U.S. patent application number 13/614736 was filed with the patent office on 2013-11-07 for magnetic device having thermally-conductive bobbin.
This patent application is currently assigned to DELTA ELECTRONICS, INC.. The applicant listed for this patent is Ya-Ling Chung Hou, Chen-Feng Wu. Invention is credited to Ya-Ling Chung Hou, Chen-Feng Wu.
Application Number | 20130293330 13/614736 |
Document ID | / |
Family ID | 47500909 |
Filed Date | 2013-11-07 |
United States Patent
Application |
20130293330 |
Kind Code |
A1 |
Wu; Chen-Feng ; et
al. |
November 7, 2013 |
MAGNETIC DEVICE HAVING THERMALLY-CONDUCTIVE BOBBIN
Abstract
A magnetic device includes a thermally-conductive bobbin and a
winding coil. The thermally-conductive bobbin has a winding
section. The winding coil is wound around the winding section. The
heat generated from the winding coil is dissipated away through the
thermally-conductive bobbin.
Inventors: |
Wu; Chen-Feng; (Taoyuan
Hsien, TW) ; Chung Hou; Ya-Ling; (Taoyuan Hsien,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Wu; Chen-Feng
Chung Hou; Ya-Ling |
Taoyuan Hsien
Taoyuan Hsien |
|
TW
TW |
|
|
Assignee: |
DELTA ELECTRONICS, INC.
Taoyuan Hsien
TW
|
Family ID: |
47500909 |
Appl. No.: |
13/614736 |
Filed: |
September 13, 2012 |
Current U.S.
Class: |
336/61 |
Current CPC
Class: |
H01F 5/02 20130101; H01F
2005/025 20130101 |
Class at
Publication: |
336/61 |
International
Class: |
H01F 27/08 20060101
H01F027/08 |
Foreign Application Data
Date |
Code |
Application Number |
May 7, 2012 |
TW |
101116247 |
Claims
1. A magnetic device, comprising: a thermally-conductive bobbin
having a winding section; and a winding coil wound around said
winding section, wherein the heat generated from said winding coil
is dissipated away through said thermally-conductive bobbin.
2. The magnetic device according to claim 1, further comprising a
magnetic core assembly, wherein said magnetic core assembly is at
least partially embedded within a channel of said
thermally-conductive bobbin.
3. The magnetic device according to claim 1, wherein said
thermally-conductive bobbin has a non-seamless ring-shape.
4. The magnetic device according to claim 1, wherein said
thermally-conductive bobbin is formed by at least two parts having
corresponding profiles with each other.
5. The magnetic device according to claim 1, wherein said
thermally-conductive bobbin further comprises a heat-dissipating
plate, wherein said heat-dissipating plate is fixed on an inner
wall of said thermally-conductive bobbin.
6. The magnetic device according to claim 1, further comprising an
insulating medium formed on a surface of said thermally-conductive
bobbin.
7. The magnetic device according to claim 1, further comprising an
insulating medium arranged between said thermally-conductive bobbin
and said winding coil.
8. The magnetic device according to claim 1, further comprising an
insulating medium formed on a surface of said winding coil.
9. The magnetic device according to claim 1, further comprising a
fixing structure, which is extended from said thermally-conductive
bobbin, wherein through said fixing structure, said magnetic device
is fixed on a system board.
10. The magnetic device according to claim 1, wherein a thermal
conductivity of said thermally-conductive bobbin is 10 W/m.times.K
or higher than 10 W/m.times.K.
11. A magnetic device, comprising: a first thermally-conductive
bobbin having a first channel; a first winding coil wound around
said first thermally-conductive bobbin; a second
thermally-conductive bobbin having a second channel; and a second
winding coil wound around said second thermally-conductive
bobbin.
12. The magnetic device according to claim 11, further comprising a
magnetic core assembly, wherein said second thermally-conductive
bobbin is accommodated within said first channel of said first
thermally-conductive bobbin, and said magnetic core assembly is at
least partially embedded within said second channel of said second
thermally-conductive bobbin.
