U.S. patent application number 13/873535 was filed with the patent office on 2013-11-07 for heat dissipating device.
This patent application is currently assigned to MICROTIPS ELECTRONICS CO., LTD.. The applicant listed for this patent is MICROTIPS ELECTRONICS CO., LTD.. Invention is credited to Hsin-Hung Lin, Takeshi Omori.
Application Number | 20130292094 13/873535 |
Document ID | / |
Family ID | 47224108 |
Filed Date | 2013-11-07 |
United States Patent
Application |
20130292094 |
Kind Code |
A1 |
Omori; Takeshi ; et
al. |
November 7, 2013 |
Heat Dissipating Device
Abstract
A heat dissipating device includes an outer heat conducting
unit, disposed with outer heat conducting plates, and an inner heat
conducting unit. The outer heat conducting unit includes an outer
surrounding wall having inner and outer wall surfaces. The inner
wall surface defines a space. The outer surrounding wall further
has an opening sealed by a cover. The inner heat conducting unit is
formed as a separate component from the outer heat conducting unit,
is received in the space, and is in thermal contact with the inner
wall surface of the outer surrounding wall.
Inventors: |
Omori; Takeshi; (Kaohsiung
City, TW) ; Lin; Hsin-Hung; (Pingtung City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MICROTIPS ELECTRONICS CO., LTD. |
Kaohsiung |
|
TW |
|
|
Assignee: |
MICROTIPS ELECTRONICS CO.,
LTD.
Kaohsiung
TW
|
Family ID: |
47224108 |
Appl. No.: |
13/873535 |
Filed: |
April 30, 2013 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28D 15/0233 20130101;
F28F 1/022 20130101; F28D 15/0275 20130101; F28F 1/16 20130101;
F28F 1/003 20130101; F28F 2255/16 20130101; F28F 21/084 20130101;
F28D 15/025 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
May 2, 2012 |
TW |
101208225 |
Claims
1. A heat dissipating device comprising: an outer heat conducting
unit including an outer surrounding wall having an inner wall
surface and an outer wall surface, said inner wall surface defining
a space, said outer surrounding wall further having a first
opening, said outer heat conducting unit further including a first
cover 32 to seal said first opening; a plurality of outer heat
conducting plates spacedly disposed on and extending away from said
outer wall surface; and an inner heat conducting unit formed as a
separate component from said outer heat conducting unit, received
in said space, and in thermal contact with said inner wall surface
of said surrounding wall.
2. The heat dissipating device as claimed in claim 1, wherein said
first cover has a retaining portion extending towards said inner
heat conducting unit.
3. The heat dissipating device as claimed in claim 1, wherein said
inner heat conducting unit includes an inner surrounding wall
corresponding in shape to said inner wall surface of said outer
surrounding wall, a plurality of inner heat conducting plates
spacedly disposed in and connected to said inner surrounding wall,
and a plurality of flow channels cooperatively defined by said
inner surrounding wall and said inner heat conducting plates; said
inner surrounding wall being welded to said inner wall surface of
said outer surrounding wall, and said inner heat conducting plates
extending in a direction away from said first cover.
4. The heat dissipating device as claimed in claim 3, wherein said
space of said outer heat conducting unit has a form of a blind
hole.
5. The heat dissipating device as claimed in claim 3, wherein said
outer surrounding wall further has a second opening opposite to
said first opening, said outer heat conducting unit further
including a second cover to seal said second opening, said inner
heat conducting plates extending in a direction from said first
opening towards said second opening, said second cover having a
retaining portion extending toward said inner heat conducting
unit.
6. The heat dissipating device as claimed in claim 3, wherein said
outer wall surface of said outer surrounding wall has a contact
portion for contacting a heat source, said outer heat conducting
plates being disposed on a region of said outer wall surface of
said outer surrounding wall other than said contact portion.
7. The heat dissipating device as claimed in claim 3, wherein said
inner heat conducting unit has surfaces that define said flow
channels and that are serrated surfaces.
8. The heat dissipating device as claimed in claim 1, wherein said
inner heat conducting unit includes an inner surrounding wall, and
a plurality of inner heat conducting plates spacedly disposed on
said inner surrounding wall and welded to said outer surrounding
wall, said inner heat conducting plates extending in a direction
away from said first cover, said inner surrounding wall and said
inner heat conducting plates cooperating with said outer
surrounding wall to define a plurality of flow channels.
