computer programs require
that patent applicants reference both a serial number and indicate
whether an application is a continuation, continuation-in-part, or
divisional of a parent application. Stephen G. Kunin, Benefit of
Prior-Filed Application, USPTO Official Gazette Mar. 18, 2003. The
USPTO further has provided forms for the Application Data Sheet
which allow automatic loading of bibliographic data but which
require identification of each application as a continuation,
continuation-in-part, or divisional of a parent application. The
present Applicant Entity (hereinafter "Applicant") has provided
above a specific reference to the application(s) from which
priority is being claimed as recited by statute. Applicant
understands that the statute is unambiguous in its specific
reference language and does not require either a serial number or
any characterization, such as "continuation" or
"continuation-in-part," for claiming priority to U.S. patent
applications. Notwithstanding the foregoing, Applicant understands
that the USPTO's computer programs have certain data entry
requirements, and hence Applicant has provided designation(s) of a
relationship between the present application and its parent
application(s) as set forth above and in any ADS filed in this
application, but expressly points out that such designation(s) are
not to be construed in any way as any type of commentary and/or
admission as to whether or not the present application contains any
new matter in addition to the matter of its parent
application(s).
[0006] If the listings of applications provided above are
inconsistent with the listings provided via an ADS, it is the
intent of the Applicant to claim priority to each application that
appears in the Priority Applications section of the ADS and to each
application that appears in the Priority Applications section of
this application.
[0007] All subject matter of the Priority Applications and the
Related Applications and of any and all parent, grandparent,
great-grandparent, etc. applications of the Priority Applications
and the Related Applications, including any priority claims, is
incorporated herein by reference to the extent such subject matter
is not inconsistent herewith.
SUMMARY
[0008] For example, and without limitation, an embodiment of the
subject matter described herein includes a heat pipe system. In
this embodiment, the heat pipe system includes an evaporator
portion having a wall internally defining an evaporator chamber and
configured to evaporate a liquid phase of a working fluid by
absorbing heat. The system includes a condenser portion having a
wall internally defining a condenser chamber and configured to
condense a vapor phase of the working fluid by releasing heat. The
system includes the working fluid. The system includes a channeled
heat transfer array including at least two tubes. Each tube of the
at least two tubes has a wall defining (i) a channel open to an
intermediate fluid and (ii) an exterior surface directly exposed to
the working fluid. The evaporator chamber, the condenser chamber,
and the exterior surfaces of the at least two tubes of the
channeled heat transfer array form a hermetically sealed hollow
vessel containing the working fluid. In an embodiment, the heat
pipe system includes a transport portion having an internal
passageway configured to flow the working fluid between the
evaporator chamber and the condenser chamber.
[0009] For example, and without limitation, an embodiment of the
subject matter described herein includes a heat transfer method. In
this embodiment, the method includes flowing an intermediate fluid
carrying heat absorbed from a heat generating device through an
array of at least two tubes. Each tube of the array of at least two
tubes having a wall defining (i) a channel flowing of the
intermediate fluid and (ii) an exterior surface exposed to a liquid
phase of a working fluid present in a first chamber of a
hermetically sealed vessel. The method includes absorbing heat from
the intermediate fluid by evaporating the liquid phase of the
working fluid into a vapor phase. The method includes flowing the
vapor-phase working fluid to a second chamber of the hermetically
sealed vessel. The method includes releasing heat from the
vapor-phase working fluid present in the second chamber to a heat
sink by condensing the vapor-phase working fluid into the liquid
phase working fluid. The method includes flowing the liquid phase
working fluid back to the first chamber.
[0010] In an embodiment, the method includes flowing the
liquid-phase working fluid proximate to the exterior surface of
each wall of the at least two tubes using a capillary action. In an
embodiment, the method includes assisting the condensing the
vapor-phase working fluid by flowing another intermediate fluid
thermally coupled with the heat sink through another array of at
least two tubes. Each tube of the another array at of least two
tubes has a wall defining (i) a channel flowing the another
intermediate fluid and (ii) an exterior surface exposed to the
vapor-phase working fluid present in the second chamber.
