U.S. patent application number 14/062678 was filed with the patent office on 2014-05-01 for chip on film and display device including the same.
The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Hee-Kwon Lee.
Application Number | 20140118969 14/062678 |
Document ID | / |
Family ID | 49554002 |
Filed Date | 2014-05-01 |
United States Patent
Application |
20140118969 |
Kind Code |
A1 |
Lee; Hee-Kwon |
May 1, 2014 |
CHIP ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
Abstract
A chip on film according to an exemplary embodiment includes: a
driving film, a wire layer formed on a first surface of the driving
film, a driving chip connected to the wire layer, and an
electromagnetic wave blocking layer formed on a second surface of
the driving film, in which a mesh portion may be formed on a
portion of the electromagnetic wave blocking layer.
Inventors: |
Lee; Hee-Kwon; (Yongin-City,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-City |
|
KR |
|
|
Family ID: |
49554002 |
Appl. No.: |
14/062678 |
Filed: |
October 24, 2013 |
Current U.S.
Class: |
361/749 ;
361/760 |
Current CPC
Class: |
H01L 23/552 20130101;
H01L 24/16 20130101; H01L 2224/16225 20130101; H01L 2924/12044
20130101; H01L 2924/12041 20130101; H05K 2201/09681 20130101; H05K
2201/10128 20130101; G02F 1/13452 20130101; H01L 2924/12044
20130101; H01L 23/4985 20130101; H01L 2924/12041 20130101; H05K
1/0281 20130101; H05K 1/189 20130101; H05K 9/00 20130101; H01L
2924/00 20130101; H01L 2924/00 20130101; H05K 1/0224 20130101 |
Class at
Publication: |
361/749 ;
361/760 |
International
Class: |
H05K 9/00 20060101
H05K009/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 25, 2012 |
KR |
10-2012-0119149 |
Claims
1. A chip on film comprising: a driving film, a wire layer formed
on a first surface of the driving film, a driving chip connected to
the wire layer, an electromagnetic wave blocking layer formed on a
second surface of the driving film; and a mesh portion is formed on
a portion of the electromagnetic wave blocking layer.
2. The chip on film of claim 1, wherein the mesh portion is formed
on a bending portion of the driving film.
3. The chip on film of claim 2, wherein the mesh portion is a
portion where a mesh pattern is formed on the electromagnetic wave
blocking layer.
4. The chip on film of claim 1, wherein the electromagnetic wave
blocking layer is a metal-plated layer.
5. The chip on film of claim 1, further comprising an insulation
layer covering the electromagnetic wave blocking layer.
6. The chip on film of claim 1, further comprising a cover layer
covering the wire layer.
7. The chip on film of claim 2, wherein the electromagnetic wave
blocking layer covers an entire surface under the driving film.
8. The chip on film of claim 2, wherein the electromagnetic wave
blocking layer covers a position corresponding to the driving chip
under the driving film.
9. A display device comprising: a display substrate, a chip on film
connected to a periphery portion of the display substrate, and a
flexible printed circuit (FPC) connected to the chip on film,
wherein the chip on film comprising: a driving film, a wire layer
formed on a first surface of the driving film, a driving chip
connected to the wire layer, an electromagnetic wave blocking layer
formed on a second surface of the driving film, and a mesh portion
formed on a portion of the electromagnetic wave blocking layer.
10. The display device of claim 9, wherein the display substrate is
a flexible substrate.
11. The display device of claim 9, wherein the driving chip is
positioned under the display substrate.
12. The display device of claim 11, wherein the mesh portion is
formed at a position corresponding to a bending portion of the
driving film.
13. The display device of claim 12, wherein the electromagnetic
wave blocking layer is a metal-plated layer.
14. The display device of claim 13, wherein the mesh portion is a
portion where a mesh pattern is formed on the metal-plated
layer.
15. The display device of claim 11, further comprising an
insulation layer covering the electromagnetic wave blocking
layer.
