Heat Dissipaion Device And Thermal Module Using Same

Chiu; Tzu-Chin

Patent Application Summary

U.S. patent application number 13/612877 was filed with the patent office on 2014-03-13 for heat dissipaion device and thermal module using same. This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. The applicant listed for this patent is Tzu-Chin Chiu. Invention is credited to Tzu-Chin Chiu.

Application Number20140069614 13/612877
Document ID /
Family ID50232042
Filed Date2014-03-13

United States Patent Application 20140069614
Kind Code A1
Chiu; Tzu-Chin March 13, 2014

HEAT DISSIPAION DEVICE AND THERMAL MODULE USING SAME

Abstract

A heat dissipation device and a thermal module using same are disclosed. The heat dissipation device includes at least one water block, a heat exchanger, a first metal tube and a second metal tube, and the water block and the heat exchanger are connected to one another by the first and second metal tubes. The thermal module includes, in addition to the heat dissipation device, a pump unit connected to the heat exchanger of the heat dissipation device, and a cooling fluid filled in the heat dissipation device and the pump unit. By connecting the water block to the heat exchanger via the first and second metal tubes, it is able to effectively prevent the problem of cooling fluid leakage.


Inventors: Chiu; Tzu-Chin; (New Taipei City, TW)
Applicant:
Name City State Country Type

Chiu; Tzu-Chin

New Taipei City

TW
Assignee: ASIA VITAL COMPONENTS CO., LTD.
New Taipei City
TW

Family ID: 50232042
Appl. No.: 13/612877
Filed: September 13, 2012

Current U.S. Class: 165/104.13 ; 165/104.19
Current CPC Class: F28D 15/00 20130101; H01L 2924/0002 20130101; F28D 2021/0031 20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/473 20130101
Class at Publication: 165/104.13 ; 165/104.19
International Class: F28D 15/00 20060101 F28D015/00

Claims



1. A heat dissipation device, comprising: at least one water block internally defining a first receiving space and being provided with a first inlet and a first outlet, and the first inlet and outlet being communicable with the first receiving space; a heat exchanger including at least one hollow container and at least one heat dissipation element; the hollow container internally defining a second receiving space and being provided with a first inlet port, a first outlet port, a second inlet port and a second outlet port; the first inlet and outlet ports as well as the second inlet and outlet ports being communicable with the second receiving space, and the heat dissipation element being attached to the hollow container; a first metal tube having two ends separately connected to the first outlet of the water block and the first inlet port of the heat exchanger; and a second metal tube having two ends separately connected to the first inlet of the water block and the first outlet port of the heat exchanger.

2. The heat dissipation device as claimed in claim 1, wherein the first and the second metal tube are made of a material selected from the group consisting of a copper material and an aluminum material.

3. The heat dissipation device as claimed in claim 1, wherein the second inlet port and the second outlet port of the heat exchanger respectively have a quick coupler connected thereto.

4. The heat dissipation device as claimed in claim 1, wherein the heat dissipation element is selected from the group consisting of a heat sink, a radiating fin assembly, and a cooling fan.

5. The heat dissipation device as claimed in claim 1, wherein the two ends of the first metal tube are connected to the first outlet of the water block and the first inlet port of the heat exchanger by way of ultrasonic welding; and the two ends of the second metal tube are connected to the first inlet of the water block and the first outlet port of the heat exchanger by way of ultrasonic welding.

6. The heat dissipation device as claimed in claim 1, wherein the first receiving space defined in the water block has a plurality of radiating fins provided therein.

7. The heat dissipation device as claimed in claim 1, wherein the water block has at least one side being a heat-absorbing side.

8. The heat dissipation device as claimed in claim 1, wherein the second receiving space defined in the hollow container of the heat exchanger is further divided into a first water chamber and a second water chamber.