[0011] For example, and without limitation, an embodiment of the
subject matter described herein includes a heat transfer method. In
this embodiment, the method includes absorbing heat by evaporating
a liquid phase of a working fluid present in a first chamber of a
hermetically sealed vessel. The method includes flowing the
vapor-phase working fluid to a second chamber of the hermetically
sealed vessel. The method includes releasing heat from the
vapor-phase working fluid present in the second chamber to a heat
sink by condensing the vapor-phase working fluid into the liquid
phase working fluid. The condensing the vapor-phase working fluid
includes flowing an intermediate fluid thermally coupled with the
heat sink through an array of at least two tubes. Each tube of the
array of at least two tubes has a wall defining (i) a channel
flowing the intermediate fluid and (ii) an exterior surface exposed
to the vapor-phase working fluid present in the second chamber. The
method includes flowing the liquid phase working fluid back to the
first chamber. In an embodiment, the condensing the vapor-phase
working fluid further includes flowing the vapor-phase working
fluid proximate to the exterior surface of each wall of the at
least two tubes using a capillary action.
[0012] The foregoing summary is illustrative only and is not
intended to be in any way limiting. In addition to the illustrative
aspects, embodiments, and features described above, further
aspects, embodiments, and features will become apparent by
reference to the drawings and the following detailed
description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 illustrates an example environment 100;
[0014] FIG. 2 illustrates additional features of the heat transfer
array 160 of FIG. 1;
[0015] FIG. 3 illustrates an example operational flow 200; and
[0016] FIG. 4 illustrates an example operational flow 300.
DETAILED DESCRIPTION
[0017] In the following detailed description, reference is made to
the accompanying drawings, which form a part hereof. In the
drawings, similar symbols typically identify similar components,
unless context dictates otherwise. The illustrative embodiments
described in the detailed description, drawings, and claims are not
meant to be limiting. Other embodiments may be utilized, and other
changes may be made, without departing from the spirit or scope of
the subject matter presented here.
[0018] FIG. 1 illustrates an example environment 100. The
environment includes a heat pipe 110, a heat source 101, and a heat
sink 102. The heat pipe includes an evaporator portion 120 having a
wall 122 internally defining an evaporator chamber 124 and
configured to evaporate a liquid phase 150LP of a working fluid 150
by absorbing heat originating from the heat source 101. The heat
pipe includes a condenser portion 130 having a wall 132 internally
defining a condenser chamber 134 and configured to condense a vapor
phase 150VP of the working fluid by releasing heat 106. The heat
pipe includes the working fluid, illustrated as the liquid phase
150LP and the vapor phase 150VP of the working fluid. The heat pipe
includes a channeled heat transfer array 160. In an embodiment, the
condenser portion (and its condenser chamber) and the evaporator
portion (and its evaporator chamber) are portions of a single
structure having a single chamber, wherein one portion of the
single chamber functions as a condenser chamber and another portion
of the single chamber functions as a condenser chamber.
[0019] The evaporator chamber 120, the condenser chamber 130, and
the exterior surfaces of the at least two tubes of the channeled
heat transfer array 160 form a hermetically sealed hollow vessel
containing the working fluid 150.
[0020] FIG. 2 illustrates additional features of the heat transfer
array 160. The heat transfer array may be deployed in the
evaporator portion 120, or the condenser portion 130 (not
illustrated). In an embodiment, the heat transfer array may be
deployed in the evaporator portion, and another heat transfer array
may be deployed in the condenser portion. The heat transfer array
is illustrated in FIGS. 1 and 2 as deployed in conjunction with the
condenser portion for illustrative purposes. The heat transfer
array includes at least two tubes 162. The at least two tubes are
illustrated as tube 162A, tube 162B, and tube 162C. Each tube of
the at least two tubes has a wall. For example, the tube 162A
includes a wall 163A. The wall of each tube defines a channel open
to an intermediate fluid 180. For example, the wall 163A of the
tube 162A defines a channel 164A open to the intermediate fluid.
For example, the intermediate fluid may include an intermediate
fluid communicating between the heat sink 102 and the channels of
the at least two tubes, illustrated by flow 166B and manifolds 170L
and 170R. In an embodiment, the intermediate fluid includes an
environment relating to the immediate surroundings or conditions to
the heat pipe 110. In an embodiment, the intermediate fluid
includes the environment that surrounds the heat pipe. Further, the
wall of each tube of the at least two tubes has an exterior surface
directly exposed to the working fluid 150. For example, the wall
163A of the tube 162A has an exterior surface 165A directly exposed
to the working fluid contained within the condenser chamber 134,
illustrated as the vapor phase 150VP of the working fluid.