9. The heat dissipating device as claimed in claim 8, wherein at
least one of said outer heat conducting plates and said inner heat
conducting plates is a curved plate.
10. The heat dissipating device as claimed in claim 1, wherein said
inner heat conducting unit includes an inner surrounding wall, a
plurality of inner heat conducting plates spacedly disposed on said
inner surrounding wall and extending towards said outer surrounding
wall, a surrounding plate surrounding and connected to said inner
heat conducting plates, and a plurality of flow channels
cooperatively defined by said inner surrounding wall, said
surrounding plate and said inner heat conducting plates; said
surrounding plate corresponding in shape to said inner wall surface
of said outer surrounding wall and being welded to said inner wall
surface of said outer surrounding wall, and said inner heat
conducting plates extending in a direction away from said first
cover.
11. The heat dissipating device as claimed in claim 10, wherein at
least one of said outer heat conducting plates and said inner heat
conducting plates is a curved plate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority of Taiwanese application
no. 101208225, filed on May 2, 2012.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a heat dissipating
device.
[0004] 2. Description of the Related Art
[0005] Referring to FIG. 1, a heat dissipating device 1 according
to R.O.C. patent no. M423992 is shown to include a heat conducting
unit 11, a plurality of outer heat conducting plates 12 spacedly
disposed on and formed integrally with the heat conducting unit 11,
and a top cover 13 and a bottom cover 14 disposed on both ends of
the heat conducting unit 11. The heat conducting unit 11 includes
an inner surrounding wall 111, an outer surrounding wall 112, a
plurality of plates 113 connected between the inner surrounding
wall 111 and the outer surrounding wall 112, and a plurality of
flow channels 114 cooperatively defined by the inner surrounding
wall 111, the outer surrounding wall 112 and the plates 113. The
top cover 13 and the bottom cover 14 seal both ends of the flow
channels 114. Referring to FIG. 2, the top cover 13 has a top cover
groove 131 and the bottom cover 14 has a bottom cover groove 141,
and both grooves 131, 141 fluidly connect with the flow channels
114. As best shown in FIG. 2, when the heat dissipating device 1
contacts a heat source 100, the liquid coolant in the bottom cover
groove 141 and in the flow channels 114 will absorb heat and turn
gaseous, flowing upwards through the plurality of flow channels
114. Through the outer heat conducting plates 12, the heat in the
gaseous coolant is dissipated and the coolant turns liquid, flowing
downwards back to the bottom cover groove 141. Such cycle repeats
to perform heat dissipation.
[0006] Due to the heat conducting unit 11 and the outer heat
conducting plates 12 being formed integrally as a unit, they are
commonly manufactured by aluminum extrusion or casting. However,
when manufacturing by aluminum extrusion, the greater the number of
the outer heat conducting plates 12 and plates 113, the greater
will be the force a manufacturing machine needs to generate, and
such high output manufacturing machine increases manufacturing
costs. Also, the greater the number of the outer heat conducting
plates 12 and plates 113, the higher frictional forces may also
wear out the components in the manufacturing machine faster,
decreasing the service life of the machines. When manufacturing by
casting, the flow of material within a molding equipment and mold
release may be affected due to the highly dense arrangements of the
outer heat conducting plates 12 and plates 113, and manufacturing
defects may result. Such drawbacks restrict the number of the outer
heat conducting plates 12 and plates 113 that can be formed in the
heat dissipating device 1 during manufacturing.
SUMMARY OF THE INVENTION
[0007] The object of the present invention is to provide a heat
dissipating device that is relative to manufacture and that can
effectively dissipate heat from a heat source.
[0008] According to the present invention, there is provided a heat
dissipating device. The heat dissipating device includes an outer
heat conducting unit which includes an outer surrounding wall
having an inner wall surface and an outer wall surface. The inner
wall surface defines a space. The outer surrounding wall further
has a first opening. The outer heat conducting unit further
includes a first cover to seal the first opening.
[0009] The heat dissipating device further includes a plurality of
outer heat conducting plates spacedly disposed on and extending
away from the outer wall surface.