13. The magnetic device according to claim 11, further comprising a
magnetic core assembly, wherein said first thermally-conductive
bobbin and said second thermally-conductive bobbin are arranged in
a side-by-side manner, wherein a first part of said magnetic core
assembly is at least partially embedded within said first channel
of said first thermally-conductive bobbin, and a second part of
said magnetic core assembly is at least partially embedded within
said second channel of said second thermally-conductive bobbin.
14. The magnetic device according to claim 11, wherein a thermal
conductivity of said first thermally-conductive bobbin or said
second thermally-conductive bobbin is 10 W/m.times.K or higher than
10 W/m.times.K.
15. The magnetic device according to claim 11, wherein said first
thermally-conductive bobbin or said second thermally-conductive
bobbin has a non-seamless ring-shape.
16. The magnetic device according to claim 11, wherein said first
thermally-conductive bobbin or said second thermally-conductive
bobbin is formed by at least two parts having corresponding
profiles with each other.
17. The magnetic device according to claim 11, further comprises a
heat-dissipating plate, wherein said heat-dissipating plate is
fixed on an inner wall of said first thermally-conductive bobbin or
said second thermally-conductive bobbin.
18. The magnetic device according to claim 11, further comprising
an insulating medium formed between said first thermally-conductive
bobbin and said first winding coil or between said second
thermally-conductive bobbin and said second winding coil.
19. The magnetic device according to claim 11, further comprising a
fixing structure, which is extended from said first
thermally-conductive bobbin or said second thermally-conductive
bobbin, wherein through said fixing structure, said magnetic device
is fixed on a system board.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a magnetic device, and more
particularly to a magnetic device with a thermally-conductive
bobbin.
BACKGROUND OF THE INVENTION
[0002] An electrical appliance is usually equipped with various
magnetic devices such as transformers or inductors. As the
electrical appliance is developed toward miniaturization, the sizes
of the magnetic devices and the inner components are gradually
reduced in order to enhance the space utilization of the circuit
board. During operation of the electrical appliance, the electronic
components may generate energy in the form of heat. Since the size
of the magnetic device is reduced, it is very important to remove
the heat. If no proper heat-dissipating mechanism is provided to
transfer enough heat to the ambient air, the elevated operating
temperature may deteriorate the operating performance, reduce the
reliability and shorten the use life of the magnetic device.
[0003] FIG. 1 is a schematic perspective view illustrating the
structure of a conventional magnetic device. As shown in FIG. 1,
the conventional magnetic device 1 includes a bobbin 10, a winding
coil 11, a magnetic core assembly 12, and a heat-dissipating plate
13. The winding coil 11 is wound around the bobbin 10. The magnetic
core assembly 12 is at least partially embedded within the bobbin
10. The bobbin 10 with the winding coil 11 is clamped by the
heat-dissipating plate 13, and the magnetic core assembly 12 is
partially sheltered by the heat-dissipating plate 13. The resulting
structure of the assembled magnetic device 1 is shown in FIG.
1.
[0004] During operation of the magnetic device 1, the winding coil
11 and the magnetic core assembly 12 may generate energy in the
form of heat, which is readily accumulated within the magnetic
device 1. Consequently, the operating temperature of the magnetic
device 1 is increased. Moreover, since the heat-dissipating plate
13 is attached on the outer surfaces of the winding coil 11 and the
magnetic core assembly 12, the heat-dissipating plate 13 is only
able to dissipate the heat from the outer surfaces of the winding
coil 11 and the magnetic core assembly 12. That is, the heat from
the inner surfaces of the winding coil 11 of the bobbin 10 and the
magnetic core assembly 12 fails to be effectively removed by the
heat-dissipating plate 13. If no proper heat-dissipating mechanism
is provided to transfer enough heat from the inner portion of the
magnetic device 1 to the ambient air, the operating temperature is
increased. Moreover, as the operating temperature of the magnetic
device 1 is increased, the saturation flux density (Bs) of the
magnetic core assembly 12 is decreased. Consequently, the operating
performance and the electrical safety of the power circuit are both
adversely affected. In addition, the magnetic device 1 has reduced
operating efficiency, reduced reliability and shortened use life.
