U.S. patent application number 13/742784 was filed with the patent office on 2013-12-05 for methods, apparatuses, and systems for thermal management between devices.
This patent application is currently assigned to MOTOROLA MOBILITY LLC. The applicant listed for this patent is MOTOROLA MOBILITY LLC. Invention is credited to Morris B. Bowers, Alberto R. Cavallaro, Martin R. Pais, Maninder S. Sehmbey.
Application Number | 20130319640 13/742784 |
Document ID | / |
Family ID | 49668825 |
Filed Date | 2013-12-05 |
United States Patent
Application |
20130319640 |
Kind Code |
A1 |
Cavallaro; Alberto R. ; et
al. |
December 5, 2013 |
METHODS, APPARATUSES, AND SYSTEMS FOR THERMAL MANAGEMENT BETWEEN
DEVICES
Abstract
A peripheral electronic device (106) can be equipped with a
coupler, which in one embodiment is a thermal transference coupler
(136). The thermal transference coupler (136) can include a
thermally conductive surface (402) configured to draw heat from a
major face (301) of another electronic device disposed within the
coupler that abuts the thermally conductive surface (402).
Inventors: |
Cavallaro; Alberto R.;
(Northbrook, IL) ; Bowers; Morris B.; (Grayslake,
IL) ; Pais; Martin R.; (North Barrington, IL)
; Sehmbey; Maninder S.; (Hoffman Estates, IL) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MOTOROLA MOBILITY LLC |
Libertyville |
IL |
US |
|
|
Assignee: |
MOTOROLA MOBILITY LLC
Libertyville
IL
|
Family ID: |
49668825 |
Appl. No.: |
13/742784 |
Filed: |
January 16, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61655252 |
Jun 4, 2012 |
|
|
|
Current U.S.
Class: |
165/121 ;
165/185 |
Current CPC
Class: |
G06F 1/203 20130101;
G06F 1/206 20130101; G06F 1/1632 20130101; H04M 1/72527 20130101;
H04B 1/3877 20130101; F28F 7/00 20130101 |
Class at
Publication: |
165/121 ;
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. An electronic device, comprising: an electronic device including
a thermal transference coupler comprising a thermally conductive
surface, the thermal transference coupler configured to: receive
another electronic device such that a major face of the another
electronic device abuts the thermally conductive surface; and draw
heat from the another electronic device to the thermally conductive
surface when the another electronic device is disposed within the
thermal transference coupler and is operable.
2. The electronic device of claim 1, the electronic device further
comprising an interface configured for data communication with a
control circuit of the another electronic device.
3. The electronic device of claim 2, wherein the interface is
wireless.
4. The electronic device of claim 1, wherein the electronic device
comprises a display module thermally coupled with the thermally
conductive surface, the display module being operable as a heat
sink for the thermally conductive surface.
5. The electronic device of claim 1, wherein the another electronic
device comprises: a printed circuit board; a battery; and a
display, wherein the printed circuit board is proximally disposed
with the major face.
6. The electronic device of claim 5, wherein the battery is
disposed between the printed circuit board and the display.
7. The electronic device of claim 5, wherein the display is
operable when the electronic device is disposed within the thermal
transference coupler to provide a secondary display function.
8. The electronic device of claim 5, wherein: the another
electronic device comprises one or more processors; and the
electronic device comprises an interface configured for data
communication with the another electronic device when disposed
within the thermal transference coupler.
9. An electronic device, comprising: an electronic device and an
another electronic device; and the electronic device including a
thermal transference coupler comprising a thermally conductive
surface, the thermal transference coupler configured to: receive
the another electronic device such that a major face of the another
electronic device abuts the thermally conductive surface; and draw
heat from the another electronic device to the thermally conductive
surface when the another electronic device is disposed within the
thermal transference coupler and is operable.
10. The electronic device of claim 9, wherein the another
electronic device comprises: a printed circuit board; a battery;
and a display, wherein the printed circuit board is proximally
disposed with the major face.
11. The electronic device of claim 10, wherein the battery is
disposed between the printed circuit board and the display.
12. The electronic device of claim 10, wherein the display is
operable when the electronic device is disposed within the thermal
transference coupler to provide a secondary display function.
13. The electronic device of claim 9, wherein the thermally
conductive surface is connected to a heat pipe.
14. The electronic device of claim 9, wherein the thermally
conductive surface is thermally connected to a heat pipe and a heat
spreader.
15. The electronic device of claim 9, wherein the thermal
transference coupler includes a blower.
16. The electronic device of claim 9, the electronic device
includes a controller, heat sensor and blower.
17. An electronic device, comprising: an electronic device; a
coupler configured to receive another electronic device; and an
interface configured for data communication with the another
electronic device when disposed within the coupler.
18. The electronic system of claim 9, wherein: the coupler
comprises a thermal transference coupler having a thermally
conductive surface; and a major face of the first electronic device
is configured to abut the thermally conductive surface and sink
heat from the first electronic device to the thermally conductive
surface when the first electronic device is disposed within the
thermal transference coupler.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] This invention relates generally to electronic devices, and
more particularly to augmented thermal management for electronic
devices.
[0003] 2. Background Art
[0004] Communication technology is constantly evolving. For
instance, there was a time when the only way to make a telephone
call was across a copper wire with the assistance of a human
operator. Today, by contrast, people are able to call others around
the world with a variety of communication devices, including
cellular telephones, satellite telephones, and network-based
communication systems such as voice over Internet protocol phone
devices that function with the assistance of a computer or other
specialized hardware. In addition to these voice-based channels,
people may communicate via electronic mail, text messaging,
videoconferences, and multimedia messaging as well.
