U.S. patent application number 13/473611 was filed with the patent office on 2013-11-21 for thermal module structure.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. The applicant listed for this patent is Chih-Peng Chen. Invention is credited to Chih-Peng Chen.
Application Number | 20130306277 13/473611 |
Document ID | / |
Family ID | 49580336 |
Filed Date | 2013-11-21 |
United States Patent
Application |
20130306277 |
Kind Code |
A1 |
Chen; Chih-Peng |
November 21, 2013 |
THERMAL MODULE STRUCTURE
Abstract
A thermal module structure includes a main body and at least one
heat pipe. The main body has a base section and an extension
section. Multiple radiating fins extend from a circumference of the
extension section. The heat pipe is assembled with the main body.
The heat pipe has a heat absorption end and a heat dissipation end.
The thermal module structure has lower thermal resistance so that
the heat dissipation effect of the thermal module structure is
greatly enhanced. Moreover, the manufacturing cost of the thermal
module structure is lowered and the manufacturing time of the
thermal module structure is shortened.
Inventors: |
Chen; Chih-Peng; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chen; Chih-Peng |
New Taipei City |
|
TW |
|
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
New Taipei City
TW
|
Family ID: |
49580336 |
Appl. No.: |
13/473611 |
Filed: |
May 17, 2012 |
Current U.S.
Class: |
165/104.26 ;
165/121 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; F28D 15/0275 20130101; H01L 23/427
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101; F28F 1/12
20130101 |
Class at
Publication: |
165/104.26 ;
165/121 |
International
Class: |
F28D 15/04 20060101
F28D015/04; F28F 13/00 20060101 F28F013/00 |
Claims
1. A thermal module structure comprising: a main body having a base
section and an extension section extending from a middle portion of
one side of the base section, multiple radiating fins extending
from a circumference of the extension section; and at least one
heat pipe assembled with the main body, the heat pipe having a heat
absorption end and a heat dissipation end, the heat absorption end
being assembled with the other side of the base section opposite to
the extension section, the heat dissipation end being attached to
one side of the extension section.
2. The thermal module structure as claimed in claim 1, wherein
multiple extension limbs further outward extend from the
circumference of the extension section, each extension limb having
a free end formed with at least one locating hole.
3. The thermal module structure as claimed in claim 1, wherein the
other side of the base section has at least one groove formed in a
position where the heat pipe is positioned, the heat absorption end
of the heat pipe being assembled in the groove.
4. The thermal module structure as claimed in claim 1, wherein the
main body is integrally formed by means of mechanical
processing.
5. The thermal module structure as claimed in claim 4, wherein the
mechanical processing is aluminum extrusion.
6. The thermal module structure as claimed in claim 1, wherein the
main body has a first side, a fan being disposed on the first side
of the main body.
7. The thermal module structure as claimed in claim 1, wherein the
main body has a second side on which the heat dissipation end of
the heat pipe is positioned, a fan being disposed on the second
side of the main body.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to an improved
thermal module structure, and more particularly to a thermal module
structure having lower thermal resistance and able to provide much
better heat dissipation effect. Moreover, the manufacturing cost of
the thermal module structure is lowered and the manufacturing time
of the thermal module structure is shortened.
[0003] 2. Description of the Related Art
[0004] Following the continuous advance of sciences and
technologies, the sizes of electronic products have become smaller
and smaller, while the power consumption and the heat generated by
the electronic products have become greater and greater. In order
to keep the electronic components stably operating, the heat must
be dissipated at high efficiency.
[0005] Please refer to FIGS. 1A and 1B. FIG. 1A is a perspective
exploded view of a conventional thermal module 1. FIG. 1B is a
perspective assembled view of the conventional thermal module 1.
The conventional thermal module 1 includes a base seat 10, a heat
dissipation unit 11 and at least one heat pipe 12. The heat
dissipation unit 11 is composed of multiple radiating fins 111
overlapping one another. The heat pipe 12 passes through the heat
dissipation unit 11 and is connected therewith to form the thermal
module 1. In general, the radiating fins 111 are connected to the
base seat 10 and the heat pipe 12 with solder paste by means of
soldering. Such soldering process takes much time and leads to
increase of manufacturing cost.
[0006] Moreover, the bottom face of the base seat 10 of the
conventional thermal module 1 is directly attached to and in
contact with a heat source 13. Accordingly, the heat generated by
the heat source must first go through the base seat 10 and then to
the radiating fins 111 to dissipate. According to such arrangement,
the heat cannot be quickly transferred to outer side of the thermal
module in the first time. Moreover, the thermal resistance is
increased. This will slow down the heat dissipation.
[0007] According to the above, the conventional thermal module has
the following shortcomings:
1. The manufacturing cost is increased. 2. It takes much time to
manufacture the thermal module. 3. The heat dissipation is slowed
down.
SUMMARY OF THE INVENTION
[0008] A primary object of the present invention is to provide an
improved thermal module structure, which has lower thermal
resistance and is able to provide much better heat dissipation
effect.
[0009] A further object of the present invention is to provide the
above thermal module structure. The manufacturing cost of the
thermal module structure is lowered and the manufacturing time of
the thermal module structure is shortened.
[0010] To achieve the above and other objects, the thermal module
structure of the present invention includes a main body and at
least one heat pipe. The main body has a base section and an
extension section extending from a middle portion of one side of
the base section. Multiple radiating fins extend from a
circumference of the extension section. The heat pipe is assembled
with the main body. The heat pipe has a heat absorption end and a
heat dissipation end. The heat absorption end is assembled with the
other side of the base section opposite to the extension section.
The heat dissipation end is attached to one side of the extension
section.