For avoiding the problem of the elevated operating temperature, a
larger magnetic core assembly 12 may be employed to increase the
heat-dissipating efficacy and increase the operating performance of
the magnetic device 1. However, since the overall volume of the
magnetic device 1 is increased, the purpose of minimizing the
magnetic device 1 fails to be achieved.
[0005] Therefore, there is a need of providing a magnetic device
with a thermally-conductive bobbin in order to eliminate the above
drawbacks.
SUMMARY OF THE INVENTION
[0006] The present invention provides a magnetic device with a
thermally-conductive bobbin. The thermally-conductive bobbin is
effective to dissipate the heat from inner surfaces of the winding
coil and the magnetic core assembly. Consequently, the operating
temperature of the magnetic device is largely reduced. When
compared with the conventional magnetic device having the external
heat-dissipating plate, the magnetic device of the present
invention has enhanced operating performance, better reliability
and longer use life. In addition, the overall volume of the
magnetic device is reduced so that the purpose of minimizing the
magnetic device can be achieved.
[0007] In accordance with an aspect of the present invention, there
is provided a magnetic device. The magnetic device includes a
thermally-conductive bobbin and a winding coil. The
thermally-conductive bobbin has a winding section. The winding coil
is wound around the winding section. The heat generated from the
winding coil is dissipated away through the thermally-conductive
bobbin.
[0008] In an embodiment, the magnetic device further comprises a
magnetic core assembly. The magnetic core assembly is at least
partially embedded within a channel of the thermally-conductive
bobbin.
[0009] In an embodiment, the thermally-conductive bobbin has a
non-seamless ring-shape. Alternatively, the thermally-conductive
bobbin is formed by at least two parts having corresponding
profiles with each other.
[0010] In an embodiment, the thermally-conductive bobbin further
comprises a heat-dissipating plate. The heat-dissipating plate is
fixed on an inner wall of the thermally-conductive bobbin.
[0011] In an embodiment, the magnetic device further comprises an
insulating medium. The insulating medium is formed on a surface of
the thermally-conductive bobbin, and/or the insulating medium is
arranged between the thermally-conductive bobbin and the winding
coil, and/or the insulating medium is formed on a surface of the
winding coil.
[0012] In an embodiment, the magnetic device further comprises a
fixing structure, which is extended from the thermally-conductive
bobbin. Through the fixing structure, the magnetic device is fixed
on a system board.
[0013] In an embodiment, a thermal conductivity of the
thermally-conductive bobbin is 10 W/m.times.K or higher than 10
W/m.times.K.
[0014] In accordance with another aspect of the present invention,
there is provided a magnetic device. The magnetic device includes a
first thermally-conductive bobbin, a first winding coil, a second
thermally-conductive bobbin, and a second winding coil. The first
thermally-conductive bobbin has a first channel. The first winding
coil is wound around the first thermally-conductive bobbin. The
second thermally-conductive bobbin has a second channel. The second
winding coil is wound around the second thermally-conductive
bobbin.
[0015] In an embodiment, the magnetic device further comprises a
magnetic core assembly. The second thermally-conductive bobbin is
accommodated within the first channel of the first
thermally-conductive bobbin. The magnetic core assembly is at least
partially embedded within the second channel of the second
thermally-conductive bobbin.
[0016] In an embodiment, the magnetic device further comprises a
magnetic core assembly. The first thermally-conductive bobbin and
the second thermally-conductive bobbin are arranged in a
side-by-side manner. A part of the magnetic core assembly is at
least partially embedded within the first channel of the first
thermally-conductive bobbin, and another part of the magnetic core
assembly is at least partially embedded within the second channel
of the second thermally-conductive bobbin.
