U.S. patent application number 13/943262 was filed with the patent office on 2013-11-14 for two-piece connector assembly suitable for solder reflow processing.
The applicant listed for this patent is Genesis Technology USA, Inc.. Invention is credited to Earl Anthony Daughtry, JR., Chi-Lun Lin, Yi Fei Luo.
Application Number | 20130303004 13/943262 |
Document ID | / |
Family ID | 46516011 |
Filed Date | 2013-11-14 |
United States Patent
Application |
20130303004 |
Kind Code |
A1 |
Daughtry, JR.; Earl Anthony ;
et al. |
November 14, 2013 |
Two-Piece Connector Assembly Suitable for Solder Reflow
Processing
Abstract
This disclosure is directed to apparatuses, systems, and methods
associated with a connector assembly for use with surface mount
technology (SMT). The connector assembly has a connector header
configured to be mounted to a circuit board and is constructed of a
high-temperature resistant material suitable for use with a reflow
soldering process. The connector header includes at least one
connector socket and at least one mounting shoulder, and is
configured to be coupled to a header attachment assembly. The
header attachment assembly comprises at least one connector pin and
at least one mounting shoulder, and is configured to be coupled to
the connector header. An electronic device, such as a card reader
or hard drive, may be connected to the header attachment assembly
and thereby to the circuit board. The connector assembly allows for
the obstructed view inserting and attaching in a manual or an
automated assembly process.
Inventors: |
Daughtry, JR.; Earl Anthony;
(Lawrenceville, GA) ; Luo; Yi Fei; (Shaoyang,
CN) ; Lin; Chi-Lun; (Taipei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Genesis Technology USA, Inc. |
Norcross |
GA |
US |
|
|
Family ID: |
46516011 |
Appl. No.: |
13/943262 |
Filed: |
July 16, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13298719 |
Nov 17, 2011 |
|
|
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13943262 |
|
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|
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61434680 |
Jan 20, 2011 |
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Current U.S.
Class: |
439/83 |
Current CPC
Class: |
H01R 12/57 20130101;
H01R 12/7082 20130101; Y10T 29/49128 20150115; H01R 12/7076
20130101 |
Class at
Publication: |
439/83 |
International
Class: |
H01R 12/57 20060101
H01R012/57 |
Claims
1. A connector assembly for connecting an electronic device having
external electrical contacts to a circuit board, comprising: a
connector header comprising a body, a plurality of connector
sockets, and a plurality of solder nails, the body being
manufactured from a first material which is resistant to soldering
temperatures, the body having a plurality of receiving channels, a
plurality of mounting sleeves, and a plurality of engaging tab
channels, each receiving channel being for receiving a respective
connector socket, the mounting sleeves being on a first end and a
second, opposing end of the body, each engaging tab channel being
open on a first end, closed on a second, opposite end, and facing
another of the engaging tab channels, each connector socket
comprising a receptacle having spring fingers on a first end and
solder terminals on a second, opposite end, the spring fingers
being oriented in a first direction and the solder terminals being
oriented in a second direction which is approximately perpendicular
to the first direction, the solder terminals extending from the
body and configured to be soldered to the circuit board, and each
solder nail being L-shaped and having a first part configured to
fit between facing channels and having a second part configured to
be soldered to the circuit board to secure the connector header to
the circuit board, the first part being oriented in a first
direction and the second part being oriented in a second direction
which is approximately perpendicular to the first direction; and a
header attachment assembly, configured to receive the electronic
device, and comprising a body and electrical conductors, the body
being manufactured from a second material which may be less
resistant to soldering temperatures than the first material, the
body comprising a plurality of mounting posts and a plurality of
mounting shoulders, each mounting post being for insertion into an
aperture in the circuit board, each mounting post having either (a)
a tab or (b) a boss at a distal end to limit a depth of insertion
of the mounting post into the aperture of the circuit board, each
mounting shoulder being configured for insertion into a respective
mounting sleeve, and each of the electrical conductors having a
connector pin on one end and an electrical contact on an opposing
end, the connector pins being configured to reversibly mate with
the spring fingers of the connector header, the electrical contacts
being configured to provide a temporary electrical connection with
an external electrical contact of the electronic device when the
electronic device is inserted into the header attachment
assembly.
