U.S. patent application number 13/623119 was filed with the patent office on 2014-03-20 for bidirectional heat dissipation structure.
This patent application is currently assigned to GOLDEN SUN NEWS TECHNIQUES CO., LTD.. The applicant listed for this patent is CPUMATE INC., GOLDEN SUN NEWS TECHNIQUES CO., LTD.. Invention is credited to CHIH-HUNG CHENG, CHUN-LUNG HUANG, KUO-JEN LIN, WEN-JUNG LIU.
Application Number | 20140076521 13/623119 |
Document ID | / |
Family ID | 50273243 |
Filed Date | 2014-03-20 |
United States Patent
Application |
20140076521 |
Kind Code |
A1 |
LIN; KUO-JEN ; et
al. |
March 20, 2014 |
BIDIRECTIONAL HEAT DISSIPATION STRUCTURE
Abstract
A bidirectional heat dissipation structure includes a base, a
plurality of heat pipes and a heat sink having a plurality of
cooling fins. The cooling fins are installed with an interval apart
on the heat pipes and stacked onto the base, and each cooling fin
includes at least one guide slat. When assembled, a horizontal
diversion channel is formed between the cooling fins, and the guide
slats form a downward diversion channel. When used, a portion of
the wind current dissipates the heat of the heat sink through the
horizontal diversion channel, and the other portion of the wind
current blows downwardly through the downward diversion channel to
dissipate the heat around the electronic device directly, so as to
enhance the heat dissipation efficiency significantly.
Inventors: |
LIN; KUO-JEN; (NEW TAIPEI
CITY, TW) ; CHENG; CHIH-HUNG; (NEW TAIPEI CITY,
TW) ; LIU; WEN-JUNG; (NEW TAIPEI CITY, TW) ;
HUANG; CHUN-LUNG; (NEW TAIPEI CITY, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CPUMATE INC.
GOLDEN SUN NEWS TECHNIQUES CO., LTD. |
NEW TAIPEI CITY
NEW TAIPEI CITY |
|
TW
TW |
|
|
Assignee: |
GOLDEN SUN NEWS TECHNIQUES CO.,
LTD.
NEW TAIPEI CITY
TW
CPUMATE INC.
NEW TAIPEI CITY
TW
|
Family ID: |
50273243 |
Appl. No.: |
13/623119 |
Filed: |
September 20, 2012 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28D 15/0275 20130101;
F28F 1/32 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Claims
1. A bidirectional heat dissipation structure, installed onto an
electronic device, and having a wind source disposed on a side of
the bidirectional heat dissipation structure, comprising: a base,
disposed on the electronic device; a plurality of heat pipes,
extended in a direction from the base; and a heat sink, having a
plurality of cooling fins, each cooling fin sequentially passing
through the heat pipes, and the cooling fins being stacked with
each other above the base, and the cooling fin having a plurality
of through holes for passing the heat pipes, and the cooling fin
having at least one guide slat; thereby a horizontal diversion
channel is formed between the cooling fins when the bidirectional
heat dissipation structure is assembled, and the guide slats form a
downward diversion channel between the cooling fins; and the wind
source supplies wind from a lateral side, and a portion of wind
current dissipates heat through the horizontal diversion channel,
and the other portion of the wind current blows downwardly to
dissipate heat of the electronic device through the downward
diversion channel.
2. The bidirectional heat dissipation structure of claim 1, wherein
the base includes a plurality of grooves corresponsive to the heat
pipes and the grooves parallelly and transversely penetrate a side
of the base.
3. The bidirectional heat dissipation structure of claim 2, wherein
the heat pipes are substantially U-shaped with the central position
disposed in the grooves respectively, so that both ends of each
heat pipe are vertically erected from the base.
4. The bidirectional heat dissipation structure of claim 1, wherein
each of the through holes has a circular flange disposed around the
through hole.
5. The bidirectional heat dissipation structure of claim 1, wherein
the cooling fin has a baffle plate disposed on a side of the
cooling fin.
6. The bidirectional heat dissipation structure of claim 5, wherein
each guide slat has a predetermined included angle with respect to
each baffle plate, and the predetermined included angle falls
within a range from 30.degree. to 89.degree..