16. The display device of claim 11, further comprising a cover
layer covering the wire layer.
17. The display device of claim 12, wherein the electromagnetic
wave blocking layer covers an entire surface under the driving
film.
18. The display device of claim 12, wherein the electromagnetic
wave blocking layer covers a position corresponding to the driving
chip under the driving film.
Description
CLAIM OF PRIORITY
[0001] This application claims priority to and the benefit of
Korean Patent Application No. 10-2012-0119149 filed in the Korean
Intellectual Property Office on Oct. 25, 2012, the entire contents
of which are incorporated herein by reference.
BACKGROUND
[0002] 1. Field
[0003] The described technology relates generally to a chip on film
and a display device including the same.
[0004] 2. Description of the Related Art
[0005] A display device includes a liquid crystal display (LCD), an
organic light emitting diode (OLED) display, and the like, and
particularly the OLED display includes a display substrate
providing a pixel region and a non-pixel region, and a sealing
substrate that is disposed to face the display substrate for
encapsulation and attached to the substrate by a sealant such as
epoxy. A plurality of light emitting elements connected in a matrix
manner between a scan line and a data line to constitute a pixel is
formed in the pixel region of the display substrate, and a scan
driver and a data driver extending from the scan line and the data
line of the pixel region and processing a signal provided from the
outside through a pad to provide the processed signal to the scan
line and the data line are formed in the non-pixel region. The scan
driver and the data driver include a driving circuit processing the
signal provided from the outside to generate a scan signal and a
data signal, and are formed in the course of manufacturing the
light emitting element or manufactured as a separate integrated
circuit chip form to be mounted on the display substrate.
[0006] In the case where the scan driver and the data driver are
manufactured in an integrated circuit chip form to be mounted on
the display substrate, a drive IC may be mounted on a chip on film
(COF) to be connected to the pad of the display substrate. A wire
layer formed on the COF includes a RGB interface wire and the like,
the aforementioned wire layer does not cause electromagnetic
hindrances such as electromagnetic interface (EMI) and
electromagnetic susceptibility (EMS), but a wire layer of the COF
applied to a flexible display device having high resolution
includes wires for transferring high-speed data, for example,
mobile industry processor interface (MIPI) wires, source output
wires, and the like, causing electromagnetic hindrances such as
electromagnetic interface (EMI) and electromagnetic susceptibility
(EMS).
[0007] Further, since the wire layer of the COF applied to the
flexible display device of the thin film is formed of a single
layer in order to form a thin chip on film, it is difficult to
adjust an impedance matching level between the display substrate
and the chip on film, and thus, it is difficult to remove noise by
electromagnetic interference (EMI).
[0008] Further, in the case where an electromagnetic interference
prevention tape adheres to the chip on film in order to block the
electromagnetic wave, the thickness of the flexible display device
is increased.
[0009] The above information disclosed in this Background section
is only for enhancement of understanding of the background of the
described technology and therefore it may contain information that
does not form the prior art that is already known in this country
to a person of ordinary skill in the art.
SUMMARY
[0010] The described technology has been made in an effort to
provide a chip on film of a thin film, which can block an
electromagnetic interference, and a display device including the
same.
[0011] An exemplary embodiment provides a chip on film including: a
driving film, a wire layer formed on a first surface of the driving
film, a driving chip connected to the wire layer, an
electromagnetic wave blocking layer formed on a second surface of
the driving film, and a mesh portion formed on a portion of the
electromagnetic wave blocking layer.
[0012] The mesh portion may be formed on a bending portion of the
driving film.
[0013] The mesh portion may be a portion where a mesh pattern is
formed on the electromagnetic wave blocking layer.
[0014] The electromagnetic wave blocking layer may be a
metal-plated layer.
[0015] The chip on film may further include: an insulation layer
covering the electromagnetic wave blocking layer.
[0016] The chip on film may further include: a cover layer covering
the wire layer.
