U.S. patent application number 13/826408 was filed with the patent office on 2014-03-27 for magnetoresistive element and magnetic memory.
The applicant listed for this patent is Kabushiki Kaisha Toshiba, Tohoku University. Invention is credited to Tadaomi Daibou, Yushi Kato, Eiji Kitagawa, Takahide Kubota, Terunobu Miyazaki, Shigemi Mizukami, Takao Ochiai.
Application Number | 20140084401 13/826408 |
Document ID | / |
Family ID | 50288824 |
Filed Date | 2014-03-27 |
United States Patent
Application |
20140084401 |
Kind Code |
A1 |
Kato; Yushi ; et
al. |
March 27, 2014 |
MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY
Abstract
A magnetoresistive element according to an embodiment includes a
first magnetic layer, a second magnetic layer, and a first
nonmagnetic layer provided between the first magnetic layer and the
second magnetic layer, the first magnetic layer including a
magnetic film of Mn.sub.xGe.sub.y (77 atm %.ltoreq.x.ltoreq.82 atm
%, 18 atm %.ltoreq.y.ltoreq.23 atm %, x+y=100 atm %).
Inventors: |
Kato; Yushi; (Tokyo, JP)
; Daibou; Tadaomi; (Yokohama-shi, JP) ; Kitagawa;
Eiji; (Yokohama-shi, JP) ; Ochiai; Takao;
(Funabashi-shi, JP) ; Kubota; Takahide;
(Sendai-shi, JP) ; Mizukami; Shigemi; (Sendai-shi,
JP) ; Miyazaki; Terunobu; (Sendai-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kabushiki Kaisha Toshiba;
Tohoku University; |
|
|
US
US |
|
|
Family ID: |
50288824 |
Appl. No.: |
13/826408 |
Filed: |
March 14, 2013 |
Current U.S.
Class: |
257/425 |
Current CPC
Class: |
G11C 11/161 20130101;
H01L 27/228 20130101; H01L 43/08 20130101; H01L 43/10 20130101 |
Class at
Publication: |
257/425 |
International
Class: |
H01L 43/10 20060101
H01L043/10 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 21, 2012 |
JP |
2012-208293 |
Claims
1. A magnetoresistive element comprising: a first magnetic layer; a
second magnetic layer; and a first nonmagnetic layer provided
between the first magnetic layer and the second magnetic layer, the
first magnetic layer including a magnetic film of Mn.sub.xGe.sub.y
(77 atm %.ltoreq.x.ltoreq.82 atm %, 18 atm %.ltoreq.y.ltoreq.23 atm
%, x+y=100 atm %).
2. The element according to claim 1, wherein when at least one
element selected from the group consisting of Al, Si, B, C, P, Ti,
Zn, Mg, Ca, Cr, and Ga is expressed as X, the magnetic film of the
first magnetic layer contains (Mn.sub.xGe.sub.y).sub.100-zX.sub.z
(77 atm %.ltoreq.x.ltoreq.82 atm %, 18 atm %.ltoreq.y.ltoreq.23 atm
%, x+y=100 atm %, z.ltoreq.10 atm %).
3. The element according to claim 1, wherein at least one of the
first magnetic layer and the second magnetic layer has a single
crystal structure.
4. The element according to claim 1, wherein a third magnetic layer
is inserted between the first magnetic layer and the first
nonmagnetic layer or between the second magnetic layer and the
first nonmagnetic layer, or the third magnetic layer is inserted
between the first magnetic layer and the first nonmagnetic layer
and between the second magnetic layer and the first nonmagnetic
layer.
5. The element according to claim 4, wherein the third magnetic
layer contains at least one element selected from the group
consisting of Mn, Al, and Ge.
6. The element according to claim 4, wherein the third magnetic
layer contains at least one element selected from the group
consisting of Co, Fe, and Ni.
7. The element according to claim 1, wherein the first nonmagnetic
layer contains either an oxide containing at least one element
selected from the group consisting of Mg, Ca, Ba, Al, Be, Sr, Zn,
Ti, V, and Nb or an oxide containing at least one element selected
from the group consisting of Sr, Ce, Dy, La, K, Ca, Na, Pb, and Ba
and at least one element selected from the group consisting of Ti,
V, Cr, Mn, Fe, Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb.
8. The element according to claim 1, wherein the first magnetic
layer is formed on a base layer, the base layer being one layer
selected from the group consisting of: a layer of nitride having a
NaCl structure containing at least one element selected from the
group consisting of Ti, Zr, Nb, V, Hf, Ta, Mo, W, B, Al, and Ce; a
layer of oxide containing one element selected from the group
consisting of Sr, Ce, Dy, La, K, Ca, Na, Pb, and Ba, and at least
one element selected from the group consisting of Ti, V, Cr, Mn,
Fe, Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb; a layer of oxide
having a NaCl structure containing at least one element selected
from the group consisting of Mg, Al, and Ce; and a layer containing
at least one element selected from the group consisting of Al, Cr,
Fe, Co, Rh, Pd, Ag, Ir, Pt, and Au, and having a (001) oriented
tetragonal or cubic structure.
9. The element according to claim 1, wherein: each of the first and
the second magnetic layers has an easy magnetization axis in a
direction perpendicular to a film plane; when a write current is
caused to flow between the first magnetic layer and the second
magnetic layer via the first nonmagnetic layer, a direction of
magnetization of the first magnetic layer is changeable, and a
direction of magnetization of the second magnetic layer is fixed;
the magnetoresistive element further includes a fourth magnetic
layer located on a side of the second magnetic layer opposite from
the first nonmagnetic layer, and having an easy magnetization axis
in a direction perpendicular to the film plane, a direction of
magnetization of the fourth magnetic layer being antiparallel with
a direction of magnetization of the second magnetic layer; the
magnetoresistive element further includes a second nonmagnetic
layer located between the second magnetic layer and the fourth
magnetic layer; and the magnetoresistive element meets a
relationship represented by an expression
Ms.sub.2.times.t.sub.2<Ms.sub.4.times.t.sub.4, where a
saturation magnetization of the second magnetic layer is Ms.sub.2,
a thickness of the second magnetic layer is t.sub.2, a saturation
magnetization of the fourth magnetic layer is Ms.sub.4, and a
thickness of the fourth magnetic layer is t.sub.4.
10. A magnetic memory comprising: the magnetoresistive element
according to claim 1; a first wiring electrically connecting to the
first magnetic layer of the magnetoresistive element; and a second
wiring electrically connecting to the second magnetic layer of the
magnetoresistive element.
11. The memory according to claim 10, wherein when at least one
element selected from the group consisting of Al, Si, B, C, P, Ti,
Zn, Mg, Ca, Cr, and Ga is expressed as X, the magnetic film of the
first magnetic layer contains (Mn.sub.xGe.sub.y).sub.100-zX.sub.z
(77 atm %.ltoreq.x.ltoreq.82 atm %, 18 atm %.ltoreq.y.ltoreq.23 atm
%, x+y=100 atm %, z.ltoreq.10 atm %).
12. The memory according to claim 10, wherein at least one of the
first magnetic layer and the second magnetic layer has a single
crystal structure.
13. The memory according to claim 10, wherein a third magnetic
layer is inserted between the first magnetic layer and the first
nonmagnetic layer or between the second magnetic layer and the
first nonmagnetic layer, or the third magnetic layer is inserted
between the first magnetic layer and the first nonmagnetic layer
and between the second magnetic layer and the first nonmagnetic
layer.
14. The memory according to claim 13, wherein the third magnetic
layer contains at least one element selected from the group
consisting of Mn, Al, and Ge.
15. The memory according to claim 13, wherein the third magnetic
layer contains at least one element selected from the group
consisting of Co, Fe, and Ni.
16. The memory according to claim 10, wherein the first nonmagnetic
layer contains either an oxide containing at least one element
selected from the group consisting of Mg, Ca, Ba, Al, Be, Sr, Zn,
Ti, V, and Nb or an oxide containing at least one element selected
from the group consisting of Sr, Ce, Dy, La, K, Ca, Na, Pb, and Ba
and at least one element selected from the group consisting of Ti,
V, Cr, Mn, Fe, Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb.
17. The memory according to claim 10, wherein the first magnetic
layer is formed on a base layer, the base layer being one layer
selected from the group consisting of: a layer of nitride having a
NaCl structure containing at least one element selected from the
group consisting of Ti, Zr, Nb, V, Hf, Ta, Mo, W, B, Al, and Ce; a
layer of oxide containing one element selected from the group
consisting of Sr, Ce, Dy, La, K, Ca, Na, Pb, and Ba, and at least
one element selected from the group consisting of Ti, V, Cr, Mn,
Fe, Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb; a layer of oxide
having a NaCl structure containing at least one element selected
from the group consisting of Mg, Al, and Ce; and a layer containing
at least one element selected from the group consisting of Al, Cr,
Fe, Co, Rh, Pd, Ag, Ir, Pt, and Au, and having a (001) oriented
tetragonal or cubic structure.