[0010] The heat dissipating device further includes an inner heat
conducting unit formed as a separate component from the outer heat
conducting unit. The inner heat conducting unit is received in the
space, and is in thermal contact with the inner wall surface of the
surrounding wall.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Other features and advantages of the present invention will
become apparent in the following detailed description of the
preferred embodiments with reference to the accompanying drawings,
of which:
[0012] FIG. 1 is an exploded perspective view of a conventional
heat dissipating device;
[0013] FIG. 2 is a sectional view of the conventional heat
dissipating device;
[0014] FIG. 3 is an exploded perspective view of a heat dissipating
device according to a first preferred embodiment of the present
invention;
[0015] FIG. 4 is a schematic side view of the heat conducting unit
according to the first preferred embodiment of the present
invention;
[0016] FIG. 5 is a top view of the heat dissipating device, with a
first cover removed according to the first preferred embodiment of
the present invention;
[0017] FIG. 6 is a top view of the heat dissipating device
illustrating a contact portion among the outer heat conducting
plates according to a modification of the first preferred
embodiment of the present invention;
[0018] FIG. 7 is a top view of the heat dissipating device,
illustrating serrated surfaces, according to another modification
of the first preferred embodiment of the present invention;
[0019] FIG. 8 is an exploded perspective view of the heat
dissipating device, which further includes a second cover,
according to yet another modification of the first preferred
embodiment of the present invention;
[0020] FIG. 9 is an exploded perspective view of the heat
dissipating device according to a second preferred embodiment of
the present invention;
[0021] FIG. 10 is a top view of the heat dissipating device
according to the second preferred embodiment of the present
invention;
[0022] FIG. 11 is a top view of the heat dissipating device
according to the second preferred embodiment of the present
invention; and
[0023] FIG. 12 is a top view of the heat dissipating device
according to a third preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] Referring to FIGS. 3 and 4, the heat dissipating device 2
according to a first preferred embodiment of this invention
includes an outer heat conducting unit 3, a plurality of outer heat
conducting plates 41, and an inner heat conducting unit 5.
[0025] The outer heat conducting unit 3 includes an outer
surrounding wall 31 and a first cover 32. The outer surrounding
wall 31 has an inner wall surface 311, an outer wall surface 312,
and a space 313 defined by the inner wall surface 311. The space
313 has a form of a blind hole and has a first opening 314. The
first cover 32 seals the first opening 314. The outer heat
conducting plates 41 are spacedly disposed on and extend away from
the outer wall surface 312.
[0026] The inner heat conducting unit 5 is formed as a separate
component from the outer heat conducting unit 3 and is received in
the space 313. In this preferred embodiment, the inner heat
conducting unit 5 includes an inner surrounding wall 51
corresponding in shape to the inner wall surface 311 of the outer
surrounding wall 31, a plurality of inner heat conducting plates 52
spacedly disposed in and connected to the inner surrounding wall
51, and a plurality of flow channels 53 cooperatively defined by
the inner surrounding wall 51 and the inner heat conducting plates
52. The flow channels 53 are defined by a plurality of surfaces
511. The inner surrounding wall 51 is welded to the inner wall
surface 311 of the outer surrounding wall 31. The inner heat
conducting plates 52 extend in a direction away from the first
opening 314. The first cover 32 has a retaining portion 321
extending towards the inner heat conducting unit 5 and fittingly
insertable into one of the flow channels 53. More than one
retaining portion 321 may be provided to enhance retention of the
first cover 32 on the inner heat conducting unit 5. Use of the
retaining portion 321 is only one of many types of engagement
applicable between the first cover 32 and the outer surrounding
wall 31, and the invention should not be limited in this
respect.
[0027] As illustrated in FIGS. 4 and 5, the outer wall surface 312
of the outer surrounding wall 31 has a contact portion 315, and the
outer heat conducting plates 41 are disposed on a region of the
outer wall surface 312 of the outer surrounding wall 31 other than
the contact portion 315. When a heat source 9 contacts the contact
portion 315, the coolant in the flow channels 53 absorbs the heat
conducted from the heat source 9. After absorbing heat, the liquid
coolant turns gaseous and moves upwards through the flow channels
53. The heat of the gaseous coolant is then conducted through the
inner surrounding wall 51 and the outer surrounding wall 31 and is
dissipated via the outer heat conducting plates 41. As the heat is
dissipated, the gaseous coolant turns liquid and flows downwards
through the flow channels 53 and is able to absorb heat again.
