U.S. patent application number 13/957865 was filed with the patent office on 2014-02-27 for pattern forming device and pattern forming method.
This patent application is currently assigned to JTEKT CORPORATION. The applicant listed for this patent is JTEKT CORPORATION. Invention is credited to Kazuaki MATSUO, Boyko STOIMENOV, Masahiro SUZUKI, Kazuyoshi YAMAKAWA.
Application Number | 20140054176 13/957865 |
Document ID | / |
Family ID | 49028916 |
Filed Date | 2014-02-27 |
United States Patent
Application |
20140054176 |
Kind Code |
A1 |
STOIMENOV; Boyko ; et
al. |
February 27, 2014 |
PATTERN FORMING DEVICE AND PATTERN FORMING METHOD
Abstract
A pattern forming device includes a plurality of tanks, and a
power supply device. Each of the tanks has an open end having the
same shape as a profile shape of a corresponding one of regions of
a surface of a workpiece, in which different types of films are to
be formed, and stores a corresponding one of electrodeposition
solutions used to form the different types of films in a state
where the open end is in contact with the surface. The power supply
device applies a predetermined voltage to between the workpiece
that serves as a first electrode, and each one of second electrodes
in the tanks.
Inventors: |
STOIMENOV; Boyko;
(Kashiba-shi, JP) ; YAMAKAWA; Kazuyoshi;
(Nishinomiya-shi, JP) ; SUZUKI; Masahiro;
(Kashiba-shi, JP) ; MATSUO; Kazuaki;
(Kashiwara-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
JTEKT CORPORATION |
Osaka |
|
JP |
|
|
Assignee: |
JTEKT CORPORATION
Osaka
JP
|
Family ID: |
49028916 |
Appl. No.: |
13/957865 |
Filed: |
August 2, 2013 |
Current U.S.
Class: |
205/118 ;
204/267 |
Current CPC
Class: |
C25D 17/00 20130101;
C25D 17/12 20130101; C25D 5/02 20130101; C25D 13/22 20130101; C25D
17/02 20130101; C25D 17/004 20130101 |
Class at
Publication: |
205/118 ;
204/267 |
International
Class: |
C25D 5/02 20060101
C25D005/02 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 22, 2012 |
JP |
2012-183261 |
Claims
1. A pattern forming device that forms, by electrodeposition,
different types of films in corresponding multiple regions of a
surface of a workpiece to obtain a predetermined film pattern from
the films, the pattern forming device comprising: a plurality of
tanks each of which has an open end having the same shape as a
profile shape of a corresponding one of the regions in which the
different types of films are to be formed, and each of which stores
a corresponding one of electrodeposition solutions used to form the
different types of films in a state where the open end is in
contact with the surface; and a power supply device that applies a
predetermined voltage to between the workpiece that serves as a
first electrode, and each one of second electrodes in the
tanks.
2. The pattern forming device according to claim 1, wherein the
power supply device applies the voltage to between the first
electrode and the second electrodes in the tanks at the same
time.
3. The pattern forming device according to claim 1, further
comprising: sealing portions that prevent leakage of the
electrodeposition solutions in the tanks from between the surface
of the workpiece and the open ends of the tanks in the state where
the open ends are in contact with the surface of the workpiece.
4. The pattern forming device according to claim 2, further
comprising: sealing portions that prevent leakage of the
electrodeposition solutions in the tanks from between the surface
of the workpiece and the open ends of the tanks in the state where
the open ends are in contact with the surface of the workpiece.
5. The pattern forming device according to claim 1, wherein inner
wall surfaces of the tanks at least partially serve as the second
electrodes.
6. The pattern forming device according to claim 2, wherein inner
wall surfaces of the tanks at least partially serve as the second
electrodes.
7. The pattern forming device according to claim 3, wherein inner
wall surfaces of the tanks at least partially serve as the second
electrodes.
8. The pattern forming device according to claim 4, wherein inner
wall surfaces of the tanks at least partially serve as the second
electrodes.
9. A pattern forming method for forming, by electrodeposition,
different types of films in corresponding multiple regions of a
surface of a workpiece to obtain a predetermined film pattern from
the films, the method characterized by comprising: bringing each of
a plurality of tanks having an open end having the same shape as a
profile shape of a corresponding one of the regions of the surface
of the workpiece, in which the different types of films are to be
formed, into contact with a corresponding one of the regions;
storing electrodeposition solutions used to form the different
types of films in the corresponding tanks; and applying a voltage
to between the workpiece that serves as a first electrode, and each
one of second electrodes in the tanks.
