U.S. patent application number 13/530112 was filed with the patent office on 2013-12-26 for electronic device, decorated article, decoration film, manufacturing method for decorated article and manufacturing method for decoration film.
This patent application is currently assigned to Etansi Inc.. The applicant listed for this patent is Wei-Hsiang Huang. Invention is credited to Wei-Hsiang Huang.
Application Number | 20130342423 13/530112 |
Document ID | / |
Family ID | 49773988 |
Filed Date | 2013-12-26 |
United States Patent
Application |
20130342423 |
Kind Code |
A1 |
Huang; Wei-Hsiang |
December 26, 2013 |
ELECTRONIC DEVICE, DECORATED ARTICLE, DECORATION FILM,
MANUFACTURING METHOD FOR DECORATED ARTICLE AND MANUFACTURING METHOD
FOR DECORATION FILM
Abstract
An electronic device, a decorated article, a decoration film, a
manufacturing method for the decorated article and a manufacturing
method for the decoration film are provided. The decoration film
includes a substrate, a releasing layer formed on the substrate, a
durable layer formed on the releasing layer, an antenna formed on
the durable layer and an adhesive layer covering the durable layer
and the antenna. The durable layer has an opening. The antenna
covers the opening. The electronic device includes a casing and an
electronic module disposed inside the casing. The casing includes a
body, an antenna transferred on a surface of the body and a durable
layer covering the surface of the body and part of the antenna. The
durable layer has an opening, and other part of the antenna is
exposed in the opening. The electronic module is electrically
connected to the antenna.
Inventors: |
Huang; Wei-Hsiang; (Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Huang; Wei-Hsiang |
Taipei City |
|
TW |
|
|
Assignee: |
Etansi Inc.
Taoyuan County
TW
|
Family ID: |
49773988 |
Appl. No.: |
13/530112 |
Filed: |
June 22, 2012 |
Current U.S.
Class: |
343/873 ;
264/259; 427/58 |
Current CPC
Class: |
B29C 45/14811 20130101;
B29C 45/14639 20130101; H01Q 1/40 20130101; H01Q 1/44 20130101;
B29L 2031/3437 20130101; B29L 2031/3456 20130101; B29C 45/14827
20130101; B29K 2995/0087 20130101; B29L 2031/3481 20130101 |
Class at
Publication: |
343/873 ;
264/259; 427/58 |
International
Class: |
H01Q 1/40 20060101
H01Q001/40; B05D 5/12 20060101 B05D005/12; B29C 45/14 20060101
B29C045/14 |
Claims
1. An electronic device comprising: a casing comprising: a body; an
antenna transferred on a surface of the body; a durable layer
covering the surface of the body and part of the antenna, wherein
the durable layer has an opening, and other part of the antenna is
exposed in the opening; and an electronic module disposed inside
the casing and electrically connected to the antenna.
2. The electronic device according to claim 1, further comprising a
conductive pad filled in the opening and electrically connected to
the antenna, wherein the electronic module is electrically
connected to the antenna through the conductive pad.
3. The electronic device according to claim 2, wherein the material
of the conductive pad is conductive polymer, silver paste or
conductive ink.
4. The electronic device according to claim 1, wherein the material
of the antenna is copper, silver, gold, aluminium, titanium, indium
tin oxide or antimony tin oxide.
5. A decorated article comprising: an article body; an antenna
transferred on a surface of the article body; and a durable layer
covering the surface of the article body and part of the antenna,
wherein the durable layer has an opening, and other part of the
antenna is exposed in the opening.
6. The decorated article according to claim 5, further comprising a
conductive pad filled in the opening and electrically connected to
the antenna.
7. The decorated article according to claim 6, wherein the material
of the conductive pad is conductive polymer, silver paste or
conductive ink.
8. The decorated article according to claim 5, wherein the material
of the antenna is copper, silver, gold, aluminium, titanium, indium
tin oxide or antimony tin oxide.
9. A decoration film comprising: a substrate; a releasing layer
formed on the substrate; a durable layer formed on the releasing
layer and having an opening; an antenna formed on the durable layer
and covering the opening; and an adhesive layer covering the
durable layer and the antenna.
10. The decorated film according to claim 9, further comprising a
conductive pad filled in the opening and electrically connected to
the antenna.
11. The decorated film according to claim 10, wherein the material
of the conductive pad is conductive polymer, silver paste or
conductive ink.
12. The decorated film according to claim 9, wherein the material
of the antenna is copper, silver, gold, aluminium, titanium, indium
tin oxide or antimony tin oxide.