[0005] With the advent of new communication protocols and
technologies, device manufacturers are continually designing more
features into their handsets. At the same time, consumers are
continually demanding smaller and sleeker devices. Additional
features require additional space within a device, larger energy
supplies, and more powerful processors and control circuits. The
desire for smaller devices demands the opposite--less space,
smaller energy supplies, and processors and control circuits
operating at reduced speed so as to produce less heat.
[0006] It would be advantageous to have methods, apparatuses, and
systems that enabled enhanced feature sets without excessively
increasing the overall size of the devices incorporating those
enhanced feature sets.
[0007] In recent years, demands are increasing for downsizing,
slimming, and enhancing performance of electronic devices such as
cellular phones. In response to such demands, high performance
integrated circuit (IC) chips have been installed in a variety of
electronic devices. At the same time, the power and heat generated
by these chips has significantly increased. Excessively hot
temperatures in electronic device can cause performance problems,
malfunctions, charging problems, circuit overloads, short
circuiting, and component failure, as well as heat burns and other
injuries to the user.
[0008] Computer and cellular (cell) phone processors generate more
heat from more powerful processors the longer the processors are
used and the more programs and applications (APs) are being used.
When cell phones are used for an extended period of time,
especially for process-heavy applications, they heat up more than
usual. The phone's battery heats up when the phone is in use for a
phone call, in navigating with a global positioning system (GPS),
or when used for video streaming, video viewing and/or recording.
Hot batteries have trouble charging.
[0009] A heat sink disperses heat from other parts, components, and
structures. Heat sinks are used in computers as well as cellular
(cell) phones. A radiator draws heat away from a car's engine,
while an internal heat sink draws heat away from a cell phone's
central processing unit (CPU). Internal heat sinks can effectively
cool some of the heat emitted from cell phone processors, such as
from processors that simultaneously run multiple programs. Without
a quality heat sink and heat transfer system, a cell phone
processor is at risk of overheating and its performance limited by
maximum allowable temperature limits.
[0010] Heat can be transferred in three different ways: convection,
radiation, and conduction. Conduction of heat is transferred in a
solid, such as in a heat sink. Conduction occurs when two objects
with different temperatures come into contact with one another. At
the point where the two objects meet, the faster moving molecules
of the warmer object crash into the slower moving molecules of the
cooler object. When this happens, the faster moving molecules from
the warmer object give energy to the slower moving molecules, which
in turn heats the cooler object. This process is known as thermal
conductivity, which is how internal heat sinks transfer heat away
from the cell phone processor.
[0011] The temperature of the surface of a portable electronic
device is a function of the temperature of the operational
components disposed within the portable electronic device. To
provide a satisfactory user experience, the surface temperatures of
portable electronic devices should be managed within a certain
temperature range, one example of which ensures that the surface of
a portable electronic device never exceeds about 38.degree. C. If
the surface temperature exceeds this predetermined threshold, the
performance of internal components may need to be throttled to stay
within certain parameters. The cause of mobile temperature rise is
the dissipation within the components in the mobile electronics
device. Moreover, in addition to surfaces, other components within
the device can also become heated by being located in proximity to
the heat generating components. Examples of these heat contact path
components include the battery and display.
[0012] The functional performance of portable electronic devices,
such as mobile computing devices, is limited by the amount of heat
that is dissipated due to operating temperature limits of their
internal components, such as the main battery, display, and other
parts and components of the mobile computing devices. A
particularly challenging environment is when a portable electronic
device is cradled in a car dock due to the extra heat load and
thermal radiation intensity from the sun and/or running a
navigation program.
[0013] Many conventional cell phones and other electronic devices
with high end applications processors (APs), modems, and multiple
power amplifiers (PAs) are generating more heat than the cell phone
or other electronic device can support by itself without going over
the specified surface temperature and component temperature limits.
There is a need to remote this heat to facilitate acceptable and
even better performance of cell phones, tablets and other
electronic devices.
[0014] It is, therefore, desirable to provide augmented thermal
management for electronic devices which overcomes most, if not all
of the preceding disadvantages.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying figures, where like reference numerals
refer to identical or functionally similar elements throughout the
separate views and which together with the detailed description
below are incorporated in and form part of the specification, serve
to further illustrate various embodiments and to explain various
principles and advantages all in accordance with the present
invention.
[0016] FIG. 1 illustrates one explanatory portable electronic
device configured in accordance with one or more embodiments of the
invention.
[0017] FIG. 2 illustrates one example of an operating schema for
one explanatory portable electronic device configured in accordance
with one or more embodiments of the invention, with this exemplary
operating schema illustrating a dual-operating system environment
that can require additional processing power in the portable
electronic device.
[0018] FIG. 3 illustrates a user connecting one explanatory
portable electronic device configured in accordance with one or
more embodiments of the invention to a peripheral device configured
in accordance with one or more embodiments of the invention.
[0019] FIG. 4 illustrates a user connecting one explanatory
portable electronic device configured in accordance with one or
more embodiments of the invention to a thermal transference coupler
of a peripheral device configured in accordance with one or more
embodiments of the invention.
[0020] FIG. 5 illustrates one explanatory portable electronic
device configured in accordance with one or more embodiments of the
invention coupled to a peripheral device configured in accordance
with one or more embodiments of the invention, with a camera of the
explanatory portable electronic device being exposed about an edge
of the peripheral device to provide video capture capabilities for
the peripheral device.
