U.S. patent application number 13/779841 was filed with the patent office on 2014-04-10 for grinding apparatus for a substrate.
This patent application is currently assigned to Samsung Display Co., Ltd.. The applicant listed for this patent is SAMSUNG DISPLAY CO., LTD.. Invention is credited to Ee Hyun An, Sang-Hoon Back, In Ho LEE, Jun-Hee Lee, Jung Kun Shin.
Application Number | 20140099870 13/779841 |
Document ID | / |
Family ID | 50433039 |
Filed Date | 2014-04-10 |
United States Patent
Application |
20140099870 |
Kind Code |
A1 |
LEE; In Ho ; et al. |
April 10, 2014 |
GRINDING APPARATUS FOR A SUBSTRATE
Abstract
A substrate grinding apparatus according to an exemplary
embodiment of the present invention includes a grinding wheel
grinding an object substrate, a nozzle unit spraying cooling water
to the object substrate and the grinding wheel in a plurality of
directions, and a cooling water controller connected to the nozzle
unit and controlling spray speed and pressure of the cooling water,
in which the nozzle unit includes a cleansing nozzle cleansing the
grinding wheel, a cooling nozzle cooling the grinding wheel, and a
surface protecting nozzle cooling the object substrate.
Inventors: |
LEE; In Ho; (Suwon-si,
KR) ; An; Ee Hyun; (Gyeonggi-do, KR) ; Lee;
Jun-Hee; (Seoul, KR) ; Back; Sang-Hoon;
(Chungcheongnam-do, KR) ; Shin; Jung Kun;
(Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG DISPLAY CO., LTD. |
Gyeongg-do |
|
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
Gyeonggi-do
KR
|
Family ID: |
50433039 |
Appl. No.: |
13/779841 |
Filed: |
February 28, 2013 |
Current U.S.
Class: |
451/444 ;
451/450 |
Current CPC
Class: |
B24B 55/02 20130101;
B24B 53/095 20130101; B24B 53/007 20130101 |
Class at
Publication: |
451/444 ;
451/450 |
International
Class: |
B24B 53/095 20060101
B24B053/095; B24B 53/007 20060101 B24B053/007 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 9, 2012 |
KR |
2012-0111799 |
Claims
1. A substrate grinding apparatus comprising: a grinding wheel
configured to grind an object substrate; a nozzle unit configured
to spray cooling water to the object substrate and the grinding
wheel in a plurality of directions; and a cooling water controller
connected to the nozzle unit and configured to control a spray
speed and a pressure of the cooling water, wherein the nozzle unit
includes, a cleansing nozzle configured to cleanse the grinding
wheel, a cooling nozzle configured to cool the grinding wheel, and
a surface protecting nozzle configured to cool the object
substrate.
2. The substrate grinding apparatus of claim 1, wherein the
cleansing nozzle is configured to spray the cooling water to the
grinding wheel after the grinding wheel and the object substrate
contact each other.
3. The substrate grinding apparatus of claim 2, wherein the
cleansing nozzle includes a two-fluid nozzle.
4. The substrate grinding apparatus of claim 1, wherein the cooling
nozzle is configured to spray the cooling water to the grinding
wheel before the grinding wheel and the object substrate contact
each other.
5. The substrate grinding apparatus of claim 1, wherein the surface
protecting nozzle is configured to spray the cooling water to the
grinding wheel and the object substrate.
6. The substrate grinding apparatus of claim 1, further comprising:
a rotating unit connected to the nozzle unit and configured to
change a cooling water spray direction of the nozzle unit; and a
numerical value controller connected to the rotating unit and
configured to control the rotating unit.
7. The substrate grinding apparatus of claim 6, wherein the
rotating unit includes: a power transmission apparatus; a rotation
shaft configured to rotate the power transmission apparatus; and a
rotary joint connected to the power transmission apparatus.
8. The substrate grinding apparatus of claim 7, wherein a supply
flow path of the cooling water is formed at an outer ring of the
rotary joint.
9. The substrate grinding apparatus of claim 8, wherein the nozzle
unit includes: a first nozzle controller connected to the surface
protecting nozzle; and a second nozzle controller connected to the
cooling nozzle and the cleansing nozzle.
