U.S. patent application number 13/903998 was filed with the patent office on 2013-12-05 for sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip, and illumination device.
This patent application is currently assigned to Formosa Epitaxy Incorporation. The applicant listed for this patent is Formosa Epitaxy Incorporation. Invention is credited to Wei-Kang Cheng, Siang-Fu Hong, Chih-Shu Huang, Chen-Hong Lee, Shyi-Ming Pan, Chi-Chih Pu, Shih-Chieh Tang, Tzu-Hsiang Wang, Cheng-Kuang Yang, Shih-Yu Yeh.
Application Number | 20130320363 13/903998 |
Document ID | / |
Family ID | 48520792 |
Filed Date | 2013-12-05 |
United States Patent
Application |
20130320363 |
Kind Code |
A1 |
Pan; Shyi-Ming ; et
al. |
December 5, 2013 |
SAPPHIRE SUBSTRATE CONFIGURED TO FORM LIGHT EMITTING DIODE CHIP
PROVIDING LIGHT IN MULTI-DIRECTIONS, LIGHT EMITTING DIODE CHIP, AND
ILLUMINATION DEVICE
Abstract
A sapphire substrate configured to form a light emitting diode
(LED) chip providing light in multi-directions, a LED chip and an
illumination device are provided in the present invention. The
sapphire substrate includes a growth surface and a second main
surface opposite to each other. A thickness of the sapphire
substrate is thicker than or equal to 200 micrometers. The LED chip
includes the sapphire substrate and at least one LED structure. The
LED structure is disposed on the growth surface and forms a first
main surface where light emitted from with a part of the growth
surface without the LED structures. At least a part of light beams
emitted from the LED structure pass through the sapphire substrate
and emerge from the second main surface. The illumination device
includes at least one LED chip and a supporting base. The LED chip
is disposed on the supporting base.
Inventors: |
Pan; Shyi-Ming; (Tao-Yuan
Hsien, TW) ; Cheng; Wei-Kang; (Tao-Yuan Hsien,
TW) ; Huang; Chih-Shu; (Tao-Yuan Hsien, TW) ;
Lee; Chen-Hong; (Tao-Yuan Hsien, TW) ; Yeh;
Shih-Yu; (Tao-Yuan Hsien, TW) ; Pu; Chi-Chih;
(Tao-Yuan Hsien, TW) ; Yang; Cheng-Kuang;
(Tao-Yuan Hsien, TW) ; Tang; Shih-Chieh; (Tao-Yuan
Hsien, TW) ; Hong; Siang-Fu; (Tao-Yuan Hsien, TW)
; Wang; Tzu-Hsiang; (Tao-Yuan Hsien, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Formosa Epitaxy Incorporation |
Tao-Yuan Hsien |
|
TW |
|
|
Assignee: |
Formosa Epitaxy
Incorporation
Tao-Yuan Hsien
TW
|
Family ID: |
48520792 |
Appl. No.: |
13/903998 |
Filed: |
May 28, 2013 |
Current U.S.
Class: |
257/88 ;
257/98 |
Current CPC
Class: |
H01L 24/49 20130101;
F21K 9/27 20160801; H01L 2224/2919 20130101; H01L 2224/45147
20130101; H01L 2224/81805 20130101; H01L 2224/8592 20130101; H01L
2224/13109 20130101; H01L 2224/05554 20130101; H01L 2224/83385
20130101; H01L 24/73 20130101; H01L 24/83 20130101; H01L 2224/131
20130101; F21K 9/20 20160801; H01L 33/08 20130101; H01L 2224/06181
20130101; H01L 2224/32225 20130101; H01L 2924/19107 20130101; H01L
24/16 20130101; H01L 33/507 20130101; H01L 2224/06102 20130101;
H01L 2224/48091 20130101; H01L 2924/01322 20130101; F21K 9/65
20160801; H01L 24/14 20130101; H01L 2224/16 20130101; H01L
2924/00011 20130101; H01L 2224/45099 20130101; H01L 2924/3025
20130101; F21Y 2109/00 20160801; H01L 25/0753 20130101; H01L 24/81
20130101; H01L 2224/48465 20130101; H01L 2924/00014 20130101; H01L
2224/1403 20130101; H01L 2924/12041 20130101; F21V 17/10 20130101;
H01L 2224/48227 20130101; H01L 24/48 20130101; F21Y 2115/10
20160801; H01L 24/13 20130101; H01L 24/29 20130101; F21V 3/02
20130101; H01L 33/20 20130101; H01L 33/505 20130101; H01L
2224/13144 20130101; H01L 2224/49107 20130101; H01L 2224/04042
20130101; F21V 21/14 20130101; F21V 29/85 20150115; H01L 2224/48137
20130101; F21Y 2107/50 20160801; H01L 2224/1329 20130101; H01L
2224/13339 20130101; H01L 2224/83493 20130101; F21K 9/232 20160801;
H01L 24/32 20130101; H01L 24/45 20130101; H01L 2224/04026 20130101;
H01L 2224/73265 20130101; H01L 2224/14 20130101; H01L 33/48
20130101; F21Y 2107/00 20160801; F21V 21/002 20130101; H01L 27/156
20130101; H01L 33/62 20130101; H01L 2224/16225 20130101; F21V 23/06
20130101; H01L 24/06 20130101; H01L 33/007 20130101; H01L 2224/0401
20130101; H01L 2224/48091 20130101; H01L 2924/00014 20130101; H01L
2224/45147 20130101; H01L 2924/00 20130101; H01L 2924/3025
20130101; H01L 2924/00 20130101; H01L 2224/131 20130101; H01L
2924/014 20130101; H01L 2924/00011 20130101; H01L 2924/01015
20130101; H01L 2924/00011 20130101; H01L 2924/01033 20130101; H01L
2224/45147 20130101; H01L 2924/00011 20130101; H01L 2924/00011
20130101; H01L 2924/01005 20130101; H01L 2924/00014 20130101; H01L
2224/45099 20130101; H01L 2224/48465 20130101; H01L 2224/48091
20130101; H01L 2924/00 20130101; H01L 2224/73265 20130101; H01L
2924/01322 20130101; H01L 2924/00 20130101; H01L 2224/32225
20130101; H01L 2224/48227 20130101; H01L 2924/00 20130101; H01L
2224/48091 20130101; H01L 2924/12041 20130101; H01L 2924/00
20130101; H01L 2924/00014 20130101; H01L 2924/00014 20130101; H01L
2224/45099 20130101; H01L 2924/3025 20130101; H01L 2924/00
20130101; H01L 2224/48465 20130101; H01L 2224/48091 20130101; H01L
2924/00 20130101; H01L 2924/01322 20130101; H01L 2924/00 20130101;
H01L 2924/12041 20130101; H01L 2924/00 20130101; H01L 2224/48465
20130101; H01L 2224/48227 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/88 ;
257/98 |
International
Class: |
H01L 33/48 20060101
H01L033/48; H01L 27/15 20060101 H01L027/15 |
Foreign Application Data
Date |
Code |
Application Number |
May 29, 2012 |
TW |
101119098 |
Jun 19, 2012 |
TW |
101121921 |
Jul 16, 2012 |
TW |
101125599 |
Aug 28, 2012 |
TW |
101131198 |
Aug 30, 2012 |
TW |
101131643 |
Sep 4, 2012 |
TW |
101132185 |
Sep 4, 2012 |
TW |
101132187 |
May 8, 2013 |
TW |
102116429 |
May 10, 2013 |
TW |
102116650 |
Claims
1. A sapphire substrate, configured to form a light emitting diode
chip providing light in multi-directions, comprising a growth
surface and a second main surface disposed opposite to each other,
wherein a thickness of the sapphire substrate is thicker than or
equal to 200 micrometers.
2. The sapphire substrate of claim 1, wherein the second main
surface comprises a non-planar structure.
