U.S. patent application number 13/805060 was filed with the patent office on 2014-03-20 for edge-grinding machine for liquid crystal panel.
This patent application is currently assigned to SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.. The applicant listed for this patent is SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.. Invention is credited to Hsin-Hua Chen, Cheng-Ming Huang.
Application Number | 20140080384 13/805060 |
Document ID | / |
Family ID | 47395471 |
Filed Date | 2014-03-20 |
United States Patent
Application |
20140080384 |
Kind Code |
A1 |
Chen; Hsin-Hua ; et
al. |
March 20, 2014 |
EDGE-GRINDING MACHINE FOR LIQUID CRYSTAL PANEL
Abstract
The present disclosure provides an edge-grinding machine used
for grinding a liquid crystal panel. The edge-grinding machine
includes a chamfering grinding wheel assembly corresponding to a
cutting edge of the liquid crystal panel for chamfering the cutting
edge and further removing a sharp portion of the cutting edge; and
a reshaping grinding wheel assembly corresponding to a complete
cutting surface of the liquid crystal panel for reshaping the
complete cutting surface and further removing a step and unwanted
objects on the complete cutting surface. The edge-grinding machine
of the present disclosure is capable of chamfering the
corresponding cutting edge of the liquid crystal panel while
reshaping the complete cutting surface for removing the step and
unwanted objects thereon, which saves resources and labors required
to reshape the liquid crystal panel and thus improves the yield
rate of the liquid crystal panel.
Inventors: |
Chen; Hsin-Hua; (Shenzhen,
CN) ; Huang; Cheng-Ming; (Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
Shenzhen |
|
CN |
|
|
Assignee: |
SHENZHEN CHINA STAR OPTOELECTRONICS
TECHNOLOGY CO., LTD.
SHENZHEN
CN
|
Family ID: |
47395471 |
Appl. No.: |
13/805060 |
Filed: |
September 17, 2012 |
PCT Filed: |
September 17, 2012 |
PCT NO: |
PCT/CN2012/081711 |
371 Date: |
December 18, 2012 |
Current U.S.
Class: |
451/65 |
Current CPC
Class: |
B24B 9/10 20130101; B24B
9/14 20130101 |
Class at
Publication: |
451/65 |
International
Class: |
B24B 9/14 20060101
B24B009/14 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 17, 2012 |
CN |
CN201210345542.3 |
Claims
1. An edge-grinding machine used for grinding a liquid crystal
panel, comprising: a chamfering grinding wheel assembly
corresponding to a cutting edge of the liquid crystal panel for
chamfering the cutting edge and further removing a sharp portion of
the cutting edge; and a reshaping grinding wheel assembly
corresponding to a complete cutting surface of the liquid crystal
panel for reshaping the complete cutting surface and further
removing a step and unwanted objects on the complete cutting
surface.
2. The edge-grinding machine as claimed in claim 1, wherein the
cutting edge comprises a first cutting edge formed on a TFT
substrate of the liquid crystal panel and a second cutting edge
formed on a CF substrate of the liquid crystal panel; the
chamfering grinding wheel assembly comprises a first grinding wheel
group having a first grinding wheel and a second grinding wheel
respectively corresponding to the first cutting edge and the second
cutting edge.
3. The edge-grinding machine as claimed in claim 2, wherein the
first grinding wheel is spaced away from the second grinding wheel
along a moving direction of the liquid crystal panel.
4. The edge-grinding machine as claimed in claim 3, wherein the
chamfering grinding wheel assembly further comprises at least one
second grinding wheel group used for re-grinding the cutting edge
chamfered by the first grinding wheel group; each second grinding
wheel group comprises a third grinding wheel and a fourth grinding
wheel, the third grinding wheel corresponds to the first cutting
edge and is spaced away from the first grinding wheel, and the
fourth grinding wheel corresponds to the second cutting edge and is
spaced away from the second grinding wheel.
5. The edge-grinding machine as claimed in claim 4, wherein a
rotating direction of the first grinding wheel is the same as that
of the second grinding wheel, and the rotating direction of the
second grinding wheel is the same as that of the fourth grinding
wheel but opposite to that of the first grinding wheel/the third
grinding wheel.