2. The connector assembly of claim 1 wherein the header attachment
assembly further comprises switch contacts for detecting insertion
of the electronic device into the header attachment assembly.
3. The connector assembly of claim 1 wherein at least one mounting
post has a rib thereon.
4. The connector assembly of claim 1 wherein the connector header
further comprises a plurality of locator posts for positioning the
connector header on the circuit board.
5. The connector assembly of claim 1 wherein each engaging tab
channel has an interior wall and an outer wall, and wherein a
distance between interior walls of facing engaging tab channels is
greater than a distance between outer walls of the facing engaging
tab channels.
6. The connector assembly of claim 1 wherein a width of the first
part of the solder nail is greater than a width of the second part
of the solder nail.
7. The connector assembly of claim 1 wherein: each engaging tab
channel has an interior wall and an outer wall, and wherein a
distance between interior walls of facing engaging tab channels is
greater than a distance between outer walls of the facing engaging
tab channels; a width of at least part of the first part of the
solder nail is greater than a width of the second part of the
solder nail and is no greater than the distance between interior
walls of facing engaging tab channels; and the width of the at
least part of the first part of the solder nail is greater than the
distance between outer walls of the facing engaging tab
channels.
8. The connector assembly of claim 1 wherein the connector header
and the header attachment assembly are used in a smart card reader,
and wherein the electrical contacts of the electrical conductors of
the header attachment assembly are configured to provide a
temporary electrical connection with contacts on a smart card when
the smart card is inserted into the smart card reader.
9. A connector assembly for connecting an electrical cable having a
plurality of electrical contacts to a circuit board, comprising: a
connector header comprising a body, a plurality of connector
sockets, and a plurality of solder nails, the body being
manufactured from a first material which is resistant to soldering
temperatures, the body having a plurality of receiving channels, a
plurality of mounting sleeves, and a plurality of engaging tab
channels, each receiving channel being for receiving a respective
connector socket, the mounting sleeves being on a first end and a
second, opposing end of the body, each engaging tab channel being
open on a first end, closed on a second, opposite end, and facing
another of the engaging tab channels, each connector socket
comprising a receptacle having spring fingers on a first end and
solder terminals on a second, opposite end, the spring fingers
being oriented in a first direction and the solder terminals being
oriented in a second direction which is approximately perpendicular
to the first direction, the solder terminals extending from the
body and configured to be soldered to the circuit board, each
solder nail being L-shaped and having a first part configured to
fit between facing channels and having a second part configured to
be soldered to the circuit board to secure the connector header to
the circuit board, the first part being oriented in a first
direction and the second part being oriented in a second direction
which is approximately perpendicular to the first direction; and a
header attachment assembly, configured to receive the electrical
cable, and comprising a body and electrical conductors, the body
being manufactured from a second material which may be less
resistant to soldering temperatures than the first material, the
body comprising a plurality of mounting shoulders, each mounting
shoulder being configured for insertion into a respective mounting
sleeve, and each of the electrical conductors having a connector
pin on one end and an electrical contact on an opposing end, the
connector pins being configured to reversibly mate with the
plurality of electrical contacts of the connector header, the
electrical contacts being configured to reversibly mate with the
contacts of the electrical cable.
10. The connector assembly of claim 9 wherein each electrical
conductor has a first part and a second part, the first part
comprising the connector pin and being oriented in a first
direction, and the second part comprising the electrical contact
and being oriented in a second direction which is approximately
perpendicular to the first direction.
11. The connector assembly of claim 9 wherein each engaging tab
channel has an interior wall and an outer wall, and wherein a
distance between interior walls of facing engaging tab channels is
greater than a distance between outer walls of the facing engaging
tab channels.
12. The connector assembly of claim 9 wherein a width of the first
part of the solder nail is greater than a width of the second part
of the solder nail.