7. The bidirectional heat dissipation structure of claim 5, wherein
each guide slat has a predetermined gap from each baffle plate.
8. The bidirectional heat dissipation structure of claim 1, wherein
the guide slat is an arc sheet structure or a rectangular sheet
structure.
9. The bidirectional heat dissipation structure of claim 1, wherein
the guide slat is extended in a direction towards a side of the
cooling fin and an included angle is defined between the guide slat
and the cooling fin.
10. The bidirectional heat dissipation structure of claim 1,
wherein the cooling fin has at least one penetrating hole formed at
a lateral edge of the guide slat and communicated with the downward
diversion channel, so that the other portion of the wind current is
blown downwardly through the downward diversion channel and the
penetrating holes for dissipating heat around the electronic
device.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to the field of heat
dissipation equipments applied in electronic devices, in particular
to a bidirectional heat dissipation structure capable of generating
horizontal airflow and downward airflow simultaneously to dissipate
heat from an electronic device and its surrounding.
[0003] 2. Description of the Related Art
[0004] As science and technology advance, computers and information
technology are developed rapidly, and the computing speed of the
electronic devices installed in a computer comes with an
increasingly higher speed. Among the heat-generating components of
the computer, central processing units (CPU) produce more heat than
any other components of the computer, and thus a heat dissipating
device is generally installed for dissipating heat to assure
stability and performance.
[0005] A general heat dissipating device comprises a heat
dissipating body and a fan, wherein the heat dissipating body is a
structure with a plurality of fins stacked onto one another, an
aluminum extruded heat dissipating body, at least one heat pipe, at
least one vapor chamber, or any combination of the above. The fan
is mounted to the top or a side of the heat dissipating body, and
the bottom of the heat dissipating body is attached onto a
heat-generating electronic device, so that the heat generated by
the electronic device can be transferred to the heat dissipating
body by means of thermal conduction and then dissipated by airflow
of the fan.
[0006] Due to the limitations of the shape of the heat dissipating
body and the installation method of the fan, the airflow cannot be
blown at the electronic device and its surrounding directly if the
fan is blowing wind downwardly or sideway, and there is
insufficient space between the heat dissipating body and the
electronic device. Therefore, most heat dissipating devices can
only dissipate the heat generated by the electronic device by a
direct-contact conduction method only, and the design of such heat
dissipating device cannot meet the heat dissipation requirements of
the electronic devices that produce a large quantity of heat in a
short time.
SUMMARY OF THE INVENTION
[0007] Therefore, it is a primary objective of the present
invention to provide a bidirectional heat dissipation structure
comprising a heat sink, and the heat sink is having a plurality of
cooling fins with at least one guide slat installed on the cooling
fin, wherein the guide slats are installed at appropriate positions
and extended upwardly or downwardly from the heat sink to form a
downward diversion channel, so that when a horizontal airflow of a
wind source is blown sideway into the heat sink, horizontal and
downward airflows are produced for dissipating the heat from an
electronic device and its surrounding.
[0008] To achieve the foregoing objective, the present invention
provides a bidirectional heat dissipation structure installed onto
an electronic device and having a wind source disposed on a side of
the bidirectional heat dissipation structure, and the bidirectional
heat dissipation structure comprises: a base, disposed on the
electronic device; a plurality of heat pipes, extended in a
direction from the base; and a heat sink, having a plurality of
cooling fins, each cooling fin sequentially passing through the
heat pipes, and stacked with each other above the base, and the
cooling fin having a plurality of through holes for passing the
heat pipes, and the cooling fin having at least one guide slat;
thereby a horizontal diversion channel is formed between the
cooling fins when the bidirectional heat dissipation structure is
assembled, and the guide slats form a downward diversion channel
between the cooling fins; and the wind source supplies wind from a
lateral side, and a portion of wind current dissipates heat through
the horizontal diversion channel, and the other portion of the wind
current blows downwardly to dissipate heat of the electronic device
through the downward diversion channel.
[0009] Wherein, the base includes a plurality of grooves
corresponsive to the heat pipes and the grooves parallelly and
transversally penetrate a side of the base. The heat pipes are
substantially U-shaped with the central position disposed in the
grooves respectively, so that both ends of each heat pipe are
vertically erected from the base.