6. The edge-grinding machine as claimed in claim 1, wherein the
complete cutting surface comprises a first cutting surface formed
on the TFT substrate and a second cutting surface formed on the CF
substrate, the reshaping grinding wheel assembly comprises a first
reshaping grinding wheel corresponding to the first cutting surface
and the second cutting surface for removing the step formed between
the first cutting surface and the second cutting surface and
further keeping the first cutting surface coplanar with the second
cutting surface.
7. The edge-grinding machine as claimed in claim 6, wherein the
reshaping grinding wheel assembly further comprises at least one
second reshaping grinding wheel for re-grinding the first cutting
surface and the second cutting surface reshaped by the first
reshaping grinding wheel, and each second grinding wheel is
parallel to and spaced away from the first reshaping grinding
wheel.
8. The edge-grinding machine as claimed in claim 7, wherein a layer
of grinding material is disposed on an outer surface of the first
reshaping grinding wheel or the at least one second reshaping
grinding wheel.
9. The edge-grinding machine as claimed in claim 7, wherein a
diameter of the at least one second reshaping grinding wheel is
larger than that of the first reshaping grinding wheel.
10. The edge-grinding machine as claimed in claim 6 further
comprising a controlling assembly, the controlling assembly is
connected to the chamfering grinding wheel assembly and the
reshaping grinding wheel assembly for controlling the chamfering
grinding wheel assembly and the reshaping grinding wheel assembly
to move to correspond to the cutting edge and the complete cutting
surface needed to be reshaped.
11. An edge-grinding machine for processing a liquid crystal panel
having at least one cutting edge and at least one complete cutting
surface, comprising: a first chamfering grinding wheel group
corresponding to the cutting edge for chamfering the cutting edge;
and a first reshaping grinding wheel corresponding to the complete
cutting surface for reshaping the complete cutting surface and
further for removing a step and unwanted objects on the complete
cutting surface.
12. The edge-grinding machine as claimed in claim 11, wherein the
cutting edge comprises a first cutting edge formed on a TFT
substrate of the liquid crystal panel and a second cutting edge
formed on a CF substrate of the liquid crystal panel, the first
grinding wheel group comprises a first grinding wheel and a second
grinding wheel respectively corresponding to the first cutting edge
and the second cutting edge for chamfering the first cutting edge
and the second cutting edge.
13. The edge-grinding machine as claimed in claim 12, wherein the
first grinding wheel is spaced away from the second grinding wheel
along a moving direction of the liquid crystal panel.
14. The edge-grinding machine as claimed in claim 13, wherein the
rotating direction of the first grinding wheel is opposite to that
of the second grinding wheel.
15. The edge-grinding machine as claimed in claim 12 further
comprising at least one second grinding wheel group parallel to the
first grinding wheel group, each second grinding wheel group is
spaced away from the first grinding wheel group along the moving
direction of the liquid crystal panel for re-grinding the
corresponding cutting edge chamfered by the first grinding wheel
group.
16. The edge-grinding machine as claimed in claim 11, wherein the
complete cutting surface comprises a first cutting surface formed
on a TFT substrate of the liquid crystal panel and a second cutting
surface formed on a CF substrate of the liquid crystal panel, and
the first reshaping grinding wheel reshapes the first cutting
surface and the second cutting surface to keep the first cutting
surface coplanar with the second cutting surface.
17. The edge-grinding machine as claimed in claim 16, wherein a
layer of grinding material is covered on an outer surface of the
first reshaping grinding wheel.
18. The edge-grinding as claimed in claim 16 further comprising at
least one second reshaping grinding wheel parallel to the first
grinding wheel, the second reshaping grinding wheel is spaced away
from the first grinding wheel for re-grinding the first cutting
surface and the second cutting surface reshaped by the first
grinding wheel.
19. The edge-grinding machine as claimed in claim 18, wherein a
diameter of the second grinding wheel is greater than that of the
first grinding wheel.
20. The edge-grinding machine as claimed in claim 16 further
comprising a controlling assembly connected to the first grinding
wheel group and the first reshaping grinding wheel for controlling
the first grinding wheel group and the first reshaping grinding
wheel to move to the corresponding cutting edge and the complete
cutting surface needed to be reshaped.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present disclosure relates to liquid crystal displaying
technologies and, particularly, to an edge-grinding machine used
for grinding and processing a liquid crystal panel.