[0017] In an embodiment, a thermal conductivity of the first
thermally-conductive bobbin is 10 W/m.times.K or higher than 10
W/m.times.K. A thermal conductivity of the second
thermally-conductive bobbin is 10 W/m.times.K or higher than 10
W/m.times.K.
[0018] The above contents of the present invention will become more
readily apparent to those ordinarily skilled in the art after
reviewing the following detailed description and accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] FIG. 1 is a schematic perspective view illustrating the
structure of a conventional magnetic device;
[0020] FIG. 2A is a schematic exploded view illustrating a magnetic
device according to a first embodiment of the present
invention;
[0021] FIG. 2B is a schematic assembled view illustrating the
magnetic device of FIG. 2A;
[0022] FIG. 2C is a schematic perspective view illustrating an
exemplary thermally-conductive bobbin used in the magnetic device
of FIG. 2A, in which the thermally-conductive bobbin is coated with
an insulating medium;
[0023] FIG. 2D is a schematic perspective view illustrating another
exemplary thermally-conductive bobbin used in the magnetic device
of FIG. 2A, in which the thermally-conductive bobbin has a fixing
structure;
[0024] FIG. 3 is a schematic assembled view illustrating a
thermally-conductive bobbin and a winding coil of a magnetic device
according to a second embodiment of the present invention;
[0025] FIG. 4 is a schematic cross-sectional view illustrating a
magnetic device according to a third embodiment of the present
invention; and
[0026] FIG. 5 is a schematic cross-sectional view illustrating a
magnetic device according to a fourth embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0027] The present invention will now be described more
specifically with reference to the following embodiments. It is to
be noted that the following descriptions of preferred embodiments
of this invention are presented herein for purpose of illustration
and description only. It is not intended to be exhaustive or to be
limited to the precise form disclosed.
[0028] FIG. 2A is a schematic exploded view illustrating a magnetic
device according to a first embodiment of the present invention.
FIG. 2B is a schematic assembled view illustrating the magnetic
device of FIG. 2A. An example of the magnetic device 2 includes but
is not limited to a transformer, an inductor, a filter, or the
like. As shown in FIG. 2A, the magnetic device 2 includes a
thermally-conductive bobbin 20, a winding coil 21, and a magnetic
core assembly 22. The thermally-conductive bobbin 20 has a winding
section 201 and a channel 202. The winding coil 21 is wound around
the winding section 201. The magnetic core assembly 22 is at least
partially embedded within the channel 202. After the magnetic
device 2 is assembled, the heat from the winding coil 21 and the
magnetic core assembly 22 may be dissipated away through the
thermally-conductive bobbin 20. In this embodiment, the
thermally-conductive bobbin 20 can be a one-piece part, but it is
not limited thereto.
[0029] Please refer to FIGS. 2A and 2B again. For enhancing the
heat-dissipating efficiency, the thermal conductivity of the
thermally-conductive bobbin 20 is 10 W/m.times.K or higher. For
example, the thermally-conductive bobbin 20 is made of a
thermally-conductive material. The thermal conductivity of the
thermally-conductive material is 10 W/m.times.K or higher. In some
embodiments, the thermally-conductive bobbin 20 is made of a
metallic material such as copper, aluminum or iron. In a case that
the thermally-conductive bobbin 20 is made of the metallic
material, the thermally-conductive bobbin 20 has a non-seamless
ring-shape. Since the thermally-conductive bobbin 20 is made of
metal, the structural strength of the magnetic device 2 is
enhanced. Under this circumstance, the thermally-conductive bobbin
20 further has the function of structurally supporting the magnetic
device 2.
[0030] In some embodiments, the thermally-conductive bobbin 20 is
made of a non-metallic material such as a carbon fiber material, a
composite material or a ceramic material. In a case that the
thermally-conductive bobbin 20 is made of the non-metallic
material, the thermally-conductive bobbin 20 is a seamless
ring-shaped plate.
