U.S. patent application number 13/890249 was filed with the patent office on 2014-01-02 for led panel lighting device.
This patent application is currently assigned to Kocam International Co., Ltd.. The applicant listed for this patent is KOCAM INTERNATIONAL CO., LTD.. Invention is credited to Tsan-Jung Chen.
Application Number | 20140003087 13/890249 |
Document ID | / |
Family ID | 47716803 |
Filed Date | 2014-01-02 |
United States Patent
Application |
20140003087 |
Kind Code |
A1 |
Chen; Tsan-Jung |
January 2, 2014 |
LED Panel Lighting Device
Abstract
The present invention relates to a LED panel lighting device,
comprising: a back framework, an assembled housing, at least two
circuit layer, a plurality of LED chips, a light guide plate, a
bottom reflective member, and an optical diffusion member, wherein
the assembled housing is consisted of a plurality of housing edges,
and the circuit layers are disposed in the housing edges via a
thermal conductive and electric insulating member, so as to be
disposed with the LED chips. In the present invention, it mainly
disposes the circuit layers with the LED chips into the housing
edges by the thermal conductive and electric insulating member,
without using any MCPCBs. Therefore, comparing to the conventional
LED panel lighting device, this LED panel lighting device would not
produce any heat accumulation issue because the MCPCB does not used
in this LED panel lighting device.
Inventors: |
Chen; Tsan-Jung; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
KOCAM INTERNATIONAL CO., LTD. |
NNew Taipei City |
|
TW |
|
|
Assignee: |
Kocam International Co.,
Ltd.
New Taipei City
TW
|
Family ID: |
47716803 |
Appl. No.: |
13/890249 |
Filed: |
May 9, 2013 |
Current U.S.
Class: |
362/606 |
Current CPC
Class: |
G02B 6/0085 20130101;
G02B 6/0083 20130101 |
Class at
Publication: |
362/606 |
International
Class: |
F21V 8/00 20060101
F21V008/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 29, 2012 |
TW |
101212613 |
Claims
1. An LED panel lighting device, comprising: a back framework; an
assembled housing, being consisted of a plurality of housing edges,
and combined with the back framework by way of enclosing the back
framework; at least two circuit layers, being disposed in two
housing edges of the assembled housing by a thermal conductive and
electric insulating member; a plurality of LED chips, being
disposed on the circuit layers; a light guide plate, being disposed
in the assembled housing and on the back framework, and having at
least two light receiving surfaces and a light emitting surface,
wherein the light receiving surfaces is used for receiving the
light emitted from the LED chips, and then the light emitting
surface would further provide a light source; a bottom reflective
member, being disposed on the bottom surface of the light guide
plate; and an optical diffusion member, being disposed on the light
emitting surface of the light guide plate, used for homogenizing
the light source.
2. The LED panel lighting device of claim 1, further comprising: at
least two reflective layers, being formed on the circuit layers
opposite to the LED chips.
3. The LED panel lighting device of claim 1, wherein the housing
edge is selected from the group consisting of: sheet-metal type
housing edge and extrusion-metal type housing edge.
4. The LED panel lighting device of claim 1, wherein the appearance
of the housing edge is selected from the group consisting of:
circular shape, triangular shape, square shape, pentagonal shape,
and hexagonal shape.
5. The LED panel lighting device of claim 2, further comprising a
plurality of lens, which are disposed on the circuit layers
opposite to the LED chips, and used for covering the LED chips, so
as to refract and scatter the light emitted by the LED chips.