13. The connector assembly of claim 9 wherein: each engaging tab
channel has an interior wall and an outer wall, and wherein a
distance between interior walls of facing engaging tab channels is
greater than a distance between outer walls of the facing engaging
tab channels; a width of at least part of the first part of the
solder nail is greater than a width of the second part of the
solder nail and is no greater than the distance between interior
walls of facing engaging tab channels; and the width of the at
least part of the first part of the solder nail is greater than the
distance between outer walls of the facing engaging tab channels.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of U.S. patent
application Ser. No. 13/298719, filed Nov. 17, 2011, which
application claims the benefit of U.S. Provisional Patent
Application No. 61/434680, filed Jan. 20, 2011, both of which are
expressly incorporated herein by reference in their entirety.
BACKGROUND
[0002] Surface mount technology (SMT) is a method of constructing
electronic circuits by mounting and soldering electronic components
to the surface of a circuit board without, usually, the use of
through-hole technology. Surface mounting lends itself to
automation, which reduces labor costs and increases production
rates. Surface mounting also lends itself to mounting and soldering
electronic components to both sides of a circuit board.
[0003] With regard to a typical automated SMT process, components
to be soldered to a circuit board may be delivered to a production
line on trays or wound on reels or tubes. Computer controlled
pick-and-place machines take the components and place them on the
circuit board. The circuit board and components are then soldered
with a reflow process. There are several reflow soldering processes
currently in use including infrared reflow, vapor phase reflow,
wave soldering, and convection heat.
[0004] It is with respect to these considerations and others that
the disclosure made herein is presented.
SUMMARY
[0005] A connector assembly comprising a connector header and a
header attachment assembly is disclosed herein. The connector
assembly embodiments disclosed herein are suitable for use with
reflow soldering processes. According to one aspect the connector
header, constructed of a material that can withstand the reflow
soldering process, is mounted to the surface of a circuit board and
soldered with a reflow process. The header attachment assembly,
constructed of a material that may not be able to withstand the
reflow soldering process, is later coupled to the connector header.
The header attachment assembly may comprise an electronic device,
such as but not limited to a card reader, or be connected to an
electronic device, such as but not limited to a hard drive.
[0006] According to one aspect, a connector header configured to be
attached to a mounting surface includes at least one connector
socket configured to receive a connector pin, and at least one
mounting sleeve configured to matingly engage a mounting shoulder.
A header attachment assembly configured to be attached to the
connector header comprises at least one connector pin configured to
be connected to the connector socket, and at least one mounting
shoulder configured to matingly engage the mounting sleeve.
[0007] According to an embodiment described herein, the connector
header further comprises at least one receiving channel configured
to guide a connector pin toward its respective connector socket. In
another aspect, the connector socket includes a solder terminal
configured to be soldered to the circuit board. In still another
aspect, the connector header includes a solder nail configured to
be soldered to the circuit board.
[0008] According to an alternative embodiment, the header
attachment assembly further comprises at least one electronic
contact communicatively connected to a connector pin. In another
aspect, the header attachment assembly includes a mounting shoulder
rib. In still another aspect, the header attachment assembly
includes a mounting post for attachment to the circuit board.
[0009] Methods of utilizing a two-piece connector assembly are
taught herein. A method teaches obtaining a circuit board, a
connector header, and a header attachment assembly. The connector
header is manufactured from a first material suitable for use with
a surface mount device reflow soldering operation. The header
attachment assembly is manufactured from a second material that may
not be suitable for a reflow soldering operation. Another aspect of
the method includes attaching the connector header to the circuit
board and performing a reflow soldering operation to couple the
connector header to the circuit board. In still another aspect, the
header attachment assembly is coupled to the connector header after
the reflow soldering operation.
[0010] Alternative embodiments of the methods include obtaining a
connector header that comprises a mounting sleeve and obtaining a
header attachment assembly that comprises a mounting shoulder.
Another embodiment includes obtaining a header attachment assembly
that comprises a mounting shoulder rib. Still other embodiments
include the obstructed view engaging of the connector header and
header attachment assembly. Additional embodiments include
electronically connecting an electronic device to the header
attachment assembly such that the connector assembly connects the
electronic device to the circuit board.
