U.S. patent application number 13/542782 was filed with the patent office on 2013-12-12 for pre-molded cavity 3d packaging module with layout.
This patent application is currently assigned to Keng-Hung Lin. The applicant listed for this patent is Ming-Lun Chang, Keng-Hung Lin, Yu-Min Lin. Invention is credited to Ming-Lun Chang, Keng-Hung Lin, Yu-Min Lin.
Application Number | 20130329374 13/542782 |
Document ID | / |
Family ID | 49715149 |
Filed Date | 2013-12-12 |
United States Patent
Application |
20130329374 |
Kind Code |
A1 |
Lin; Keng-Hung ; et
al. |
December 12, 2013 |
Pre-molded Cavity 3D Packaging Module with Layout
Abstract
A pre-molded cavity 3D packaging module with layout is
disclosed. The 3D packaging module includes a pre-molded cavity. A
wall and a vertical plane of the pre-molded cavity form an inclined
angle of more than 3.degree.. An intersecting region between a
bottom and a sidewall of the 3D packaging module has a curved
profile to facilitate smooth circuit layout.
Inventors: |
Lin; Keng-Hung; (Hsinchu
County, TW) ; Chang; Ming-Lun; (Hsinchu County,
TW) ; Lin; Yu-Min; (Kaohsiung City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Lin; Keng-Hung
Chang; Ming-Lun
Lin; Yu-Min |
Hsinchu County
Hsinchu County
Kaohsiung City |
|
TW
TW
TW |
|
|
Assignee: |
Keng-Hung Lin
Hsinchu County
TW
CMSC, Inc.
Hsinchu
TW
|
Family ID: |
49715149 |
Appl. No.: |
13/542782 |
Filed: |
July 6, 2012 |
Current U.S.
Class: |
361/728 ;
174/520 |
Current CPC
Class: |
H01L 23/10 20130101;
H05K 2201/0999 20130101; H01L 2224/48091 20130101; H01L 25/165
20130101; H05K 1/0284 20130101; H01L 2224/16225 20130101; H01L
2224/48091 20130101; H01L 2924/19105 20130101; H01L 2924/00014
20130101 |
Class at
Publication: |
361/728 ;
174/520 |
International
Class: |
H05K 5/00 20060101
H05K005/00; H05K 7/00 20060101 H05K007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 6, 2012 |
TW |
101120248 |
Claims
1. A pre-molded cavity three-dimensional (3D) packaging module with
layout, comprising: a first circuit with at least a specific
layout; and at least one packaging cavity with the first circuit on
a cavity surface thereof, and forming a receiving space by a cavity
bottom and a cavity sidewall surrounding the cavity sidewall,
wherein the cavity sidewall forms an inclined angle greater than
3.degree. with a vertical axis of the cavity bottom, and the
receiving space is for receiving at least one component to be
electrically coupled with the first circuit.
2. The pre-molded cavity 3D packaging module with layout of claim
1, wherein an intersecting region between the cavity sidewall and
the cavity bottom is a curved intersecting region to facilitate the
first circuit to form smoothly from the cavity bottom through the
curved intersecting region onto the cavity sidewall.
3. The pre-molded cavity 3D packaging module with layout of claim
2, wherein the cavity bottom at the curved intersecting region
forms steps of different heights to facilitate staggered wire
layouts or wire bonding on different vertical planes.
4. The pre-molded cavity 3D packaging module with layout of claim
1, wherein the at least one packaging cavity includes at least one
via through which the first circuit is electrically coupled to
external circuits.
5. The pre-molded cavity 3D packaging module with layout of claim
4, wherein the outer surface of the at least one packaging cavity
includes at least one signal transmitting region, which transmits
incoming/outgoing signals to/from the first circuit through the
first via.
6. The pre-molded cavity 3D packaging module with layout of claim
5, wherein the at least one signal transmitting region is a module
testing region.
7. The pre-molded cavity 3D packaging module with layout of claim
1, wherein the at least one packaging cavity includes at least one
heat-dissipating path, wherein the at least one heat-dissipating
path has at least one heat-dissipating area exposed from the outer
surface of the packaging cavity.
8. The pre-molded cavity 3D packaging module with layout of claim
1, wherein the at least one packaging cavity includes at least one
air hole for exchanging air with an external environment to form an
air-type packaging module, wherein a material is filled into the
air hole to block the air hole, and during assembly of the
packaging cavity, inert gas is filled into it, or it is heated to
remove moisture to form a sealed packaging module.
9. The pre-molded cavity 3D packaging module with layout of claim
1, further comprising at least one first cavity holder with a
length greater than the width of the opening of the at least one
packaging cavity.
10. The pre-molded cavity 3D packaging module with layout of claim
9, wherein the first cavity holder includes a second circuit with
at least a specific layout and at least one second via, the second
circuit is formed on a surface of the first cavity holder, and at
least one signal transmitting region is formed on the other surface
of the first cavity holder for transmitting signals to/from the
second circuit through the second via.
11. The pre-molded cavity 3D packaging module with layout of claim
1, wherein the cavity sidewall has at least one step forming a
staircase-like surface with at least one ledge in the receiving
space.