6. An LED panel lighting device, comprising: a geometric-shaped
back framework, being consisted of a bottom plate and a plurality
of edges; at least two circuit carrying bodies, being disposed in
the geometric-shaped back framework and closely adjoining the
edges; at least two circuit layers, being disposed on the circuit
carrying bodies by a thermal conductive and electric insulating
member; a plurality of soldering metal sheets, wherein each of the
soldering metal sheets have a first soldering portion and a second
soldering portion, and the first soldering portion being provided
having an insulating layer with a first opening on the inner and
outer surfaces thereof, in which the first opening is used for
being welded with a plurality of welding pads of the circuit
layers; moreover, the second soldering portion being also provided
having an insulating layer with a second opening on the inner and
outer surfaces, and the second opening being used for being welded
with the plurality of welding pads of the circuit layers; a
plurality of LED chips, being welded on the second soldering
portions via the second openings, and electrically connected to the
circuit layers via the soldering metal sheets; a light guide plate,
being disposed in the geometric-shaped back framework and located
on the bottom plate, and having at least two light receiving
surfaces and a light emitting surface, wherein the light receiving
surfaces is used for receiving the light emitted from the LED
chips, and then the light emitting surface would further provide a
light source; a bottom reflective member, being disposed on the
bottom surface of the light guide plate; and an optical diffusion
member, being disposed on the light emitting surface of the light
guide plate, used for homogenizing the light source.
7. The LED panel lighting device of claim 6, further comprising: at
least two reflective members, being disposed at the front of the
soldering metal sheets, and located between the soldering metal
sheets and the LED chips.
8. The LED panel lighting device of claim 6, wherein the appearance
of the geometric-shaped back framework is selected from the group
consisting of: circular shape, triangular shape, square shape,
pentagonal shape, and hexagonal shape.
9. The LED panel lighting device of claim 7, wherein the reflective
member comprises a plurality of through holes, used for exposing
the LED chips out.
10. The LED panel lighting device of claim 6, wherein an included
angle is provided between the first soldering portion and the
second soldering portion of the soldering metal sheet.
11. An LED panel lighting device, comprising: a geometric-shaped
back framework, being consisted of a bottom plate and a plurality
of edges; at least two housing, being disposed in the
geometric-shaped back framework and closely adjoining the edges,
wherein each of the housing have a first disposing portion and a
second disposing portion; at least two circuit layers, being
disposed on the first disposing portions by a thermal conductive
and electric insulating member; a plurality of LED chips, being
disposed on the circuit layers; a light guide plate, being disposed
in the geometric-shaped back framework and located on the bottom
plate, and having at least two light receiving surfaces and a light
emitting surface, wherein the light receiving surfaces is used for
receiving the light emitted from the LED chips, and then the light
emitting surface would further provide a light source; a bottom
reflective member, being disposed on the bottom surface of the
light guide plate; and an optical diffusion member, being disposed
on the light emitting surface of the light guide plate, used for
homogenizing the light source.
12. The LED panel lighting device of claim 11, further comprising:
at least two reflective members, being disposed on the second
disposing portions.
13. The LED panel lighting device of claim 11, wherein the
appearance of the geometric-shaped back framework is selected from
the group consisting of: circular shape, triangular shape, square
shape, pentagonal shape, and hexagonal shape.
14. The LED panel lighting device of claim 12, wherein the housing
is selected from the group consisting of: sheet-metal type housing
and extrusion-metal type housing.
15. The LED panel lighting device of claim 14, wherein the
reflective member comprises a plurality of through holes, used for
exposing the LED chips out.
16. An LED panel lighting device, comprising: a geometric-shaped
back framework, being consisted of a bottom plate and a plurality
of edges; at least two circuit layers, being disposed on the edges
by a thermal conductive and electric insulating member; a plurality
of LED chips, being disposed on the circuit layers; a light guide
plate, being disposed in the geometric-shaped back framework and
located on the bottom plate, and having at least two light
receiving surfaces and a light emitting surface, wherein the light
receiving surfaces is used for receiving the light emitted from the
LED chips, and then the light emitting surface would further
provide a light source; a bottom reflective member, being disposed
on the bottom surface of the light guide plate; and an optical
diffusion member, being disposed on the light emitting surface of
the light guide plate, used for homogenizing the light source.
17. The LED panel lighting device of claim 16, further comprising:
at least two reflective members, being disposed on the circuit
layers.