10. The substrate grinding apparatus of claim 9, wherein the first
nozzle controller and the second nozzle controller are connected to
an outer ring of the rotary joint.
11. The substrate grinding apparatus of claim 10, wherein the first
nozzle controller and the second nozzle controller are moved up and
down and rotated left and right.
12. The substrate grinding apparatus of claim 1, further comprising
an air layer removal film positioned near the grinding wheel and
configured to remove an air boundary layer.
13. A grinding apparatus comprising: a grinding unit configured to
grind an object; a rotating unit connected to the grinding unit and
configured to rotate the grinding unit; and a nozzle unit
configured to spray a cooling material to the grinding unit or
object in a plurality of directions.
14. The grinding apparatus of claim 13, wherein the nozzle unit
includes a first nozzle configured to spray the cooling material in
a first direction and a second nozzle configured to spray the
cooling material in a second direction different from the first
direction.
15. The grinding apparatus of claim 14, wherein the nozzle unit
includes a third nozzle configured to spray the cooling material in
a third direction different from the first and second
directions.
16. The grinding apparatus of claim 13, further comprising a
cooling water controller connected to the nozzle unit and
configured to control a speed and a pressure of the sprayed cooling
material.
17. The grinding apparatus of claim 13, wherein the nozzle unit is
connected to an outer ring of the rotating unit.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to Korean Patent
Application No. 10-2012-0111799 filed in the Korean Intellectual
Property Office on Oct. 9, 2012, the disclosure of which is
incorporated by reference herein in its entirety.
TECHNICAL FIELD
[0002] Embodiments of the present invention relate to a grinding
apparatus for a substrate.
DISCUSSION OF THE RELATED ART
[0003] Flat panel displays, such as liquid crystal displays,
organic light emitting devices, or the like, include a display
panel. A substrate of the display panel may be divided into a
plurality of individual cells by a cutting process.
[0004] A cut portion of each individual cell is sharp, and may be
subjected to a grinding process.
[0005] In the substrate grinding process, the substrate is ground
by using a grinding wheel, and is cooled and cleansed by spraying
cooling water through one nozzle.
SUMMARY
[0006] A substrate grinding apparatus according to an exemplary
embodiment of the present invention includes a grinding wheel
configured to grind an object substrate, a nozzle unit configured
to spray cooling water to the object substrate and the grinding
wheel in a plurality of directions, and a cooling water controller
connected to the nozzle unit and configured to control a spray
speed and a pressure of the cooling water, in which the nozzle unit
includes a cleansing nozzle configured to cleanse the grinding
wheel, a cooling nozzle configured to cool the grinding wheel, and
a surface protecting nozzle configured to cool the object
substrate.
[0007] The cleansing nozzle may spray the cooling water to the
grinding wheel after the grinding wheel and the object substrate
contact each other.
[0008] The cleansing nozzle may include a two-fluid nozzle.
[0009] The cooling nozzle may spray the cooling water to the
grinding wheel before the grinding wheel and the object substrate
contact each other.
[0010] The surface protecting nozzle may spray the cooling water to
the grinding wheel and the object substrate.
[0011] The substrate grinding apparatus may further include a
rotating unit connected to the nozzle unit and changing a cooling
water spray direction of the nozzle unit, and a numerical value
controller connected to the rotating unit and controlling the
rotating unit.
[0012] The rotating unit may include a power transmission
apparatus, a rotation shaft rotating the power transmission
apparatus, and a rotary joint connected to the power transmission
apparatus.
[0013] A supply flow path of the cooling water may be formed at an
outer ring of the rotary joint.
[0014] The nozzle unit may include a first nozzle controller
connected to the surface protecting nozzle, and a second nozzle
controller connected to the cooling nozzle and the cleansing
nozzle.
[0015] The first nozzle controller and the second nozzle controller
may be connected to an outer ring of the rotary joint.
[0016] The first nozzle controller and the second nozzle controller
may be moved up and down and may be rotated left and right.
[0017] The substrate grinding apparatus may further include an air
layer removal film positioned near the grinding wheel and removing
an air boundary layer.
