U.S. patent application number 14/020116 was filed with the patent office on 2014-01-09 for method and apparatus for in-line process control of the cigs process.
This patent application is currently assigned to SOLIBRO RESEARCH AB. The applicant listed for this patent is SOLIBRO RESEARCH AB. Invention is credited to JOHN KESSLER, LARS STOLT.
Application Number | 20140007809 14/020116 |
Document ID | / |
Family ID | 32067349 |
Filed Date | 2014-01-09 |
United States Patent
Application |
20140007809 |
Kind Code |
A1 |
STOLT; LARS ; et
al. |
January 9, 2014 |
METHOD AND APPARATUS FOR IN-LINE PROCESS CONTROL OF THE CIGS
PROCESS
Abstract
An in-line production apparatus and a method for composition
control of copper indium gallium diselenide (CIGS) solar cells
fabricated by a co-evaporation deposition process. The deposition
conditions are so that a deposited Cu-excessive overall composition
is transformed into to a Cu-deficient overall composition, the
final CIGS film. Substrates with a molybdenum layer move through
the process chamber with constant speed. The transition from copper
rich to copper deficient composition on a substrate is detected by
using sensors which detect a physical parameter related to the
transition. Preferred embodiment sensors are provided that detect
the composition of elements in the deposited layer. A controller
connected to the sensors adjusts the fluxes from the evaporant
sources in order provide a CIGS layer with uniform composition and
thickness over the width of the substrate.
Inventors: |
STOLT; LARS; (UPPSALA,
SE) ; KESSLER; JOHN; (NANTES, FR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SOLIBRO RESEARCH AB |
UPPSALA |
|
SE |
|
|
Assignee: |
SOLIBRO RESEARCH AB
UPPSALA
SE
|
Family ID: |
32067349 |
Appl. No.: |
14/020116 |
Filed: |
September 6, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10591391 |
Jun 30, 2008 |
|
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PCT/SE2005/000333 |
Mar 4, 2005 |
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14020116 |
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Current U.S.
Class: |
118/696 |
Current CPC
Class: |
C23C 14/548 20130101;
C23C 14/56 20130101; C23C 14/0623 20130101; H01L 21/02568 20130101;
Y02P 70/521 20151101; Y02P 70/50 20151101; H01L 21/02631 20130101;
H01L 21/02491 20130101; H01L 31/0322 20130101; H01L 31/18 20130101;
Y02E 10/541 20130101 |
Class at
Publication: |
118/696 |
International
Class: |
H01L 31/18 20060101
H01L031/18 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 5, 2004 |
SE |
0400582-3 |
Claims
1. An in-line continuous substrate flow production apparatus for
fabrication of copper indium gallium diselenide (CIGS) solar cells,
comprising: a CIGS process chamber comprising a deposition zone
(DZ) therein, the deposition zone configured for substrates
provided with a molybdenum back contact layer to be continuously
moved therethrough, the CIGS process chamber further comprising: a
plurality of separated substrate heaters, evaporation sources with
Cu, In, Ga and Se, the evaporation sources configured to produce
evaporant fluxes for depositing respective amounts of Cu, In, Ga
and Se to a substrate for depositing a CIGS film on a surface of
the substrate, the evaporation sources provided in respective rows
over a width of the substrate, source heaters provided with said
evaporation sources, at least one composition detection device that
detects respective amounts of elements on the surface of the
substrate, and a controller connected to said at least one
composition detection device, the controller configured to adjust
the evaporant fluxes from each of the evaporant sources in response
to a detection of a variation, detected by the at least one
composition detection device, of the respective amounts of elements
in the CIGS film on the surface of the substrate, so that the CIGS
film is deposited by the evaporation sources to have a uniform
composition.
2. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein said controller adjusts the
evaporant fluxes in the respective rows so that the CIGS film has a
uniform thickness.
3. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein two rows of evaporation sources
are arranged over a width of the process chamber as seen in a
transport direction of the substrates, the two rows of evaporation
sources being arranged at each side of and outside a path along
which the substrates flow through the deposition chamber.
4. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein said at least one composition
detection device is located within the process chamber.
5. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein said at least one composition
detection device is located outside the process chamber.
6. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein the evaporation sources are
arranged at a level below the substrates.
7. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein said at least one composition
detection device is one of an X-ray fluorescence device or an EDX
(energy dispersion X-ray spectroscopy) device, said at least one
composition device configured to measure total deposited amounts of
each element and to measure a thickness of the CIGS film.
8. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein the controller is configured to
receive an input signal representative of total deposited amounts
of each element and, in response to said input signal, adjust the
evaporant fluxes from the evaporant sources to form the CIGS film
with a uniform thickness.
9. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein said at least one composition
detection device is a device that measures the composition of a
layer of elements on the substrate indirectly by calibrating
against a physical parameter to obtain a measure of an amount of
Cu, Ga, and In.
10. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein said at least one composition
detection device is a resistance measuring device.
11. The in-line continuous substrate flow production apparatus in
accordance with claim 1, further comprising: a separate thickness
measuring device connected to the controller for measuring a
thickness of the CIGS film on the substrate, the controller being
configured to, in response to a detected thickness variation,
adjust the evaporant fluxes from the evaporant sources so that the
CIGS film is deposited by the evaporation sources to have a uniform
thickness.
12. The in-line continuous substrate flow production apparatus in
accordance with claim 11, wherein the thickness measuring device is
a profilometer.
13. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein the evaporation sources with Cu,
Ga and In are arranged in an order of: Ga, followed by Cu, followed
by In, with respect to a transport direction of the substrates.
14. The in-line continuous substrate flow production apparatus in
accordance with claim 13, wherein a further evaporation source with
Ga is arranged downstream the In evaporation source with respect to
the transport direction of the substrates.
15. The in-line continuous substrate flow production apparatus in
accordance with claim 1, wherein the evaporation sources with Cu,
Ga and In are arranged in the following order as seen in a
transport direction of a substrate: In, Cu, Ga.
16. The in-line continuous substrate flow production apparatus in
accordance with claim 15, wherein a further evaporation source with
In is arranged downstream the Ga evaporation source with respect to
the transport direction of the substrates.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The invention relates to a method and apparatus for
fabrication of copper indium gallium diselenide (CIGS) solar cells
by a co-evaporation deposition process in a process chamber. The
invention also relates to a method and device for control of the
thickness and composition of the deposited CIGS layer.
TECHNICAL BACKGROUND
[0002] Solar cells provide a means to produce electric power with
minimal environmental impact because it is a renewable technology.
In order to become a commercial success the solar cells need to be
efficient, to have low cost, to be durable, and not add other
environmental problems.
[0003] Today's dominant solar cell technology is based on
crystalline silicon. It fulfils many of the requirements mentioned
above but can not be produced at such low cost that electricity
generation in large scale is cost effective. It also requires
relatively large amount of energy in the production, which is an
environmental disadvantage. Solar cells based on thin film
technologies have been developed. They offer a potential of
substantial cost reductions but have, in general, lower conversion
efficiencies and less good durability. A very promising thin film
solar cell technology is based on the semiconductor
Cu(In,Ga)Se.sub.2 (CIGS) which has demonstrated high efficiencies
(16.6% in small prototype modules) and durability in operation.
DESCRIPTION OF RELATED ART
[0004] In FIG. 1 a CIGS solar cell is shown to comprise a CIGS
layer 1 on a substrate material 2 such as sheet glass or metal
foil, which has been coated with a layer 3 of molybdenum. This
layer serves as a back contact of the solar cell. The CIGS growth
is followed by the formation of a pn-junction by deposition of a
buffer layer 4, typically 50 nm of CdS, a high resistivity thin
layer 5 of ZnO (sometimes omitted) and a front contact 6 of a
transparent conductive oxide 6. One critical factor for obtaining
solar cells with high light to electricity conversion efficiency is
the quality of the CIGS material.
[0005] U.S. Pat. No. 6,310,281 describes high vacuum co-deposition
methods using three or five boats as effusion sources for the
elements to be deposited. In the three vapour source method a strip
of Mo-coated substrate material travels in a chamber through the
vapor deposition zone. Each point on that material first passes
directly over the copper source, thereafter over the gallium
source, thereafter over the indium source, and throughout, over the
selenium sources.
[0006] The respective vapor effusion rates of copper, gallium and
indium from the crucibles/boats are controlled in such a fashion
that the entrance end of the vapour deposition zone is copper-rich,
the middle region of this zone is gallium-rich, and the exit end of
the zone is indium-rich. By establishing appropriate effusion rates
for copper, gallium and indium the composition of the CIGS film
varies along the deposition zone in accordance with the following:
(a), within the entrance end of the deposition zone the ratio
(Cu)/(Ga+In) is generally about 3.4, and the ratio (Ga)/(Ga+In) is
generally about 0.46; (b), within the middle region of the
deposition zone the ratio (Cu)/(Ga+In) is generally about 1.9, and
the ratio (Ga)/(Ga+In) is generally about 0.43; and (c), within the
exit end of the deposition zone the ratio (Cu)/(Ga+In) is generally
between 0.8 and 0.92, most preferably, about 0.88, and the ratio
(Ga)/(Ga+In) is between generally between 0.25 and 0.3, most
preferably 0.275.
[0007] The CIGS layer created has an internal make-up or
composition of approximately 23.5 atomic percent copper, 19.5
atomic percent indium, 7atomic percent gallium, and 50 atomic
percent selenium.
[0008] In accordance with the patent deposition of the various
elements is controlled by controlling the vapour effusion rates
from nozzles in crucibles and by controlling the temperatures of
the molten metals within reservoirs in the crucibles.