[0031] Please refer to FIG. 2A again. The magnetic device 2 further
includes a magnetic core assembly 22. The magnetic core assembly 22
is at least partially embedded within the channel 202 of the
thermally-conductive bobbin 20 for conducting the magnetic flux. In
this embodiment, the magnetic core assembly 22 is an EE-type
magnetic core assembly. The magnetic core assembly 22 includes two
E cores, wherein each E core includes a middle post 220 and two
lateral posts 221. The two lateral posts 221 are located at
bilateral sides of the middle post 220. In some other embodiments,
the winding coil 21 is wound as a winding assembly, and the winding
assembly is directly sheathed around the winding section 201. For
assembling the magnetic device 2, the winding coil 21 is firstly
wound around the winding section 201 of the thermally-conductive
bobbin 20. After the winding coil 21 and the thermally-conductive
bobbin 20 are combined together, the middle posts 220 of the
magnetic core assembly 22 are embedded within the channel 202 of
the thermally-conductive bobbin 20. The resulting structure of the
assembled magnetic device 2 is shown in FIG. 2B. Of course, the
magnetic core assembly 22 is not limited to the EE-type magnetic
core assembly as long as the magnetic core assembly 22 is at least
partially embedded within the channel 202 of the
thermally-conductive bobbin 20. It is noted that numerous
modifications and alterations of the magnetic core assembly 22 may
be made while retaining the teachings of the invention.
[0032] FIG. 2C is a schematic perspective view illustrating an
exemplary thermally-conductive bobbin used in the magnetic device
of FIG. 2A, in which the thermally-conductive bobbin is coated with
an insulating medium. As shown in FIG. 2C, the magnetic device 2
further includes an insulating medium 203. The insulating medium
203 is sprayed on the surface of the thermally-conductive bobbin
20. That is, the insulating medium 203 is arranged between the
thermally-conductive bobbin 20 and the winding coil 21 in order to
insulate the thermally-conductive bobbin 20 from the winding coil
21. Alternatively, in some embodiments, the insulating medium 203
is directly formed on the surface of the thermally-conductive
bobbin 20 by an injection molding process. Alternatively, in some
embodiments, the insulating medium 203 is formed on the winding
section 201 of the thermally-conductive bobbin 20 only. That is,
the surface of the thermally-conductive bobbin 20 is not completely
covered by the insulating medium 203. From the above discussions,
the insulating medium 203 is formed on a surface of the
thermally-conductive bobbin 20 or the insulating medium 203 is
arranged between the thermally-conductive bobbin 20 and the winding
coil 21, so that the insulation between the thermally-conductive
bobbin 20 and the winding coil 21 is achieved through the
insulating medium 203.
[0033] Alternatively, in some other embodiments, the insulating
medium 203 is directly formed on the surface of the winding coil
21. That is, the winding coil 21 is covered by the insulating
medium 203. After the winding coil 21 with the insulating medium
203 is wound around the winding section 201 of the
thermally-conductive bobbin 20, the insulation between the
thermally-conductive bobbin 20 and the winding coil 21 is achieved
through the insulating medium 203.
[0034] FIG. 2D is a schematic perspective view illustrating another
exemplary thermally-conductive bobbin used in the magnetic device
of FIG. 2A, in which the thermally-conductive bobbin has a fixing
structure. As shown in FIG. 2D, the thermally-conductive bobbin 20
has a fixing structure 23. The fixing structure 23 is extended from
a bottom part of the thermally-conductive bobbin 20. In addition,
the fixing structure 23 is perpendicular to the winding section 201
of the thermally-conductive bobbin 20. Through the fixing structure
23, the magnetic device 2 may be fixed on a system board (not
shown) by fastening, screwing, engaging or welding means.