18. The LED panel lighting device of claim 16, wherein the
appearance of the geometric-shaped back framework is selected from
the group consisting of: circular shape, triangular shape, square
shape, pentagonal shape, and hexagonal shape.
19. The LED panel lighting device of claim 16, further comprises a
plurality of lens 18, which are disposed on the circuit layers
opposite to the LED chips, and used for covering the LED chips, so
as to refract and scatter the light emitted by the LED chips.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to an LED light device, and
more particularly to an LED panel lighting device.
[0003] 2. Description of the Prior Art
[0004] Recently, light emitting diode (LED) devices are widely used
in lighting device of human life, and there are many LED lighting
device sold in the market, for example, LED cup lighting devices,
LED bulbs, LED lamps, LED downlights, and LED panel lighting
devices.
[0005] Please refer to FIG. 1, which illustrates an exploded view
of a conventional LED panel lighting device. As shown in FIG. 1,
the LED panel lighting device 1' includes: a back plate 101', a
reflective sheet 102', a light guide plate 103', an optical
diffusion sheet 104', two LED light bars 20', four edges 30', and
four outer edges 40. The reflective sheet 102', the light guide
plate 103' and the optical diffusion sheet 104' are sequentially
disposed on the back plate 101', and the two LED light bars 20' are
respectively disposed on the left edge 30' and the right edge 30'.
Moreover, after the reflective sheet 1022, the light guide plate
103', the optical diffusion sheet 104', and the LED light bars 20'
are have been installed, the four edges 30' are then assembled to
the four side edges of the back plate 101'; and furthermore, the
four outer edges 40' are used to cover and protect the four edges
30', respectively.
[0006] The above-mentioned LED panel lighting device 1' includes
the advantages of simple structure and being able to be assembled
easily, however, it still has the shortcomings as follows.
[0007] In the LED panel lighting device 1', the LED light bar 20'
is consisted of a MCPCB and a plurality of LED chips; so that, when
the LED chips emit light, the heat produced by the LED chips cannot
be effectively dissipated because the MCPCB is not a good heat
dissipating material, such that the heat produced by the LED chips
would eventually accumulated in the edges 30'; and more seriously,
the accumulated heat may causes damages on the LED chips.
[0008] Accordingly, in view of the conventional LED panel lighting
device still have shortcomings and drawbacks, the inventor of the
present application has made great efforts to make inventive
research thereon and eventually provided an LED panel lighting
device.
SUMMARY OF THE INVENTION
[0009] The first objective of the present invention is to provide
an LED panel lighting device, in which the circuit layers with the
LED chips are disposed into the housing edges of a back framework
by a thermal conductive and electric insulating member, without
using any MCPCBs, such that this LED panel lighting device would
not produce any heat accumulation issue.
[0010] The second objective of the present invention is to provide
an LED panel lighting device, in which the circuit layers with the
LED chips are disposed into the housing edges of a back framework
by a thermal conductive and electric insulating member, without
using any MCPCBs, such the housing edges of the back framework of
this LED panel lighting device can be made to be thinner.
[0011] Accordingly, to achieve the first and second objectives of
the present invention, the inventor of the present invention
provides an LED panel lighting device, comprising:
[0012] a back framework;
[0013] an assembled housing, consisted of a plurality of housing
edges and combined with the back framework by way of enclosing the
back framework;
[0014] at least two circuit layers, disposed in two housing edges
of the assembled housing by a thermal conductive and electric
insulating member;
[0015] a plurality of LED chips, disposed on the circuit
layers;
[0016] a light guide plate, disposed in the assembled housing and
on the back framework, and having at least two light receiving
surfaces and a light emitting surface, wherein the light receiving
surfaces is used for receiving the light emitted from the LED
chips, and then the light emitting surface would further provide a
light source;
[0017] a bottom reflective member, disposed on the bottom surface
of the light guide plate; and
[0018] an optical diffusion member, disposed on the light emitting
surface of the light guide plate, used for homogenizing the light
source.