Description
INCORPORATION BY REFERENCE
[0001] The disclosure of Japanese Patent Application No.
2012-183261 filed on Aug. 22, 2012 including the specification,
drawings and abstract, is incorporated herein by reference in its
entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a pattern forming device and a
pattern forming method each for forming, by electrodeposition,
different types of films in corresponding multiple regions of a
surface of a workpiece to obtain a predetermined film pattern on
the surface of the workpiece from these films.
[0004] 2. Description of Related Art
[0005] In order to reduce frictional resistance on a surface of a
metal workpiece, for example, a film of a resin is formed on the
surface in some cases. As a method for forming such a film,
electrodeposition is known. Specifically, as illustrated in FIG. 7,
a workpiece 92 and a counter electrode 93 are placed in a tank 91
filled with an electrodeposition solution (electrolyte solution) 90
containing a resin component, and a direct-current voltage is
applied to the workpiece 92 and the counter electrode 93, so that
the resin component contained in the electrodeposition solution 90
is deposited on a surface of the workpiece 92 to form a film from
the resin. A device for forming a film on a surface of a workpiece
by electrodeposition is described in, for example, Japanese Patent
Application Publication No. 2000-256895 (JP2000-256895 A) (see FIG.
1).
[0006] Further, as illustrated in FIG. 8, in a case where different
types of films are formed, by electrodeposition, in corresponding
multiple regions of a surface of a workpiece 95 to obtain a
predetermined film pattern from these films, masks are
conventionally used, as described below. As shown in FIG. 8, the
surface of the plate-like workpiece 95 is partitioned into nine
regions A1 to A9. A first film is formed in each of the regions A2,
A4, A6, A8. A second film different in type from the first film is
formed in each of the regions A1, A9. A third film different in
type from the first film and the second film is formed in each of
the regions A3, A7. A fourth film different in type from the first,
second, and third films is formed in the region A5.
[0007] In a case where such a film pattern is formed, first, a
workpiece and a counter electrode are placed in a tank filled with
an electrodeposition solution used to form the first film. Note
that a grid mask M1 is disposed on a surface of the workpiece as
illustrated in FIG. 9A. Then, a direct-current voltage is applied
to the workpiece and the counter electrode, so that the first film
is formed in each of the regions A2, A4, A6, A8, which are not
covered with the mask M1 (see FIG. 9B). Subsequently, the
workpiece, on which the first film has been formed, and the counter
electrode are placed in a tank filled with an electrodeposition
solution used to form the second film. Note that the mask used to
cover the surface of this workpiece is replaced with another mask
M2, as illustrated in FIG. 9C. In this way, the second film is
formed in each of the regions A1, A9, which are not covered with
the mask M2 (see FIG. 9D).
[0008] Similarly, the workpiece, on which the mask has been
replaced with a mask M3 (see FIG. 9E), is placed in a tank filled
with an electrodeposition solution used to form the third film in
each of the regions A3, A7 (FIG. 9F). Furthermore, the workpiece
covered with a mask M4 (see FIG. 9G) is placed in a tank filled
with an electrodeposition solution used to form the fourth film, so
that the fourth film is formed in the region A5 (FIG. 9H).
[0009] As described above, in order to form the different types of
films by electrodeposition in the corresponding multiple regions A1
to A9 of the surface of the workpiece to obtain a predetermined
film pattern from these films, it is necessary to perform the
electrodeposition treatment several times by sequentially placing
the workpiece in the tanks respectively filled with the different
types of electrodeposition solutions. Further, it is necessary to
change the mask used to cover the workpiece every time the
treatment is performed. Therefore, the conventional method causes a
problem that both the number of man-hours and the product cost
increase.
SUMMARY OF THE INVENTION
[0010] One object of the invention is to provide a pattern forming
device and a pattern forming method that make it possible to reduce
man-hours needed to form different types of films by
electrodeposition in corresponding multiple regions of a surface of
a workpiece to obtain a predetermined film pattern from these
films.