18. The memory according to claim 10, wherein: each of the first
and the second magnetic layers has an easy magnetization axis in a
direction perpendicular to a film plane; when a write current is
caused to flow between the first magnetic layer and the second
magnetic layer via the first nonmagnetic layer, a direction of
magnetization of the first magnetic layer is changeable, and a
direction of magnetization of the second magnetic layer is fixed;
the magnetoresistive element further includes a fourth magnetic
layer located on a side of the second magnetic layer opposite from
the first nonmagnetic layer, and having an easy magnetization axis
in a direction perpendicular to the film plane, a direction of
magnetization of the fourth magnetic layer being antiparallel with
a direction of magnetization of the second magnetic layer; the
magnetoresistive element further includes a second nonmagnetic
layer located between the second magnetic layer and the fourth
magnetic layer; and the magnetoresistive element meets a
relationship represented by an expression
Ms.sub.2.times.t.sub.2<Ms.sub.4.times.t.sub.4, where a
saturation magnetization of the second magnetic layer is Ms.sub.2,
a thickness of the second magnetic layer is t.sub.2, a saturation
magnetization of the fourth magnetic layer is Ms.sub.4, and a
thickness of the fourth magnetic layer is t.sub.4.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims the benefit of
priority from the prior Japanese Patent Application No.
2012-208293, filed on Sep. 21, 2012, the entire contents of which
are incorporated herein by reference.
FIELD
[0002] Embodiments described herein relate generally to
magnetoresistive elements and magnetic memories.
BACKGROUND
[0003] A basic structure of a magnetic tunnel junction (MTJ)
element serving as a magnetoresistive element is a stacked
structure including a storage layer, the magnetization direction of
which is changeable, a reference layer, the magnetization direction
of which is fixed, and an insulating layer provided between the
storage layer and the reference layer. It is known that an MTJ
element shows a tunneling magnetoresistive (TMR) effect. Thus, an
MTJ element is used as a storage element of a memory cell in a
magnetic random access memory (MRAM).
[0004] An MRAM stores information ("1", "0") in accordance with a
change in relative angle between magnetizations of magnetic layers
included in an MTJ element, and is nonvolatile. Since the
magnetization switching speed of an MRAM is a few nanoseconds, it
is possible to write and read data at a high speed with an MRAM.
Accordingly, MRAMs are expected to be next-generation high-speed
nonvolatile memories. Furthermore, by using a method called "spin
transfer torque switching" for controlling magnetization by means
of a spin polarized current, a current density can be increased by
decreasing the cell size of an MRAM. Accordingly, it is possible to
easily switch the magnetization in a storage layer, resulting in
that it is possible to obtain an MRAM with a high density and a low
power consumption.
[0005] In improving the density of a nonvolatile memory, it is
essential to improve the degree of integration of a
magnetoresistive element. However, as the size of a
magnetoresistive element decreases, the thermal stability of a
ferromagnetic material for forming the magnetoresistive element
deteriorates. Therefore, a problem arises in that the magnetic
anisotropy energy and the thermal stability of the ferromagnetic
material should be improved.
[0006] In order to solve this problem, recently, it is attempted
that an MRAM using a perpendicular magnetization MTJ element, in
which the direction of the magnetization of a ferromagnetic
material is perpendicular to the film plane, be formed. In a
perpendicular magnetization MTJ element, generally a ferromagnetic
material with a high magnetic crystalline anisotropy is used.
[0007] Generally, a critical current for magnetization reversal by
the spin transfer torque switching method is dependent on the
saturation magnetization and the Gilbert damping constant of a
storage layer. Accordingly, in order to switch the magnetization of
a storage layer by means of low-current spin transfer torque
switching, it is necessary to reduce the saturation magnetization
and the Gilbert damping constant of the storage layer. Furthermore,
the influence of strayed magnetic field from a reference layer
becomes more remarkable as the element is miniaturized.
Accordingly, in order to improve the degree of integration of a
magnetoresistive element, it is also necessary to reduce the
saturation magnetization of the reference layer thereof with a high
magnetic anisotropy energy of the reference layer being
maintained.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 is a sectional view showing a magnetoresistive
element according to a first embodiment.
[0009] FIG. 1A is a sectional view showing a magnetoresistive
element according to a modification of the first embodiment.
[0010] FIG. 2 is a sectional view showing a magnetoresistive
element according to a second embodiment.
[0011] FIG. 2A is a sectional view showing a magnetoresistive
element according to a modification of the second embodiment.
[0012] FIG. 3 is a sectional view showing a magnetoresistive
element according to a third embodiment.
[0013] FIG. 3A is a sectional view showing a magnetoresistive
element according to a modification of the third embodiment.
[0014] FIG. 4 is a sectional view showing a magnetoresistive
element according to a fourth embodiment.
[0015] FIG. 5 is a sectional view showing a magnetoresistive
element according to a modification of the fourth embodiment.
[0016] FIG. 5A is a sectional view showing a magnetoresistive
element according to another modification of the fourth
embodiment.
[0017] FIGS. 6(a) and 6(b) are for explaining a method of
manufacturing an MTJ element including a magnetic film with a
single crystal structure.
[0018] FIGS. 7(a) to 7(c) are for explaining a method of
manufacturing an MTJ element including a magnetic film with a
single crystal structure.
[0019] FIGS. 8(a) to 8(c) show examples of x-ray diffraction on a
MnGe alloy.
[0020] FIG. 9 shows examples of magnetization curve of a MnGe
alloy.
[0021] FIGS. 10(a) and 10(b) show examples of the characteristics
that the saturation magnetization of a MnGe alloy is dependent on
the composition and the substrate temperature.
[0022] FIG. 11 shows examples of magnetization curve in the cases
where Al is slightly added to a MnGe alloy on a thermally oxidized
Si substrate.
[0023] FIGS. 12(a) and 12(b) show the band structure and the
density of states of a bulk MnGe alloy, which are obtained by
calculation.
[0024] FIG. 13 is a sectional view showing a memory cell of a
magnetic memory according to a fifth embodiment.
[0025] FIG. 14 is a circuit diagram of the main part of the
magnetic memory according to the fifth embodiment.
DETAILED DESCRIPTION
[0026] A magnetoresistive element according to an embodiment
includes a first magnetic layer, a second magnetic layer, and a
first nonmagnetic layer provided between the first magnetic layer
and the second magnetic layer, the first magnetic layer including a
magnetic film of Mn.sub.xGe.sub.y (77 atm %.ltoreq.x.ltoreq.82 atm
%, 18 atm %.ltoreq.y.ltoreq.23 atm %, x+y=100 atm %).
[0027] Hereinafter, embodiments will be explained with reference to
the accompanying drawings. In the following explanations, elements
having the same function and the same structure are denoted by the
same reference numeral, and a repeated explanation will be
performed only when it is necessary to do so.
First Embodiment
[0028] FIG. 1 shows a magnetoresistive element according to a first
embodiment. FIG. 1 is a sectional view of the magnetoresistive
element 1 of the first embodiment. The magnetoresistive element 1
of this embodiment is an MTJ element having such a structure that a
ferromagnetic layer 2, a nonmagnetic layer 4 (hereinafter also
referred to as "tunnel barrier layer 4"), and a ferromagnetic layer
8 are formed on a base layer 100 in this order. The base layer 100
is used to control the crystallinity such as crystal orientation,
crystal grain size, etc. of the ferromagnetic layer 2 and the
layers above the ferromagnetic layer 2, and the detailed
explanation thereof will be provided later. One of the
ferromagnetic layer 2 and the ferromagnetic layer 8 includes a
magnetic film of Mn.sub.xGe.sub.y (77 atm %.ltoreq.x.ltoreq.82 atm
%, 18 atm %.ltoreq.y.ltoreq.23 atm %, x+y=100 atm %).
[0029] The resistance value of the MTJ element is determined by the
angle between the directions of the magnetizations of the two
magnetic layers arranged with the tunnel barrier layer sandwiched
therebetween. It is possible to control the angle between the
directions of the magnetizations by means of an external magnetic
field or current caused to flow through the element. On such an
occasion, it is possible to control the angle between the
directions of the magnetizations more stably by differentiating the
magnitudes of coercive force, anisotropic magnetic field Hk and/or
Gilbert damping constant .alpha. of the two magnetic layers.
