U.S. patent application number 13/969602 was filed with the patent office on 2014-02-27 for cooling plate and water cooling device having the same.
This patent application is currently assigned to ASUSTeK COMPUTER INC.. The applicant listed for this patent is ASUSTeK COMPUTER INC.. Invention is credited to Kuang-Yu CHANG, Ing-Jer CHIOU.
Application Number | 20140054009 13/969602 |
Document ID | / |
Family ID | 50146977 |
Filed Date | 2014-02-27 |
United States Patent
Application |
20140054009 |
Kind Code |
A1 |
CHANG; Kuang-Yu ; et
al. |
February 27, 2014 |
COOLING PLATE AND WATER COOLING DEVICE HAVING THE SAME
Abstract
A water cooling device includes a cooling plate and a water
cooling module. The cooling plate includes a plate and a wording
fluid. The plate includes vacuum enclosed space therein. The
wording fluid is accommodated in the enclosed space. The water
cooling module is connected to the cooling plate.
Inventors: |
CHANG; Kuang-Yu; (TAIPEI,
TW) ; CHIOU; Ing-Jer; (TAIPEI, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASUSTeK COMPUTER INC. |
Taipei |
|
TW |
|
|
Assignee: |
ASUSTeK COMPUTER INC.
Taipei
TW
|
Family ID: |
50146977 |
Appl. No.: |
13/969602 |
Filed: |
August 18, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61693337 |
Aug 27, 2012 |
|
|
|
Current U.S.
Class: |
165/104.11 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; F28F 3/046
20130101; F28D 15/0233 20130101; H01L 2924/00 20130101; H01L 23/473
20130101; F28D 15/00 20130101; F28F 3/00 20130101 |
Class at
Publication: |
165/104.11 |
International
Class: |
F28F 3/00 20060101
F28F003/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 29, 2013 |
TW |
102118977 |
Claims
1. A cooling plate, comprising: a plate including a vacuum enclosed
space; and a working fluid accommodated in the enclosed space.
2. The cooling plate according to claim 1, wherein an outside
surface of the plate which is at back of the enclosed space
includes a plurality of first concave-convex structures.
3. The cooling plate according to claim 2, wherein the first
concave-convex structure is one or a combination of a convex rib, a
groove, or a grid.
4. The cooling plate according to claim 1, wherein an inner surface
of the plate facing the enclosed space includes a plurality of
second concave-convex structures.
5. The cooling plate according to claim 4, wherein the second
concave-convex structure is one or a combination of the convex rib,
the groove, the grid.
6. A water cooling device, comprising: a cooling plate, including:
a plate including a vacuum enclosed space; and a working fluid
accommodated in the enclosed space; and a water cooling module
connected to the cold plate.
7. The water cooling device according to claim 6, wherein the water
cooling module includes: a cooling plate connector including a
cavity, wherein the cooling plate is in the cavity; a pump disposed
in the cavity; a beat exhaust pan; a first connecting pipe; a
second connecting pipe, wherein the second connecting pipe and the
first connecting pipe are connected between the cooling plate
connector and the heat exhaust part; and a cooling liquid
accommodated in the cavity, the heat exhaust part, the first
connecting pipe and the second connecting pipe.
8. The water cooling device according to claim 7, wherein an
outside surface of the plate contacting the cooling liquid includes
a plurality of first concave-convex structures.
9. The water cooling device according to claim 7, wherein the pump
is a constant speed pump or a variable frequency pump.
10. The water cooling device according to claim 6, wherein an inner
surface of the plate facing the enclosed space includes a plurality
of second concave-convex structures.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of U.S.
provisional application. Ser. No. 61/693,337 filed on Aug. 27, 2012
and Taiwan application serial no. 102118977, filed on May 29, 2013.
The entirety of the above-mentioned patent application are hereby
incorporated via reference herein and made a part of
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates to a cooling plate and a water
cooling device including the cooling plate.
[0004] 2. Description of the Related Art
[0005] Electronic components usually generates much heat in
operation, when the heat is not exhausted out effectively, the
electronic components may shut down or even may be burned down.
Commonly, a heat dissipating apparatus is disposed at an electronic
chip, a fan, a heat pipe, a heat sink with a fin, a cooling plate
or a water cooling module of the heat dissipating apparatus is used
to dissipate heat.
[0006] When assembling the cooling device, the heat sink can be
disposed at the surface of the chip to exhaust the heat out by
using the fan, the heat pipe or the water cooling module, The
cooling plate whose thickness is smaller than that of the heat sink
can be attached to the chip to generate a cooling effect, but the
cooling effect of the cooling plate is poor comparing with that of
the heat sink.