[0011] An aspect of the invention relates to a pattern forming
device that forms, by electrodeposition, different types of films
in corresponding multiple regions of a surface of a workpiece to
obtain a predetermined film pattern from the films. The pattern
forming device includes: a plurality of tanks each of which has an
open end having the same shape as a profile shape of a
corresponding one of the regions in which the different types of
films are to be formed, and each of which stores a corresponding
one of electrodeposition solutions used to form the different types
of films in a state where the open end is in contact with the
surface; and a power supply device that applies a predetermined
voltage to between the workpiece that serves as a first electrode,
and each one of second electrodes in the tanks.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The foregoing and further features and advantages of the
invention will become apparent from the following description of
example embodiments with reference to the accompanying drawings,
wherein like numerals are used to represent like elements and
wherein:
[0013] FIG. 1 is a perspective view illustrating the schematic
configuration of a pattern forming device according to an
embodiment of the invention;
[0014] FIG. 2 is a view illustrating the state where tanks are
separated from a workpiece;
[0015] FIG. 3 is an explanatory view illustrating the state where
the tanks are turned upside down so that a contact portion faces
upward;
[0016] FIG. 4 is a sectional explanatory view of the tanks as
viewed from the front;
[0017] FIG. 5 is an explanatory view of a surface of the workpiece
on which a predetermined film pattern has been formed by the
pattern forming device;
[0018] FIG. 6 is a perspective view illustrating a schematic
configuration of a pattern forming device according to another
embodiment of the invention;
[0019] FIG. 7 is an explanatory view of a conventional device;
[0020] FIG. 8 is an explanatory view of a surface of a workpiece;
and
[0021] FIG. 9A to FIG. 9H are explanatory views for describing a
conventional pattern forming method.
DETAILED DESCRIPTION OF EMBODIMENTS
[0022] Hereinafter, an embodiment of the invention will be
described with reference to the accompanying drawings. FIG. 1 is a
perspective view illustrating the schematic configuration of a
pattern forming device according to the embodiment of the
invention. The pattern forming device is used to form, by
electrodeposition, different types of films in corresponding
multiple regions of a surface F of a workpiece W to obtain a
predetermined film pattern from these films. Note that the films
are formed on the surface of the workpiece W in order to, for
example, improve the abrasion resistance on the surface and to
reduce the frictional resistance. Further, the film pattern having
several types of films is formed so that the surface
characteristics vary from region to region in the surface F.
[0023] FIG. 5 is an explanatory view of the surface F of the
workpiece W, on which a predetermined film pattern has been
obtained by the pattern forming device according to the present
embodiment. In the present embodiment, the workpiece W is formed
from a metal plate, and the surface F is partitioned into multiple
regions in a grid pattern. The workpiece W has nine regions A1 to
A9. Note that the workpiece W serves as an electrode (first
electrode), which will be described later. Four types of films are
formed by electrodeposition on the surface F, so that a film
pattern formed of the four types of films is obtained. More
specifically, a first film S1 is formed in each of the regions A2,
A4, A6, A8. A second film S2 different in type from the first film
S1 is formed in each of the regions A1, A9. A third film S3
different in type from the first film S1 and the second film S2 is
formed in each of the regions A3, A7. A fourth film S4 different in
type from the first, second, and third films S1, S2, S3 is formed
in the region A5.
[0024] As shown in FIG. 1, the pattern forming device includes a
plurality of tanks 11 to 19. FIG. 2 is a view illustrating the
state where the tanks 11 to 19 are separated from the workpiece W.
As shown in FIG. 1 and FIG. 2, the number of the tanks included in
the pattern forming device is the same as the number of the regions
A1 to A9 of the surface F of the workpiece A, in which films are to
be formed, that is, the pattern forming device includes the nine
tanks 11 to 19. The pattern forming device is used in a state where
the workpiece W is arranged such that the surface F faces upward
and the tanks 11 to 19 are placed on the surface F. That is, each
of the tanks 11 to 19 is configured to be opened toward the surface
F (that is, opened at its lower end), and is used with its lower
end in contact with the surface F of the workpiece W. The inner
peripheral surface of each of the tanks has an elongate tubular
shape that extends in the up-down direction, and the lower ends of
the tanks 11 to 19 serve as a contact portion 9 that is brought
into contact with the surface F. The lower ends (open ends) of the
tanks 11 to 19 contact peripheral edges of the regions A1 to A9,
respectively.
[0025] FIG. 3 is an explanatory view illustrating the state where
the tanks 11 to 19 are turned upside down so that the contact
portion 9 faces upward. Open ends 21 to 29 of the tanks 11 to 19
have the same shapes as the profile shapes of the regions A1 to A9,
respectively. In the present embodiment, the profile shape of each
of the regions A1 to A9 is rectangular, and all the regions A1 to
A9 have the same shape. Therefore, all the open ends 21 to 29 have
the same rectangular shape. The open ends 21 to 29 serve as the
contact portion 9 that is brought into contact with the surface F
of the workpiece W. Further, the sectional shape of each of the
tanks 11 to 19 is constant in the longitudinal direction (up-down
direction). In the present embodiment, the tanks 11 to 19 are
formed as a single-piece member. That is, for example, an inner
wall surface 11 a of the tank 11 and an inner wall surface 12a of
the tank 12 adjacent to the tank 11 are formed of respective sides
of a single side wall.