3. The sapphire substrate of claim 1, further comprising a
diamond-like carbon (DLC) film, disposed on the growth surface or
the second main surface.
4. The sapphire substrate of claim 3, further comprising an optical
film, disposed between the DLC film and the second main
surface.
5. The sapphire substrate of claim 1, wherein an area of the growth
surface or an area of the second main surface is larger than 5
times of an total area formed from at least one light emitting
surface of at least one light emitting diode (LED) structure
disposed on the growth surface or the second main surface.
6. The sapphire substrate of claim 1, further comprising at least
one wavelength conversion layer disposed on the second main
surface, wherein the wavelength conversion layer includes at least
one kind of fluorescent powders.
7. The sapphire substrate of claim 1, further comprising a
reflector or filter disposed on the second main surface or the
growth surface.
8. The sapphire substrate of claim 7, wherein the reflector or
filter comprises a plurality of insulating thin films with
different refractive indexes.
9. The sapphire substrate of claim 8, wherein the reflector
comprises a plurality of metal oxide layers.
10. The sapphire substrate of claim 1, further comprising a first
connecting conductor and a second connecting conductor disposed on
the growth surface or the second main surface.
11. The sapphire substrate of claim 1, wherein a light
transmittance of the sapphire substrate is larger than or equal to
70% for light beams having a wavelength ranges from 420 nanometers
to 470 nanometers.
12. The sapphire substrate of claim 10, wherein the first
connecting conductor is connected to a first connecting electrode
and the second connecting conductor is connected to a second
connecting electrode.
13. The sapphire substrate of claim 12, wherein the first
connecting electrode and the second connecting electrode are
relatively disposed on different sides of the sapphire substrate or
on the same side of the sapphire substrate.
14. The sapphire substrate of claim 1, wherein at least one pin is
disposed on the sapphire substrate, and at least one electrically
connecting port is disposed on the pin.
15. A light emitting diode (LED) chip, providing light in
multi-directions, comprising: a sapphire substrate of claim 1; and
a plurality of light emitting diode (LED) structures, disposed on
the growth surface and forming a first main surface where light
emitted from with at least a part of the growth surface without the
LED structures, and each of the LED structures comprises a first
electrode and a second electrode, wherein light emitted from at
least one of the LED structures passes through the sapphire
substrate and emerges from the second main surface.
16. A light emitting diode (LED) chip, providing light in
multi-directions, comprising: a sapphire substrate of claim 1; and
at least one light emitting diode (LED) structures, disposed on the
growth surface and forming a first main surface where light emitted
from with at least a part of the growth surface without the LED
structure, and the LED structure comprises a first electrode and a
second electrode, wherein the LED chip has a beam angle greater
than 180 degrees, and at least a part of light beams emitted from
the LED structure pass through the sapphire substrate and emerge
from the second main surface.
17. The LED chip of claim 15, further comprising wavelength
conversion layers respectively disposed on the first main surface
and the second main surface, wherein a ratio of fluorescent powder
concentration in the different wavelength conversion layers ranges
from 1:0.5 to 1:3.
18. The LED chip of claim 15, further comprising wavelength
conversion layers respectively disposed on the LED structure and
the second main surface, wherein a ratio of fluorescent powder
concentration in the different wavelength conversion layers ranges
from 1:0.5 to 1:3.
19. The LED chip of claim 15, further comprising a plurality of LED
structures disposed on the second main surface, wherein the LED
structures on the growth surface are disposed interlacedly
corresponding to the LED structures on the second main surface.
20. An illumination device, comprising: a LED chip of claim 15; and
a supporting base, wherein the LED chip is disposed on the
supporting base.
21. The illumination device of claim 20, wherein a first angle
exists between the LED chip and the supporting base, and the first
angle ranges from 30 degrees to 150 degrees.
22. The illumination device of claim 20, further comprising a
support coupled to the supporting base, wherein the LED chip is
disposed on the support.
23. The illumination device of claim 22, wherein the support is
flexible for forming the first angle between the LED chip and the
supporting base.
24. The illumination device of claim 20, further comprising a
plurality of LED chips, wherein at least some of the LED chips are
point-symmetrically disposed on the supporting base or
line-symmetrically disposed on the supporting base.
25. The illumination device of claim 20, further comprising another
LED chip, wherein one of the LED chips stands on the supporting
base and the other one lies on the supporting base.
26. An illumination device, comprising: a LED chip of claim 15; and
a support, wherein the LED chip is disposed on the support.
27. The illumination device of claim 26, wherein a material of the
support includes one of selected from metal, composite metallic
material, copper conductor, electric wire, ceramic substrate or
printed circuit board.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a sapphire substrate, a
light emitting diode chip, and an illumination device, and more
particularly, to a sapphire substrate configured to form a light
emitting diode chip providing light in multi-directions, a light
emitting diode chip, and an illumination device including the light
emitting diode chip.
[0003] 2. Description of the Prior Art
[0004] A light beam emitted from a light emitting diode (LED) is a
kind of directional light source, which is different from a
dispersive light source of a conventional bulb. Accordingly,
applications of LED are limited. For instance, the conventional LED
can not or may be hard to provide required lighting effect for
indoor and outdoor illumination applications. Additionally,
conventional LED illumination devices emit light beams from a
single side and luminous efficiency of the conventional LED
illumination device is relatively low accordingly.
SUMMARY OF THE INVENTION
[0005] It is one of the objectives of the present invention to
provide a sapphire substrate configured to form a light emitting
diode (LED) chip providing light in multi-directions, a light
emitting diode chip, and an illumination device including the light
emitting diode chip. The purposes of luminous efficiency
enhancement, light shape improvement, and cost reduction may then
be achieved.
[0006] A preferred embodiment of the present invention provides a
sapphire substrate configured to form a light emitting diode chip
providing light in multi-directions. The sapphire substrate
includes a growth surface and a second main surface opposite to
each other. A thickness of the sapphire substrate is thicker than
or equal to 200 micrometers.
[0007] A preferred embodiment of the present invention provides a
light emitting diode (LED) chip. The LED chip includes a
transparent substrate, a plurality of LED structures, an insulating
layer and a conductive pattern. The transparent substrate has a
growth surface and a second main surface disposed opposite to each
other. The LED structures are disposed on the growth surface and
form a first main surface where light emitted from with at least a
part of the growth surface without the LED structures. Each of the
LED structures includes a first electrode and a second electrode.
The insulating layer is disposed on at least some of the LED
structures. The conductive pattern is disposed on the insulating
layer and electrically connected to at least some of the first
electrodes and at least some of the second electrodes. Light
emitted from at least one of the LED structures passes through the
transparent substrate and emerges from the second main surface.
[0008] Another preferred embodiment of the present invention
provides a LED chip. The LED chip includes a transparent substrate
and at least one LED structure. A material of the transparent
substrate includes sapphire, and the transparent substrate has a
growth surface and a second main surface disposed opposite to each
other. The LED structure is disposed on the growth surface The LED
structure has a beam angle greater than 180 degrees, and at least a
part of light beams emitted from the LED structure pass through the
transparent substrate and emerge from the second main surface.
[0009] Another preferred embodiment of the present invention
provides a LED chip. The LED chip includes a transparent substrate,
at least one LED structure and a wavelength conversion layer. The
transparent substrate has a growth surface and a second main
surface disposed opposite to each other. The LED structure is
disposed on the growth surface and forms a first main surface where
light emitted from with at least a part of the growth surface
without the LED structure. The LED structure has a beam angle
greater than 180 degrees, and at least a part of light beams
emitted from the LED structure pass through the transparent
substrate and emerge from the second main surface. The wavelength
conversion layer is at least disposed on the LED structure or the
second main surface. The wavelength conversion layer at least
partially absorbs a light beam emitted from the LED structure and
converts the light beam into another light beams having different
wavelength range.