[0019] The third objective of the present invention is to provide
an LED panel lighting device, in which the circuit layers with the
LED chips are disposed into the disposing portions of housings of a
back framework by a thermal conductive and electric insulating
member, without using any MCPCBs, such that this LED panel lighting
device would not produce any heat accumulation issue.
[0020] The fourth objective of the present invention is to provide
an LED panel lighting device, in which the circuit layers with the
LED chips are disposed into the disposing portions of housings of a
back framework by a thermal conductive and electric insulating
member, without using any MCPCBs, such this LED panel lighting
device can be made to be thinner.
[0021] So that, to achieve the third and fourth objectives of the
present invention, the inventor of the present invention provides
an LED panel lighting device, comprising:
[0022] a geometric-shaped back framework, consisted of a bottom
plate and a plurality of edges;
[0023] at least two circuit carrying bodies, disposed in the
geometric-shaped back framework 10a and closely adjoining the
edges;
[0024] at least two circuit layers, disposed on the circuit
carrying bodies by a thermal conductive and electric insulating
member;
[0025] a plurality of soldering metal sheets, wherein each of the
soldering metal sheets have a first soldering portion and a second
soldering portion, and the first soldering portion are provided
having an insulating layer with a first opening on the inner and
outer surfaces thereof, in which the first opening is used for
being welded with a plurality of welding pads of the circuit
layers; moreover, the second soldering portion is also provided
having an insulating layer with a second opening on the inner and
outer surfaces, and the second opening is used for being welded
with the plurality of welding pads of the circuit layers;
[0026] a plurality of LED chips, welded on the second soldering
portions via the second openings, and electrically connected to the
circuit layers via the soldering metal sheets;
[0027] a light guide plate, disposed in the geometric-shaped back
framework and located on the bottom plate, and having at least two
light receiving surfaces and a light emitting surface, wherein the
light receiving surfaces is used for receiving the light emitted
from the LED chips, and then the light emitting surface would
further provide a light source;
[0028] a bottom reflective member, disposed on the bottom surface
of the light guide plate; and
[0029] an optical diffusion member, disposed on the light emitting
surface of the light guide plate, used for homogenizing the light
source.
[0030] Moreover, to achieve the third and fourth objectives of the
present invention, the inventor of the present invention provides
an LED panel lighting device, comprising:
[0031] a geometric-shaped back framework, consisted of a bottom
plate and a plurality of edges;
[0032] at least two housing, disposed in the geometric-shaped back
framework and closely adjoining the edges, wherein each of the
housing have a first disposing portion and a second disposing
portion;
[0033] at least two circuit layers, disposed on the first disposing
portions by a thermal conductive and electric insulating
member;
[0034] a plurality of LED chips, disposed on the circuit
layers;
[0035] a light guide plate, disposed in the geometric-shaped back
framework and located on the bottom plate, and having at least two
light receiving surfaces and a light emitting surface, wherein the
light receiving surfaces is used for receiving the light emitted
from the LED chips, and then the light emitting surface would
further provide a light source;
[0036] a bottom reflective member, disposed on the bottom surface
of the light guide plate; and
[0037] an optical diffusion member, disposed on the light emitting
surface of the light guide plate, used for homogenizing the light
source.
[0038] The fifth objective of the present invention is to provide
an LED panel lighting device, in which the circuit layers with the
LED chips are disposed into the inner surfaces of a back framework
by a thermal conductive and electric insulating member, without
using any MCPCBs, such this LED panel lighting device can be made
to be thinner.
[0039] So that, to achieve the fifth objective of the present
invention, the inventor of the present invention provides an LED
panel lighting device, comprising:
[0040] a geometric-shaped back framework, consisted of a bottom
plate and a plurality of edges;
[0041] at least two circuit layers, disposed on the edges by a
thermal conductive and electric insulating member;
[0042] a plurality of LED chips, disposed on the circuit
layers;
[0043] a light guide plate, disposed in the geometric-shaped back
framework and located on the bottom plate, and having at least two
light receiving surfaces and a light emitting surface, wherein the
light receiving surfaces is used for receiving the light emitted
from the LED chips, and then the light emitting surface would
further provide a light source;
[0044] a bottom reflective member, disposed on the bottom surface
of the light guide plate; and
[0045] an optical diffusion member, being disposed on the light
emitting surface of the light guide plate, used for homogenizing
the light source.