13. A manufacturing method for a decorated article comprising:
providing a decoration film comprising: a substrate; a releasing
layer formed on the substrate; a durable layer formed on the
releasing layer and having an opening; an antenna formed on the
durable layer and covering the opening; and an adhesive layer
covering the durable layer and the antenna; feeding the decoration
film into a mold with the substrate in contact with an inner
surface of the mold; injecting a plastic material into the mold for
forming an article body in the mold; taking the article body with
the decoration film out from the mold; and simultaneously removing
both the substrate and the releasing layer.
14. A manufacturing method for a decoration film comprising:
forming a releasing layer on a substrate; forming a durable layer
having an opening on the releasing layer; forming an antenna
covering the opening on the durable layer; and forming an adhesive
layer which covers the durable layer and the antenna.
15. The manufacturing method according to claim 14, further
comprising forming a conductive pad filled in the opening and
electrically connected to the antenna.
16. The manufacturing method according to claim 14, wherein forming
the antenna comprising: forming a mask layer on the durable layer;
forming a conductive layer on the mask layer; and removing the mask
layer, so that the antenna is left on the durable layer.
17. The manufacturing method according to claim 16, wherein the
conductive layer is formed by sputtering, physical vapor deposition
or chemical vapor deposition.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to an electronic
device with an antenna transferred thereon, a decorated article
with an antenna transferred thereon, a decoration film, a
manufacturing method for the decorated article and a manufacturing
method for the decoration film.
[0003] 2. Description of Related Art
[0004] Following a progress of integrated circuit technology in
recent years, wireless communication devices have become lighter,
thinner and smaller. Responding to said tendency of the wireless
communication devices, antenna integrated on casing for the
wireless communication devices are provided. A two-component
injection is applied for manufacturing a casing with integrated
antenna. In the two-component injection, a main body of the casing
is formed by a first injection molding. Thereafter, active metal
layer is formed on the main body of the casing by a second
injection molding to form a pattern of an antenna. Afterward, the
antenna is finished on the active metal layer by wet plating.
However, it is difficult to form the active metal layer in correct
pattern by the second injection molding, and the molds for the
two-component injection are expensive.
[0005] Meanwhile, a laser direct structuring is applied for
manufacturing a casing with integrated antenna. In the laser direct
structuring, the injection material added with photochemical
reaction promoter is applied in an injection molding for forming
the casing. Thereafter, the casing added with photochemical
reaction promoter is radiated by laser. After radiated by laser,
the photochemical reaction promoter is transformed into metal
grain. That is, a pattern of an antenna constituted with metal
grain can be formed on surface of the casing by laser radiation.
Afterward, the antenna is finished on the metal grain by wet
plating. However, laser radiation is expensive, and the injection
material added with photochemical reaction promoter is also
expensive. Moreover, whatever the two-component injection or the
laser direct structuring, the wet plating for finishing the antenna
increases cost and process period, and the wet plating is not
friendly to the earth.
SUMMARY OF THE INVENTION
[0006] Accordingly, the present invention is directed to an
electronic device having antenna integrated on a casing.
[0007] The present invention is directed to a decorated article
having antenna integrated thereon.
[0008] The present invention is directed to a decoration film
having antenna integrated therein.
[0009] The present invention is directed to a manufacturing method
for a decorated article having antenna integrated thereon.
[0010] The present invention is directed to a manufacturing method
for a decoration film having antenna integrated therein.
[0011] An electronic device of the present invention includes a
casing and an electronic module disposed inside the casing. The
casing includes a body, an antenna transferred on a surface of the
body and a durable layer covering the surface of the body and part
of the antenna. The durable layer has an opening, and other part of
the antenna is exposed in the opening. The electronic module is
electrically connected to the antenna.
[0012] In one embodiment of the present invention, the electronic
device further includes a conductive pad filled in the opening and
electrically connected to the antenna. The electronic module is
electrically connected to the antenna through the conductive
pad.
[0013] In one embodiment of the present invention, the material of
the conductive pad is conductive polymer, silver paste or
conductive ink
[0014] In one embodiment of the present invention, the material of
the antenna is copper, silver, gold, aluminium, titanium, indium
tin oxide or antimony tin oxide.
[0015] A decorated article of the present invention includes an
article body, an antenna transferred on a surface of the article
body and a durable layer covering the surface of the article body
and part of the antenna. The durable layer has an opening, and
other part of the antenna is exposed in the opening.