Herein, the magnetic layer with a higher coercive force, a higher
anisotropic magnetic field Hk or a higher Gilbert damping constant
.alpha. will be called "reference layer," and a magnetic layer with
a lower coercive force, a lower anisotropic magnetic field Hk or a
lower Gilbert damping constant .alpha. will be called "storage
layer." Generally, it is desirable that a magnetic layer with a
higher coercive force, a higher anisotropic magnetic field Hk or a
higher Gilbert damping constant .alpha. be used as a reference
layer, and a magnetic layer with a lower coercive force, a lower
anisotropic magnetic field Hk or a lower Gilbert damping constant
.alpha. be used as a storage layer. As will be described later,
since a magnetic layer of Mn.sub.xGe.sub.y (77 atm
%.ltoreq.x.ltoreq.82 atm %, 18 atm %.ltoreq.y.ltoreq.23 atm %,
x+y=100 atm %) has a high spin polarization, a high coercive force,
and a high anisotropic magnetic field, such a magnetic layer is
more suitable to be used as a reference layer.
[0030] In a MnGe alloy used for a ferromagnetic layer, the c-axis
is an easy magnetization axis. Accordingly, it is possible to
manufacture a perpendicular magnetization MTJ element by
controlling the orientation in crystallization so that the c-axis
is along the direction perpendicular to the film plane.
[0031] In the first embodiment, it is desirable that an oxide
insulator be used for the nonmagnetic layer 4. When an MTJ element
has a stacked structure in which for example, a ferromagnetic layer
of CoFe(B), a nonmagnetic layer of crystalline MgO, and a
ferromagnetic layer of MnGe are stacked in this order, an
orientation relationship of MnGe(001)/MgO(001)/CoFe(B)(001) can be
established. Here, MnGe(001) or MgO(001) means that the crystalline
orientation is such that the (001) surface is exposed on the top
surface of each material. In this manner, it is possible to improve
the wavenumber selectability of tunnel electrons, thereby obtaining
a higher MR ratio.
[0032] It is possible to make the easy magnetization directions of
the ferromagnetic layer 2 and the ferromagnetic layer 8
perpendicular to the film plane by controlling the direction of
crystalline orientation. That is to say, the magnetoresistive
element 1 according to this embodiment can be not only an in-plane
magnetization MTJ element but also a so-called "perpendicular
magnetization MTJ element," in which the directions of the
magnetizations of the ferromagnetic layer 2 and the ferromagnetic
layer 8 are perpendicular to the film planes, respectively.
Incidentally, in this specification, the "film plane" means a plane
perpendicular to the direction in which each ferromagnetic layer is
stacked. Furthermore, the "easy magnetization direction" means a
direction in a ferromagnetic material with a certain macro size,
and if a spontaneous magnetization is along this direction in a
state where there is no external magnetic field, the internal
energy becomes the lowest. In contrast, the "hard magnetization
direction" means a direction of a ferromagnetic material with a
certain macro size, and if a spontaneous magnetization is along
this direction in a state where there is no external magnetic
field, the internal energy becomes the highest.
[0033] In one of the ferromagnetic layer 2 and the ferromagnetic
layer 8, the magnetization direction does not change between before
and after a write operation, by which a write current flows through
the MTJ element 1, and in the other, the magnetization direction
changes. The ferromagnetic layer in which the magnetization
direction does not change will also be called a "reference layer,"
and the ferromagnetic layer in which the magnetization direction
changes will also be called a "storage layer." In this embodiment,
for example, the ferromagnetic layer 2 serves as a storage layer,
and the ferromagnetic layer 8 serves as a reference layer.
Incidentally, the write current is caused to flow between the
ferromagnetic layer 2 and the ferromagnetic layer 8 in a direction
perpendicular to the film plane. In a case where the ferromagnetic
layer 2 is a storage layer and the ferromagnetic layer 8 is a
reference layer, and the magnetization direction of the
ferromagnetic layer 2 and the magnetization direction of the
ferromagnetic layer 8 are antiparallel (reverse directions) to each
other, the write current is caused to flow from the ferromagnetic
layer 2 to the ferromagnetic layer 8. In this case, electrons flow
from the ferromagnetic layer 8 toward the ferromagnetic layer 2 via
the nonmagnetic layer 4. The electrons having been subjected to
spin polarization by passing through the ferromagnetic layer 8 then
flow into the ferromagnetic layer 2. The spin-polarized electrons
with the spin in the same direction as the direction of the
magnetization of the ferromagnetic layer 2 pass through the
ferromagnetic layer 2, but the spin-polarized electrons with the
spin in the direction opposite to the direction of the
magnetization of the ferromagnetic layer 2 exert spin torque on the
magnetization of the ferromagnetic layer 2 so that the direction of
the magnetization of the ferromagnetic layer 2 becomes the same as
the direction of the magnetization of the ferromagnetic layer 8. As
a result, the direction of the magnetization of the ferromagnetic
layer 2 is switched so as to be in parallel with (the same as) the
direction of the magnetization of the ferromagnetic layer 8.
[0034] In contrast, in a case where the direction of the
magnetization of the ferromagnetic layer 2 and the direction of the
magnetization of the ferromagnetic layer 8 are parallel with each
other, the write current is caused to flow from the ferromagnetic
layer 8 toward the ferromagnetic layer 2. In this case, electrons
flow from the ferromagnetic layer 2 toward the ferromagnetic layer
8 via the nonmagnetic layer 4. The electrons spin-polarized by
passing through the ferromagnetic layer 2 flow into the
ferromagnetic layer 8. Although the spin-polarized electrons with
the spin in the same direction as the magnetization of the
ferromagnetic layer 8 pass through the ferromagnetic layer 8, the
spin-polarized electrons with the spin in the direction opposite to
the magnetization of the ferromagnetic layer 8 are reflected at the
interface between the nonmagnetic layer 4 and the ferromagnetic
layer 8, and pass through the nonmagnetic layer 4 to flow into the
ferromagnetic layer 2. As a result, the spin torque is exerted on
the magnetization of the ferromagnetic layer 2, and the direction
of the magnetization of the ferromagnetic layer 2 is caused to be
opposite to the direction of the magnetization of the ferromagnetic
layer 8. Accordingly, the direction of the magnetization of the
ferromagnetic layer 2 is switched to be antiparallel to the
direction of the magnetization of the ferromagnetic layer 8.
[0035] The first embodiment has a structure in which the
ferromagnetic layer 2, the nonmagnetic layer 4, and the
ferromagnetic layer 8 are stacked on the base layer 100 in this
order. However, the order can be reversed on the base layer 100, as
in a magnetoresistive element according to a modification of the
first embodiment shown in FIG. 1A. That is to say, the
ferromagnetic layer 8, the nonmagnetic layer 4, and the
ferromagnetic layer 2 can be stacked on the base layer 100 in this
order.
Second Embodiment
[0036] FIG. 2 shows a magnetoresistive element 1A according to a
second embodiment. The magnetoresistive element 1A has a structure
obtained by providing an interface magnetic layer 6 between the
nonmagnetic layer 4 and the ferromagnetic layer 8 in the
magnetoresistive element 1 of the first embodiment shown in FIG. 1.
At least one of the ferromagnetic layer 2, the ferromagnetic layer
8, and the interface magnetic layer 6 includes a magnetic film of
Mn.sub.xGe.sub.y (77 atm %.ltoreq.x.ltoreq.82 atm %, 18 atm
%.ltoreq.y.ltoreq.23 atm %, x+y=100 atm %).
[0037] Like the first embodiment, by controlling the crystalline
orientation, the ferromagnetic layer 2 and the ferromagnetic layer
8 are caused to have magnetic anisotropy energy perpendicular to
the film plane, by which it is possible to make the directions of
the easy magnetizations thereof perpendicular to the film plane.
That is to say, the magnetoresistive element 1A of this embodiment
can be not only an in-plane magnetization MTJ element but also a
so-called "perpendicular magnetization MTJ element," in which the
directions of the magnetizations of the ferromagnetic layer 2 and
the ferromagnetic layer 8 are perpendicular to the film planes,
respectively. In one of the ferromagnetic layer 2 and the
ferromagnetic layer 8, the magnetization direction does not change
between before and after a write operation, by which a write
current flows through the MTJ element 1, and in the other, the
magnetization direction changes. In this embodiment, for example,
the ferromagnetic layer 2 serves as a storage layer, and the
ferromagnetic layer 8 serves as a reference layer. Like the first
embodiment, the write current is caused to flow between the
ferromagnetic layer 2 and the ferromagnetic layer 8 in a direction
perpendicular to the film plane. Incidentally, the interface
magnetic layer 6 is provided to increase the spin polarization.