[0011] It should be appreciated that the above-described subject
matter may also be implemented as an electrical apparatus, a
manufacturing process, an electrical and mechanical system, or as
an article of manufacture. The features, functions, and advantages
that have been discussed can be achieved independently in various
embodiments of the present disclosure or may be combined in yet
other embodiments, further details of which can be seen with
reference to the following Detailed Description and Drawings.
[0012] This Summary is provided to introduce a selection of
concepts in a simplified form that are further described below in
the Detailed Description. This Summary is not intended to identify
key features or essential features of the claimed subject matter,
nor is it intended that this Summary be used to limit the scope of
the claimed subject matter. Furthermore, the claimed subject matter
is not limited to implementations that solve any or all
disadvantages noted in any part of this disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 is a top-view perspective diagram showing an
exemplary connector assembly.
[0014] FIG. 2 is a bottom-view perspective diagram showing the
exemplary connector assembly of FIG. 1.
[0015] FIG. 3 is an exploded perspective diagram illustrating an
exemplary connector header.
[0016] FIG. 4 is a partial bottom-view perspective diagram showing
the mounting of an exemplary header attachment assembly to an
exemplary connector header.
[0017] FIG. 5 is a perspective diagram illustrating an exemplary
header attachment assembly mounted to a connector header.
[0018] FIG. 6 is a perspective diagram showing an exemplary
connector header and header attachment assembly.
[0019] FIG. 7 is a perspective diagram illustrating an exemplary
header attachment assembly mounted to a connector header.
[0020] FIG. 8 is a logical flow diagram illustrating a process for
manufacturing, assembling, and utilizing an exemplary connector
assembly.
DETAILED DESCRIPTION
[0021] The following Detailed Description is directed to
apparatuses, systems, and methods for utilizing a connector header
for coupling a header attachment assembly to a circuit board. The
embodiments taught herein are applicable to both the automated
assembly and interconnecting of electrical components to circuit
boards using surface mount technology (SMT), as well as the manual
assembly and interconnecting of electrical components to circuit
boards using other soldering process. With regard to SMT assembly,
utilizing the connector assembly embodiments provided herein a
connector header is included with other electrical components
during the SMT assembly and reflow soldering of the circuit board.
A header attachment assembly--a circuit board component which may
not be compatible with reflow soldering, or which may be
advantageously added later in the assembly process--is then coupled
to the connector header to electrically and mechanically connect to
the circuit board.
[0022] In the following Detailed Description, references are made
to the accompanying drawings that form a part hereof, and which are
shown by way of illustrated embodiments and example. The drawings
are not drawn to scale. Accordingly, the dimensions or proportions
of particular elements, or the relationships between different
elements, as shown in the drawings are chosen only for convenience
of description and do not limit possible implementation of this
disclosure. Referring now to the drawings, in which like numerals
represent like elements through the several figures, aspects of
apparatus, system, and methodology for a connector assembly will be
described.
[0023] FIGS. 1 and 2 are perspective diagrams showing various
aspects of an exemplary connector assembly 100 as disclosed herein.
As shown in FIGS. 1 and 2, the illustrated connector assembly 100
includes a connector header 102 and a header attachment assembly
104. Both the connector header 102 and header attachment assembly
104 will be coupled to a circuit board 106, which includes mounting
apertures 108, as described herein. As used herein, the term
"coupled" includes one element, component, device, and the like
being electrically connected and mechanically connected to another
element, component, device, and the like.
[0024] The connector assembly 100 as taught herein may be used with
any element, component, device, and the like to be connected to a
circuit board. Further, the connector assembly 100 as taught herein
may be used with any process of assembly and interconnecting of
electrical components to a circuit board, including SMT and reflow
soldering. Accordingly, for the purpose of teaching, describing,
and illustration, and not restriction or limitation, the present
disclosure is presented within the context of different
embodiments, including a card reader communicatively connected to
any type of electronic device that might receive and obtain data
from a card, such as but not limited to an ATM, a vending machine,
a point of sale device, and the like. It should then be appreciated
that the header attachment assembly 104 illustrated here is shown
in the form of a card reader body configured for receiving and
electronically linking a substantially planar card comprising
circuitry or embedded electronics from which data may be retrieved,
such as a smart card, chip card, ICC card, and the like.