[0018] A grinding apparatus according to an embodiment of the
present invention includes a grinding unit configured to grind an
object, a rotating unit connected to the grinding unit and
configured to rotate the grinding unit, and a nozzle unit
configured to spray a cooling material to the grinding unit or
object in a plurality of directions.
[0019] The nozzle unit may include a first nozzle configured to
spray the cooling material in a first direction and a second nozzle
configured to spray the cooling material in a second direction
different from the first direction.
[0020] The nozzle unit may include a third nozzle configured to
spray the cooling material in a third direction different from the
first and second directions.
[0021] The grinding apparatus may further include a cooling water
controller connected to the nozzle unit and configured to control a
speed and a pressure of the sprayed cooling material.
[0022] The nozzle unit may be connected to an outer ring of the
rotating unit.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIG. 1 is a perspective view illustrating a substrate
grinding apparatus according to an exemplary embodiment of the
present invention.
[0024] FIG. 2 is an enlarged view illustrating a nozzle unit and a
grinding unit of the substrate grinding apparatus of FIG. 1.
[0025] FIG. 3 is a view illustrating grinding a substrate by using
the substrate grinding apparatus of FIG. 1.
[0026] FIG. 4 is a view illustrating grinding a substrate by using
a substrate grinding apparatus according to an exemplary embodiment
of the present invention.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0027] Embodiments of the present invention will be hereinafter
described in detail with reference to the accompanying drawings.
However, the present invention may be embodied in many different
forms and should not be construed as being limited to the
embodiments set forth herein.
[0028] It will be understood that when an element is referred to as
being "on," "connected to" or "coupled to" another element, it can
be directly on, connected to or coupled to the other element or
intervening elements may be present. Like reference numerals may
designate like or similar elements throughout the specification and
the drawings.
[0029] FIG. 1 is a perspective view illustrating a substrate
grinding apparatus according to an exemplary embodiment of the
present invention, FIG. 2 is an enlarged view of a nozzle unit and
a grinding unit of the substrate grinding apparatus of FIG. 1, and
FIG. 3 is a view illustrating grinding a substrate by using the
substrate grinding apparatus of FIG. 1.
[0030] A structure of a substrate grinding apparatus shown in FIG.
1 to FIG. 3 is provided as an example, and the embodiments of the
present invention are not limited thereto. Accordingly, the
substrate grinding apparatus may have different structures.
[0031] Referring to FIG. 1 to FIG. 3, a substrate grinding
apparatus according to an present exemplary embodiment includes a
grinding unit 100 for grinding an object substrate 10, a nozzle
unit 200 for spraying cooling water in a plurality of directions, a
cooling water controller 300 for controlling spray speed and
pressure of the cooling water, a rotating unit 400 for rotating a
cooling water spray direction of the nozzle unit 200 to be suitable
for the object substrate 10, and a numerical value controller 500
for controlling the rotating unit 400. As an example, cooling water
is used herein, but the embodiments of the present invention are
not limited thereto. Other types of cooling materials, such as a
cooling oil, may be also used according to an embodiment of the
present invention.
[0032] The grinding unit 100 includes a grinding wheel 110 that
rotates at high speed and grinds the object substrate 10 and a
driving shaft 120 that rotates the grinding wheel 110. The grinding
wheel 110 is moved along a grind surface of the object substrate 10
while being rotated.
[0033] The nozzle unit 200 includes a surface protecting nozzle
210, a cooling nozzle 220, and a cleansing nozzle 230.
[0034] The cleansing nozzle 230 cleanses the grinding wheel 110.
For example, the cleansing nozzle 230 sprays cooling water to the
grinding wheel 110, e.g., after the grinding wheel 110 and the
object substrate 10 are brought in contact with each other, and
removes sludge left on the surface of the grinding wheel 110 after
grinding and removes an air boundary layer generated near the
grinding wheel 110 when grinding the object substrate 10.
[0035] The cleansing nozzle 230 may be, e.g., a two-fluid nozzle.
The two-fluid nozzle atomizes and sprays a liquid by using a
pressure difference generated by the high-speed flow of the
compressed air. By applying the two-fluid nozzle to the cleansing
nozzle 230, the pressure of the sprayed cooling water is increased,
and the amount of the cooling water used is reduced. Thus, the
sludge left on the surface of the grinding wheel 110 may be
removed. Also, the cleansing performance may be increased through
cavitation.