[0026] The tanks 11 to 19 are able to store electrodeposition
solutions (electrolyte solutions) used to form different types of
films, respectively, with the open ends 21 to 29 in contact with
the surface F. FIG. 4 is a sectional explanatory view of the tanks
17, 18, 19 as viewed from the front. According to FIG. 4,
electrodeposition solutions L3, L1, L2, which are different in type
from each other, are stored in the tanks 17, 18, 19, respectively.
The internal space of each of the tanks 11 to 19 is independent of
the internal spaces of the other tanks, so that the
electrodeposition solutions do not mix with each other.
[0027] In FIG. 1, the electrodeposition solution L1 used to form
the first film S1 is stored in the tanks 12, 14, 16, 18 in the
present embodiment. The electrodeposition solution L2 used to form
the second film S2 is stored in the tanks 11, 19. The
electrodeposition solution L3 used to form the third film S3 is
stored in the tanks 13, 17. An electrodeposition solution L4 used
to form the fourth film S4 is stored in the tank 15. The
electrodeposition solutions L1 to L4 respectively contain different
resin components. Due to this, in the present embodiment, the films
S1 to S4 made from different types of resins are formed on the
surface F.
[0028] Although not illustrated, the tanks 11 to 19 may be
connected to server tanks via pipes, and the electrodeposition
solutions stored in the server tanks may be supplied to the
respective tanks 11 to 19 through the pipes.
[0029] Further, the pattern forming device includes sealing
portions 8 that prevents leakage of the electrodeposition solutions
(see FIG. 3 and FIG. 4). The sealing portions 8 are formed at the
open ends 21 to 29 of the tanks 11 to 19, which are brought into
contact with the surface F of the workpiece W. That is, the sealing
portions 8 are formed at the contact portion 9 of the tanks 11 to
19. The sealing portions 8 are made of rubber or resin, and formed
by bonding the resin to the open ends 21 to 29. With the use of the
sealing portions 8, it is possible to prevent leakage of the
electrodeposition solutions L1 to L4 in the tanks 11 to 19, from
between the surface F and the open ends 21 to 29, in a state where
the open ends 21 to 29 of the tanks 11 to 19 are in contact with
the surface F of the workpiece W.
[0030] Particularly, in the present embodiment, the multiple
regions A1 to A9 formed by partitioning the surface F of the
workpiece W include regions adjacent to each other (e.g., A7 and
A8). Thus, the tanks corresponding to these regions (the tank 17
and the tank 18, in FIG. 4) are placed so as to be adjacent to each
other. However, even in this case, it is possible to prevent the
electrodeposition solution L1 (L3) from leaking out and mixing with
the electrodeposition solution L3 (L1) in the adjacent tank.
[0031] Further, in the tanks 11 to 19, second electrodes 31 to 39
are provided as counter electrodes for the first electrode (the
workpiece W) (see FIG. 4). In the present embodiment, the
electrodes 31 to 39 are provided on the inner wall surfaces of the
tanks 11 to 19, respectively. That is, parts of the inner wall
surfaces of the tanks 11 to 19 serve as the second electrodes 31 to
39. Note that, as described above, the sealing portions 8 are
provided at the contact portions 9 of the tanks 11 to 19. The
sealing portions 8 are made of a non-conductive material, and
function as members that electrically insulate the tanks 11 to 19
from the workpiece W. In view of this, the inner wall surfaces of
the tanks 11 to 19 may entirely serve as the second electrodes.
That is, the tanks 11 to 19 may be made of a conductive
material.
[0032] The pattern forming device further includes a power supply
device 10 (see FIG. 1). The power supply device 10 applies a
predetermined direct-current voltage to between the workpiece W,
which serves as the first electrode, and each of the second
electrodes 31 to 39 in the tanks 11 to 19. Thus, in each of the
regions A1 to A9 of the surface F of the workpiece W, a film
different in type from those of its adjacent regions is formed, and
thus, a grid film pattern as illustrated in FIG. 5 is obtained.
Particularly, in the present embodiment, the power supply device 10
simultaneously applies the voltage to between the first electrode
(the workpiece W) and the second electrodes 31 to 39 in the tanks
11 to 19. Thus, electrodeposition treatments are performed at the
same time.