[0038] In the second embodiment, for example, when the interface
magnetic layer 6 of MnGe is formed on the nonmagnetic layer 4 of
crystalline MgO, it is possible to perform epitaxial growth of the
ferromagnetic layer 8 containing Mn and one or more elements
selected from Al, Ge, and Ga on the interface magnetic layer 6. For
example, in a case where an alloy containing Mn and Ga is selected
to form the ferromagnetic layer 8, it is possible to have an
epitaxial relationship of MnGa(001)/MnGe(001)/MgO(001). In this
manner, it is possible to improve the wavenumber selectability of
tunnel electrons, thereby obtaining a high MR ratio and at the same
time obtaining a reference layer with a low-saturation
magnetization.
[0039] Furthermore, although the ferromagnetic layer 2, the
nonmagnetic layer 4, the interface magnetic layer 6, and the
ferromagnetic layer 8 are stacked on the base layer 100 in this
order in the second embodiment, the order can be reversed on the
base layer 100, as in a magnetoresistive element according to a
modification of the second embodiment shown in FIG. 2A. That is to
say, the ferromagnetic layer 8, the interface magnetic layer 6, the
nonmagnetic layer 4, and the ferromagnetic layer 2 can be stacked
on the base layer 100 in this order.
Third Embodiment
[0040] FIG. 3 shows a magnetoresistive element 1B according to a
third embodiment. The magnetoresistive element 1B is obtained by
inserting an interface magnetic layer 3 between the ferromagnetic
layer 2 and the nonmagnetic layer 4 and inserting an interface
magnetic layer 6 between the nonmagnetic layer 4 and the
ferromagnetic layer 8 in the magnetoresistive element 1 according
to the first embodiment shown in FIG. 1. At least one of the
interface magnetic layer 3 and the interface magnetic layer 6
includes a magnetic film of Mn.sub.xGe.sub.y (77 atm
%.ltoreq.x.ltoreq.82 atm %, 18 atm %.ltoreq.y.ltoreq.23 atm %,
x+y=100 atm %). The details of the properties of the interface
magnetic layer 3 and the interface magnetic layer 6 will be
described later.
[0041] The magnetoresistive element 1B of the third embodiment,
like the magnetoresistive elements of the first and the second
embodiments, can be not only an in-plane magnetization MTJ element
but also a perpendicular magnetization MTJ element. Furthermore,
like the magnetoresistive elements of the first and the second
embodiments, the interface magnetic layer 3 and the interface
magnetic layer 6 of the third embodiment are provided to increase
the spin polarization.
[0042] Although the ferromagnetic layer 2, the interface magnetic
layer 3, the nonmagnetic layer 4, the interface magnetic layer 6,
and the ferromagnetic layer 8 are stacked on the base layer 100 in
this order in the third embodiment, the order can be reversed on
the base layer 100, as in a magnetoresistive element according to a
modification of the third embodiment shown in FIG. 3A. That is to
say, the ferromagnetic layer 8, the interface magnetic layer 6, the
nonmagnetic layer 4, the interface magnetic layer 3, and the
ferromagnetic layer 2 can be stacked on the base layer 100 in this
order.
Fourth Embodiment
[0043] FIG. 4 shows a magnetoresistive element 1C according to a
fourth embodiment. The magnetoresistive element 1C is obtained by
stacking a nonmagnetic layer 10 and a ferromagnetic layer 11 on the
ferromagnetic layer 8 in the magnetoresistive element 1B according
to the third embodiment shown in FIG. 3. Incidentally, in this
embodiment, for example, the interface magnetic layer 6 and the
ferromagnetic layer 8 serve as a reference layer. The ferromagnetic
layer 11 is also called a "bias layer," and has a magnetization
that is anti-parallel (opposite direction) with the magnetization
of the ferromagnetic layer 8. The ferromagnetic layer 11 can be
coupled with the ferromagnetic layer 8 via the nonmagnetic layer 10
by synthetic-antiferromagnetic coupling. In this manner, it is
possible to reduce and adjust the shift of the switching current of
the storage layer formed of the interface magnetic layer 3 and the
ferromagnetic layer 2 caused by the strayed magnetic field from the
reference layer formed of the interface magnetic layer 6 and the
ferromagnetic layer 8. It is desirable that the nonmagnetic layer
10 should have a heat resistance so that the ferromagnetic layer 8
and the ferromagnetic layer 11 are not mixed with each other in a
heating process, and have a function of controlling crystalline
orientation when the ferromagnetic layer 11 is formed.
[0044] When the thickness of the nonmagnetic layer 10 is increased,
the distance between the ferromagnetic layer 11 and the storage
layer (in this embodiment, the ferromagnetic layer 2, for example)
is increased. Accordingly, the shift adjustment magnetic field
applied from the ferromagnetic layer 11 to the storage layer is
decreased. Therefore, it is desirable that the thickness of the
nonmagnetic layer 10 be 5 nm or less. The ferromagnetic layer 11 is
formed of a ferromagnetic material with an easy magnetization axis
in a direction perpendicular to the film plane. Since the
ferromagnetic layer 11 is more distant from the storage layer than
the reference layer, in order to adjust the strayed magnetic field
to be applied to the storage layer by means of the ferromagnetic
layer 11, it is necessary to set the thickness or the magnitude of
the saturation magnetization Ms of the ferromagnetic layer 11 to be
greater than the thickness or the magnitude of the saturation
magnetization Ms of the reference layer. That is to say, as a
result of the study by the inventors of the present invention, it
is necessary to meet the following relational expression wherein
the thickness and the saturation magnetization of the reference
layer are t.sub.2 and Ms.sub.2, respectively, and the thickness and
the saturation magnetization of the ferromagnetic layer 11 are
t.sub.3 and Ms.sub.3, respectively.
Ms.sub.2.times.t.sub.2<Ms.sub.3.times.t.sub.3
[0045] Incidentally, the ferromagnetic layer 11 of the fourth
embodiment can be applied to the magnetoresistive elements of the
first and the second embodiments. In this case, the ferromagnetic
layer 11 is formed above the ferromagnetic layer serving as the
reference layer with the nonmagnetic layer 10 being sandwiched
therebetween.
[0046] Although the fourth embodiment has a top bias structure, in
which the ferromagnetic layer 2, the interface magnetic layer 3,
the nonmagnetic layer 4, the interface magnetic layer 6, the
ferromagnetic layer 8, the nonmagnetic layer 10, and the
ferromagnetic layer 11 are stacked on the base layer 100 in this
order, the ferromagnetic layer 11 can be stacked below the base
layer 100. That is to say, like a magnetoresistive element 1D
according to a modification of the fourth embodiment shown in FIG.
5, a bottom bias structure can be employed, in which the base layer
100, the ferromagnetic layer 2, the interface magnetic layer 3, the
nonmagnetic layer 4, the interface magnetic layer 6, and the
ferromagnetic layer 8 are stacked in this order on the
ferromagnetic layer 11. In this case, it is preferable that the
ferromagnetic layer 2 be used as a reference layer. Furthermore,
the staking order can be reversed as in a magnetoresistive element
according to another modification of the fourth embodiment shown in
FIG. 5A. That is to say, the base layer 100, the ferromagnetic
layer 11, the nonmagnetic layer 10, the ferromagnetic layer 8, the
interface magnetic layer 6, the nonmagnetic layer 4, the interface
magnetic layer 3, and the ferromagnetic layer 2 can be stacked in
this order.
(MTJ Element Including Magnetic Film with Single Crystal
Structure)
[0047] Next, a method of manufacturing an MTJ element including a
magnetic film with a single crystal structure (hereinafter also
referred to as "single crystal MTJ element") will be explained. It
is desirable that in a magnetoresistive element (MTJ element)
according to any of the first to the fourth embodiments, at least
one of the ferromagnetic layer 2, the ferromagnetic layer 8, the
interface magnetic layer 3, and the interface magnetic layer 6
should be with a single crystal structure. The reason for this is
that it is possible to suppress the dispersion of magnetic
characteristics considerably by forming a magnetic film with a
single crystal structure, in which the crystalline orientations in
the in-plane directions of the film are aligned along one
direction, thereby enhancing the magnetic coupling in the film.
Furthermore, since the formation of grain boundary is curbed, it is
possible to form a magnetic film or insulating layer, which is
flattened in the atomic level, and which has good crystallinity.
Accordingly, it can be expected that a magnetoresistive ratio (MR
ratio) that is higher than the MR ratios of conventional MTJ
elements can be obtained.
[0048] Therefore, in order to achieve a large capacity MRAM of a
few tens Gbits, it is necessary to manufacture a single crystal MTJ
element.
[0049] However, generally, the wiring of a circuit includes a
polycrystalline or amorphous structure, and thus it is not possible
to grow a single crystal film thereon. Accordingly, it is difficult
to grow a single crystal MTJ on a substrate on which transistors
are implemented.