[0010] Another preferred embodiment of the present invention
provides a LED chip. The LED chip includes a transparent substrate
and a plurality of LED structures. The transparent substrate has a
growth surface and a second main surface disposed opposite to each
other. The LED structures are disposed on the growth surface. A
light emitting surface of each LED structure uncovered by the
transparent substrate and at least a part of the growth surface
without the LED structures form a first main surface where light
emitted from. Each of the LED structures has a beam angle greater
than 180 degrees. Light emitted from at least one of the LED
structures passes through the transparent substrate and emerges
from the second main surface. An area of the first main surface or
an area of the second main surface is larger than 5 times of a
total area formed from at least one of the light emitting surfaces
of each LED structure.
[0011] Another preferred embodiment of the present invention
provides a LED chip. The LED chip includes a transparent substrate,
at least one diamond-like carbon (DLC) film, and at least one LED
structure. The transparent substrate has a growth surface and a
second main surface disposed opposite to each other. The DLC film
is disposed on the transparent substrate. The LED structure is
disposed on the growth surface. A light emitting surface of the LED
structure uncovered by the transparent substrate and at least a
part of the growth surface without the LED structure form a first
main surface where light emitted from. The LED structure has a beam
angle greater than 180 degrees, and at least a part of light beams
emitted from the LED structure pass through the transparent
substrate and emerge from the second main surface.
[0012] Another preferred embodiment of the present invention
provides a LED chip. The LED chip includes a transparent substrate,
at least one LED structure and a reflector. The transparent
substrate has a growth surface and a second main surface disposed
opposite to each other. The reflector is disposed on the second
main surface. The LED structure is disposed on the growth surface.
A light emitting surface of the LED structure uncovered by the
transparent substrate and at least part of the growth surface
without the LED structure form a first main surface where light
emitted from. The LED structure has a beam angle greater than 180
degree.
[0013] Another preferred embodiment of the present invention
provides a LED chip. The LED chip includes a transparent substrate,
at least one LED structure, a first connecting conductor and a
second connecting conductor. The transparent substrate has a growth
surface and a second main surface disposed opposite to each other.
The LED structure is disposed on the growth surface and forms a
first main surface where light emitted from with at least a part of
the growth surface without the LED structure. The LED structure has
a beam angle greater than 180 degrees, and at least a part of light
beams emitted from the LED structure pass through the transparent
substrate and are emitted from the second main surface. The first
connecting conductor and the second connecting conductor are
respectively disposed on two sides of the transparent substrate.
The first connecting conductor and the second connecting conductor
are electrically connected to the LED structure.
[0014] Another preferred embodiment of the present invention
provides an illumination device. The illumination device includes a
supporting base and an LED chip providing light in
multi-directions, wherein the LED chip is disposed on the
supporting base.
[0015] Another preferred embodiment of the present invention
provides an illumination device. The illumination device includes a
LED chip and a support. The LED chip includes a transparent
substrate, at least one LED structure, a first connecting conductor
and a second connecting conductor. The transparent substrate has a
growth surface and a second main surface disposed opposite to each
other. The LED structure is disposed on the growth surface and
forms a first main surface where light emitted from with at least a
part of the growth surface without the LED structure. The LED
structure has a beam angle greater than 180 degrees, and at least a
part of light beams emitted from the LED structure pass through the
transparent substrate and are emitted from the second main surface.
The first connecting conductor and the second connecting conductor
are respectively disposed on two sides of the transparent
substrate. The first connecting conductor and the second connecting
conductor are electrically connected to the LED structure. The
support includes at least one opening, and the LED chip is disposed
correspondingly to the opening.
[0016] Another preferred embodiment of the present invention
provides an illumination device. The illumination device includes a
plurality of LED chips and a device frame. Each of the LED chips
includes a transparent substrate, at least one LED structure, a
first connecting conductor and a second connecting conductor. The
transparent substrate has a growth surface and a second main
surface disposed opposite to each other. The LED structure is
disposed on the growth surface and forms a first main surface where
light emitted from with at least a part of the growth surface
without the LED structure. The LED structure has a beam angle
greater than 180 degrees, and at least a part of light beams
emitted from the LED structure pass through the transparent
substrate and are emitted from the second main surface. The first
connecting conductor and the second connecting conductor are
respectively disposed on two sides of the transparent substrate.
The first connecting conductor and the second connecting conductor
are electrically connected to the LED structure. The device frame
includes a supporting base and a plurality of supports extending
outward from the supporting base. Each of the supports includes at
least one opening, and the LED chips are disposed correspondingly
to at least some of the openings.
[0017] Another preferred embodiment of the present invention
provides an illumination device. The illumination device includes a
plurality of LED chips and a light bar. Each of the LED chips
includes a transparent substrate, at least one LED structure, a
first connecting conductor and a second connecting conductor. The
transparent substrate has a growth surface and a second main
surface disposed opposite to each other. The LED structure is
disposed on the growth surface and forms a first main surface where
light emitted from with at least a part of the growth surface
without the LED structure. The LED structure has a beam angle
greater than 180 degrees, and at least a part of light beams
emitted from the LED structure pass through the transparent
substrate and are emitted from the second main surface. The first
connecting conductor and the second connecting conductor are
respectively disposed on two sides of the transparent substrate.
The first connecting conductor and the second connecting conductor
are electrically connected to the LED structure. The light bar
includes a plurality of openings. The light bar has an extending
direction, and the openings are disposed along the extending
direction. The LED chips are disposed correspondingly to at least
some of the openings.
[0018] Another preferred embodiment of the present invention
provides an illumination device. The illumination device includes a
plurality of LED chips and a supporting base. Each of the LED chips
includes a transparent substrate, at least one LED structure, a
first connecting conductor and a second connecting conductor. The
transparent substrate has a growth surface and a second main
surface disposed opposite to each other. The LED structure is
disposed on the growth surface and forms a first main surface where
light emitted from with at least a part of the growth surface
without the LED structure. The LED structure has a beam angle
greater than 180 degrees, and at least a part of light beams
emitted from the LED structure pass through the transparent
substrate and are emitted from the second main surface. The first
connecting conductor and the second connecting conductor are
respectively disposed on two sides of the transparent substrate.
The first connecting conductor and the second connecting conductor
are electrically connected to the LED structure. The supporting
base includes a plurality of openings. The openings are disposed as
an array. The LED chips are disposed correspondingly to at least
some of the openings.
[0019] Another preferred embodiment of the present invention
provides a device frame of an illumination device. The device frame
includes a supporting base and a plurality of supports. Each of the
supports extends from the supporting base. Each of the supports
includes at least one opening and a plurality of electrodes
disposed on two sides of the opening.
[0020] In the LED chip of the present invention, the LED structure
is disposed on the transparent substrate, and the transparent
substrate allows the light beam emitted by the LED structure
passing through. Accordingly, the LED chip in the present invention
can emit light in at least multi-directions or all directions. The
luminous efficiency of the illumination device may be accordingly
enhanced, and the light shape of the LED illumination device may
also be improved. Additionally, since the insulating layer, the
conductive pattern and the LED structures of the LED chip in the
present invention can be fabricated through wafer-level processes,
the related manufacturing cost may be reduced, and the
corresponding LED chip may have an improved reliability.
[0021] These and other objectives of the present invention will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the preferred
embodiment that is illustrated in the various figures and
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 and FIG. 2 are schematic structure diagrams
illustrating a light emitting diode (LED) chip according to a
preferred embodiment of the present invention.
[0023] FIGS. 3-5 are schematic diagrams illustrating different
types of electrically coupling approaches between a light emitting
diode structure and conductors according to a preferred embodiment
of the present invention.
[0024] FIG. 6 and FIG. 7 are schematic diagrams illustrating a
disposition of a wavelength conversion layer according to a
preferred embodiment of the present invention.
[0025] FIG. 8 is a cross-sectional diagram illustrating a LED chip
according to another preferred embodiment of the present
invention.