[0003] 2. Description of Related Art
[0004] Referring to FIG. 1, in the manufacturing process of a
liquid crystal panel, two opposite substrates of large size,
including a TFT substrate G1 and a CF substrate G2, are generally
bonded together to form a mother panel M with liquid crystal sealed
therein. The mother panel M then is cut to form the display panel
unit U as shown in FIG. 2. The display panel unit U is further
processed to form a final liquid crystal panel. The TFT substrate
G1 often includes a glass substrate, thin film transistors formed
on the glass substrate for driving liquid crystal, and at least one
terminal region formed on the glass substrate for being connected
to an external circuit. The CF substrate G2 often includes a glass
substrate and a color filter formed on the glass substrate.
[0005] As shown in FIG. 1, conventionally, a cutting device with at
least one cutter wheel is used for cutting the mother panel M to
form the display panel unit U. When cutting the mother panel M, two
cutter wheels respectively abut corresponding positions on surfaces
of the TFT substrate G1 and the CF substrate G2. The two cutter
wheels then move on the surfaces of the TFT substrate G1 and the CF
substrate to respectively define two cutting lines on the TFT
substrate G1 and the CF substrate G2. After that, the two cutter
wheels cut the display panel unit U off the mother panel M along
the cutting lines by applying force or heating vapor onto the
cutting lines. The display panel unit U then is transferred to
following processes by using robots.
[0006] Specifically, a pair of cutter wheel C1, C2 is used for
cutting the mother panel M from up and down. One of the cutter
wheel C1 abuts one side of TFT substrate G1 which is away from the
CF substrate G2 and the other cutter wheel C2 abuts one side of the
CF substrate G2 which is away from the TFT substrate G1. Ideally,
the cutter wheel C2 is aligned with the cutter wheel C 1. Then, the
two cutter wheels are controlled to operate at the same time, for
example, controlled to rotate in opposite directions, to form a
complete cutting surface P, which is capable of separating two
adjacent display panel units U. As shown in FIG. 2, the complete
cutting surface P includes a first cutting surface P1 formed on the
TFT substrate G1 and a second cutting surface P2 formed on the CF
substrate G2. In the ideal situation, the first cutting surface P1
is coplanar with the second cutting surface P2. After that, as
shown in FIGS. 3 and 4, in the next process, the cutter wheel C2 is
often used for further cutting the CF substrate G2 to reveal the
terminal region of the TFT substrate G1. To a TFT substrate G1
configured with only one terminal region, the cutter wheel C2 cuts
only one edge of the CF substrate G2 to reveal the corresponding
terminal region. That is, to a display panel unit configured with
one terminal region, the number of the complete cutting surfaces P
is three.
[0007] After the terminal region is revealed, an edge-grinding
machine is used for chamfering the cutting edge of the display
panel unit U, thereby removing the sharp portion on each cutting
edge. However, the present edge-grinding machine can only chamfer
the cutting edge. On the other hand, as shown in FIG. 5, limited to
the cutting precision of the present cutting machine, the cutter
wheel corresponding to the TFT substrate G1 is often not aligned
with the cutter wheel corresponding to the CF substrate G2,
resulting in a step formed on the complete cutting surface of the
display panel unit U. At this time, the first cutting surface P1 is
not coplanar with the second cutting surface P2. Therefore, extra
operators are needed to grind the display panel unit U in the
following process to remove the step, which reduces the
productivity of the liquid crystal panel.
[0008] Additionally, in the process of cutting the mother panel M
to form the display panel unit U, due to some unexpected
situations, for example, the cutter wheel C1 or the cutter wheel C2
shakes due to the power fluctuations or the platform supporting the
mother panel M shakes due to some external factors, some unwanted
objects B as shown in FIG. 7 may be left over on the complete
cutting surface. This not only declines the cutting quality, but
also reduces the manufacturing efficiency of the liquid crystal
panel since it requires time and labor to grind the display panel
to remove the unwanted objects B.
SUMMARY
[0009] One object of the present disclosure is to provide an
edge-grinding machine for reshaping a complete cutting surface of a
liquid crystal panel while chamfering a corresponding edge of the
liquid crystal panel.