[0021] FIG. 6 illustrates one explanatory portable electronic
device configured in accordance with one or more embodiments of the
invention coupled to a thermal transference coupler of a peripheral
device configured in accordance with one or more embodiments of the
invention, with the portable electronic device being exposed about
an edge of the peripheral device.
[0022] FIG. 7 illustrates a top, plan, cutaway view showing
illustrative components of one explanatory portable electronic
device configured in accordance with one or more embodiments of the
invention seated in a thermal transference coupler of a peripheral
device configured in accordance with one or more embodiments of the
invention.
[0023] FIGS. 8-10 illustrate different explanatory locations where
an explanatory portable electronic device can couple to a thermal
transference coupler of a peripheral device in accordance with one
or more embodiments of the invention.
[0024] Skilled artisans will appreciate that elements in the
figures are illustrated for simplicity and clarity and have not
necessarily been drawn to scale. For example, the dimensions of
some of the elements in the figures may be exaggerated relative to
other elements to help to improve understanding of embodiments of
the present invention.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0025] Before describing in detail embodiments that are in
accordance with the present invention, it should be observed that
the embodiments reside primarily in combinations of method steps
and apparatus components related to thermal management practices
between a portable electronic device and another electronic device,
with those practices offering an enhanced overall feature set to a
user without requiring increased volume in the portable electronic
device. Any process descriptions or blocks in flow charts should be
understood as representing modules, segments, or portions of code
that include one or more executable instructions for implementing
specific logical functions or steps in the process. Alternate
implementations are included, and it will be clear that functions
may be executed out of order from that shown or discussed,
including substantially concurrently or in reverse order, depending
on the functionality involved. Accordingly, the apparatus
components and method steps have been represented where appropriate
by conventional symbols in the drawings, showing only those
specific details that are pertinent to understanding the
embodiments of the present invention so as not to obscure the
disclosure with details that will be readily apparent to those of
ordinary skill in the art having the benefit of the description
herein.
[0026] It will be appreciated that embodiments of the invention
described herein may be comprised of one or more conventional
processors and unique stored program instructions that control the
one or more processors to implement, in conjunction with certain
non-processor circuits, some, most, or all of the functions of
communication and radio frequency functions that occur between
electronic devices illustrated herein. The non-processor circuits
may include, but are not limited to, a radio receiver, a radio
transmitter, signal drivers, clock circuits, power source circuits,
and user input devices. As such, these functions may be interpreted
as steps of a method to perform feature and radio frequency
management activities between two or more devices. Alternatively,
some or all functions could be implemented by a state machine that
has no stored program instructions, or in one or more application
specific integrated circuits (ASICs), in which each function or
some combinations of certain of the functions are implemented as
custom logic. Of course, a combination of the two approaches could
be used. Thus, methods and means for these functions have been
described herein. Further, it is expected that one of ordinary
skill, notwithstanding possibly significant effort and many design
choices motivated by, for example, available time, current
technology, and economic considerations, when guided by the
concepts and principles disclosed herein will be readily capable of
generating such software instructions and programs and ICs with
minimal experimentation.
[0027] Embodiments of the invention are now described in detail.
Referring to the drawings, like numbers indicate like parts
throughout the views. As used in the description herein and
throughout the claims, the following terms take the meanings
explicitly associated herein, unless the context clearly dictates
otherwise: the meaning of "a," "an," and "the" includes plural
reference, the meaning of "in" includes "in" and "on." Relational
terms such as first and second, top and bottom, and the like may be
used solely to distinguish one entity or action from another entity
or action without necessarily requiring or implying any actual such
relationship or order between such entities or actions. Also,
reference designators shown herein in parenthesis indicate
components shown in a figure other than the one in discussion. For
example, talking about a device (10) while discussing figure A
would refer to an element, 10, shown in figure other than figure
A.
[0028] Embodiments of the present invention provide methods,
apparatuses, and systems for thermal and feature/performance
management between devices when those devices are coupled together.
For example, in one embodiment, an electronic device is configured
as a "peripheral" device for a portable electronic device. When the
two devices are coupled together, the portable electronic device
provides primary computational functionality for the system. This
allows less functionality to be integrated into the peripheral
device, thereby saving cost. The portable electronic device can
operate in a first mode when alone. However, when operating in
tandem with the peripheral device, additional features and
functionality is possible without making the portable electronic
device any larger due to the thermal management functionality
offered by embodiments of the present invention. In addition to
"dual operating environment" applications, which will be explained
in more detail below, embodiments of the present invention can be
used for any type of system where multiple electronic devices are
coupled together to provide a common system application.
[0029] In one embodiment, an electronic device is configured as a
peripheral device for a portable electronic device. The peripheral
device is configured with a thermal transference coupler configured
to receive the portable electronic device. In one embodiment, the
thermal transference coupler is a uniquely configured mechanical
interface adapted to conduct and transfer heat from the portable
electronic device the thermal transference coupler is configured to
receive. In one embodiment, the thermal transference coupler
includes one or more thermally conductive surfaces that are
configured to physically abut one or more surfaces of the portable
electronic device. In one embodiment, the thermally conductive
surface is configured to abut at least a major face of the portable
electronic device and to draw heat from the portable electronic
device to the thermally conductive surface when the portable
electronic device is disposed within the thermal transference
coupler and is operable (i.e., generating heat). The thermal
transference coupler thus provides thermal management for the
portable electronic device when disposed within the thermal
transference coupler.