[0026] FIG. 9 is an equivalent circuit diagram of a LED chip
according to another preferred embodiment of the present
invention.
[0027] FIG. 10 is a schematic diagram illustrating a LED chip
according to another preferred embodiment of the present
invention.
[0028] FIG. 11 is a schematic diagram illustrating a supporting
base according to a preferred embodiment of the present
invention.
[0029] FIG. 12 is a schematic diagram illustrating a circuit board
according to a preferred embodiment of the present invention.
[0030] FIG. 13 is a schematic diagram illustrating a reflector
according to a preferred embodiment of the present invention.
[0031] FIG. 14 is a schematic diagram illustrating a diamond-like
carbon film according to a preferred embodiment of the present
invention.
[0032] FIG. 15 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
[0033] FIG. 16 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
[0034] FIGS. 17-19 are schematic diagrams illustrating a
transparent substrate inserted or adhered to a supporting base
according to a preferred embodiment of the present invention.
[0035] FIG. 20 and FIG. 21 are schematic diagrams illustrating a
transparent substrate adhered to a supporting base with supports
according to a preferred embodiment of the present invention.
[0036] FIG. 22 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
[0037] FIG. 23 is a schematic diagram illustrating a device frame
of an illumination device according to another preferred embodiment
of the present invention.
[0038] FIG. 24 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
[0039] FIGS. 25-28 are schematic diagrams illustrating transparent
substrates point-symmetrically or line-symmetrically disposed on a
supporting structure according to a preferred embodiment of the
present invention.
[0040] FIG. 29 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
[0041] FIG. 30 and FIG. 31 are schematic diagrams illustrating a
lamp housing according to a preferred embodiment of the present
invention.
[0042] FIG. 32 is a top-view diagram illustrating an advertisement
lamp housing according to a preferred embodiment of the present
invention.
[0043] FIGS. 33-36 are schematic diagrams illustrating a bulb lamp
according to a preferred embodiment of the present invention.
[0044] FIG. 37 is a schematic diagram illustrating a light bar
according to another preferred embodiment of the present
invention.
[0045] FIG. 38 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
[0046] FIG. 39 is a schematic diagram illustrating an illumination
device according to another preferred embodiment of the present
invention.
DETAILED DESCRIPTION
[0047] Please refer to FIG. 1 and FIG. 2. FIG. 1 and FIG. 2 are
schematic structure diagrams illustrating a light emitting diode
(LED) chip or a light emitting plate according to a preferred
embodiment of the present invention. As shown in FIG. 1 and FIG. 2,
a LED chip 1 includes a transparent substrate 2, a growth surface
210, a first main surface 21A, a second main surface 21B and at
least one LED structure 3 providing light in multi-directions. The
transparent substrate 2, which is a sheet type substrate, has two
main surfaces, and one of the surfaces is the growth surface 210.
The LED structure 3 capable of emitting light is disposed on the
growth surface 210. A light emitting surface 34 of the LED
structure 3 uncovered by the transparent substrate 2 and at least a
part of the growth surface 210 without the LED structure form the
first main surface 21A where light emitted from. The second main
surface 21B is another main surface of the transparent substrate 2
without the LED structures 3. The disposition described above may
also be reversed, or the LED structure 3 may be disposed on the two
surfaces of the transparent substrate 2. In one embodiment, LED
structures 3 may be disposed on the growth surface 210 of the
transparent substrate 2 interlacedly corresponding to other LED
structures 3 disposed on the second main surface 21B, such that
light beams emitted from LED structure 3 on one surface of the
transparent substrate 2 would not be blocked by other LED structure
3 on another surface of the transparent substrate 2. The luminance
of the LED chip 1 may be increased accordingly. A material of the
transparent substrate 2 may comprise one selected from aluminum
oxide (Al.sub.2O.sub.3), sapphire containing aluminum oxide,
silicon carbide (SiC), glass, plastic or rubber. Preferably, the
transparent substrate may be a sapphire substrate in a preferred
embodiment of the present invention. The structure of the sapphire
substrate is substantially single crystal. The sapphire substrate
has properties of higher light transmittance and better heat
dissipation capability. The sapphire substrate may be used to
increase the life time of the LED chip 1. However, the conventional
sapphire substrate used for forming conventional LED structure may
be fragile when applied in the present invention. According to
experiment results of the present invention, the transparent
substrate 2 of the present invention is preferably a sapphire
substrate having a thickness thicker than or equal to 200
micrometers so as to perform better reliability, supporting
performance and transparency. For emitting light in
multi-directions, including dual-directions or full directions,
from the LED chip 1, the LED structure 3 in this invention
preferably has a beam angle greater than 180 degrees. Accordingly,
the LED structure 3 disposed on the transparent substrate 2 may
emit light beams from the light emitting surface 34 toward a
direction away from the transparent substrate 2, and the LED
structure 3 may also emit light beams at least partially entering
the transparent substrate 2. The light beams entering the
transparent substrate 2 may emerge from the second main surface 21B
opposite to the first main surface 21A, and the light beams
entering the transparent substrate 2 may also be emitted from a
part of the growth surface 210 without LED structures 3 or emitted
from other surfaces of the transparent substrate 2. The LED chip 1
may then be capable of emitting light in multi-directions including
dual-directions or full directions. In this invention, an area of
the first main surface 21A or an area of the second main surface
21B is larger than 5 times of a total area formed from at least one
of the light emitting surfaces 34 of each LED structure, and this
is a preferred proportion according to the consideration of both
the luminous efficiency and the heat dissipation performance.
[0048] Additionally, in another preferred embodiment of the present
invention, a difference in color temperatures of light beams
emitted from the first main surface 21A and the second main surface
21B of the LED chip 1 is smaller than or equal to 1500K so as to
uniform light emitting effects of the LED chip 1. In addition,
under the thickness condition of the transparent substrate 2
mentioned above, a light transmittance of the transparent substrate
3 is larger than or equal to 70% for light beams having a
wavelength range larger than or equal to 420 nanometers, or light
beams having a wavelength rage smaller than or equal to 470
nanometers.
[0049] The present invention is not limited to the embodiment
described above. The following description will detail the
different embodiments in the present invention. To simplify the
description, similar components in each of the following
embodiments are marked with identical symbols. For making it easier
to understand the differences between the embodiments, the
following description will detail the dissimilarities among
different embodiments and the identical features will not be
redundantly described.
[0050] Please refer to FIGS. 3-5. In the present invention, the LED
structure 3 includes a first electrode 31A and a second electrode
31B for receiving electricity. The first electrode 31A and the
second electrode 31B are respectively and electrically connected to
a first connecting conductor 23A and a second connecting conductor
23B on the transparent substrate 2. FIGS. 3-5 are schematic
diagrams illustrating different types of electrically coupling
approaches between the light emitting diode structure 3 and the
conductors. FIG. 3 illustrates a horizontal type LED structure, the
LED structure 3 is formed on the growth surface 210 of the
transparent substrate 2, and the electrodes 31A and 31B are coupled
to the connecting conductors 23A and 23B by wire bonding. FIG. 4
illustrates a flip structure type LED structure 3, and the LED
structure 3 is disposed reversely and coupled to the transparent
substrate 2 by the first electrode 31A and the second electrode
31B. The first electrode 31A and the second electrode 31B may be
directly coupled to the first connecting conductor 23A and the
second connecting conductor 23B by welding or adhering. As shown in
FIG. 5, the first electrode 31A and the second electrode 31B are
disposed on different surfaces of the LED structure 3, and the LED
structure 3 is vertically disposed so as to respectively connect
the electrodes 31A and 31B to the connecting conductors 23A and
23B.