12. The pre-molded cavity 3D packaging module with layout of claim
11, further comprising at least one second cavity holder received
on the ledge.
13. The pre-molded cavity 3D packaging module with layout of claim
12, wherein the second cavity holder further includes a third
circuit with at least a specific layout and at least one third via,
the third circuit is formed on a surface of the second cavity
holder, and an electrical coupling region is formed on the other
surface of the second cavity holder through the at least one third
via.
14. The pre-molded cavity 3D packaging module with layout of claim
1, wherein the receiving space of the at least one packaging cavity
is filled with a liquid material with low stress for protecting
internal components and solder wires.
15. The pre-molded cavity 3D packaging module with layout of claim
1, further comprising a U-shaped packaging cavity, a symmetric
packaging cavity, and an H-shaped packaging cavity, wherein the
type of the pre-molded cavity 3D packaging module with layout is
selected from one or a combination of the above.
16. The pre-molded cavity 3D packaging module with layout of claim
15, wherein the H-shaped packaging cavity includes two opposite
openings and two cavity holders.
17. The pre-molded cavity 3D packaging module with layout of claim
15, wherein the symmetric packaging cavity includes a pair of
symmetric packaging cavities.
18. A pre-molded cavity three-dimensional (3D) packaging module
with layout, comprising: a packaging module with a plurality of
packaging cavities, each cavity forming a receiving space by a
cavity bottom and a cavity sidewall surrounding the cavity sidewall
for receiving at least one component, wherein the cavity sidewall
forms an inclined angle greater than 3.degree. with a vertical axis
of the cavity bottom, and an intersecting region between the cavity
sidewall and the cavity bottom is a curved intersecting region to
facilitate the formation of a circuit with at least a specific
layout; a first circuit with at least a specific layout formed on
the surface of the cavity sidewall and over the cavity sidewall to
electrically couple the component in each packaging cavity; and at
least a cavity holder for packaging each packaging cavity.
19. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the cavity bottom at the curved intersecting region
forms steps of different heights to facilitate staggered wire
layouts or wire bonding on different vertical planes.
20. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the packaging module includes at least one via through
which the first circuit is electrically coupled to external
circuits.
21. The pre-molded cavity 3D packaging module with layout of claim
20, wherein the outer surface of a packaging module includes at
least one signal transmitting region, which transmits
incoming/outgoing signals to/from the first circuit through the
first via.
22. The pre-molded cavity 3D packaging module with layout of claim
21, wherein the at least one signal transmitting region is at least
one module testing region.
23. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the packaging module includes at least one
heat-dissipating path, wherein the at least one heat-dissipating
path has at least one heat-dissipating area exposed from the outer
surface of a packaging cavity.
24. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the packaging module includes at least one air hole for
exchanging air with an external environment to form an air-type
packaging module, wherein a material is filled into the air hole to
block the air hole, and during assembly of the packaging module,
inert gas is filled into it, or it is heated to remove moisture to
form a sealed packaging module.
25. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the cavity holder further includes a second circuit
with at least a specific layout and at least one second via, the
second circuit is formed on a surface of the cavity holder, and an
electrical coupling region is formed on the other surface of the
cavity holder through the second via.
26. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the cavity sidewall has at least one step forming a
staircase-like surface with at least one ledge in the receiving
space.
27. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the receiving space is filled with a liquid material
with low stress for protecting internal components and solder
wires.
28. The pre-molded cavity 3D packaging module with layout of claim
18, wherein the plurality of packaging cavities include the cavity
bottoms of different thickness.
29. A pre-molded cavity three-dimensional (3D) packaging module
with layout, comprising: a packaging cavity forming a receiving
space by a cavity bottom and a cavity sidewall surrounding the
cavity sidewall, wherein the cavity sidewall forms an inclined
angle greater than 3.degree. with a vertical axis of the cavity
bottom, and an intersecting region between the cavity sidewall and
the cavity bottom is a curved intersecting region, and the cavity
sidewall has a plurality of steps forming staircase-like surfaces
with a plurality of ledges in the receiving space; a plurality of
first circuits with specific layouts formed on a surface of the
packaging cavity in the receiving space and on the curved
intersecting region, wherein the first circuits are each
electrically coupled with a component received in the receiving
space; and a plurality of packaging holder disposed on the
plurality of ledges, each packaging holder having a component on a
surface thereof.
30. The pre-molded cavity 3D packaging module with layout of claim
29, wherein the cavity bottom at the curved intersecting region
forms steps of different heights to facilitate staggered wire
layouts or wire bonding on different vertical planes.
31. The pre-molded cavity 3D packaging module with layout of claim
29, wherein the packaging cavity includes a plurality of first vias
through which the first circuits are electrically coupled to
external circuits.
32. The pre-molded cavity 3D packaging module with layout of claim
31, wherein the outer surface of the packaging cavity includes a
plurality of signal transmitting regions, which transmit
incoming/outgoing signals to/from the first circuits through the
first vias.
33. The pre-molded cavity 3D packaging module with layout of claim
32, wherein the signal transmitting regions are module testing
regions.