BRIEF DESCRIPTION OF THE DRAWINGS
[0046] The invention as well as a preferred mode of use and
advantages thereof will be best understood by referring to the
following detailed description of an illustrative embodiment in
conjunction with the accompanying drawings, wherein:
[0047] FIG. 1 is an exploded view of a conventional LED panel
lighting device;
[0048] FIG. 2 is an exploded view of a LED panel lighting device
according to the present invention;
[0049] FIG. 3 is a stereo view of the LED panel lighting device
according to the present invention;
[0050] FIG. 4 is a cross-sectional view of the LED panel lighting
device according to the present invention;
[0051] FIG. 5 is a second stereo view of the LED panel lighting
device according to the present invention;
[0052] FIG. 6 is a third stereo view of the LED panel lighting
device according to the present invention;
[0053] FIG. 7 is a second cross-sectional view of the LED panel
lighting device according to the present invention;
[0054] FIG. 8 is a stereo view of a second embodiment of the LED
panel lighting device according to the present invention;
[0055] FIG. 9 is a cross-sectional view of the second embodiment of
the LED panel lighting device according to the present
invention;
[0056] FIG. 10 is a stereo view of a plurality of soldering metal
sheets of the LED panel lighting device;
[0057] FIG. 11A is a front view of the soldering metal sheets of
the LED panel lighting device;
[0058] FIG. 11B is a bottom view of the soldering metal sheets of
the LED panel lighting device;
[0059] FIG. 12 is a stereo view of a third embodiment of the LED
panel lighting device according to the present invention;
[0060] FIG. 13 is a cross-sectional view of the third embodiment of
the LED panel lighting device according to the present
invention;
[0061] FIG. 14 is a stereo view of a fourth embodiment of the LED
panel lighting device according to the present invention;
[0062] FIG. 15 is a cross-sectional view of the fourth embodiment
of the LED panel lighting device according to the present
invention;
[0063] FIG. 16 is a second cross-sectional view of the fourth
embodiment of the LED panel lighting device according to the
present invention;
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0064] To more clearly describe an LED panel lighting device
according to the present invention, embodiments of the present
invention will be described in detail with reference to the
attached drawings hereinafter.
[0065] Please refer to FIG. 2, FIG. 3 and FIG. 4, there are shown
an exploded view, a stereo view and a cross-sectional view of the
LED panel lighting device according to the present invention. As
shown in FIG. 2, FIG. 3 and FIG. 4, the LED panel lighting device 1
of the present invention consists of: a back framework 10, an
assembled housing 11, two circuit layers 12, a plurality of LED
chips 13, a light guide plate 15, a bottom reflective member 16,
and an optical diffusion member 17.
[0066] The assembled housing 11 is consisted of a plurality of
housing edges 111, and combined with the back framework 10 by way
of enclosing the back framework 10. In some exemplary embodiments,
the housing edges 111 can be a sheet-metal type housing edge or an
extrusion-metal type housing edge. The two circuit layers 12 are
respectively disposed in the two housing edges 111 of the assembled
housing 11 by a thermal conductive and electric insulating member,
and the LED chips 13 are disposed on the circuit layers 12. The
light guide plate 15 is disposed in the assembled housing 11 and on
the back framework 10. As shown in FIGs., the light guide plate 15
has two light receiving surfaces 151 and a light emitting surface
152, wherein the light receiving surfaces 151 is used for receiving
the light emitted from the LED chips 13, and then the light
emitting surface 152 would further provide a light source. In
addition, the bottom reflective member 16 is disposed on the bottom
surface of the light guide plate 15, and the optical diffusion
member 17 is disposed on the light emitting surface 152 of the
light guide plate 15, used for homogenizing the light source.