[0028] Referring to FIGS. 5 and 6, the size of the contact portion
315 can be modified according to needs. When the heat source 9 has
a larger size, the contact portion 315 can have a larger area, and
when the heat source 9 has a smaller size, the contact portion 315
can occupy a smaller area that allows for more outer heat
conducting plates 41. Furthermore, as best shown in FIG. 7,
surfaces 511 of the inner heat conducting unit 5 that define the
flow channels 53 may be serrated surfaces such that the contact
area between the coolant and the surfaces 511 is increased. Such
increase in the contact area further improves the efficiency of
heat dissipation.
[0029] Referring to FIG. 8, the outer surrounding wall 31 may
further have a second opening 316 opposite to the first opening
314. The inner heat conducting plates 52 extend in a direction from
the first opening 314 towards the second opening 316. The outer
heat conducting unit 3 further includes a second cover 33 to seal
the second opening 316. The second cover 33 has a retaining portion
331 that extends toward the inner heat conducting unit 5 and that
is fittingly insertable into any one of the flow channels 53.
[0030] In this invention, the inner heat conducting unit 5 is
formed as a separate component from the outer heat conducting unit
3. This effectively mitigates the problem of excessively large
friction that arises when simultaneously forming the plurality of
outer heat conducting plates 41 and the plurality of inner heat
conducting plates 52 during aluminum extrusion in manufacturing,
and the problem of uniformity in material flow during casting due
to the highly dense arrangements of the plurality of outer heat
conducting plates 41 and the plurality of inner heat conducting
plates 52 in the molding equipment. By overcoming such problems,
manufacturing costs can be effectively reduced and a greater number
of the outer heat conducting plates 41 and the inner heat
conducting plates 52 may be formed to increase the efficiency of
heat dissipation.
[0031] Referring to FIGS. 9 and 10, the second preferred embodiment
of the heat dissipating device 2 of this invention has several
differences with the first preferred embodiment. A plurality of
inner heat conducting plates 52 are spacedly disposed on the inner
surrounding wall 51 and connect the inner surrounding wall 51 with
the outer surrounding wall 31. The inner surrounding wall 51 and
the inner heat conducting plates 52 cooperate with the outer
surrounding wall 31 to define a plurality of flow channels 53.
During assembly, the inner heat conducting unit 5 is placed into
the space 313 of the outer surrounding wall 31, and then the inner
heat conducting plates 52 are welded to the inner wall surface 311
of the outer surrounding wall 31. In this preferred embodiment, the
retaining portion 321 of the first cover 32 and the retaining
portion 331 of the second cover 33 are both fittingly engaged with
the inner surrounding wall 51. The shape of this preferred
embodiment that is different from the first embodiment can be
modified to suit different needs. As illustrated in FIG. 11, the
plurality of outer heat conducting plates 41 and the plurality of
inner heat conducting plates 52 may be manufactured in the form of
curve shapes to improve the efficiency of heat dissipation.
[0032] Referring to FIG. 12, the third preferred embodiment of the
heat dissipating device 2 of this invention has several differences
with the second preferred embodiment. The inner heat conducting
unit 5 further includes a surrounding plate 54 surrounding and
connected to the inner heat conducting plates 52. The plurality of
flow channels 53 are cooperatively defined by the inner surrounding
wall 51, the surrounding plate 54 and the inner heat conducting
plates 52. The surrounding plate 54 is welded to the inner wall
surface 311 of the outer surrounding wall 31. With the surrounding
plate 54, the increased contact area between the inner heat
conducting unit 5 and the inner wall surface 311 of the outer
surrounding wall 31 improves fitting engagement between the inner
heat conducting unit 5 and the outer surrounding wall 31.
[0033] In summary, the heat dissipating device 2, by separating the
inner heat conducting unit 5 and the outer heat conducting unit 3,
effectively mitigates the problem of excessively large friction and
the problem of material uniformity during casting. By such, the
manufacturing costs can be effectively reduced and a greater number
of the outer heat conducting plates 41 and the inner heat
conducting plates 52 may be formed to increase the efficiency of
heat dissipation.
[0034] While the present invention has been described in connection
with what are considered the most practical and preferred
embodiments, it is understood that this invention is not limited to
the disclosed embodiments but is intended to cover various
arrangements included within the spirit and scope of the broadest
interpretation so as to encompass all suchmodifications and
equivalent arrangements.
* * * * *