34. The pre-molded cavity 3D packaging module with layout of claim
29, wherein the plurality of packaging holders include a plurality
of second vias and second circuits with specific layouts, the
second circuits are formed on surfaces of the plurality of
packaging holders, and electrically coupled with components on both
surfaces of the packaging holders through the plurality of second
vias.
35. The pre-molded cavity 3D packaging module with layout of claim
29, wherein the packaging cavity includes at least one
heat-dissipating path, wherein the at least one heat-dissipating
path has at least one heat-dissipating area exposed from the outer
surface of the packaging cavity.
36. The pre-molded cavity 3D packaging module with layout of claim
29, wherein the packaging cavity includes at least one air hole for
exchanging air with an external environment to form an air-type
packaging module, wherein a material is filled into the air hole to
block the air hole, and during assembly of the packaging cavity,
inert gas is filled into it, or it is heated to remove moisture to
form a sealed packaging module.
37. The pre-molded cavity 3D packaging module with layout of claim
29, wherein the receiving space of the packaging cavity is filled
with a liquid material with low stress for protecting internal
components and solder wires.
38. A pre-molded cavity three-dimensional (3D) packaging module
with layout, comprising: a plurality of packaging cavities, each
forming a receiving space by a cavity bottom and a cavity sidewall
surrounding the cavity sidewall, wherein the cavity sidewall forms
an inclined angle greater than 3.degree. with a vertical axis of
the cavity bottom, and an intersecting region between the cavity
sidewall and the cavity bottom is a curved intersecting region; the
plurality of packaging cavities further including a first packaging
cavity, a second packaging cavity, a third packaging cavity, and a
fourth packaging cavity, wherein the second packaging cavity and
the third packaging cavity are matching in appearance and
symmetrical with each other, and with opening larger than the
cavity sidewall of the first packaging cavity to be assembled to
the cavity sidewall, and the cavity sidewall of the first packaging
cavity has a plurality of steps forming staircase-like surface with
a plurality of ledges in the receiving space; a plurality of first
circuits with specific layouts formed on a surface of a packaging
cavity in the receiving space and on the curved intersecting
region, wherein the first circuits are each electrically coupled
with a component received in the receiving space; and a plurality
of packaging holder disposed on the plurality of ledges, each
packaging holder having a component on a surface thereof.
39. The pre-molded cavity 3D packaging module with layout of claim
38, wherein the cavity bottom at the curved intersecting region
forms steps of different heights to facilitate staggered wire
layouts or wire bonding on different vertical planes.
40. The pre-molded cavity 3D packaging module with layout of claim
38, wherein the plurality of packaging cavities include a plurality
of first vias through which the first circuits are electrically
coupled to external circuits.
41. The pre-molded cavity 3D packaging module with layout of claim
40, wherein the outer surfaces of the plurality of packaging
cavities include a plurality of signal transmitting regions, which
transmit incoming/outgoing signals to/from the first circuits
through the first vias.
42. The pre-molded cavity 3D packaging module with layout of claim
41, wherein the signal transmitting regions are module testing
regions.
43. The pre-molded cavity 3D packaging module with layout of claim
38, wherein the plurality of packaging holders include a plurality
of second vias and second circuits with specific layouts, the
second circuits are formed on surfaces of the plurality of
packaging holders, and electrically coupled with components on both
surfaces of the packaging holders through the plurality of second
vias.
44. The pre-molded cavity 3D packaging module with layout of claim
38, wherein the packaging cavities each includes at least one
heat-dissipating path, wherein the at least one heat-dissipating
path has at least one heat-dissipating area exposed from the outer
surface of the packaging cavity.
45. The pre-molded cavity 3D packaging module with layout of claim
38, wherein the packaging cavities each includes at least one air
hole for exchanging air with an external environment to form an
air-type packaging module, wherein a material is filled into the
air hole to block the air hole, and during assembly of the
packaging cavity, inert gas is filled into it, or it is heated to
remove moisture to form a sealed packaging module.
46. The pre-molded cavity 3D packaging module with layout of claim
38, wherein the receiving space of each packaging cavity is filled
with a liquid material with low stress for protecting internal
components and solder wires.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a three-dimensional (3D)
packaging module, and more particularly, to a pre-molded cavity 3D
packaging module with layout.
[0003] 2. Description of the Prior Art
[0004] Demands of low cost, small size and versatility have become
the main driving forces of the electronics industry. One of the
main challenges of the IC industry lies in the cost effective
assembly of the various functions in a limited package, so that
dies of different functions may achieve their best performances. To
this end, various advanced packaging technology have been
developed, such as flip-chip, chip scale packaging, wafer-level
packaging and 3D packaging technology. However, in the fields of
digital, analog, memory and wireless radio frequency applications,
different functions of the electronic circuits will have different
needs and results facing the need for miniaturization of the
process technology, therefore the single-chip integration of
different functions no longer provides the best solution. With the
rapid developments of technologies like System-on-Chip (SOC),
System-in-Package (SiP), Package-in-Package (PiP),
Package-on-Package (POP) and stacked CSP, the most efficient system
chip in recent years should be directed to the structure of a
single package by full use of the architecture of the
multi-dimensional space, wherein chips of various functions
employing heterogeneous technologies and different operating
voltages can be integrated. Therefore, the current trend for system
chip packaging has shifted towards the concept of three-dimensional
(3D) packaging technology, which is capable of integrating dies,
packaged and passive components into a single package body,
providing a viable solution for system packaging. The arrangement
of the integration of 3D packaging technology can be side-by-side,
stacked or a combination of the two. In particular, 3D packaging
has the advantages such as a small footprint, high performance and
low cost.