[0007] Moreover, the height of a conventional heat sink is thicker,
which cannot make an electronic device thinner. Although a
conventional cooling plate is thinner, it is made of a solid metal
plate, and the area of the conventional cooling plate contacting
with air is small, the heat of the chip is conducted to the cooling
plate only by heat conduction, the cooling plate cannot store heat,
and the cooling effect is limited.
BRIEF SUMMARY OF THE INVENTION
[0008] A cooling plate including a plate and a working fluid is
provided. A enclosed space is formed in the plate. The working
fluid is accommodated in the enclosed space.
[0009] A water cooling device including a cooling plate and a water
cooling module is provided. The cooling plate includes a plate and
a working fluid. A vacuum enclosed space is formed in the plate.
The working fluid is accommodated in the enclosed space. The water
cooling module is connected to the cooling plate.
[0010] Since the cooling plate includes the working fluid, and the
working fluid is accommodated in the enclosed space of the plate,
when the cooling plate is disposed at a heat source, the heat
generated by the heat source is not only conducted via the plate
but also absorbed via the working fluid in the plate, and the
cooling plate has the function of heat diffusion and heat storage.
Moreover, when the water cooling module is connected to the cooling
plate, the cooling plate and the working fluid are in a cavity of a
cooling plate connector to reduce the temperature of the cold
plate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a three-dimensional diagram showing a cooling
plate in one embodiment;
[0012] FIG. 2 is a sectional schematic diagram showing a cross
section of the cooling plate in FIG. 1 along a line 2-2;
[0013] FIG. 3 is a sectional schematic diagram showing that the
cooling plate in FIG. 2 is used at a heat source;
[0014] FIG. 4 is a three-dimensional diagram showing a cooling
plate in another embodiment;
[0015] FIG. 5 is a sectional schematic diagram showing a cross
section of the cooling plate in FIG. 4 along a line 5-5;
[0016] FIG. 6 is a sectional diagram showing that the cooling plate
in FIG. 5 is used at the heat source;
[0017] FIG. 7 is a exploded diagram showing a water cooling device
in one embodiment; and
[0018] FIG. 8 is a sectional diagram showing that the water cooling
device in FIG. 7 is used at the heat source.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] FIG. 1 is a three-dimensional diagram showing a cooling
plate in one embodiment. FIG. 2 is a sectional schematic diagram
showing a cross section of the cooling plate in FIG. 1 along a line
2-2. As shown in FIG. 1 and FIG. 2, the cooling plate 100 includes
a plate 110 and a working fluid 120. The plate 110 is a hollow
structure, and vacuumed enclosed space 112 is formed in the plate
110. The working fluid 120 is accommodated in the enclosed space
112. The plate 110 can be made of copper, aluminum or other mental
of high thermal conductivity. The working fluid 120 can be water or
alcohol, which is not limited herein.
[0020] In this embodiment, the enclosed space 112 may be vacuumized
by a vacuum process to make the boiling point of the working fluid
120 drop. The pressure range of the enclosed space 112 includes a
low vacuum (760 to 100 torr), a medium vacuum (100 to 1 torr), a
middle-high vacuum (1 to 10.sup.-3 torr) and a high vacuum
(10.sup.-3 to 10.sup.-7 torr). The pressure of the enclosed space
112 is adjusted according to the wattage of a heat source 310 or
the character of the working fluid. The using state of the cooling
plate 100 is illustrated hereinafter.
[0021] FIG. 3 is a sectional schematic diagram showing that the
cooling plate in FIG. 2 is used at the heat source 310. The heat
source 310 is disposed at the circuit board 320. The heat source
310 can be a central processing unit (CPU), a graphic chip or other
electronic element which can generate heat. When the cooling plate
100 is disposed at the heat source 310, the heat generated by the
heat source 310 can be conducted via the plate 110. The working
fluid 120 in the plate 110 absorbs the heat of the plate 110 to
have the phase transformation. The end of the cooling plate 100
which is near the heat source 310 is a high temperature side (such
as a downside of the cooling plate 100), the other end which is
away from the heat source 310 is a low temperature side (such as an
upside of the cooling plate 100).