[0016] In one embodiment of the present invention, the decorated
article further includes a conductive pad filled in the opening and
electrically connected to the antenna.
[0017] In one embodiment of the present invention, the material of
the conductive pad is conductive polymer, silver paste or
conductive ink.
[0018] In one embodiment of the present invention, the material of
the antenna is copper, silver, gold, aluminium, titanium, indium
tin oxide or antimony tin oxide.
[0019] A decoration film of the present invention includes a
substrate, a releasing layer formed on the substrate, a durable
layer formed on the releasing layer, an antenna formed on the
durable layer and an adhesive layer covering the durable layer and
the antenna. The durable layer has an opening. The antenna covers
the opening.
[0020] In one embodiment of the present invention, the decorated
film further includes a conductive pad filled in the opening and
electrically connected to the antenna.
[0021] In one embodiment of the present invention, the material of
the conductive pad is conductive polymer, silver paste or
conductive ink.
[0022] In one embodiment of the present invention, the material of
the antenna is copper, silver, gold, aluminium, titanium, indium
tin oxide or antimony tin oxide.
[0023] A manufacturing method for a decorated article of the
present invention includes following steps. Providing a decoration
film including a substrate, a releasing layer formed on the
substrate, a durable layer formed on the releasing layer and having
an opening, an antenna formed on the durable layer and covering the
opening, and an adhesive layer covering the durable layer and the
antenna. Feeding the decoration film into a mold with the substrate
in contact with an inner surface of the mold. Injecting a plastic
material into the mold for forming an article body in the mold.
Taking the article body with the decoration film out from the mold.
Simultaneously removing both the substrate and the releasing
layer.
[0024] A manufacturing method for a decoration film of the present
invention includes following steps. Forming a releasing layer on a
substrate. Forming a durable layer having an opening on the
releasing layer. Forming an antenna covering the opening on the
durable layer. Forming an adhesive layer which covers the durable
layer and the antenna.
[0025] In one embodiment of the present invention, the
manufacturing method further includes forming a conductive pad
filled in the opening and electrically connected to the
antenna.
[0026] In one embodiment of the present invention, the step of
forming the antenna includes: forming a mask layer on the durable
layer; forming a conductive layer on the mask layer; and removing
the mask layer, so that the antenna is left on the durable
layer.
[0027] In one embodiment of the present invention, the conductive
layer is formed by sputtering, physical vapor deposition or
chemical vapor deposition.
[0028] As described above, the present invention provides an
electronic device, a decorated article, a decoration film, a
manufacturing method for the decorated article and a manufacturing
method for the decoration film, wherein the antenna can be
integrated to an article quickly with lower cost.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0030] FIGS. 1A-1F are the cross-section views of a manufacturing
method for a decoration film of an embodiment of the present
invention.
[0031] FIGS. 2A-2D are the cross-section views of a manufacturing
method for a decorated article of an embodiment of the present
invention.
[0032] FIG. 3 is the explode view of an electronic device of an
embodiment of the present invention.
DESCRIPTION OF THE EMBODIMENTS
[0033] Reference will now be made in detail to the present
preferred embodiments of the invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0034] FIGS. 1A-1F are the cross-section views of a manufacturing
method for a decoration film of an embodiment of the present
invention. Please refer to FIG. 1A, in the manufacturing method for
a decoration film of an embodiment of the present invention, a
releasing layer 120 is formed on a substrate 110 first. The
material of the substrate 110 can be polyethylene terephthalate,
polyethylene naphthalate, glycol-polyethylene terephathalate,
thermoplastic polyurethane, polyurethane, polypropylene,
polycarbonate, amorphous polyethylene terephthalate, polyvinyl
chloride, cellulose triacetate, polyamide, styrene-methyl
methacrylate copolymer, cyclic olefin copolymer, or a combination
of the aforementioned materials. Thereafter, a durable layer 130
having an opening 132 is formed on the releasing layer 120. The
material of the durable layer 130 can be radiant curable
multifunctional acrylate, epoxide, vinyl ester resin, diallyl
phthalate, or vinyl ether, or a combination of the aforementioned
materials. Radiant curable multifunctional acrylate can be any one
of the following kinds: epoxy acrylate, polyurethane acrylate,
polyester acrylate, siloxane acrylate, or glycidyl acrylate. The
opening 132 of the durable layer 130 can be formed by stencil
printing the durable layer 130 or other suitable method, and the
opening 132 can be multiple.