[0025] The illustrated connector header body 110 is fabricated from
a high-temperature thermoplastic, such as liquid crystal polymer
(LCP), or polyamide nylon (PA9T), and the like, suitable for
withstanding reflow solder temperature profiles. In other
embodiments other high-temperature resistant materials or
composites may be used to fabricate the connector header body 110.
The connector header body 110 may include elements that are molded
or attached, including solder nails 112 for mechanically connecting
and solder terminals 114 for electrically connecting the connector
header 102 to the circuit board 106, as described below. As used
herein the term "solder nail", whether in the singular or plural,
includes an oversized SMT solder terminal that provides increased
surface area and mechanical strength for connecting components to
the circuit board 106.
[0026] The illustrated header attachment assembly body 120 is
fabricated from a less expensive thermoplastic, such as
medium-density polyethylene (MDPE), or polybutylene terephthalate
(PBT), combinations thereof, and the like. In other embodiments
other materials or composites may be used to fabricate the header
attachment assembly body 120. The header attachment assembly body
120 may include elements that are molded or attached, including
connector pins 122 for coupling to the connector header 102,
conductive electronic contacts 124 for electronically linking the
circuitry of a smart card to the card reader, and switch contacts
126 for detecting the full insertion of a card into the header
attachment assembly 104.
[0027] According to one embodiment, the header attachment assembly
body 120 includes a plurality of engaging members, shown here as
mounting posts 128 molded with the header attachment assembly body
120. The mounting posts 128 are configured for insertion into
correspondingly located mounting apertures 108 in a mounting
surface, such as the illustrated circuit board 106, a platform, a
chassis, a case, and the like. The mounting posts 128 may be solid
or split, and may include a tab or boss 130 or other mechanisms for
securing the header attachment assembly 104 to the circuit board
106. Other types of mechanical and/or chemical engaging mechanisms,
such as but not limited to solder nails, arms, extensions, bridges,
bolts, welds, combinations thereof, and the like might be utilized
to attach the header attachment assembly 104 to the circuit board
106. Also, as best shown in FIG. 2, the connector header body 110
may include a locator post 132 for positioning and obstructed view
inserting of the connector header 102 to the circuit board 106.
[0028] Turning now to FIG. 3, this is shown an exploded perspective
diagram illustrating the exemplary connector header 102 of FIGS. 1
and 2. The illustrated connector header body 110 comprises a
plurality of receiving channels 300, mounting sleeves 302, and
engaging tab channels 304. Each edge of the open end of the
illustrated receiving channels 300, mounting sleeves 302, and
engaging tab channels 304 are shown tapered. An advantage of these
components having at least one edge of the open end tapered is
appreciated during obstructed view attachment or assembly. In some
alternative embodiments, however, not every edge of an open end is
tapered. Obstructed view attachment or assembly of these components
can be easier and more reliable with at least one edge of an open
end tapered. In some alternative embodiments some or all of these
components do not have tapered ends. In some alternative
embodiments the attachment or assembly of some or all of these
components is not obstructed view.
[0029] Positioned within each receiving channel 300 is a respective
connector socket 310 comprising a plurality of resilient spring
fingers 312. The resilient spring fingers 312 are configured to
frictionally receive and connect to a connector pin 122 when the
header attachment assembly 104 is coupled to the connector header
102 as further described herein.
[0030] An advantage of the present disclosure is that the flat
configuration of the connector pin(s) 122 and the flat
configuration of the resilient spring fingers 312 offers improved
connectivity between the connector header 102 and header attachment
assembly 104. Some connector socket 310 embodiments comprise a
greater number of resilient spring fingers 312 and some embodiments
comprise a fewer number. Each illustrated connector socket 310
further includes a solder terminal 114, which is connected to the
circuit board 106 during the soldering operation of assembly.