[0051] Please refer to FIG. 6 and FIG. 7. The LED chip 1 in the
present invention may further include a wavelength conversion layer
4. The wavelength conversion layer 4 may be selectively disposed on
the first main surface 21A or/and the second main surface 21B, or
directly on the LED structures 3. The wavelength conversion layer 4
may directly contact the LED structures 3, or the wavelength
conversion layer 4 may be separated from the LED structures 3 by a
distance without directly contact. The wavelength conversion layer
4 contains at least one kind of fluorescent powders such as organic
fluorescent powder or inorganic fluorescent powder of garnet
series, sulfate series or silicate series. The wavelength
conversion layer 4 may then be able to at least partially absorb a
light beam emitted from the LED structure 3 and covert the light
beam into another light beams having different wavelength range.
For example, when blue light beams are emitted from the LED
structure 3, a part of the blue light beams may be converted into
yellow light beams by the wavelength conversion layer 4, and the
blue light beams and the yellow light beams may be mixed for
presenting white light beams emitted from the LED chip 1.
Additionally, a luminance of the first main surface 21A is
different from a luminance of the second main surface 21B because a
light source of the first main surface 21A mainly comes from light
beams directly emitted from the LED structure 3, and a light source
of the second main surface 21B comes from light beams passing
through the transparent substrate 2. Therefore, in a LED chip 1 of
another preferred embodiment, concentrations of the fluorescent
powders in the wavelength conversion layer 4 disposed on the first
main surface 21A and the wavelength conversion layer 4 disposed on
the second main surface 21B are arranged correspondingly.
Preferably, a ratio of a fluorescent powder concentration in the
wavelength conversion layer 4 disposed on the first main surface
21A to a fluorescent powder concentration in the wavelength
conversion layer 4 disposed on the second main surface 21B may
ranges from 1:0.5 to 1:3, or a ratio of the fluorescent powder
concentration in the wavelength conversion layer 4 disposed on the
second main surface 21B to the fluorescent powders in the
wavelength conversion layer 4 disposed on the first main surface
21A may ranges from 1:0.5 to 1:3. The luminance and the lighting
effect of the LED chip 1 may become more appropriate for different
applications accordingly. A difference in color temperatures of
light beams emitted from the first main surface 21A and the second
main surface 21B may then be controlled to be smaller than or equal
to 1500K. A wavelength converting efficiency and light emitting
performance of the LED chip 1 may then be enhanced.
[0052] Please refer to FIG. 8. FIG. 8 is a cross-sectional diagram
illustrating a LED chip according to another preferred embodiment
of the present invention. As shown in FIG. 8, the LED chip 10 in
this embodiment includes a transparent substrate 2, a plurality of
LED structures 14, an insulating layer 20 and a conductive pattern
22. The transparent substrate 2 has a growth surface 210 and a
second main surface 21B disposed opposite to each other. The LED
structures 14 are disposed or formed on the growth surface. Each of
the LED structures 14 includes a first electrode 16 and a second
electrode 18. A light emitting surface 34 of the LED structures 14
uncovered by the transparent substrate 2 and a part of the growth
surface 210 without the LED structures 14 form a first main surface
21A where light emitted from. The insulating layer 20 is disposed
at least on a part of the LED structure 14. The conductive pattern
22 is disposed on the insulating layer 20 and electrically
connected to at least a part of the first electrodes 16 and at
least a part of the second electrodes 18. The conductive pattern 22
may be a metal line layout or a pattern formed by wire bonding, but
the present invention is not limited to this. Other appropriate
materials may also be used to form the conductive pattern 22.
[0053] The LED structure 14 may include a first semiconductor layer
141, an active layer 142 and a second semiconductor layer 143. The
first semiconductor layer 141, the active layer 142 and the second
semiconductor layer 143 are sequentially formed on the transparent
substrate 2. Preferably, the first semiconductor layer 141 may be
an N-type semiconductor layer, and the second semiconductor layer
143 may be a P-type semiconductor layer, but not limited thereto.
Materials of the first semiconductor layer 141, the active layer
142, and the second semiconductor layer 143 are selected from IIIA
nitride group such as aluminum nitride (AlN) or gallium nitride
(GaN), but not limited thereto. The LED chip 10 may further include
a buffer layer 13 formed between the first semiconductor layer 141
and the transparent substrate 2. A material of the buffer layer 13
may also be selected from IIIA nitride group such as aluminum
nitride or gallium nitride, but not limited thereto. The first
electrode 16 is electrically connected to the second semiconductor
layer 143, and the second electrode 18 is electrically connected to
the first semiconductor layer 141. The first electrode 16 and the
second electrode 18 may be metal electrodes, but not limited
thereto.
[0054] In addition, the LED chip 10 may further include wavelength
conversion layers 4 disposed on the transparent substrate 2 and the
LED structures. A light beam (not shown) emitted from the LED
structure 14 may have a specific wavelength range. The wavelength
conversion layer 4 may convert the light beam having the specific
wavelength range into another light beam having different
wavelength range or having a wider wavelength rage, and the LED
chip 10 may emit the converted light beam accordingly.
[0055] In this embodiment, the LED structures 14 are connected in
series through the conductive pattern 22, but not limited thereto.
In addition, the insulating layer 20, the conductive pattern 22,
the LED structures 14 (each of which including the first
semiconductor layer 141, the active layer 142 and the second
semiconductor layer 143) and the buffer layer 13 can be fabricated
in consecutive processes. In other words, after the buffer layer
13, the first semiconductor layer 141, the active layer 142 and the
second semiconductor layer 143 are sequentially formed on the
transparent substrate 2, the insulating layer 20 and the conductive
pattern 22 can be further formed. A dicing process is carried out
afterward. Processes for fabricating the insulating layer 20 and
the conductive pattern 22 may include photolithography and etching
processes, but not limited thereto. Since the insulating layer 20,
the conductive pattern 22 and the LED structures 14 in the LED chip
10 of this embodiment are all fabricated through wafer-level
processes, the related manufacturing cost may be reduced, and the
corresponding LED chip 10 may have an improved reliability.
[0056] Additionally, in order to increase intensity and
distribution uniformity of the light emitted from the transparent
substrate 2, the second main surface 21B may selectively has a
non-planar structure 12M. The non-planar structure 12M may includes
various convex or concave structures, such as pyramid, cone,
hemispheroid, triangular prism and so forth. The non-planar
structure 12M may be arranged regularly or randomly. Furthermore, a
diamond-like carbon (DLC) film 25 may be optionally disposed on the
second main surface 21B, which is used to increase the thermal
conduction ability and thermal dissipation ability. Furthermore,
there may be an optical film 28 between the second main surface 21B
and the diamond-like carbon film 25. Preferably, the optical film
28 may be chosen from a material having a refractive index between
a refractive index of the transparent substrate 2 and a refractive
index of the diamond-like carbon film 25 or the wavelength
conversion layer 4, to increase the light output of the LED chip
10.
[0057] Please refer to FIG. 9 accompanied with FIG. 8 and other
figures described above. FIG. 9 is an equivalent circuit diagram of
a LED chip according to another preferred embodiment of the present
invention. As shown in FIG. 9, in this modified embodiment, the LED
structures 14 in an LED chip 10' are electrically connected in a
hybrid way by the conductive pattern 22; that is, some are in
series and the others are in parallel. The LED structures are
further electrically coupled to a power supply via the connecting
conductors.