[0030] As should be noted, there are a multitude of applications or
use cases that can include two electronic devices being coupled
together to form a system. Any of this multitude of applications is
well suited to take advantage of the thermal management offered by
the thermal transference coupler, as detailed herein. However, to
better illustrate synergistic harmonies that can arise from use of
embodiments of the invention, a particular schema will be used for
explanatory purposes only. Specifically, in one explanatory
embodiment, a portable electronic device configured in accordance
with one or more embodiments of the invention includes one or more
processors disposed within the device are configured for operation
in a "dual-operating system hybrid environment." A first operating
system environment is active during normal operation, such as when
the portable device is being operated in a stand-alone mode in a
user's hand. However, in certain other use cases, such as when the
device is coupled to a peripheral hardware component having a
dual-operating system hybrid environment license, the portable
electronic device can enter a second operating system environment
having enhanced performance capabilities.
[0031] In one embodiment used for illustration purposes, the
dual-operating system hybrid environment is referred to as a
"WebTop" environment, in that the portable electronic device has
access to two simultaneous operating system environments. The first
operating system environment is a standard mobile operating
environment, where the portable electronic device is configured to
interact with a wide area network using standard wide area network
data rates and usage modes. The second operating system environment
gives rise to an enhanced feature set, which can include an
enhanced, full, multi-window desktop environment where the device
can access a desktop class web browser and web applications similar
to those normally found only on a personal computer.
[0032] In this second mode of operation, the portable electronic
device can optionally also run the first operating system
environment, and accordingly present one or more dedicated windows
that display the content and results of operational steps in the
first environment. These windows can be referred to as the "Mobile
View" of the WebTop. A user can start, stop, or interact with the
first environment applications inside a Mobile View window. The
dual-operating system hybrid environment enables the user to access
a full desktop computer web browsing experience with a mobile
device, e.g., viewing the full desktop versions of Internet
websites that include Adobe Flash.TM. based websites through the
portable electronic device's built-in web browser and web
application framework. When entering the second operating system
environment, the power requirements of the one or more processors
can increase rapidly. The thermal transference coupler can remove
heat from the portable electronic device, which allows the
processors within the portable electronic device to operate at
higher speeds.
[0033] By nature of their design, WebTop applications operating in
the second operating system environment download orders of
magnitude more data than do the mobile applications operating in
the first operating system environment. Accordingly, such WebTop
applications require an enhanced data usage rate, which requires
the circuit components disposed within the portable electronic
device to consume far more power and, therefore, generate far more
heat. Since a connection to the peripheral device is required in
some embodiments for the portable electronic device to enter the
WebTop mode, connector systems configured in accordance with one or
more embodiments of the invention advantageously allow heat to be
drawn from the portable electronic device through the connector
system to the docking station. This allows the portable electronic
device to deliver high-performance, WebTop applications without the
need of integrating a fan or active cooling system into the
portable electronic device.
[0034] In one embodiment, the temperature of the surface of a
portable electronic device is a function of the heat load within
and temperature of the operational components disposed within the
portable electronic device. To provide a satisfactory user
experience, the surface temperatures of the portable electronic
devices should be managed within a certain temperature range. For
example, in a preferred embodiment, the surface of a portable
electronic device operates in a range of about 40 degrees
centigrade or less. If the surface temperature exceeds this
predetermined threshold, the performance of internal components may
need to be throttled to stay within certain envelopes. The cause of
mobile temperature rise is the dissipation within the components in
the mobile. Moreover, in addition to surfaces, other components
within the device can also become heated by being proximately
located with the heat generating components. Examples of these
"heat contact path" components include the housing, battery and
display.
[0035] Embodiments detailed herein can leverage uniquely configured
internal structures and connector systems, to provide enhanced
thermal isolation and dissipation management, thereby offering
enhanced performance of the system. For example, in one embodiment,
the portable electronic device is configured to dissipate heat
along its shortest axis by providing a conduction path configured
to remove heat generation from a printed circuit board to an
external major face of the portable electronic device. This is
achieved in one embodiment by disposing a battery between the
printed circuit board and the display of the portable electronic
device. While prior art designs sandwich the heat-laden printed
circuit board between the display and battery, in one embodiment
the present invention instead sandwiches the battery between the
printed circuit board and the display. This allows the heat
generating components to be disposed near the major face that will
abut the thermally conductive surface of the thermal transference
coupler, thus providing a path for heat to be dissipated out of the
portable electronic device.
[0036] Other feature enhancements are possible using embodiments of
the invention as well. As noted above, in a basic embodiment a
system employing embodiments of the invention includes a thermal
transference coupler, disposed in a peripheral device, and that is
configured to receive heat from a portable electronic device. The
system can also include communication and temperature measurement
capability between the peripheral device and the portable
electronic device. The temperature monitoring capability then
allows the portable electronic device to avail itself of one or
more sensors disposed within itself and the peripheral device. The
use of the temperature information allows optimization of
performance of one or more of the features being run. An
auto-detection feature can be incorporated into the
connectorization methodology so that it can detect when the
portable electronic device is inserted or connected to the
peripheral device and accordingly, adjust up or down the
performance of the feature capability.
[0037] As detailed herein, enhanced thermal management is
beneficial when a portable electronic device increases its power
consumption when working in a WebTop mode, streaming video and the
like. Using this as an explanatory example to illustrate
embodiments of the present invention, and turning now to FIG. 1,
illustrated therein is one embodiment of an explanatory portable
electronic device 100 configured in accordance with one or more
embodiments of the invention. The illustrative portable electronic
device 100 of FIG. 1 is configured for communication with a wide
area network 104. The illustrative portable electronic device 100
of FIG. 1 is shown as a "smart phone" for illustration purposes.