[0009] The patent does not disclose any means for detecting a
transformation of a copper rich CIGS composition into a copper
deficient CIGS composition. Neither does the patent describe any
means for control of the deposition of the CIGS layer.
[0010] The patent also discloses a five stage process according to
which each point of the surface of the film in the CIGS chamber
encounters , in sequence, a gallium/indium-rich region, a
copper-rich region, and finally another indium/gallium-rich
region.
[0011] U.S. Pat. No. 5,633,033 relates to a method of manufacturing
a chalcopyrite film for a solar cell and to a method of monitoring
an electrical or optical property of the film in order to determine
an end point of the last method step where the electrical or
optical property of the film demonstrates a specific change. Once
the end point is detected the process is stopped.
SUMMARY OF THE INVENTION
[0012] One object of the present invention is to provide a control
method for accurate control of the co-deposited CIGS layer in an
in-line system for fabrication of CIGS solar cells, wherein
substrates provided with a molybdenum back contact layer
continuously move through a CIGS process chamber.
[0013] Another object of the invention is to provide a uniform
deposition of the CIGS layer over the width of the substrates as
seen in the transport direction of the substrates through the
process chamber. This is achieved by using at least two rows of
evaporation sources, as seen in the transport direction of the
substrates through the process chamber, the evaporation sources in
one row being controlled more or less independently of the sources
of the other rows in order to provide a uniform thickness and a
uniform composition of the CIGS layer.
[0014] Still another object of the invention is to provide control
methods that use sensors that either detect a transition point in
the deposited CIGS layer or detect the thickness and composition of
the deposited CIGS layer.
[0015] One control method in accordance with the invention is based
on the fact that several physical and chemical properties of the
CIGS material changes abruptly when the CIGS layer is transformed
from a Cu-excessive to Cu-deficient composition. In particular the
travelling CIGS layer transforms from a two-phase material
comprising Cu(In,Ga)Se.sub.2 and Cu.sub.xSe into a single phase
material comprising Cu(InGa)Se.sub.2. The control method is
independent of the method used for the manufacture of the CIGS
layer. In accordance with the invention the position in the CIGS
process chamber at which the transformation takes place, this
position being referred to as a reference transition point, is
detected. Further, by detecting a shift of the position at which
the transformation occurs, this position being referred to as the
actual transition point, from the reference transition position and
take a corrective action to bring the actual transition point back
to the reference transition point it is possible to accurately
control the composition of the CIGS layer.
[0016] Detection of the transition point is made with at least one
sensor adapted to measure a physical parameter representative of
the transition. The control action is taken by a controller that
receives and processes the sensor signal and provides a corrective
signal that adjusts the evaporant fluxes so that the transition
point is brought back to its reference position in the process
chamber. In the above referenced U.S. Pat. No. 5,633,033 the
control process is stopped when the transition is detected, while
according to the present invention the transition detection process
continues all the time and generates control parameters which are
used to generate a corrective signal which is used to bring back
the transition point to its reference position.
[0017] Two sensors forming a sensor pair may be used in order to
detect the transition point. The sensors of a pair are arranged at
each side of the transition point. There may be two or more sensor
pairs arranged over the width of the process chamber in order to
detect a respective transition point. A set of evaporation sources
is associated with each sensor pair. Each sensor pair and its
associated set of evaporation sources are connected to a respective
controller. A controller adjusts any of its associated evaporation
sources in order to keep its respective transition point generally
still. Control takes place by adjusting the power to the relevant
evaporation source heater. The use of several sensor pairs arranged
over the width of the process chamber enhances the precision with
which the CIGS layer is deposited as seen in a direction over the
width of the process chamber.
[0018] By providing an x-ray fluorescence composition measuring
apparatus, below referred to as an XRF device, downstream the
reference transition point it is possible to accurately control the
thickness and composition of the CIGS material, thus proving a high
output rate of substrates that have accurately controlled
composition and thickness.
[0019] The method provides a fast feed-back loop in order to
achieve good control dynamics.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1. is a cross sectional view of a CIGS solar cell
[0021] FIG. 2. is a cross sectional view of a CIGS process chamber
provided with the control in accordance with the invention
[0022] FIG. 3. is a view similar to FIG. 2 illustrating evaporation
rate profiles for the deposited elements
[0023] FIG. 4. is a view similar to FIG. 2 illustrating CIGS film
composition vs time/position in the process chamber
[0024] FIG. 5. is a view similar to FIG. 2 illustrating CIGS film
emissivity vs time/position
[0025] FIG. 6. is a view of the controller,
[0026] FIG. 7. is a graph illustrating the sharp transition point
in a graph of Cu/Ga+In vs time,
[0027] FIG. 8. is a schematic bottom view of the CIGS process
chamber and illustrates a second embodiment of the deposition and
control systems,
[0028] FIG. 9. is a schematic bottom view of the CIGS process
chamber and illustrates the use of several sensors at each
substrate heater,
[0029] FIG. 10. is a schematic bottom view of the CIGS process
chamber and illustrates a second embodiment of the control
systems,
[0030] FIG. 11. is a schematic bottom view of a process chamber,
wherein a preferred embodiment of the invention is disclosed,
[0031] FIG. 12. is a side view of the process chamber shown in FIG.