[0033] Next, description will be provided on a pattern forming
method for forming, with the use of the pattern forming device
having the aforementioned configuration, different types of films
in the corresponding multiple regions A1 to A9 of the surface F of
the workpiece W by electrodeposition to obtain a predetermined film
pattern from these films. As illustrated in FIG. 1 and FIG. 2, the
tanks 11 to 19 having the open ends 21 to 29 (see FIG. 3) with the
same shapes as the respective profile shapes of the regions A1 to
A9 are brought into contact with the regions A1 to A9 of the
surface F of the workpiece W, in which different types of films are
to be formed.
[0034] The electrodeposition solutions L1 to L4 used to form the
films S1 to S4 of different types are stored in the corresponding
tanks 11 to 19, and a direct-current voltage is applied, by the
power supply device 10, to between the workpiece W, which serves as
the first electrode, and each of the second electrodes 31 to 39 in
the tanks 11 to 19.
[0035] By applying the voltage as described above, the films S1 to
S4 of different types are formed in the regions A1 to A9 of the
surface F of the workpiece W, and the film pattern as illustrated
in FIG. 5 is obtained. Therefore, a conventional mask is no longer
necessary to form the films S1 to S4 of different types on the
surface F of the workpiece W. Thus, replacement of the mask is
unnecessary, which makes it possible to reduce man-hours required
to form a film pattern. As a result, it is possible to perform a
surface treatment on the workpiece W in a short time, thereby
making it possible to contribute to reduction in product cost.
[0036] Particularly, in the present embodiment, in a state where
the prescribed electrodeposition solutions L1 to L4 are stored in
the corresponding tanks 11 to 19, a voltage is simultaneously
applied to between each of the second electrodes 31 to 39 and the
first electrode (the workpiece W). Thus, it is possible to perform
electrodeposition on the regions A1 to A9 at the same time, thereby
forming the films S1 to S4 of different types at the same time.
[0037] In contrast to this, in a conventional technique, as
described above with reference to FIG. 9A to FIG. 9H, in order to
form several types of films in corresponding multiple regions,
multiple tanks filled with respective types of electrodeposition
solutions and multiple types of masks are required. It is necessary
to perform electrodeposition on a workpiece while changing the
tanks, and further, it is necessary to change the masks every time
the tank is changed. When the change of the masks and the
electrodeposition treatment are regarded as one step, it is
necessary to perform the step four times repeatedly in order to
form four types of the films S1 to S4. However, according to the
present embodiment, no masks are required, and further, by
performing the electrodeposition treatment on all the regions A1 to
A9 at the same time, it is possible to form the four types of films
S1 to S4 on the surface F of the workpiece W in a single step, that
is, in a short time.
[0038] Note that with regard to the control for the
electrodeposition treatment that is performed with the use of the
power supply device 10, the control may be executed such that the
same condition such as a voltage or a current is achieved in all
the tanks 11 to 19, or the control may be executed such that the
condition may vary among the tanks 11 to 19. The condition includes
at least one of a current, a voltage, and an application time. In
order to execute this control, the power supply device 10 includes
a controlling portion (not shown) for controlling the condition.
The controlling portion is a microcomputer including a CPU and an
internal memory.
[0039] For example, in the embodiment illustrated in FIG. 1, a
single power source is used to apply a predetermined voltage to
between the workpiece W, which serves as the first electrode, and
each of the second electrodes 31 to 39 in the tanks 11 to 19,
thereby performing the electrodeposition treatment with the same
parameter (e.g., a current, a voltage) and in the same process
(e.g., an application time). However, in another embodiment of the
invention, each one of the tanks may be provided with one power
source (see FIG. 6). In the case in FIG. 6, the tanks 11 to 19 are
provided with power sources V1 to V9, respectively. Therefore, it
is possible to perform the electrodeposition treatment while
changing the parameter and the process among the tanks 11 to 19.
Thus, even if the electrodeposition solutions stored in the tanks
11 to 19 have different characteristics, it is possible to perform
the electrodeposition treatment while changing at least one of the
parameter and the process depending on the characteristics.
[0040] The pattern forming device according to the invention is not
limited to the embodiments illustrated in the drawings, but may be
implemented in other embodiments within a scope of the invention.
For example, the workpiece W need not have a plate-like shape, but
may have a cylindrical or columnar shape. The regions formed by
partitioning the surface of the workpiece need not have a
rectangular shape, but may have other shapes such as a shape
including a curved portion, and the like. The tanks (open ends) may
be formed in conformity to profile shapes of these regions.
[0041] According to the invention, different types of films are
formed by electrodeposition in corresponding multiple regions of a
surface of a workpiece to obtain a predetermined film pattern from
these films. Therefore, unlike in the conventional technique, masks
are no longer necessary. As a result, it is not necessary to change
masks, thereby making it possible to reduce man-hours.
* * * * *