[0005] Specifically, the above System-in-Package (SiP) involves the
assembly of different types of ICs in a package. Based on SiP, a
new technology is extended to allow multiple pieces of dies to be
stacked in a package module, and achieve the integration of more
features or a higher density with the use of three-dimensional
space. Among these types of package structures, stacked CSP was the
first to be released; its products are mostly memory combo and it
is capable of stacking six layers of memory dies in a ball grid
array (BGA) package. In addition to the traditional wire bonding,
solder bumps or flip-chip technology can also be used. In addition,
interposers are often added in order to facilitate stacking or heat
dissipation. For example, a package with stacked dies may include
dies that are separate but connected with each other through wires
(die as building blocks); may include a stacking of one to several
pieces of memory dies, an analog die stacked on top of another
system-on-Chip (SOC) or digital die, while an independent radio
frequency (RF) die disposed on an interconnected substrate. These
constituent dies all have different control and I/O (Input/Output)
paths.
[0006] Referring to FIGS. 1A to 1D, a traditional stacked package
structure typically includes a plurality of substrate, a plurality
of packaged chipsets and solder balls; some of the packaged
chipsets are adhered or bonded on a top surface of a substrate and
are electrically connected by pins or solder balls, while some of
the packaged chipsets are adhered or bonded on top and/or bottom
surfaces of another substrate and are electrically connected by
pins or solder balls. The two substrates are connected together
with rigid conductors or solder balls in order to facilitate
stacking in a three-dimensional space and the formation of 3D
packaging architecture, wherein substrates, printed circuit boards
(PCBs), and leadframes are connected through solder balls,
connection columns, ring-shaped substrates or PCBs with opening
therein and curved feet forming as interposers to provide the
required space for connection. The interposers in a traditional 3D
package or module provide connections for the upper and lower
layers through pins having circuit functions.
[0007] Packaging currently adopted by most packaging factories are
like those shown in the diagrams just described, which is a
multi-layer stacked package structure involving mainly packaged
dies. However, this type of multi-layer stacked package is faced
with several challenges. In one aspect, if chips and wires are
directly exposed to the air without protection, this will lead to
reliability problems. Therefore, the circuits of the chips cannot
be connected onto the holder using wire bonding process, and the
components used in these package structures must be packaged
components and are soldered onto the holder or PCB in an exposed
and unprotected way. Although coating a protective layer may
provide re-packaging protection, but once the protective layer is
coated, if an internal component is defective or damaged, unless
this protective layer is removed, the whole packaging module will
have to be discarded, dismantling of components for repair is not
possible. For packaging factories, the cost of repair is high. In
another aspect, no immediate testing can be performed on
traditional 3D packages at the time of manufacturing but only after
the packaging, mass production is hindered.
[0008] Moreover, in a traditional multi-layer stacked package
structure, if a rigid conductor is used for shelf support, despite
that the interlayer height can be controlled, alignment control
during the manufacturing process is very difficult. On the
contrary, if solder balls are used for the shelf support, alignment
issue can be easily solved, but there are height restrictions, such
that the lower components are more easily pressed by the upper
substrates. In addition, the traditional 3D structure is famous for
its heat dissipation problem, more layers mean more system modules
that are in operation, and the heat generated by each component
will produce a synergistic effect. As a result, the multi-layer
stacked package structure has very poor cooling effect.
Furthermore, each individual packaged component has their own
stamp, but for the entire packaging module, the stamp is made on
the holder or the PCB, and no packaging date for the module is
available for retrospective purpose.
[0009] All these factors will seriously affect the reliability of
3D packaging, and greatly reduce the yield of the packaging
process, resulting in a substantial increase in cost. Therefore,
how to overcome these shortcomings is still the major target of the
industry requiring much-needed development.
SUMMARY OF THE INVENTION
[0010] In view of the above and in accordance with the needs of the
industry, the present invention proposes a pre-molded cavity 3D
packaging module with layout to address the issues encountered in
the prior art.
[0011] One objective of the present invention is to provide
pre-molded cavity 3D packaging module with layout. The 3D packaging
module provided protection, and packaged or unpackaged components
can be protected within the 3D packaging module. In addition, the
outside of the 3D packaging module provides a flat area for laser
or ink stamping to enable easy tracing of the packaging date of the
overall module. Moreover, the structure of the present invention
may provide solder pads or balls as output electrodes, and testing
pads are pre-manufactured by bottom through-hole drilling for
internal component testing during production, this increases the
viability of mass-production. On the other hand, the 3D packaging
module structure of the present invention is composed of a
pre-molded holder or cavity and is assembled into a 3D package or
module structure. In this 3D package or module structure, chips and
wires are not directly exposed, and packaged components, passive
components and chips are soldered onto the pre-molded cavity
holder, and the substrate or PCB on which the packaged or passive
components are soldered can also be used as a lid or an internal
circuit layer of the 3D packaging module of the present
invention.