[0031] The illustrated connector header body 110 comprises two
integral mounting sleeves 302. Each mounting sleeve 302 is
configured to receive a mounting shoulder 400, best shown in FIG.
4, when the header attachment assembly 104 is coupled to the
connector header 102, as further described herein. Alternative
embodiments of the connector header body 110 may include more than
two mounting sleeves 302, or just one. In addition, mounting
sleeves 302 may be integral to the connector header body 110. As
used herein the term "integral" includes an element described
herein that may be molded into or attached to another element. By
way of example and not limitation, the mounting sleeve 302 may be
molded with or attached to the connector header body 110. The
mounting shoulders 400 of the exemplary embodiments include a
mounting shoulder rib 402. An advantage of the present disclosure
is that the combination of the illustrated mounting sleeves 302 and
mounting shoulders 400 provides for obstructed view insertion and
attachment of the header attachment assembly 104 to the connector
header 102. Further, the combination of mounting sleeves 302 and
mounting shoulders 400 provides a structure that prevents damage to
the connector pins 122 during attachment of the header attachment
assembly 104 to the connector header 102.
[0032] The illustrated connector header body 110 also comprises two
engaging tab channels 304. The engaging tab channels 304 are
configured to receivingly connect an engaging tab 320 of a solder
nail 112. The illustrated engaging tabs 320 include an engaging tab
rib 322. The solder nails 112 include a securing tab 324.
[0033] In practice, the connector header 102 may be assembled by
positioning and aligning each connector socket 310 within the
connector header body 110 and with respect to a respective
receiving channel 300, such that when coupling the header
attachment assembly 104 to the connector header 102 as shown
herein, a connector pin 122 may be inserted into a respective
receiving channel 300 and connector socket 310. The engaging tabs
320 may be inserted within the engaging tab channels 304. The
connector header 102 may now be attached to a mounting surface,
such as the circuit board 106, as best shown in FIG. 1.
[0034] With reference to FIGS. 1, 2 and 4, a method of constructing
the connector assembly 100 will now be described. The connector
header 102, which may include locator posts 132 configured to be
inserted into mounting apertures 108, is positioned on the circuit
board 106. Other electrical components may be attached to the
circuit board 106 and then, together with the connector header 102,
connected to the circuit board 106 during a soldering operation
such as used with surface mount technology (also sometimes referred
to as surface mount device) reflow soldering. During the soldering
operation a solder fillet may be placed along the exterior edges of
the solder terminal(s) 114 and solder nail 112 securing tab(s) 324.
In this way the connector header 102 is coupled to the circuit
board 106.
[0035] After the soldering operation the header attachment assembly
104 may be connected to the circuit board 106 by, substantially
simultaneously, aligning and inserting the mounting posts 128 into
the mounting apertures 108, the mounting shoulder 400 into the
mounting sleeve 302, and the connector pins 122 into the connector
sockets 310. In this way, as perhaps best shown in FIG. 5, the
header attachment assembly 104 may be mounted on the circuit board
106 and coupled to the connector header 102.
[0036] Advantages of the connector assembly 100 taught herein
include: fabricating a comparatively small header from more
expensive material while fabricating a larger assembly from less
expensive material; assembling a circuit board with a reflow
soldering compatible header to which can be mounted an assembly;
increasing circuit board surface area; increasing circuit board
density; allowing the stacking of electrical components to either
side of a circuit board; allowing the addition of electrical
components to either side of a circuit board after reflow
soldering; allowing for entirely automated SMT assembly of circuit
boards; allowing for various surface mount device soldering
processes; providing improved connectively between the header and
assembly; allowing for the obstructed view inserting, connecting,
attaching, and coupling of components in the assembly process;
providing for improved attachment through larger solder nails, and
providing flexibility in manufacturing.