However, it will be obvious to those of ordinary skill in the art
having the benefit of this disclosure that other portable
electronic devices may be substituted for the explanatory smart
phone of FIG. 1. For example, the portable electronic device 100
may be configured as a palm-top computer, a tablet computer, a
gaming device, a media player, or other device.
[0038] The illustrative portable electronic device 100 may include
standard components such a user interface 107 and associated
modules. The user interface 107 can include various combinations of
a display, a keypad, voice control modules, and/or touch sensitive
interfaces. The portable electronic device 100 includes a
radio-frequency transceiver 110. The radio-frequency transceiver
110 is configured for communication with one or more networks
104,103,120, and can include wireless communication circuitry, one
of a receiver, a transmitter, or transceiver, and an antenna
112.
[0039] The radio-frequency transceiver 110 can be configured for
data communication with at least one wide area network 104. For
illustration, the wide area network 104 of FIG. 1 is shown as a
cellular network being operated by a service provider 121. Examples
of cellular networks include GSM, CDMA, W-CDMA, CDMA-2000, iDEN,
TDMA, and other networks. It should be understood that the
radio-frequency transceiver 110 could be configured to communicate
with multiple wide area networks as well, with one being shown in
FIG. 1 for simplicity.
[0040] The portable electronic device 100 can optionally be
configured to communicate with a local area network 103, such as
the WiFi network being supported by a local area network router
113. Local area networks can be connected through communication
nodes, e.g., local area network router 113, to other networks, such
as the Internet, which is represented by network 120 in FIG. 1. For
example, the local area network 103 can provide data communication
through a non-IP Multimedia Subsystem (non-IMS) channel.
[0041] The portable electronic device 100 includes one or more
processors 102, which are responsible for performing the functions
of the device. The one or more processors 102 can be a
microprocessor, a group of processing components, one or more
Application Specific Integrated Circuits (ASICs), programmable
logic, or other type of processing device. The one or more
processors 102 are operable with the user interface 107 and the
radio-frequency transceiver 110, as well as various peripheral
ports 105 that can be coupled to peripheral hardware devices 106
via interface connections for communication with those peripheral
hardware devices 106. The one or more processors 102 process and
execute executable software code to perform the various functions
of the portable electronic device 100.
[0042] A storage device 109, such as a memory module, stores the
executable software code used by the one or more processors 102 for
device operation. The storage device 109 may also store
identification information suitable for identifying the portable
electronic device 100 or its user to the service provider 121. In
one embodiment, the identification information includes information
identifying the user and the type of subscription held by the user
for wireless communication services.
[0043] The one or more processors 102, in one embodiment, can be
configured to host a dual-operating system hybrid environment 111.
A first operating system environment 114 can be configured for
normal data rate communication 115 with the wide area network 104.
This "normal" data rate communication 115 is referred to as "Mobile
Communication" and can be used for voice calls, mobile device web
browsing, text and multimedia messages, and so forth. Typical
normal data rate communication 115 occurs with data being exchanged
below one megabit per second.
[0044] The second operating system environment 116 is operable to
communicate with the wide area network 104 using enhanced data rate
communication 117. One example of the second operating system
environment 116 is the WebTop environment discussed above, in which
enhanced, full, multi-window desktop environments can be used,
where the portable electronic device 100 can access a desktop class
web browser and web applications, which are similar to those
normally found only on a personal computer. "Enhanced" data rates
can vary by service provider and technology. In general terms, a
particular service provider will offer both a normal throughput in
bits per second and a maximum allowed data limit in total bits
downloaded and/or uploaded per month. For discussion purposes, one
example of an enhanced data rate communication 117 include
communication occurring at data rates in excess of one megabit per
second, such as the enhanced fourth generation enhanced data
transmission speeds that are in excess of two megabits per second.
It will be clear to those of ordinary skill in the art that the
enhanced data rate can change as technology is developed or across
service providers.
[0045] When using an enhanced data rate, the one or more processors
102 can draw more power due to the need to process more data.
Drawing more power generates more heat. To provide thermal
management for this enhanced performance, in one embodiment a
peripheral electronic device 106 can be configured with a thermal
transference coupler 136. The thermal transference coupler 136 is
configured to receive the portable electronic device 100 so that
the portable electronic device 100 and the peripheral electronic
device 106 can be connected together.
[0046] The thermal transference coupler 136, in one embodiment,
includes a thermally conductive surface 135. The thermal
transference coupler 136 can be configured to receive the portable
electronic device 100 such that a major face 134 of the portable
electronic device 100 abuts the thermally conductive surface 135.
When the portable electronic device 100 is inserted into the
thermal transference coupler 136, the thermally conductive surface
135 is configured to draw heat from the portable electronic device
100 to the thermally conductive surface 135 when the portable
electronic device 100 is operable. For example, when operating in
the second operating system environment 116, which generates more
heat, the major face 134 of the portable electronic device 100,
which is abutted against the thermally conductive surface 135, can
deliver heat to the thermal transference coupler 136. The thermal
transference coupler 136 thus acts as a heat sink for the portable
electronic device 100.
[0047] In one embodiment, the thermal conductive surface 135 is an
internal thermal coupler in the electronic device 100, and
comprises at least one of: a copper coupler, copper alloy coupler,
aluminum coupler, aluminum alloy coupler, carbon based coupler,
carbon fiber coupler, metal coupler, coupler with a thermally
conductive surface, coupler with at least one thermally conductive
coating thereon, thermal conductor, graphite film coupler, ribbon
coupler, sheet coupler, solid coupler, tubular coupler, heat
conductive coupler, or combinations of the preceding internal
thermal couplers.