[0035] After the magnetic device 2 is assembled, the heat from the
winding coil 21 and the magnetic core assembly 22 may be dissipated
away through the thermally-conductive bobbin 20. As a consequence,
the heat-dissipating efficacy is enhanced. In addition to the
function of proving a winding section for winding coil and
enhancing the heat-dissipating efficacy, the thermally-conductive
bobbin 20 is effective to structurally support the magnetic device
2. Moreover, since the bobbin used in the conventional magnetic
device is omitted according to the present invention, the material
cost of the present magnetic device is reduced. Moreover, since the
operating temperature of the magnetic device 2 is largely reduced,
the reliability and the use life of the magnetic device 2 are both
increased. Since the magnetic properties of the magnetic core
assembly 22 are enhanced, the size of the magnetic core assembly 22
may be reduced while maintaining the operating performance of the
magnetic device 2. Under this circumstance, the overall volume of
the magnetic device 2 is decreased, and the material cost is
reduced.
[0036] FIG. 3 is a schematic assembled view illustrating a
thermally-conductive bobbin and a winding coil of a magnetic device
according to a second embodiment of the present invention. The
thermally-conductive bobbin 30 includes at least one
heat-dissipating plate 31, a winding section 301, and a channel
302. The configurations of the winding section 301 and the channel
302 are similar to those of FIG. 2, and are not redundantly
described herein. In this embodiment, the thermally-conductive
bobbin 30 further includes the heat-dissipating plate 31. The
heat-dissipating plate 31 is fixed on an inner wall of the
thermally-conductive bobbin 30. In this embodiment, the
thermally-conductive bobbin 30 has two heat-dissipating plates 31,
which are arranged around the channel 302 for removing the heat
from the winding coil 32 and the magnetic core assembly (not
shown). It is noted that the number of the heat-dissipating plates
31 may be varied according to the practical requirements.
Alternatively, the heat-dissipating plate 31 can be a one-piece
part.
[0037] From the above discussions, the thermally-conductive bobbin
of the present invention is able to dissipate the heat of the
magnetic device. Consequently, the overall heat-dissipating
efficacy is enhanced. Moreover, since it is not necessary to
install an additional heat-dissipating structure outside the
magnetic device, the overall volume of the magnetic device may be
reduced. Moreover, the turns of the winding coil may be increased
according to the practical requirement in order to enhance the
operating performance of the magnetic device.
[0038] FIG. 4 is a schematic cross-sectional view illustrating a
magnetic device according to a third embodiment of the present
invention. In this embodiment, the magnetic device 4 has a
plurality of thermally-conductive bobbins, so that the operating
performance of the magnetic device is further enhanced. As shown in
FIG. 4, the magnetic device 4 includes a first thermally-conductive
bobbin 40, a second thermally-conductive bobbin 41, a first winding
coil 42, a second winding coil 43, and a magnetic core assembly 44.
The configurations of the first winding coil 42 and the second
winding coil 43 are similar to those of the above embodiments, and
are not redundantly described herein. In addition, the first
thermally-conductive bobbin 40 has a first channel 401, and the
second thermally-conductive bobbin 41 has a second channel 410. The
first winding coil 42 is wound around the first
thermally-conductive bobbin 40. The second winding coil 43 is wound
around the second thermally-conductive bobbin 41. Moreover, the
diameter of the combination of the second thermally-conductive
bobbin 41 and the second winding coil 43 is substantially equal to
the diameter of the first channel 401. Consequently, the
combination of the second thermally-conductive bobbin 41 and the
second winding coil 43 is tightly accommodated within the first
channel 401 of the first thermally-conductive bobbin 40.
[0039] In this embodiment, the magnetic core assembly 44 is an
EE-type magnetic core assembly. The magnetic core assembly 44
includes two E cores, wherein each E core includes a middle post
440 and two lateral posts. After the first thermally-conductive
bobbin 40 with the first winding coil 42 and the second
thermally-conductive bobbin 41 with the second winding coil 43 are
combined together, the middle posts 440 of the magnetic core
assembly 44 are inserted into the second channel 410 of the second
thermally-conductive bobbin 41. Consequently, the magnetic core
assembly 44 is at least partially embedded within the second
channel 410 of the second thermally-conductive bobbin 41. The
resulting structure of the assembled magnetic device 4 is shown in
FIG. 4. Of course, the magnetic core assembly 44 is not limited to
the EE-type magnetic core assembly. It is noted that numerous
modifications and alterations of the magnetic core assembly 44 may
be made while retaining the teachings of the invention.