[0050] However, it is possible to form an MRAM including a single
crystal MTJ element by preparing a substrate with a single crystal
structure on which an MTJ element with a single crystal structure
is formed and a substrate on which a transistor is formed, bonding
the MTJ element formed on the single crystal substrate and the
substrate on which the transistor is formed, and removing the
single crystal substrate, which is unnecessary. This will be
explained with reference to FIG. 6(a) to FIG. 7(c).
[0051] Specifically, first, an MTJ element according to any of the
first to the fourth embodiments is formed on a Si single crystal
substrate under appropriate film growth conditions. For example, as
shown in FIG. 6(a), a base layer 100, a ferromagnetic layer 2, a
nonmagnetic layer 4, and a ferromagnetic layer 8 are formed on a Si
single crystal substrate 200 in this order by a sputtering method
or MBE (Molecular Beam Epitaxy) method, thereby obtaining an MTJ
element 1 of the first embodiment. At this time, the crystallinity
of the Si single crystal substrate 200 is conveyed to the base
layer 100, the ferromagnetic layer 2, the nonmagnetic layer 4, and
the ferromagnetic layer 8, resulting in that the MTJ element 1
formed is a single crystal MTJ element 1. Thereafter, a metal
bonding layer 20a is formed on the ferromagnetic layer 8 (FIG.
6(a)). Similarly, a substrate 220, on which a transistor circuit
and wiring are formed, is prepared, and a metal bonding layer 20b
is formed on the substrate 220 (FIG. 6(a)). The materials for
forming the metal bonding layers 20a, 20b can be Al, Au, Cu, Ti,
Ta, etc.
[0052] Next, the substrate 200, on which the single crystal MTJ
element 1 is formed, and the substrate 220, on which the transistor
circuit is formed, are positioned so that the metal bonding layers
20a, 20b are opposed to each other. For example, as shown in FIG.
6(a), the metal bonding layers 20a, 20b are opposed to each other.
Thereafter, as shown in FIG. 6(b), the metal bonding layers 20a,
20b are contacted to each other. At this time, the metal bonding
layers 20a, 20b can be bonded to each other by applying a pressure.
When a pressure is applied, the metal bonding layers 20a, 20b can
be heated in order to improve the bonding force.
[0053] Next, as shown in FIG. 7(a), the single crystal substrate
200, on which the single crystal MTJ element 1 is formed, is
removed. The removal is performed in such a manner that first the
substrate 200 is thinned by a BSG (Back Side Grinding) method, and
then the thinned single crystal substrate 200 is mechanically
polished by a CMP (Chemical Mechanical Polishing) method or the
like as shown in FIG. 7(b). In this manner, the manufacturing of
the MTJ element 1 is completed (FIG. 7(c)).
[0054] As explained above, a single crystal MTJ element according
to any of the first to the fourth embodiments can be formed above
the substrate by a manufacturing method including a series of the
processes of preparing the single crystal substrate 200 on which a
single crystal MTJ element according to any of the first to the
fourth embodiments is formed and the substrate 220 on which a
transistor circuit is formed, bonding the substrate on which
transistors etc. are formed onto the single crystal MTJ element 1,
and then removing the single crystal substrate 200 that is
unnecessary.
[0055] Next, the specific composition of each layer included in the
MTJ elements 1, 1A, 1B, 1C and 1D of the first to the fourth
embodiments will be explained in the order of the ferromagnetic
layer 2, the ferromagnetic layer 8, the base layer 100, the
nonmagnetic layer 4, the interface magnetic layer 3, and the
interface magnetic layer 6.
(Ferromagnetic Layer 2)
[0056] The ferromagnetic layer 2 is a perpendicular magnetization
film. In order to achieve both a high thermal stability and a
low-current magnetization switching, it is desirable that the
material of the ferromagnetic layer 2 be with a low saturation
magnetization Ms, a high magnetic anisotropy energy Ku that is high
enough to maintain a thermal stability factor .DELTA., and a
coercive force, an anisotropic magnetic field and a Gilbert damping
constant that are lower than those of the material used for the
ferromagnetic layer 8. Furthermore, it is desirable that the
material show a high spin polarization. The following is the
specific explanation thereof.
[0057] A first example of the ferromagnetic layer 2 is formed of a
MnGe alloy. Mn.sub.xGe.sub.y has a characteristic of a
perpendicular magnetization film when the composition ratio x of Mn
is in the range of 77 atm %.ltoreq.x.ltoreq.82 atm %, and the
composition ratio y of Ge is in the range of 18 atm
%.ltoreq.y.ltoreq.23 atm % (x+y=100 atom %). The magnetization of a
MnGe alloy is oriented along a specific crystal orientation. By
changing the forming conditions, it is possible to form a MnGe
alloy with a coercive force, an anisotropic field and a Gilbert
damping constant that are lower than those of a material used to
form the ferromagnetic layer 8.
[0058] A second example of the ferromagnetic layer 2 is formed of,
for example, an alloy containing one element selected from the
group consisting of Mn, Fe, Co, and Ni, and two elements selected
from the group consisting of Zn, Al, Ga, In, Si, Ge, Sn, As, Sb,
and Bi. Specific examples are MnAlGe, MnGaGe, MnZnSb, and so
on.
[0059] In order to cause the aforementioned materials to have
perpendicular magnetic anisotropy, it is required that the c-axis
be grown perpendicular to the film plane, i.e., grown to be (001)
oriented. Specifically, by appropriately selecting the base layer
100, it is possible to control the crystal orientation in the
growth of the ferromagnetic layer 2. The details of the base layer
100 will be described later.
[0060] A third example of the ferromagnetic layer 2 is formed of an
alloy containing at least one metal selected from the group
consisting of Fe and Co. Incidentally, in order to control the
saturation magnetization of the ferromagnetic layer 2, at least one
element selected from the group consisting of Ni, B, C, P, Ta, Ti,
Mo, Si, W, Nb, Mn, and Ge may be added thereto. That is, the
ferromagnetic layer 2 can be formed of an alloy containing at least
one element selected from the group consisting of Fe and Co, and at
least one element selected from the group consisting of Ni, B, C,
P, Ta, Ti, Mo, Si, W, Nb, Mn, and Ge. For example, CoFeSi, CoFeP,
CoFeW, CoFeNb, etc. may be used besides CoFeB.
(Ferromagnetic Layer 8)
[0061] It is preferable that the ferromagnetic layer 8 have an easy
magnetization axis in a direction perpendicular to the film plane,
a low saturation magnetization Ms, a high magnetic anisotropy
energy Ku that is high enough to maintain a thermal stability
factor .DELTA., and a coercive force, an anisotropic magnetic field
and a Gilbert damping constant that are higher than those of the
material used for the ferromagnetic layer 2. Furthermore, it is
desirable that the material show a high spin polarization. A MnGe
alloy magnetic material containing Mn and Ge is one of the material
that meet such requirements. The following is the specific
explanation thereof.
[0062] A specific example of the ferromagnetic layer 8 is formed of
a MnGe alloy. The characteristics of Mn.sub.xGe.sub.y as a
perpendicular magnetization film appear when the composition ratio
x of Mn is in the range of 77 atm %.ltoreq.x.ltoreq.82 atm %, and
the composition ratio y of Ge is in the range of 18 atm
%.ltoreq.y.ltoreq.23 atm % (x+y=100 atm %).
[0063] The magnetization of a MnGe alloy with a high crystal
magnetic anisotropy is oriented along a specific crystal
orientation. By changing the composition ratios and the
crystallinity of the constituent elements, it is possible to
control the degree of crystal magnetic anisotropy. Accordingly, it
is possible to control the direction of magnetization by changing
the direction of crystal growth. Furthermore, since a MnGe alloy
itself has a high crystal magnetic anisotropy, it is possible to
adjust the aspect ratio of the device with it. Moreover, since a
MnGe alloy has a high thermal stability, it is suitable to be
integrated.
[0064] As examples, FIGS. 8(a), 8(b) and 8(c) show the results of
x-ray diffraction of MnGe (with the composition ratios of Mn being
79 atm %, and Ge being 21 atm %) formed on MgO (001), and FIG. 9
shows magnetization curves. The composition ratios given here are
calculated by an analysis by ICP (Inductively Coupled Plasma). It
is confirmed that by forming a MnGe film by heat treatment on MgO,
the orientation of which is controlled, it is possible to form the
MnGe film that is highly (001)-oriented (see FIGS. 8(a), 8(b) and
8(c)). Furthermore, it is confirmed that the characteristics
required for a reference layer have been met since the saturation
magnetization Ms of MnGe thus obtained is as low as 97 emu/cc, and
the effective perpendicular magnetic anisotropy energy Ku thereof
is as high as 3.2.times.10.sup.6 erg/cc (see FIG. 9). The graph
g.sub.1 of FIG. 9 shows the magnetization curve in the case where a
magnetic field is applied in a direction parallel to the film plane
of the MnGe film, and the graph g.sub.2 shows the magnetization
curve in the case where a magnetic field is applied in a direction
perpendicular to the film plane of the MnGe film.
