U.S. patent application number 13/826895 was filed with the patent office on 2014-05-01 for system and method for controlling electroplating.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Yong Chan JUNG, Young Gu KANG, Kwang Myung KIM, Jae Chan LEE.
Application Number | 20140116884 13/826895 |
Document ID | / |
Family ID | 50545995 |
Filed Date | 2014-05-01 |
United States Patent
Application |
20140116884 |
Kind Code |
A1 |
KANG; Young Gu ; et
al. |
May 1, 2014 |
SYSTEM AND METHOD FOR CONTROLLING ELECTROPLATING
Abstract
Disclosed herein is a system and method for controlling
electroplating, the method including: measuring current applied to
an object to be plated at the time of electroplating, by a current
sensor; receiving current data corresponding to the current applied
to the object to be plated at the time of electroplating to execute
necessary processing, and transmitting the processed current data
to the HMI, by the measurement system; receiving the current data
from the measurement system to execute necessary processing, and
transmitting the processed data to the PLC, by the HMI; receiving
the data from the HMI and storing the data in a memory, and then
comparing and computing the stored current measurement value and a
set current value, to control an output of the rectifier, by the
PLC; and controlling the current supplied to the electroplating
bath according to the control of the PLC, by the rectifier.
Inventors: |
KANG; Young Gu; (Busan,
KR) ; LEE; Jae Chan; (Busan, KR) ; JUNG; Yong
Chan; (Busan, KR) ; KIM; Kwang Myung;
(Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Gyeonggi-do |
|
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Gyeonggi-do
KR
|
Family ID: |
50545995 |
Appl. No.: |
13/826895 |
Filed: |
March 14, 2013 |
Current U.S.
Class: |
205/83 ;
204/229.2 |
Current CPC
Class: |
C25D 21/12 20130101 |
Class at
Publication: |
205/83 ;
204/229.2 |
International
Class: |
C25D 5/18 20060101
C25D005/18; C25D 21/12 20060101 C25D021/12 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 31, 2012 |
KR |
10-2012-0122150 |
Claims
1. A system for controlling electroplating, the system comprising:
an electroplating bath for performing electroplating on an object
to be plated therein, the electroplating bath having a current
sensor installed at one side of a body thereof, the current sensor
measuring a current applied to the object to be plated at the time
of electroplating; a measurement system receiving current data
corresponding to the current applied to the object to be plated at
the time of electroplating, which are measured by the current
sensor, from the electroplating bath to execute necessary
processing, and transmitting the processed current data to a
subsequent apparatus; a human machine interface (HMI) receiving the
current data applied to the object to be plated at the time of
electroplating, from the measurement system, to execute necessary
processing, and transmitting the processed data to a subsequent
apparatus; a programmable logic controller (PLC) receiving the data
from the HMI and storing the data in a memory, and comparing and
computing the stored current measurement value and a set current
value of a rectifier to control an output of the rectifier; and a
rectifier controlling the current supplied to the electroplating
bath according to the control of the PLC.
2. The system according to claim 1, wherein the electroplating bath
and the measurement system are configured to perform data
transmission and reception therebetween through wireless
communication.
3. The system according to claim 2, wherein the wireless
communication is Zigbee.
4. The system according to claim 1, wherein the measurement system
and the HMI are configured to perform data transmission and
reception therebetween through OLE for process control (OPC)
communication.
5. The system according to claim 4, wherein for the OLE for process
control (OPC) communication between the measurement system and the
HMI, the measurement system is defined as an OPC client and the HMI
is defined as an OPC server.
6. The system according to claim 4, wherein for the OLE for process
control (OPC) communication between the measurement system and the
HMI, an OPC distributed component object model (DCOM) is set.
7. The system according to claim 6, wherein the OPC DCOM includes
security configurating, access permissions setting, firewall
setting, password setting, and OPC port additive setting.
8. The system according to claim 1, wherein the HMI and the PLC are
configured to perform data transmission and reception therebetween
through Ethernet communication.
9. A method for controlling electroplating by a system for
controlling electroplating including an electroplating bath, a
measurement system, a human machine interface (HMI), a programmable
logic controller (PLC), and a rectifier, the method comprising: a)
measuring current applied to an object to be plated at the time of
electroplating, by a current sensor installed at the electroplating
bath; b) receiving current data corresponding to the current
applied to the object to be plated at the time of electroplating,
which are measured by the current sensor, to execute necessary
processing, and transmitting the processed current data to the HMI,
by the measurement system; c) receiving the current data applied to
the object to be plated at the time of electroplating, from the
measurement system, to execute necessary processing, and
transmitting the processed data to the PLC, by the HMI; d)
receiving the data from the HMI and storing the data in a memory,
and then comparing and computing the stored current measurement
value and a set current value of the rectifier, to control an
output of the rectifier, by the PLC; and e) controlling the current
supplied to the electroplating bath according to the control of the
PLC, by the rectifier.
