U.S. patent application number 14/053124 was filed with the patent office on 2014-02-06 for bottom chassis, method of fabricating the same, and liquid crystal display including the same.
This patent application is currently assigned to Samsung Display Co., Ltd.. The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Sang-Joon PARK.
Application Number | 20140033536 14/053124 |
Document ID | / |
Family ID | 46048005 |
Filed Date | 2014-02-06 |
United States Patent
Application |
20140033536 |
Kind Code |
A1 |
PARK; Sang-Joon |
February 6, 2014 |
BOTTOM CHASSIS, METHOD OF FABRICATING THE SAME, AND LIQUID CRYSTAL
DISPLAY INCLUDING THE SAME
Abstract
Provided are a bottom chassis, a method of fabricating the same,
and a liquid crystal display (LCD) including the same. The bottom
chassis is fabricated using an aluminum alloy plate including, by
weight, 0.5 to 1.5% manganese, 0.8 to 1.5% magnesium, 0.01 to 0.03%
titanium, less than 0.02% molybdenum, and 96% or more aluminum.
Inventors: |
PARK; Sang-Joon;
(Hwaseong-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin City |
|
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
Yongin City
KR
|
Family ID: |
46048005 |
Appl. No.: |
14/053124 |
Filed: |
October 14, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13172684 |
Jun 29, 2011 |
8580359 |
|
|
14053124 |
|
|
|
|
Current U.S.
Class: |
29/897.2 |
Current CPC
Class: |
Y10T 29/49622 20150115;
B62D 21/00 20130101; B32B 15/04 20130101; C09K 2323/061 20200801;
C22C 21/00 20130101; C22F 1/00 20130101; Y10T 428/1095 20150115;
C22F 1/04 20130101 |
Class at
Publication: |
29/897.2 |
International
Class: |
B62D 21/00 20060101
B62D021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 16, 2010 |
KR |
10-2010-0113931 |
Claims
1. A method of fabricating a bottom chassis, the method comprising:
fabricating an aluminum alloy plate by preparing an aluminum alloy
material, rolling the aluminum alloy material at a reduction ratio
of 50% or more, and annealing the rolled aluminum alloy material
for at least 13 hour; and fabricating the bottom chassis by
processing the aluminum alloy plate.
2. The method of claim 1, wherein the aluminum alloy plate
comprises, by weight, 0.5 to 1.5% manganese, 0.8 to 1.5% magnesium,
0.01 to 0.03% titanium, less than 0.02% molybdenum, and 96% or more
aluminum.
3. The method of claim 2, wherein the aluminum alloy plate further
comprises, by weight, 0.1 to 0.3% silicon, 0.4 to 0.6% iron, 0.1 to
0.2% copper, less than 0.03% chrome, and less than 0.05% zinc.
4. The method of claim 1, wherein the rolling of the aluminum alloy
material is performed such that the aluminum alloy plate has a
thickness of 0.6 to 1.2 mm.
5. The method of claim 1, wherein in the rolling of the aluminum
alloy material, the aluminum alloy material is cold-rolled.
6. The method of claim 1, wherein the annealing of the rolled
aluminum alloy material comprises heat-treating the rolled aluminum
alloy material for at least 7 hours and then performing furnace
cooling for at least 5 hours.
7. The method of claim 6, wherein the heat-treating of the rolled
aluminum alloy material is performed at a temperature ranging from
400 to 420.degree. C.
8. The method of claim 1, wherein the fabricating of the aluminum
alloy plate further comprises performing tension leveling after the
annealing of the rolled aluminum alloy material, such that the
aluminum alloy plate has target yield strength.
9. The method of claim 1, wherein the aluminum alloy plate has a
thickness of 0.6 to 1.2 mm, a yield strength of 110 to 120 MPa, a
tensile strength of 185 to 205 MPa, an elongation of 18 to 22%, and
a heat transfer coefficient of 160 to 180.
Description
[0001] This application is a divisional application of U.S. patent
application Ser. No. 13/172,684 filed on Jun. 29, 2011, which
claims priority to Korean Patent Application No. 10-2010-0113931
filed on Nov. 16, 2010 in the Korean Intellectual Property Office
(KIPO), and all the benefits accruing therefrom under 35 U.S.C.