[0021] In an embodiment, the heat pipe 102 may comprise a loop heat
pipe. In an embodiment, the heat pipe may comprise a flat heat
pipe. In an embodiment, the relative elevations of the evaporator
portion 120 and condenser portions 130 may be interchangeable
depending on the deployed orientation of the heat pipe. For
example, in the embodiment illustrated in FIG. 1, the condenser
portion is above the evaporator portion. In another embodiment, the
evaporator portion may be above the condenser portion. In another
embodiment, the evaporator portion and the condenser portion may be
at a substantially same elevation. In an embodiment, the condenser
portion or the evaporation portion may be made from a copper,
Monel, or titanium material.
[0022] Continuing with FIG. 1, in an embodiment, the evaporator
portion 120 is configured to evaporate a liquid phase 150LP of the
working fluid 150 by absorbing heat from the heat source 101. In an
embodiment, the condenser portion 130 is configured to condense a
vapor phase 150VP of the working fluid by releasing heat 106 to the
heat sink 102.
[0023] In an embodiment, the heat pipe 102 includes a transport
portion 140 having an internal passageway 144 configured to flow
the working fluid 150 between the evaporator chamber 124 and the
condenser chamber 134. In an embodiment, the evaporator chamber,
the condenser chamber, the internal flow passageway, and the
exterior surfaces of the at least two tubes 162 of the channeled
heat transfer array 160 form a hermetically sealed hollow vessel
containing the working fluid. In an embodiment, the transport
portion includes a capillary structure 146 configured to facilitate
transportation of the working fluid in a liquid phase from the
condenser portion to the evaporator portion. For example, the
capillary structure may include a sintered metal powder wick,
grooved wick, or metal mesh wick. For example, the capillary
structure may include axial grooves, mesh screen, sintered metal
powders, sintered metal powder grooves (fine grooves), sintered
slab or sintered metal powder grooves. In an embodiment, the
transport portion includes (i) a first transport portion configured
to flow a vapor phase 150VP of the working fluid from the
evaporator chamber to the condenser chamber; and (ii) a second
transport portion configured to flow a liquid phase 150LP of the
working fluid from the condenser chamber to the evaporator chamber
(not illustrated). In an embodiment, the first transport portion
defines a first internal passageway. In an embodiment, the second
transport portion defines a second internal passageway. In an
embodiment, the second transport portion includes a capillary
material. In an embodiment, the second transport portion includes a
wicking material. In an embodiment, the second transport portion
includes a grooved surface.
[0024] In an embodiment, a surface of the hermetically sealed
hollow vessel comprises a capillary structure configured to
facilitate transportation of the working fluid. In an embodiment,
the capillary structure comprises a capillary material. In an
embodiment, the capillary structure comprises a wicking material.
In an embodiment, the capillary structure comprises a grooved
surface.
[0025] In an embodiment, the working fluid 150 includes a working
fluid tuned to a particular cooling situation. For example, a
particular cooling situation may include cooling a CPU, a piece of
high voltage transmission line equipment, or a communication or
instrumentation device. For example, the tuned to a particular
cooling situation may include tuned to function over an expected
temperature range of the heat source 101 and the heat sink 102. In
an embodiment, the working fluid includes a working fluid tuned to
a cooling situation in which the heat pipe is designed to
operate.
[0026] In an embodiment, the channeled heat transfer array is
located at least partially within the evaporator chamber 120. In an
embodiment, the channeled heat transfer array is located at least
partially within the condenser chamber 130. In an embodiment, the
channeled heat transfer array includes (i) a first channeled heat
transfer array located at least partially within the evaporator
chamber, (ii) and a second channeled heat transfer array located at
least partially within the condenser chamber. In an embodiment, the
channel of a tube of the at least two tubes is directly exposed to
an intermediate fluid (not illustrated).
[0027] In an embodiment, the at least two tubes 162 of the array
160 include at least two microtubes. Each microtube has a
microchannel configured to facilitate a laminar flow of the
intermediate fluid 180 through the microchannel. The intermediate
fluid may be a gas or a liquid, which may depend on the operating
temperature of the heat pipe. Laminar flow through a microchannel
is illustrated by the flow 166B through the tube 162B in FIG. 2. In
an embodiment, the microchannel is sized or shaped to facilitate a
laminar flow. For example, the fluid may include an intermediate
fluid 180. In an embodiment, the microchannel has a cross-sectional
dimension of less than about 1000 microns. In an embodiment, the
microchannel has a cross-sectional dimension that is about equal to
or less than the thermal boundary layer thickness of the
intermediate fluid. In an embodiment, the microchannel is a channel
in which the hydraulic diameter, expressed as four times the cross
sectional area of the channel divided by the perimeter of the cross
section, is less than approximately 1000 microns.