[0065] The effect of a strayed magnetic field from a reference
layer becomes more remarkable as an MTJ element is miniaturized. As
a method of solving this problem, the introduction of a bias layer
is effective. A detailed explanation of a bias layer will be
provided later. According to a prestudy by calculation, assuming
that the shape of an MTJ element is cylindrical (pillar shape),
when the thickness of a reference layer is 6 nm, the allowable size
(diameter size) in the miniaturization process of an MTJ element is
about 38 nm when the saturation magnetization Ms of the reference
layer is 1000 emu/cc, about 28 nm when Ms is 750 emu/cc, and about
20 nm when Ms is 500 emu/cc.
[0066] From the above, it is desirable that in order to highly
integrate an MTJ element having a diameter of 15 nm or less, a low
Ms material of 200 emu/cc or less be used for a reference layer. In
order to achieve this, Mn.sub.xGe.sub.y can be used for a reference
layer. From FIG. 9, the saturation magnetization Ms of an MnGe
alloy is as low as 97 emu/cc. Thus, it is more preferable that an
MnGe alloy be used as a low Ms reference layer.
[0067] As the element size is decreased, the thermal stability of a
ferromagnetic material constituting a magnetoresistive element
deteriorates. As an option for solving this problem, the
perpendicular magnetic anisotropy energy Ku can be improved. The
effective perpendicular magnetic anisotropy energy Ku of a MnGe
alloy obtained by a calculation using the values of saturation
magnetization and anisotropic magnetic field obtained from FIG. 9
is as high as 3.2.times.10.sup.6 erg/cc. Thus, it is possible to
use this alloy to form a reference layer that is superior in
thermal stability.
[0068] From the foregoing viewpoints, it could be understood that a
magnetic film formed of an MnGe alloy is a perpendicular magnetic
film with a low saturation magnetization and a high perpendicular
magnetic anisotropy energy, and is especially suitable to form a
reference layer. FIG. 10(a) shows the dependency of saturation
magnetization of a MnGe alloy on the composition ratio, and FIG.
10(b) shows the dependency thereof on the substrate temperature. It
could be confirmed from FIGS. 10(a) and 10(b) that it is possible
to control the saturation magnetization by selecting optimum
composition ratio and substrate temperature.
[0069] In order to cause the perpendicular magnetic anisotropy
energy to appear, the c-axis should be (001)-oriented, i.e., in the
direction perpendicular to the film plane. Specifically, by
appropriately selecting the tunnel barrier layer and the interface
magnetic layer, the (001) orientation growth can be achieved.
[0070] An example of the material of the ferromagnetic layer 8 is
an alloy containing Mn.sub.xGe.sub.y (77 atm %.ltoreq.x.ltoreq.82
atm %, 18 atm %.ltoreq.y.ltoreq.23 atm %, x+y=100 atm %) and 10 atm
% or less of at least one element selected from the group
consisting of Al, Si, B, C, P, Ti, Zn, Mg, Ca, Cr, and Ga. That is,
if the aforementioned element is expressed as "X," the alloy can be
expressed as (Mn.sub.xGe.sub.y).sub.100-zX.sub.z (77 atm
%.ltoreq.x.ltoreq.82 atm %, 18 atm %.ltoreq.y.ltoreq.23 atm %,
x+y=100 atm %, z.ltoreq.10 atm %). FIG. 11 shows examples of the
magnetization curve of a thin film obtained by adding 5 atm % of Al
to MnGe formed on a thermally oxidized Si substrate. The graph
g.sub.1 of FIG. 11 shows the magnetization curve in the case where
a magnetic field is applied in a direction parallel to the film
plane of this ferromagnetic layer, and the graph g.sub.2 shows the
magnetization curve in the case where a magnetic field is applied
in a direction perpendicular to the film plane of the ferromagnetic
layer. It could be confirmed from FIG. 11 that MnGe with a slight
amount of Al being added thereto is not easily affected by the base
layer, and has a characteristic of a perpendicular magnetization
film. Furthermore, it could be confirmed that the addition of a
slight amount of a light element represented by Al, which has a low
melting point and a high diffusing property, would effectively
contribute to a further lowering of magnetization of perpendicular
magnetic film.
[0071] In the case where the magnetoresistive element has an
interface magnetic layer 6 as in the second to the fourth
embodiments, the interface magnetic layer 6 being formed of
Mn.sub.xGe.sub.y (77 atm %.ltoreq.x.ltoreq.82 atm %, 18 atm
%.ltoreq.y.ltoreq.23 atm %, x+y=100 atm %), the following materials
can be used to form the ferromagnetic layer 8. As a material of the
ferromagnetic layer 8, for example, a metal that has the (111)
crystalline orientation of a face-centered cubic (FCC) structure or
has the (0001) crystalline orientation of a hexagonal close-packed
(HCP) structure, or a metal that can form an artificial lattice, or
an alloy containing Mn and at least one element selected from the
group consisting of Al, Ge, and Ga can be used. An example of a
metal that has the (111) crystalline orientation of a FCC structure
or the (0001) crystalline orientation of a HCP structure is an
alloy containing at least one element selected from the first group
consisting of Fe, Co, Ni, and Cu and at least one element selected
from the second group consisting of Pt, Pd, Rh, and Au.
Specifically, ferromagnetic alloys such as CoPd, CoPt, NiCo, NiPt,
and the like can be used. Specific examples of alloy containing Mn
and at least one element selected from the group consisting of Al,
Ge, and Ga are ferromagnetic alloys such as MnGa, MnAlGe, and
MnGaGe.
[0072] The artificial lattice to be used for the ferromagnetic
layer 8 has a structure in which layers each containing one or more
elements selected from the group consisting of Fe, Co, and Ni or an
alloy containing the one or more elements (ferromagnetic films) and
layers each containing one element selected from the group
consisting of Cr, Pt, Pd, Ir, Rh, Ru, Os, Re, Au, and Cu or an
alloy containing the one element (nonmagnetic films) are
alternately stacked. For example, Co/Pt artificial lattice, Co/Pd
artificial lattice, CoCr/Pt artificial lattice, Co/Ru artificial
lattice, Co/Os artificial lattice, Co/Au artificial lattice, Ni/Cu
artificial lattice, and the like can be used. It is possible to
adjust the magnetic anisotropy energy density and the saturation
magnetization of such artificial lattices by adding an element to
the ferromagnetic film, or by adjusting the ratio of thicknesses
between the ferromagnetic film and the nonmagnetic film.
[0073] Furthermore, the material of the ferromagnetic layer 8 can
be an alloy containing at least one element selected from the group
consisting of transition metals Fe, Co, and Ni, and at least one
element selected from the group consisting of rare earth metals Tb,
Dy, and Gd. Examples are TbFe, TbCo, TbFeCo, DyTbFeCo, GdTbCo and
the like. Furthermore, a multi-layer structure in which these
alloys are alternately stacked can be employed. Specific examples
are multi-layer films of TbFe/Co, TbCo/Fe, TbFeCo/CoFe, DyFe/Co,
DyCo/Fe, DyFeCo/CoFe, and the like. It is possible to adjust the
magnetic anisotropy energy density and the saturation magnetization
of these alloys by adjusting the thickness ratio or
composition.
[0074] Moreover, a material used to form the ferromagnetic layer 8
can be an alloy containing one or more elements selected from the
first group consisting of Fe, Co, Ni, and Cu and one or more
elements selected from the second group consisting of Pt, Pd, Rh,
and Au. Specific examples are ferromagnetic alloys of FeRh, FePt,
FePd, CoPt, and the like.
(Base Layer 100)
[0075] The base layer 100 is used to control the crystallinity such
as crystalline orientation, grain size, etc. of the ferromagnetic
layer 2 and the layers above the ferromagnetic layer 2.
Accordingly, the selection of the material of the base layer 100 is
important. Hereinafter, the material and the structure of the base
layer 100 will be explained. Incidentally, although both conductive
and insulating materials can be used to form a base layer, if a
current should flow through the base layer, it is preferable that a
conductive material be used.
[0076] A first example of the base layer 100 is a layer of nitride
having a (001) oriented NaCl structure and containing at least one
element selected from the group consisting of Ti, Zr, Nb, V, Hf,
Ta, Mo, W, B, Al, and Ce.