[0012] The circuit connection for the 3D packaging module of the
present invention involves forming circuits from the bottom through
the sidewall to the upper-layer substrate and the lid. The
upper-layer substrate of the 3D packaging module of the present
invention can be connected to the circuits on the sidewall of the
pre-molded cavity through conductive materials. The 3D packaging
module of the present invention can be a massive module with small
footprint by stacking pre-molded cavity, sub-modules and PCBs into
a 3D structure. The various substrates in the 3D packaging module
of the present invention can be designed to accommodate the needs
of other modules or circuit area requirements, and are not limited
to the dimensions of the 3D packaging module of the present
invention. The area of the circuit layout can be extended by
substrates or PCBs, which can be attached within the 3D packaging
module of the present invention by conductive materials. The
circuit layout of the 3D packaging module of the present invention
reduces the length of solder wires.
[0013] The concept of the 3D packaging module of the present
invention can be extended to a 3D packaging structure with multiple
modules. The 3D packaging module of the present invention is
composed of a pre-molded cavity. A wall and a vertical plane of the
pre-molded cavity form an inclined angle of more than 3.degree.. An
intersecting region between a bottom and a sidewall of the 3D
packaging module has a curved profile to facilitate smooth circuit
layout. The circuit connections of the 3D packaging module of the
present invention can be made in the form of steps on the sidewall,
and are not restricted to two dimensions. With the 3D packaging
module of the present invention, staggered wire layouts on
different vertical planes can prevent short circuit caused by mold
flow. The circuits of the 3D packaging module of the present
invention can be manufactured on the planar bottom of the
pre-molded cavity, and connected with output solder pads through
vias. The output solder pads can be flexibly manufactured to
connect to the bottom of the cavity holder through vias, or as
solder balls/pads on an upper-lid PCB.
[0014] Accordingly, with the pre-molded cavity 3D packaging module
with layout of the present invention, not only the numerous
shortcomings of the prior art are addressed, flexible design is
also made possible. Therefore, the present invention can be widely
used in the commerce and industry of the packaging modules,
achieving a major target of the industry that required much-needed
development.
[0015] According to the objectives of the present invention, a
pre-molded cavity three-dimensional (3D) packaging module with
layout is provided by the present invention. The pre-molded cavity
3D packaging module with layout includes: a first circuit with at
least a specific layout; and at least one packaging cavity with the
first circuit on a cavity surface thereof, and forming a receiving
space by a cavity bottom and a cavity sidewall surrounding the
cavity sidewall, wherein the cavity sidewall forms an inclined
angle greater than 3.degree. with a vertical axis of the cavity
bottom, and the receiving space is for receiving at least one
component to be electrically coupled with the first circuit. In
addition, an intersecting region between the cavity sidewall and
the cavity bottom is a curved intersecting region for forming a
circuit with at least a specific layout thereon, and the cavity
bottom at the curved intersecting region forms steps of different
heights to facilitate staggered wire layouts or wire bonding on
different vertical planes. Moreover, the at least one packaging
cavity includes at least one via through which the first circuit is
electrically coupled to external circuits, and the outer surface of
the at least one packaging cavity includes at least one signal
transmitting region, which transmits incoming/outgoing signals
to/from the first circuit through the first via, wherein the at
least one signal transmitting region is a module testing
region.
[0016] The at least one packaging cavity above includes at least
one heat-dissipating path, wherein the at least one
heat-dissipating path has at least one heat-dissipating area
exposed from the outer surface of the packaging cavity, and the at
least one packaging cavity includes at least one air hole for
exchanging air with an external environment to form an air-type
packaging module, wherein a material is filled into the air hole to
block the air hole, and during assembly of the packaging cavity,
inert gas is filled into it, or it is heated to remove moisture to
form a sealed packaging module. Moreover, the pre-molded cavity 3D
packaging module with layout above further includes at least one
first cavity holder with a length greater than the width of the
opening of the at least one packaging cavity. Furthermore, the
first cavity holder includes a second circuit with at least a
specific layout and at least one second via, the second circuit is
formed on a surface of the first cavity holder, and at least one
signal transmitting region is formed on the other surface of the
first cavity holder for transmitting signals to/from the second
circuit through the second via, and the cavity sidewall has at
least one step forming a staircase-like surface with at least one
ledge in the receiving space.