[0010] The present disclosure provides an edge-grinding machine
used for grinding a liquid crystal panel. The edge-grinding machine
includes a chamfering grinding wheel assembly corresponding to a
cutting edge of the liquid crystal panel for chamfering the cutting
edge and further removing a sharp portion of the cutting edge; and
a reshaping grinding wheel assembly corresponding to a complete
cutting surface of the liquid crystal panel for reshaping the
complete cutting surface and further removing a step and unwanted
objects on the complete cutting surface.
[0011] Preferably, the cutting edge includes a first cutting edge
formed on a TFT substrate of the liquid crystal panel and a second
cutting edge formed on a CF substrate of the liquid crystal panel;
the chamfering grinding wheel assembly includes a first grinding
wheel group having a first grinding wheel and a second grinding
wheel respectively corresponding to the first cutting edge and the
second cutting edge.
[0012] Preferably, the first grinding wheel is spaced away from the
second grinding wheel along a moving direction of the liquid
crystal panel.
[0013] Preferably, the chamfering grinding wheel assembly further
includes at least one second grinding wheel group used for
re-grinding the cutting edge chamfered by the first grinding wheel
group; each second grinding wheel group includes a third grinding
wheel and a fourth grinding wheel, the third grinding wheel
corresponds to the first cutting edge and is spaced away from the
first grinding wheel, and the fourth grinding wheel corresponds to
the second cutting edge and is spaced away from the second grinding
wheel.
[0014] Preferably, a rotating direction of the first grinding wheel
is the same as that of the second grinding wheel, and the rotating
direction of the second grinding wheel is the same as that of the
fourth grinding wheel but opposite to that of the first grinding
wheel/the third grinding wheel.
[0015] Preferably, the complete cutting surface includes a first
cutting surface formed on the TFT substrate and a second cutting
surface formed on the CF substrate, the reshaping grinding wheel
assembly includes a first reshaping grinding wheel corresponding to
the first cutting surface and the second cutting surface for
removing the step formed between the first cutting surface and the
second cutting surface and further keeping the first cutting
surface coplanar with the second cutting surface.
[0016] Preferably, the reshaping grinding wheel assembly further
includes at least one second reshaping grinding wheel for
re-grinding the first cutting surface and the second cutting
surface reshaped by the first reshaping grinding wheel, and each
second grinding wheel is parallel to and spaced away from the first
reshaping grinding wheel.
[0017] Preferably, a layer of grinding material is disposed on an
outer surface of the first reshaping grinding wheel or the at least
one second reshaping grinding wheel.
[0018] Preferably, a diameter of the at least one second reshaping
grinding wheel is larger than that of the first reshaping grinding
wheel.
[0019] Preferably, the edge-grinding machine further includes a
controlling assembly, the controlling assembly is connected to the
chamfering grinding wheel assembly and the reshaping grinding wheel
assembly for controlling the chamfering grinding wheel assembly and
the reshaping grinding wheel assembly to move to correspond to the
cutting edge and the complete cutting surface needed to be
reshaped.
[0020] The present disclosure further provides another
edge-grinding machine for processing a liquid crystal panel having
at least one cutting edge and at least one complete cutting
surface. The edge-grinding machine includes a first chamfering
grinding wheel group corresponding to the cutting edge for
chamfering the cutting edge; and a first reshaping grinding wheel
corresponding to the complete cutting surface for reshaping the
complete cutting surface and further for removing a step and
unwanted objects on the complete cutting surface.
[0021] Preferably, the cutting edge includes a first cutting edge
formed on a TFT substrate of the liquid crystal panel and a second
cutting edge formed on a CF substrate of the liquid crystal panel,
the first grinding wheel group includes a first grinding wheel and
a second grinding wheel respectively corresponding to the first
cutting edge and the second cutting edge for chamfering the first
cutting edge and the second cutting edge.
[0022] Preferably, the first grinding wheel is spaced away from the
second grinding wheel along a moving direction of the liquid
crystal panel.
[0023] Preferably, the rotating direction of the first grinding
wheel is opposite to that of the second grinding wheel.
[0024] Preferably, the edge-grinding machine further includes at
least one second grinding wheel group parallel to the first
grinding wheel group, each second grinding wheel group is spaced
away from the first grinding wheel group along the moving direction
of the liquid crystal panel for re-grinding the corresponding
cutting edge chamfered by the first grinding wheel group.
