U.S. patent application number 13/656748 was filed with the patent office on 2013-11-14 for illuminant device.
This patent application is currently assigned to INTEMATIX TECHNOLOGY CENTER CORP.. The applicant listed for this patent is Hsi-Yan CHOU, Yu-Chou Hu, Fu-Chen Liu. Invention is credited to Hsi-Yan CHOU, Yu-Chou Hu, Fu-Chen Liu.
Application Number | 20130301261 13/656748 |
Document ID | / |
Family ID | 47224970 |
Filed Date | 2013-11-14 |
United States Patent
Application |
20130301261 |
Kind Code |
A1 |
CHOU; Hsi-Yan ; et
al. |
November 14, 2013 |
ILLUMINANT DEVICE
Abstract
An illuminant device includes a housing, a circuit board, a
plurality of LED dies, a light-transmitting layer, a controlling
and driving module and a conductive connector. One end of the
housing has a carrying part. The circuit board is disposed on the
carrying part and has a circuit layer. The LED dies are placed on
the circuit board and electrically connected to the circuit layer.
The light-transmitting layer is circularly disposed on the circuit
board and covering the LED dies. The controlling and driving module
is placed on the circuit board and electrically connected to the
circuit layer. The conductive connector is assembled with the other
end of the housing and electrically connected to the circuit
layer.
Inventors: |
CHOU; Hsi-Yan; (Yangmei,
TW) ; Hu; Yu-Chou; (Yangmei, TW) ; Liu;
Fu-Chen; (Yangmei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHOU; Hsi-Yan
Hu; Yu-Chou
Liu; Fu-Chen |
Yangmei
Yangmei
Yangmei |
|
TW
TW
TW |
|
|
Assignee: |
INTEMATIX TECHNOLOGY CENTER
CORP.
|
Family ID: |
47224970 |
Appl. No.: |
13/656748 |
Filed: |
October 22, 2012 |
Current U.S.
Class: |
362/235 ;
362/249.02 |
Current CPC
Class: |
F21K 9/64 20160801; H01L
2924/181 20130101; H01L 2224/48091 20130101; F21V 19/0055 20130101;
H01L 2924/181 20130101; F21V 23/005 20130101; F21K 9/232 20160801;
F21V 29/745 20150115; F21V 29/773 20150115; F21K 9/238 20160801;
F21V 23/06 20130101; F21V 23/002 20130101; H01L 2224/73265
20130101; H01L 2924/00012 20130101; H01L 2924/00014 20130101; F21K
9/23 20160801; H01L 2224/48464 20130101; F21Y 2115/10 20160801;
F21Y 2103/33 20160801; H01L 2224/16225 20130101; H01L 2224/48091
20130101 |
Class at
Publication: |
362/235 ;
362/249.02 |
International
Class: |
F21V 9/00 20060101
F21V009/00; F21V 1/00 20060101 F21V001/00; F21V 21/00 20060101
F21V021/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 11, 2012 |
TW |
101209042 |
Claims
1. An illuminant device comprising: a housing, one end of the
housing comprising a carrying part; a circuit board disposed on the
carrying part, the circuit board having a circuit layer; a
plurality of light emitting diode (LED) dies placed on the circuit
board and electrically connected to the circuit layer; a
light-transmitting layer circularly disposed on the circuit board
and covering the LED dies; a controlling and driving module placed
on the circuit board and electrically connected to the circuit
layer; and a conductive connector assembled with the other end of
the housing and electrically connected to the circuit layer.
2. The illuminant device in claim 1, wherein the light-transmitting
layer is circularly disposed on the circuit board.
3. The illuminant device in claim 1, wherein a profile of the
light-transmitting layer covering the LED dies is of arc-shape.
4. The illuminant device in claim 1, further comprising a
wavelength-converting matter disposed within the light-transmitting
layer.
5. The illuminant device in claim 1, further comprising two dams
respectively disposed at two sides of the LED dies and around the
LED dies, the light-transmitting layer is located within the
dams.