[0077] A second example of the base layer 100 is a (002) oriented
perovskite conductive oxide layer of ABO.sub.3. The A-site contains
at least one element selected from the group consisting of Sr, Ce,
Dy, La, K, Ca, Na, Pb, and Ba, and the B-site contains at least one
element selected from the group consisting of Ti, V, Cr, Mn, Fe,
Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb.
[0078] A third example of the base layer 100 is a layer of oxide
having a (001) oriented NaCl structure and containing at least one
element selected from the group consisting of Mg, Al, and Ce.
[0079] A fourth example of the base layer 100 is a layer having a
(001) oriented tetragonal or cubic structure and containing at
least one element selected from the group consisting of Al, Cr, Fe,
Co, Rh, Pd, Ag, Ir, Pt, Au, Mo, and W.
[0080] A fifth example of the base layer 100 is a layer having a
stacked structure with a combination of two or more of the layers
of the above first to fourth examples. Thus, by devising the
structure of the base layer as mentioned above, it is possible to
control the crystallinity of the ferromagnetic layer 2 and the
layers above the ferromagnetic layer 2, thereby improving the
magnetic characteristics.
(Nonmagnetic Layer 4)
[0081] The nonmagnetic layer 4 can have a conductive or insulating
property. However, it is preferable that a tunnel barrier layer of
an insulating material be used. With respect to the nonmagnetic
layer 4, it is possible to achieve a selective tunnel conduction
and a high MR ratio by appropriately combining the nonmagnetic
layer 4 with the adjacent ferromagnetic layer or interface magnetic
layer. Accordingly, the selection of the material of the
nonmagnetic layer 4 is important. Hereinafter, the material for
forming the nonmagnetic layer 4 will be explained.
[0082] As a material of a tunnel barrier layer, an oxide containing
at least one element selected from the group consisting of Mg, Ca,
Ba, Al, Be, Sr, Zn, Ti, V, and Nb can be considered. Specific
examples are MgO, AlO, ZnO, SrO, BaO, TiO, and the like. In
particular, an oxide with a crystal structure of NaCl structure is
preferable. Specific examples thereof are MgO, CaO, SrO, BaO, TiO,
VO, NbO, and the like. If crystal growth of such an oxide with NaCl
structure is performed on a (001) surface of any of Fe, Co, and Ni,
or an alloy containing two or more of these elements as main
ingredients, or any of metals having a body-centered tetragonal
structure with preferred orientation of (001), or an alloy
containing two or more of such metals as main ingredients, or a
MnGe alloy, the crystal growth can be performed easily with the
(001) surface being a preferred orientation surface. In particular,
it is possible to achieve preferred orientation of (001) surface if
crystal growth is performed on a CoFe--X amorphous alloy, which
includes a very small amount of B, C, N, Ti, Ta, P, Mo, Si, W, Nb,
and the like to improve the amorphous property. Here, X indicates
an added element such as B, C, N, and the like.
[0083] The tunnel barrier layer can be of a mixed crystal
containing two or more materials selected from the aforementioned
group of oxides, or have a stacked structure with layers of such
oxides. Examples of such a mixed crystal are MgAlO, MgZnO, MgTiO,
MgCaO, and the like. Examples of the materials of a two-layer
stacked structure are MgO/ZnO, MgO/AlO, TiO/AlO, MgAlO/MgO, and the
like. Examples of the materials of a three-layer stacked structure
are AlO/MgO/AlO, ZnO/MgO/ZnO, MgAlO/MgO/MgAlO, and the like.
[0084] A second example of the tunnel barrier layer is a (002)
oriented perovskite oxide of ABO.sub.3. Here, the A-site contains
at least one element selected from the group consisting of Sr, Ce,
Dy, La, K, Ca, Na, Pb, and Ba, and the B-site contains at least one
element selected from the group consisting of Ti, V, Cr, Mn, Fe,
Co, Ni, Ga, Nb, Mo, Ru, Ir, Ta, Ce, and Pb. The specific examples
are SrTiO.sub.3, SrRuO.sub.3, SrNbO.sub.3, BaTiO.sub.3,
PbTiO.sub.3, and the like. The lattice constant of the [100] plane
of each of these oxides is about 3.7 .ANG.-4.0 .ANG., which is
close to the lattice constant of about 3.8 .ANG. of the [100] plane
of a MnGe alloy. Accordingly, these oxides are suitable for forming
an interface with good quality to obtain a higher MR ratio.
[0085] A third example of the tunnel barrier layer is a spinel
oxide of MgAlO. The lattice constant of MgAl.sub.2O.sub.4 having
the spinet structure is about 4.05 .ANG., the lattice mismatch of
which relative to the lattice constant of the [100] plane of a MnGe
alloy, which is about 3.8 .ANG., is as small as 6.6%. Accordingly,
this material is suitable for forming an interface with good
quality to obtain a higher MR ratio.
[0086] The tunnel barrier layer can be formed of either a
crystalline or amorphous material. However, if the tunnel barrier
layer is formed of a crystalline material, the scattering of
electrons in a tunnel barrier is curbed, resulting in that the
probability would increase that the electrons would be selectively
conducted by tunneling from the ferromagnetic layer with the
wavenumber thereof being maintained. Accordingly, it is possible to
increase the MR ratio. Therefore, in order to obtain a higher MR
ratio, a crystalline tunnel barrier is preferable.
[0087] For example, when an MTJ element has a stacked structure
including a ferromagnetic layer of CoFe(B), a nonmagnetic layer of
crystalline MgO, and a ferromagnetic layer of MnGe, which layers
are stacked in this order, an orientation relationship of
MnGe(001)/MgO(001)/CoFe(B)(001) can be established. As a result, it
is possible to improve the wavenumber selectivity of tunnel
electrons, and to obtain a higher MR ratio. However, the lattice
mismatch obtained from the bulk lattice constants of MnGe and MgO
in the in-plane direction is as high as about 11.0%. The lattice
mismatch is defined by the following expression:
(a(MgO)-a(MnGe))/a(MnGe).times.100
[0088] where a(MgO) and a(MnGe) are the lattice constants of MgO
and MnGe in the in-plane direction of the film, respectively. If a
lattice mismatch is large, a dislocation or the like is caused at
the interface in order to reduce the interface energy generated by
lattice distortion. In this case, an epitaxial relationship is
established between crystal grains, and it is difficult to perform
a uniform epitaxial growth in the film plane. When a current is
caused to flow through an MTJ element, a dislocation works as a
source of the scattering of electrons, and the MR ratio is
decreased. Therefore, in order to perform a uniform epitaxial
growth in the film plane without causing a dislocation, it is
important to form a stacked structure using materials with smaller
lattice mismatch. Accordingly, from the viewpoint of lattice
mismatch, a perovskite oxide, a spinel oxide, a NaCl structure
oxide, with the preference set in this order, are suitable
materials for forming a nonmagnetic layer.
(Interface Magnetic Layer 3 and Interface Magnetic Layer 6)
[0089] Both the interface magnetic layer 3 and the interface
magnetic layer 6 are perpendicular magnetization films. In order to
meet the requirements of a high thermal stability and a low-current
magnetization switching, it is preferable that these layers be
formed of a material with a low saturation magnetization Ms, a high
magnetic anisotropy energy Ku to maintain a thermal stability
factor .DELTA., and a high spin polarization. An example of such a
material meeting the aforementioned requirements is a MnGe alloy
magnetic material containing Mn and Ge. This material will be
specifically explained below.
[0090] Specific examples of the interface magnetic layer 3 and the
interface magnetic layer 6 are formed of a MnGe alloy. The
characteristic of Mn.sub.xGe.sub.y as a perpendicular magnetization
film appears when the composition ratio x of Mn is in the range of
77 atm %.ltoreq.x.ltoreq.82 atm %, and the composition ratio y of
Ge is in the range of 18 atm %.ltoreq.y.ltoreq.23 atm %. In order
to cause perpendicular magnetic anisotropy energy to appear, it is
necessary that the c-axis is grown in the direction perpendicular
to the film plane, i.e., (001) oriented. Specifically, it is
possible to control the crystalline orientation of the
ferromagnetic layer 2 and the interface magnetic layer 3 by
appropriately selecting the material of the base layer 100.
Furthermore, it is possible to control the crystalline orientation
of the interface magnetic layer 6 and the ferromagnetic layer 8 by
appropriately selecting the material of the nonmagnetic layer
4.