.sctn.119, the contents of the prior applications being herein
incorporated by reference
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a bottom chassis, a method
of fabricating the same, and a liquid crystal display (LCD)
including the same, and more particularly, to a bottom chassis
fabricated using an aluminum alloy plate that can ensure superior
mechanical and thermal properties, a method of fabricating the
bottom chassis, and an LCD including the bottom chassis.
[0004] 2. Description of the Related Art
[0005] Liquid crystal displays (LCDs) are one of the most widely
used types of flat panel displays (FPDs). LCDs are low in power
consumption, lightweight and slim, and have high resolution. Due to
these advantages, LCDs are being used as display devices for many
apparatuses.
[0006] An LCD includes a liquid crystal panel which consists of two
display substrates and a liquid crystal layer interposed between
the two display substrates to display an image. The LCD also
includes a backlight unit which emits light to the liquid crystal
panel, and a bottom chassis which is disposed under the liquid
crystal panel and the backlight unit to house them. The bottom
chassis not only provides a housing space, but also dissipates heat
generated from a light source, serves as the ground, and blocks
electromagnetic waves.
[0007] The recent trend toward lighter and slimmer LCDs is
increasing the need for the development of an alloy material that
can make a bottom chassis thinner and satisfy mechanical and
thermal properties required of the bottom chassis.
SUMMARY OF THE INVENTION
[0008] A bottom chassis fabricated using an aluminum alloy plate
that can ensure superior mechanical and thermal properties, a
method of fabricating the bottom chassis, and a liquid crystal
display (LCD) including the bottom chassis are provided.
[0009] According to one aspect, there is provided a bottom chassis
fabricated using an aluminum alloy plate including, by weight, 0.5
to 1.5% manganese, 0.8 to 1.5% magnesium, 0.01 to 0.03% titanium,
less than 0.02% molybdenum, and 96% or more aluminum.
[0010] According to another aspect, there is provided a bottom
chassis fabricated using an aluminum alloy plate having a thickness
of 0.6 to 1.2 mm, a yield strength of 110 to 120 MPa, a tensile
strength of 185 to 205 MPa, an elongation of 18 to 22%, and a heat
transfer coefficient of 160 to 180.
[0011] According to another aspect, there is provided a method of
fabricating a bottom chassis. The method includes: fabricating an
aluminum alloy plate by preparing an aluminum alloy material,
rolling the aluminum alloy material at a reduction ratio of 50% or
more, and annealing the rolled aluminum alloy material for at least
13 hour; and fabricating the bottom chassis by processing the
aluminum alloy plate.
[0012] According to another aspect, there is provided an LCD
including: a liquid crystal panel displaying an image; a backlight
unit providing light to the liquid crystal panel; and a bottom
chassis housing the liquid crystal panel and the backlight unit,
wherein the bottom chassis is fabricated using an aluminum alloy
plate including, by weight, 0.5 to 1.5% manganese, 0.8 to 1.5%
magnesium, 0.01 to 0.03% titanium, less than 0.02% molybdenum, and
96% or more aluminum.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The above and other aspects and features of the present
disclosure will become more apparent by describing in detail
exemplary embodiments with reference to the attached drawings, in
which:
[0014] FIG. 1 is a schematic exploded perspective view of a liquid
crystal display (LCD) according to an exemplary embodiment;
[0015] FIG. 2 is a view showing a bottom portion of a bottom
chassis according to an exemplary embodiment; and
[0016] FIG. 3 is a graph illustrating mechanical properties of an
aluminum alloy plate fabricated according to an exemplary
embodiment.
DETAILED DESCRIPTION OF THE INVENTION
[0017] Advantages and features of the present disclosure and
methods of accomplishing the same may be understood more readily by
reference to the following detailed description of exemplary
embodiments and the accompanying drawings. The present invention
may, however, be embodied in many different forms and should not be
construed as being limited to the embodiments set forth herein. In
the drawings, sizes and relative sizes of layers and regions may be
exaggerated for clarity.
[0018] It will be understood that when an element or layer is
referred to as being "on" another element or layer, the element or
layer can be directly on another element or layer, or intervening
elements or layers may also be present. In contrast, when an
element is referred to as being "directly on" another element or
layer, there are no intervening elements or layers present. As used
herein, the term "and/or" includes any and all combinations of one
or more of the associated listed items.