[0022] For example, if the working fluid 120 is water, the liquid
water which is near an internal surface 122 is heated to the water
vapor, and the water vapor flows towards the internal surface 124
along a direction D1. Since the temperature of the inner surface
124 is lower than that of the inner surface 122, the water vapor is
condensed to the liquid water at the inner surface 124. When the
liquid water condensed at the inner surface 124 accumulates to a
certain volume, the liquid water drips towards the direction D2 to
back to the inner surface 122 due to gravity. Consequently, the
working fluid 120 can stabilize the temperature of the heat source
310 by changing the phase continually to avoid that the heat source
310 is overheated and damaged.
[0023] That is, the cooling plate 100 also has the ability of heat
storage, besides the ability of heat diffusion.
[0024] FIG. 4 is a three-dimensional diagram showing a cooling
plate 100a in another embodiment. FIG. 5 is a sectional schematic
diagram showing a cross section of the cooling plate 100a in FIG. 4
along a line 5-5. As shown in FIG. 4 and FIG. 5, the cooling plate
100a includes the plate 110 and the working fluid 120. Different
from the embodiments in FIG. 1, and FIG. 2, an outside surface 114
of the plate 110 which is at the back of the enclosed space 112
includes a plurality of first concave-convex structures 132, the
inner surface 122, 124 of the plate 110 which faces the enclosed
space 112 include a plurality of second concave-convex structures
134 and 136, respectively. The first concave-convex structure 132
and the second concave-convex structure 134,136 can be one or a
combination of a convex rib, a groove, and a grid. The first
concave-convex structure 132 and the second concave-convex
structure 134,136 are formed by processing the plate 110 (such as
stamping), or they also may be fixed at the plate 110 by welding or
gluing, which is not limited.
[0025] In the flowing, the using state of the cooling plate 100a is
illustrated.
[0026] FIG. 6 is a sectional diagram showing that the cooling plate
100a in FIG. 5 is used at the heat source 310. When the cooling
plate 100a is disposed at the heat source 310, the heat generated
by the heat source 310 is conducted by the plate 110. The working
fluid 120 in the plate 110 absorbs the heat of the plate 110 to
change the phase. In this embodiment, the second concave-convex
structure 134 can increase the area of the inner surface 122
contacting the working fluid 120 and enhance the efficiency of
conducting the heat from the part of the plate 110 which has high
temperature to the gaseous working fluid 120, and the evaporation
rate of the working fluid 120 is increased. Moreover, the second
concave-convex structure 136 increases the area of the inner
surface 124 contacting the working fluid 120, and the efficiency of
conducting heat from the pan of the plate 110 with lower
temperature to the gaseous working fluid 120 is increased to
accelerate the condensation of the gaseous working fluid 120.
[0027] Furthermore, the first concave-convex structure 132 is at
the outside surface 114 of the plate 110, the area of the outside
surface 114 contacting the air is increased to enhance the
efficiency of heat dissipation of the plate 110. That is, the first
concave-convex structure 132 and the second concave-convex
structures 134 and 136 can enhance the heat exchange efficiency of
the cooling plate 100a, the heat of the heat source 310 can be
exhausted out effectively.
[0028] The first concave-convex structure 132 and the second
concave-convex structures 134 and 136 can be selectively set at the
plate 110 according to demands, which is not limited. For example,
the plate 110 includes the second concave-convex structure 134 but
does not include the first concave-convex structure 132 and the
second concave-convex structure 136, and the plate 110 also may
include the first concave-convex structure 132 but does not include
the second concave-convex structures 134 and 136, which is
determined according to demands.
[0029] However, when the heat source 310 is at a high load and has
high temperature, the cooling plate can be connected to a water
cooling module to exhaust the heat of the heat source 310 out
effectively. the flowing. Then, a water cooling device with the
cooling plate 100a is taken as an example hereinafter.
[0030] FIG. 7 is an exploded diagram showing the water cooling
device 200 in one embodiment. FIG. 8 is a sectional diagram showing
that the water cooling device 200 in FIG. 7 is used in the heat
source 310. As shown in FIG. 7 and FIG. 8, the water cooling device
200 includes the cooling plate 100a and the water cooling module
210. The water cooling module 210 can be connected to the cooling
plate 100a. The water cooling module 210 includes the cooling plate
connector 212 (that is a cooling head), a pump 214, a heat exhaust
part 216 (that is a heat exchanger), a first connecting pipe 218a,
a second connecting pipe 218b and a cooling liquid 215. The cooling
plate connector 212 includes a cavity 213, and the cooling plate
100a is disposed in the cavity 213. The pump 214 is disposed in the
cavity 213. The second connecting pipe 218b and the first
connecting pipe 218a are connected between the cooling plate
connector 212 and the heat exhaust part 216. The cooling liquid 215
is accommodated in the cavity 213, the heat exhaust part 216, the
first connecting pipe 218a and the second connecting pipe 218b.
[0031] The cooling liquid 215 can be water, which is not limited
herein. The fan 220 may be a system fan or a fan attached to the
heat exhaust part 216. The fan 220 blows towards the heat exhaust
part 216 to decrease the temperature of the heat exhaust part 216,
and then the temperature of the cooling liquid 215 in the heat
exhaust part 216 drops.
[0032] When the heat source 310 operates, the pump 214 makes the
cooling liquid 215 flow along a direction D3 from heat exhaust part
216, the first connecting pipe 218a, the cooling plate connector
212, and then to the second connecting pipe 218b. Since the outside
surface 114 of the plate 110 of the cooling plate 100a which
contacts the cooling liquid 215 includes the first concave-convex
structure 132, the cooling liquid 215 takes the heat of the plate
110 away quickly, the condensation of the gaseous working fluid 120
near the inner surface 124 is accelerated to enhance the heat
exchange of the cooling plate 100a. Consequently, the water cooling
device 200 can make the temperature of the heat source 310 drop
effectively.
[0033] When the cooling liquid 215 flows through the cooling plate
100a in the cavity 213, the temperature of the cooling liquid 215
increases, and the cooling liquid 215 flows through the second
connecting pipe 218b into the heat exhaust part 216. Then, the wind
generated by the fan 220 makes the temperature of the heat exhaust
part 216 drop due to the thermal convection, and the cooling liquid
215 flowing out the heat exhaust part 216 has lower temperature
than that flows into the heat exhaust part 216. The cooling liquid
215 at lower temperature flows into the cavity 213 of the cooling
plate connector 212 via the first connecting pipe 218a.
[0034] In this embodiment, the pump 214 can be a constant speed
pump or a variable frequency pump If the pump 214 is the constant
speed pump, when the pump 214 is powered on, the cooling liquid 215
flows circularly from the heat exhaust part 216, through the first
connecting pipe 218a and the cooling plate connector 212 to the
second connecting pipe 218b, and the water cooling device 200
exhausts the heat. When the pump 214 is powered off, the cooling
liquid 215 stops flowing, the water cooling device 200 can store
the heat via the cooling liquid 215 in the cooling plate 100a and
the cavity 213.
[0035] When the pump 214 is the variable frequency pump, the pump
214 can be electrically connected to a temperature control device
(not shown) which detects the heat source 310. The temperature
control device can detect the temperature of the heat source 310
and adjust the power of the pump 214. For example, the lower the
temperature of the heat source 310 is, the smaller the power of the
pump 214 and the flow of the cooling liquid 215 are. The higher the
temperature of the heat source 310 is the larger the power of the
pump 214 and the flow of the cooling liquid 215 are. Consequently,
the water cooling device 200 can save energy. Additionally, the
temperature control device can set that the pump 214 is powered on
when the temperature of the heat source 310 is higher than a
specific value (such as 70.degree. C.) according to demands, which
is not limited herein.
[0036] The connection between the cooling plate (such as the
cooling plate 100 in the embodiment in FIG. 1) and the water
cooling module 210 in other embodiments is similar to that between
the cooling plate 100a and the water cooling module 210, and the
principles are similar, which is omitted herein.
[0037] The cooling plate and the water cooling device at least have
advantages:
[0038] (1) the cooling plate includes the working fluid, and the
working fluid is accommodated in the confined space of the plate,
when the cooling plate is disposed at the heat source, the heat
generated by the heat source is conducted by the plate, the working
fluid in the plate absorbs the heat to change the phase, and the
cooling plate has the function of heat diffusion and heat
storage;
[0039] (2) when the water cooling module is connected to the
cooling plate, the cooling plate and the cooling liquid are in the
cavity of the cooling plate connector, the cooling liquid takes
away the heat of the cooling plate quickly to drops the temperature
of the heat source effectively;
[0040] (3) the first concave-convex structure and the second
concave-convex structure can disposed at the outside surface or the
inner surface of the plate of the cooling plate according to
demands to make the rate of the heat exchange of the cooling plate
is enhanced.
[0041] Although the disclosure has been described m considerable
detail with reference to certain preferred embodiments thereof, the
disclosure is not for limiting the scope. Persons having ordinary
skill in the art may make various modifications and changes without
departing from the scope. Therefore, the scope of the appended
claims should not be limited to the description of the preferred
embodiments described above.
* * * * *