[0040] In such way, the heat from the first winding coil 42 and the
outer surface of the second coil 43 may be dissipated away through
the first thermally-conductive bobbin 40, and the heat from the
inner surface of the second coil 43 may be dissipated away through
the second thermally-conductive bobbin 41. In other words, the uses
of the first thermally-conductive bobbin 40 and the second
thermally-conductive bobbin 41 can enhance the heat-dissipating
efficacy and operating performance of the magnetic device 4.
[0041] FIG. 5 is a schematic cross-sectional view illustrating a
magnetic device according to a fourth embodiment of the present
invention. In this embodiment, the magnetic device 5 also has a
plurality of thermally-conductive bobbins. As shown in FIG. 5, the
magnetic device 5 includes a first thermally-conductive bobbin 50,
a second thermally-conductive bobbin 51, a first winding coil 52, a
second winding coil 53, and a magnetic core assembly 54. In
addition, the first thermally-conductive bobbin 50 has a first
channel 501, and the second thermally-conductive bobbin 51 has a
second channel 510. The configurations of the first
thermally-conductive bobbin 50, the second thermally-conductive
bobbin 51, the first winding coil 52 and the second winding coil 53
are similar to those of the above embodiments, and are not
redundantly described herein. In this embodiment, the first
thermally-conductive bobbin 50 and the second thermally-conductive
bobbin 51 are arranged in a side-by-side manner. Moreover, the
magnetic core assembly 54 includes a first magnetic core 541 and a
second magnetic core 542. The first magnetic core 541 includes two
magnetic parts 541a and 541b, and the second magnetic core 542
includes two magnetic parts 542a and 542b. For assembling the
magnetic device 5, the first winding coil 52 and the second winding
coil 53 are firstly wound around the first thermally-conductive
bobbin 50 and the second thermally-conductive bobbin 51,
respectively. Then, the magnetic parts 541b and 542b are embedded
within the first channel 501, and the magnetic parts 541a and 542a
are embedded within the second channel 510. Under this
circumstance, the first thermally-conductive bobbin 50 and the
second thermally-conductive bobbin 51 are arranged in a
side-by-side manner. Consequently, the heat-dissipating efficacy
and operating performance of the magnetic device 5 are both
enhanced.
[0042] From the above embodiments, the magnetic device includes one
or more thermally-conductive bobbins. For example, the magnetic
device may have three, four or five thermally-conductive bobbins.
Depending on the number of the thermally-conductive bobbins, the
configurations of the magnetic core assembly are correspondingly
adjusted. It is noted that numerous modifications and alterations
of the magnetic core assembly may be made while retaining the
teachings of the invention.
[0043] From the above description, the present invention provides a
magnetic device with a thermally-conductive bobbin. The
thermally-conductive bobbin is effective to dissipate the heat from
the inner surfaces of the winding coil and the magnetic core
assembly. Consequently, the operating temperature of the magnetic
device is largely reduced. When compared with the conventional
magnetic device having the external heat-dissipating plate, the
magnetic device of the present invention has enhanced operating
performance, better reliability and longer use life. Due to the
thermally-conductive bobbin, the magnetic device of the present
invention has reduced operating temperature, increased turns of
winding coil, and enhanced operating performance. In addition, the
overall volume of the magnetic device of the present invention is
smaller, and the space utilization is enhanced. Moreover, since the
heat-dissipating plate used in the conventional magnetic device may
be omitted, the material cost of the present magnetic device is
reduced.
[0044] While the invention has been described in terms of what is
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiment. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures.
* * * * *