[0025] Preferably, the complete cutting surface includes a first
cutting surface formed on a TFT substrate of the liquid crystal
panel and a second cutting surface formed on a CF substrate of the
liquid crystal panel, and the first reshaping grinding wheel
reshapes the first cutting surface and the second cutting surface
to keep the first cutting surface coplanar with the second cutting
surface.
[0026] Preferably, a layer of grinding material is covered on an
outer surface of the first reshaping grinding wheel.
[0027] Preferably, the edge-grinding further includes at least one
second reshaping grinding wheel parallel to the first grinding
wheel, the second reshaping grinding wheel is spaced away from the
first grinding wheel for re-grinding the first cutting surface and
the second cutting surface reshaped by the first grinding
wheel.
[0028] Preferably, a diameter of the second grinding wheel is
greater than that of the first grinding wheel.
[0029] Preferably, the edge-grinding machine further includes a
controlling assembly connected to the first grinding wheel group
and the first reshaping grinding wheel for controlling the first
grinding wheel group and the first reshaping grinding wheel to move
to the corresponding cutting edge and the complete cutting surface
needed to be reshaped.
[0030] With the reshaping grinding wheel assembly arranged adjacent
to the chamfering grinding wheel assembly, the reshaping grinding
wheel assembly is capable of reshaping the complete cutting surface
when the chamfering grinding wheel assembly chamfers the
corresponding cutting edge. In this way, the step formed between
the first cutting surface and the second cutting surface and the
unwanted objects on the first cutting surface and the second
cutting surface can be removed, allowing the edge-grinding machine
to chamfer and reshape the liquid crystal panel. Therefore, the
edge-grinding machine of the present disclosure can be used for
chamfering and reshaping the liquid crystal panel at the same time,
which saves the resources and labors required to reshape the liquid
crystal panel and thus improves the yield rate of the liquid
crystal panel.
DESCRIPTION OF THE DRAWINGS
[0031] Many aspects of the embodiments can be better understood
with reference to the following drawings. The components in the
drawings are not necessarily dawns to scale, the emphasis instead
being placed upon clearly illustrating the principles of the
embodiments. Moreover, in the drawings, like reference numerals
designate corresponding parts throughout the several views.
[0032] FIG. 1 is a schematic view illustrating using two cutter
wheels to cut a CF substrate and a TFT substrate to form a display
panel unit;
[0033] FIG. 2 is a schematic view showing the display panel unit
formed in FIG. 1;
[0034] FIGS. 3 and 4 are schematic views illustrating cutting the
CF substrate to reveal a terminal region of the TFT substrate;
[0035] FIG. 5 is a schematic view showing that the present two
cutter wheels respectively corresponding to the CF substrate and
TFT substrate are not aligned with each other;
[0036] FIG. 6 is a schematic view showing the display panel unit
formed in FIG. 5;
[0037] FIG. 7 is a schematic view showing an unwanted object on a
complete cutting surface of the display panel unit;
[0038] FIG. 8 is a schematic view of a chamfering grinding wheel
assembly and a reshaping grinding wheel assembly;
[0039] FIG. 9 is similar to FIG. 8 but viewed from another
angle;
[0040] FIG. 10 is a schematic view showing using the chamfering
grinding wheel assembly and the reshaping grinding wheel assembly
of FIG. 8 to process the liquid crystal panel.
DETAILED DESCRIPTION
[0041] The disclosure is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings in
which like references indicate similar elements. It should be noted
that references to "an" or "one" embodiment is this disclosure are
not necessarily to the same embodiment, and such references mean at
least one.
[0042] Referring to FIGS. 8 and 9, in which FIG. 8 is a schematic
view of a chamfering grinding wheel assembly and a reshaping
grinding wheel assembly, and FIG. 9 is similar to FIG. 8 but viewed
from another angle. A liquid crystal panel 200 includes a TFT
substrate 210 and a CF substrate 220 opposite to the TFT substrate
210. The TFT substrate 210 includes a glass substrate, thin film
transistors formed on the glass substrate for driving liquid
crystal, and a terminal region formed on the glass substrate for
being connected to an external circuit. The CF substrate 220
includes a glass substrate and a color filter formed on the glass
substrate. The liquid crystal panel 200 further includes four
cutting edges 230 and at least one complete cutting surface 240.