[0011] The side of the base section with the heat absorption end of
the heat pipe is attached to a heat source. The heat absorption end
of the heat pipe serves to directly absorb the heat generated by
the heat source and transfer the heat to the heat dissipation end
attached to the side of the extension section. Then the heat is
dissipated from the radiating fins of the extension section.
Accordingly, the heat can be quickly dissipated. The main body is
integrally formed so that the manufacturing cost of the thermal
module structure is greatly lowered and the manufacturing process
of the thermal module structure is simplified.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein:
[0013] FIG. 1A is a perspective exploded view of a conventional
thermal module;
[0014] FIG. 1B is a perspective assembled view of the conventional
thermal module;
[0015] FIG. 2A is a perspective exploded view of a first embodiment
of the thermal module structure of the present invention;
[0016] FIG. 2B is a perspective assembled view of the first
embodiment of the thermal module structure of the present
invention;
[0017] FIG. 3A is a perspective exploded view of a second
embodiment of the thermal module structure of the present
invention;
[0018] FIG. 3B is a perspective assembled view of the second
embodiment of the thermal module structure of the present
invention;
[0019] FIG. 4A is a perspective exploded view of a third embodiment
of the thermal module structure of the present invention; and
[0020] FIG. 4B is a perspective assembled view of the third
embodiment of the thermal module structure of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] Please refer to FIGS. 2A and 2B. FIG. 2A is a perspective
exploded view of a first embodiment of the thermal module structure
of the present invention. FIG. 2B is a perspective assembled view
of the first embodiment of the thermal module structure of the
present invention. According to the first embodiment, the thermal
module structure 2 of the present invention includes a main body 20
and at least one heat pipe 21. The main body 20 has a base section
201 and an extension section 202 extending from a middle portion of
one side of the base section 201. Multiple radiating fins 2023
extend from a circumference of the extension section 202. The base
section 201 and the extension section 202 are integrally formed by
means of mechanical processing. In this embodiment, the mechanical
processing is aluminum extrusion.
[0022] The heat pipe 21 is assembled with the main body 20. The
heat pipe 21 has a heat absorption end 211 and a heat dissipation
end 212. The heat absorption end 211 is assembled with the other
side of the base section 201 opposite to the extension section 202.
The heat dissipation end 212 is attached to one side of the
extension section 202. The other side of the base section 201 has
at least one groove 2011 formed in a position where the heat pipe
21 is positioned. The heat absorption end 211 of the heat pipe 21
is assembled in the groove 2011.
[0023] According to the above arrangement, the heat pipe 21 is
assembled with the main body 20, whereby the heat absorption end
211 can absorb the heat and transfer the heat to the heat
dissipation end 212. Then the heat is dissipated from the radiating
fins 2023 of the extension section 202. Accordingly, the heat can
be quickly dissipated. Moreover, the base section 201, the
extension section 202 and the radiating fins 2023 are integrally
formed so that the manufacturing process is simplified and the
manufacturing cost is greatly lowered.
[0024] Please refer to FIGS. 3A and 3B. FIG. 3A is a perspective
exploded view of a second embodiment of the thermal module
structure of the present invention. FIG. 3B is a perspective
assembled view of the second embodiment of the thermal module
structure of the present invention. The second embodiment is
substantially identical to the first embodiment in component and
connection relationship between the components and thus will not be
repeatedly described hereinafter. The second embodiment is mainly
different from the first embodiment in that multiple extension
limbs 2021 further outward extend from the circumference of the
extension section 202. Each extension limb 2021 has a free end
formed with at least one locating hole 2022. The main body 20 has a
first side 22. A fan 24 is disposed on the first side 22 of the
main body 20. By means of the locating holes 2022 of the free ends
of the extension limbs 2021, the fan 24 is affixed to the thermal
module structure 2. The side of the base section 201 with the heat
pipe 21 is attached to the heat source 25. The heat absorption end
211 of the heat pipe 21 serves to absorb the heat generated by the
heat source 25 and transfer the heat to the heat dissipation end
212. Then the heat is dissipated from the radiating fins 2023 of
the extension section 202 and carried away by the airflow generated
by the fan 24. Accordingly, the heat can be quickly dissipated.
[0025] Please refer to FIGS. 4A and 4B. FIG. 4A is a perspective
exploded view of a third embodiment of the thermal module structure
of the present invention. FIG. 4B is a perspective assembled view
of the third embodiment of the thermal module structure of the
present invention. The third embodiment is substantially identical
to the second embodiment in component and connection relationship
between the components and thus will not be repeatedly described
hereinafter. The third embodiment is mainly different from the
second embodiment in that the main body 20 has a second side 23 on
which the heat dissipation end 212 of the heat pipe 21 is
positioned. A fan 24 is disposed on the second side 23 of the main
body 20. By means of the locating holes 2022 of the free ends of
the extension limbs 2021, the fan 24 is affixed to the thermal
module structure 2. The side of the base section 201 with the heat
pipe 21 is attached to the heat source 25. The heat absorption end
211 of the heat pipe 21 serves to absorb the heat generated by the
heat source 25 and transfer the heat to the heat dissipation end
212. Then the heat is dissipated from the radiating fins 2023 of
the extension section 202 and carried away by the airflow generated
by the fan 24. Accordingly, the heat can be quickly dissipated.
[0026] In conclusion, in comparison with the conventional thermal
module, the present invention has the following advantages:
1. The manufacturing cost is lowered. 2. The manufacturing process
is simplified. 3. The heat dissipation is speeded.
[0027] The above embodiments are only used to illustrate the
present invention, not intended to limit the scope thereof. It is
understood that many changes and modifications of the above
embodiments can be made without departing from the spirit of the
present invention. The scope of the present invention is limited
only by the appended claims.
* * * * *