11,
[0032] FIG. 13. is a diagram illustrating the elemental flux along
a row region in the substrate plane in the embodiment of FIG.
12,
[0033] FIG. 14. is a diagram illustrating the output signal from
the detection device shown in FIG. 12,
[0034] FIG. 15. is a schematic bottom view of the process chamber,
wherein a further embodiment of the invention is disclosed, and
[0035] FIG. 16. is a cross section view of the process chamber.
DETAILED DESCRIPTION OF EMBODIMENTS
[0036] Refer to FIG. 1. The commonly used way of fabricating CIGS
solar cells is includes the growth of a CIGS layer 1 on a substrate
material 2, such as sheet glass or metal foil, which has been
coated with a layer of Mo 3. The Mo layer serves as back contact of
the solar cell. The CIGS growth is followed by the formation of a
pn-junction by deposition of a buffer layer 4, typically 50 nm of
CdS, an optional high resistivity thin layer of ZnO 5 and a front
contact of a transparent conductive oxide 6. One critical factor
for obtaining solar cells with high light to electricity conversion
efficiency is the quality of the CIGS material.
[0037] Although the invention will be described in connection with
a horizontal deposition system, it should be understood the present
invention can be used with a vertical deposition system. In FIG. 2
the deposition system comprises a process chamber 7 for the
inventive fabrication of a CIGS layer. The process chamber is shown
to comprise an inlet 8, an outlet 9, a plurality of substrate
heaters 10, a copper evaporation source 11, a gallium evaporation
source 12, an indium evaporation source 13, and individual
evaporation source heaters 14, 15, 16. Within the process chamber 7
and specifically within a deposition zone DZ the co-evaporation
process for establishing the CIGS layer is performed. Thermocouples
14', 15' and 16' are arranged to measure the temperature of the
individual evaporation sources. Non-shown temperature controllers
are adapted to maintain the temperature of the respective
evaporation sources constant. An inventive control system comprises
a controller 17 connected to sensors 18, 19 and to the evaporation
sources heaters 14-16. An XRF device 20 measures the composition
and the thickness of the deposited CIGS layer. Selenium sources 26
are located to give excess selenium at all growth positions in the
deposition zone and distribute selenium vapour rather evenly
throughout the deposition zone.
[0038] In a preferred embodiment of the invention the substrates
are glass plates of about 120 cm wide and about 60 cm long, the
sensors are thermocouples and the substrate heaters comprise many
segments, typically 10 cm wide in the direction of substrate
movements. The exact width depends on the overall geometry and size
of the process chamber. The substrate heaters may for example be IR
lamps. Described in a very short and incomplete way but with the
intention to give the reader a general apprehension of the
processes taking place in the process chamber the following facts
are given: the process chamber is held at vacuum, the glass plates
are at about 500.degree. C. when entering the process chamber, the
source heaters are heating the crucibles containing the respective
elements to temperatures of about 1000 to 1500.degree. C.
[0039] The Mo coated substrates 21 travel with uniform speed
through the deposition zone DZ in the direction of arrow 22 on
non-shown transfer mechanisms.
[0040] The transfer mechanisms are designed so that there is a
continuous flow of substrates through the deposition zone, the
leading edge of one substrate with a minimal separation to the
trailing edge of a previous substrate. In the deposition zone, the
evaporation sources are preferably located so that the substrates
will see the Cu source before they see the In-source. Ga, which is
evaporated in less amount than In (typically high performance CIGS
films have Ga/(Ga+In) ratios of 0.15 to 0.40) is preferably located
to give higher deposition rates near the entrance of the substrates
to the deposition zone than the exit as is illustrated in FIG.
3.
[0041] In FIG. 3 the elemental fluxes at different positions in the
substrate plane in the direction of substrate movement are shown.
In particular the copper evaporation flux is shown at curve 23, the
gallium evaporation flux is shown at curve 24 and the indium
evaporation flux is shown at curve 25. This way a Ga-gradient
through the depth of the CIGS layer is introduced which improves
solar cell performance.
[0042] As the substrate move through the deposition zone a copper
rich layer of low resistivity will be deposited at the entrance
end. This layer comprises copper selenide Cu.sub.xSe and
Cu(In,Ga)Se.sub.2. Further down the line, where the copper flux
drops and the indium flux increases, the copper rich layer meets
and almost instantly reacts with copper deficient Cu(In,Ga)Se.sub.2
by giving away its copper to the copper deficient Cu(In,Ga)Se.sub.2
as the substrate moves further down the line. The copper in the
copper rich layer will thus be consumed. When the excessive copper
in the Cu.sub.xSe has been consumed, which happens at a transition
point generally shown at 27, the resulting CIGS layer generally
comprise a high resistivity, copper deficient
Cu(In,Ga)Se.sub.2layer.