Each cutting edge 230 includes a first cutting edge 231 formed on
the TFT substrate 210 and a second cutting edge 232 formed on the
CF substrate 220. The complete cutting surface 240 includes a first
cutting surface 241 formed on the TFT substrate 210 and a second
cutting surface 242 formed on the CF substrate 220.
[0043] Referring also to FIG. 9, an edge-grinding machine 100 is
used for grinding and processing the liquid crystal panel 200,
including chamfering the corresponding cutting edge 230 to remove
sharp portions of the corresponding cutting edge 230 and reshaping
the complete cutting surface 240 to remove a step and unwanted
objects on the corresponding complete cutting surface.
[0044] The edge-grinding machine 100 includes a chamfering grinding
wheel assembly 110, a reshaping grinding wheel assembly 120, and a
controlling assembly (not shown in the drawings). The chamfering
grinding wheel assembly 110 corresponds to the cutting edge 230 of
the liquid crystal panel 200 for chamfering the corresponding
cutting edge 230 and further removing the sharp portion of the
corresponding cutting edge 230. The reshaping grinding wheel
assembly 120 corresponds to the complete cutting surface 240 for
reshaping the complete cutting surface 240 and further removing the
step formed between the first cutting surface 241 and the second
cutting surface 242. The reshaping grinding wheel assembly 120 can
also remove unwanted objects such as protrusions on the complete
cutting surface 240. The controlling assembly is connected to the
chamfering grinding wheel assembly 110 and the reshaping grinding
wheel assembly 120 for controlling the moving direction and the
moving distance of the chamfering grinding wheel assembly 110 and
the reshaping grinding wheel assembly 120.
[0045] Specifically, in the embodiment, the chamfering grinding
wheel assembly 110 includes a first grinding wheel group 111. The
first grinding wheel group 111 includes a first grinding wheel 111a
and a second grinding wheel 111b. The first grinding wheel 111a
corresponds to the first cutting edge 231 of each cutting edge 230
for chamfering the first cutting edge 231, thereby removing the
sharp portion of the first cutting edge 231. The second grinding
wheel 111b corresponds to the second cutting edge 232 for
chamfering the second cutting edge 232, thereby removing the sharp
portion of the second cutting edge 231. The second grinding wheel
111b is spaced away from the first grinding wheel 111a along the
moving direction of the liquid crystal panel 200.
[0046] Furthermore, in the embodiment, the chamfering grinding
wheel assembly 110 includes a second grinding wheel group 112 which
is spaced away from the first grinding wheel group 111 for
re-grinding the chamfered first cutting edge 231 and the second
cutting edge 232. The second chamfering grinding wheel group 112
includes a third grinding wheel 112a parallel to the first grinding
wheel 111a and a fourth grinding wheel 112b parallel to the second
grinding wheel 111b. The third grinding wheel 112a is spaced away
from the first grinding wheel 111a. Similar to the first grinding
wheel 111a, the third grinding wheel 112a corresponds to the first
cutting edge 231, being used for re-grinding the first cutting edge
231 chamfered by the first grinding wheel 111a. The fourth grinding
wheel 112b is spaced away from the second grinding wheel 111b.
Similar to the second grinding wheel 111b, the fourth grinding
wheel 112b corresponds to the second cutting edge 232, being used
for re-grinding the second cutting edge 232 chamfered by the second
grinding wheel 112b.
[0047] It is understood that the chamfering grinding wheel assembly
110 is not limited to the embodiment. In some embodiments that the
chamfering quality of the liquid crystal panel 200 is not strictly
required, the second grinding wheel group 112 can be omitted.
Similarly, in other embodiments, when the chamfering quality of the
liquid crystal panel 200 is strictly required, the chamfering
grinding wheel assembly 110 can include more than one second
grinding wheel group 112, which is capable of re-grinding the
chamfered first cutting edge 231 and the chamfered second cutting
edge 232 over and over.
[0048] The reshaping grinding wheel assembly 120 includes a first
reshaping grinding wheel 121 and a second reshaping grinding wheel
122 parallel to the first reshaping grinding wheel 121. The first
reshaping grinding wheel 121 is parallel to and spaced away from
the chamfering grinding wheel assembly 110. A first layer 121a of
grinding material is covered on an outer surface of the first
reshaping grinding wheel 121. The first layer 121a of grinding
material corresponds to the corresponding complete cutting surface
of the liquid crystal panel, that is, corresponds to the complete
cutting surface 240 needed to be reshaped, for removing the step
formed between the first cutting surface 241 and the second cutting
surface 242, thereby keeping the first cutting surface 241 coplanar
with the second cutting surface 242. Meanwhile, the first reshaping
grinding wheel 121 can also remove the unwanted objects such as
protrusions on the first cutting surface 241 and the second cutting
surface 242. The second reshaping grinding wheel 122 is spaced away
from the first reshaping grinding wheel 121, being used for
re-grinding the first and second cutting surface 241, 242 reshaped
by the first reshaping grinding wheel 121 for improving the quality
of the reshaping operation. In the embodiment, a diameter of the
second reshaping grinding wheel 122 is greater than that of the
first reshaping grinding wheel 121. A second layer 122a of grinding
material is covered on an outer surface of the second reshaping
grinding wheel 122.
[0049] It is understood that the reshaping grinding wheel assembly
120 is not limited to the embodiment. In other embodiments, the
number of the reshaping grinding wheel can be adjusted according to
the cutting situation of the first cutting surface 241 and the
second cutting surface 242. For example, if the step formed between
the first and second cutting surfaces 241, 242 is distinct, or
there are a number of unwanted objects on the first and second
cutting surfaces 241, 242, the reshaping grinding wheel assembly
120 can include more than one second reshaping grinding wheel 122.
On the other hand, if the step formed between the first and second
cutting surfaces 241, 242 are unobvious, or there are few unwanted
objects on the first cutting surface 241 or the second cutting
surface 242, the reshaping grinding wheel assembly 120 can be
configured with the omission of the second reshaping grinding wheel
122.
[0050] It is noted that, to different types of liquid crystal panel
200, the number of the cutting edge 230 needed to be chamfered
remains unchanged, but the number of the complete cutting surface
240 needed to be reshaped is correspondingly changed as the type of
the liquid crystal panel changes. Specifically, the sum of the
number of the complete cutting surface 240 needed to be reshaped
and the number of the revealed terminal region is equal to that of
the cutting edge 240 needed to be chamfered. For example, as shown
in FIG. 10, to a liquid crystal panel configured with only one
terminal region revealed on an edge of the TFT substrate, the
number of the complete cutting surfaces 240 needed to be reshaped
is three and the number of non-complete cutting surface is one. In
this state, on the non-complete cutting surface, the first cutting
surface 241 is spaced away from the second cutting surface 242 and
there are no steps formed between the first cutting surface 241 and
the second cutting surface 242, therefore, the edge-grinding
machine 100 is mainly used for chamfering the cutting edge 230 of
the liquid crystal panel 200. In some embodiments, if the TFT
substrate 210 is configured with two terminal regions on two edges
thereof, since the number of the terminal region is two, therefore,
the number of the complete cutting surfaces 240 to be reshaped is
also two, while the number of the cutting edges 230 to be chamfered
by the edge-grinding machine 100 is four. It is noted that in the
embodiment, as shown in FIG. 10, even corresponding to the
non-complete cutting surface, the edge-grinding machine 100 still
can be used for removing the unwanted objects on the TFT substrate
210 when chamfering the corresponding cutting edge 230.
[0051] The controlling assembly is connected to the chamfering
grinding wheel assembly 110 and the reshaping grinding wheel
assembly 120 for adjusting the positions of the chamfering grinding
wheel assembly 110 and the reshaping grinding wheel assembly 120.
Thus, the chamfering grinding wheel assembly 110 and the reshaping
grinding wheel assembly 120 can move to correspond to the cutting
edge 230 or the complete cutting surface 240 needed to be
reshaped.
[0052] Before using the edge-grinding machine 100 to chamfer the
cutting edge of the liquid crystal panel 200, the liquid crystal
panel 200 is placed on a transferring apparatus, with the first
cutting edge 231 to be chamfered corresponding to the first
grinding wheel 111a and the third grinding wheel 112a, with the
second cutting edge 232 to be chamfered corresponding to the second
grinding wheel 111b and the fourth grinding wheel 112b, and with
the first cutting surface 241 and the second cutting surface 242
respectively corresponding to the first reshaping grinding wheel
121 and the second reshaping grinding wheel 122. During the
process, the positions of each grinding wheel and each reshaping
grinding wheel can be slightly adjusted via the controlling
assembly, thus, the chamfering grinding wheel assembly 110 and the
reshaping grinding wheel assembly 120 can precisely process the
liquid crystal panel 200. After that, the transferring apparatus
operates to move the liquid crystal panel 200 along the direction Y
shown in FIG. 9.
[0053] The chamfering grinding wheel assembly 110 at the same time
operates to chamfer the first cutting edge 231 and the second
cutting edge 232 to remove the sharp portions thereof. During the
process, the outer surfaces of the first grinding wheel 111a and
the second grinding wheel 111b respectively contact the first
cutting edge 231 and the second cutting edge 232, which allows
friction generated therebetween. Under the friction, the liquid
crystal panel 200 is driven to move along the direction X as shown
in FIG. 9 towards the chamfering grinding wheel assembly 110 for a
predetermined distance, which allows the portion of the
corresponding cutting edge of the liquid crystal panel processed by
the edge-grinding machine 100 to have a predetermined width in the
direction X. Since the two grinding wheels are spaced away from
each other along the direction Y, therefore, the thickness of the
corresponding cutting edge can be prevented grinded to zero by the
first grinding wheel 111a and the second grinding wheel 111b, which
allows the liquid crystal panel 200 to move along the direction X.
After the portion chamfered by the first grinding wheel group 111
is moved to correspond to the second grinding wheel group 112, the
second grinding wheel group 112 operates to re-grind the chamfered
first and second cutting edges 231, 232.
[0054] Meanwhile, the reshaping grinding wheel assembly 120 also
begins to operate to reshape the first cutting surface 241 and the
second cutting surface 242 of the corresponding cutting surface
240. Since the first layer 121a of grinding material abuts the
first cutting surface 241 and the second cutting surface 242, thus,
after the first reshaping grinding wheel 121 rotates, the first
layer 121a of grinding material is capable of removing the step
formed between the first cutting surface 241 and the second cutting
surface 242 and removing the unwanted objects, such as protrusions
on the first cutting surface 241 and the second cutting surface
242. As the liquid crystal panel 200 moves on along the direction
Y, the portions of the first cutting surface 241 and the second
cutting surface 242 reshaped by the first reshaping grinding wheel
121 is moved to correspond to the second reshaping grinding wheel
122. Since the diameter of the second reshaping grinding wheel 122
is greater than that of the first reshaping grinding wheel 121,
therefore, the extending distance beyond the liquid crystal panel
200 from the second reshaping grinding wheel 122 is longer than
that beyond the liquid crystal panel 200 from the first reshaping
grinding wheel 121 along the direction X, allowing the second
reshaping grinding wheel 122 to re-grind the reshaped first and
second cutting surfaces 241, 242.
[0055] With the reshaping grinding wheel assembly 120 arranged
adjacent to the chamfering grinding wheel assembly 110, the
reshaping grinding wheel assembly 120 is capable of reshaping the
complete cutting surface 240 when the chamfering grinding wheel
assembly 110 chamfers the corresponding cutting edge 230. In this
way, the step formed between the first cutting surface 241 and the
second cutting surface 242 and the unwanted objects on the first
cutting surface 241 and the second cutting surface 242 can be
removed, allowing the edge-grinding machine 100 to chamfer and
reshape the liquid crystal panel 200. Additionally, even
corresponding to the non-complete cutting surface, the
edge-grinding machine 100 can also remove the unwanted objects on
the first cutting surface of the TFT substrate 210. Therefore, the
edge-grinding machine 100 of the present disclosure can be used for
chamfering and reshaping the liquid crystal panel at the same time,
which saves the resources and labors required to reshape the liquid
crystal panel and thus improves the yield rate of the liquid
crystal panel 200.
[0056] Even though information and the advantages of the present
embodiments have been set forth in the foregoing description,
together with details of the mechanisms and functions of the
present embodiments, the disclosure is illustrative only; and that
changes may be made in detail, especially in matters of shape,
size, and arrangement of parts within the principles of the present
embodiments to the full extend indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
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