[0028] One of the advantages of using microchannel structures is
that turbulent flow within the channels is not necessary to
increase heat transfer efficiency. Microchannel structures neither
require nor create turbulent flow. Conventional macrochannels
require turbulence to increase cooling efficiency otherwise the
fluid flowing in the middle of the channel stays relatively cool.
Turbulent flow within the fluid channel mixes the hot fluid next to
the wall of the channel with the cooler fluid in the middle of the
channel. However, such turbulence and mixing decreases the
efficiency of cooling. Microchannels, instead, have the advantage
that the heat transfer coefficient "h" is inversely proportional to
the width of the channel. As "h" decreases efficiency increases. A
very narrow channel completely heats a very thin layer of fluid as
it travels through the collector.
[0029] In an embodiment, the exterior surface of a wall of a tube
of the at least two tubes lying within the hermetically sealed
hollow vessel is directly exposed to the working fluid. FIG. 2
illustrates an embodiment where the exterior surface 165A of a wall
163A of a tube 162A of the at least two tubes 162 lies within the
hermetically sealed hollow vessel and is directly exposed to the
working fluid 150. In an embodiment, the exterior surface of a wall
of a tube of the at least two tubes is directly exposed to the
working fluid over at least 50% of its area. In an embodiment, the
exterior surface of a wall of a tube of the at least two tubes is
directly exposed to the working fluid over at least 75% of its
area. In an embodiment, the exterior surface of a wall of a tube of
the at least two tubes is directly exposed to the working fluid
over at least 95% of its area. In an embodiment, a circumference of
the exterior surface of a wall of a tube of the at least two tubes
within the hermetically sealed hollow vessel is directly exposed to
the working fluid. In an embodiment, a circumference of exterior
surface of a wall of a tube of the at least two tubes within the
hermetically sealed hollow vessel is directly exposed to the
working fluid along at least 50% of the length of the exterior
surface. In an embodiment, a circumference of exterior surface of a
wall of a tube of the at least two tubes within the hermetically
sealed hollow vessel is directly exposed to the working fluid along
at least 75% of the length of the exterior surface.
[0030] In an embodiment, the exterior surface of a wall of a tube
of the at least two tubes within the hermetically sealed hollow
vessel is at least partially covered with a capillary structure
that is directly exposed to the working fluid. FIG. 2 illustrates
an embodiment where an exterior surface of a wall of the tube 162B
of the at least two tubes 162 lying within the hermetically sealed
hollow vessel is covered with a capillary structure 167B that is
directly exposed to the working fluid 150. In an embodiment, the
exterior surface of a wall of a tube of the at least two tubes
within the hermetically sealed hollow vessel is covered over at
least 50% of its area with a capillary structure that is directly
exposed to the working fluid. In an embodiment, the exterior
surface of a wall of a tube of the at least two tubes within the
hermetically sealed hollow vessel is covered over at least 75% of
its area with a capillary structure that is directly exposed to the
working fluid.
[0031] In an embodiment, at least one channel of a tube of the at
least two tubes 160 has a non-circular cross section. In an
embodiment, the at least one channel of a tube of the at least two
tubes has an elliptical cross section. In an embodiment, the at
least one channel of a tube of the at least two tubes has a
rectangular cross section.
[0032] FIG. 3 illustrates an example operational flow 200. After a
start operation, the operational flow includes a heat transfer
operation 210. The heat transfer operation includes flowing an
intermediate fluid carrying heat absorbed from a heat generating
device through an array of at least two tubes. Each tube of the
array of at least two tubes has a wall defining (i) a channel
flowing the intermediate fluid and (ii) an exterior surface exposed
to a liquid phase of a working fluid present in a first chamber of
a hermetically sealed vessel. In an embodiment, the intermediate
fluid may include an air, liquid, or gas. In an embodiment, the
heat transfer operation may be implemented using the channeled heat
transfer array 160 described in conjunction with FIGS. 1 and 2. An
absorption operation 220 includes absorbing heat from the
intermediate fluid by evaporating the liquid phase of the working
fluid into a vapor phase. In an embodiment, the absorption
operation may be implemented using the channeled heat transfer
array 160 and the evaporator chamber 120 described in conjunction
with FIGS. 1 and 2. A fluid transfer operation 230 includes flowing
the vapor-phase working fluid to a second chamber of the
hermetically sealed vessel. In an embodiment, the fluid transfer
operation may be implemented using the transport portion 140
described in conjunction with FIG. 1. A release operation 240
includes releasing heat from the vapor-phase working fluid present
in the second chamber to a heat sink by condensing the vapor-phase
working fluid into the liquid phase working fluid. In an
embodiment, the release operation may be implemented using the
condenser portion 130 described in conjunction with FIG. 1. A
return operation 260 includes flowing the liquid phase working
fluid back to the first chamber. In an embodiment, the return
operation may be implemented using the transport portion 140
described in conjunction with FIG. 1. The operational flow includes
an end operation.