[0043] The transition is very sharp and takes place over a short,
as seen in the transport direction, clearly defined location or
transition zone in the process chamber. In the following this point
will be referred to as the reference transition point. For an
operator of the in line production line there is not a single
instant at which a transition takes place, but transitions take
place all the time as the substrate move. The reference transition
point will however not move in the deposition zone, provided the
transport speed is uniform and the fluxes are stable therein. In
accordance with the invention the reference transition point is
used in order to control the formation of the CIGS composition.
[0044] Overall, the source arrangement is such that the growth is
Cu-excessive in the entrance end of the deposition zone and Cu
deficient in the exit end. The fluxes are adjusted to give a final
composition of the CIGS film with a Cu/(In+Ga) ratio in the region
0.75-0.95, and a Ga/(In+Ga) ratio of about 0.10 to 0.45. In FIG. 7
the final composition of the CIGS film with a Cu/(In+Ga) ratio in
the region 0.75-0.95 is illustrated. FIG. 7 also illustrates the
sharp transition which takes place in the region 0.95 to 1.05.
[0045] The amounts of the respective deposited elements are shown
in FIG. 4. The composition of the CIGS film at one specific
location of the substrate is shown. How the composition at this
location changes as the substrate travels through the process
chamber is illustrated. Upstream the reference transition point the
proportion of Cu to In+Ga is larger than 1 and downstream the
transition point it is less than 1.
[0046] At each side of the reference transition point, at a
distance of 5-30 cm, a respective sensor 18 and 19 is located which
monitors a physical property related to the transition, in
particular a parameter related to the emissivity, resistivity or
heat capacitivity of the CIGS material composition.
[0047] If the reference transition point tends to move from its
reference location, the shift is detected by the sensors. In
principle, the reference transition point may move due either to a
change in Cu or a change in (In+Ga) flux. The output signal from
the sensors are fed as input signals to the controller in which
there is a software program 28 that processes the input signals and
provides a corrective output signal by which the evaporant fluxes
are adjusted to compensate for the shift and bring the transition
point back to the reference location.
[0048] The sensors are adapted to measure a physical parameter
representative of the transition of the Cu rich layer into a Cu
deficient layer. Exemplary parameters are emissivity, resisitivity,
heat capacitivity, intensity of light reflected by or transmitted
through the deposited CIGS film, and intensity of specular light in
relation to intensity of reflected light.
[0049] In the following a sensor measuring emissivity will be
described in relation to FIG. 5 which in its turn is related to
FIGS. 3 and 4. A substrate that moves with constant speed through
the process chamber will cause an output signal from an emission
sensor to follow an emissivity curve 29. Since speed is constant
there is a linear relation between position and time (s=v t). The
Mo coated substrate entering the process chamber has a low
emissivity value because the metal will reflect a large fraction of
the heat radiation from the substrate heaters. As the copper rich
layer begins to deposit the emissivity increases and will reach a
values that is representative of the copper rich layer. The
emissivity will remain on this value until the transition occurs at
which instant/position the emissivity changes sharply as is
indicated with the broad dotted line 29. At this position a clear
change of the emissivity, resistivity and heat capacitivity
occurs.
[0050] With sensor 18 a high emissivity value is measured and with
sensor 19 a low emissivity value is measured. Both sensors are
measuring the emissivity. Suppose the in-line process has been
running for a while and that a condition has been attained where
the transition point lies still, i.e. it doesn't move. Now, if any
of the Cu, Ga or In fluxes starts to vary so that the CIGS film
becomes more copper rich this will imply that it will take longer
time for the composition to become copper deficient. The transition
point will thus shift from the reference position in a direction
downwards the process chamber, i.e. to the right in FIG. 5. The
output signal from sensor 19 will increase. The emissivity measured
by the two sensors will now be high. The controller program will as
a result of the processing of the two input signals deliver an
output signal to that reduces the copper flux. The copper flow is
reduced until the actual transition point has moved back to the
reference transition point. If the output signal from sensor 18
decreases the transition point shifts in a direction upstream the
reference transition point, i. e. to the left in the drawing, and
copper flux must be increased until the actual transition point
moves back to the reference position.
[0051] The fluxes from the respective evaporation sources are
controlled by adjusting the power supplied to the respective
sources. When the power is adjusted, the temperature will be
correspondingly adjusted and the thermocouple 14', 15' or 16' will
send its temperature reading to the controller.
[0052] The controller may for example order that the Cu source
shall maintain 1500.degree. C. The non-shown temperature controller
at the Cu source will then adjust the heater 14 until the
thermocouple 14' reports a temperature of 1500.degree. C. If the
reference transition point now shifts to the left in FIG. 2, the
program in the controller will execute and order an increase of the
Cu source temperature to 1502.degree. C. The temperature controller
increases the power to the heater, the temperature rises and this
is detected with thermocouple 14' which reports the temperature
back to the controller.