[0048] In one embodiment, the thermal transference coupler 136 can
include a radio-frequency interface 108 that couples to a
radio-frequency port 133 of the portable electronic device 100. The
radio-frequency interface 108 can include a radio-frequency port
137 that is complementary to the radio-frequency port 133 of the
portable electronic device 100, such that the radio-frequency port
133 can couple to the complementary radio-frequency port 137 at a
connection point.
[0049] In one or more embodiments, the thermally conductive surface
135 can be manufactured with a material having a high thermal
conductivity. Examples of such materials include copper, aluminum,
and alloys thereof, as well as carbon-based materials. In other
embodiments, thermally conducting plastics can be used as the
thermally conductive surface 135. The thermally conductive surface
135 can have one or more coatings disposed thereon as well. In one
embodiment, a thermal conduit 602, such as a heat pipe, as shown in
FIG. 6, can be attached to the thermally conductive surface 135 of
the thermal transference coupler 136. This thermal conduit 602 may
be coupled to various heat sinking devices (not shown in FIG. 1) in
the peripheral electronic device 106. Examples of thermal conduit
include heat pipes, thermal conductors, thermally conductive
graphite films, fibers, or ribbons. Multiple thermal conductors can
also be used. In another embodiment, the thermal conduit comprises
thermal conductors made from sheets, ribbons, or films of copper or
aluminum or alloys thereof. Other thermal transfer devices
configured to transfer heat from one location to another will be
obvious to those of ordinary skill in the art having the benefit of
this disclosure.
[0050] In one or more embodiments, the portable electronic device
100 can also include an interface 131 configured for data
communication with a control circuit 132 the peripheral electronic
device 106. This interface 131 can be a direct electrical
connection with the peripheral electronic device 106, such as via a
connector comprising electronic contacts that is configured to
connect to an electrical connector 130 of the portable electronic
device 100 comprising electrical contacts. Data and power can be
drawn through the electrical contacts so that the portable
electronic device 100 can optionally communicate with and/or be
powered by a peripheral electronic device 106. Alternatively, this
interface 131 can be a wireless communication channel, such as via
Bluetooth or other near-field wireless protocol.
[0051] In one or more embodiments, when the second operating system
environment 116 is launched, for a user to use enhanced data rate
communication 117, an authentication check is performed to ensure
that the subscription plan associated with the user permits
enhanced data rate communication 117. To perform the
authentication, in one embodiment the one or more processors 102
initially confirm that data communication is possible between the
radio-frequency transceiver 110 and the wide area network 104. This
will generally be the case when the portable electronic device 100
is within range of the wide area network 104, e.g., is within the
communication radius of a tower 118 of the wide area network 104,
and where the radio-frequency transceiver 110 is active. Data
communication would not be possible in cases where, for example,
the portable electronic device was OFF, or where the portable
electronic device 100 had been placed in a "airplane mode" or other
mode that disables the wide area communication capabilities of the
radio-frequency transceiver 110.
[0052] The one or more processors 102 then initiate the
dual-operating system hybrid environment 111 by making the first
operating system environment 114 and the second operating system
environment 116 simultaneously operative. In many applications, the
first operating system environment 114 will be continually active,
while the second operating system environment 116 is selectively
activated. For example, in one embodiment the second operating
system environment 116 is activated when a peripheral electronic
device 106 that includes a dual-operating system license key 119 is
coupled to an interface connection in communication with the one or
more processors 102. Examples of peripheral hardware devices 106
include external displays, docking stations, peripheral connectors,
and so forth, some of which will be shown below.
[0053] Turning to FIG. 2, a user 200 is holding the portable
electronic device 100 of FIG. 1. The portable electronic device is
operating in the first operating system environment (114). Since
the portable electronic device 100 must remain relatively cool so
as to be capable of being held, the operation of the internal
components is generally thermally limited while operating in this
first operating system environment (114). In this illustrative
example, the first operating system environment (114) is a smart
cellular telephone mode. The first operating system environment
(114) has associated therewith various applications capable of
operating at normal data rate communication (115). Examples of such
applications include a cellular telephone application 201, a mobile
web browser application 202, and a mail application 203, each being
configured for operation at data rates under 1.5 megabits per
second. Other applications can include an Internet shopping
application 204, a camera application 205, an Internet search
application 206, and a social media application 207. These
applications are illustrative only, as others will be obvious to
one of ordinary skill in the art having the benefit of this
disclosure. Each of the applications has a common element, however,
in that it is operable at reduced performance or speed, be it data
rates or graphics or response, for example.
[0054] Turning now to FIGS. 3 and 4, illustrated therein is the
user 200 inserting the portable electronic device 100 into a
thermal transference coupler 136 of a peripheral electronic device
106 in accordance with one or more embodiments of the invention.
The peripheral electronic device 106 is shown in perspective view
in FIG. 3, and in rear elevation view in FIG. 4. In this
illustrative embodiment, the portable electronic device 100
includes a display 401 that defines a first major face disposed
opposite a second major face 301 of the portable electronic device
100. When inserted into the thermal transference coupler 136, the
second major face 301 is configured to abut the thermally
conductive surface 402, which is shown in FIG. 4. As also shown in
FIG. 4, the thermal transference coupler 136 can comprise the
radio-frequency interface 108, which is formed in this illustrative
embodiment by providing the complementary radio-frequency port 137
that is configured to couple to a radio-frequency port (133) of the
portable electronic device 100. The interface 331 configured for
data communication between a control circuit of the peripheral
electronic device 106 and the one or more processors (102) of the
portable electronic device 100 is also shown in FIG. 4. The
interface 331 is shown for illustration purposes as a physical
connector. However, as noted above, the interface 331 could be
wireless. In this illustrative embodiment, the interface 331 is
disposed within the thermal transference coupler 136. However, the
connection could be disposed in other locations with cables or
pigtails routing the appropriate connector to its respective
port.