6. The illuminant device in claim 1, further comprising at least
one bonding wire, one end of the bonding wire is connected to the
LED die, and the other end of the bonding wire is connected to the
circuit layer, the light-transmitting layer covers the bonding
wire.
7. The illuminant device in claim 1, further comprising a
protecting layer covering the controlling and driving module.
8. The illuminant device in claim 7, further comprising a
surrounding wall, the surround wall is disposed on the circuit
board and around the controlling and driving module, the protecting
layer is located within the surrounding wall.
9. The illuminant device in claim 1, further comprising a plurality
of wires connected to the conductive connector and the circuit
layer.
10. The illuminant device in claim 1, wherein the LED dies are
arranged on the circuit board with the same interval
11. The illuminant device in claim 1, wherein the LED dies encloses
the controlling and driving module.
12. The illuminant device in claim 1, further comprising a
plurality of fins radially extending from an external surface of
the housing.
13. The illuminant device in claim 1, further comprising a
plurality of fixing elements penetrating the circuit board and
fastening the circuit board on the carrying part.
14. The illuminant device in claim 1, further comprising a lamp
shade, the lamp shape is assemble with the housing, such that the
circuit board, the LED dies and the controlling and driving module
are arranged between the lamp shade and the housing.
15. The illuminant device in claim 14, further comprising a
wavelength-converting matter disposed within the lamp shade.
Description
[0001] This application is based on and claims the benefit of
Taiwan Application No. 101209042 filed May 11, 2012 the entire
disclosure of which is incorporated by reference herein.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an illuminant device, and
especially to an illuminant device using light emitting diode as
light source.
[0004] 2. Description of Prior Art Light emitting diodes (LEDs)
have the advantages of small volume, long lifetime, difficulty
damage, without mercury and lower power consumption. They are
gradually replacing the fluorescent tubes and incandescent lamps
and widely used in indoor and outdoor lighting and decorative
lighting.
[0005] Reference is made to FIG. 1, which is a sectional view of a
conventional LED lamp. The LED lamp 50 includes a housing 510, a
first circuit board 520, a plurality of LEDs 530, a conductive
connector 540, a lamp shade 550 and a controlling and driving
module 560. The housing 510 has an accommodating space 512 and a
plurality of fins 514 disposed around the accommodating space 512
and used for enhancing heat-dissipating effect.
[0006] The first circuit board 520 is disposed at one end of the
housing 510. The LEDs 530 are placed on the first circuit board 520
and electrically connected thereto. The conductive connector 540 is
connected to the other end of the housing 510 which is opposite to
where the first circuit board 520 is disposed. The lamp shade 550
is disposed in front of the LEDs 530 such that the LEDs 530 are
arranged between the lamp shade 550 and the housing 510.
[0007] The controlling and driving module 560, which includes a
second circuit board 562 and a plurality of electrical elements
564, is located within the accommodating space 512. The electrical
elements 564 are placed on the second circuit board 562 and
collectively constructing power modulating circuit and controlling
circuit. The controlling and driving module 560 is electrically
connected to the first circuit board 520 via multiple wires 570,
and electrically connected to the conductive connector 540 via
multiple power lines 580.
[0008] In the practical application, the first circuit board 520
for mounting the LEDs 530 and the second circuit board 562 for
mounting the electrical elements 564 are respectively assembled
with the housing 510, and then the first circuit board 520 and the
second circuit board 562 are electrically connected via the wires
570. However, the manufacturing procedures of assembling the LED
lamp 50 are complicated and manufacturing time is longer.
[0009] In addition, the second circuit board 562 and the electrical
elements 564 of the controlling and driving module 560 have
predestinated volume, such that the volume of the accommodating
space 512 cannot be reduced, and the volume of the housing 510 can
also not be effectively reduced.
SUMMARY OF THE INVENTION
[0010] It is an object to provide an illuminant device, which has
advantages of easily manufacturing and small volume.
[0011] An illuminant device includes a housing, a circuit board, a
plurality of LEDs, a transmitting layer, a controlling and driving
module and a conductive connector. One end of the housing has a
carrying part, the circuit board is disposed on the carrying part
and has a circuit layer. The LEDs are placed on the circuit board
and electrically connected to the circuit layer. The
light-transmitting is circularly disposed on the circuit board and
covers the LEDs. The controlling and driving module placed on the
circuit and electrically connected to the circuit layer. The
conductive connector is assembled with the other end of the
housing.