[0017] The electromagnetic wave blocking layer may cover an entire
surface under the driving film.
[0018] The electromagnetic wave blocking layer may cover a position
corresponding to the driving chip under the driving film.
[0019] Another exemplary embodiment provides a display device
including: a display substrate, a chip on film connected to a
periphery portion of the display substrate, and a flexible printed
circuit (FPC) connected to the chip on film, in which the chip on
film may include a driving film, a wire layer formed on a first
surface of the driving film, a driving chip connected to the wire
layer, and an electromagnetic wave blocking layer formed on a
second surface of the driving film, and a mesh portion may be
formed on a portion of the electromagnetic wave blocking layer.
[0020] The display substrate may be a flexible substrate.
[0021] The driving chip may be positioned under the display
substrate.
[0022] The mesh portion may be formed at a position corresponding
to a bending portion of the driving film.
[0023] The electromagnetic wave blocking layer may be a
metal-plated layer.
[0024] The mesh portion may be a portion where a mesh pattern is
formed on the metal-plated layer.
[0025] The display device may further include: an insulation layer
covering the electromagnetic wave blocking layer.
[0026] The display device may further include: a cover layer
covering the wire layer.
[0027] The electromagnetic wave blocking layer may cover an entire
surface under the driving film, or the electromagnetic wave
blocking layer may cover a position corresponding to the driving
chip under the driving film.
[0028] In a chip on film according to the exemplary embodiments, it
is possible to minimize electromagnetic interference (EMI) in a
display device to which the chip on film is connected by forming an
electromagnetic wave blocking layer under a driving film by a
metal-plated layer to block an electromagnetic wave occurring in a
wire layer formed on the driving film, particularly a high-speed
data transferring wire.
[0029] Further, it is possible to alleviate tension of a bending
portion and improve electromagnetic susceptibility (EMS) by forming
a mesh portion on the electromagnetic wave blocking layer at a
position corresponding to the bending portion of the driving
film.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] FIG. 1 is a side view of a chip on film according to a first
exemplary embodiment.
[0031] FIG. 2 is a base view of the chip on film according to the
first exemplary embodiment.
[0032] FIG. 3 is a side view of a state where a bending portion of
the chip on film according to the first exemplary embodiment is
bent.
[0033] FIG. 4 is a base view of a chip on film according to a
second exemplary embodiment.
[0034] FIG. 5 is a side view of a state where a bending portion of
the chip on film according to the second exemplary embodiment is
bent.
[0035] FIG. 6 is a side view of a display device including the chip
on film according to the first exemplary embodiment.
DETAILED DESCRIPTION
[0036] The present invention will be described more fully
hereinafter with reference to the accompanying drawings, in which
exemplary embodiments of the invention are shown. As those skilled
in the art would realize, the described embodiments may be modified
in various different ways, all without departing from the spirit or
scope of the present invention.
[0037] The drawings and description are to be regarded as
illustrative in nature and not restrictive. Like reference numerals
designate like elements throughout the specification. The size and
thickness of each configuration shown in the drawings are
arbitrarily shown for understanding and ease of description, but
the present invention is not limited thereto.
[0038] Throughout the specification, it will be understood that
when an element such as a layer, film, region, or substrate is
referred to as being "on" another element, it can be directly on
the other element or intervening elements may also be present.
[0039] FIG. 1 is a side view of a chip on film according to a first
exemplary embodiment, FIG. 2 is a base view of the chip on film
according to the first exemplary embodiment, and FIG. 3 is a side
view of a state where a bending portion of the chip on film
according to the first exemplary embodiment is bent.
[0040] As shown in FIG. 1, a chip on film 100 according to the
first exemplary embodiment includes a driving film 10, a wire layer
20 formed on the driving film 10, a driving chip 30 connected to
the wire layer 20, a cover layer 40 covering the wire layer 20, an
electromagnetic wave blocking layer 50 formed under the driving
film 10, and an insulation layer 60 covering the electromagnetic
wave blocking layer 50. In other words, the wire layer 20 is formed
on a first surface of the driving film 10 while the electromagnetic
wave blocking layer 50 is formed on a second surface of the driving
film 10.