[0053] In the just described scenario it was assumed the shift of
the transition point depended on a copper flux that varies. As
already mentioned above the transition point may however in
principle move due either to a change in Cu or a change in (In+Ga)
flux. In order to make sure the right corrective action is taken by
the controller additional information is needed. This can simply be
the fact that Ga and In sources in general are more stable than a
Cu source, and therefore the right corrective action is always
assumed to be adjustment of the Cu-flux. In particular the power
delivered to the Cu source heater 14 is adjusted. An additional
possibility is to use the XRF device 20 provided further down the
line or even outside the process chamber. Conventionally an XRF
device measures total composition, and for thin CIGS layers the
total amount of atoms of each deposited element can be determined.
Thus a measure of CIGS layer thickness as well as of the elemental
composition of the CIGS layer is obtained with an XRF device 20.
Instead of an XRF device one may use any other device that measures
the composition and/or the thickness of the CIGS layer.
[0054] If the transition point remains still this reflects that the
composition of the CIGS layer is correct and that a transition has
taken place, but it does not reflect the thickness of the CIGS
layer. The thickness could in principle be anyone. Therefore
thickness measurements need to be taken and the XRF device is used
for this.
[0055] From the above it should be clear that the XRF device is
primarily used for thickness measurements, even if also
compositional data is obtained from it, and that the controller is
adapted to control the vapour sources in order to obtain a CIGS
layer of correct composition and correct thickness.
[0056] If the transition point moves to the right it would in
principle be possible to decrease the In+Ga fluxes in order to
obtain a more copper rich deposition, but the XRF device would then
detect that the CIGS film starts to become thinner and would
transmit a corresponding signal to the controller. The control
program would then find out that the proper corrective action is to
increase the copper flux. This gives a slow feedback but adds
information on total deposited amounts of each element and not just
the relative composition of the constituents. The process window
for total deposited amounts, i.e. thickness, is substantially
larger than for the composition. Also the process window for
Ga/(Ga+In) ratio is relatively large. This means that the slow
feedback can be used to adjust for drift in the In and Ga fluxes
and the fast feedback for composition control by altering the Cu
flux.
[0057] The following section explains why it is possible to detect
the transition point by measuring the temperature at the
thermocouples. Since the process takes place in vacuum heat is
transferred to and from the complete aggregate of substrate and its
deposited layers by way of radiation only. Heat transfer by way of
conduction takes place within the aggregate. Following a start up
phase of the in line system a condition of radiation equilibrium
will appear i.a. between the substrates and the substrate heaters.
In this state the substrate heaters radiate heat, the top surface
of the aggregate, that is the surface facing the substrate heaters,
will reflect some heat, and the bottom surface of the aggregate,
that is the surface comprising the Mo and CIGS layers, will radiate
some heat. As seen from the substrate heaters nothing changes as
the depositions on the bottom surface progress; the substrate
heaters continue to see only the substrate and the Mo layer. The
substrate will continue to absorb and reflect the same amounts of
heat, provided the power supplied to the substrate heaters is kept
constant.
[0058] At the bottom surface the emissivity will change when
transition takes place. When emissivity is low, the bottom surface
will radiate little heat and the aggregate becomes warmer (due to
heat conduction within the aggregate) provided the power supplied
to the substrate heaters is kept constant. When emissivity is high,
the bottom surface will radiate more heat and the aggregate becomes
cooler.
[0059] Sensor 18, sitting at a location where emissivity is high
will measure a certain temperature and sensor 19, sitting after the
transition point and thus at a location where emissivity is lower,
will measure a temperature which is higher when the transition
point is between the sensors 18, 19.
[0060] Instead of holding the power to the source heaters constant
it is possible to control them individually and regulate them so
that the temperature of the substrates is held constant. The
heaters at each side of the transition point would then need to be
supplied with different powers in order to keep the substrate
temperature constant. The power difference will thus indicate that
the transition point is present between the substrate heaters in
question.
[0061] As an alternative to use temperature sensors, which are
specific embodiments of an emission sensor, in order to detect the
transition point it is possible to use optical sensors of the kind
described in the above referenced U.S. Pat. No. 5,633,033.
[0062] Still another alternative is to use a sensor that measures
the intensity of light reflected by or transmitted through the
deposited CIGS film.
[0063] A further alternative is to use an optical device that
measures intensity of specular light and intensity of reflected
light, the light impinging the top of the deposited CIGS film with
an acute angle, one sensor measuring reflected light and another
measuring specular light.
[0064] If a sensor takes absolute readings it is, in principle,
possible to detect the transition point using one sensor only. The
use of two or more sensors and comparing their readings in order to
detect the transition point allows the use of relative readings.