[0058] Please refer to FIG. 10. FIG. 10 is a schematic diagram
illustrating an illumination device according to another preferred
embodiment of the present invention. As shown in FIG. 10, a LED
chip 310 in this invention includes the transparent substrate 2, at
least one LED structure 3, a first connecting electrode 311A, a
second connecting electrode 311B and at least one wavelength
conversion layer 4. The LED structure 3 is disposed on the growth
surface 210 of the transparent substrate 2 and forms a first main
surface 21A where light emitted from. In this embodiment, the LED
structure 3 has a beam angle greater than 180 degrees, and at least
a part of light beams emitted from the LED structure 3 penetrate
into the transparent substrate 2. At least a part of the
penetrating light beams may be emitted from a second main surface
21B which is opposite to the first main surface 21A, and the other
penetrating light beams may be emitted from other surfaces of the
transparent substrate 2, so as to form the LED chip 310 providing
light in multi-directions. The first connecting electrode 311A and
the second connecting electrode 311B are respectively disposed on
different sides of the transparent substrate 2 or on the same side
of the transparent substrate 2 (not shown in FIG. 10). The first
connecting electrode 311A and the second connecting electrode 311B
may be electrodes of the chip 310 respectively formed by extension
parts of a first connecting conductor and a second connecting
conductor on the transparent substrate 2, and the first connecting
electrode 311A and the second connecting electrode 311B are
electrically connected to the LED structure 3 accordingly. The
wavelength conversion layer 4 at least covers the LED structure 3
and exposes at least a part of the first connecting electrode 311A
and the second connecting electrode 311B. In other words, the
wavelength conversion layer 4 may also be disposed without covering
the first connecting electrode 311A and the second connecting
electrode 311B. The wavelength conversion layer 4 at least
partially absorbs a light beam emitted from the LED structure 3
or/and the transparent substrate 2, and converts the light beam
into a light beam having another wavelength range. The converted
light and the light which are not absorbed by the wavelength
conversion layer 4 may be mixed to extend the total wavelength
range of the light beams emitted from the LED chip 310 and improve
the light emitting performance of the LED chip 310. Because the LED
chip 310 in this embodiment includes the first connecting electrode
311A and the second connecting electrode 311B respectively disposed
on the transparent substrate 2, traditional LED packaging process
may be omitted and the LED chip 310 may be independently
manufactured and then combined with an appropriate supporting base.
Accordingly, the total manufacturing yield may be improved, the
structure may be simplified and the applications of the
corresponding supporting base may also be increased.
[0059] Please refer to FIG. 11. An illumination device 11 is
provided in this embodiment. The illumination device 11 includes a
supporting base 5 and the LED chip described above. The transparent
substrate 2 of the LED chip may stand on (or lie on) and be
electrically coupled to the supporting base 5. A first angle
.theta.1 exists between the transparent substrate 2 and the
supporting base 5. The first angle .theta.1 may be fixed or be
adjusted according to the light shape requirement of the
illumination device. Preferably, the first angle .theta.1 ranges
from 30 degrees to 150 degrees.
[0060] Please refer to FIG. 12. The supporting base 5 of the
illumination device 11 in the present invention may further
includes a circuit board 6 electrically coupled to a power supply.
The circuit board 6 is electrically coupled to a first connecting
conductor and a second connecting conductor (not shown in FIG. 12)
so as to be electrically connected to the LED structure 3. The
power supply may then provide electricity to the LED ship 3 for
emitting light via the circuit board 6. In other preferred
embodiment of the present invention, the LED structure 3 may also
be electrically connected to the supporting base directly via the
first connecting conductor and the second connecting conductor (not
shown in FIG. 12) without the circuit board 6, and the power supply
may provides electricity to the LED ship 3 via the supporting base
5.
[0061] Please refer to FIG. 13. The illumination device 11 of the
present invention may further include a reflector or filter 8
disposed on the second main surface 21B or the growth surface 210.
The reflector or filter 8 may be used to reflect at least a part of
light beams emitted from the LED structure 3 and passing through
the transparent substrate 2. At least a part of the reflected light
beams may be changed to be emitted from the first main surface 21A.
The reflector 8 may includes at least one metal layer or a Bragg
reflector, but not limited thereto. The Bragg reflector may be
composed of a plurality of insulating thin films with different
refractive indexes disposed in a stack configuration, or the Bragg
reflector may be composed of a plurality of insulating thin films
with different refractive indexes and a plurality of metal oxide
layers disposed in a stack configuration.
[0062] Please refer to FIG. 14. The illumination device 11 of the
present invention may further include a diamond-like carbon (DLC)
film 9 disposed on the growth surface 210 or/and the second main
surface 21B of the transparent substrate 2 so as to enhance the
thermal conductive ability and the heat dissipating
performance.
[0063] Please refer to FIG. 15. FIG. 15 is a schematic diagram
illustrating an illumination device according to another preferred
embodiment of the present invention. As shown in FIG. 15, an
illumination device 100 in this embodiment includes a LED chip 10
and a supporting base 26. The LED chip 10 may be at least partially
embedded into the supporting base 26, and the LED chip 10 is
electrically connected to the electrode 30 and the electrode 32 of
the supporting base 26 via the connecting conductors. Driving
voltage V+ and driving voltage V- may be provided through the
electrodes 30 and 32 respectively to the LED chip 10 for emitting a
light beam L. In the illumination device 100 of this embodiment,
the structure of the LED chip 10 may be similar to the LED chip of
other embodiments described above, and the conductive pattern 22 is
electrically connected to the first electrodes 16 and the second
electrodes 18 of at least a part of the LED structures 14 so as to
electrically connect at least some of the LED structures 14 in
series or other approaches such as in parallel. The conductive
pattern 22 may be a metal line layout or a pattern formed by wire
bonding, but not limited thereto. Other appropriate materials or
structures may also be used to form the conductive pattern 22. The
first electrode 16 and the second electrode 18, which are not
connected to the conductive pattern 22, are respectively and
electrically connected to the electrode 30 and the electrode 32 of
the supporting base 26 via the connecting conductors. Additionally,
at least one of the LED structures 14 of the LED chip 10 emits the
light beam L with a beam angle greater than 180 degrees or has a
plurality of light emitting surfaces, and then the LED chip 10 may
emits light beams from the first main surface 21A and the second
main surface 21B. Further more, because some of the light beams may
be emitted directly from the LED structure 14 and/or the other four
side surfaces of the transparent substrate 2, the LED chip 10 may
accordingly emit light from six sides or in full directions.
[0064] Additionally, the LED chip 10 in this embodiment may further
includes a wavelength conversion layer 4, a DLC film 25 and an
optical film 28 disposed on the second main surface 21B of the
transparent substrate 2. The wavelength conversion layer 4 may
further be disposed on the LED structures 14 or the first main
surface 21A. The wavelength conversion layer 4 may covert at least
a part of light beams emitted from the LED structures 14 into
another light beams having different wavelength range so as to emit
light with specific color or light having a wider wavelength range
from the LED chip 10. For example, when blue light beams are
emitted from the LED structure 14, a part of the blue light beams
may be converted into yellow light beams by the wavelength
conversion layer 4, and the blue light beams and the yellow light
beams may be mixed for presenting white light beams emitted from
the LED chip 10. The DLC film 25 and the optical film 28 may be
used to enhance the thermal dissipation ability and the light
emitting efficiency of the LED structure 14 and the LED chip 10.
The transparent substrate 2 preferably includes materials with high
thermal conductivity, and heat generated from the LED structure 14
may be accordingly dissipated directly to the supporting base 26,
such that the high power LED structures can be applied in the
illumination device of the present invention accordingly. However,
in a preferred embodiment of the present invention, at the same
power consumption of the illumination device, more LED structures
with relatively low power are dispersed on the transparent
substrate 2 so as to fully utilize the thermal conductivity
capability of the transparent substrate 2. For example, a power of
each LED structure 14 in this embodiment may be equal to or lower
than 0.2 watt, but not limited thereto.
[0065] Please refer to FIG. 16. FIG. 16 is a schematic diagram
illustrating an illumination device according to a preferred
embodiment of the present invention. As shown in FIG. 16, an
illumination device 200 in this embodiment may further includes a
support 51 configured to connect the LED chip 10 and the supporting
base 26. The LED chip 10 is fixed on a side of the support 51 by a
bonding layer 52, and another side of the support 51 may be
disposed on the supporting base 26. Additionally, the support 51
may be flexible so as to form an adjustable angle between the LED
chip 10 and the supporting base 26, and the angle ranges from 30
degrees to 150 degrees. A material of the support 51 may include
one selected from aluminum, composite metallic material, copper
conductor, electric wire, ceramic substrate, printed circuit board,
or other appropriate materials.