[0012] The LED dies and the controlling and driving module of the
illuminant device according to the present invention are
respectively placed on the circuit board and electrically connected
to the circuit layer, so that the circuit board for placing the
controlling and driving module according to the conventional LED
lamp is omitted. In addition, the volume of the accommodating space
can be substantially reduced, and then the volume of the housing is
also reduced. Furthermore, the electrical element dies and the LED
dies are simultaneously proceeded die attachment and wire bonding
procedure, which can substantially reduce manufacturing time and
procedure.
BRIEF DESCRIPTION OF DRAWING
[0013] The features of the invention believed to be novel are set
forth with particularity in the appended claims. The invention
itself however may be best understood by reference to the following
detailed description of the invention, which describes certain
exemplary embodiments of the invention, taken in conjunction with
the accompanying drawings in which:
[0014] FIG. 1 is a sectional view of a conventional LED lamp.
[0015] FIG. 2 is a partially perspective view of an illuminant
device according to a first embodiment of the present
invention.
[0016] FIG. 3 is an assemble view of the illuminant device
according to a first embodiment of the present invention.
[0017] FIG. 4 is a sectional view of the illuminant device
according to a first embodiment of the present invention.
[0018] FIG. 5A to FIG. 5C are schematic views of electrically
connection between LED dies and circuit layer.
[0019] FIG. 6 is a top view of the illuminant device according to a
first embodiment of the present invention.
[0020] FIG. 7 is a schematic view of light passes through
light-transmitting layer.
[0021] FIG. 8 is a sectional view of an illuminant device according
to a second embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0022] A preferred embodiment of the present invention will be
described with reference to the drawings.
[0023] Referring to FIG. 2, FIG. 3 and FIG. 4, FIG. 2 is a
partially perspective view of an illuminant device according to a
first embodiment of the present invention, FIG. 3 is a assemble
view of the illuminant device according to a first embodiment of
the present invention, and FIG. 4 is a sectional view of the an
illuminant device according to a first embodiment of the present
invention. The illuminant device 10 includes a housing 110, a
circuit board 120, a plurality of light emitting diode (LED) dies
130, a light-transmitting layer 140, a controlling and driving
module 150 and a conductive connector 160.
[0024] The housing 110 has a substantially poculiform (cup-shaped)
profile and includes a carrying body 112 for carrying the circuit
board 120. The carrying body 112 is preferably disposed on one end
of the housing 110 which has lager diameter. The housing 110 is
made of metal, for example aluminum, for quickly conductive heat
generated from the LED dies 130 and the controlling and driving
module 150. In the practical application, the housing 110 may also
be made of ceramic or thermal-conductive plastic, which has thermal
conductive property as well as electrically isolating property.
[0025] In addition, a plurality of fins 116 are radially extending
from an external surface 114 of the housing 110 for increasing the
area contacted with air, and then enhance heat-dissipating effect
of the illuminant device 10. Furthermore, the center of the housing
110 includes an accommodating space 118.
[0026] The circuit board 120 is disposed on the carrying part 112
and fastened thereon via a plurality of fixing elements 20. In this
embodiment, the amount of the fixing elements 20 is, for example,
two. The circuit board 120 has a circuit layer 122 (as shown in
FIG. 2) made of cupper or other electrically conductive material.
The circuit board 120 may be print circuit board (PCB), metal core
PCB, ceramic PCB or composite material PCB. A through hole 124 is
formed on the circuit board 120, and in this embodiment, the
through hole 124 is, for example, formed at the center on the
circuit board 120.
[0027] The LED dies 130 are placed on the circuit board 120, and
attached on the circuit board 120 by die attachment process. The
attaching material located between the LED dies 130 and the circuit
board 120 may be silver adhesive, solder paste or gold-tin solder.