10. The method according to claim 9, wherein the electroplating
bath and the measurement system are configured to perform data
transmission and reception therebetween through wireless
communication.
11. The method according to claim 10, wherein the wireless
communication is Zigbee.
12. The method according to claim 9, wherein the measurement system
and the HMI are configured to perform data transmission and
reception therebetween through OLE for process control (OPC)
communication.
13. The method according to claim 12, wherein for the OLE for
process control (OPC) communication between the measurement system
and the HMI, the measurement system is defined as an OPC client and
the HMI is defined as an OPC server.
14. The method according to claim 12, wherein for the OLE for
process control (OPC) communication between the measurement system
and the HMI, an OPC distributed component object model (DCOM) is
set.
15. The method according to claim 14, wherein the OPC DCOM includes
security configurating, access permissions setting, firewall
setting, password setting, and OPC port additive setting.
16. The method according to claim 9, wherein the HMI and the PLC
are configured to perform data transmission and reception
therebetween through Ethernet communication.
Description
CROSS REFERENCE(S) TO RELATED APPLICATIONS
[0001] This application claims the benefit under 35 U.S.C. Section
119 of Korean Patent Application Serial No. 10-2012-0122150,
entitled "System and Method for Controlling Electroplating" filed
on Oct. 31, 2012, which is hereby incorporated by reference in its
entirety into this application.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a system and a method for
controlling electroplating, and more particularly, to a system and
a method for controlling electroplating, capable of allowing a
product to be plated with a uniform thickness.
[0004] 2. Description of the Related Art
[0005] Today, market trends of domestic and international printed
circuit board (PCB) industries are changing day by day. The change
types of the PCB industries are focusing on high integration,
flexibility, and greening, such as reducing environmental
materials, for example, lead (Pb) and the like. In characteristics
of these changes of the PCB industries, the PCB is highly
multilayered and highly integrated, and thus the layers of the
substrate become thicker on from one surface or both surfaces or
multilayers. There are several essential technologies in the PCB
manufacturing method, but a plating technology for forming a
high-integration circuit becomes a main essential technology.
Currently, the plating technology for connecting layers and forming
circuits is a generic technology in the manufacture of PCB.
[0006] In particular, in electroplating, the deviation in plating
thickness is generated due to several factors such as intensity of
current, variation in current, mechanical design, chemical
reactions, and the like, which may cause several defects such as
under-etching, over-etching, and the like in the subsequent
process, a circuit process. Therefore, various attempts for
obtaining uniform plating thickness have been made.
RELATED ART DOCUMENT
Patent Documents
(Patent Document 1) Korean Laid-Open Patent Publication No.
10-2002-0091911
(Patent Document 2) Korean Laid-Open Patent Publication No.
10-2001-0107788
SUMMARY OF THE INVENTION
[0007] An object of the present invention is to provide a system
and a method for controlling electroplating, capable of allowing a
product (PCB) to be plated with a uniform thickness, by measuring
current intensity applied to the product at the time of plating and
then controlling the current supplied to the electrolytic copper
(electroplating bath) based on the measured current intensity.
[0008] According to an exemplary embodiment of the present
invention, there is provided a system for controlling
electroplating, the system including: an electroplating bath for
performing electroplating on an object to be plated therein, the
electroplating bath having a current sensor installed at one side
of a body thereof, the current sensor measuring a current applied
to the object to be plated at the time of electroplating; a
measurement system receiving current data corresponding to the
current applied to the object to be plated at the time of
electroplating, which are measured by the current sensor, from the
electroplating bath to execute necessary processing, and
transmitting the processed current data to a subsequent apparatus;
a human machine interface (HMI) receiving the current data applied
to the object to be plated at the time of electroplating, from the
measurement system, to execute necessary processing, and
transmitting the processed data to a subsequent apparatus; a
programmable logic controller (PLC) receiving the data from the HMI
and storing the data in a memory, and comparing and computing the
stored current measurement value and a set current value of a
rectifier to control an output of the rectifier; and a rectifier
controlling the current supplied to the electroplating bath
according to the control of the PLC.