[0017] The pre-molded cavity 3D packaging module with layout above
further includes at least one second cavity holder received on the
ledge, and the second cavity holder further includes a third
circuit with at least a specific layout and at least one third via,
the third circuit is formed on a surface of the second cavity
holder, and an electrical coupling region is formed on the other
surface of the second cavity holder through the at least one third
via, wherein the receiving space of the at least one packaging
cavity is filled with a liquid material with low stress for
protecting internal components and solder wires. In addition, the
pre-molded cavity 3D packaging module with layout above further
includes a U-shaped packaging cavity, a symmetric packaging cavity,
and an H-shaped packaging cavity, wherein the type of the
pre-molded cavity 3D packaging module with layout is selected from
one or a combination of the above. The H-shaped packaging cavity
includes two opposite openings and two cavity holders, and the
symmetric packaging cavity includes a pair of symmetric packaging
cavities.
[0018] According to the objectives of the present invention, a
pre-molded cavity three-dimensional (3D) packaging module with
layout is provided, which includes a packaging module with a
plurality of packaging cavities, each cavity forming a receiving
space by a cavity bottom and a cavity sidewall surrounding the
cavity sidewall for receiving at least one component, wherein the
cavity sidewall forms an inclined angle greater than 3.degree. with
a vertical axis of the cavity bottom, and an intersecting region
between the cavity sidewall and the cavity bottom is a curved
intersecting region to facilitate the formation of a circuit with
at least a specific layout; a first circuit with at least a
specific layout formed on the surface of the cavity sidewall and
over the cavity sidewall to electrically couple the component in
each packaging cavity; and at least a cavity holder for packaging
each packaging cavity, wherein the cavity bottom at the curved
intersecting region forms steps of different heights to facilitate
staggered wire layouts or wire bonding on different vertical
planes. The above packaging module includes at least one via
through which the first circuit is electrically coupled to external
circuits, and the outer surface of a packaging module includes at
least one signal transmitting region, which transmits
incoming/outgoing signals to/from the first circuit through the
first via.
[0019] The at least one signal transmitting region above is at
least one module testing region, and the above packaging module
includes at least one heat-dissipating path, wherein the at least
one heat-dissipating path has at least one heat-dissipating area
exposed from the outer surface of a packaging cavity. In addition,
the packaging module includes at least one air hole for exchanging
air with an external environment to form an air-type packaging
module, wherein a material is filled into the air hole to block the
air hole, and during assembly of the packaging module, inert gas is
filled into it, or it is heated to remove moisture to form a sealed
packaging module. The above cavity holder further includes a second
circuit with at least a specific layout and at least one second
via, the second circuit is formed on a surface of the cavity
holder, and an electrical coupling region is formed on the other
surface of the cavity holder through the second via, wherein the
cavity sidewall has at least one step forming a staircase-like
surface with at least one ledge in the receiving space. Moreover,
the receiving space is filled with a liquid material with low
stress for protecting internal components and solder wires. The
plurality of packaging cavities above include the cavity bottoms of
different thickness.
[0020] According to the objectives of the present invention, a
pre-molded cavity three-dimensional (3D) packaging module with
layout is provided, which includes: a packaging cavity forming a
receiving space by a cavity bottom and a cavity sidewall
surrounding the cavity sidewall, wherein the cavity sidewall forms
an inclined angle greater than 3.degree. with a vertical axis of
the cavity bottom, and an intersecting region between the cavity
sidewall and the cavity bottom is a curved intersecting region, and
the cavity sidewall has a plurality of steps forming staircase-like
surfaces with a plurality of ledges in the receiving space; a
plurality of first circuits with specific layouts formed on a
surface of the packaging cavity in the receiving space and on the
curved intersecting region, wherein the first circuits are each
electrically coupled with a component received in the receiving
space; and a plurality of packaging holder disposed on the
plurality of ledges, each packaging holder having a component on a
surface thereof. The cavity bottom at the curved intersecting
region forms steps of different heights to facilitate staggered
wire layouts or wire bonding on different vertical planes. The
above packaging cavity includes a plurality of first vias through
which the first circuits are electrically coupled to external
circuits. The outer surface of the above packaging cavity includes
a plurality of signal transmitting regions, which transmit
incoming/outgoing signals to/from the first circuits through the
first vias. The signal transmitting regions above are module
testing regions. The plurality of packaging holders above include a
plurality of second vias and second circuits with specific layouts,
the second circuits are formed on surfaces of the plurality of
packaging holders, and electrically coupled with components on both
surfaces of the packaging holders through the plurality of second
vias. The above packaging cavity includes at least one
heat-dissipating path, wherein the at least one heat-dissipating
path has at least one heat-dissipating area exposed from the outer
surface of the packaging cavity. The above packaging cavity
includes at least one air hole for exchanging air with an external
environment to form an air-type packaging module, wherein a
material is filled into the air hole to block the air hole, and
during assembly of the packaging cavity, inert gas is filled into
it, or it is heated to remove moisture to form a sealed packaging
module. The receiving space of the above packaging cavity is filled
with a liquid material with low stress for protecting internal
components and solder wires.