[0066] Please refer to FIGS. 17-19. When the transparent substrate
2 in the present invention is disposed on a supporting base 5, the
transparent substrate 2 may be inserted or bonded to the supporting
base 5.
[0067] As shown in FIG. 17. When the transparent substrate 2 is
disposed on the supporting base 5, the transparent substrate 2 is
inserted in to a single socket 61 of the supporting base 5, and the
LED chip may be electrically coupled to the single socket 61 via
connecting conductors. The LED structures (not shown in FIG. 17) on
the transparent substrate 2 have to be electrically coupled to a
power supply from or through the supporting base 5, and at least
part of the conductive pattern or the connecting conductors are
extended to an edge of the transparent substrate 2 and integrated
in to an connecting finger having a plurality of conductive contact
sheets or an electrically connecting port such as the connecting
electrodes 311A and 311B described above (not shown in FIG. 17).
When the transparent substrate 2 is inserted into the socket 61,
the LED structure (not shown in FIG. 17) may then receive
electricity from or through the supporting base 5, and the
transparent substrate 2 may be fixed by the socket 61 of the
supporting base 5 accordingly.
[0068] Please refer to FIG. 18. FIG. 18 is a schematic diagram
illustrating the transparent substrate 2 inserted into multi
sockets of the supporting base 5. In this embodiment, the
transparent substrate 2 has a dual-pin structure. One of the pins
may be configured as a positive electrode of the chip, and another
one of the pins may be configured as a negative electrode of the
chip. Both of the pins comprise at least a conductive contact sheet
respectively so as to act as connecting ports. In other words, at
least one electrically connecting port is disposed on the pin.
Accordingly, there are at least two sockets 61 having corresponding
shape and size with the pins so as to smoothly insert the
transparent substrate 2 into the supporting base 5 and provide
electricity to the LED structure.
[0069] Please refer to FIG. 19. The transparent substrate 2 is
combined with the supporting base 5. In the combining process,
metal materials such as gold, tin, indium, bismuth or silver may be
used in combining or welding the transparent substrate 2 and the
supporting base 5. Additionally, conductive silica gel or epoxy
material may also be used in fixing the transparent substrate 2 on
the supporting base 5. The conductive pattern and the connecting
conductors of the LED chip may be electrically connected to the
supporting base via the bonding layer accordingly.
[0070] Please refer to FIG. 20 and FIG. 21. The supporting base 5
of the illumination device 11 described in the present invention
may be a substrate comprising one selected from metal such as
aluminum, composite metallic material including aluminum, copper
conductor, electric wire, ceramic substrate or printed circuit
board. There is at least one support 62 on a surface or edge of the
supporting base 5. The support 62 may be separated from the
supporting base 5, or the support 62 and the supporting base 5 are
monolithically integrated. The LED chip may be electrically coupled
to the support 62 by bonding, and a bonding layer 63 is used to fix
the transparent substrate 2 on the supporting base 5. The first
angle .theta.1 is maintained between the transparent substrate 2
and a surface of the supporting base 5 without supports. The LED
chip may also be disposed on the surface of the supporting base 5
without supports so as to enhance the light emitting performance of
the illumination device 11. Additionally, the LED chip may also be
inserted and connected to the support 62 (not shown in FIG. 20 and
FIG. 21), wherein a connector may be used to connect the LED chip
and the support (and/or the support and the supporting base) so as
to fix the transparent substrate 2 on the supporting base 5.
Because the supporting base 5 and the support 62 are flexible, it
is more convenient to apply the present invention to different
applications. Moreover, the color variety of the illumination
device 11 may be enhanced for different demands by combining using
LED chips having different light colors.
[0071] Please refer to FIG. 22. As shown in FIG. 22, an
illumination device in this embodiment includes at least one LED
chip 1 and a supporting base 5. The supporting base 5 includes at
least one support 62 and at least one circuit pattern P. An end of
the transparent substrate of the LED chip 1 is electrically coupled
to the support 62 so as to avoid or reduce the shielding influence
caused by the support 62 for light emitting from the LED chip 1.
The supporting base 5 may comprise one selected from metal such as
aluminum, composite metallic material including aluminum, copper
conductor, electric wire, ceramic substrate or printed circuit
board. The support 62 may be formed by cutting and bending a part
of the supporting base 5 to form an angle (as the first angle
.theta.1 shown in FIG. 20 and FIG. 21). The circuit pattern P is
disposed on supporting base 5, and the circuit pattern P has at
least one set of electrical port to be electrically connected to a
power supply. Another part of the circuit pattern P extends on the
support 62 so as to be electrically connected to the LED chip 1,
and the LED chip 1 may than be electrically connected to the power
supply via the circuit pattern P of the supporting base 5. In
addition, the supporting base 5 may further include at least one
hole H or at least one gap G, and fixing devices such as screws,
nails or bolts may be used to combine the supporting base 5 with
other device via the hole H or the gap G according to the
application conditions of the illumination device. Meanwhile, the
hole H or the gap G may also be used to increase the heat radiating
area and enhance the heat dissipation capability of the
illumination device.
[0072] Please refer to FIG. 23. FIG. 23 is a schematic diagram
illustrating a device frame of an illumination device according to
another preferred embodiment of the present invention. As shown in
FIG. 23, a device frame 322 in this embodiment includes a
supporting base 5 and at least one support 62. Compared with the
embodiment shown in FIG. 22, the support 62 in this embodiment
includes at least one stripe part 342 and an opening 330. The
electrode 30 and the electrode 32 are respectively disposed on two
sides of the opening 330. The stripe part 342 forms at least one
wall of the opening 330. One LED chip described in the present
invention is disposed correspondingly to the opening 330 and
electrically coupled to the support 62. The connecting conductors
of the LED chip is electrically connected to the electrode 30 and
32 so as to drive the LED chip by a power supply via the support 62
and the circuit pattern on the supporting base 5. A size of the
opening 330 may not be smaller than a main light emitting surface
of the LED chip so as to prevent light beams emitted from the LED
chip from being blocked by the support 62. An interface between the
support 62 and the supporting base 5 may be adjustable so as to
adjust the angle between the support 62 and the supporting base 5
as required.
[0073] Please refer to FIG. 23 and FIG. 24. FIG. 24 is a schematic
diagram illustrating an illumination device according to another
preferred embodiment of the present invention. Compared with the
embodiment shown in FIG. 23, an illumination device 302 shown in
FIG. 24 further includes at least one support 62 having a plurality
of openings 330. The openings 330 are respectively disposed on two
opposite sides of the support 62, and the stripe part 342 forms at
least one wall of each opening 330. The LED chip 310 are disposed
correspondingly to the openings 330, and the conductive pattern or
the connecting electrodes (not shown in FIG. 25) of each LED chip
310 are respectively disposed correspondingly and electrically
connected to the electrode 30 and 32. The illumination device 302
in this embodiment may further include a plurality of the supports
62. Angles between the supporting base 5 and the supports 62 with
the LED chip disposed on may be modified respectively. In other
words, an angle between the supporting base 5 and at least one of
the supports 62 may be different from an angle between the
supporting base 5 and another one of the supports 62 so as to
perform required light emitting effects, but not limited thereto.
Additionally, LED chips emitting light having different wavelength
ranges may be disposed on an identical support or on different
supports so as to enrich the color effect of the illumination
device.