[0009] The electroplating bath and the measurement system may be
configured to perform data transmission and reception therebetween
through wireless communication.
[0010] The wireless communication may be Zigbee.
[0011] The measurement system and the HMI may be configured to
perform data transmission and reception therebetween through OLE
for process control (OPC) communication.
[0012] Here, for the OLE for process control (OPC) communication
between the measurement system and the HMI, the measurement system
may be defined as an OPC client and the HMI may be defined as an
OPC server.
[0013] Here, for the OLE for process control (OPC) communication
between the measurement system and the HMI, an OPC distributed
component object model (DCOM) may be set.
[0014] The OPC DCOM may include security configurating, access
permissions setting, firewall setting, password setting, and OPC
port additive setting.
[0015] The HMI and the PLC may be configured to perform data
transmission and reception therebetween through Ethernet
communication.
[0016] According to another exemplary embodiment of the present
invention, there is provided a method for controlling
electroplating by a system for controlling electroplating including
an electroplating bath, a measurement system, a human machine
interface (HMI), a programmable logic controller (PLC), and a
rectifier, the method including: a) measuring current applied to an
object to be plated at the time of electroplating, by a current
sensor installed at the electroplating bath; b) receiving current
data corresponding to the current applied to the object to be
plated at the time of electroplating, which are measured by the
current sensor, to execute necessary processing, and transmitting
the processed current data to the HMI, by the measurement system;
c) receiving the current data applied to the object to be plated at
the time of electroplating, from the measurement system, to execute
necessary processing, and transmitting the processed data to the
PLC, by the HMI; d) receiving the data from the HMI and storing the
data in a memory, and then comparing and computing the stored
current measurement value and a set current value of the rectifier,
to control an output of the rectifier, by the PLC; and e)
controlling the current supplied to the electroplating bath
according to the control of the PLC, by the rectifier.
[0017] The electroplating bath and the measurement system may be
configured to perform data transmission and reception therebetween
through wireless communication.
[0018] The wireless communication may be Zigbee.
[0019] The measurement system and the HMI may be configured to
perform data transmission and reception therebetween through OLE
for process control (OPC) communication.
[0020] Here, for the OLE for process control (OPC) communication
between the measurement system and the HMI, the measurement system
may be defined as an OPC client and the HMI may be defined as an
OPC server.
[0021] Here, for the OLE for process control (OPC) communication
between the measurement system and the HMI, an OPC distributed
component object model (DCOM) may be set.
[0022] The OPC DCOM may include security configurating, access
permissions setting, firewall setting, password setting, and OPC
port additive setting.
[0023] The HMI and the PLC may be configured to perform data
transmission and reception therebetween through Ethernet
communication.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] FIG. 1 is a schematic diagram showing a constitution of a
system for controlling electroplating according to an exemplary
embodiment of the present invention; and
[0025] FIG. 2 is a flow chart showing a method for controlling
electroplating according to the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0026] Terms and words used in the present specification and claims
are not to be construed as a general or dictionary meaning but are
to be construed to have meaning and concepts meeting the technical
ideas of the present invention based on a principle that the
inventors can appropriately define the concepts of the terms in
order to describe their own inventions in the best mode.
[0027] Through the specification, unless explicitly described to
the contrary, the word "comprise" and variations such as
"comprises" or "comprising", will be understood to imply the
inclusion of stated elements but not the exclusion of any other
elements. In addition, the terms "-er", "-or", "module", and "unit"
described in the specification mean units for processing at least
one function and operation, and can be implemented by hardware
components or software components and combinations thereof.
[0028] Exemplary embodiments of the present invention will now be
described in detail with reference to the accompanying
drawings.
[0029] FIG. 1 is a schematic diagram showing a constitution of a
system for controlling electroplating according to an exemplary
embodiment of the present invention.
[0030] Referring to FIG. 1, a system for controlling electroplating
according to an exemplary embodiment of the present invention may
include an electroplating bath 110, a measurement system 120, a
human machine interface (HMI) 130, a programmable logic controller
140, and a rectifier 150.
[0031] In the electroplating bath 110, electroplating is performed
on an object to be plated (for example, PCB) 116. A current sensor
114 is installed at one side of a body of the electroplating bath
110 to measure a current applied to the object to be plated 116 at
the time of electroplating. That is, the electroplating bath 110 is
filled with an electrolytic liquid for electroplating.
Electroplating is performed while a plurality of objects to be
plated (PCBs) 116 fixed on a hanger 112 are immersed in the
electrolytic liquid. The current sensor 114 for measuring the
current at the time of plating is installed at a predetermined
portion of the hanger 112.