The controller and its software would then need to be
correspondingly designed. In FIG. 2 third and fourth sensors 30, 31
are shown with dashed lines. The use of such third and fourth
sensors allow for determination of the direction into which a
transition points moves and/or for determination of the magnitude
of the shift of the transition point. This information is used by
the controller to take appropriate corrective actions to bring the
transition point back to its reference position. The system of
sensors 18, 19, 30, 31 will of course also allow determination of
the current position of the transition point.
[0065] FIG. 8 is a top view of the CIGS process chamber and
illustrates a second embodiment of the deposition system. Instead
of having a single control system comprising a pair of sensors 18,
19, evaporation sources 11, 12, 13, source heaters 14, 15, 16,
source temperature sensors 14', 15', 16', an XRF source 20, and a
controller 17 as shown in FIG. 2 a double control system may be
used as shown in FIG. 8. Each control system comprises a pair of
sensors 18, 19, evaporation sources 11, 12, 13, source heaters 14,
15, 16, source temperature sensors 14', 15', 16', an XRF source 20
and a controller 17. The two control systems are arranged side by
side.
[0066] The transition point is thus controlled at two points as
seen in a direction over the width of the substrate material. If
one looks at FIG. 8 one could say that there are two rows of
controls, although this expression is general and non-exact. Each
control system is essentially, but not completely, independent of
the other. Accordingly control of one transit point is essentially
independent of control of the other. As described above a transit
point is controlled by controlling the power to the source heaters.
By this arrangement an accurate control of the deposition of the
CIGS film over the width of the substrates is achieved.
[0067] The use of two rows of evaporation sources allows adjustment
of the elemental composition and the thickness of the CIGS layer
over the width of the substrate. In accordance with the invention,
the ability to control each row of sources will provide a
possibility to adjust for non-uniformity of thickness and
non-uniformity of composition (of the CIGS layer) over the with of
the substrate. This is an advantage over the use of known linear
evaporation sources which cannot provide such adjustments, since it
is not possible to control the amount of evaporation flux at one
side in relation to the amount of evaporation flux at the other
side.
[0068] It is possible to control the evaporation sources of one row
independently of the evaporation sources of the other row. It is,
however, possible to use a dependency between the rows in order to
increase the accurateness of the control. For example, say that a
measurement is taken on the sources in one row, called the first
row. If we know that 90% of the resulting measurement emanates from
the sources in said first row and that 10% emanates from sources in
another other row, called the second row then this knowledge can be
used to provide a smarter corrective action. This is because an
corrective action can be weighted among the two rows. Therefore
control of the evaporation sources in a row may be dependent on the
control of the evaporation sources of another row.
[0069] A modification of the FIG. 8 embodiment is to use three or
more control systems arranged side by side over the width of the
substrates and control the transit point at three or more
positions.
[0070] In FIG. 9 a modification of the invention is shown wherein
there is a sensor 18 or 19 at each substrate heater, thus allowing
for determination of the transition point at any location within
the deposition zone. As shown there are also double rows of control
systems like in the FIG. 8 arrangement which will allow for precise
control of the deposition of the CIGS film over the width of the
substrates wherever transition points are detected. Depending on
the implementation of the substrate heaters there may be two or
more sensors at each substrate heater in each control system.
[0071] A modification of the FIG. 9 embodiment is to use three or
more control systems arranged side by side over the width of the
substrates and control the transit point at three or more
positions.
[0072] The above embodiments are based on detection of the sharp
transition from a Cu-rich film composition to a Cu-deficient film
composition. Given the various constant conditions the sharp
transition is measured at a relatively fixed position within the
process chamber. Next there will be disclosed some embodiments
which are not based on detection of the sharp transition, but
instead on detection of the composition of CIGS film. There is thus
no need to detect a transition point, but detection can take place
at many places other than that in the vicinity of the transition
point. As will be seen further down detection can take place at the
outlet portion of the process chamber and detection can even take
place outside the process chamber. The following embodiments will
thus provide more freedom as regards detection sites.
[0073] FIG. 10 discloses a control system wherein sensors 18, 19,
30, 31 are omitted and instead a plurality of XRF devices 20 are
arranged downstream the deposition zone near the outlet. Like in
the FIG. 8 arrangement there may be several rows of XRF devices
over the width of the substrate. The XRF devices in each row are
connected to a respective controller 17 which is adapted to control
the composition as well as thickness of the deposited CIGS layer to
and adjust any of the individual evaporation sources 11-13 so as to
obtain a CIGS layer with the desired composition and with the
desired thickness over the width of as well as length of the
substrates.
[0074] In the FIG. 10 embodiment of the invention the amounts of
the respective substances of the CIGS layer as well as the
thickness of the CIGS layer are detected.