[0091] Generally, there is a correlation between a Gilbert damping
constant and a magnitude of spin-orbit interaction of a material. A
material having a higher atomic number has greater spin-orbit
interaction, and a higher Gilbert damping constant. Since MnGe is a
material formed of light elements, it is expected that the Gilbert
damping constant thereof is low. Accordingly, the energy required
for magnetization switching thereof is low. Therefore, the current
density for magnetization reversal by spin polarized electrons can
be considerably reduced. Thus, MnGe can be effectively applied to
the interface ferromagnetic layer 3.
[0092] As examples, FIG. 12(a) shows the band structures of a bulk
MnGe alloy, which are obtained by calculation. FIG. 12(b) shows the
density of states thereof. It could be understood from FIG. 12(a)
that in the Majority state, the M band crosses the Fermi energy
E.sub.F while in the Minority state, the M band does not cross the
Fermi energy E.sub.F. This means that the spin of the electrons
moving in the c-axis direction is completely polarized. From FIG.
12(b), the spin polarization P could be estimates as -78% and the
saturation magnetization Ms could be estimated as 183 emu/cc. Thus,
it is understood that such a material is suitable to form an
interface magnetic layer of a storage layer or reference layer.
[0093] A second example of the interface magnetic layer 3 and the
interface magnetic layer 6 can be formed of, for example, an alloy
containing one element selected from the group consisting of Mn,
Fe, Co, and Ni, and two elements selected from the group consisting
of Zn, Al, Ga, In, Si, Ge, Sn, As, Sb, and Bi. Specifically,
MnAlGe, MnGaGe, MnZnSb, and the like can be used.
[0094] A third example of the interface magnetic layer 3 and the
interface magnetic layer 6 can be formed of, for example, an alloy
containing at least one metal selected from the group consisting of
Fe and Co. For example, it is desirable that the interface magnetic
layer 6 be formed of an alloy containing at least one metal
selected from the group consisting of Fe and Co. For example, when
an interface magnetic layer of CoFe, a nonmagnetic layer of MgO,
and an interface magnetic layer of CoFe are stacked, it is possible
to establish the orientation relationship of
CoFe(001)/MgO(001)/CoFe(001). In such a case, it is possible to
improve the wavenumber selectability of tunnel electrons, resulting
in that it is possible to obtain a high MR ratio. Incidentally, in
order to control the saturation magnetizations of the interface
magnetic layer 3 and the interface magnetic layer 6, it is possible
to add at least one element selected from the group consisting of
Ni, B, C, P, Ta, Ti, Mo, Si, W, Nb, Mn, and Ge thereto. That is to
say, the interface magnetic layer 3 and the interface magnetic
layer 6 can be formed of an alloy containing at least one element
selected from the group consisting of Fe and Co, and at least one
element selected from the group consisting of Ni, B, C, P, Ta, Ti,
Mo, Si, W, Nb, Mn, and Ge. For example, CoFeSi, CoFeP, CoFeW,
CoFeNb, and the like, besides CoFeB, can be such an alloy. These
alloys have a spin polarization equivalent to that of CoFeB.
Furthermore, a Heusler alloy such as Co.sub.2FeSi, Co.sub.2MnSi,
Co.sub.2MnGe and the like can be used. A Heusler alloy has a spin
polarization equivalent to or higher than that of CoFeB.
Accordingly, a Heusler alloy is suitable as a material of the
interface magnetic layers.
[0095] Furthermore, a fourth example of the interface magnetic
layer 3 and the interface magnetic layer 6 can be formed of a MnAl
alloy, for example. Since a MnAl alloy is formed of light metals,
the Gilbert damping constant thereof is low, resulting in that the
energy required for magnetization switching would be low.
Accordingly, it is possible to considerably reduce the current
density for switching magnetization by means of spin polarized
electrons. Moreover, since a MnAl alloy has an energy gap relative
to either the spinband of up-spin or the spinband of down-spin in
the (001) direction, it has a half-metallic characteristic and a
high spin polarization, resulting in that it is possible to obtain
a high MR ratio.
[0096] Since it is possible to obtain a high MR ratio as long as
the interface magnetic layer 3 and the interface magnetic layer 6
are epitaxially grown against the nonmagnetic layer 4, the
interface magnetic layer 3 and the interface magnetic layer 6
contacting the nonmagnetic layer 4 can expand or shrink in the
direction perpendicular to the film plane.
Fifth Embodiment
[0097] Next, a magnetic memory (MRAM) of spin transfer torque
writing type according to a fifth embodiment will be explained
below.
[0098] The MRAM according to this embodiment includes a plurality
of memory cells. FIG. 13 is a sectional view of the main part of a
memory cell of the MRAM according to this embodiment. Each memory
cell has a magnetoresistive element according to any of the first
to the fourth embodiments as a storage element. In the explanation
of the fifth embodiment, the storage element is assumed to be the
magnetoresistive element (MTJ element) 1 of the first
embodiment.
[0099] As shown in FIG. 13, the top surface of the MTJ element 1 is
connected to a bit line 32 via an upper electrode 31. Furthermore,
the bottom surface of the MTJ element 1 is connected to a drain
region 37a of source/drain regions of a surface of a semiconductor
substrate 36 via a lower electrode 33, a leading electrode 34, and
a plug 35. The drain region 37a constitutes a selection transistor
Tr with a source region 37b, a gate insulating film 38 formed on
the substrate 36, and a gate electrode 39 formed on the gate
insulating film 38. The selection transistor Tr and the MTJ element
1 constitute one memory cell of the MRAM. The source region 37b is
connected to another bit line 42 via a plug 41. Incidentally, it is
possible to exclude the leading electrode 34, to provide the plug
35 below the lower electrode 33, and to connect the lower electrode
33 the plug 35 directly. The bit lines 32 and 42, the electrodes 31
and 33, the leading electrode 34, and the plugs 35 and 41 are
formed of any one of W, Al, AlCu, Cu, and the like.
[0100] In the MRAM according to this embodiment, a plurality of
memory cells, each being the one shown in FIG. 13, are arranged in
a matrix form, thereby forming a memory cell array of the MRAM.
FIG. 14 is a circuit diagram showing the main part of the MRAM
according to this embodiment.
[0101] FIG. 14 shows that a plurality of memory cells 53 each
including an MTJ element 1 and a selection transistor Tr are
arranged in a matrix form. One end of each of the memory cells 53
in the same column is connected to the same bit line 32, and the
other is connected to the same bit line 42. The gate electrodes
(word line) 39 of the selection transistors Tr of the memory cells
53 belonging to the same row are mutually connected, and further
connected to a row decoder 51.
[0102] The bit line 32 is connected to a current source/sink
circuit 55 via a switching circuit 54 such as a transistor.
Furthermore, the bit line 42 is connected to a current source/sink
circuit 57 via a switching circuit 56 such as a transistor. The
current source/sink circuits 55 and 57 supply a write current to
the bit lines 32 and 42 connected thereto, or sink a current from
the bit lines 32 and 42 connected thereto.
[0103] The bit line 42 is also connected to a read circuit 52. The
read circuit 52 can be connected to the bit line 32. The read
circuit 52 includes a read current circuit, a sense amplifier, and
the like.
[0104] In a write operation, by turning on the switching circuits
54 and 56 connected to a memory cell, on which the write operation
is performed, and the selection transistor Tr, a current path
passing through the target memory cell is formed. One of the
current source/sink circuits 55 and 57 functions as a current
source, and the other functions as a current sink depending on
information to be written. As a result, a write current flows in a
direction depending on the information to be written.
[0105] With respect to the write speed, it is possible to perform
the spin transfer writing with a current having a pulse width from
a few nanoseconds to a few microseconds.
[0106] In a read operation, a read current that is low enough to
prevent magnetization switching is supplied to the MTJ element 1
specified in the same manner as the write operation. The read
circuit 52 determines the resistance state of the MTJ element 1 by
comparing a current value or voltage value, which is derived from
the resistance value that depends on the magnetization state of the
MTJ element 1, with a reference value.
[0107] Incidentally, it is preferable that the current pulse width
in a read operation be narrower than that in a write operation. In
this manner, the occurrences of writing errors caused by a current
in a read operation can be reduced. This is based on the fact that
the narrower the pulse width of a write current is, the higher the
absolute value of the write current becomes.
[0108] As described above, according to this embodiment, it is
possible to obtain a magnetic memory using a magnetoresistive
element with a low saturation magnetization and a high
perpendicular magnetic anisotropy energy.
[0109] While certain embodiments have been described, these
embodiments have been presented by way of example only, and are not
intended to limit the scope of the inventions. Indeed, the novel
methods and systems described herein may be embodied in a variety
of other forms; furthermore, various omissions, substitutions and
changes in the form of the methods and systems described herein may
be made without departing from the spirit of the inventions. The
accompanying claims and their equivalents are intended to cover
such forms or modifications as would fail within the scope and
spirit of the inventions.
* * * * *