[0055] As shown in FIG. 3, the peripheral electronic device 106 is
shown as a "lap dock," which is a device having a primary display
302, a keyboard 303, and a cursor manipulation device 304. The lap
dock can be configured with minimal electronic circuitry, because
the one or more processors (102) of the portable electronic device
100 can be used as the central processing unit of the overall
system. This allows the lap dock to be less expensive. In one
embodiment, the peripheral electronic device 106 can include a
dual-operating system license key (119) stored in an on-board
memory device. The one or more processors (102) of the portable
electronic device 100 can be configured to retrieve the
dual-operating system license key (119) and then launch the second
operating system environment (116). Accordingly, when inserted into
the thermal transference coupler 136, the portable electronic
device 100 can be configured to enter the second operating system
environment (116) to provide the user with a world-class desktop
user experience.
[0056] Where this is the case, coupling the portable electronic
device 100 to the peripheral electronic device 106 will cause
additional heat to be generated within the portable electronic
device 100, as the portable electronic device 100 will enter an
enhanced performance mode. Said differently, launching the second
operating system environment (116) causes the power drawn by the
one or more processors (102) to significantly increase, which in
turn generates more heat. Embodiments detailed herein are adapted
to draw this additional heat through the thermally conductive
surface 402 so that it can be dissipated by the peripheral
electronic device 106.
[0057] In one embodiment, the display 401 of the portable
electronic device 100 can be visible when the portable electronic
device 100 is seated within the thermal transference coupler 136.
In such a configuration, the display 401 can be activated to
provide a secondary display for the overall system. Said
differently, when the portable electronic device 100 is seated
within the thermal transference coupler, the display 401 of the
portable electronic device 100 can be activated to provide a
secondary display function for the system formed by the portable
electronic device 100 and peripheral electronic device 106 working
in tandem.
[0058] As shown in FIGS. 5 and 6, in one embodiment, the thermal
transference coupler 136 can be configured such that when the
portable electronic device 100 is inserted therein, a portion 501
of the portable electronic device 100 is exposed about an edge 502
of the peripheral electronic device 106. In this illustrative
embodiment, the portable electronic device 100 includes a camera
503. The camera 503 is disposed on the major face 301 that abuts
the thermally conductive surface (402) of the thermal transference
coupler 136. As shown in FIG. 5, the camera 503 is disposed on the
portion 501 of the portable electronic device 100 that is exposed
about the edge 502 of the peripheral electronic device 106.
Accordingly, the camera 503 can be used as an image capture device
for the system. The camera 503 can capture video images and deliver
them to the display 302 of the peripheral device through the
interface (131). This enables the system to work as a video
conferencing unit without the need of incorporating a camera into
the peripheral electronic device 106. Where the portable electronic
device 100 includes a microphone and/or speaker 504, this can be
disposed along the portion 501 of the major face 301 that is
exposed about the edge 502 as well. For example, when the
peripheral electronic device 106 includes a control circuit 505,
the one or more processors (102) of the portable electronic device
100 can be configured to communicate with the control circuit 505
via the interface (131). The one or more processors (102) can
accordingly be configured to deliver video captured by the camera
503 to the control circuit 505 via the interface (131) for
presentation on the display 302. Optionally, the one or more
processors (102) can also deliver the video to the radio-frequency
interface (108) of the peripheral electronic device 106 for
transmission to a network through one or more antennas (138)
disposed within the peripheral electronic device 106. In FIG. 6,
the thermal conductive surface 135 is shown, and the coupler 136
securely holds a portion 501 of the portable electronic device 100
to the peripheral electronic device 106. In one embodiment, a
thermal conduit 602 is thermally connected to the thermal
conductive surface 135 and thermally connected to a spreader 604.
The thermal conduit may be vertical and the spreader may be
horizontal, as shown in FIG. 6. This construction, can be varied,
as should be understood.
[0059] As shown in FIG. 6, heat is drawn and dissipated downwardly
and outwardly as shown by arrows "H". This can provide enhanced
heat dissipation from the electronic device 100 to the thermal
conduit 602 and spreader 604, in a passive arrangement. In an
active embodiment, a blower 608 can provide cooling and heat
dissipation (upper arrows, shown as "C" pointing to the left In
FIG. 6), when appropriate. In one embodiment, the blower 608 is
located adjacent to the portable electronic device 100 in the
coupler 136 shown as compartment 610.
[0060] In one embodiment, the spreader 604 is a thermal spreader
and can include at least one of: a thermally conductive graphite
film; copper; aluminum; and a high conductivity metal or alloy. The
spreader 604 is shown being horizontally orientated. As should be
understood, the spreader can be aligned vertically, horizontally or
in an angled fashion, based on space considerations and design
requirements.
[0061] Turning now to FIG. 7, illustrated therein is a sectional,
plan view of the portable electronic device 100 seated within the
thermal transference coupler 136 of the peripheral electronic
device 106. FIG. 7 illustrates one configuration of internal
components of each device that assists in facilitating thermal
transfer along a minor axis 701 of the portable electronic device
100.