[0019] Spatially relative terms, such as "below", "beneath",
"lower", "above", "upper", and the like, may be used herein for
ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. It will be understood that the spatially relative
terms are intended to encompass different orientations of the
device in use or operation, in addition to the orientation depicted
in the figures. Throughout the specification, like reference
numerals in the drawings denote like elements.
[0020] Embodiments are described herein with reference to plan and
cross-sectional illustrations that are schematic illustrations of
idealized embodiments. As such, variations from the shapes of the
illustrations as a result, for example, of manufacturing techniques
and/or tolerances, are to be expected. Thus, embodiments of the
invention should not be construed as limited to the particular
shapes of regions illustrated herein, but are to include deviations
in shapes that result, for example, from manufacturing. Thus, the
regions illustrated in the figures are schematic in nature and
their shapes are not intended to illustrate the actual shape of a
region of a device and are not intended to limit the scope of the
invention.
[0021] Hereinafter, exemplary embodiments will be described with
reference to the attached drawings.
[0022] FIG. 1 is a schematic exploded perspective view of a liquid
crystal display (LCD) 100 according to an exemplary embodiment.
[0023] Referring to FIG. 1, the LCD 100 includes a liquid crystal
panel 110, a backlight unit 120, a bottom chassis 130, and a top
chassis 140.
[0024] The liquid crystal panel 110 displays an image. Although not
shown in the drawings, the liquid crystal panel 110 has a structure
in which a liquid crystal layer is interposed between two display
substrates. Thin-film transistors (TFTs), each controlling liquid
crystals and a pixel, which is a minimum unit of an image, are
formed on one of the two display substrates. In addition, a color
filter forming an image is formed on the other one of the display
substrates. That is, the other one of the display substrates is a
glass substrate coated with red, green and blue pixels.
[0025] The backlight unit 120 provides light to the liquid crystal
panel 110 from behind the liquid crystal panel 110. Although not
shown in the drawing, the backlight unit 120 includes a light
source, a reflective plate, an optical plate such as a light guide
plate (LGP) or a diffusion plate, and other optical sheets.
[0026] The bottom chassis 130 is disposed under the liquid crystal
panel 110 and the backlight unit 120 to house them. To provide a
housing space for the other components of the display device, the
bottom chassis 130 includes a bottom portion 132 and a side portion
134. The bottom portion 132 of the bottom chassis 130 faces the
liquid crystal panel 110 and the backlight unit 120, and the side
portion 134 extends vertically from the bottom portion 132 toward
the liquid crystal panel 110 and consists of four surfaces.
[0027] The top chassis 140 is frame-shaped and is coupled to the
bottom chassis 130 so as to define an effective display region of
the liquid crystal panel 110.
[0028] The bottom chassis 130 may be fabricated by processing a
plate made of an alloy (hereinafter, referred to as an `alloy
plate`).
[0029] When forming the bottom chassis 130, an embossed structure
(not shown in FIG. 1) or a deep drawn structure (not shown in FIG.
1) may be formed in various shapes on the bottom portion 132 of the
bottom chassis 130. The embossed structure or the deep drawn
structure may be provided to couple the LCD 100 to an external
device. For example, the embossed structure may service as a
coupler that couples the LCD 100 to various substrates or audio
sets. In addition, the deep drawn structure may serve as a passage
through which a connecting wire for driving the light source of the
backlight unit 120 passes. The deep drawn structure may increase
the torsional strength of the bottom chassis 130. To accomplish
these objectives, the embossed structure or the deep drawn
structure may have various shapes. For example, the bottom portion
132 of the bottom chassis 130 may be shaped as shown in a picture
of FIG. 2.
[0030] FIG. 2 is a view showing the bottom portion 132 of the
bottom chassis 130 according to an exemplary embodiment.
[0031] Referring to FIG. 2, the bottom portion 132 of the bottom
chassis 130 includes a first surface 1322 on which an optical plate
such as an LGP is mounted. An embossed structure 1324 may be formed
on the bottom portion 132. The embossed structure 1324 may protrude
from the first surface 1322 toward a second surface which is
opposite the first surface 1322, or may protrude from the second
surface toward the first surface 1322. In addition, a deep drawn
structure 1326 may be formed on the bottom portion 132. The deep
drawn structure 1326 may be formed on a flat surface and is
elongated while also protruding from the first surface 1322 toward
the second surface which is opposite the first surface 1322, or
protruding from the second surface toward the first surface
1322.