9. A thermal module, comprising: a heat dissipation device including: at least one water block internally defining a first receiving space and being provided with a first inlet and a first outlet, and the first inlet and outlet being communicable with the first receiving space; a heat exchanger including at least one hollow container and at least one heat dissipation element; the hollow container internally defining a second receiving space and being provided with a first inlet port, a first outlet port, a second inlet port and a second outlet port; the first inlet and outlet ports as well as the second inlet and outlet ports being communicable with the second receiving space, and the heat dissipation element being attached to the hollow container; a first metal tube having two ends separately connected to the first outlet of the water block and the first inlet port of the heat exchanger; and a second metal tube having two ends separately connected to the first inlet of the water block and the first outlet port of the heat exchanger; a pump unit being internally provided with a water guide way and a first pump impeller, and externally provided with a water outlet port and a water inlet port; the water outlet port and the water inlet port being communicable with the water guide way; the first pump impeller being mounted in the water guide way; and the water outlet port and the water inlet port being connected to the second inlet port and the second outlet port, respectively, of the heat exchanger of the heat dissipation device; and a cooling fluid being filled in the heat dissipation device and the pump unit.

10. The thermal module as claimed in claim 9, wherein the first and the second metal tube are made of a material selected from the group consisting of a copper material and an aluminum material.

11. The thermal module as claimed in claim 9, wherein the second inlet port and the second outlet port of the heat exchanger respectively have a quick coupler connected thereto.

12. The thermal module as claimed in claim 9, wherein the heat dissipation element is selected from the group consisting of a heat sink, a radiating fin assembly, and a cooling fan.

13. The thermal module as claimed in claim 9, wherein the two ends of the first metal tube are connected to the first outlet of the water block and the first inlet port of the heat exchanger by way of ultrasonic welding; and the two ends of the second metal tube are connected to the first inlet of the water block and the first outlet port of the heat exchanger by way of ultrasonic welding.

14. The thermal module as claimed in claim 9, wherein the first receiving space defined in the water block has a plurality of radiating fins provided therein.

15. The thermal module as claimed in claim 9, wherein the water block has at least one side being a heat-absorbing side.

16. The thermal module as claimed in claim 9, wherein the pump unit further includes a second pump impeller mounted in the water guide way.

17. The thermal module as claimed in claim 9, wherein the second receiving space defined in the hollow container of the heat exchanger is further divided into a first water chamber and a second water chamber.
Description



FIELD OF THE INVENTION

[0001] The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device that eliminates the problem of cooling fluid leakage. The present invention also relates to a thermal module using the above-described heat dissipation device.

BACKGROUND OF THE INVENTION

[0002] While the currently available various electronic devices have constantly enhanced computing power, the heat produced by their internal electronic elements during operation also increases. Usually, a heat sink or a plurality of radiating fins are attached to the electronic elements to provide increased heat dissipation surface area and upgraded heat dissipation effect. However, the use of the heat sink and the radiating fins to radiate heat can only provide very limited heat dissipation effect. Thus, liquid-cooling thermal modules are also employed in an attempt to provide enhanced heat dissipation effect.

[0003] A liquid-cooling thermal module uses a cooling fluid to dissipate the heat from a heat source. The liquid-cooling thermal module includes a water block in contact with the heat source to absorb and transfer heat, a water tank unit for storing the cooling fluid, and a pump and a heat exchanger for pressurizing the cooling fluid and enabling heat exchange via circulation of the cooling fluid in the thermal module. The water block, the water tank unit, the pump and the heat exchanger are serially connected to one another by tubes to enable heat exchange via the circulation of the cooling fluid. While the liquid-cooling thermal module can provide upgraded heat dissipation effect, the cooling fluid tends to leak at joints between the tubes and the water block, the water tank unit, the pump and the heat exchanger. Since the liquid-cooling thermal module is in direct contact with the heat sources and electronic elements in an electronic device, the cooling fluid leaked out of the thermal module would undesirably damage the electronic device. It is therefore very important and urgent to solve the problem of having cooling fluid leaking out of the thermal module.

SUMMARY OF THE INVENTION

[0004] A primary object of the present invention is to provide a heat dissipation device and a thermal module using same that overcome the problem of having cooling fluid leaking therefrom.