[0035] Please refer to FIG. 1B, conductive pads 140 are selectively
filled in the openings 132. The quantity of the conductive pads 140
is corresponding to the quantity of the openings 132. The material
of the conductive pads 140 is conductive polymer, silver paste or
conductive ink
[0036] Please refer to FIG. 1E, an antenna 150 is formed for
covering the openings 132 on the durable layer. Once the conductive
pads 140 are selectively formed, the antenna 150 covers and
electrically connects to the conductive pads 140. The material of
the antenna 150 can be copper, silver, gold, aluminium, titanium,
indium tin oxide or antimony tin oxide.
[0037] In the present embodiment, the step of forming the antenna
140 includes following steps. Please refer to FIG. 1C, a mask layer
160 is formed on the durable layer. The mask layer 160 can be
formed by stencil printing. Please refer to FIG. 1D, a conductive
layer 152 is formed on the mask layer 160. The conductive layer 152
can be formed by sputtering, physical vapor deposition or chemical
vapor deposition.
[0038] Thereafter, the mask layer 152 is removed, so that the
antenna 150 is left on the durable layer 130, as shown in FIG.
1E.
[0039] Afterward, an adhesive layer 170 is formed and covers the
durable layer 130 and the antenna 150. Briefly, the decoration film
100 of the present embodiment includes a substrate 110, a releasing
layer 120 formed on the substrate 110, a durable layer 130 formed
on the releasing layer 120, an antenna 150 formed on the durable
layer 130 and an adhesive layer 170 covering the durable layer 130
and the antenna 150. The durable layer 130 has an opening 132. The
antenna 150 covers the opening 132. A pattern of the antenna 150
can be a design choice for better signal transmitting and receiving
ability. Moreover, the decoration film 100 of the present
embodiment may further include a conductive pad 140 filled in the
opening 132 and electrically connected to the antenna 150.
[0040] The antenna 150 formed inside the decoration film 100 can be
transferred to a surface of any article quickly and simply.
Meanwhile, no chemical for electroplating is necessary to
manufacture the decoration film 100, so that the decoration film
100 is friendly to the earth.
[0041] FIGS. 2A-2D are the cross-section views of a manufacturing
method for a decorated article of an embodiment of the present
invention. Please refer to FIG. 2A, in the manufacturing method for
a decorated article of an embodiment of the present invention, a
decoration film 100 as shown in FIG. 1E is fed into a mold 50 with
the substrate 110 in contact with an inner surface 52 of the mold
50. Please refer to FIG. 2B, a plastic material is injected into
the mold 50 for forming an article body 210 in the mold 50. Please
refer to FIG. 2C, the article body 210 with the decoration film 100
is took out from the mold 50. Afterward, both the substrate 110 and
the releasing layer 120 are simultaneously removed so that the
decorated article 200 as shown in FIG. 2D is finished.
[0042] Briefly, the decorated article 200 of the present embodiment
includes the article body 210, an antenna 150 transferred on a
surface 212 of the article body 210, and a durable layer 130
covering the surface of the article body 210 and part of the
antenna 150. The durable layer 130 has an opening 132, and other
part of the antenna 150 is exposed in the opening 132. The
decorated article 210 may further include the conductive pad 140
filled in the opening 132 and electrically connected to the antenna
150. The antenna 150 is transferred to the article body 210 while
the article body 210 is formed inside the mold 50. Therefore, the
decorated article 200 with integrated antenna 150 can be formed
quickly and simply. Meanwhile, no chemical for electroplating is
necessary to manufacture the decorated article 200, so that the
decorated article 200 is friendly to the earth.
[0043] FIG. 3 is the explode view of an electronic device of an
embodiment of the present invention. Please refer to FIG. 2A, the
electronic device 300 of the embodiment of the present invention
includes a casing 310 and an electronic module 320 disposed inside
the casing 310. The casing 310 includes a body 312, an antenna 150
transferred on a surface of the body 312 and a durable layer 130
covering the surface of the body 312 and part of the antenna 150.
The durable layer 130 has an opening 132, and other part of the
antenna 150 is exposed in the opening 132. The electronic module
320 is electrically connected to the antenna 150. In the present
embodiment, the electronic module 320 is electrically connected to
the antenna 150 through the conductive pad 140. In another
embodiment, the electronic module 320 can be directly connected to
the antenna 150 in the opening 132. The electronic device 300 with
integrated antenna 150 can be formed quickly and simply Meanwhile,
no chemical for electroplating is necessary to manufacture the
antenna 150 of the electronic device 300, so that the electronic
device 300 is friendly to the earth.
[0044] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *