U.S. patent application number 14/053563 was filed with the patent office on 2014-02-13 for heat dissipation device with parallel and perpendicular fins.
This patent application is currently assigned to Hon Hai Precision Industry Co., Ltd.. The applicant listed for this patent is Hon Hai Precision Industry Co., Ltd., Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. Invention is credited to XIAN-XIU TANG.
Application Number | 20140041837 14/053563 |
Document ID | / |
Family ID | 43924158 |
Filed Date | 2014-02-13 |
United States Patent
Application |
20140041837 |
Kind Code |
A1 |
TANG; XIAN-XIU |
February 13, 2014 |
HEAT DISSIPATION DEVICE WITH PARALLEL AND PERPENDICULAR FINS
Abstract
A heat dissipation device includes a heat pipe, a first fin
unit, a second fin unit, and a fan arranged on the first fin unit
for drawing air from the first fin unit to the second fin unit. The
heat pipe includes an evaporation section, a first condensing
section and a second condensing section. The first fin unit
includes a plurality of stacked first fins with a first channel
defined between adjacent first fins. A notch is defined in the
first fin unit receiving the evaporation section, and a canal is
defined in the first fin unit receiving the first condensing
section of the heat pipe. The second fin unit includes a plurality
of stacked second fins. A second channel is defined between
adjacent second fins perpendicular to the first channels. A passage
is defined in the second fin unit receiving the second condensing
section of the heat pipe.
Inventors: |
TANG; XIAN-XIU; (Shenzhen,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Hon Hai Precision Industry Co., Ltd.
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd |
New Taipei
Shenzhen |
|
TW
CN |
|
|
Assignee: |
Hon Hai Precision Industry Co.,
Ltd.
New Taipei
TW
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd
Shenzhen
CN
|
Family ID: |
43924158 |
Appl. No.: |
14/053563 |
Filed: |
October 14, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12649299 |
Dec 29, 2009 |
8584737 |
|
|
14053563 |
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Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28D 15/0266 20130101;
F28D 15/0275 20130101; H05K 7/20309 20130101; F28F 2215/04
20130101; H05K 7/20809 20130101; G06F 2200/201 20130101; H05K
7/20318 20130101; G06F 1/20 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 29, 2009 |
CN |
2009103090530 |
Claims
1. A heat dissipation device, comprising: a heat pipe comprising an
evaporation section, a first condensing section and a second
condensing section; a first fin unit comprising a plurality of
stacked first fins, a first channel defined between adjacent first
fins, a notch defined in the first fin unit receiving the
evaporation section, and a canal defined in the first fin unit
receiving the first condensing section of the heat pipe; a second
fin unit comprising a plurality of stacked second fins, a passage
defined in the second fin unit receiving the second condensing
section of the heat pipe, and a second channel defined between
adjacent second fins of the second fin unit, the second channels
being perpendicular to the first channels; and a fan arranged on
the first fin unit for drawing air from the first fin unit to the
second fin unit, the fan comprising a base wall, a top wall, an
annular wall between the base wall and the top wall, and an
impeller, the base wall, the top wall and the annular wall
cooperatively defining a space for receiving the impeller therein,
the impeller comprising a hub, a plurality of blades surrounding
the hub, an annular ring arranged around the hub and
interconnecting middle portions of the blades, and a plurality of
poles extending outwards from the hub and connected to the annular
ring.
2. The heat dissipation device of claim 1, wherein a plurality of
assistant fins extends radially from an outer side of the annular
wall, an air inlet is defined in the base wall facing the first fin
unit, and an air outlet perpendicular to the air inlet is defined
in the annular wall facing the second fin unit.
3. The heat dissipation device of claim 2, wherein the base wall,
the top wall, and the annular wall are metal.
4. The heat dissipation device of claim 1, wherein the first
condensing section is parallel to the evaporation section, and the
second condensing section is perpendicular to the evaporation
section, the heat pipe further comprising a curved connecting
section between the first condensing section and the evaporation
section.
5. The heat dissipation device of claim 1, wherein the fan is a
centrifugal fan.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This patent application is a divisional application of
patent application Ser. No. 12/649,299, filed on Dec. 29, 2009,
entitled "HEAT DISSIPATION DEVICE WITH PARALLEL AND PERPENDICULAR
FINS," which is assigned to the same assignee as the present
application, and which is based on and claims priority from Chinese
Patent Application No. 200910309053.0 filed in China on Oct. 29,
2009. The disclosures of patent application Ser. No. 12/649,299 and
the Chinese Patent Application are incorporated herein by reference
in their entirety.