[0005] To achieve the above and other objects, the heat dissipation device according to an embodiment of the present invention includes at least one water block, a heat exchanger, a first metal tube, and a second metal tube.

[0006] The water block internally defines a first receiving space and is provided with a first inlet and a first outlet, which are communicable with the first receiving space. The heat exchanger includes at least one hollow container and at least one heat dissipation element; the hollow container internally defines a second receiving space and is provided with a first inlet port, a first outlet port, a second inlet port and a second outlet port, which are communicable with the second receiving space; and the heat dissipation element is attached to the hollow container. The first metal tube has two ends separately connected to the first outlet of the water block and the first inlet port of the heat exchanger; and the second metal tube has two ends separately connected to the first inlet of the water block and the first outlet port of the heat exchanger.

[0007] To achieve the above and other objects, the thermal module according to an embodiment of the present invention includes a heat dissipation device, a pump unit, and a cooling fluid.

[0008] The heat dissipation device includes at least one water block, a heat exchanger, a first metal tube, and a second metal tube. The water block internally defines a first receiving space and is provided with a first inlet and a first outlet, which are communicable with the first receiving space. The heat exchanger includes at least one hollow container and at least one heat dissipation element; the hollow container internally defines a second receiving space and is provided with a first inlet port, a first outlet port, a second inlet port and a second outlet port, which are communicable with the second receiving space; and the heat dissipation element is attached to the hollow container. The first metal tube has two ends separately connected to the first outlet of the water block and the first inlet port of the heat exchanger; and the second metal tube has two ends separately connected to the first inlet of the water block and the first outlet port of the heat exchanger.

[0009] The pump unit is internally provided with a water guide way and at least a first pump impeller, and externally provided with a water outlet port and a water inlet port communicating with the water guide way. The first pump impeller is mounted in the water guide way; and the water outlet port and the water inlet port are connected to the second inlet port and the second outlet port, respectively, of the heat exchanger of the heat dissipation device.

[0010] The cooling fluid is filled in the heat dissipation device and the pump unit.

[0011] With the structural design of the present invention, it is able to effectively prevent the cooling fluid from leaking out of the heat dissipation device and the thermal module and accordingly ensure extended service life of the thermal module.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

[0013] FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation device according to the present invention;

[0014] FIG. 2 is an assembled sectional view of FIG. 1;

[0015] FIG. 3 is an assembled perspective view of a heat exchanger for a second embodiment of the heat dissipation device according to the present invention;

[0016] FIG. 4 is an exploded perspective view of a first embodiment of a thermal module according to the present invention;

[0017] FIG. 5 is an assembled sectional view of FIG. 4;

[0018] FIG. 6 is a sectional view of a pump unit for a second embodiment of the thermal module according to the present invention; and

[0019] FIG. 7 is a partially exploded perspective view of a third embodiment of the thermal module according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.

[0021] Please refer to FIGS. 1 and 2 that are exploded perspective view and assembled sectional view, respectively, of a first embodiment of a heat dissipation device 1 according to the present invention. As shown, the heat dissipation device 1 in the first embodiment thereof includes at least one water block 11, a heat exchanger 12, a first metal tube 13, and a second metal tube 14.

[0022] The water block 11 internally defines a first receiving space 111 and is provided with a first inlet 112 and a first outlet 113, both of which are communicable with the first receiving space 111. The water block 11 is made of a material with good heat conducting ability. At least one side of the water block 11 is a heat-absorbing side 114 for directly contacting with a heat source 2, so that heat from the heat source 2 can be directly transferred to the water block 11 via the heat-absorbing side 114 thereof. The material with good heat conducting ability for making the water block 11 may be a copper material, an aluminum material, or any other suitable metal material. Further, a plurality of radiating fins 115 is provided in the first receiving space 111 of the water block 11.