[0010] Wherein, each of the through holes has a circular flange
disposed around the through hole to facilitate the assembling
process, not only providing a partitioning structure for the
assembling, but also providing an effective support to enhance the
stability of the assembly.
[0011] Similarly, the cooling fin has a baffle plate disposed on a
side of the cooling fin to facilitate the assembling process, and
the baffle plate is installed between the two cooling fins and
forms a whole plane after the assembling. In addition, each guide
slat has a predetermined included angle with respect to each baffle
plate, wherein the predetermined included angle falls within a
range from 30.degree. to 89.degree., so that when the horizontal
airflow enters, an air collecting structure is formed; or each
guide slat has a predetermined gap from each baffle plate for
passing a portion of the horizontal airflow to adjust the back
pressure during use.
[0012] It is noteworthy that, the guide slat of each cooling fin is
an arc sheet structure or a rectangular sheet structure, and the
guide slat is extended in a direction (upwardly or downwardly)
towards a side of the cooling fin and an included angle is defined
between the guide slat and the cooling fin.
[0013] To improve the smooth air discharge of the downward
diversion channel, each cooling fin has at least one penetrating
hole formed at a lateral edge of the guide slat and communicated
with the downward diversion channel, so that the other portion of
the wind current is blown downwardly through the downward diversion
channel and the penetrating holes for dissipating heat around the
electronic device.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a perspective view of a preferred embodiment of
the present invention;
[0015] FIG. 2 is a perspective exploded view of a preferred
embodiment of the present invention;
[0016] FIG. 3 is a schematic view of an application status of a
preferred embodiment of the present invention;
[0017] FIG. 4 is a perspective view of another implementation of a
preferred embodiment of the present invention;
[0018] FIG. 5 is a perspective exploded view of another
implementation of a preferred embodiment of the present
invention;
[0019] FIG. 6 is a schematic view showing the structure of a
cooling fin in a reverse side in accordance with another
implementation of a preferred embodiment of the present
invention;
[0020] FIG. 7 is a schematic view of an application in accordance
with another implementation of a preferred embodiment of the
present invention;
[0021] FIG. 8 is a first schematic view, showing the flow of a wind
current in accordance with another implementation of a preferred
embodiment of the present invention; and
[0022] FIG. 9 is a second schematic view, showing the flow of a
wind current in accordance with another implementation of a
preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] The technical contents of the present invention will become
apparent with the detailed description of preferred embodiments and
the illustration of related drawings as follows.
[0024] With reference to FIGS. 1 and 2 for a perspective view and a
perspective exploded view of a preferred embodiment of the present
invention respectively, a bidirectional heat dissipation structure
1 of the invention is provided and installed to an electronic
device 2, and a wind source 3 is disposed on a side of the
bidirectional heat dissipation structure 1. The bidirectional heat
dissipation structure 1 comprises a base 11, a plurality of heat
pipes 12 and a heat sink 14 having a plurality of the cooling fins
13.
[0025] The base 11 is made of a thermally conductive metal such as
aluminum or copper, and cast or punched to form a rectangular block
structure and a side of the base 11 can be mounted on the
electronic device 2. In addition, the base 11 has a plurality of
grooves 111 corresponsive to the heat pipes 12 respectively and the
grooves 111 penetrate through a side of the base 11 parallelly and
transversely. It is noteworthy that the width of the groove 111 is
flexible and can be changed according to the requirement of
containing one heat pipe 12 or a plurality of parallelly installed
heat pipes 12.
[0026] Each of the heat pipes 12 is U-shaped, with the central
position disposed in the grooves 111 respectively, so that both
ends of each heat pipe 12 are vertically erected from the base 11.
In other words, the heat pipes are extended upwardly from the base
11.