[0033] In an embodiment, the absorption operation 220 further
includes flowing the liquid-phase working fluid proximate to the
exterior surface of each wall of the at least two tubes using a
capillary action. In an embodiment, the exterior surface includes
an exterior surface having at least a portion covered with a
capillary structure facilitating evaporation of the liquid-phase
working fluid. In an embodiment, the absorption operation may be
implemented using the capillary structure 167B described in
conjunction with FIG. 2. In an embodiment, the array of at least
two tubes includes an array of at least two microtubes, each
microtube having a microchannel configured to facilitate a laminar
flow of the intermediate fluid through the microchannel. In an
embodiment, the fluid transfer operation 230 further includes
flowing the liquid phase working fluid back to the first chamber
using a capillary action. The method of claim 35, wherein the
return operation 260 further includes flowing the liquid phase
working fluid back to the first chamber using a capillary
action.
[0034] In an embodiment, the operational flow 200 includes
assisting 250 the condensing the vapor-phase working fluid by
flowing another intermediate fluid thermally coupled with the heat
sink through another array of at least two tubes. Each tube of the
another array at least two tubes having a wall defining (i) a
channel flowing the another intermediate fluid and (ii) an exterior
surface exposed to the vapor-phase working fluid present in the
second chamber. The operation 250 may be implemented using another
instance of the channeled heat transfer array 160 and the
evaporator chamber 120 described in conjunction with FIGS. 1 and 2.
In an embodiment, the assisting the condensing further includes
flowing the condensed liquid-phase of the vapor-phase working fluid
proximate to the exterior surface of each wall of the at least two
tubes of the another array using a capillary action.
[0035] FIG. 4 illustrates an example operational flow 300. After a
start operation, the operational flow includes an absorption
operation 310. The absorption operation includes absorbing heat by
evaporating a liquid phase of a working fluid present in a first
chamber of a hermetically sealed vessel to a vapor phase. In an
embodiment, the absorption operation may be implemented using the
evaporator chamber 120 described in conjunction with FIG. 1. A
fluid transfer operation 320 includes flowing the vapor-phase
working fluid to a second chamber of the hermetically sealed
vessel. In an embodiment, the fluid transfer operation may be
implemented using the transport portion 140 described in
conjunction with FIG. 1. A release operation 330 includes releasing
heat from the vapor-phase working fluid present in the second
chamber to a heat sink by condensing the vapor-phase working fluid
into the liquid-phase working fluid. The condensing the vapor-phase
working fluid includes flowing an intermediate fluid thermally
coupled with the heat sink through an array of at least two tubes.
Each tube of the array at least two tubes having a wall defining
(i) a channel flowing the intermediate fluid and (ii) an exterior
surface exposed to the vapor-phase working fluid present in the
second chamber. In an embodiment the release operation may be
implemented using the condenser portion described in conjunction
with FIG. 1 and the channeled heat transfer array 160 described in
conjunction with FIGS. 1 and 2. A return operation 340 includes
flowing the liquid-phase working fluid back to the first chamber.
In an embodiment, the return operation may be implemented using the
transport portion 140 described in conjunction with FIG. 1. The
operational flow includes an end operation.
[0036] In an embodiment, the condensing the vapor-phase working
fluid further includes flowing the condensed liquid-phase of the
vapor-phase working fluid proximate to the exterior surface of each
wall of the at least two tubes using a capillary action. In an
embodiment, the exterior surface includes an exterior surface
having at least a portion covered with a capillary structure
further facilitating the condensing the vapor-phase working
fluid.
[0037] All references cited herein are hereby incorporated by
reference in their entirety or to the extent their subject matter
is not otherwise inconsistent herewith.