[0021] According to the objectives of the present invention, a
pre-molded cavity three-dimensional (3D) packaging module with
layout is provided, which includes: a plurality of packaging
cavities, each forming a receiving space by a cavity bottom and a
cavity sidewall surrounding the cavity sidewall, wherein the cavity
sidewall forms an inclined angle greater than 3.degree. with a
vertical axis of the cavity bottom, and an intersecting region
between the cavity sidewall and the cavity bottom is a curved
intersecting region; the plurality of packaging cavities further
including a first packaging cavity, a second packaging cavity, a
third packaging cavity, and a fourth packaging cavity, wherein the
second packaging cavity and the third packaging cavity are matching
in appearance and symmetrical with each other, and with opening
larger than the cavity sidewall of the first packaging cavity to be
assembled to the cavity sidewall, and the cavity sidewall of the
first packaging cavity has a plurality of steps forming
staircase-like surface with a plurality of ledges in the receiving
space; a plurality of first circuits with specific layouts formed
on a surface of a packaging cavity in the receiving space and on
the curved intersecting region, wherein the first circuits are each
electrically coupled with a component received in the receiving
space; and a plurality of packaging holder disposed on the
plurality of ledges, each packaging holder having a component on a
surface thereof.
[0022] The above cavity bottom at the curved intersecting region
forms steps of different heights to facilitate staggered wire
layouts or wire bonding on different vertical planes, and the
plurality of packaging cavities above include a plurality of first
vias through which the first circuits are electrically coupled to
external circuits, wherein the outer surfaces of the plurality of
packaging cavities include a plurality of signal transmitting
regions, which transmit incoming/outgoing signals to/from the first
circuits through the first vias, and the signal transmitting
regions are module testing regions. In addition, the plurality of
packaging holders above include a plurality of second vias and
second circuits with specific layouts, the second circuits are
formed on surfaces of the plurality of packaging holders, and
electrically coupled with components on both surfaces of the
packaging holders through the plurality of second vias, and the
packaging cavities each includes at least one heat-dissipating
path, wherein the at least one heat-dissipating path has at least
one heat-dissipating area exposed from the outer surface of the
packaging cavity. Moreover, the packaging cavities above each
includes at least one air hole for exchanging air with an external
environment to form an air-type packaging module, wherein a
material is filled into the air hole to block the air hole, and
during assembly of the packaging cavity, inert gas is filled into
it, or it is heated to remove moisture to form a sealed packaging
module, wherein the receiving space of each packaging cavity is
filled with a liquid material with low stress for protecting
internal components and solder wires.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The present invention can be more fully understood by
reading the following detailed description of the preferred
embodiments, with reference made to the accompanying drawings,
wherein:
[0024] FIGS. 1A to 1D are schematic diagrams illustrating prior-art
packaging designs;
[0025] FIGS. 2A to 2L are schematic diagrams illustrating a
pre-molded cavity 3D packaging module with layout according to
embodiments of the present invention; and
[0026] FIGS. 3A to 3D are black and white photos of the actual
implementations of the pre-molded cavity 3D packaging module with
layout according to embodiments of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0027] The present invention is directed to three-dimensional (3D)
packaging modules. In order to facilitate understanding of the
present invention, detailed structures and their elements and
method steps are set forth in the following descriptions.
Obviously, the implementations of the present invention are not
limited to specific details known to those skilled in the art of
packaging module. On the other hand, well-known structures and
their elements are omitted herein to avoid unnecessary limitations
on the present invention. In addition, for better understanding and
clarity of the description by those skilled in the art, some
components in the drawings may not necessary be drawn to scale, in
which some may be exaggerated relative to others, and irrelevant
parts are omitted. Preferred embodiments of the present invention
are described in details below, in addition to these descriptions,
the present invention can be widely applicable to other
embodiments, and the scope of the present invention is not limited
by such, rather by the scope of the following claims.
[0028] According to an embodiment of the present invention,
referring to FIG. 2A, a pre-molded cavity 3D packaging module with
layout 200. The pre-molded cavity 3D packaging module with layout
includes a first circuit 210A with at least a specific layout and
at least one packaging cavity 220. The at least one packaging
cavity 220 forms a receiving space 220C with a cavity bottom 220A
and a cavity sidewall 220B surrounding the cavity bottom 220A,
wherein the first circuit 210A is pre-formed on the surfaces of the
packaging cavity 220 including the cavity bottom 220A and the
cavity sidewall 220B, as shown in FIG. 2B. The receiving space 220C
can receive at least one component 230 to be electrically coupled
with the first circuit 210A, wherein if the component 230 is a
packaged component, then it can be electrically coupled with the
first circuit 210A using pins or solder balls at specific
locations. If the component 230 is not a packaged component, then
it can be electrically coupled with the first circuit 210A directly
using wiring bonding technique at specific locations.