[0027] The cooling fins 13 are made of a thermally conductive metal
such as aluminum or copper and punched to produce a plurality of
plate structures, and each cooling fin 13 has a plurality of
through holes 131 for passing the heat pipes 12 respectively, and
both windward sides of each cooling fin 13 are bent into guide
slats 132 respectively, wherein both guide slats 132 are extended
upwardly or both guide slats 132 are extended downwardly, and the
cooling fins 13 are sequentially passed and installed onto the heat
pipes 12 to form a structure of the cooling fins stacked with each
other above the base 11. It is noteworthy that when each guide slat
132 is extended in a direction from the cooling fin 13, an included
angle is defined, wherein the included angle is smaller than 90
degrees.
[0028] During assembling, a horizontal diversion channel 136 is
formed between the cooling fins 13, and after the guide slats 132
are stacked and installed, a downward diversion channel137 is
formed between both windward sides of the cooling fins 13. During
the use of this invention, the wind source 3 is disposed on a side
of the bidirectional heat dissipation structure 1 and capable of
blowing wind from a lateral side, wherein a portion of the wind
current can dissipate heat from surfaces of the cooling fins 13
through the horizontal diversion channel136, and the other portion
of the wind current is induced by the guide slats and then blown
directly downward through the downward diversion channel137, so as
to achieve the effect of dissipating the heat of the electronic
device 2.
[0029] With reference to FIGS. 4 to 7 for perspective views of
another implementation, a schematic view of a heat sink 14 in a
reverse side, and a schematic view of an application in accordance
with another implementation of a preferred embodiment of the
present invention respectively, each of the through holes 131 has a
circular flange 133 disposed around the through hole 131 and
provided for the partitioning and fixing functions during the
assembling process of stacking the cooling fins 13, so that the
cooling fins 13 have an appropriate partition space from one
another to form the horizontal diversion channel136. In FIGS. 7 and
8, each cooling fin 13 has a baffle plate 134 for blocking airflow
to prevent the airflow from escaping in a particular direction, or
the baffle plate 134 can be used to assist forming the horizontal
diversion channel136. The baffle plate 134 is installed between two
adjacent cooling fins 13. In this preferred embodiment, the baffle
plate 134 is extended in a direction from both edges, but the
invention is not limited to such arrangement only. Each guide slat
132 has a predetermined included angle with respect to each baffle
plate 134, wherein the predetermined included angle falls within a
range from 30.degree. to 89.degree., and each guide slat 132 has a
predetermined gap from each baffle plate 134 to form a part of the
horizontal diversion channel136. To improve the circulation
efficiency of the downward diversion channel137, each cooling fin
13 has a pair of penetrating holes 135 formed at positions
corresponding to an edge of the guide slat 132 and communicated
with the downward diversion channel137, so that the other portion
of the wind current can be blown downwardly through the downward
diversion channel137 and the penetrating holes 135 to dissipate the
heat around the electronic device 2. It is noteworthy that each
guide slat 132 is made into an arc sheet structure or a rectangular
sheet structure. As shown in FIG. 7, each guide slat 132 is
substantially an arc sheet structure.
[0030] With reference to FIG. 8 for the first schematic view,
showing the flow of a wind current in accordance with another
implementation of a preferred embodiment of the present invention,
the wind current flows along each baffle plate 134 and enters the
horizontal diversion channel136, and a portion of the wind current
passes through the predetermined gap, while colliding with the
guide slats 132 to produce rotations and flow downwardly through
the penetrating holes 135, so as to form a downwardly blown
vortex-like wind current. In this preferred embodiment, the baffle
plate 134 can be bent into an L-shape, and the baffle plate 134 can
be in a plate form (as shown in FIG. 9). However, the invention is
not limited to such arrangements only.
[0031] With reference to FIG. 9 for the second schematic view,
showing the flow of a wind current in accordance with another
implementation of a preferred embodiment of the present invention,
if there is no predetermined gap or a smaller predetermine gap
between each guide slat 132 and each baffle plate 134, a
substantially sealed partition is formed, and an acute angle is
formed on a side of the partition (which is the junction between
the guide slat 132 and the baffle plate 134), so that after the
wind current is blocked by each guide slat 132 and each baffle
plate 134, the wind current is blown downwardly from the
penetrating holes 135 to produce a straight wind current blowing
downwardly. Both of the aforementioned downwardly blown wind
currents can achieve the effect of dissipating the heat generated
by the electronic device 2.
* * * * *