[0037] Additional advantages of the connector assembly 100 taught
herein includes the combination of the mounting sleeve 302, the
mounting shoulder 400, and the mounting shoulder rib 402. This
combination of releaseably engaged elements is a solution that
reduces tolerance differences for a secure attachment between the
connector header 102 and header attachment assembly 104, and
achieves performance criteria without fatiguing the connector
header 102 or header attachment assembly 104. Alternative
embodiments include various profiles and configurations of
releaseably engaged mounting sleeves and mounting shoulders, such
as but not limited to polygons, hexagons, octagons, circles,
combinations thereof, and the like. Some alternative embodiments
may not include a mounting shoulder rib 402, and some alternative
embodiments include a plurality of ribs, tabs, bosses, and the like
of various profiles and configurations.
[0038] FIG. 6 is a perspective diagram showing various aspects of
another exemplary connector assembly 600, as disclosed herein. The
connector assembly 600 as taught herein may be used with any
electronic device that includes electrical components connected to
a circuit board. More specifically, this embodiment is taught
within the context of a serial ATA (SATA) connector communicatively
connected to any type of electronic device that might store data,
such as an optical drive or a hard drive. The illustrated connector
assembly 600 includes a connector header 602 and a header
attachment assembly 604. Here the connector header 602 will be
coupled to a circuit board 606 and the header attachment assembly
604 will be coupled to the connector header 602.
[0039] The illustrated connector header body 610 is fabricated from
a high-temperature thermoplastic, such as liquid crystal polymer
(LCP), or polyamide nylon (PA9T), and the like, suitable for
withstanding reflow solder temperature profiles. In other
embodiments other high-temperature resistant materials or
composites may be used to fabricate the connector header body 610.
The connector header body 610 may include elements that are molded
or attached, including solder nails 612 for primarily mechanically
connecting and solder terminals 614 for primarily electrically
connecting the connector header 602 to the circuit board 606, as
described herein.
[0040] The illustrated header attachment assembly body 620 is
fabricated from a less expensive thermoplastic, such as
medium-density polyethylene (MDPE), or polybutylene terephthalate
(PBT), combinations thereof, and the like. In other embodiments
other materials or composites may be used to fabricate the header
attachment assembly body 620. The header attachment assembly body
620 may include elements that are molded or attached, including
connector pins 622 for connecting to the connector header 602, and
conductive electronic contacts 624 for connecting to a SATA cable
and thereby electronically linking the electronic device to the
circuit board 606 through the connector assembly 600.
[0041] The illustrated connector header body 610 comprises a
plurality of receiving channels 630, mounting sleeves 632, and
engaging tab channels 636. Positioned within each receiving channel
630 is a respective connector socket (not shown) comprising a
plurality of resilient spring fingers as described above. The
illustrated connector header body 610 also comprises two mounting
sleeves 632. Each mounting sleeve 632 is configured to receive a
mounting shoulder 634 when the header attachment assembly 604 is
coupled to the connector header 602. The illustrated connector
header body 610 comprises two engaging tab channels 636. The
engaging tab channels 636 are configured to receivingly connect an
engaging tab 638 of a solder nail 612. The solder nails 612 include
a securing tab 640.
[0042] In practice, the connector header 602 may be assembled by
positioning and aligning each connector socket (not shown) within
the connector header body 610 and with respect to a respective
receiving channel 630, such that when coupling the header
attachment assembly 604 to the connector header 602 a connector pin
622 may be inserted into a respective receiving channel 630 and
connector socket. The engaging tab 638 may be inserted within the
engaging tab channel 636 and the connector header 602 attached to a
mounting surface, such as the circuit board 606.
[0043] With reference now to FIGS. 6 and 7, a method of
constructing the connector assembly 600 will now be described. The
connector header 602, which may include locator posts (not shown)
configured to be inserted into mounting apertures (not shown), is
positioned on the circuit board 606. Other electrical components
may be attached to the circuit board 606 and then, together with
the connector header 602, connected to the circuit board 606 during
a soldering operation such as used with surface mount technology
(sometimes also referred to as surface mount device) reflow
soldering. During the soldering operation a solder fillet may be
placed along the exterior edges of the solder terminal(s) 614 and
solder nail 612 securing tab(s) 640. In this way the connector
header 602 is communicatively connected to the circuit board
606.