[0032] The measurement system 120 receives data, which correspond
to the current applied to the object to be plated (PCB) 116 at the
time of electroplating and are measured by the current sensor 114,
from the electroplating bath 110 (that is, the current sensor 114
installed at the hanger 112 within the electroplating bath 110) to
execute necessary processing, and transmits the processed data to a
subsequent apparatus (herein, the HMI 130). Here, data transmission
and reception between the measurement system 120 and the
electroplating bath 110 may be performed through wireless
communication. Here, as the wireless communication, Zigbee may be
used.
[0033] The human machine interface (HMI) 130 receives current data,
which are applied to the object to be plated (PCB) 116 at the time
of electroplating, through the measurement system 120 to execute
necessary processing, and transmits the processed data to a
subsequent apparatus (herein, the PLC 140). Here, as the HMI 130, a
general PC may be used.
[0034] In addition, data transmission and reception between the
measurement system 120 and the HMI 130 may be performed through an
OLE for process control (OPC) communication. Here, the OPC
communication is a single communication interface for performing
communication between various applications.
[0035] In addition, for OPC communication between the measurement
system 120 and the HMI 130, the measurement system 120 may be
designated as an OPC client and the HMI 130 may be designated as an
OPC server when communication is performed.
[0036] Here, an OPC distributed component object model (DCOM) may
be set for the OPC communication between the measurement system 120
and the HMI 130.
[0037] In addition, here, security configurating, access
permissions setting, firewall setting, password setting, OPC port
additive setting may be set in the OPC DCOM.
[0038] Meanwhile, the PLC 140 receives data from the HMI 130 and
stores the data in a memory (not shown), and compares and computes
the stored current measurement value and the set current value of
the rectifier 150 to control an output of the rectifier 150.
[0039] Here, data transmission and reception between the HMI 130
and the PLC 140 may be performed through Ethernet
communication.
[0040] The rectifier 150 controls the current supplied to the
electroplating bath 110 according to the control of the PLC
140.
[0041] Then, a method for controlling electroplating by the system
for controlling electroplating according to the present invention
having the above constitution will be described.
[0042] FIG. 2 is a flow chart showing a method for controlling
electroplating according to the present invention.
[0043] Referring to FIG. 2, the method for controlling
electroplating according to the present invention is a method for
controlling electroplating carried out by the system for
controlling electroplating, including the electroplating bath 110,
the measurement system 120, the HMI 130, the PLC 140, and the
rectifier 150. First, the current sensor 114 installed at the
electroplating bath 110 measures the current applied to the object
to be plated (PCB) 116 at the time of electroplating (S201).
[0044] Then, the measurement system 120 receives data corresponding
to the current applied to the object to be plated at the time of
electroplating, which are measured by the current sensor 114, to
execute necessary processing, and then transmits the processed data
to the HMI 130 (S202).
[0045] Then, the human machine interface (HMI) 130 receives current
data, which are applied to the object to be plated (PCB) 116 at the
time of electroplating, through the measurement system 120 to
execute necessary processing, and transmits the processed data to
the PLC 140 (S203).
[0046] Then, the PLC 140 receives data from the HMI 130 and stores
the data in a memory (not shown), and compares and computes the
stored current measurement value and the set current value of the
rectifier 150 to control an output of the rectifier 150 (S204).
That is, the PLC 140 compares and computes the set current value of
the rectifier 150 and the current value measured by the measurement
system 120. Then, the output of the rectifier 150 is controlled in
a manner, such as +1 A, +2 A, +3 A, -1 A, -2 A, and -3 A, by a
difference between the current measurement value and the set
current value. Here, the output of the rectifier 150 is controlled
until the current measurement value is equal to the set current
value.
[0047] After that, the rectifier 150 controls the current supplied
to the electroplating bath 110 according to the control of the PLC
140 (S205).
[0048] In the series procedure as above, data transmission and
reception between the electroplating bath 110 and the measurement
system 120 may be performed through wireless communication. Here,
as the wireless communication, Zigbee may be used.
[0049] In addition, data transmission and reception between the
measurement system 120 and the HMI 130 may be performed through an
OLE for process control (OPC) communication.
[0050] Here, for the OPC communication between the measurement
system 120 and the HMI 130, the measurement system 120 may be
designated as an OPC client and the HMI 130 may be designated as an
OPC server when communication is performed.
[0051] Here, an OPC distributed component object model (DCOM) may
be set for the OPC communication between the measurement system 120
and the HMI 130.