[0041] The driving film 10 may be a flexible film including
polyimide and the like.
[0042] The wire layer 20 includes a plurality of signal
transferring lines 21 and 22 transferring a driving signal to the
driving chip 30 for an interface between a flexible printed circuit
(FPC) and a display substrate, and a plurality of signal
transferring lines includes an input signal transferring line 21
inputting a driving signal to the driving chip 30 and an output
signal transferring line 22 outputting the driving signal from the
driving chip 30.
[0043] The input signal transferring line 21 includes a high-speed
data transferring wire, thus affecting an electromagnetic
interference (EMI), and the output signal transferring line 22
includes a source output wire, thus affecting an electromagnetic
susceptibility (EMS).
[0044] The electromagnetic wave blocking layer 50 blocks
discharging of an electromagnetic wave occurring from the wire
layer 20 to the outside, and the electromagnetic wave blocking
layer 50 covers an entire surface under the driving film 10. The
electromagnetic wave blocking layer 50 may be formed of a
metal-plated layer to form a thin film, and the metal-plated layer
may include electromagnetic wave blocking metal such as a
copper-plated layer and may be formed of the same metal as the wire
layer 20.
[0045] Accordingly, the electromagnetic wave blocking layer 50 may
block the electromagnetic wave occurring in the wire layer 20
formed on the driving film 10, and particularly in the high-speed
data transferring wire 21 through impedance matching to minimize
the electromagnetic interference (EMI) occurring in the display
device to which the chip on film 100 is connected.
[0046] As shown in FIGS. 2 and 3, the flexible driving film 10 (or
the chip on film 100) has a bendable bending portion 11, and a mesh
portion 51 is formed on the electromagnetic wave blocking layer 50
at a position corresponding to the bending portion 11. The mesh
portion 51 is a portion where a mesh pattern 51a is formed on the
electromagnetic wave blocking layer 50, and the mesh pattern 51a is
formed by removing two diagonal layers 5 crossing each other from
the electromagnetic wave blocking layer 50.
[0047] As described above, it is possible to improve the
electromagnetic susceptibility (EMS) and alleviate tension of the
bending portion 11 by forming the electromagnetic wave blocking
layer 50 at a position corresponding to the bending portion 11 of
the driving film 10 and forming the mesh portion 51 on the
electromagnetic wave blocking layer 50 at the position
corresponding to the bending portion 11 of the driving film 10.
[0048] Meanwhile, in the first exemplary embodiment, the
electromagnetic wave blocking layer 50 covers the entire surface
under the driving film 10, but a second exemplary embodiment where
the electromagnetic wave blocking layer 50 covers only the position
corresponding to the driving chip 30 under the driving film is
feasible.
[0049] Hereinafter, the second exemplary embodiment will be
described in detail with reference to FIGS. 4 and 5.
[0050] FIG. 4 is a base view of a chip on film according to the
second exemplary embodiment.
[0051] The second exemplary embodiment illustrated in FIGS. 4 and 5
is substantially the same as the first exemplary embodiment
illustrated in FIGS. 1 to 3, with the exception of the formation
position of the electromagnetic wave blocking layer, and a repeated
description will be omitted.
[0052] As shown in FIGS. 4 and 5, the chip on film according to the
second exemplary embodiment includes a driving film 10, a wire
layer 20 formed on the driving film 10, a driving chip 30 connected
to the wire layer 20, a cover layer 40 covering the wire layer 20,
an electromagnetic wave blocking layer 50 formed under the driving
film 10, and an insulation layer 60 covering the electromagnetic
wave blocking layer 50.