[0075] An XRF device is capable of taking absolute measurements of
the amounts of each of the elements in the CIGS layer. As a
consequence also the total amount of each of the elements and
therefore also the thickness of the CIGS layer may be measured. In
principle it is not required to measure the selenium content, since
this is self adjusting. Instead of an XRF device it possible to use
an EDX (Energy Dispersive X-ray spectroscope) device similar to the
kind used in electron microscopes.
[0076] If simultaneous contents and thickness measurements cannot
be taken by one and the same device it is possible to use a
separate device for taking direct or indirect measurements relating
to the composition of the CIGS layer, and a separate device for
measuring the thickness of the CIGS layer, said separate devices
can be positioned outside the deposition system. Examples of
thickness measuring devices are points or needles tracking the
upper surface of the CIGS layer, so called profilometers. Other
examples are optical devices.
[0077] An example of taking indirect measurements of the CIGS layer
composition is to calibrate the element composition against a
physical parameter such as resistance in order to get a measure of
the amount of the respective elements Cu, Ga, In and, not
necessary, Se.
[0078] The order in which a Mo-coated substrate material meets the
various elemental sources 11-13 may be changed and need not be the
one shown in FIGS. 1-10. In FIGS. 11 and 12 an embodiment is
disclosed wherein there are two rows of element sources 11-13 and
XRF devices 20. A substrate first meets two Ga-sources 12, then two
Cu-sources 11 and finally two In-sources 13. Selen sources 26 will
provide the deposition zone with a vapour of selenium in excess.
Each XRF device is connected to a respective controller 17. In FIG.
13 the relative emissions from the elemental sources 11-13 in FIGS.
11 and 12 are shown. The abscissa is the is the distance an Mo
coated substrate 21 travels in deposition zone DZ.
[0079] In FIGS. 10, 11 and 12 the relation Cu/(In+Ga) >1 applied
in the embodiments of FIGS. 1-9 need not be fulfilled since no
distinct detection of a transition point is made.
[0080] Instead a more gradual detection of composition is made with
the XRF devices and the relation Cu/(In+Ga) need not be larger than
1 at any time during deposition.
[0081] The output signal from an XRF device used in FIGS. 11 and 12
is processed and a resulting control signal is schematically shown
in FIG. 14. The control signal measures concentration and is
constant when a correct proportion of elements has been attained in
the deposited CIGS layer. If for example the Cu-concentration is
too high the controller will take a corrective action and reduce
the power supplied to the heater 14 of the Cu evaporation source
11. After correction the control signal returns to the constant
value. Before one can say that the Cu concentration is too high one
has to decide if the reason for the elevated Cu concentration is a
consequence of a reduced concentration of gallium and indium. A
reduced concentration of gallium and indium manifests itself in a
reduced thickness of the deposited CIGS layer. If the thickness is
too small one has to increase the power to the heaters of the Ga-
and In-sources first and thereafter take a new Cu reading before
one increases the power to the heater of the Cu source.
[0082] In FIGS. 15 and 16 still another embodiment of the invention
is shown wherein there are two rows of evaporation sources 11, 12,
13 and 26 arranged, not under the Mo-coated substrates as in the
previously described embodiments, but displaced laterally so that
each row is arranged at the side of and with a distance to the
edges of the substrates 21. If flaws of deposited material get
loose and fall down, or if a Mo-coated glass substrate cracks,
nothing will fall down on the evaporation sources and thereby
disturb the deposition.
[0083] A further feature of the embodiment in FIG. 15 is that the
XRF devices 20 are arranged outside the deposition system, thereby
taking the composition and thickness measurements on substrates
that are outside the process chamber. As a modification of this
feature it is possible to use a single XRF device that is moved
from one row position, where it takes measurements relating to the
evaporations sources along that one row, to the other row position
where it takes measurements relating to the evaporations sources
along the other row of evaporation sources. If there are three rows
of evaporation sources the XRF device would move between the three
row positions taking measurements at each one.
[0084] A further modification of the FIG. 15 embodiment is to use a
further set of Ga evaporation sources 12 arranged downstream the In
evaporation sources 13, as shown with the dashed lines. Still a
further modification is to use the following sequence of
evaporation sources as seen in the travelling direction 22:
In--Cu--Ga. It is thus possible to use several Ga sources and the
positions of the Ga sources in relation to the Cu source may shift.
Another modification is to use the following sequence:
In--Cu--Ga--In.
[0085] FIG. 16 illustrates the arrangement and orientation of two
evaporation sources 11 in relation to a substrate 21 travelling
through the process chamber 7. Each source sits beneath the level
of a transported substrate and at the side thereof at a distance
from the nearby edge 31 of the substrate. As appears at the dashed
lines the emissions from the two evaporation sources overlap in the
middle region of a substrate, thereby both contributing to the
deposition of this area. Areas outside this middle region are
subject to deposition from primarily one source. With the
illustrated arrangement and orientation of evaporation sources it
is possible to obtain a uniform thickness of the layer that is
deposited by the illustrated sources.
* * * * *