[0052] Here, security configurating, access permissions setting,
firewall setting, password setting, and OPC port additive setting
may be set in the OPC DCOM.
[0053] In addition, data transmission and reception between the HMI
130 and the PLC 140 may be performed through Ethernet
communication.
[0054] Here, with respect to the OPC communication employed in the
present invention, communication mechanism between the measurement
system 120 and the HMI 130 will be described.
[0055] As described above, the OPC distributed component object
model (DCOM) is set for the OPC communication between the
measurement system 120 and the HMI 130. When security
configurating, access permissions setting, firewall setting,
password setting, and OPC port additive setting were completed with
respect to the OPC DCOM setting, communication is executed by using
a communication tag according to a tag naming rule previously
discussed. Here, tag transmission between the measurement system
120 and the HMI 130 using the current sensor 114 is
exemplified.
[0056] Tags necessary for communication are largely classified into
four types, Tag M, Tag E, Tag A, and Tag C.
[0057] First, Tag C is an abbreviation of "connection", and is a
tag for checking the communication connection state between two
equipments. A certain value is continuously written from the
measurement system 120 to the HMI 130. It is determined that the
OPC communication is disconnected if the certain value is not
changed for 10 seconds or longer.
[0058] Tag A is an abbreviation of "alarm", and is a tag for
generating or canceling alarm when the OPC communication is
disconnected.
[0059] Tag E is an abbreviation of "event", and is a tag for
transmitting data about product LOT ID and hanger No., from the HMI
130 to the measurement system 120.
[0060] In addition, Tag M is a parameter-related tag, and a tag for
periodically transmitting data.
[0061] The measurement system 120 implements tag transmission to
the HMI 130 by using Tag M including the current value measured by
the current sensor 114 in addition to data of Tag E (Product LOT
ID, hanger No.).
[0062] Here, a substantial example of transmission with respect to
the respective tags will be described.
[0063] As described above, Tag M is a parameter-related tag, and a
tag for periodically transmitting data.
[0064] Ex) tag transmission example:
M.sub.--003.sub.--000002.sub.--00-FFA393949;35
[0065] (Current value at Clamp No. 003 of Hanger No. 2 is 35 A and
Product LOT No. is FFA393949)
[0066] Tag E includes hanger number and product LOT ID, and the HMI
130 implements tag transmission thereof to the measurement system
120 at the same time when the product (PCB) is input.
[0067] Ex) tag transmission example:
E.sub.--000.sub.--0000001.sub.--00-163030;H.sub.--001;F394549439
[0068] (Hanger H.sub.--001 enters the electroplating bath and
Product LOT ID under working is F394549439, at 16:30:30)
[0069] Tag A is a tag for generating or canceling alarm for
communication between the measurement system 120 and the HMI
130.
[0070] Ex) tag transmission example:
A.sub.--000.sub.--000000.sub.--01
[0071] (Alarm generation A.sub.--000.sub.--000000.sub.--02: alarm
cancellation)
[0072] Tag C is a tag for checking the connection state between the
measurement system 120 and the HMI 130.
[0073] A certain value is continuously written in the HMI 130. If
the certain value is not changed for 10 seconds or longer, the
communication is determined to be disconnected.
[0074] Ex) C.sub.--000.sub.--000001.sub.--00.fwdarw.86685, write a
certain value
[0075] As described above, in the present invention, four types of
tags such as, tag M, tag E, tag A, and tag C are used for the OPC
communication.
[0076] As described above, the system and the method for
controlling electroplating according to the present invention, the
current applied to the object to be plated (PCB) at the time of
electroplating is measured, and is fed-back to the rectifier, and
then based on this, the rectifier controls and controls the current
to the plating bath, so that the object to be plated can be plated
with a uniform thickness.
[0077] As set forth above, according to the present invention, the
current applied to the object to be plated (PCB) at the time of
electroplating is measured, and is fed-back to the rectifier, and
then based on this, the rectifier controls the current supplied to
the plating bath, so that the object to be plated can be plated
with a uniform thickness.
[0078] Although the exemplary embodiments of the present invention
have been disclosed for illustrative purposes, the present
invention is not limited thereto, and it will be appreciated to
those skilled in the art that various modifications, additions and
substitutions are possible, without departing from the scope and
spirit of the invention as disclosed in the accompanying claims.
Therefore, the protection scope of the present invention must be
construed by the following claims and it should be construed that
all spirit within a scope equivalent thereto are included in the
scope of the present invention.
* * * * *