Moreover, In the present invention, two reflective layers are
formed on the inner surface of the housing edges 111 by way of
spraying coating, and opposite to the LED chips 13.
[0067] Continuously referring to FIG. 5 and FIG. 6, there are shown
a second stereo view and a third stereo view of the LED panel
lighting device, respectively. As shown in FIG. 5 and FIG. 6, the
appearance of the LED panel lighting device 1 is limited by the
number of the housing edges 111. For example, if the assembled
housing 11 of the LED panel lighting device 1 is consisted of 3
housing edges 111, the appearance of the LED panel lighting device
1 is triangular shape; and similarly, f the assembled housing 11 of
the LED panel lighting device 1 is consisted of 4 housing edges
111, the appearance of the LED panel lighting device 1 is square
shape. Of course, depending on different number of the housing
edges 111, the appearance of the LED panel lighting device 1 can
also be circular shape, pentagonal shape and hexagonal shape.
[0068] Please refer to FIG. 7, which illustrates a second
cross-sectional view of the LED panel lighting device. For reducing
the total amount of the LED chips 13, a plurality of lens 18 are
disposed on the circuit layers 12 opposite to the LED chips 13 as
shown in FIG. 7, and the lens 18 are used for covering the LED
chips 13, so as to refract and scatter the light emitted by the LED
chips 13. Therefore, entire brightness of the LED panel lighting
device 1 even if the number of the LED chips 13 have been
reduced.
[0069] Thus, through the descriptions, the LED panel lighting
device of the present invention has been completely introduced and
disclosed. In summary, the present invention has the following
advantages:
1. Comparing to the conventional LED panel lighting device, the
present invention attaches the circuit layers 12 in the housing
edges 111 by a thermal conductive and electric insulating layer; so
that, this LED panel lighting device 1 would not produce any heat
accumulation issue because of without any MCPCB. Therefore, when
the LED chips emit light, the heat produced by the LED chips would
be rapidly conducted to the housing edges 111, so as to be
dissipated. 2. Moreover, because without the MCPCB, the housing
edges 111 can be made to be thinner.
[0070] The LED panel lighting device of the present invention
further includes a second embodiment. Please refer to FIG. 8 and
FIG. 9, there are shown a cross-sectional view and a stereo view of
the second embodiment of the LED panel lighting device. As shown in
FIG. 8 and FIG. 9, the second embodiment of the LED panel lighting
device 1 consists of: a geometric-shaped back framework 10a, two
circuit carrying bodies 111a, two circuit layers 12a, a plurality
of soldering metal sheets 19a, a plurality of LED chips 13a, a
light guide plate 15a, a bottom reflective member 16a, and an
optical diffusion member 17a, wherein the geometric-shaped back
framework 10a is consisted of a bottom plate 101a and a plurality
of edges 102a, and the two circuit carrying bodies 111a are
disposed in the geometric-shaped back framework 10a and closely
adjoining the edges 102a. In addition, the two circuit layers 12a
are disposed on the circuit carrying bodies 111a by a thermal
conductive and electric insulating member.
[0071] Continuously referring to FIG. 8 and FIG. 9, and please
simultaneously refer to FIG. 10, FIG. 11A, and FIG. 11B, there are
shown a stereo view, a front view and a bottom view of the
soldering metal sheets. As shown in FIG. 10, in the second
embodiment of the LED panel lighting device 1, each of the
soldering metal sheets 19a have a first soldering portion 191a and
a second soldering portion 192a, and the first soldering portion
191a is provided with an insulating layer with a first opening
1911a on the inner and outer surfaces thereof. Moreover, as shown
in FIG. 11B, the first opening 1911a is used for being welded with
a plurality of welding pads of the circuit layers 12a. Furthermore,
as shown in FIG. 11B, the second soldering portion 192a is also
provided with an insulating layer with a second opening 1921a on
the inner and outer surfaces, and the second opening 1921a is used
for being welded with the plurality of welding pads of the circuit
layers 12a.