[0032] The shape of the bottom portion 132 of the bottom chassis
130 is not limited to the exemplary shape shown in FIG. 2. The
bottom portion 132 of the bottom chassis 130 may have various
shapes as long as it can house the backlight unit 120 and couple
the LCD 100 to a necessary external device.
[0033] The above-described bottom chassis 130 satisfies the
following requirements.
[0034] First, to make the LCD 100 lighter and slimmer, an alloy
plate that forms the bottom chassis 130 should be thin. When the
alloy plate that forms the bottom chassis 130 is thin, the LCD 100
can be made lighter and slimmer, and costs can be saved due to a
reduction in material use.
[0035] Despite a reduction in its thickness, the alloy plate that
forms the bottom chassis 130 should be able to satisfy required
mechanical properties such as the required yield strength, tensile
strength, and elongation.
[0036] Furthermore, the alloy plate that forms the bottom chassis
130 should satisfy required thermal properties such as the required
heat transfer coefficient, so that heat generated from the light
source of the backlight unit 120 can be easily dissipated via the
bottom chassis 130.
[0037] The appropriate thickness, yield strength, tensile strength,
elongation, and heat transfer coefficient ranges for an alloy plate
suitable for use in fabricating the bottom chassis 130 are provided
herein. An alloy plate which can meet these suggested ranges, and a
method of fabricating the alloy plate, are also provided.
[0038] An alloy plate that forms the bottom chassis 130 may have
the following thickness, yield strength, tensile strength,
elongation, and heat transfer coefficient.
[0039] The alloy plate that forms that bottom chassis 130 may have
a thickness range of 0.6 to 1.2 mm. If possible, the alloy plate
that forms the bottom chassis 130 has a thickness of 1 mm or less.
An alloy plate that is less than 1 mm thick can make the LCD 100
lighter and slimmer and reduce costs.
[0040] The yield strength of the alloy plate that forms the bottom
chassis 130 may range from 110 to 120 MPa. For example, the alloy
plate that forms the bottom chassis 130 may have a yield strength
of approximately 115 MPa. In the bottom chassis 130 as shown in
FIG. 2, whether an optical plate such as an LGP can be successfully
mounted on, for example, the first surface 1322, is closely related
to yield strength of the alloy plate used to form bottom chassis
130. The yield strength is the point at which plastic deformation
begins to occur. A yield strength lower than a required level
causes the first surface 1322 of the bottom chassis 130 to deform
plastically, thus making it difficult for an optical plate to be
mounted on the surface 1322. Consequently, this degrades the
quality stability of the LCD 100. For this reason, the yield
strength of the alloy plate that forms the bottom chassis 130 may
have a value in a range of 110 to 120 MPa as described above.
[0041] The tensile strength of the alloy plate that forms the
bottom chassis 130 may be in a range of 185 to 205 MPa. For
example, the alloy plate that forms the bottom chassis 130 may have
a tensile strength of approximately 195 MPa. Whether the deep drawn
structure 1326 can be formed on the bottom chassis 130 as shown in
FIG. 2 to perform adequately is closely related to tensile strength
of the alloy plate used to form bottom chassis 130. A tensile
strength lower than a required level causes the deep drawn
structure 1326 of the bottom chassis 130 to be distorted by heat,
thus degrading the quality stability of the LCD 100. For this
reason, the tensile strength of the alloy plate that forms the
bottom chassis 130 may have a value in a range of 185 to 205 MPa as
described above.
[0042] The elongation of the alloy plate that forms the bottom
chassis 130 may range from 18 to 22%. For example, the alloy plate
that forms the bottom chassis 130 may have an elongation of
approximately 22%. Whether the embossed structure 1324 can be
formed on the bottom chassis 130 as shown in FIG. 2 and perform
adequately is closely related to elongation. An elongation that
fails to meet a required level leads to low formability, which, in
turn, makes it difficult to form the embossed structure 1324 of the
bottom chassis 130. For this reason, the elongation of the alloy
plate that forms the bottom chassis 130 may have a value in a range
of 18 to 22% as described above.
[0043] The heat transfer coefficient of the alloy plate that forms
the bottom chassis 130 may be in a range of 160 to 180. For
example, the alloy plate that forms the bottom chassis 130 may have
a heat transfer coefficient of 170. When the heat transfer
coefficient of the alloy plate is in the above range, heat
generated from a light source can be easily dissipated.