The LED dies 130 are electrically connected to the circuit layer
122. The LED dies 130 may be flip-chip packaged, and two electrodes
of each LED die 130 are directly and electrically connected to the
circuit layer 122, as shown in FIG. 5A. However, the LED dies 130
may be vertical packaged, and one end of a bonding wire 135, which
formed by wire bonding process, is connected to one electrode 132
of each LED die 130, the other end of the bonding wire 135 is
connected to the circuit layer 122, and the other electrode 132 is
directly and electrically connected to the circuit layer 122, as
shown in FIG. 5B. Also, the LED dies 130 may be horizontal
packaged, and two bonding wires 135 connected to two electrodes 132
of each LED dies 130 and the circuit layer 122, as shown in FIG.
5C.
[0028] Reference is made to FIG. 6, which is a top view of the
illuminant device according to the first embodiment of the present
invention. In this embodiment, the number of the LED dies 130 is,
for example, 18. The LED dies 130 are arranged on the circuit board
120 in a circular manner. In preferably, the LED dies 130 are
arranged on the circuit board 120 with the same interval
therebetween, thus the uniformity of light emitted by the
illuminant device 10 can be enhanced. In the practical application,
the arrangement of the LED dies 130 may be adjusted according to
demand light intensity distribution.
[0029] With reference again to FIG. 4 and FIG. 6, the
light-transmitting layer 140 is disposed on the circuit board 120
and of circular shape. The light-transmitting layer 140 also covers
the LED dies 130 to prevent the LED dies 130 from damage or
reducing illuminant effect which is caused by dust attaching to the
LED dies 130 and moisture permeating into LED dies 130. The
light-transmitting layer 140 further protects the bonding wires 135
connected to the LED dies 130 and the circuit layer 122 from
breaking caused by compression or collision. In this embodiment,
the profile of the light-transmitting layer 140 covering the LED
dies 130 is of arc-shape, which can enlarge light-projecting angle
of light passing therethrough, as shown in FIG. 7. In FIG. 7, each
LED die 130 is, for example, electrically connected to the circuit
layer 132 by flip chip technology. In addition, the
light-transmitting layer 140 circularly covers the LED dies 130.
However, the light-transmitting layer 140 can cover the LED dies
130 in a polygon circular manner or irregular circular manner. The
light-transmitting layer 140 may be epoxy, silicone resin or other
light-transparent material with electrically isolating
property.
[0030] The illuminant device 10 may also include two dams 145. The
dams 145 are respectively disposed on the circuit board 130 and at
two sides of the LED dies 130 before disposing the
light-transmitting layer 120 to provide space-limiting, which can
enhance accuracy of disposing the light-transmitting layer 140, and
effectively control the shape thereof
[0031] The light-transmitting layer 140 further includes a
wavelength-converting matter 142 disposed therein. The
wavelength-converting matter 142 is excited by partial light
emitted from the LED dies 130 and then convers the light into a
wavelength-converted light, which is to be mixed with other light
emitted from the LED dies 130 to generate a demanded light. The
wavelength-converting matter 142 is phosphor or quantum dot
phosphor.
[0032] The controlling and driving module 150 including a plurality
of electrical element dies 152 is placed on the circuit board 120.
The electrical element dies 152 are placed on the circuit board 120
and mounted on the circuit board 120 via die attachment. The
electrical element dies 152 are electrically connected to the
circuit layer 122 via wire bonding. The electrically element dies
152 may electrically connect to the circuit layer 122 by flip chip
(as shown in FIG. 5A) technology, or the electrical element dies
152 may electrically connect to the circuit layer 122 via at least
one bonding wire (as shown in FIG. 5B and 5C). In the practical
application, the electrical element dies 152 and the LED dies 130
are simultaneously mounted on the circuit board 120 by die
attachment procedure, and electrically connected to the circuit
layer 122 by wire bonding procedure. The electrical element dies
152 may be resistors, capacitors, diodes or other active component
or passive component, and collectively construct power modulating
circuit, such as rectification, filter or buck-booster voltage, and
controlling circuit, such as dimming, for driving and controlling
the LED dies 130. In this embodiment, the LED dies 130 are placed
at fringe of the circuit board 120 and encloses the controlling and
driving module 150, so as to prevent light emitting from the LED
dies 130 from being blocked by the controlling and driving module
150 and uneven light distribution. In the practical application,
the controlling and driving module 150 may be as system on chip
package.