[0036] The cooling nozzle 220 sprays the cooling water to the
grinding wheel 110 before the grinding wheel 110 contacts the
object substrate 10 when grinding the object substrate 10, and may
thus cool a relatively wide area and may facilitate air discharge.
Thus, heat buildup may be reduced.
[0037] The surface protecting nozzle 210 sprays the cooling water
to the grinding wheel 110 and the object substrate 10 to cool the
object substrate 10 while protecting the surface of the object
substrate 10 from the rotation of the grinding wheel 110, the
cooling water spray, and the sludge transited to the grinding unit
100.
[0038] The nozzle unit 200 includes a first nozzle controller 240
connected to the surface protecting nozzle 210 and a second nozzle
controller 250 connected to the cooling nozzle 220 and the
cleansing nozzle 230.
[0039] The first nozzle controller 240 is moved up and down and is
rotated left and right to control the height and the direction of
the cooling water spray of the surface protecting nozzle 210. The
second nozzle controller 250 is also moved up and down and is
rotated left and right to control the height and the direction of
the cooling water spray of the of the cooling nozzle 220 and the
cleansing nozzle 230.
[0040] The cooling water controller 300 is connected to the nozzle
unit 200 and controls the spray speed and the pressure of the
cooling water sprayed from the surface protecting nozzle 210, the
cooling nozzle 220, and the cleansing nozzle 230.
[0041] The rotating unit 400 includes a power transmission
apparatus 410, such as a gear or a belt, a rotation shaft 420 for
rotating the power transmission apparatus 410, and a rotary joint
430 for preventing the fluid flow from being changed during the
rotation.
[0042] The power transmission apparatus 410 and the rotary joint
430 are connected to each other, and the rotary joint 430 is thus
rotated by the rotation of the rotation shaft 420.
[0043] The first and second nozzle controllers 240 and 250 are
connected to an outer ring of the rotary joint 430. A flow path for
supplying the cooling water to the surface protecting nozzle 210,
the cooling nozzle 220, and the cleansing nozzle 230 is positioned
not at an inner path of the rotary joint 430 but at the outer ring
of the rotary joint 430, and the cooling water is supplied to each
of the nozzles 210, 220, and 230 through the first and second
nozzle controllers 240 and 250. Accordingly, the rotary joint 430
need not be connected to a motor that rotates at high speed.
[0044] The numerical value controller 500 is connected to the
rotating unit 400 and controls the rotation of the rotation shaft
420.
[0045] When grinding the object substrate 10 by using the substrate
grinding apparatus according to an exemplary embodiment, a
direction in which the object substrate 10 contacts the grinding
wheel 110 may be changed. In this case, the numerical value
controller 500 controls the rotation of the rotation shaft 420 to
rotate the rotary joint 430, and thus the cooling water spray
direction is changed, and the surface protecting nozzle 210, the
cooling nozzle 220, and the cleansing nozzle 230 may perform their
respective functions.
[0046] As described above, by using a plurality of nozzles, for
example, the surface protecting nozzle 210, the cooling nozzle 220,
and the cleansing nozzle 230, the cooling water is sprayed in a
plurality of directions, and thus, the grinding efficiency may be
increased and the lifetime of the grinding wheel 110 may be
increased.
[0047] FIG. 4 is a view showing grinding a substrate by a substrate
grinding apparatus according to an exemplary embodiment of the
present invention.
[0048] Referring to FIG. 4, the substrate grinding apparatus is the
same or substantially the same as the substrate grinding apparatus
shown in FIG. 1 except that the substrate grinding apparatus shown
in FIG. 4 includes an air layer removal film 270.
[0049] The substrate grinding apparatus includes the air layer
removal film 270 near the grinding wheel 110.
[0050] The air layer removal film 270 removes an air boundary layer
formed near the grinding wheel 110 that rotates at a high speed and
decreases the pressure gradient, thus resulting in an increase in
the inflow performance of the cooling water.
[0051] While exemplary embodiments of the present invention have
been described, the present invention is not limited to the
embodiments, and various modifications and variations may be made
to the invention.
* * * * *