[0044] To have the above-described thickness, yield strength,
tensile strength, elongation and heat transfer coefficient, the
alloy plate that forms the bottom chassis 130 may be made of an
aluminum alloy having the following composition. That is, the
bottom chassis 130 according to an exemplary embodiment is
fabricated using an aluminum (Al) alloy plate having the following
composition.
[0045] An alloy plate that forms the bottom chassis 130 according
to an exemplary embodiment may include, by weight, 0.5 to 1.5%
manganese (Mn), 0.8 to 1.5% magnesium (Mg), 0.01 to 0.03% titanium
(Ti), and 96% or more Al. The Al alloy plate may further include
less than 0.02% molybdenum (Mo) by weight. Mn may enhance heat
transfer efficient, Mg may increase strength, and Ti may increase
elongation. Mo may additionally be added to further increase
strength. An example of such an alloy plate may be an Al alloy
plate including, by weight, 0.1 to 0.3% silicon (Si), 0.4 to 0.6%
iron (Fe), 0.1 to 0.2% copper (Cu), 0.5 to 1.5% Mn, 0.8 to 1.5% Mg,
less than 0.03% chrome (Cr), less than 0.05% zinc (Zn), less than
0.02% Mo, 0.01 to 0.03% Ti, and the balance of Al.
[0046] Hereinafter, a description will be given of a method of
fabricating the Al alloy plate. First, an Al alloy material
including, by weight, 0.5 to 1.5% Mn, 0.8 to 1.5% Mg, 0.01 to 0.03%
Ti, and 96% or more Al is prepared. For example, an Al alloy plate
including, by weight, 0.1 to 0.3% Si, 0.4 to 0.6% Fe, 0.1 to 0.2%
Cu, 0.5 to 1.5% Mn, 0.8 to 1.5% Mg, less than 0.03% Cr, less than
0.05% Zn, less than 0.02% Mo, 0.01 to 0.03% Ti, and the balance of
Al is prepared. The Al alloy material may have a thickness that is
greater than the desired thickness of the bottom chassis 130, for
example, the Al alloy material may have a thickness of 2.85 mm by
rolling.
[0047] To obtain an Al alloy plate having a desired thickness, the
Al alloy material is rolled. That is, a rolling process is
performed such that an Al alloy plate has a thickness of 0.6 to 1.2
mm, if possible, approximately 1 mm. To satisfy this requirement, a
cold rolling process may be performed at a reduction ratio of 50%
or more. The reduction ratio is a ratio of the thickness of an Al
alloy material before being rolled to that of the Al alloy plate
after being rolled. Because the Al alloy material has a thickness
of approximately 2.85 mm as described above, the reduction ratio
should be 50% or more in order to achieve a desired Al alloy plate
thickness. Generally, a rolling reduction ratio is 30 to 40%.
However, when the thickness of an alloy material is 3 mm or less as
in the current exemplary embodiment, the rolling reduction ratio
can be increased to 50% or more by adding a load in the rolling
process. The rolling reduction ratio increased to 50% or more leads
to an increase in the yield strength and/or tensile strength,
thereby satisfying yield strength and/or tensile strength
properties required by the bottom chassis 130.
[0048] Next, the rolled Al alloy material is annealed. Annealing is
a process of cooling metal or glass after heat treatment. The
annealing process may be performed for 13 hours or more. More
specifically, in the current exemplary embodiment, the rolled Al
alloy material is heat-treated for approximately 7 hours or more at
a temperature of 400 to 420.degree. C. After heat treatment,
furnace cooling may be performed for 5 hours or more. That is,
after the rolled Al alloy material is heat-treated, it is left in
an unheated furnace for 5 hours or more to naturally cool the
rolled Al alloy material. If the annealing process is performed as
described above, elongation properties required by the bottom
chassis can be satisfied while the strength corresponding to a high
reduction ratio, e.g., a reduction ratio of 50% or more, is
maintained. Consequently, this can result in an increase in
formability.
[0049] As a result of sequentially performing the above processes,
an Al alloy plate used to fabricate the bottom chassis 130 can be
manufactured.