[0072] Inheriting to above descriptions, the LED chips 13a are
welded on the second soldering portions 192a via the second
openings 1921a, and electrically connected to the circuit layers
via the soldering metal sheets 19a. Besides, an includes angle is
provide between the first soldering portion 191a and the second
soldering portion 192a, used for adjusting the light emitting
position of the LED chips 13a, so as to facilitate the light guide
plate receive the light efficiently.
[0073] The light guide plate 15a is disposed in the
geometric-shaped back framework 10a and located on the bottom plate
101a. The light guide plate 15a has two light receiving surfaces
151a and a light emitting surface 152a, wherein the light receiving
surfaces 151a is used for receiving the light emitted from the LED
chips 13a, and then the light emitting surface 152a would further
provide a light source. In addition, the bottom reflective member
16a is disposed on the bottom surface of the light guide plate 15a,
and the optical diffusion member 17a is disposed on the light
emitting surface 152a of the light guide plate 15a, used for
homogenizing the light source.
[0074] Moreover, in the second embodiment of the LED panel lighting
device 1 of the present invention, two reflective members 14a are
disposed at the front of the soldering metal sheets 19a, and
located between the soldering metal sheets 19a and the LED chips
13a. Each of the reflective members 14a have a plurality of through
hole 141a, used for exposing the LED chips 13a out. Besides, what
does the same to the above-mentioned embodiment is that, in the
second embodiment of the LED panel lighting device 1, the
appearance of the second embodiment of the LED panel lighting
device 1 can be fabricated to be circular shape, triangular shape,
square shape, pentagonal shape, or hexagonal shape depending on the
appearance of the geometric-shaped back framework 10a.
[0075] Thus, through the descriptions, the second embodiment of the
LED panel lighting device of the present invention has been
completely introduced and disclosed. In summary, the present
invention has the following advantages:
1. Comparing to the conventional LED panel lighting device, the
present invention attaches the circuit layers 12a in the circuit
carrying bodies 111a by a thermal conductive and electric
insulating layer; so that, this LED panel lighting device 1 would
not produce any heat accumulation issue because of without any
MCPCB. Therefore, when the LED chips emit light, the heat produced
by the LED chips would be rapidly conducted to the circuit carrying
bodies 111a, so as to be dissipated. 2. Moreover, because without
the MCPCB, the second embodiment of the LED panel lighting device s
can be made to be thinner.
[0076] The LED panel lighting device of the present invention
further includes a third embodiment. Please refer to FIG. 12 and
FIG. 13, there are shown a cross-sectional view and a stereo view
of the third embodiment of the LED panel lighting device. As shown
in FIG. 12 and FIG. 13, the third embodiment of the LED panel
lighting device 1 consists of: a geometric-shaped back framework
10b, two housing 11b, two circuit layers 12b, a plurality of LED
chips 13b, a light guide plate 15b, a bottom reflective member 16b,
and an optical diffusion member 17b, wherein the geometric-shaped
back framework 10b is consisted of a bottom plate 101b and a
plurality of edges 102b. What does the same to above-mentioned
second embodiment is that, the appearance of the third embodiment
of the LED panel lighting device 1 can be fabricated to be circular
shape, triangular shape, square shape, pentagonal shape, or
hexagonal shape depending on the appearance of the geometric-shaped
back framework 10b.
[0077] The housing 11b are disposed in the geometric-shaped back
framework 10b and closely adjoining the edges 102b, wherein each of
the housing 11b have a first disposing portion 111b and a second
disposing portion 121b. The two circuit layers 12b are disposed on
the first disposing portions 111b by a thermal conductive and
electric insulating member, and the LED chips 13b are disposed on
the circuit layers 12b. As shown in FIGs., the first disposing
portion 111b and the second disposing portion 121b are the bottom
edge and the side edge of the housing 11b; however, that does not
be used to limit the structure of the housing 11b. In some
exemplary embodiment, the first disposing portion 111b and the
second disposing portion 121b can also be the side edge and the
bottom edge of the housing 11b.