BACKGROUND
[0002] 1. Technical Field
[0003] The present disclosure relates to computer servers, and more
particularly to a heat dissipation device of a computer server.
[0004] 2. Description of Related Art
[0005] A server is a stand-alone computer and accommodates a
plurality of electronic components such as processors, RAM, fixed
disks, AC to DC power supplies therein. As the server contains
these electronic components, a large amount of heat is generated
during operation of the server. However, for a standard 1U server,
a height of the server is just 1.75 inches. Conventional heat
dissipation devices which are constructed by fin-type heat sinks
and axial fans arranged on the heat sinks are much higher than 1.75
inches, and thus are impossible to be accommodated in the server
for heat dissipating.
[0006] What is need, therefore, is a heat dissipation device which
can overcome the above limitations.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is an isometric, assembled view of a heat dissipation
device according to an exemplary embodiment.
[0008] FIG. 2 is an exploded view of the heat dissipation device of
FIG. 1.
[0009] FIG. 3 is an inverted view of FIG. 2.
DETAILED DESCRIPTION
[0010] Referring to FIG. 1, a heat dissipation device 10 according
to an exemplary embodiment includes a substrate 12, a first fin
unit 14, a second fin unit 15, a pair of heat pipes 16, and a
centrifugal fan 18.
[0011] Referring to FIGS. 2 and 3, the substrate 12 is rectangular
and flat. The substrate 12 includes a planar bottom face 120
configured for contacting a heat generating component (not shown),
and a top face 122 opposite to the bottom face 120. A fixing
portion 125 extends outwards from each corner of the substrate 12
for extension of a screw 127 therethrough to assemble the heat
dissipation device 10 onto the heat generating component. A pair of
grooves 123 is defined in the top face 122 of the substrate 12. The
grooves 123 are straight and parallel to each other, and formed at
a middle portion of the substrate 12. The grooves 123 extend
through the base wall 180 along a longitudinal direction of the
base wall 180. A cross section of each groove 123 is
semi-circular.
[0012] The heat pipes 16 are identical, with each heat pipe 16
including an evaporation section 160, a first condensing section
164, a connecting section 166, and a second condensing section 162.
The evaporation section 160 is straight. A length of the
evaporation section 160 is substantially the same as a length of
each groove 123 of the substrate 12. The first condensing section
164 is straight, and is arranged parallel to the evaporation
section 160. The connecting section 166 and the second condensing
section 162 are arranged at opposite sides of the evaporation
section 160. The connecting section 166 is curved, and
interconnects ends of the first condensing section 164 and the
evaporation section 160. The second condensing section 162 extends
upwards and perpendicularly from the evaporation section 160. A top
end of the second condensing section 162 is higher than the first
condensing section 164, and the first condensing section 164 is
higher than the evaporation section 160.
[0013] The first fin unit 14 is arranged on the top face 122 of the
substrate 12, and includes a plurality of first fins 140 spacedly
stacked in parallel along the longitudinal direction of the
substrate 12. A first channel 142 is defined between any two
neighboring 172 first fins 140. The first channels 142 are
perpendicular to the grooves 123 of the substrate 12.
[0014] A pair of notches 144 are defined at a middle of a bottom
side of the first fin unit 14 corresponding to the pair of grooves
123 of the substrate 12. Each of the notches 144 is semi-circular.
When assembled, each notch 144 of the first fin unit 14 and a
corresponding groove 123 of the substrate 12 define a receiving
groove for receiving the evaporation section 160 of the heat pipe
16 therein. A pair of canals 146 is formed at a top side of the
first fin unit 14 for receiving the first condensing sections 164
of the heat pipes 16 therein, respectively. Each of the pair of
canals 146 is located adjacent to a lateral side of the first fin
unit 14. The canals 146 are parallel to the notches 144, and are
located at opposite sides of the notches 144.
[0015] The second fin unit 15 is arranged adjacent to the first fin
unit 14. The second fin unit 15 includes a plurality of second fins
150 stacked from bottom to top. Each second fin 150 is parallel to
the substrate 12, but is perpendicular to the first fin 140. A
second channel 154 is defined between any adjacent two second fins
150. The second channels 154 of the second fin unit 15 are
perpendicular to the first channels 142 of the first fin unit 14. A
pair of passages 152 extends through the second fin unit 15 from
bottom to top for receiving the second condensing sections 162 of
the heat pipes 16, respectively.