[0044] After the soldering operation the header attachment assembly
604 may be coupled to the connector header 602 by, substantially
simultaneously, aligning and inserting the mounting shoulder 634
into the mounting sleeve 632, and the connector pins 622 into the
receiving channels 630 and connector sockets (not shown). In this
way, as best shown in FIG. 7, the header attachment assembly 604 is
coupled to the connector header 602.
[0045] FIG. 8 is a logical flow diagram illustrating a process 800
for manufacturing, assembling, and utilizing the connector assembly
100, 600 disclosed herein. It should be appreciated that the
operations described herein can be implemented as a sequence of
manufacturing steps, mechanical operations, and physical processes.
The implementation may vary depending on the performance and other
requirements of a particular manufacturing system or electronic
device in which the connector assembly 100, 600 disclosed herein is
utilized. It should also be appreciated that more or fewer
operations may be performed than shown in the Figures and described
herein. These operations may also be performed in parallel, or in a
different order than those described herein.
[0046] The process 800 can begin with operation 802 where an
appropriate manufacturing procedure is utilized to mold the
connector header body 110, 610 from a high-temperature
thermoplastic suitable for withstanding surface mount technology
reflow soldering temperature profiles. Elements such as connector
sockets 310, solder nails 112, and the like can be attached to or
molded into other elements such as the connector header body 110,
610. In this way a connector header 102, 602 is then manufactured
for incorporation into an electronic device, which may include
other electrical components connected to a circuit board 106, 606.
From operation 802, the routine 800 proceeds to operation 804 where
the connector header 102, 602 is mounted to the circuit board 106,
606, possibly with other electrical components. After the connector
header 102, 602 has been mounted to the circuit board 106, 606 the
routine 800 proceeds to operation 806.
[0047] At operation 806, the connector header 102, 602 is soldered
to the circuit board 106, 606. The soldering operation 806 may be
done manually or automatically. Automatic soldering operations
include any of the surface mount technology reflow soldering
processes, and the like. During the soldering operation the solder
terminals 114 of the connector sockets 310 are soldered to the
circuit board 106, 606. In this way the connector header 102, 602
is coupled to the circuit board 106, 606. In some embodiments
solder nails 114 are also soldered to the circuit board 106, 606;
in this way the solder nails 114 provide increased attachment and
stability to the connector header 102, 602.
[0048] At operation 808 an appropriate manufacturing procedure is
utilized to mold the header attachment assembly 104, 604 from a
second material, a material which may not be suitable for
high-temperature soldering operations. Elements such as connector
pins 122, 622, conductive electronic contacts 124, 624, switch
contacts 126, and the like can be attached to or molded into the
header attachment assembly body 120, 620. A header attachment
assembly 104, 604 is then provided for coupling to a connector
header 102.
[0049] At operation 810 the header attachment assembly 104, 604 is
coupled to connector header 102, 602. In some embodiments the
header attachment assembly 104, 604 may also be attached to a
mounting surface, such as a circuit board 106, 606, platform, case,
and the like. The routine 800 then continues to operation 812,
where it ends.
[0050] Based on the foregoing, it should be appreciated that a
connector assembly 100, 600, comprising a connector header 102, 602
and header attachment assembly 104, 604, has been disclosed herein.
Although the subject matter presented herein has been described in
language specific to systems, methodological acts, mechanical and
physical operations, and manufacturing processes, it is to be
understood that the invention disclosed herein is not necessarily
limited to the specific features, acts, or media described herein.
Rather, the specific features, acts and mediums are disclosed as
example forms.
[0051] The subject matter described herein is provided by way of
illustration for the purposes of teaching, suggesting, and
describing, and not limiting. Alternatives to the illustrated
embodiment are contemplated, described herein, and set forth in the
claims. Various modifications and changes may be made to the
subject matter described herein without following the example
embodiments and applications illustrated and described, and without
departing from the true spirit and scope of the present
invention.
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