[0050] When the manufactured Al alloy plate fails to have target
yield strength, tension leveling may additionally be performed
after the annealing process, such that the Al alloy plate has the
target yield strength. However, the tension leveling process is
optional. Tension leveling is well known to those of ordinary skill
in the art as a process to level shape-fault of a strip of material
after a cold rolling.
[0051] The Al alloy plate described above may have a thickness of
0.6 to 1.2 mm, a yield strength of 110 to 120 MPa, a tensile
strength of 185 to 205 MPa, an elongation of 18 to 22%, and a heat
transfer coefficient of 160 to 80, as supported by an experimental
example below.
Experimental Example
[0052] An Al alloy plate of the current experimental example was
fabricated to include, by weight, 0.203% Si, 0.502% Fe, 0.151% Cu,
1.0% Mn, 1.208% Mg, 0.019% Cr, 0.039% Zn, less than 0.001% Mo,
0.02% Ti and the balance of Al and to have a thickness of
approximately 1 mm.
[0053] The Al alloy plate of the current experimental example was
fabricated as follows.
[0054] An Al alloy material including, by weight, 0.203% Si, 0.502%
Fe, 0.151% Cu, 1.0% Mn, 1.208% Mg, 0.019% Cr, 0.039% Zn, less than
0.001% Mo, 0.02% Ti, and the balance of Al was produced.
[0055] Then, the Al alloy material was cold-rolled to have a
thickness of approximately 1 mm. Here, the cold rolling of the Al
alloy material was performed at a reduction ratio of 50% or more. A
reduction ratio is a ratio of the thickness of a material after a
rolling to the thickness of the material before the rolling.
[0056] The Al alloy material was annealed for approximately 13
hours. More specifically, the Al alloy material was heat-treated
for 7 hours at a temperature of 410.degree. C., and then furnace
cooling was performed for 5 hours. After the furnace cooling,
tension leveling was performed such that the yield strength of the
Al alloy plate is in a range of 110 to 120 MPa. Tension leveling is
well known to those of ordinary skill in the art as a process to
level shape-fault of a strip of material after a cold rolling.
[0057] As a result, the Al alloy plate of the current experimental
example was fabricated and its mechanical properties were measured.
The results are shown in FIG. 3.
[0058] FIG. 3 is a graph illustrating mechanical properties of an
Al alloy plate fabricated according to an exemplary embodiment, the
Experimental Example, compared to those of an Al alloy plate
fabricated according to conventional art, the Comparative Example.
Specifically, a stress-strain curve of the Experimental Example
alloy plate for bottom chassis and a stress-strain curve of the
Comparative Example are illustrated for comparison purposes.
[0059] As apparent from FIG. 3, the stress-strain curve (see
Experimental Example) of the Al alloy plate fabricated according to
the above experimental example is higher than the stress-strain
curve (see Comparative Example) of the alloy plate for bottom
chassis which was fabricated according to the conventional art.
[0060] Therefore, the Al alloy plate of the Experimental Example
exhibits an approximately 30% higher yield strength YS (see {circle
around (1)}), an approximately 17% higher tensile strength TS (see
{circle around (2)}), and an approximately 3 to 4% lower elongation
(see {circle around (3)}) than the conventional alloy plate for
bottom chassis.
[0061] Specifically, the Al alloy plate of the Experimental Example
was measured to be 1 mm in thickness, 115 MPa in yield strength,
195 MPa in tensile strength, and approximately 20% in elongation.
In addition, the measured heat transfer coefficient of the Al alloy
plate of the Experimental Example is approximately 170.
[0062] Accordingly, it can be understood that an Al alloy plate
according to an exemplary embodiment has a thickness, yield
strength, tensile strength, elongation, and heat transfer
coefficient suitable for fabrication of the bottom chassis 130.
[0063] As described above, in an Al alloy plate and a method of
fabricating the same according to an exemplary embodiment, all
properties required of a bottom chassis, including thickness,
mechanical properties and thermal properties, can be satisfied.
Ultimately, this contributes to the quality improvement of an
LCD.
[0064] While the present disclosure has been particularly shown and
described with reference to exemplary embodiments thereof, it will
be understood by those of ordinary skill in the art that various
changes in form and detail may be made therein without departing
from the spirit and scope of the present invention as defined by
the disclosure including the following claims. The exemplary
embodiments should be considered in a descriptive sense only and
not for purposes of limitation.
* * * * *