[0016] The centrifugal fan 18 includes a base wall 180, a cover
182, and an impeller 184. The base wall 180 and the cover 182 may
be made of a metal material having a high heat transfer
coefficient, such as aluminum. The base wall 180 is arranged on a
top side of the first fin unit 14, and the cover 182 is fixed on
the base wall 180. A space 187 is defined between the base wall 180
and the cover 182 receiving the impeller 184 therein. An air inlet
181 is defined in a central portion of the base wall 180 to allow
airflow into the centrifugal fan 18.
[0017] The cover 182 includes a top wall 183 and an annular wall
185 extending down from an outer periphery of the top wall 183 to
the base wall 180. An opening 188 is defined in a central portion
of the top wall 183 and functions as another air inlet for the
centrifugal fan 18. An air outlet 193 is defined in the annular
wall 185, and is perpendicular to the air inlet 181 of the base
wall 180 and the opening 188 of the top wall 183. When assembled,
the centrifugal fan 18 is arranged with the air outlet 193 thereof
facing the second fin unit 15, and the air inlet 181 facing the
first fin unit 14. A plurality of assistant fins 194 extend
radially from an outer side of the annular wall 185 of the cover
182.
[0018] A supporting wall 189 is arranged in the opening 188 of the
top wall 183. A plurality of ribs 190 extends from the supporting
wall 189 to an inner periphery of the top wall 183 to fix the
supporting wall 189 to the top wall 183 of the cover 182. The
supporting wall 189 is circular. A sleeve 191 extends
perpendicularly from a central portion of the tube to the base wall
180. A bearing 192 is received in the sleeve 191.
[0019] The impeller 184 includes a hub 170, a shaft 175 extending
from the hub 170 into the bearing 192, and a plurality of blades
176 surrounding the hub 170. An annular ring 172 is arranged around
the hub 170 and interconnects middle portions of the blades 176. A
number of poles 174 extend outwards from the hub 170 to connect the
annular ring 172. Thus the blades 176 are fixed with the hub 170
and can rotate with the hub 170 to generate forced airflow.
[0020] During operation of the heat dissipation device 10, the
bottom face 120 of the substrate 12 is arranged on the heat
generating component to absorb heat therefrom. The first fin unit
14 is arranged on the top face 122 of the substrate 12.
Cooperatively the grooves 123 of the substrate 12 and the notches
144 of the first fin unit 14 receive the evaporation sections 160
of the heat pipes 16, respectively. The first condensing sections
164 of the heat pipes 16 are respectively fixed in the canals 146
of the first fin unit 14, and the second condensing sections 162 of
the heat pipes 16 are respectively fixed in the passages 152 of the
second fin unit 15. Thus, the heat pipes 16, the first fin unit 14,
the second fin unit 15, and the substrate 12 are closely combined
together. Heat of the heat generating component thus can be quickly
transferred to the first fin unit 14 and the second unit by the
heat pipes 16.
[0021] When the centrifugal fan 18 operates to absorb surrounding
air into the space 187 via both the opening 188 of the top wall 183
and the air inlet 181 of the base wall 180, forced airflow is
formed in the first channels 142 of the first fin unit 14.
Accordingly, the heat of the heat generating component transferred
to the first fin unit 14 is taken away. Since there are assistant
fins 194 formed on the annular wall 185 of the cover 182, the
airflow through the space 187 of the centrifugal fan 18 is cooled
by the assistant fins 194, and thus air flowing out of the air
outlet 193 to the second fin unit 15 can cool the second fin unit
15 efficiently. Therefore, the airflow of the centrifugal fan 18
can take away the heat from both the first fin unit 14 and the
second fin unit 15 timely. Accordingly, the heat generating device
can be kept at safe temperatures. In addition, the second fin unit
15 is arranged at a lateral side of the centrifugal fan 18 for
enhancing a heat dissipation efficiency of the heat dissipation
device 10. Thus, the heat dissipation device 10 can still have a
relatively smaller height. Accordingly, the heat dissipation device
10 can be accommodated in the thin electronic devices, such as 1U
severs.
[0022] It is to be understood, however, that even though numerous
characteristics and advantages of embodiments have been set forth
in the foregoing description, together with details of the
structures and functions of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the disclosure to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
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