[0033] With reference again to FIG. 3 and FIG. 6, the illuminant
device 10 still includes a protecting layer 180. The protecting
layer 180, made of transparent or opaque material, covers the
controlling and driving module 150 to prevent dust from attaching
to the controlling and driving module 150 and prevent moisture from
permeating into the controlling and driving module 150. The
protecting layer 180 also protects the bonding wires connected
between each electrically element dies 152 and the circuit layer
122 to prevent the bonding wires from breaking by compress or
colliding. The illuminant device 10 may also include a surrounding
wall 190. The surrounding wall 190 surrounds the controlling and
driving module 150 to provide space-limiting, which can enhance
accuracy of disposing the protecting layer 180, and effectively
control the shape thereof.
[0034] With reference again to FIG. 2 and FIG. 4, the conductive
connector 160 is assembled with the other end of the housing 110.
In this embodiment, the conductive connector 160 is, for example,
screwed to the housing 110 via external thread 162. The conductive
connector 160 is connected to an external lamp holder (not shown)
and then a power, such as a 110V wall-socket alternating power
source, provided by the external lamp holder can transmit to the
illuminant device 10. In this embodiment, the conductive connector
160 is, for example, screw socket. However, in the practical
application, the conductive connector 160 may be modulated
according to application field and standard of lamp holders.
[0035] The illuminant device 10 still includes a plurality of power
lines 170. In this embodiment, number of the power lines 170 is,
for example, two. The power lines 170 are located within the
accommodating space 118, one end of each power lines 170 is
connected to the conductive connector 160, and the other end of
each power lines 170 is connected to the circuit layer 122 via the
through hole 124, such that the power provided by the external lamp
holder is transmitted to the circuit layer 122 via the conductive
connector 160 and the power lines 170, and driving the controlling
and driving module 150 and the LED dies 130.
[0036] Reference is made to FIG. 8, which is a sectional view of an
illuminant device according to a second embodiment of the present
invention. The illuminant device 10a is similar to the illuminant
device 10 mentioned above, and the same reference numbers are used
in the drawings and the description to refer to the same parts. It
should be noted that the illuminant device 10a further includes a
lamp shade 30, and that a wavelength-converting matter 142a is
disposed within the lamp shade 30 rather than disposed within the
light-transmitting layer 140.
[0037] The lamp shade 30 is assembled with the housing 110, such
that the circuit board 120, the LED dies 130 and the controlling
and driving module 150 are arranged between the housing 110 and the
lamp shade 30 for providing isolating protection. The lamp shade 30
may be made of light-transmitting material such as resin, plastic
or glass, and selected to be transparent or translucent. In this
embodiment, the lamp shade 30 is of hemisphere shape. In the
practical application, however, the lamp shade 30 may be of other
special shape according to practical applications.
[0038] In FIG. 8, the wavelength-converting matter 142a is phosphor
or quantum dot phosphor. The wavelength-converting matter 142a is
excited by partial light emitted from the LED dies 130 and
transmitted to the lamp shade 30, and then converts the light into
a wavelength-converted light, which is to be mixed with other light
emitted from the LED dies 130 to generate a demanded light.
[0039] To sum up, the LED dies 130 and the controlling and driving
module 150 of the illuminant device 10, 10a according to the
present invention are respectively placed on the circuit board 120
and electrically connected to the circuit layer 122, so that the
circuit board 120 for placing the controlling and driving module
150 in the conventional LED lamp is omitted. In addition, the
volume of the accommodating space 118 can be substantially reduced,
and then the volume of the housing is also reduced. Furthermore,
the electrical element dies 152 and the LED dies 130 are
simultaneously proceeded die attachment and wire bonding procedure,
which can substantially reduce manufacturing time and
procedure.
[0040] Although the present invention has been described with
reference to the foregoing preferred embodiment, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
* * * * *