[0029] Referring to FIG. 2C, according to an embodiment of the
present invention, the cavity sidewall 220B forms an inclined angle
larger than 3.degree. with an vertical axis of the cavity bottom
220A, and the intersecting region between the cavity sidewall 220B
and the cavity bottom 220A is a curved intersecting region R in
order to facilitate the first circuit 210A to be smoothly formed
from the cavity bottom 220A through the curved intersecting region
R onto the cavity sidewall 220B, wherein the bottom of the cavity
sidewall 220B at the curved intersecting region R are formed with
steps of different heights, so as to facilitate staggered wire
layouts or wire bonding on different vertical planes, as shown in
FIG. 2D. The at least one packaging cavity 220 further includes at
least a first via 240A to allow the first circuit 210A to be
electrically coupled with external circuits through the first via
240A. In addition, the outer surface of the at least one packaging
cavity 220 includes at least a first signal transmitting region
250A. The first signal transmitting region 250A is electrically
coupled to the first circuit 210A through the first via 240A to
transmit incoming/outgoing signals, as shown in FIG. 2E, wherein
the first signal transmitting region 250A can be testing electrodes
for a module testing area and/or I/O electrodes. The outer surface
of the packaging cavity 220 is available for stamps of packaging
date or other information, as shown in FIG. 2F.
[0030] Referring to FIG. 2A, according to an embodiment of the
present invention, the at least one packaging cavity 220 further
includes at least one heat-dissipating path 260 for dissipating
heat, wherein the at least one heat-dissipating path 260 may have
at least one heat-dissipating area 265 exposed from the outer
surface of the packaging cavity. The at least one packaging cavity
220 further includes at least one air hole for exchanging air with
the external environment, thereby forming an air-type packaging
module, wherein a material can be used to block the air hole, and
during adhesion of the overall cavity, inert gas is filled into it,
or it is heated to remove moisture, thereby forming a sealed
packaging module. In addition, the pre-molded cavity 3D packaging
module with layout further includes at least a first cavity holder
270A. The length of the first cavity holder 270A is greater than
the width of the opening of the at least one packaging cavity 220.
The first cavity holder 270A includes a second circuit 210B with at
least a specific layout and at least one second via 240B. The
second circuit 210B is formed on a surface of the first cavity
holder 270A, and at least a second signal transmitting region 250B
is formed on the other surface of the first cavity holder 270A for
transmitting signals to/from the second circuit 210B through the at
least one second via 240B, as shown in FIG. 2G, wherein the second
signal transmitting region 250B can be adhered with conductive
objects such as solder bumps/balls. Moreover, the cavity sidewall
220B includes at least one step, forming a staircase-like surface
with at least one ledge 225 in the receiving space 220C, as shown
in FIG. 2C. The at least one first cavity holder 270A can be placed
on the ledge 225 to seal the receiving space 220C. In addition, the
receiving space 220C of the at least one packaging cavity 220 can
be filled with a liquid material with low stress to protect the
internal components and solder wires.
[0031] Referring to FIG. 2H, according to an embodiment of the
present invention, the pre-molded cavity 3D packaging module with
layout 200 further includes U-shaped packaging cavities 200A/200B,
symmetric packaging cavities 200E/200F, and H-shaped packaging
cavities 200C/200D, wherein the type of the pre-molded cavity 3D
packaging module with layout 200 can be selected from one or a
combination of the above. Furthermore, the H-shaped packaging
cavities 200C/200D each includes two opposite openings and two
cavity holders. The symmetric packaging cavities 200E/200F each
includes a pair of symmetric packaging cavities. As described
above, the assembly of the present invention is based on the
concept of 3D spatial stacking, similar to the stacking of toy
bricks, which is different from the traditional vertical stacking.
For example, different cavity combinations can be used depending on
the needs, such as, 200B/200C/200B, 200A/200C/200A . . . etc. An
exemplary combinational stacking is shown in FIG. 2I. Referring
further to FIG. 2J, a modification of the present embodiment is
shown, wherein there are several ledges on a cavity sidewall of a
packaging cavity, and cavity holders with appropriate sizes are
placed on these ledges.
[0032] According to an embodiment of the present invention,
[0033] According to an embodiment of the present invention, the
cavity holder of the 3D package or module of the present invention
can be used directly as a PCB or PVB, so not only the internal
substrates or PCBs can be used for extension, a plurality of cavity
substrates for different modules can be soldered onto a fundamental
module substrate for extension, as shown in FIG. 2K. FIG. 2K shows
a plurality of packaging cavities with different thicknesses in the
same packaging module, cavities can be interconnected through
circuits going over the cavity sidewalls, thus, package
miniaturization can be easily achieved, wherein each packaging
cavity is provided with an appropriate cavity holder to complete
the packaging, as shown in FIG. 2L. Alternatively, a single cavity
holder can be used for packaging the plurality of cavities.
[0034] According to an embodiment of the present invention, black
and white photos of the actual implementations of the present
invention are shown in FIGS. 3A to 3D, in which circuit layouts can
be designed on the sidewalls of the packaging module. The circuits
can be connected by going over the sidewalls and thus are not
limited to a planar design. Moreover, the present invention also
allows unpackaged components to be directly wire-bonded in the
packaging module. It is apparent that based on the above
descriptions of the embodiments, the present invention can have
numerous modifications and alterations, and they should be
construed within the scope of the following claims. In addition to
the above detailed descriptions, the present invention can be
widely applied to other embodiments. The above embodiments are
merely preferred embodiments of the present invention, and should
not be used to limit the present invention in any way. Equivalent
modifications or changes can be made by those with ordinary skill
in the art without departing from the scope of the present
invention as defined in the following appended claims.
* * * * *