[0023] The heat exchanger 12 includes at least one hollow container 121 and at least one heat dissipation element 122. The hollow container 121 internally defines a second receiving space 1211 and is provided with a first inlet port 1212, a first outlet port 1213, a second inlet port 1214, and a second outlet port 1215. The second receiving space 1211 is further divided into a first water chamber 1211a and a second water chamber 1211b. The first outlet port 1213 and the second inlet port 1214 are communicable with the first water chamber 1211a, while the first inlet port 1212 and the second outlet port 1215 are communicable with the second water chamber 1211b. The heat dissipation element 122 can be a cooling fan, a heat sink or a radiating fin assembly, and is attached to the hollow container 121. While the heat dissipation element 122 illustrated in the first embodiment of the heat dissipation device 1 is a cooling fan, it is understood the heat dissipation element 122 for the present invention is not necessarily limited to the cooling fan.

[0024] The first metal tube 13 has two ends separately connected to the first outlet 113 on the water block 11 and the first inlet port 1212 on the heat exchanger 12; and the second metal tube 14 has two ends separately connected to the first inlet 112 on the water block 11 and the first outlet port 1213 on the heat exchanger 12.

[0025] The ends of the first metal tube 13 are connected to the first outlet 113 on the water block 11 and the first inlet port 1212 on the heat exchanger 12 as well as the ends of the second metal tube 14 are connected to the first inlet 112 on the water block 11 and the first outlet port 1213 on the heat exchanger 12 by ultrasonic welding.

[0026] Please refer to FIG. 3 that is an assembled perspective view of a heat exchanger 12 for a second embodiment of the heat dissipation device according to the present invention. As shown, while the heat exchanger 12 for the second embodiment of the heat dissipation device is generally structurally similar to that for the first embodiment, the second inlet port 1214 and the second outlet port 1215 thereof respectively have a quick coupler 3 connected thereto.

[0027] FIGS. 4 and 5 are exploded perspective view and assembled sectional view, respectively, of a first embodiment of a thermal module 4 according to the present invention. As shown, the thermal module 4 in the first embodiment thereof includes a heat dissipation device 1, a pump unit 5, and a cooling fluid 6.

[0028] The heat dissipation device 1 includes at least one water block 11, a heat exchanger 12, a first metal tube 13, and a second metal tube 14. Since the heat dissipation device 1 included in the thermal module 4 is structurally identical to the heat dissipation device 1 previously described with reference to FIGS. 1, 2 and 3, it is not repeatedly discussed herein.

[0029] The pump unit 5 is internally provided with a water guide way 51 and a first pump impeller 54, and externally provided with a water outlet port 52 and a water inlet port 53, which are communicable with the water guide way 51. The first pump impeller 54 is mounted in the water guide way 51. The water outlet port 52 and the water inlet port 53 are connected to the second inlet port 1214 and the second outlet port 1215, respectively, of the heat exchanger 12 of the heat dissipation device 1.

[0030] The cooling fluid 6 is filled in the heat dissipation device 1 and the pump unit 5.

[0031] FIG. 6 is a sectional view of a pump unit 5 for a second embodiment of the thermal module according to the present invention. The thermal module in the second embodiment is generally structurally similar to that in the first embodiment, except that the pump unit 5 in the second embodiment further includes a second pump impeller 55. The second pump impeller 55 is also mounted in the water guide way 51. In the event the first pump impeller 54 is failed, the second pump impeller 55 can be actuated to keep the pump unit 5 working.

[0032] FIG. 7 is a partially exploded perspective view of a third embodiment of the thermal module 4 according to the present invention. The thermal module 4 of the present invention in the third embodiment thereof is applied to a server apparatus 7, which includes a plurality of rack servers 71, and the rack servers 71 respectively have a plurality of heat sources 711. The thermal module 4 is provided in each of the rack servers 71 with one water block 11 correspondingly attached to each of the heat sources 711 for transferring heat. The rack servers 71 respectively have a quick-plug slot 712, into and from which one pump unit 5 can be correspondingly plugged and unplugged. Since the water outlet port 52 and the water inlet port 53 of the pump unit 5 are respectively provided with a quick coupler 3 for quickly connecting to the second inlet port 1214 and the second outlet port 1215 on the heat exchanger 12, immediate and quick replacement of a failed pump unit 5 can be achieved.

[0033] The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

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