[0053] The electromagnetic wave blocking layer 50 covers the
position corresponding to the driving chip 30 under the driving
film 10, and may further cover the high-speed data transferring
wire 21. The mesh portion 51 having the mesh pattern 51a may be
formed at a position corresponding to the bending portion 11 of the
driving film 10, while being spaced apart from the electromagnetic
wave blocking layer 50 between the driving film 10 and the
insulation layer 60.
[0054] Accordingly, the electromagnetic wave blocking layer 50 may
block the electromagnetic wave occurring in the high-speed data
transferring wire 21 through impedance matching to minimize the
electromagnetic interference (EMI) occurring in the display device
to which the chip on film 100 is connected.
[0055] Meanwhile, hereinafter, the display device including the
chip on film according to the first exemplary embodiment will be
described in detail.
[0056] FIG. 6 is a side view of a display device including the chip
on film according to the first exemplary embodiment.
[0057] As shown in FIG. 6, the display device including the chip on
film according to the first exemplary embodiment includes the
display substrate 200, the chip on film 100 connected to a
periphery portion of the display substrate 200, and a flexible
printed circuit (FPC) 300 connected to the chip on film 100.
[0058] The display substrate 200 may be a flexible substrate, and a
sealing substrate 400 that is disposed to face the display
substrate 200 for sealing and attached to the substrate by a
sealant such as epoxy is formed on the display substrate 200.
[0059] The FPC 300 is connected through an anisotropic conductive
film (ACF) to the chip on film 100. Accordingly, if a control
signal and a data signal are provided from the outside through the
FPC 300 to the driving chip 30 of the chip on film 100, the driving
chip 30 generates a scan signal and a data signal, and the driving
chip 30 transfers the generated signals through the scan line and
the data line to the light emitting element of the display
substrate 200.
[0060] The chip on film 100 includes the driving film 10, the wire
layer 20 formed on the driving film 10, the driving chip 30
connected to the wire layer 20, the cover layer 40 covering the
wire layer 20, the electromagnetic wave blocking layer 50 formed
under the driving film 10, and the insulation layer 60 covering the
electromagnetic wave blocking layer 50.
[0061] The electromagnetic wave blocking layer 50 blocks
discharging of an electromagnetic wave occurring from the wire
layer 20 to the outside, and the electromagnetic wave blocking
layer 50 covers an entire surface under the driving film 10. The
electromagnetic wave blocking layer 50 may be formed by the
metal-plated layer to form a thin film, and the metal-plated layer
may include electromagnetic wave blocking metal such as the
copper-plated layer.
[0062] Accordingly, the electromagnetic wave blocking layer 50 may
block the electromagnetic wave occurring in the wire layer 20
formed on the driving film 10, and particularly in the high-speed
data transferring wire through impedance matching to minimize the
electromagnetic interference (EMI) occurring in the display device
to which the chip on film is connected.
[0063] Further, the flexible driving film 10 has the bendable
bending portion 11, and the mesh portion 51 is formed between the
driving film 10 and the insulation layer 60 at a position
corresponding to the bending portion 11. The chip on film is bent
at the bending portion 11 to be positioned under the display
substrate 200.
[0064] As described above, it is possible to improve the
electromagnetic susceptibility (EMS) and alleviate tension of the
bending portion 11 by forming the electromagnetic wave blocking
layer 50 at a position corresponding to the bending portion 11 of
the driving film 10 and forming the mesh portion 51 on the
electromagnetic wave blocking layer 50 at the position
corresponding to the bending portion 11 of the driving film 10,
thus maximizing a bending angle of the bending portion 11 to
minimize the thickness of the bent chip on film. Therefore, the
thickness of the flexible display device may be reduced.
[0065] While this disclosure has been described in connection with
what is presently considered to be practical exemplary embodiments,
it is to be understood that the invention is not limited to the
disclosed embodiments, but, on the contrary, is intended to cover
various modifications and equivalent arrangements included within
the spirit and scope of the appended claims.
* * * * *