[0078] In addition, the light guide plate 15b is disposed in the
geometric-shaped back framework 10b and located on the bottom plate
101b. The light guide plate 15b has two light receiving surfaces
151b and a light emitting surface 152b, wherein the light receiving
surfaces 151b is used for receiving the light emitted from the LED
chips 13b, and then the light emitting surface 152b would further
provide a light source. Moreover, the bottom reflective member 16b,
being disposed on the bottom surface of the light guide plate 15b,
and the optical diffusion member 17b, being disposed on the light
emitting surface 152b of the light guide plate 15b, used for
homogenizing the light source. As shown in FIG. 12, because the
circuit layers 12b are attached to the side edges of the housings
11b, the LED chips 13a disposed on the first disposing portion 111b
respectively pass through out of the through holes 141b of the
reflective layers 14b.
[0079] Thus, through the descriptions, the third embodiment of the
LED panel lighting device of the present invention has been
completely introduced and disclosed. In summary, the present
invention has the following advantages:
[0080] Comparing to the conventional LED panel lighting device, the
present invention attaches the circuit layers 12b in the first
disposing portions 111b of the housings 11b by a thermal conductive
and electric insulating layer; so that, this LED panel lighting
device 1 would not produce any heat accumulation issue because of
without any MCPCB. Therefore, when the LED chips emit light, the
heat produced by the LED chips would be rapidly conducted to the
housing 11b, so as to be dissipated.
[0081] 2. Moreover, because without the MCPCB, the third embodiment
of the LED panel lighting device s can be made to be thinner.
[0082] The LED panel lighting device of the present invention
further includes a fourth embodiment. Please refer to FIG. 14 and
FIG. 15, there are shown a cross-sectional view and a stereo view
of the fourth embodiment of the LED panel lighting device. As shown
in FIG. 14 and FIG. 15, the fourth embodiment of the LED panel
lighting device 1 consists of: a geometric-shaped back framework
10c, two circuit layers 12c, a plurality of LED chips 13c, a light
guide plate 15c, a bottom reflective member 16c, and an optical
diffusion member 17c, wherein the two circuit layers 12c are
disposed on the edges 102c by a thermal conductive and electric
insulating member. What does the same to above-mentioned third
embodiment is that, the appearance of the fourth embodiment of the
LED panel lighting device 1 can be fabricated to be circular shape,
triangular shape, square shape, pentagonal shape, or hexagonal
shape depending on the appearance of the geometric-shaped back
framework 10c.
[0083] Inheriting to above descriptions, the LED chips 13c is
disposed on the circuit layers 12c, and the light guide plate 15c
is disposed in the geometric-shaped back framework 10c and located
on the bottom plate 101c. The light guide plate 15c has two light
receiving surfaces 151c and a light emitting surface 152c, wherein
the light receiving surfaces 151c is used for receiving the light
emitted from the LED chips 13c, and then the light emitting surface
152c would further provide a light source. Moreover, the bottom
reflective member 16c is disposed on the bottom surface of the
light guide plate 15c, and the optical diffusion member 17c is
disposed on the light emitting surface 152c of the light guide
plate 15c, used for homogenizing the light source.
[0084] Please further refer to FIG. 16, which illustrates a second
cross-sectional view of the fourth embodiment of the LED panel
lighting device. For reducing the total amount of the LED chips
13c, a plurality of lens 18c are disposed on the circuit layers 12c
opposite to the LED chips 13c as shown in FIG. 16, and the lens 18c
are used for covering the LED chips 13c, so as to refract and
scatter the light emitted by the LED chips 13c. Therefore, entire
brightness of the LED panel lighting device 1 even if the number of
the LED chips 13c have been reduced.
[0085] The above description is made on embodiments of the present
invention. However, the embodiments are not intended to limit scope
of the present invention, and all equivalent implementations or
alterations within the spirit of the present invention still fall
within the scope of the present invention.
* * * * *