[0074] For enhancing the luminance and improving the light emitting
effect, in an illumination device of another preferred embodiment
of the present invention, a plurality of the LED chips comprising
the transparent substrates are disposed on the supporting bases
detailed above or on other supporting structures. A point-symmetric
distribution or a line-symmetric distribution may be applied. The
LED chips comprising the transparent substrates may be
point-symmetrically disposed on the supporting structure or
line-symmetrically disposed on the supporting structure. Please
refer to FIGS. 25-28. In the illumination devices of the
embodiments shown in FIGS. 25-28, the LED chips are disposed on the
supporting structures having different shapes. The light beams
emitted from the illumination devices 11 may be uniform because of
the point-symmetric distribution or the line-symmetric distribution
(the LED structures are not shown in FIGS. 25-28). The light
emitting effects of the illumination devices 11 may be further
improved by adjusting the first angle described above. As shown in
FIG. 25, the LED chips are point-symmetrically arranged and form an
angle between each other in 90 degrees. Such that at least two of
the LED chips face any one of the four sides of the illumination
device 11. As shown in FIG. 26, the angle between the LED chips is
smaller than 90 degrees. As shown in FIG. 28, the angle between the
LED chips is larger than 90 degrees. In another preferred
embodiment of the present invention (not shown), the LED chips may
be asymmetrically disposed and at least a part of the LED chips may
be disposed in a crowd or separately disposed so as to perform
required light shape according to different applications of the
illumination device.
[0075] Please refer to FIG. 29. FIG. 29 is a schematic diagram
illustrating an illumination device according to another preferred
embodiment of the present invention. As shown in FIG. 29, an
illumination device 301 includes a LED chip 310 and a support 321.
The support 321 includes an opening 330, and the LED chip 310 is
disposed correspondingly to the opening 330. In this embodiment, an
external part of the support 321 may be work as a pin or be bent to
form a connecting pad required in surface mounting so as to be
fixed and electrically connected to other electrical circuit units.
A light emitting surface of the LED chip 310 is disposed in the
opening 330, and the illumination device 301 may still emit light
from multi sides or six sides accordingly whether the support 321
is transparent or not.
[0076] Please refer to FIG. 30. An illumination device is provided
in this embodiment of the present invention. The illumination
device includes a lamp housing 7 having a tube shape, at least one
LED chip 1 and a supporting structure 60. The LED chip 1 is
disposed on the supporting structure 60, and at least a part of the
LED chip 1 is disposed in space formed by the lamp housing 7.
Please refer to FIG. 31. When more LED chips 1 are disposed in the
lamp housing 7, the first main surfaces 21A of the LED chips 1 are
arranged separately and not parallel to one another. Additionally,
the LED chips 1 are at least partially disposed in space formed by
the lamp housing 7, and the LED chips 1 are not closely adjacent to
an inner wall of the lamp housing 7. Preferably, a distance D
between the LED chip 1 and the lamp housing 7 may be equal to or
larger than 500 micrometers. However, the lamp housing 7 may also
be formed by filling glue, and the lamp housing 7 may at least
partially cover and directly contact the LED chip 1.
[0077] Please refer to FIG. 32. In another illumination device is
provided in this embodiment of the present invention, the lamp
housing 7 of the illumination device has at least one covering
layer 71. The covering layer 71 may be a billboard, signboard or
other display devices requiring backlight sources. Light provided
from the first main surface 21A and the second main surface 21B of
the LED chip 1 in the present invention may be applied as a light
source of a backlight for the covering layer 71. An second angle
between the LED chip 1 and the covering layer 71 ranges between 0
degree and 45 degrees (the second angle is 0 degree in FIG. 32 and
not shown accordingly). In addition, the LED chips 1 are at least
partially disposed in space formed by the lamp housing 7 and
basically not closely adjacent to the inner wall of the lamp
housing 7, and then light beams generated by a light emitting
plate/sheet or the LED chip comprising the transparent substrate
and the LED structure providing light in multi-directions can
uniformly pass through the lamp housing. Preferably, a distance D
between the LED chip 1 and the lamp housing 7 may be equal to or
larger than 500 micrometers. However, the lamp housing 7 may also
be formed by filling glue, and the lamp housing 7 may at least
partially cover and directly contact the LED chip 1.
[0078] Please refer to FIGS. 33-36. In other series of embodiments
in the present invention, the illumination devices in this series
of embodiments may further include a lamp housing 7 having a bulb
shape and a base 64. As shown in FIG. 33, compared with the other
embodiments described above, the illumination device in this
embodiment further includes a lamp housing 7 having a bulb shape,
and a supporting base 5 further disposed on a base 64. The base 64
may be a traditional lamp base. The lamp housing 7 may be coupled
to the base 64 and cover the LED chip and the supporting base 5, or
the lamp housing 7 may be directly coupled to the supporting base 5
and cover the LED chip. The shape of the base 64 may be modified as
required. The base 64 may be a platform or include another
supporting protrusion (as shown in FIG. 34). As shown in FIG. 35,
the wavelength conversion layer 4 is coated on an inner wall of the
lamp housing 7 so as to convert at least a part of light beams
generated from the LED structure 3 into another light beams having
different wavelength range before leaving the lamp housing 7. As
shown in FIG. 36, a dual housing design including the lamp housing
7 and a lamp housing 7' is disclosed. Space S exists between the
lamp housing 7 and the lamp housing 7'. The space S, the lamp
housing 7 and the lamp housing 7' may be further modified for
performing different patterns and colors of light from the
illumination device.
[0079] Please refer to FIG. 37 and FIG. 38. FIG. 37 is a schematic
diagram illustrating a light bar according to another preferred
embodiment of the present invention. FIG. 38 is a schematic diagram
illustrating an illumination device according to another preferred
embodiment of the present invention. As shown in FIG. 37, a light
bar 323 in this embodiment includes a plurality of openings 330.
The light bar 323 has an extending direction X, and the openings
330 are disposed along the extending direction X. A plurality of
the LED chips providing light in multi-directions are disposed
correspondingly to the openings 330 of the light bar 323, and the
light bar 323 can emit light accordingly, but not limited thereto.
Additionally, the light bar 323 may further include a plurality of
electrodes 30 and 32, a first external connecting electrode 350A
and a second external connecting electrode 350B. The electrical
polarity of the electrode 30 is different from the electrode 32.
The electrodes 30 and the electrodes 32 are respectively disposed
on the same side or different sides of each opening 330. The first
external connecting electrode 350A and the second external
connecting electrode 350B are electrically connected to the
electrodes 30 and the electrodes 32 respectively. The first
external connecting electrode 350A and the second external
connecting electrode 350B are respectively disposed on the same
side or different sides of the light bar 323. As shown in FIG. 37
and FIG. 38, an illumination device 303 may include the light bar
323 described above and a device frame 360, wherein the light bar
323 with LED chips 310 may be vertically disposed, horizontally
disposed or inclinedly disposed on the device frame 360. The first
connecting electrode 350A and 350B of the light bar 323 may be
electrically connected to a power supply via the device frame 360,
but not limited thereto. Additionally, other appropriate optical
films such as diffusion films may also be applied in the
illumination device 303 so as to modify the light emitting effect
of the LED chips 310 disposed in the device frame 360.
[0080] Please refer to FIG. 39. FIG. 39 is a schematic diagram
illustrating an illumination device according to another preferred
embodiment of the present invention. As shown in FIG. 39, an
illumination device 304 includes a plurality of the LED chips 310
and a supporting base 324. The supporting base 324 includes a
plurality of openings 330, and the openings 330 are disposed as an
array. The LED chips 310 are disposed correspondingly to the
openings 330. The connecting approach of the LED chips 310 on the
openings 330 may be similar to that described in the embodiments
detailed above, and will not be redundantly described. In addition,
the supporting base 324 may further include a first external
connecting electrode 350A and a second external connecting
electrode 350B so as to be electrically connected to other
electrical devices. Additionally, the illumination device 304 in
this embodiment may be used as a billboard, signboard or a
backlight module, and the supporting base 324 is preferably
transparent, but not limited thereto.
[0081] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the invention. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
* * * * *