[0038] In some embodiments, "configured" includes at least one of
designed, set up, shaped, implemented, constructed, or adapted for
at least one of a particular purpose, application, or function.
[0039] It will be understood that, in general, terms used herein,
and especially in the appended claims, are generally intended as
"open" terms. For example, the term "including" should be
interpreted as "including but not limited to." For example, the
term "having" should be interpreted as "having at least." For
example, the term "has" should be interpreted as "having at least."
For example, the term "includes" should be interpreted as "includes
but is not limited to," etc. It will be further understood that if
a specific number of an introduced claim recitation is intended,
such an intent will be explicitly recited in the claim, and in the
absence of such recitation no such intent is present. For example,
as an aid to understanding, the following appended claims may
contain usage of introductory phrases such as "at least one" or
"one or more" to introduce claim recitations. However, the use of
such phrases should not be construed to imply that the introduction
of a claim recitation by the indefinite articles "a" or "an" limits
any particular claim containing such introduced claim recitation to
inventions containing only one such recitation, even when the same
claim includes the introductory phrases "one or more" or "at least
one" and indefinite articles such as "a" or "an" (e.g., "a
receiver" should typically be interpreted to mean "at least one
receiver"); the same holds true for the use of definite articles
used to introduce claim recitations. In addition, even if a
specific number of an introduced claim recitation is explicitly
recited, it will be recognized that such recitation should
typically be interpreted to mean at least the recited number (e.g.,
the bare recitation of "at least two chambers," or "a plurality of
chambers," without other modifiers, typically means at least two
chambers).
[0040] In those instances where a phrase such as "at least one of
A, B, and C," "at least one of A, B, or C," or "an [item] selected
from the group consisting of A, B, and C," is used, in general such
a construction is intended to be disjunctive (e.g., any of these
phrases would include but not be limited to systems that have A
alone, B alone, C alone, A and B together, A and C together, B and
C together, or A, B, and C together, and may further include more
than one of A, B, or C, such as A.sub.1, A.sub.2, and C together,
A, B.sub.1, B.sub.2, C.sub.1, and C.sub.2 together, or B.sub.1 and
B.sub.2 together). It will be further understood that virtually any
disjunctive word or phrase presenting two or more alternative
terms, whether in the description, claims, or drawings, should be
understood to contemplate the possibilities of including one of the
terms, either of the terms, or both terms. For example, the phrase
"A or B" will be understood to include the possibilities of "A" or
"B" or "A and B."
[0041] The herein described aspects depict different components
contained within, or connected with, different other components. It
is to be understood that such depicted architectures are merely
examples, and that in fact many other architectures can be
implemented which achieve the same functionality. In a conceptual
sense, any arrangement of components to achieve the same
functionality is effectively "associated" such that the desired
functionality is achieved. Hence, any two components herein
combined to achieve a particular functionality can be seen as
"associated with" each other such that the desired functionality is
achieved, irrespective of architectures or intermedial components.
Likewise, any two components so associated can also be viewed as
being "operably connected," or "operably coupled," to each other to
achieve the desired functionality. Any two components capable of
being so associated can also be viewed as being "operably
couplable" to each other to achieve the desired functionality.
Specific examples of operably couplable include but are not limited
to physically mateable or physically interacting components or
wirelessly interactable or wirelessly interacting components.
[0042] With respect to the appended claims, the recited operations
therein may generally be performed in any order. Also, although
various operational flows are presented in a sequence(s), it should
be understood that the various operations may be performed in other
orders than those which are illustrated, or may be performed
concurrently. Examples of such alternate orderings may include
overlapping, interleaved, interrupted, reordered, incremental,
preparatory, supplemental, simultaneous, reverse, or other variant
orderings, unless context dictates otherwise. Use of "Start,"
"End," "Stop," or the like blocks in the block diagrams is not
intended to indicate a limitation on the beginning or end of any
operations or functions in the diagram. Such flowcharts or diagrams
may be incorporated into other flowcharts or diagrams where
additional functions are performed before or after the functions
shown in the diagrams of this application. Furthermore, terms like
"responsive to," "related to," or other past-tense adjectives are
generally not intended to exclude such variants, unless context
dictates otherwise.
[0043] While various aspects and embodiments have been disclosed
herein, other aspects and embodiments will be apparent to those
skilled in the art. The various aspects and embodiments disclosed
herein are for purposes of illustration and are not intended to be
limiting, with the true scope and spirit being indicated by the
following claims.
* * * * *