[0062] While prior art devices sandwich the printed circuit board
of a portable electronic device between a battery and display, an
embodiment employs a unique configuration to optimize heat transfer
along the minor axis 701. As shown in FIG. 7, this illustrative
portable electronic device 100 includes a printed circuit board
702, a battery 703, and a display 704. Rather than sandwiching the
printed circuit board 702 between the battery 703 and the display
704 as in prior art designs, this embodiment proximally disposes
the printed circuit board 702 with the major face 301 of the
portable electronic device 100. Accordingly, the battery 703 is
disposed between the printed circuit board 702 and the display 704.
As the one or more processors (102) and other heat generating
components are disposed along the printed circuit board 702, this
configuration helps to ensure that these heat generating components
are disposed relatively adjacent to the major face 301, which
allows heat generated therefrom to be transferred to the thermally
conductive surface 402 of the thermal transference coupler 136.
[0063] In this illustrative embodiment, the peripheral electronic
device 106 also comprises a display 302 as noted above with
reference to FIG. 3. In some embodiments, the display 302 of the
peripheral electronic device 106 may be sensitive to heat. In such
an embodiment, the display 302 may be insulated from the thermal
transference coupler 136 to prevent excessive amounts of heat from
interfering with the display's performance. In such embodiments,
the rear surface 705 of the peripheral electronic device 106 can be
configured as a heat sink in thermally conductive contact with the
thermal transference coupler 136. Accordingly, heat can be "wicked"
away from the thermal transference coupler 136 and dissipated into
the air by the rear surface 705.
[0064] However, in other embodiments, the display 704 may not be
thermally sensitive. In fact, many devices used as the display 704
can be used to provide heat-sinking capabilities for the thermal
transference coupler 136. Accordingly, in one or more embodiments,
the display 704 or a corresponding display module can be thermally
coupled with the thermally conductive surface 402. In such an
embodiment, the display 704 or display module can be operable as a
heat sink for the thermally conductive surface 402 of the thermal
transference coupler 136.
[0065] Also shown in FIG. 7, are temperature sensors 710 and 712 on
peripheral electronic device 106 and temperature sensor 714 on
electronic device 100. These sensors can be utilized to monitor
and/or provide information to a controller, to actively control
heat dissipation, by for example, use of a blower. Also magnets 716
can be used for enhanced and secure holding of the electronic
device 100 to the peripheral electronic device 106.
[0066] Turning now to FIGS. 8-10, illustrated therein are a few
examples of locations for the thermal transference coupler 136
along a rear surface 705 of a peripheral electronic device 106. It
will be clear to those of ordinary skill in the art having the
benefit of this disclosure that these locations are merely
illustrative of any number of locations that will be readily
apparent to those of ordinary skill in the art having the benefit
of this disclosure.
[0067] The location shown in FIG. 8 is similar to that of FIG. 6
but with the portable electronic device 100 being oriented in a
portrait orientation rather than landscape. Such an orientation can
be useful when the portable electronic device 100 has communication
antennas disposed at its end 801. Allowing the end 801 of the
portable electronic device 100 to extend beyond the edge 502 of the
peripheral electronic device 106 reduces loading on the
antennas.
[0068] FIG. 9 illustrates the portable electronic device 100
extends beyond a side edge 902 of the peripheral electronic device
106. This configuration can be useful where the portable electronic
device 100 includes antennas, camera devices, microphones, or
speakers disposed along a side edge 901 of the portable electronic
device 100.
[0069] FIG. 10 illustrates the portable electronic device 100 being
located along a central portion of the rear side 701 of the
peripheral electronic device. While any of the embodiments of FIGS.
8-10 could cause loading of antennas disposed within the portable
electronic device 100, the embodiment of FIG. 10 can be
particularly loading due to the fact that the rear side 701 of the
peripheral electronic device 106 extends across the major face
(301) of the portable electronic device 100 and in all directions
therefrom. This means that the ground plane of any printed circuit
board disposed within the peripheral electronic device 106 can load
the antennas disposed within the portable electronic device
100.
[0070] As described above, an electronic device can include thermal
transference coupler. The thermal transference coupler can include
a thermally conductive surface. The thermal transference coupler
can be configured to receive another electronic device, like a
portable electronic device, such that a major face of the
electronic device abuts the thermally conductive surface. The
thermally conductive surface will then draw heat from the
electronic device to the thermally conductive surface when the
electronic device is disposed within the thermal transference
coupler and is operable.
[0071] In one embodiment, the electronic device disposed within the
thermal transference coupler can be uniquely configured to
facilitate more optimal thermal transfer along a minor axis.
Specifically, the electronic device can include a printed circuit
board, a battery, and a display. The printed circuit board can be
disposed adjacent to the major face of the device, while the
battery is disposed between the printed circuit board and the
display.
[0072] In the foregoing specification, specific embodiments of the
present invention have been described. However, one of ordinary
skill in the art appreciates that various modifications and changes
can be made without departing from the scope of the present
invention as set forth in the claims below. Thus, while preferred
embodiments of the invention have been illustrated and described,
it is clear that the invention is not so limited. Numerous
modifications, changes, variations, substitutions, and equivalents
will occur to those skilled in the art without departing from the
spirit and scope of the present invention as defined by the
following claims. Accordingly, the specification and figures are to
be regarded in an illustrative rather than a restrictive sense, and
all such modifications are intended to be included within the scope
of present invention. The benefits, advantages, solutions to
problems, and any element(s) that may cause any benefit, advantage,
or solution to occur or become more pronounced are not to be
construed as a critical, required, or essential features or
elements of any or all the claims.
* * * * *